| Entries |
| Document | Title | Date |
|---|
| 20080213598 | Materials and processes for coating substrates having heterogeneous surface properties - A coating material includes:
| 09-04-2008 |
| 20080254300 | Resin Composition, Resin-Attached Metal Foil, Base Material-Attached Insulating Sheet and Multiple-Layered Printed Wiring Board - A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy. The present invention is directed to a resin composition, capable of being employed for forming a resin layer of a resin-attached metal foil or an insulating sheet of a base material-attached insulating sheet, and comprises: a cyanate resin and/or a prepolymer thereof; an epoxy resin substantially containing no halogen atom; a phenoxy resin substantially containing no halogen atom; an imidazole compound; and an inorganic filler, and also directed to a resin-attached metal foil formed by cladding a metal foil with such resin composition, a base material-attached insulating sheet formed by cladding an insulating base material therewith, and a multiple-layered printed wiring board, formed by laying such resin-attached metal foil(s) or such base material-attached insulating sheet(s) on a single side or both sides of an internal layer circuit board, and hot pressure forming thereof. | 10-16-2008 |
| 20080261049 | Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts - The conductive paste of the invention comprises a conductive powder and a binder component, wherein the conductive powder is composed of metal powder which is copper powder or copper alloy powder partially covered on the surface with silver, and is either a mixture of roughly spherical metal powder and flat metal powder, or roughly spherical or flat metal powder alone, and wherein the binder component contains a mixture of an epoxy resin and an imidazole compound with a hydroxyl group or a mixture of an epoxy resin and an imidazole compound with a carboxyl group. | 10-23-2008 |
| 20080286579 | METHOD FOR IDENTIFICATION OF EQUIPMENT - A method and kit for the personal identification of a piece of equipment. An identifying mark having a pre-selected color is applied to a surface of the piece of equipment. The identifying mark is strongly adhered to the surface and has a high abrasion resistance and impact resistance. The identifying mark can be formed from an epoxy resin, such as a two-part epoxy resin. The piece of equipment can be recreational equipment, carpenter's tools or mechanic's tools. | 11-20-2008 |
| 20080292885 | Carrier Film of an Embossing Film - The invention relates to an embossing film, in addition to an associated carrier film for applying surface structures, in particular to fibreboard. The invention also relates to a press and to a production method that uses the embossing film. The advantages of the inventive embossing film are that its use during the pressing process is low-maintenance and obtains a particularly even surface structure. In an additional embodiment, the embossing film has one or more metallic additives, in particular aluminium additives. This improves the strength of the film, in particular during the pressing process and improves the thermal conductivity of the embossing film. The heat that occurs or is produced during the pressing process for curing the resins that are used can thus be dissipated more efficiently from the panel. In a further embodiment, the embossing film comprises an acrylate, which increases the mechanical stability of said film. The acrylate can be applied in the form of a dispersion to the carrier film or paper and is pressed into the film or paper in a roller pressing process. The high mechanical stability permits the film to undergo the embossing operation several times, thus reducing production costs. In addition, the thickness of the film can be reduced, without any detrimental effect on the required stability. Said reduction also increases the thermal conductivity of the film, again reducing production costs. | 11-27-2008 |
| 20090004480 | COMPOSITES WITH INTEGRATED MULTI-FUNCTIONAL CIRCUITS - An exemplary embodiment provides a composite substrate including a resin matrix that has embedded therein a flex circuit and reinforcing filler. The flex circuit includes a metallic circuit on a film that is co-cured with the resin matrix. The metallic circuit may be configured for any of a variety of functions, including for example, dissipating energy generated by a lightning strike on the composite substrate. The flex circuit may also provide a platform for implementation of other communication and maintenance functions. | 01-01-2009 |
| 20090017309 | COMPOSITIONS AND METHODS FOR CREATING ELECTRONIC CIRCUITRY - The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor having an insulating substrate and a cover layer. The insulating substrate is made from a dielectric material and also a metal oxide activatable filler. The cover layer can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process. | 01-15-2009 |
| 20090029175 | Alkylated Polyalkylene Polyamines And Uses Thereof - The present invention provides curing agent compositions comprising alkylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed. | 01-29-2009 |
| 20090047524 | EASY OPEN ENDS THAT CAN BE FAVORABLY OPENED AT HIGH TEMPERATURES - An easy open end comprising a resin-coated metal plate obtained by coating a metal substrate with a polyester film via a primer, wherein the primer comprises an epoxy resin or a polyester resin and a resole-type phenol resin, and the resole-type phenol resin has 0.2 to 2.0 methylol groups per a benzene ring. The end can be lightly opened without causing defect at the time of opening the end by pushing in the end of a tab and cutting the score and, particularly, can be excellently opened at high temperatures without arousing the problem even in a state of being heated at high temperatures featuring excellent corrosion resistance, resistance against the content and retort resistance. | 02-19-2009 |
| 20090081467 | Non-Chromate Corrosion Inhibitor Formulas Based on Highly Crystalline Hydrotalcite Analogs - A mixture of Zinc Oxides or Hydroxides with Aluminum Hydroxides and Vanadium Oxide (V | 03-26-2009 |
| 20090092839 | NON-CHROMATE CORROSION INHIBITOR FORMULAS BASED ON ZIRCONIUM VANADIUM OXIDE COMPOSITIONS - A mixture of zirconium hydroxides or zirconium basic carbonate with vanadium oxide (V205) co-reacts in high temperature aqueous slurry to form respectively an amorphous material, believed to be based on a zirconium analog of a zeolite structure, and a solid solution of zirconium oxide with vanadium oxide. The subject compositions, free of hexavalent chromium, are highly effective in providing blister-free corrosion prevention in typical coil and aerospace grade epoxy primer and color coat combinations. | 04-09-2009 |
