| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 428672000 | Au-base component | 10 |
| 20090191424 | MANUFACTURING METHOD FOR A COMPOSITE METAL WIRE USED AS A PACKAGING WIRE AND PRODUCTS THEREOF - A manufacturing method for a composite metal wire used as semiconductor packaging wire and products thereof. Au, Ag and Cu materials are melted in a vacuum melting furnace, and then trace metal elements are added into the vacuum melting furnace and melted together with Au, Ag and Cu materials to obtain a composite material. The obtained composite material is drawn by a fist thick drawing machine, a second thick drawing machine and a first thin drawing machine to obtain a composite metal wire with a predetermined diameter. An Au layer is electroplated to the surface of the composite metal wire. The composite metal wire with Au layer is then drawn by a thin drawing machine, a very thin drawing machine and an ultra thin drawing machine to obtain an ultra thin composite metal wire with a predetermined diameter. Finally, the surface of the composite metal wire is washed and the composite metal wire is heat treated to ensure a final product with desirable physical properties, e.g. breaking load and elongation. | 07-30-2009 |
| 20100086807 | NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM - Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal. | 04-08-2010 |
| 20100183898 | METALLIZED SUBSTRATE AND METHOD FOR PRODUCING THE SAME - A metallized substrate having, disposed in the order mentioned: a ceramics substrate; a high-melting point metal layer; a base nickel plating layer; a layered nickel-phosphorous plating layer; a diffusion-inhibiting plating layer; and a gold plating layer. The base nickel plating layer being any one of a nickel plating layer, a nickel-boron plating layer, or a nickel-cobalt plating layer. The diffusion-inhibiting plating layer being any one of a columnar nickel-phosphorous plating layer, a palladium-phosphorous plating layer, or a palladium plating layer. According to the above composition, even after heating the semiconductor chips in a mounted state, the metallized substrate can make the connection strength of wire bonding favorable. | 07-22-2010 |
| 20120021248 | SYNTHESIS OF NANOPEAPODS BY GALVANIC DISPLACEMENT OF SEGMENTED NANOWIRES - A method for fabricating nanostructures, which includes the steps of forming a multi-segmented nanowire; and performing a galvanic displacement reaction on the multi-segmented nanowire. The method utilizes template directed electrodeposition to fabricate nanowires with alternating layers of sacrificial/noble metal, enabling a new level of control over particle spacing, aspect ratio, and composition. Moreover, by exploiting the redox potential dependent reaction of galvanic displacement, nanopeapod materials can be extended (semiconductor/metal, p-type/n-type, metal/metal, ferromagnetic/nonmagnetic, etc.) beyond the fundamental metal/metal-oxide nanopeapods synthesized by high temperature techniques. In accordance with an exemplary embodiment. Co/Au and Ni/Au multisegmented nanowires were used to create Te/Au nanopeapods by galvanic displacement, producing Te nanotubes and nanowires with embedded Au particles, respectively. | 01-26-2012 |
| 20120129005 | ELECTROLESS GOLD PLATING SOLUTION AND ELECTROLESS GOLD PLATING METHOD - It is an object of the present invention to provide an electroless gold plating solution capable of directly subjecting a plated coating film made of an underlying metal such as nickel or palladium to gold plate processing, of forming a thick gold plated coating film having a thickness of 0.1 μm or more, of forming a uniform gold plated coating film, and of safely performing plating work. The present invention relates to an electroless gold plating solution comprising: a water-soluble gold compound; and hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. Preferably, the electroless gold plating solution comprises 0.1 to 100 g/L of hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. | 05-24-2012 |
| 20130171470 | ALLOY WIRE AND METHODS FOR MANUFACTURING THE SAME - An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire. | 07-04-2013 |
| 20150010778 | COATED ARTICLES AND METHODS - Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process. | 01-08-2015 |
| 20150314570 | ENCAPSULATED BEAM AND METHOD OF FORMING - A device including a protecting material encapsulated metallic beam and a method of encapsulating the metallic beam using the protecting material layer are presented. The device includes a cantilever beam that includes at least about 90 Wt % of a metallic beam material, and 10 Wt % or less of a protecting material. The method of forming an encapsulated metallic beam includes the steps of depositing a first layer of protecting material over a substrate, depositing a second layer of protecting material over the first layer, depositing a metallic beam material over the second layer of protecting material, and encapsulating the beam material with a coating of the protecting material. | 11-05-2015 |
| 20160024678 | PREFERRED ORIENTED AU FILM, METHOD FOR PREPARING THE SAME AND BONDING STRUCTURE COMPRISING THE SAME - The present invention relates to a preferred oriented Au film, a method for preparing the same, and a bonding structure comprising the same. The Au film comprises a plurality of Au grains connected to each other, wherein at least 50% by volume of the Au grains are composed of a plurality of nano-twin Au grains, and the nano-twin Au grains are formed of a plurality of nano-twin Au stacked along a [ | 01-28-2016 |
| 20160089752 | Au-Sn-Ag-BASED SOLDER ALLOY, ELECTRONIC DEVICE SEALED OR JOINED USING THE SAME, AND ELECTRONIC APPARATUS EQUIPPED WITH THE ELECTRONIC DEVICE - Disclosed herein is a high-temperature lead-free Au—Sn—Ag-based solder alloy that is excellent in sealability, joint reliability, and wet-spreadability, that can be kept at a high quality level for a long period of time, and that is provided at a relatively low cost. The lead-free Au—Sn—Ag-based solder alloy contains 27.5 mass % or more but less than 33.0 mass % of Sn, 8.0 mass % or more but 14.5 mass % or less of Ag, and a balance being Au except for elements inevitably contained therein during production. When having a plate- or sheet-like shape, the Au—Sn—Ag-based solder alloy has a surface whose L*, a*, and b* in an L*a*b* color system in accordance with JIS Z8781-4 are 41.1 or more but 57.1 or less, −1.48 or more but 0.52 or less, and −4.8 or more but 9.2 or less, respectively. When having a ball-like shape, the Au—Sn—Ag-based solder alloy has a surface whose L*, a*, and b* are 63.9 or more but 75.9 or less, 0.05 or more but 0.65 or less, and 1.3 or more but 11.3 or less, respectively. | 03-31-2016 |
