| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 428601000 | Discontinuous surface component | 45 |
| 20080213616 | DOOR SKIN, A METHOD OF ETCHING A PLATE, AND AN ETCHED PLATE FORMED THEREFROM - The present invention relates to a door skin comprising an exterior surface having outer portions lying on a first plane, spaced grooves recessed from the plane of the outer portions, and tonal portions having a planar area and a plurality of spaced depressions recessed from the plane of said planar area. The present invention is also directed to a method of etching a plate, for use with a molded die set, for embossing a wood grain pattern in the door skin, and the etched plate formed therefrom. | 09-04-2008 |
| 20080299409 | COMPOSITE METAL ARTICLE - A composite metal article provided in the present invention includes a carbon steel core and a dissimilar composite metal out-layer, said out-layer combined with the carbon steel core by high pressure forging. As the high pressure forging belongs to the precise forging type, which molded by the method of inpour the metal liquid into the cavity on high pressure, thus it can form a thin composite out-layer out of the carbon steel core; it can combined a composite out-layer with the complex structure carbon steel core thus form a complex structure railing and metal table/chair etc.; it can combined complex structure composite out-layer with the simplex structure carbon steel core thus form a complex structure railings and metal table/chair etc.; as there are no air holes on the composite out-layer surface, it has a precise and nice-looking surface and can manufacture products by a simple post-processing. | 12-04-2008 |
| 20090053550 | TEXTURED SUBSTRATE FOR EPITAXIAL FILM FORMATION AND SURFACE IMPROVING METHOD OF TEXTURED SUBSTRATE FOR EPITAXIAL FILM FORMATION - Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness on the surface of the textured substrate for epitaxial film formation having a textured metal layer at least on one surface, wherein differences between orientation degrees (Δφ and Δω) in the textured metal layer surface and orientation degrees (Δφ and Δω) in the crystal orientation improving layer surface are both 0.1 to 3.0°. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to heat treatment, the smoothness of that surface can be improved. At this time, the surface roughness of the substrate surface becomes 20 nm or less. | 02-26-2009 |
| 20090087680 | Coated metal product and manufacturing method thereof - A coated metal product is disclosed in which the surface of a ferrous component is coated using an anticorrosive layer, and the surface of the anticorrosive layer is coated using a coating film. The coating film has numerous very small uncoated portions for exposing the surface of the anticorrosive layer to the exterior of the coated metal product, rather than the entire surface of the anticorrosive layer being coated. | 04-02-2009 |
| 20090148720 | ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, ELECTRONIC COMPONENT ASSEMBLY, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY - An electronic component device includes an electronic component element including a lower surface having a metal surface provided thereon, a metal plate arranged so that a first principal surface thereof faces the lower surface of the electronic component element, and a first solder provided between the lower surface of the electronic component element and the first principal surface of the metal plate, the first solder arranged to connect the electronic component element to the metal plate. At least a portion of a peripheral portion of the first principal surface of the metal plate is located outwardly beyond an outer periphery of the lower surface of the electronic component element. A ridge defined by the first solder is provided in the peripheral portion of the first principal surface of the metal plate along the outer periphery of the lower surface of the electronic component element. | 06-11-2009 |