| 20090110934 | Thin chip resistant powder topcoats for steel - The present invention provides chip-resistant powder topcoats for corrosion resistant powder coated steel substrates, such as, for example, automotive suspension coil springs, comprising powder coatings formed from one or more wax and a resin component of one or more toughened epoxy resin. The present invention provides dual coatings of toughened epoxy powder basecoats and topcoats, which may be foamed and/or fiber reinforced. The powder used to form the chip resistant topcoat can further comprise up to 200 phr or, preferably, up to 75 phr of one or more extender, or 0.5 or more phr of one or more extender, such as barium sulfate, while fully retaining its chip resistant properties. In addition, the powder used to form the chip resistant topcoat can be a low temperature curing powder comprising one or more low temperature curing agent. The invention provides methods for making the dual coatings comprising applying to the substrate a toughened, zinc-loaded, epoxy coating powder, applying to the powder coated substrate a wax containing toughened epoxy topcoat and heating to fuse or cure the coating powders. | 04-30-2009 |
| 20090155598 | Coatings and Coating Systems for Metal Substrates - Disclosed are methods of treating a metal to improve the metal's corrosion resistance. In one such method, the method is carried out by applying, to the surface of the metal, a coating which includes magnesium powder and a UV-curable or other radiation-curable binder. In another such method, the method is carried out by applying, to the surface of the metal, a coating which includes magnesium powder and an inorganic binder. In another such method, a coating that includes a magnesium alloy powder and a binder is applied to the surface of the metal. The magnesium alloy powder is selected such that it has a corrosion potential that is from about 0.01 volt to about 1.5 volt more negative than the metal's corrosion potential. Also disclosed are methods of treating a ferrous metals and magnesium alloys to improve the corrosion resistance of these materials. | 06-18-2009 |
| 20090155599 | CORROSION AND SCALE INHIBITION COMPOSITIONS AND METHODS OF USE THEREOF - Improved multi-component compositions are provided for treating metallic surfaces subjected to contact with hydrocarbons, such as producing well casings and downhole equipment, and transmission lines. The compositions include an epoxy, a cross-linking or curing agent for the epoxy (e.g., ethoxylated tallow amine), and a scale inhibitor including phosphonic acid or phosphonate moieties (e.g., an organic phosphonate such as DETA phosphonate). The compositions may be added to a well or transmission line as a unitary, three-component mixture, or the epoxy may be initially added, followed by the cross-linking or curing agent, and the scale inhibitor. The compositions provide long-term scale inhibition without the need for continuous metered addition of scale inhibitor | 06-18-2009 |
| 20090197090 | Composition, anti-oxide film including the same, electronic component including the anti-oxide film, and methods for forming the anti-oxide film and electronic component - Disclosed herein is a composition, including a fluorine-based polymer or a perfluoropolyether (PFPE) derivative and a PFPE-miscible polymer, an anti-oxide film and electronic component including the same, and methods of forming an anti-oxide film and an electronic component. Use of the composition may achieve formation of an anti-oxide film through a solution process and electronic components using a metal having increased conductivity and decreased production costs. | 08-06-2009 |
| 20090286087 | Thermosetting Resin Composition and Use thereof - Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance. | 11-19-2009 |
| 20100028689 | B-STAGE THERMAL CONDUCTIVE DIELECTRIC COATED METAL-PLATE AND METHOD OF MAKING SAME - A thermal conductive dielectric coated metal-plate includes a metal carrier, and a partially cured dielectric layer coated to the metal carrier. The dielectric layer includes an epoxy resin, a filler, and a coupling agent. | 02-04-2010 |
| 20100028690 | High-Temperature Non-Skid Coating Composition - One embodiment relates to a coating composition, comprising a novolac epoxy resin comprising silicon carbide powder; an amine curing agent, said agent comprising at least a cycloaliphatic amine; a hydrophobic silica thixotrope agent; and an aluminum oxide powder having the following mesh retention characteristics, based on the weight of the aluminum oxide powder: about 0 wt. % size 10 mesh, ≧ about 5 wt. % size 16 mesh, ≧ about 20 wt. % size 18 mesh, ≧ about 10 wt. % size 20 mesh, and ≦ about 5 wt. % size 30 mesh. Other embodiments relate to making and using the coating composition, and coatings made from the coating composition. | 02-04-2010 |
| 20100040888 | Metallized barrier material - A metallized barrier material comprising a base material, a metallized layer and a protective coating. The base material has a first surface and a second surface. The metallized layer is vapor deposited on the first surface of the base material to a desired optical density. The protective coating is applied to the metallized layer, wherein the protective coating comprises a butyl methacrylate or a combination of an epoxy component and an acrylic component wherein the epoxy component has an EEW of less than 800. | 02-18-2010 |
| 20100080997 | Epoxy prepolymer, and epoxy resin composition, cured material, semi-cured material, prepreg and composite substrate using the epoxy prepolymer - An epoxy prepolymer having excellent thermal conductivity is obtained by reacting an epoxy compound having a mesogenic skeleton and a trinuclear bisphenol represented by the following formula: | 04-01-2010 |
| 20100080998 | Epoxy resin composition, and cured material, semi-cured material, prepreg and composite substrate using the epoxy resin composition - The present invention provides an epoxy resin composition that is excellent in thermal conductivity and has improved high-temperature resistance and handleability. The epoxy resin composition comprises an epoxy compound having a mesogenic skeleton and a curing agent having a biphenylaralkyl skeleton. The biphenylaralkyl skeleton-containing curing agent preferably has a softening point of 110° C. or lower. The biphenylaralkyl skeleton-containing curing agent is preferably an amorphous curing agent. | 04-01-2010 |
| 20100119837 | COATINGS FOR CORROSION SUSCEPTIBLE SUBSTRATES - Superior protective coatings for corrosion susceptible substrates are provided by lower alkoxysilane-epoxy polymeric compounds produced by sol-gel polymerization and cross-linked by reaction with an aromatic diamine cross-linking agent such as a phenylenediamine. | 05-13-2010 |
