Class / Patent application number | Description | Number of patent applications / Date published |
428462000 | Including polyene monomers (e.g., butadiene, etc.) | 12 |
20100129676 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE - Provided is a process for producing a thermosetting resin varnish from which a printed circuit board can be produced wherein the printed circuit board has excellent dielectric properties in a high frequency band and can significantly reduce the transmission loss, and exhibits excellent heat resistance after moisture absorption and excellent thermal expansion properties and satisfies the metallic foil peeling strength. | 05-27-2010 |
20100136352 | COATING AGENT - A coating agent, which comprises a cellulose derivative, an isocyanate group-containing 1,2-polybutadiene, a synthetic wax having a softening point of 100°-150° C., a fatty acid amide having a softening point of 60°-170° C., and graphite, can satisfy desired performances, when applied to rubbery elastomers, etc. such as prevention of sticking, adhesion and blocking, and improvement of abrasion resistance, and also can serve as a surface-treating agent for vulcanized rubber without peeling of coating films due to adhesion under high-temperature compression or friction-abrasion under high specific pressure. | 06-03-2010 |
20100233495 | Thermosetting Resin Composition of Semi-IPN Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same - Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. | 09-16-2010 |
20120094133 | CATAPHORESABLE SMOOSTEEL WITH GOOD RESISTANCE TO WARM AND WET ENVIRONMENT - Composite metal and polymer part, use in particular in the automotive field | 04-19-2012 |
20120196138 | PROCESS FOR FORMING MULTILAYER STRUCTURES CONTAINING A METAL LAYER - A process for producing a multilayer structure comprising:
| 08-02-2012 |
20120214009 | THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH, PREPREG AND METAL CLAD LAMINATED BOARD USING THE SAME - Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. | 08-23-2012 |
20120288726 | SIMULTANEOUSLY DRAWN OPAQUE FILM MADE OF PLA - The present invention relates to simultaneously drawn opaque biaxially oriented film made of at least one cycloolefin copolymer (COC) containing layer. The COC is preferably at a concentration of 0.5 to 30% by weight, based on the layer. The invention further relates to an opaque, biaxially oriented polyhydroxycarboxylic acid film containing at least one layer containing a polymer based on hydroxycarboxylic acids and a cycloolefin copolymer (COC). The invention further relates to a process for producing the PHC film and the use thereof. | 11-15-2012 |
20130040153 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE, THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE - A thermosetting resin varnish that includes a thermosetting resin composition of an uncured semi-IPN composite having compatibilized with one another (A) a polyphenylene ether, (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified, and (C) a crosslinking agent; (D) an inorganic filler; and (E) a saturated thermoplastic elastomer. Also, a resin varnish for a printed circuit board, a prepreg, and a metal-clad laminate, using the thermosetting resin varnish. | 02-14-2013 |
20130196166 | Film Composition and Method of Making the Same - This disclosure relates to a film that includes a first layer, the first layer includes a) 65.0 to 94.5 wt % of a first polymer; b) 0.5 to 10.0 wt % of a hydrocarbon resin; and c) 5.0 to 25.0 wt % of an elastomeric propylene-ethylene copolymer having an isotactic propylene triad tacticity of from 65 to 95%, a melting point by DSC equal to or less than 110° C., a heat of fusion of from 5.0 to 50.0 J/g, the elastomeric propylene-ethylene copolymer having: (1) propylene-derived units in an amount of at least 75 wt %; (2) ethylene-derived units in an amount of at least 6 wt %; and (3) optionally, 10 wt % or less of diene-derived units. | 08-01-2013 |
20140004363 | NBR Composition and Rubber-Metal Laminate | 01-02-2014 |
20140329100 | THERMOPLASTIC MOULDING COMPOSITIONS FOR METAL PLATED ARTICLES WITH IMPROVED RESISTANCE AGAINST REPEATED IMPACT - Thermoplastic moulding composition (F), comprising: A) from 5 to 80% by weight of a graft polymer (A) having bimodal particle size distribution and a moisture content of 0 to 27% by weight, made, based on (A), a | 11-06-2014 |
20150044485 | LOW-DIELECTRIC RESIN COMPOSITION AND COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING THE SAME - The present invention provides a resin composition useful for a copper-clad laminate and a printed circuit board, wherein the resin composition comprises the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide; (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. The present invention also provides a resin composition and an article made therefrom having low dissipation factor at high frequency and excellent thermal resistance and peeling strength and being useful for a copper-clad laminate and a printed circuit board. | 02-12-2015 |