| 20090176120 | HIGHLY ELECTRICALLY CONDUCTIVE SURFACES FOR ELECTROCHEMICAL APPLICATIONS - A method is described that can be used in electrodes for electrochemical devices and includes disposing a precious metal on a top surface of a corrosion-resistant metal substrate. The precious metal can be thermally sprayed onto the surface of the corrosion-resistant metal substrate to produce multiple metal splats. The thermal spraying can be based on a salt solution or on a metal particle suspension. A separate bonding process can be used after the metal splats are deposited to enhance the adhesion of the metal splats to the corrosion-resistant metal substrate. The surface area associated with the splats of the precious metal is less than the surface area associated with the top surface of the corrosion-resistant metal substrate. The thermal spraying rate can be controlled to achieve a desired ratio of the surface area of the metal splats to the surface area of the corrosion-resistant metal substrate. | 07-09-2009 |
| 20100143743 | STAINLESS STEEL SUBSTRATE WITH CONDUCTIVE METAL LAYER, HARD DISK SUSPENSION MATERIAL AND HARD DISK SUSPENSION MANUFACTURED BY USING THE MATERIAL - A stainless steel substrate with one or more conductive metal layers, a method for manufacturing the same, and a hard disk drive suspension material using the same that are excellent in etching accuracy and does not involve the use of any substances casing environmental burdens, while ensuring stable adhesion between the conductive metal layers on the stainless steel substrate and the polyimide-based resin layer. The conductive metal layers are formed to have a total thickness ranging from 0.1 to 10 ?m, a centerline average surface roughness Ra from 0.05 to 1 ?m, and a ten-point average surface roughness Rz from 1 to 5 ?m, respectively. | 06-10-2010 |
| 20100143744 | Systems and Methods of Laser Texturing of Material Surfaces and their Applications - The surface of a material is textured and by exposing the surface to pulses from an ultrafast laser. The laser treatment causes pillars to form on the treated surface. These pillars provide for greater light absorption. Texturing and crystallization can be carried out as a single step process. The crystallization of the material provides for higher electric conductivity and changes in optical and electronic properties of the material. The method may be performed in vacuum or a gaseous environment. The gaseous environment may aid in texturing and/or modifying physical and chemical properties of the surfaces. This method may be used on various material surfaces, such as semiconductors, metals and their alloys, ceramics, polymers, glasses, composites, as well as crystalline, nanocrystalline, polycrystalline, microcrystalline, and amorphous phases. | 06-10-2010 |
| 20100159268 | METHOD FOR PRODUCING DECORATIVE SURFACE STRUCTURES - In the case of a method for producing decorative surface structures, patterns or the like on articles, in particular sanitary articles, basic bodies made of a first metal, basic bodies made of metal that are coated with a first metal or basic bodies made of plastic that are coated with a first metal are used as a basis. Then, a layer of material temporarily applied to the article is partially removed by electromagnetic radiation or by particle radiation, thereby forming a first surface structure with regions that are free from material. Subsequently, the first metal is at least partially removed in the material-free regions or the first metal or some other metal is built up in the material-free regions. This method step is followed by removal of the still present material, a second (final) surface structure being formed. Finally, further top layers can preferably be applied to the article, the second surface structure being substantially retained. | 06-24-2010 |
| 20100215979 | Method of forming metal film and metal wiring pattern, undercoat composition for forming metal film and metal wiring pattern, and metal film - A method of forming a metal film and a metal wiring pattern is described a step of forming an organic film by applying and polymerizing an undercoat composition for forming a metal film containing an addition-polymerizable monomer having an acidic group and a polymerization initiator on a substrate or film, a step of converting the acidic group into a metal (M1) salt by treating the organic film with an aqueous solution containing a metal (M1) ion, a step of converting the metal (M1) salt into a metal (M2) salt by treating the organic film with an aqueous solution containing a metal (M2) ion having an ionization tendency lower than the metal (M1) ion, and a step of forming a metal film on the organic film surface by reducing the metal (M2) ion. | 08-26-2010 |
