| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 427443100 | Chemical compound reducing agent utilized (i.e., electroless deposition) | 22 |
| 20080206474 | Stabilization and Performance of Autocatalytic Electroless Processes - Disclosed is a method of plating a substrate with a metal using an autocatalytic electroless plating bath wherein the bath is operated above its cloud point temperature such that at least two phases are present in the bath. An autocatalytic electroless plating bath for coating silver metal is also described. A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed. The deposits of silver obtained are uniform, non-porous and have electrical properties. The technique can be applied for different processes and bath formulations i.e. different metals, complexing agents and reducing agents. | 08-28-2008 |
| 20080233303 | Coatings for metal-metal seal surfaces - A method of producing a metal seal ring is provided. The method includes selecting a seal ring substrate material and applying a coating to the seal ring substrate material using an electroless plating process. | 09-25-2008 |
| 20090011136 | COMPOSITE ELECTROLESS PLATING - This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals. | 01-08-2009 |
| 20090176028 | MICROWAVE-ATTENUATING COMPOSITE MATERIALS, METHODS FOR PREPARING THE SAME, INTERMEDIATES FOR PREPARING THE SAME, DEVICES CONTAINING THE SAME, METHODS OF PREPARING SUCH A DEVICE, AND METHODS OF ATTENTUATING MICROWAVES - The present invention provides microwave attenuating, filled composite materials which contain a polymer or ceramic matrix and metallic tubules and processes for making the same and devices which contain such materials. | 07-09-2009 |
| 20100291312 | ELECTROLESS PLATING METHOD FOR ALLOY COATING FILM AND PLATING LIQUID - A substrate is immersed in a metal compound solution prepared by dissolving a plurality of metal compounds of metals differing from each other, to thereby form an alloy film having a desired alloy composition on the surface of the substrate. | 11-18-2010 |
| 20100310781 | MANUFACTURING METHOD THEREOF AND A SEMICONDUCTOR DEVICE - In a semiconductor device, a lead frame made of a copper alloy prevents exfoliation occurring near the surface of the lead frame. A copper oxide layer is formed on the base material made of a copper alloy by immersing the base material into a solution of a strong oxidizer. The copper oxide layer serves as an outermost layer and consists of a copper oxide other than a copper oxide in the form of needle crystals. | 12-09-2010 |
| 20110104380 | METHOD FOR PRODUCING MOLDED ARTICLE - The present invention provides a method for producing a molded article which enables dissolution of a desired amount of a subject material in a molten resin without any limitation by the solubility of a high-pressure carbon dioxide in the molten resin and which is therefore suitable for commercial production of molded articles. The present invention pertains to a method for producing a molded article by molding a molten resin, and this method is characterized by including steps of supplying a high-pressure carbon dioxide and a subject material dissolved therein, into the molten resin; kneading the molten resin into which the high-pressure carbon dioxide and the subject material have been supplied; and exhausting the high-pressure carbon dioxide from the kneaded molten resin. | 05-05-2011 |
| 20120009350 | Electroless autocatalytic tin plating solution and electroless autocatalytic tin plating method using the same - Disclosed are an electroless autocatalytic tin plating solution and an electroless autocatalytic tin plating method using the same. The electroless autocatalytic tin plating solution includes: tin salt formed as a tin ion and a ligand having two or more carboxyl groups are bound; and one or more reductants selected from the group consisting of borohydrides delivering electrons to the tin ion to form a tin layer on a target object to be plated. | 01-12-2012 |
| 20130171366 | PLATING CATALYST AND METHOD - A solution including a precious metal nanoparticle and a polymer polymerized from a monomer comprising at least a monomer having two or more carboxyl groups or carboxylic acid salt groups. The solution is useful for a catalyst for a process of electroless plating of a metal on non-conductive surface. | 07-04-2013 |
| 20130209698 | Process for Electroless Deposition of Metals Using Highly Alkaline Plating Bath - A plating process using an electroless plating bath formed from two separate prepared component solutions. The component solutions mixed within 120 hours prior to plating operations, to provide a highly alkaline plating bath solution. One component solution of the two-part plating bath, is provided with a metal salt or source of plating ions, and which is initially kept in a separate solution from the second other prepared component solution. The second component solution contains formaldehyde, and preferably paraformaldehyde, used to reduce the metal salts into the metal to be deposited on a substrate. Each component solution further includes sodium hydroxide in concentrations selected so that when the two solutions are preferably mixed the final plating bath solution has a pH greater than 11.5. | 08-15-2013 |
