| Entries |
| Document | Title | Date |
|---|
| 20080220153 | HIGH-DIELECTRIC CONSTANT THIN FILM METAL OXIDES ON SILICON WAFERS FOR CAPACITOR APPLICATIONS AND METHODS OF MANUFACTURE - A method of fabrication of high-k paraelectric metal oxide films at low temperatures utilizing ordered mesoporous metal oxide thin films synthesized by organic templating methodology. The process consisting of (a) chemical solution deposition of periodic ordered mesoporous structures containing high-k metal oxide films, (b) removal of organic template additives, (c) infiltration of the pores with an appropriate second phase, and (d) low temperature thermal and/or annealing of infiltrated films. | 09-11-2008 |
| 20080226815 | NOVEL THIN LAMINATE AS EMBEDDED CAPACITANCE MATERIAL IN PRINTED CIRCUIT BOARDS - The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure comprises a pair of parallel electrically conductive layers separated by a pair of dielectric layers and a central polymerizable layer. Each of the dielectric layers and the central layer may include a filler. Capacitors formed from the multilayered structures of the invention exhibit excellent short circuit resistance as well as excellent void resistance. | 09-18-2008 |
| 20080233274 | Manufacturing method of tantalum condenser - There is provided a method of manufacturing a tantalum condenser, in which a high-performing tantalum condenser is manufactured through a more simplified and higher-efficient process using simpler and economical equipment. The method of manufacturing a tantalum condenser including: sintering a tantalum powder to prepare a tantalum pellet; oxidizing the tantalum pellet to form a dielectric layer on a surface thereof; and depositing a polymer on the tantalum pellet by immersing the tantalum pellet having the dielectric layer formed on the surface thereof in a polymer suspension. | 09-25-2008 |
| 20080233275 | Manufacturing method of tantalum condenser - There is provided a method of manufacturing a tantalum condenser, in which a high-performing tantalum condenser is manufactured through a more simplified and higher-efficient process using simpler and economical equipment. The method of manufacturing a tantalum condenser including: preparing a tantalum pellet by sintering a tantalum powder; oxidizing the tantalum pellet to form a dielectric layer on a surface thereof; forming a polymer layer on the tantalum pellet having the dielectric layer formed on the surface thereof; and immersing the tantalum pellet having the polymer layer formed on the surface thereof in a polymer suspension to be subjected to chemical reformation. | 09-25-2008 |
| 20080260939 | Sintered bodies based on niobium suboxide - Disclosed are sintered bodies that include: (a) 30 to 100 mol % of NbO | 10-23-2008 |
| 20080292783 | METHOD OF MANUFACTURING A THIN LAYER AND METHODS OF MANUFACTURING GATE STRUCTURES AND CAPACITORS USING THE SAME - In a method of manufacturing a thin layer, an organic metal precursor is provided onto a substrate. The organic metal precursor has a vapor pressure of about 0.5 Torr to about 6 Torr at a temperature of about 65° C. to about 95° C. and is represented by following Chemical Formula 1. An oxidant including an oxygen atom is provided onto the substrate to oxidize the organic metal precursor. The organic metal precursor reacts with the oxidant to form a thin layer including a metal oxide on the substrate. The thin layer may be used for a gate insulation layer of a gate structure, a dielectric layer of a capacitor, etc. | 11-27-2008 |
| 20090004367 | CERAMIC GLAZE COATING STRUCTURE OF A CHIP ELEMENT AND METHOD OF FORMING THE SAME - A ceramic glaze-coating structure of a chip element and a method of forming the same are provided. In the ceramic glaze-coating structure, a high-density, smooth, and high-impedance ceramic glaze is coated on the body of an element. As for the terminal electrode part, the unique firing characteristics between the material of the terminal electrode (e.g., conductive compositions) and the ceramic glaze are utilized, such that the ceramic glaze layer between the surface of the terminal electrode or the terminal electrode and the ceramic body is absorbed and then removed by sintering; thus, the ceramic glaze coating structure of a chip element with only the element body being coated is formed. | 01-01-2009 |
| 20090110810 | LOW TEMPERATURE CURING INK FOR PRINTING OXIDE COATING AND PROCESS THE SAME - A composition suitable for application as an ink, and a method of producing a composition for forming a porous oxide-based coating on a substrate including: 1) fabricating reactive nano particles; 2) fabricating active submicron powder with a reactive surface; and 3) mixing reactive powders with organic vehicle to form an ink. A viscosity of the ink can be adjusted by adding high boiling point solvents. An ink can be printed via a variety of printing processes to form a coating. Upon thermal cure an oxide-based compound coating is formed with adhesion to a substrate. | 04-30-2009 |
| 20090176011 | Capacitor Forming Methods - A capacitor forming method includes forming an electrically conductive support material over a substrate, forming an opening through at least the support material to the substrate, and, after forming the opening, forming a capacitor structure contacting the substrate and the support material in the opening. The support material contains at least 25 at % carbon. Another capacitor forming method includes forming a support material over a substrate, forming an opening through at least the support material to the substrate, and, after forming the opening, forming a capacitor structure contacting the substrate and the support material in the opening. The support material contains at least 20 at % carbon. The support material has a thickness and the opening has an aspect ratio 20:1 or greater within the thickness of the support material. | 07-09-2009 |