| 20100261031 | MANUFACTURING METHODS FOR METAL CLAD LAMINATES - The present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating material using the silver complexes having a unique structure and electroplating metals outside of said conductive layer. The present invention can provide the manufacturing method of metal clad laminates, which has a fast operation speed for mass production, simple process steps to minimize defective ratio and cheap production cost. | 10-14-2010 |
| 20110091738 | COMPOSITE MATERIAL FOR ELECTRIC/ELECTRONIC PART, PRODUCTION METHOD THEREOF, AND ELECTRIC/ELECTRONIC PART - A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass. | 04-21-2011 |
| 20110244263 | PATTERNING USING ELECTROLYSIS - A method of patterning and an article having a patterned structure defined therein are provided. The method comprises the steps of providing a substrate having a patterned conductive metal film disposed thereon. The patterned conductive metal film has at least one raised feature. The patterned conductive metal film defines at least one recess therein that is adjacent to the at least one raised feature. A surface of the substrate is exposed in the at least one recess. The pattern is modified through electrolysis in an electrodeposition setup including an electrolyte and two electrodes. The patterned conductive metal film is one of the electrodes during electrolysis. The method is ideal for shrinking initial patterns having features that are on the magnitude of microscale dimensions to obtain a final pattern having features that are on the magnitude of nanoscale dimensions. | 10-06-2011 |
| 20110268984 | METHOD OF CONTROLLING SURFACE DEFECTS IN METAL-COATED STRIP - A method of controlling “rough coating” and “pinhole-uncoated” surface defects on a steel strip coated with a aluminum-zinc-silicon alloy. The alloy has 50-60% wt Al, 37-46% wt Zn and 1.2-2.3% wt Si. The method includes heat treating the steel strip in a heat treatment furnace and thereafter hot-dip coating the strip in a molten bath and thereby forming a coating of the alloy on the steel strip. The method is characterized by controlling the concentration of (i) strontium or (ii) calcium or (iii) strontium and calcium in the molten bath to be at least 2 ppm. | 11-03-2011 |
| 20120015205 | Surface Finishing Process for Indirect or Offset Printing Components - A process for preparing an imaging surface of an imaging transfer member in a printing machine, the process comprises providing a surface roughness to the imaging surface to produce a plurality of pits having sharp features on the surface, and then exposing the pitted imaging surface to an acid dip for a time period sufficient to substantially reduce the sharp features on the imaging surface. This process may be followed by anodization. The process produces an imaging surface having a pit structure providing reduced oil consumption and wear of components of the printing machine that contact the imaging surface. | 01-19-2012 |
| 20120094141 | DESIGN METHOD OF WELDING METHOD, WELDING METHOD AND WELDED JOINT BODY - A welding method is provided which makes it possible to obtain a joint body having a sufficient strength by selecting a metal glass and a crystalline metal having given conditions. According to the present invention, there is provided a welding method of applying energy to an interface where a metal glass and a crystalline metal make contact with each other or to the metal glass near the interface, of forming a molten layer by heating and melting the metal glass and of performing welding, in which the molten layer after the metal glass and the crystalline metal have been joined together has a glass formation ability, the metal glass has a glass formation ability in which a nose time of a TTT curve when a solid of the metal glass is reheated is 0.2 seconds or more, and the metal glass and the crystalline metal are formed with a material that satisfies a temperature range of a temperature of the metal glass at which a spread factor of the crystalline metal that has not been melted and the molten metal glass is 25% or more and a melting point of the crystalline metal to be 100k or more. | 04-19-2012 |
| 20130004789 | METHOD FOR PATTERNING SURFACE OF METAL OBJECT AND THE METAL OBJECT - On the surface of the spread multi-layered metal object, as reaches from outside to inside of step-wise, the pattern shaped concave is formed by reaching the lower layer of metal layer of the metal layer. The concave is formed as step-wise, the innermost reaches inside of the metal layer from the surface, the outer reaches the top of the metal layer from the surface, and the outermost reaches the top of the metal layer. The metals removed to form the concave remains inside and effectively control on the pattern part obtained at the end. As a result, able to form desired pattern stably. | 01-03-2013 |