| 20100119838 | Curing Agent For Low Temperature Cure Applications - The present invention provides N,N′-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N′-dimethyl secondary diamine polymers are also disclosed. | 05-13-2010 |
| 20100167062 | COATING COMPOSITION WITH PHOSPHOROUS-CONTAINING RESINS AND ORGANOMETALLIC COMPOUNDS - An aqueous electrodeposition coating composition comprising (a) an organometallic compound and (b) a cathodically electrodepositable binder, the binder comprising an amine-functional phosphorylated resin, provides corrosion protection equivalent to that obtained by the conventional phosphate pretreatment-electrodeposition coating process. | 07-01-2010 |
| 20100203343 | ANTIRUST TREATED METAL - In an antirust treated metal base material in accordance with the present invention, a coating film containing insulating polyaniline in a highly oxidized state (PE state) is formed on the surface of a metal base material. A method for antirust treatment of the surface of a metal base material includes a process of forming a coating film containing insulating polyaniline in a highly oxidized state (PE state) on the metal base material surface. According to the present invention, an antirust treated metal base material, in which the coating film of an insulating polyaniline system containing no dopants exhibits strong corrosion inhibition effect, and a method of antirust treatment for the metal base material are provided. | 08-12-2010 |
| 20100215965 | RESIN-COATED METAL SHEET AND FORMED BODY USING RESIN-COATED METAL SHEET - A resin-coated metal sheet having excellent corrosion resistance and excellent adhesiveness which has a chromium-free surface treatment layer and exhibits excellent adhesiveness and excellent corrosion resistance even after being subject to severe forming such as deep drawing after formation of an organic resin film on the surface treatment layer is provided. A resin-coated metal sheet includes: an aluminum substrate having a surface-treatment film on at least one surface thereof; and an organic resin film layer formed on the surface of the aluminum substrate by way of an adhesive layer. The adhesive layer contains a cationic-group containing resin and a water-based resin. A formed body such as a can body or a can lid which is formed by using such a resin-coated metal sheet is also provided. | 08-26-2010 |
| 20100233487 | COATING COMPOSITIONS EXHIBITING CORROSION RESISTANCE PROPERTIES, RELATED COATED SUBSTRATES, AND METHODS - Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed. | 09-16-2010 |
| 20100247921 | NOVEL RESIN COMPOSITION, COMPOSITE MATERIAL CONTAINING THE SAME AND USE OF THE COMPOSITE MATERIAL - Disclosed is a resin composition which can firmly bond a metal with a molding material, a composite material including the resin composition and use of the composite material. The resin composition of the present invention includes: an organic compound having at least one secondary thiol group per molecule; and a curable compound having at least one hydroxyl group per molecule. | 09-30-2010 |
| 20100247922 | Water Based Non-Chromated Primers for Structural Bonding Applications - Non-chromated corrosion inhibiting primer formulations having one or more active corrosion inhibitors covalently anchored, or optionally covalently anchored, onto an organic and/or inorganic reactive specie are provided herein. | 09-30-2010 |
| 20100255315 | EPOXY RESIN COMPOSITION - Provided is an epoxy resin composition which excels in heat resistance properties and electrical properties, and is easily decomposable for the recycling of resources. | 10-07-2010 |
| 20100266851 | Sealed HVOF carbide coating - Sealing a thermal spray coating with an extensively diluted sealant, such as a thermosetting epoxy resin, allows the sealant to more effectively protect the coating against leakage, wear and corrosion. The dilution of the sealant is believed to enhance penetration of the sealant into the coating. Such sealed coatings are useful in oilfield applications. | 10-21-2010 |
| 20100297453 | INSULATING SHEET AND MULTILAYER STRUCTURE - The present invention provides an insulating sheet which is used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer. The handleability of the insulating sheet is excellent when it is uncured, and a cured product of the insulating sheet has higher adhesion, heat resistance, dielectric breakdown characteristics, and thermal conductivity. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer comprises: (A) a polymer having an aromatic skeleton and a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent composed of a phenol resin, an acid anhydride having an aromatic skeleton or an alicyclic skeleton, a hydrogenated product of the acid anhydride, or a modified product of the acid anhydride; and (D) a filler. When the insulating sheet is uncured, the insulating sheet has a glass transition temperature Tg of 25° C. or lower. | 11-25-2010 |
| 20110008625 | ELECTRODEPOSITION COATINGS INCLUDING A LANTHANIDE SERIES ELEMENT FOR USE OVER ALUMINUM SUBSTRATES - A process for applying a coating on aluminum substrates by anionic or cationic electrodeposition of an electrodeposition coating including an aqueous dispersion of one or more lanthanide series elements having a +3/+4 oxidation state and phosphated epoxy resin made by phosphating a polyepoxide with both phosphoric acid and an organophosphonic acid and/or an organophosphinic acid. The coating has a reduced tendency to form pinholes. | 01-13-2011 |
| 20110045303 | HALOGEN-FREE FLAME RETARDANT RESIN COMPOSITION, AND, PREPREG, LAMINATE, AND LAMINATE FOR PRINTED CIRCUIT MADE THEREFROM - The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability. | 02-24-2011 |
| 20110064954 | METHOD FOR CONDITIONING INSULATING RESIN AND ITS USE - For the purpose of providing a method capable of conveniently enhancing adhesion between a metal film and an insulating resin upon forming the metal film on a flat surface of the insulating resin, the invention provides a method for conditioning an insulating resin, comprising hydrophilizing an insulating resin, treating the insulating resin with a solution containing a polymer having a primary amine, a secondary amine or both of them on a side chain thereof, and a method for metallizing an insulating resin utilizing the conditioning method. | 03-17-2011 |
| 20110076502 | PURIFIED ACETYLATED DERIVATIVES OF CASTOR OIL AND COMPOSTIONS INCLUDING SAME - The present disclosure is directed to a single phase acetylated castor component (SP-ACC). An acetylated castor component is purified to produce the SP-ACC which contains a reduced amount of, or no, insoluble component(s) therein. The SP-ACC enhances the performance and properties of plasticizers of which it is a component. | 03-31-2011 |
