Class / Patent application number | Description | Number of patent applications / Date published |
428642000 | Ga-, In-, Tl- or Group VA metal-base component | 12 |
20090233123 | METHOD OF MANUFACTURING A DECORATIVE ARTICLE, A DECORATIVE ARTICLE, AND A TIMEPIECE - A method of manufacturing a decorative article, including a first coating formation step of forming a first coating of primarily TiN on a base member, and a second coating formation step of forming a second coating on the first coating by means of a dry plating method using an Au—Pd—Ag—In alloy of primarily Au and containing 6.0-9.0 wt % Pd, 6.0-8.0 wt % Ag, and 7.0-9.0 wt % In as a target. | 09-17-2009 |
20100028713 | METHOD AND ARTICLE FOR IMPROVED ADHESION OF FATIGUE-PRONE COMPONENTS - A method of processing an article includes mechanically working an article having a metallic layer disposed on a titanium substrate and establishing a residual stress region that extends through the metallic layer and at least partially into the titanium substrate. | 02-04-2010 |
20100266869 | SLIDE MEMBER - A slide member including a base material; an intermediate layer consisting of Ag or Ag-based alloy and an additive element of a first quantity formed over the base material; and an overlay comprising Bi or Bi-based alloy and the additive element of a second quantity formed over the intermediate layer, wherein the additive element consists of a low melting point metal, the first quantity being five times or greater than the second quantity. | 10-21-2010 |
20110033728 | Method and System for Repairing Cracks in Structures - A first material with a known maximum temperature of operation is coated with a second material on at least one surface of the first material. The coating has a melting temperature that is greater than the maximum temperature of operation of the first material. The coating is heated to its melting temperature until the coating flows into any cracks in the first material's surface. | 02-10-2011 |
20120028073 | PROCESS FOR ELECTROPLATING OF COPPER - A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided. | 02-02-2012 |
20130029177 | COLD SPRAYED AND HEAT TREATED COATING FOR MAGNESIUM - Methods of coating a magnesium substrate are provided along with coated magnesium substrates. A low melting point material is cold sprayed onto a region of the magnesium substrate. A corrosion resistant material or a zinc material is cold sprayed over at least a portion of the low melting point material to form a coated magnesium substrate. The coated magnesium substrate is then heated. | 01-31-2013 |
20130143069 | Laminated Structure And Method For Producing The Same - Provided by the present invention is a laminated structure with good use efficiency, in which diffusion of tin from an indium-tin solder material to an indium target is favorably suppressed, and a method for producing the same. The laminated structure has a backing plate, an indium-tin solder material, and an indium target laminated in this order, and the concentration of tin in the 2.5 to 3.0 mm thickness range of the indium target from the indium-tin solder material side surface is 5 wtppm or less. | 06-06-2013 |
20130252020 | Electro-Depositing Metal Layers of Uniform Thickness - The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte. | 09-26-2013 |
20130316189 | SLIDING - A slide member is provided with a base material and an overlay provided over the base material. The overlay includes a plurality of regions in a thickness direction including a region located in sliding-surface side that slides with the counter element and a region located in a base-material side. A material forming the overlay includes a plurality of crystal planes. Orientation index of at least one of the crystal planes differs in the region located in the sliding-surface side and the region located in the base-material side of the overlay. | 11-28-2013 |
20140329107 | METAL MATERIAL FOR ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material | 11-06-2014 |
20150140357 | Layer For An Electrical Contact Element, Layer System And Method For Producing A Layer - A contact layer for an electrical contact is disclosed having bismuth and being tin-free. | 05-21-2015 |
20160121395 | REACTIVE POWDER, BONDING MATERIAL USING REACTIVE POWDER, BONDED BODY BONDED WITH BONDING MATERIAL AND METHOD FOR PRODUCING BONDED BODY - There is provided a reactive powder enabling a satisfactory and stable self-propagating high temperature synthesis (SHS) reaction. Also, there is provided a bonding material enabling reliable bonding, by using the reactive powder, while inhibiting thermal degradation of a joint member without depending on a surface shape to be bonded of the joint member. The reactive powder is a reactive powder enabling self-propagating high temperature synthesis including a first material and a second material that chemically react with each other, in which each grain constituting the reactive powder is in a state that first sub-grains made of the first material and second sub-grains made of the second material are disorderly mixed within the grain. | 05-05-2016 |