| 20130022830 | BUMPING PROCESS AND STRUCTURE THEREOF - A bumping process comprises steps of forming a metal layer with copper on a substrate, and the metal layer with copper comprises a plurality of first zones and second zones; forming a photoresist layer on the metal layer with copper; patterning the photoresist layer to form a plurality of openings; forming a plurality of copper bumps within the openings, each of the copper bumps covers the first zones and comprises a first top surface; forming a connection layer on the first top surface; removing the photoresist layer; removing the second zones and enabling each of the first zones to form an under bump metallurgy layer, wherein the under bump metallurgy layer, the copper bump, and the connection layer possess their corresponded peripheral walls, and covering sections of a first protective layer formed on the connection layer may cover those peripheral walls to prevent ionization phenomenon. | 01-24-2013 |
| 20130029172 | COATED STEEL STRIPS, METHODS OF MAKING THE SAME, METHODS OF USING THE SAME, STAMPING BLANKS PREPARED FROM THE SAME, STAMPED PRODUCTS PREPARED FROM THE SAME, AND ARTICLES OF MANUFACTURE WHICH CONTAIN SUCH A STAMPED PRODUCT - Coated steel having a well defined and uniform thickness is useful and advantageous for preparing products by hot stamping. Products prepared by hot stamping such a steel are particularly advantageous when subjected to a subsequent spot welding step. | 01-31-2013 |
| 20130108886 | METAL COMPONENT, METHOD FOR PRODUCING A METAL COMPONENT, AND FITTING, PIECE OF FURNITURE AND HOUSEHOLD APPLIANCE | 05-02-2013 |
| 20130230736 | NANOSTRUCTURE DEVICE AND METHOD FOR MANUFACTURING NANOSTRUCTURES - A method for manufacturing a plurality of nanostructures ( | 09-05-2013 |
| 20130236736 | ELECTROPLATING JIG FOR PROCESSING ELECTROPLATING AT CERTAIN LOCATION, ELECTROPLATING METHOD INCORPORATING WITH THE SAME, AND ELECTRO PRODUCT FREE OF PLATING PROOF LAYER PRODUCED THEREBY - An electroplating jig for processing electroplating at a certain location, an electroplating method incorporating with the electroplating jig, and an electro product free of a plating proof layer produced by the electroplating method are provided. The electroplating jig includes a base and a flexible electric conductive pad. An accommodation slot and an opening are respectively installed on two opposite surfaces of the base in which an electro can be disposed in the accommodation slot and the accommodation slot is larger than the opening and communicated with the opening, the opening exposes a first metal pattern of the electro therefrom. The flexible electric conductive pad is blanketed on a second metal pattern formed on another surface of the electro to electrically connect the first metal pattern and the second metal pattern. | 09-12-2013 |
| 20130302634 | MANUFACTURING METHOD OF VEHICLE TAILGATE INNER PANEL - Disclosed herein is a method of manufacturing an inner panel of a vehicle tailgate, which is formed in a bending plate shape and to which reinforcing members are coupled to improve rigidity, including: temporarily coupling a plurality of sub-blanks to a main blank by spot welding; forming the main blank into an inner panel and the plurality of sub-blanks into a plurality of reinforcing members, using a forming mold; and permanently coupling the plurality of reinforcing members to the inner panel. | 11-14-2013 |
| 20130316185 | SHEET METAL PIECE HAVING WELD NOTCH AND METHOD OF FORMING THE SAME - A sheet metal piece includes a base material layer and one or more intermediate and coating material layers, along with a weld notch formed along an edge region of the piece. At least a portion of the coating and intermediate material layers is removed at the weld notch so that certain constituents from such layers do not affect the integrity of a nearby weld joint when it is subsequently formed along the edge region. Various methods of ablation, including laser ablation, can be used to form the weld notch. | 11-28-2013 |