| 20110151264 | AQUEOUS COATING COMPOSITION - The present invention refers to an aqueous coating composition comprising a binder combination A) comprising A1) and A2) wherein A1) comprises 60 to 90 wt % of at least one water-dilutable (meth)acrylate copolymer comprising; a) 10 to 80 wt % of at least one reaction product of a monoepoxyester and an unsaturated acid functional monomer, b) 0 to 40 wt % of at least one hydroxyl functional unsaturated monomer which is different from component a), c) 1 to 8 wt % of at least one unsaturated acid functional monomer, and d) 0 to 70 wt % of at least one other polymerisable unsaturated monomer, and A2) comprises 10 to 40 wt % of at least one water-dilutable epoxyester resin, and the awqueous coating composition further comprises B) at least one isocyanate compound as cross-linking agent. The aqueous coating composition according to the invention is particularly useful as top coat for direct coating of metal surfaces, particularly un-treated steel surfaces, providing high corrosion resistance and highly performed adhesiveness on the un-treated steel surfaces as well as high performance on appearance, e.g., gloss and flow. | 06-23-2011 |
| 20110189488 | PROCESS FOR COATING METALLIC SURFACES WITH AN AQUEOUS COMPOSITION, AND THIS COMPOSITION - A compositon and a method for coating metallic surfaces with a silane/silanol/siloxane/polysiloxane-containing composition, whereby the composition contains a) at least one compound selected from the silanes, silanols, siloxanes and polysiloxanes, b) at least two compounds selected from titanium-, hafnium-, zirconium-, aluminum- or boron-containing compounds, optionally c) at least one type of cation selected from cations of metals of the 1 | 08-04-2011 |
| 20110281117 | CURABLE COMPOSITION BASED ON EPOXY RESINS AND HETERO-POLY-CYCLIC POLYAMINES - The invention relates to curable compositions substantially comprising A) at least one epoxy resin, and B) at least one curing agent comprising a hetero-poly-cyclic ring system comprising at least two amino groups. | 11-17-2011 |
| 20110281118 | SURFACE TREATMENT AGENT FOR GALVANIZED STEEL SHEETS, GALVANIZED STEEL SHEETS AND PRODUCTION METHODS THEREOF - Disclosed is a surface treatment agent for galvanized steel sheets, which comprises epoxy-containing silane derivates, alkyl-containing silane derivates, alkoxy silane derivates and one or more selected from the group consisting of a cationic polymer aqueous dispersion, a non-ionic polymer aqueous dispersion and a water-soluble polymer. Also disclosed is a method for producing it, which comprises mixing each component uniformly for 0.5 to 8 hours at 5 to 70° C. Further provided are galvanized steel sheets coated with the surface treatment agent on the surface and a production method thereof. The surface treatment agent for galvanized steel sheets has excellent corrosion resistance, alkali resistance, solvent resistance, recoating property, high temperature resistance and electrical conductivity. | 11-17-2011 |
| 20110311827 | SELF-PRECIPITATING AQUEOUS PARTICULATE COMPOSITION COMPRISING PIGMENT BINDER PARTICLES - The present invention relates to an acidic, aqueous, particulate composition having a high stability with respect to agglomeration for autophoretic deposition of organic-inorganic hybrid layers on metal surfaces, comprising, in addition to iron(III) ions, fluoride ions and at least one dispersed organic binder (B), pigment-binder particles comprising a pigment portion and a binder portion (B), such that the binder (B) comprises a polymer of at least one monomer having acid groups and at least one polymerizable double bond. Likewise, the invention relates to the use of an aqueous dispersion comprising pigment-binder particles comprising a pigment portion and a binder portion (B) for the production of a self-depositing composition as well as a method for autophoretic deposition on metal surfaces. | 12-22-2011 |
| 20120094130 | Coating Compositions With Anticorrosion Properties - Anticorrosive coating compositions comprise a binding polymer and an amorphous aluminum phosphate corrosion inhibiting pigment. The composition comprises from about 1 to 25 percent by weight amorphous aluminum phosphate. The amorphous aluminum phosphate has a water adsorption potential of up to about 25 percent by weight water. The composition provides a controlled phosphate delivery of from about 50 to 500 ppm, and preferably of from about 100 to 200 ppm. The composition has a total solubles content of less than about 1,500 ppm. The amorphous aluminum phosphate is preferably substantially free of alkali metals. The amorphous aluminum phosphate is made by combining aluminum hydroxide with phosphoric acid and sodium aluminate. The amorphous aluminum phosphate is treated to reduce the level of unwanted solubles, and the treated amorphous aluminum phosphate is dried at less than about 300° C. The composition is used as a primer coat, a mid-coat, and/or a top-coat coating. | 04-19-2012 |
| 20120121913 | ADHESIVE COMPOSITION - Disclosed is an adhesive composition including 100 parts by weight of lignin, 150 to 400 parts by weight of epoxy resin, and 7.5 to 200 parts by weight of flexibilizer. The lignin and the flexibilizer can be pre-reacted to enhance the physical properties, e.g. glass transition temperature (Tg) and flexural endurance (MIT), of the cured adhesive composition. Furthermore, the adhesive composition and a flexible metal foil can be laminated to form a flexible substrate. | 05-17-2012 |
| 20120156503 | SEAWATER-MIXED CONCRETE, CONCRETE STRUCTURE CONSTRUCTED WITH THE SAME, AND DESIGN METHOD OF CONCRETE STRUCTURE CONSTRUCTED WITH SEAWATER-MIXED CONCRETE - The present invention relates to concrete with necessary durability using seawater and sea sand. The seawater mixed concrete of the present invention is obtained by mixing a mixture including slag-containing cement and sea sand, with seawater. And by including a nitrite-based admixture and pozzolan, the diffusion coefficient of concrete after hardening can be reduced to restrain the external intrusion of harmful factors. Further, the concrete structure according to the present invention can include seawater mixed concrete and reinforcement for increasing tensile strength. | 06-21-2012 |
| 20120183781 | CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL - The present invention provides a conductive connecting material having a multi-layered structure comprising a resin composition and a metal foil selected from a solder foil or a tin foil, wherein the minimum ion viscosity value of the resin composition is 4-9 when measured in accordance with ASTM standard E2039 by applying a frequency of 10000 Hz at the melting point of the metal foil. The present invention further provides a method for connecting terminals and a method for producing a connection terminal using the conductive connecting material. By using the conductive connecting material of the present invention, good electric connection between connection tell finals as well as highly-reliable insulation between adjacent terminals can be achieved. | 07-19-2012 |