| 20130230657 | STABLE CATALYSTS FOR ELECTROLESS METALLIZATION - Catalysts include nanoparticles of catalytic metal and gallic acid or gallic acid derivatives or salts thereof. The catalysts are used in electroless metal plating. The catalysts are free of tin. | 09-05-2013 |
| 20140242287 | PLATING CATALYST AND METHOD - A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has π electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface. | 08-28-2014 |
| 20140242288 | REDUCING ELECTROLESS SILVER PLATING SOLUTION AND REDUCING ELECTROLESS SILVER PLATING METHOD - Provided are a reducing electroless silver plating solution and a reducing electroless silver plating method using the silver plating solution, the reducing electroless silver plating solution being capable of preventing decomposition of silver in the plating solution thereby to maintain stability of the solution and also being capable of preventing excessive roughening of an underlying metal or the like thereby to form a plating film having good film characteristics and a good appearance. The reducing electroless silver plating solution according to the present invention comprises a water-soluble silver salt and a reducing agent, wherein cyanide ions in a concentration of 0.006×10 | 08-28-2014 |
| 20140295093 | PLATING APPARATUS AND PLATING METHOD - A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction. | 10-02-2014 |
| 20150024139 | ELECTROLESS COPPER PLATING SOLUTION - Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster. | 01-22-2015 |
| 20150056379 | Method of manufacturing gold thin film by using electroless-plating method - Provided is a method of manufacturing a gold (Au) thin film on a dielectric surface by using an electroless-plating method, the method including: manufacturing a reaction mixture by adding an Au chloride compound and an alkaline compound to an alcohol-water mixed solution; and forming an Au thin film by putting a substrate in the reaction mixture and stirring the reaction mixture. Accordingly, compounds that are relatively low toxic may be used as raw materials, and an Au thin film having a surface enhancement Raman scattering (SERS) effect may be conveniently and stably formed on a dielectric surface without having to use expensive additional equipment, such as a vacuum device. | 02-26-2015 |
| 20150093514 | Polishing And Electroless Nickel Compositions, Kits, And Methods - Disclosed are various methods, kits, and compositions in the field of electroless nickel plating and chemical polishing. An electroless nickel plating composition may include a surfactant-brightener; a coupler; a bismuth metallic stabilizer; and organosulfur stabilizer and a bismuth complexer. Prior to plating, a substrate may be polished with a polishing composition that includes a surface blocker and a surface leveler. When practiced in accordance with the preferred teachings described herein, the electroless nickel plating composition is capable of providing a mirror-bright, lustrous finish, and has good leveling properties. The composition may be made without lead or cadmium. | 04-02-2015 |
| 20150118406 | CATALYST SOLUTION FOR ELECTROLESS PLATING - The present invention relates to a stable palladium ion catalyst aqueous solution for electroless metal plating that does not use boric acid and can be used stably over a wide pH range. The catalyst solution for electroless plating of the present invention contains palladium ion, palladium ion complexing agent, and a specific amine compound and is alkaline. | 04-30-2015 |
| 20150307994 | ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS - A solution for electroless deposition of nickel is provided. A reducing agent of Ti | 10-29-2015 |
| 20150345027 | Aqueous Electroless Nickel Plating Bath and Method of Using the Same - An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners. | 12-03-2015 |
| 20160115597 | Plating Bath Solutions - The present invention is directed to compositions for electroless plating baths and their use, and more particularly to different solutions each usable to both make up an original bath and to replenishment of the original bath. | 04-28-2016 |
| 20160145745 | FORMALDEHYDE-FREE ELECTROLESS METAL PLATING COMPOSITIONS AND METHODS - Formaldehyde-free electroless metal plating solutions include glyoxylic acid or salts thereof in combination with tertiary amines which stabilize the glyoxylic acid and salts. The electroless metal plating solutions are environmentally friendly, stable and deposit bright metal deposits on substrates. | 05-26-2016 |