| 20140030541 | ALTERNATE PAD STRUCTURES/PASSIVATION INTEGRATION SCHEMES TO REDUCE OR ELIMINATE IMC CRACKING IN POST WIRE BONDED DIES DURING CU/LOW-K BEOL PROCESSING - Passivation integration schemes and pad structures to reduce the stress gradients and/or improve the contact surface existing between the Al in the pad and the gold wire bond. One of the pad structures provides a plurality of recessed pad areas which are formed in a single aluminum pad. An oxide mesa can he provided under the aluminum pad. Another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a copper pad and a plurality of trench/via pads. Still another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a portion of a copper pad, such that the aluminum pad and the copper pad are staggered relative to each other. | 01-30-2014 |
| 20140044984 | STUD WELDING REPAIR OF SUPERALLOY COMPONENTS - Superalloy components are joined or repaired by mating a recess formed in one component substrate with a corresponding projection formed in another component along a contact surface and welding them together with a stud welding apparatus. A mating superalloy repair stud is formed with a stud projection whose profile conforms to the substrate recess profile along a corresponding contact surface. Both the stud and substrate are coupled to a stud welding apparatus, with the stud projection and substrate recess oriented in an opposed spaced relationship with a gap there between. The stud welding apparatus passes current between the stud projection and recess and forms an arc there between, to melt their respective opposed surfaces. The melted stud projection and substrate recess opposed surfaces are pressed into contact with each other with the stud welding apparatus, forming a weld there between. | 02-13-2014 |
| 20140044985 | PROBE FABRICATION USING COMBINED LASER AND MICRO-FABRICATION TECHNOLOGIES - A method of making a probe (and the resulting probe) comprising providing a metal foil, creating a tip on an edge of the foil, and laser cutting a body of the probe from the foil with one or more tips at an end of the body. | 02-13-2014 |
| 20140087204 | TOOL MARKING STRUCTURE AND A FORMING METHOD THEREOF - A method for forming a tool marking structure contains: a first plating means used on a surface of a tool so as to form a first plating layer; a coloring means applied to print a marking area with a first color layer on the first plating layer and to have the first plating layer on a bottom end of the marking area; a carving means served to eliminate a part of the first color layer of the marking area so that the marking area has a marking portion and a contrast portion formed therein; a second plating means provided to form a second plating layer on the surface of the tool and the contrast portion of the marking area. | 03-27-2014 |
| 20140087205 | ELECTRODE PAD, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer. | 03-27-2014 |
| 20140120362 | Partial Plating Method, a Laser Plating Device, and a Plated Material - A partial plating method capable of applying fine hard gold plating, a laser plating device capable of applying partial plating to a minute region with high positional precision, and a plated member. The partial plating method comprising plating a region to be plated by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less. A laser plating device | 05-01-2014 |
| 20140134451 | IN-SITU COMPOSITE FORMATION OF DAMAGE TOLERANT COATINGS UTILIZING LASER - A coating steel component with a pattern of an iron based matrix with crystalline particles metallurgically bound to the surface of a steel substrate for use as disc cutters or other components with one or more abrading surfaces that can experience significant abrasive wear, high point loads, and large shear stresses during use. The coated component contains a pattern of features in the shape of freckles or stripes that are laser formed and fused to the steel substrate. The features can display an inner core that is harder than the steel substrate but generally softer than the matrix surrounding the core, providing toughness and wear resistance to the features. The features result from processing an amorphous alloy where the resulting matrix can be amorphous, partially devitrified or fully devitrified. | 05-15-2014 |
| 20140141274 | COPPER FOIL STRUCTURE HAVING BLACKENED ULTRA-THIN FOIL AND MANUFACTURING METHOD THEREOF - A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance. | 05-22-2014 |
| 20140186649 | COATED ARTICLE AND METHOD FOR MANUFACTURING THE SAME - A coated article includes a metal substrate, a number of recesses defined in the metal substrate, and a plurality of sealing portions filled in the recesses. The sealing portions include metal, silicon oxide, aluminum oxide, sodium oxide, potassium oxide, and inorganic oxide pigment. The metal includes aluminum. A method for manufacturing the coated article is also provided. | 07-03-2014 |