| 20120237774 | Polyamides and Amidoamines From Selectively Modified Amine Amines - The present disclosure provides polyamides and amidoamine curing agents including the reaction product of (1) a modified amine component comprising at least one multifunctional amine of structure 1: | 09-20-2012 |
| 20120237775 | POWDER COATING METHOD - A coating film is formed on a surface of a coating object by adhering a coating powder to the coating object by spraying the coating powder from an electrostatic gun together with a compressed gas. A voltage not smaller than 80 kV but not larger than 100 kV is applied between the electrostatic gun and the coating object. Moreover, a current flowed between the electrostatic gun and the coating object is set to be not smaller than 10 μA but not larger than 20 μA. Further, a pressure of the compressed gas for spraying the coating powder is set to be not smaller than 3 kgf/cm | 09-20-2012 |
| 20120237776 | BACKED PLY MATERIAL AND APPARATUS FOR FORMING SAME - A layered material may include a ply material and a backing film disposed upon the ply material. The backing film may comprise a polyester film. | 09-20-2012 |
| 20120251830 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME - A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. | 10-04-2012 |
| 20120258316 | POWDER COATING COMPOSITIONS CAPABLE OF HAVING A SUBSTANTIALLY NON-ZINC CONTAINING PRIMER - Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, can be formed from a coating composition comprising a primer having an epoxy resin with the proviso that the epoxy resin does not have an EEW of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a HEW of about 200 to about 500, and a platy filler. The primer contains less than 20 wt % zinc. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 450 to about 1400, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a foaming agent and a reinforcing fiber. | 10-11-2012 |
| 20120276392 | THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE - Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided. | 11-01-2012 |
| 20120315487 | COMPOSITE PARTICLE, METHOD FOR PRODUCING THE SAME, AND RESIN COMPOSITION - A composite particle is constituted to include: an aluminum nitride particle; a first coating layer that contains α-alumina and coats at least a part of a region of a surface of the aluminum nitride particle; and a second coating layer that contains organic matter and coats a region other than the first coating layer of the surface of the aluminum nitride particle. | 12-13-2012 |
| 20130011682 | RESIN COMPOSITION, AND PREPEG AND LAMINATE PREPARED USING THE SAME - A resin composition is provided. The resin composition comprises:
| 01-10-2013 |
| 20130034736 | SHAPE MEMORY MATERIAL BASED ON A STRUCTURAL ADHESIVE - A composition, including at least one curable structural adhesive, and at least one thermoplastic elastomer, wherein the thermoplastic elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies. | 02-07-2013 |
| 20130040147 | PHOSPHORUS-CONTAINING OLIGOMER AND METHOD FOR PRODUCING THE SAME, CURABLE RESIN COMPOSITION AND CURED PRODUCT OF THE SAME, AND PRINTED WIRING BOARD - [Object] A phosphorus-containing oligomer that has high solubility in an organic solvent and exhibits high flame retardancy and heat resistance in the form of a cured product thereof is provided. The phosphorus-containing oligomer is represented by structural formula (1) below | 02-14-2013 |
| 20130089743 | RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET - There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler. | 04-11-2013 |
| 20130101857 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR ENCAPSULATING MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM - A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms). | 04-25-2013 |
| 20130108875 | INORGANIC FILLER, RESIN COMPOSITION, AND APPLICATION THEREOF | 05-02-2013 |
| 20130122308 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises:
| 05-16-2013 |
| 20130136930 | RESIN COMPOSITION, PREPREG, AND LAMINATE - There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1): | 05-30-2013 |
| 20130143046 | EPOXY RESIN COMPOSITION, AND PREPREG AND METAL-CLAD LAMINATE USING THE SAME - Disclosed is an epoxy resin composition, which includes (A) an epoxy resin having at least two epoxy groups in one molecule; (B) a curing agent; and (C) polystyrene. | 06-06-2013 |
| 20130157061 | RESIN COMPOSITION, AND PREPREG AND LAMINATED SHEET USING THE SAME - There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B) | 06-20-2013 |
| 20130230727 | Copolymer of Styrene and Maleic Anhydride Comprising an Epoxy Resin Composition and Co-Cross-Linking Agent - A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent. | 09-05-2013 |
| 20130266813 | ENHANCED DURABILITY OF STRUCTURAL ADHESIVES - An exemplary embodiment discloses a structural adhesive including a structural adhesive; and, a hydrophobic material additive comprising a material selected from the group consisting of oil and carbon black. | 10-10-2013 |
| 20130266814 | GLOSSY IMPROVED APPEARANCE AUTO-DEPOSITION COATING, AND METHODS OF APPLYING SAME - The invention provides an improved appearance, glossy, autodepositing coating composition that maintains its desirable properties such as moisture barrier properties, although it is still able to deliver a glossy finish. No additional coatings are necessary over the instant coating to achieve a gloss. The glossy composition is accomplished by narrowing the molecular weight distribution and the molecular weight of an autodepositing epoxy dispersion coating by adding a chain transfer agent. The chain transfer agent is a thiol-containing compound made from an epoxy resin mixed with at least one ethylenically unsaturated monomer polymerized through a polymerization process, a curing agent, and a starter composition of peroxide, FeF3, and hydrofluoric acid. By eliminating the starter composition, a bath concentrate suitable for selling is manufactured. | 10-10-2013 |
| 20130337269 | RESIN COMPOSITION, AND PREPREG AS WELL AS LAMINATE USING THE SAME - A resin composition is provided which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. There is used a resin composition including an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride. | 12-19-2013 |
| 20140017502 | RESIN COMPOSITION, PREPREG AND LAMINATE - It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components. | 01-16-2014 |