| 20140242408 | METHOD FOR MANUFACTURING A METAL-CERAMIC COMPOSITE STRUCTURE AND METAL-CERAMIC COMPOSITE STRUCTURE - The invention relates to a method for manufacturing a metal-ceramic composite structure intended to be exposed to high temperatures. The composite structure includes a base metal structure or component, which is on at least one side covered and permanently joined with one or more ceramic tiles. | 08-28-2014 |
| 20150024233 | QUALITY CONTROL OF ADDITIVE MANUFACTURED PARTS - Methods and apparatuses to fabricate additive manufactured parts with in-process monitoring are described. As parts are formed layer-by-layer, a 3D measurement of each layer or layer group may be acquired. The acquisition of dimensional data may be performed at least partially in parallel with the formation of layers. The dimensional data may be accumulated until the part is fully formed, resulting in a part that was completely inspected as it was built. The as-built measurement data may be compared to the input geometrical description of the desired part shape. Where the part fails to meet tolerance, it may be amended during the build process or rejected. | 01-22-2015 |
| 20150037603 | ARTICLES INCLUDING METAL STRUCTURES HAVING MAXIMIZED BOND ADHESION AND BOND RELIABILITY, AND METHODS OF FORMING THE SAME - Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface. | 02-05-2015 |
| 20150334832 | ELECTRODE STRUCTURE - The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer. | 11-19-2015 |
| 20150346392 | ANTI-FINGERPRINT FILM AND ELECTRICAL AND ELECTRONIC APPARATUS - This disclosure relates to an anti-fingerprint film with low interaction energy that includes nanoscale or microscale microprojections having a contact side with the film, the upper side facing therewith, and a side wall connecting the contact side and the upper side, and has a shape such that the internal angle formed by the side wall and the film is an obtuse angle, an anti-fingerprint film including predetermined linear micropatterns or a continuous phase micropattern, and an electrical and electronic apparatus including the anti-fingerprint film. | 12-03-2015 |
| 20150380244 | ANISOTROPIC DEPOSITION IN NANOSCALE WIRES - The present invention generally relates to nanoscale wires, including anisotropic deposition in nanoscale wires. In one set of embodiments, material may be deposited on certain portions of a nanoscale wire, e.g., anisotropically. For example, material may be deposited on a first facet of a crystalline nanoscale wire but not on a isotropic second facet. In some cases, additional materials may be deposited thereon, and/or the portions of the nanoscale wire may be removed, e.g., to produce vacant regions within the nanoscale wire, which may contain gas or other species. Other embodiments of the invention may be directed to articles made thereby, devices containing such nanoscale wires, kits involving such nanoscale wires, or the like. | 12-31-2015 |
| 20160073508 | METHOD FOR FORMING METAL PATTERN AND SUBSTRATE HAVING THE SAME - A method for forming a metal pattern on a substrate having at least one metal component is provided. By performing the surface passivation treatment on the at least metal component, the surface of the at least metal component becomes an anti-plating surface via an anti-plating coating. Hence, the metal pattern can be selectively formed in the following electroless plating processes. | 03-10-2016 |
| 20160122891 | STEEL SHEET FOR CONTAINERS, AND METHOD FOR PRODUCING STEEL SHEET FOR CONTAINERS - A steel sheet for containers includes a steel sheet, an underlying Ni layer formed by performing a Ni coating or a Fe—Ni alloy coating containing Ni in an amount of 5 mg/m | 05-05-2016 |
| 20160163425 | ORIENTED SUBSTRATE FOR USE IN FORMATION OF EPITAXIAL FILM, AND METHOD FOR PRODUCING SAME - The present invention provides a textured substrate for forming an epitaxial film, including a textured metal layer on at least one surface of the layer, the textured metal layer including a copper layer having a cube texture, the textured metal layer having, on a surface of the layer, palladium added in an amount of 10 to 300 ng/mm | 06-09-2016 |
| 20160168741 | CONTACT ELEMENT WITH GOLD COATING | 06-16-2016 |
| 20160183380 | SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 06-23-2016 |
| 20160251769 | THERMAL INTERFACE MATERIALS USING METAL NANOWIRE ARRAYS AND SACRIFICIAL TEMPLATES | 09-01-2016 |