| 20140044973 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin, a zinc oxide powder and a hardener, wherein the zinc oxide powder has a Mohs hardness ranging from about 4 to about 5 and a diameter ranging from about 0.1 μm to about 50 μm, and the amount of the zinc oxide powder is more than 0.5 parts by weight and less than 10 parts by weight per 100 parts by weight of the epoxy resin. | 02-13-2014 |
| 20140050926 | METHOD OF APPLYING COATING COMPOSITION OF QUATERNARY AMMONIUM SALTS CONTAINING NON-HALOGEN ANIONS AS ANTICORROSIVE AGENTS - Disclosed are quaternary ammonium salts containing non-halogen anions (e.g., quaternary ammonium carbonates, bicarbonates, and mixtures thereof) as anti-corrosive agents. The invention relates to a method for inhibiting the corrosion of metal surfaces by applying a composition containing one or more quaternary ammonium carbonate or bicarbonate. The disclosure is also directed to anti-corrosive coatings for metal substrates containing these compounds, to metal substrates having these anticorrosive coatings, and to aqueous cleaning solutions containing these compounds. | 02-20-2014 |
| 20140065427 | VEHICLE COMPONENT INCLUDING BASALT AND METHOD FOR MAKING SAME - A vehicle component formed using a reinforcing mixture that includes a plurality of basalt fibers. According to one embodiment, the reinforced vehicle component could be formed by a method in which a vehicle component is provided for reinforcement, such as a vehicle panel that may be stamped from steel. Basalt fibers are mixed with a carrier that includes one or more of an epoxy or a glue. The mixture of basalt fibers and the carrier are applied to the vehicle panel. In one embodiment, for example, the mixture could be sprayed onto the vehicle panel for purposes of reinforcement. | 03-06-2014 |
| 20140162072 | THERMOSETTING RESIN COMPOSITIONS, RESIN FILMS IN B-STAGE, METAL FOILS, COPPER CLAD BOARDS AND MULTI LAYER BUILD-UP BOARDS - A thermosetting resin composition contains a liquid epoxy resin, a solid epoxy resin having a softening point of 125° C. or lower, an aromatic diamine compound including benzoate group and a main chain including polymethylene group, a solvent soluble polyimide resin having Tg of 200° C. or higher and a weight average molecular weight Mw of 50000 or smaller, and a phenoxy resin having Tg of 130° C. or higher. A total of amounts of the solvent soluble polyamide resin and the phenoxy resin is 15 weight parts or more and 150 weight parts or less, provided that 100 weight parts are assigned to a total of amounts of the liquid epoxy resin, the solid epoxy resin and the aromatic diamine compound. | 06-12-2014 |
| 20140170418 | ANTI-CORROSION COATING COMPOSITION AND USE THEREOF - Anti-corrosion coatings comprising electroconductive polymers polymerized in the presence of one or more film forming polymers are provided. These coatings can be used with metal substrates such as cold-rolled steel and other metals to inhibit corrosion. | 06-19-2014 |
| 20140178696 | RESIN COMPOSITION, COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD FOR USE THEREWITH - A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition. | 06-26-2014 |
| 20140178697 | HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME - A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards. | 06-26-2014 |
| 20140255702 | ELECTRODEPOSITABLE FILM-FORMING COMPOSITIONS CAPABLE OF FORMING STRATIFIED FILMS, AND THEIR USE IN COMPACT PROCESSES - An electrodepositable film-forming composition is provided, comprising a resinous phase dispersed in an aqueous medium. The resinous phase comprises: (1) an ungelled active hydrogen-containing, cationic resin derived from a polyepoxide; (2) a cationic acrylic resin containing urethane functional groups; and (3) an at least partially blocked polyisocyanate curing agent. Also provided is a coated metal substrate comprising: A) a metal substrate having at least one coatable surface, and B) a cured coating layer deposited on at least one surface of the substrate and having a coating/air interface and a coating/substrate interface, wherein the cured coating layer is deposited from the electrodepositable film-forming composition described above. Further provided is a process for coating an electroconductive substrate, comprising electrophoretically depositing on the substrate the curable, electrodepositable coating composition described above. | 09-11-2014 |
| 20140272422 | ANTI-CORROSION COMPOSITIONS FOR NATURAL GAS RECOVERY OR CONVEYING EQUIPMENT - Improved anti-corrosion systems are provided for use with hydrocarbon recovery, treatment and distribution equipment, in order to inhibit corrosion on the metal surfaces thereof. The systems include an epoxy resin, a curing agent for the resin, and a surfactant, which is the reaction product of an alkyl benzene sulfonic acid at least partially neutralized of from about 6-11 with an ammonia or amine neutralizing agent. The systems provide improved anti-corrosion protection in the case of metal surfaces not continually wetted with liquid hydrocarbons, such as crude oil. | 09-18-2014 |
| 20140272423 | ANTI-CORROSION COMPOSITIONS FOR NATURAL GAS RECOVERY OR CONVEYING EQUIPMEN - Improved anti-corrosion systems are provided for use with hydrocarbon recovery, treatment and distribution equipment, in order to inhibit corrosion on the metal surfaces thereof. The systems include an epoxy resin, a curing agent for the resin, and a surfactant, which is the reaction product of an alkyl benzene sulfonic acid at least partially neutralized of from about 6-11 with an ammonia or amine neutralizing agent. The systems provide improved anti-corrosion protection in the case of metal surfaces not continually wetted with liquid hydrocarbons, such as crude oil. | 09-18-2014 |
| 20140287241 | EPOXY RESIN, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD - Provided is an epoxy resin allowing a cured product that is less changed in terms of heat resistance due to thermal history and has low thermal expansion, the epoxy resin having high solvent solubility. The epoxy resin is a polyglycidyl ether of a naphthol-novolac resin including, at predetermined proportions, a trimer and a dimer that have specific structures. | 09-25-2014 |
| 20140308527 | ISOCYANURATE EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING SAME, COMPOSITION INCLUDING SAME, CURED PRODUCT OF THE COMPOSITION, AND USE OF THE COMPOSITION - Disclosed are an alkoxysilylated isocyanurate epoxy compound, a composite of which exhibiting low CTE and high glass transition temperature or Tg-less and/or a cured product of which exhibiting good flame retardant property, a method of preparing the same, a composition including the same, a cured product formed of the composition, and a use of the composition. An isocyanurate epoxy compound having an alkoxysilyl group and an epoxy group in a core; a method of manufacturing the epoxy compound by the epoxidation and alkoxysilylation of a starting material; an epoxy composition including the epoxy compound; and a cured product and a use thereof, are provided. A composite of the epoxy composition has improved bonding efficiency between alkoxysilyl group and filler and between alkoxysilyl groups, and has good heat resistance, low CTE, and high glass transition temperature or Tg-less. A cured product formed of the epoxy composition has good flame retardant property. | 10-16-2014 |
| 20140322541 | HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME - A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards. | 10-30-2014 |
| 20140349121 | Chromium-Free Paint Composition And Paint Films Obtained By Coating Same - To provide a chromium-free paint composition which can provide paint films which are excellent in terms of corrosion resistance on the edge surfaces, scratched surfaces and worked parts of a pre-coated steel sheet, and the paint films which can be obtained by coating this chromium-free paint composition. A chromium-free paint composition which includes paint film-forming resin (A), anti-rust pigment (B), comprising at least one type of amorphous MgO—V | 11-27-2014 |
| 20140377565 | RESIN COMPOSITION, PREPREG, AND LAMINATE - A resin composition of the present invention contains a mixture (A) of at least two of cyanate ester compounds selected from the group consisting of cyanate ester compounds (A1) to (A3) having a specific structural unit, an epoxy resin (B), and an inorganic filler (C). A prepreg of the present invention is obtained by impregnating a base material with the resin composition or applying the resin composition to a base material. Furthermore, a metal foil-clad laminate of the present invention is the laminate comprising the prepreg. Furthermore, a printed wiring board of the present invention contains an insulating layer and a conductor layer formed on a surface of the insulating layer, in which the insulating layer contains the resin composition. | 12-25-2014 |
| 20150017450 | RESIN COMPOSITION AND SEMICONDUCTOR MOUNTING SUBSTRATE OBTAINED BY MOLDING SAME - A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature. (A) an epoxy rein (B) an amine-based curing agent (C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group (D) silica particles (E) a silane coupling agent Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent. Also provided is a semiconductor mounting substrate which is obtained by molding the resin composition. | 01-15-2015 |
| 20150024215 | SILVER-PLATED COATED BODY - Provided is a silver-plated coated body that is excellent in interlayer adhesion and tarnish resistance. The silver-plated coated body has a silver film layer and a topcoat layer as essential layers on a substrate, the topcoat layer containing at least one kind selected from thiourea and thiourea derivatives, and at least one kind selected from thiol organic acids and thiol organic acid derivatives. | 01-22-2015 |
| 20150037588 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD - Provided is a photosensitive resin composition which has excellent heat resistance, pore explosion resistance, empty foam resistance and crack resistance. A photosensitive resin composition of the present invention contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a diluent solvent, (D) a compound that has two or more ethylenically unsaturated groups in each molecule and (E) a thermosetting component that has two or more cyclic ether groups and/or cyclic thioether groups in each molecule. This photosensitive resin composition is characterized in that: (A-1) a carboxyl group-containing resin which is obtained by reacting an esterified product of an epoxy group, said esterified product being produced by reacting (a) at least one kind of a bisphenol type epoxy compound and (b) an unsaturated carboxylic acid, with (c) a saturated or unsaturated polybasic acid anhydride is contained as the carboxyl group-containing resin (A); and the thermosetting component (E) has an average epoxy equivalent weight of 200 or more. | 02-05-2015 |
| 20150037589 | RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATED BOARD AND PRINTED WIRING BOARD - The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less. | 02-05-2015 |
| 20150044475 | ELECTRICAL STEEL SHEET WITH INSULATION COATING, METHOD OF MANUFACTURING SAME, AND COATING MATERIAL FOR FORMING INSULATING COATING - The present invention includes an electrical steel sheet with an insulation coating having a large interlaminar insulation resistance when laminated; a coating material for forming the insulation coating that is used for the electrical steel sheet and the coating material for forming the insulation coating, which includes apart from a solvent an aqueous carboxy group-containing resin as component (A), an aluminum-containing oxide as component (B), and at least one crosslinking agent as component (C) selected from the group consisting of melamine, isocyanate and oxazoline. There are component (A); 100 parts by mass; 40 parts by mass| 02-12-2015 | |
| 20150044476 | Two-Coat Single Cure Powder Coating - Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage. | 02-12-2015 |
| 20150056454 | RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE - Provided are a resin composition that can realize a prepreg, a metal foil-clad laminate and the like high in light reflectance in an ultraviolet region and in a visible light region, small in the reduction in light reflectance due to a heating treatment and a light irradiation treatment, good in peel strength of metal foil, also excellent in heat resistance after moisture absorption, also good in outer appearance, and also excellent in preservation stability, and a prepreg, a metal foil-clad laminate and the like using the same. The resin composition of the present invention contains at least an epoxy-modified silicone compound (A), a branched imide resin (B) having an isocyanurate group and a carboxyl group, a phosphorus curing accelerator (C), titanium dioxide (D) and a dispersant (E). The branched imide resin (B) is preferably at least one selected from the group consisting of an epoxy-modified branched imide resin, an alcohol-modified branched imide resin and an amine-modified branched imide resin. | 02-26-2015 |
| 20150079402 | WATERBORNE DISPERSIONS - A waterborne dispersion containing a high molecular weight cycloaliphatic epoxy resin based on a diglycidyl ether of a cycloaliphatic diol polymerized with, for example, a diphenolic or diacid compound. | 03-19-2015 |
| 20150104651 | EPOXY RESIN, METHOD FOR PRODUCING EXPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL - The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin. | 04-16-2015 |
| 20150111044 | RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET - There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler. | 04-23-2015 |
| 20150118499 | ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM - A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds. | 04-30-2015 |
| 20150322271 | CHROMATE FREE PRETREATMENT PRIMER - A coating comprising epoxy functional resin, corrosion resistant particles, and a multi-functional crosslinker are disclosed as are methods of using such a coating to coat at least a portion of a substrate and a substrate coated thereby. | 11-12-2015 |
| 20150322308 | EPOXY RESIN, PRODUCTION METHOD THEREOF, EPOXY RESIN COMPOSITION, AND CURED PRODUCT - An epoxy resin obtained through the following steps (a) to (d): | 11-12-2015 |
| 20150322588 | Functionally Graded Coatings and Claddings for Corrosion and High Temperature Protection - The present disclosure describes functionally graded coatings and claddings for corrosion and high temperature protection. | 11-12-2015 |
| 20150343753 | METHODS FOR BONDING METAL AND THERMOPLASTIC COMPONENTS - A method for bonding components is provided. The method includes preparing a surface of a metal component, applying a film adhesive to the prepared surface, forming a thermoplastic component using injection molding such that the film adhesive is positioned between the metal component and the thermoplastic component, and curing the film adhesive. | 12-03-2015 |
| 20150368506 | TWO-COMPONENT-TYPE PRIMER, PRIMER COATING FILM, LAYERED ANTIFOULING COATING FILM, AND METHOD FOR PREVENTING BASE MATERIAL FROM BEING FOULED - Provided is a two-component-type primer having good adhesive property with a base material, particularly a nonferrous metal, and excellent curability, without containing any chromium compound. The two-component-type primer comprises an epoxy resin, an MXDA (meta-xylenediamine) Mannich modified curing agent, a gypsum (excluding crystal gypsum), and a pigment (excluding gypsum), wherein the volume concentration of a gypsum and a pigment in a dry coating film formed with the primer is 40 to 50%. | 12-24-2015 |
| 20150376447 | Curable resin composition containing aromatic polyester, and cured article thereof - Provided is a curable resin composition which: has high levels of dielectric characteristics required in an electrically insulating material application compatible with a high frequency; provides a cured article excellent in low water absorption rate and low linear expansion rate; and is excellent in wire embedding flatness and resin fluidity. Specifically, provided is an aromatic polyester obtained by condensing (a) an aromatic oxycarboxylic acid, (b) an aromatic polyvalent carboxylic acid or an aromatic polyhydric hydroxy compound, and (c) an aromatic monohydroxy compound or an aromatic monocarboxylic acid. Also provided is a curable resin composition containing the aromatic polyester (A), an epoxy resin (D) having two or more epoxy groups per molecule, and a curing accelerator (E). | 12-31-2015 |
| 20160002490 | POLYMERIZABLE COMPOSITION, CYCLOOLEFIN-BASED POLYMER, CYCLOOLEFIN-BASED RESIN MOLDED BODY, AND LAMINATE - The present invention pertains to: a polymerizable composition comprising a cycloolefin-based monomer represented by a formula (I), and a polymerization catalyst, wherein R | 01-07-2016 |
| 20160017141 | RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE - Provided is a resin composition for a printed wiring board with which a substrate material having a low CTE can be formed while ensuring good moldability. A resin composition for a printed wiring board contains a thermosetting resin including an epoxy resin, a curing agent, an inorganic filler, and an expansion relief component including an acrylic resin that is soluble in an organic solvent. The content of the inorganic filler is 150 parts by mass or more with respect to 100 parts by mass of the total amount of the thermosetting resin and the curing agent. The melt viscosity at 130° C. is less than 50000 Ps. | 01-21-2016 |
| 20160024310 | POCESS FOR PROVIDING METALLIC SUBSTRATES WITH CORROSION RESISTANCE - The present invention relates to the technical field of providing corrosion resistant coatings or anticorrosion coatings on substrates which are susceptible to corrosion, particularly on metallic substrates, especially of providing chromate-free corrosion resistant (anticorrosion) coatings on such substrates. | 01-28-2016 |
| 20160024312 | Sour Gas Resistant Coating - Coating compositions that include one or more epoxy resin compositions, one or more metal-containing compound and one or more curing agents are described. The compositions can be applied to steel substrates, including steel substrates such as steel pipe to resist attack by sour gas. When applied to a substrate and cured, these coating compositions demonstrate reduced permeability to hydrogen sulfide. | 01-28-2016 |
| 20160083542 | IMPROVEMENTS IN OR RELATING TO EPOXY RESIN FORMULATIONS - Epoxy formulations comprising a polyfunctional epoxy resin, a solid bisphenol A epoxy resin, a phenolic end capped bisphenol A resin, a rubber epoxy adduct and a curative are provided as is their use in prepregs and as matrix materials in laminates of metal foil and fibre reinforced epoxy resins. | 03-24-2016 |
| 20160102224 | Coating Composition - A coating composition comprising i) a polymeric film forming resin, ii) a crosslinking agent suitable for crosslinking the polymeric film forming resin i), and iii) an additive comprising a bismuth carboxylic acid salt. | 04-14-2016 |
| 20160115324 | Coating compositions and coating products made therefrom - A coating composition and coating products made therefrom, containing modified inorganic nanoplatelets that form mesomorphic structure in a resin phase. The coating products exhibit low permeation/penetration properties, and can be used as anti-corrosion or barrier coatings. | 04-28-2016 |
| 20160125972 | RESIN COMPOSITION, PREPREG, RESIN SHEET AND METAL FOIL-CLAD LAMINATE - The resin composition of the present invention comprises a cyanate ester compound (A) obtained by cyanating a modified naphthalene formaldehyde resin, and an epoxy resin (B). | 05-05-2016 |
| 20160153107 | MULTI-LAYERED COATING FILM FORMATION METHOD | 06-02-2016 |
| 20160160057 | WATERBORNE SHOP PRIMER - A coating system for application to metal components prior to assembly or fabrication into large metal objects is described. The system includes a composition comprising a water-dispersible polymer component, a crosslinking agent, and a conductive material. When applied to a metal substrate, the coating system is weldable and provides optimal corrosion resistance during fabrication or assembly. | 06-09-2016 |
| 20160193810 | Electric Field Activated Shape Memory Polymer Composite | 07-07-2016 |
| 20180022919 | LOW-DIELECTRIC RESIN COMPOSITION | 01-25-2018 |
| 20180022927 | ELECTRICAL STEEL SHEET | 01-25-2018 |