| 20090238954 | LARGE AREA THIN FILM CAPACITORS ON METAL FOILS AND METHODS OF MANUFACTURING SAME - Disclosed are a method of making a dielectric on a metal foil, and a method of making a large area capacitor that includes a dielectric on a metal foil. A dielectric precursor layer and the base metal foil are prefired at a prefiring temperature in the range of 350 to 650° C. in a moist atmosphere that also comprises a reducing gas. The prefired dielectric precursor layer and base metal foil are subsequently fired at a firing temperature in the range of 700 to 1200° C. in an atmosphere having an oxygen partial pressure of less than about 10 | 09-24-2009 |
| 20090238955 | PROCESSES FOR THE MANUFACTURE OF BARIUM TITANATE CAPACITORS ON NICKEL FOILS - Provided are processes for the manufacture of capacitors. It is found that by using a nickel foil as the substrate and one electrode of the capacitor and by controlling the oxygen partial pressure in the range of 10 | 09-24-2009 |
| 20090297696 | METHODS FOR FORMING CONDUCTIVE TITANIUM OXIDE THIN FILMS - The present disclosure relates to the deposition of conductive titanium oxide films by atomic layer deposition processes. Amorphous doped titanium oxide films are deposited by ALD processes comprising titanium oxide deposition cycles and dopant oxide deposition cycles and are subsequently annealed to produce a conductive crystalline anatase film. Doped titanium oxide films may also be deposited by first depositing a doped titanium nitride thin film by ALD processes comprising titanium nitride deposition cycles and dopant nitride deposition cycles and subsequently oxidizing the nitride film to form a doped titanium oxide film. The doped titanium oxide films may be used, for example, in capacitor structures. | 12-03-2009 |
| 20100119699 | Particle based electrodes and methods of making same - A coated electrode is provided for use in energy storage devices. The coated electrode comprises a dry fibrillized polymer that is fibrillized with no processing additives. | 05-13-2010 |
| 20100178418 | DEVICE FABRICATION METHOD FOR HIGH POWER DENSITY CAPACITORS - A method for manufacturing a bundle of fibers for use as a capacitor is disclosed. First and second fibers all having an electrically conductive fiber core and an electrically insulating cladding are provided and arranged in a bundle. The first end of the first fibers are arranged to protrude from a first end of the bundle, and the second ends of the second fibers are arranged to protrude from a second end of the bundle creating a plurality of first and second spaces defined by the protruding first and second ends of the first and second fibers and the non-protruding first and second ends of the second and first fibers respectively. The first and second spaces are filled with an electrically insulating material. First and second electrodes are provided that contact the fiber cores of the first and second fibers respectively so that an electric capacitance is established between the fiber cores of the first fibers and the fiber cores of the second fibers. | 07-15-2010 |
| 20100183802 | METHODS FOR PRODUCING SOLID PARTICULATE DISPERSION LIQUID, ELECTRODE, AND ELECTRIC DOUBLE LAYER CAPACITOR - Disclosed is a method for producing a dispersion liquid of solid particulates, the method comprising subjecting a mixture liquid comprising charged particles, solid particles greater in average particle diameter than the charged particles, and a liquid medium to pulverization. Moreover, a method for producing an electrode and a method for producing an electric double layer capacitor using the aforementioned method. | 07-22-2010 |
| 20100196592 | METHODS OF FABRICATING CAPACITORS INCLUDING LOW-TEMPERATURE CAPPING LAYERS - In a method of fabricating a capacitor, a lower electrode is formed, and a dielectric layer is formed on the lower electrode. An upper electrode is foamed on the dielectric layer opposite the lower electrode. A low-temperature capping layer is formed on the upper electrode at a temperature of less than about 300° C. Related devices and fabrication methods are also discussed. | 08-05-2010 |
| 20100209595 | Methods of Forming Strontium Ruthenate Thin Films and Methods of Manufacturing Capacitors Including the Same - In a method of forming a strontium ruthenate thin film using water vapor as an oxidizing agent, a strontium source and a ruthenium source are used. The strontium source includes a cyclopentadienyl (Cp) ligand, an alkoxide ligand, an alkyl ligand, an amide ligand or a halide ligand, and the ruthenium source includes a beta diketonate ligand. | 08-19-2010 |
| 20100209596 | SCALABLE LEAD ZIRCONIUM TITANATE (PZT) THIN FILM MATERIAL AND DEPOSITION METHOD, AND FERROELECTRIC MEMORY DEVICE STRUCTURES COMPRISING SUCH THIN FILM MATERIAL - A novel lead zirconium titanate (PZT) material having unique properties and application for PZT thin film capacitors and ferroelectric capacitor structures, e.g., FeRAMs, employing such thin film material. The PZT material is scalable, being dimensionally scalable, pulse length scalable and/or E-field scalable in character, and is useful for ferroelectric capacitors over a wide range of thicknesses, e.g., from about 20 nanometers to about 150 nanometers, and a range of lateral dimensions extending to as low as 0.15 μm. Corresponding capacitor areas (i.e., lateral scaling) in a preferred embodiment are in the range of from about 10 | 08-19-2010 |
| 20100233359 | METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER - As for electrode pads for a semiconductor integrated circuit element, some of electrode pads for signal transmission are coupled to Ti films. Others of the electrode pads for signal transmission are coupled to electrode pads through wiring routed in multilayer wiring. Electrode pads for power supply are coupled to electrode pads to which power lines at potentials different from each other are coupled through wiring. The electrode pads are also coupled to Al foils (anodes). Electrode pads for grounding are coupled to electrode pads to which ground lines are coupled through wiring. The electrode pads are also coupled to conductive polymer films (cathodes). | 09-16-2010 |
| 20100266751 | PROCESS FOR PRODUCING ZIRCONIUM OXIDE THIN FILMS - This invention concerns a process for producing oxide thin film on a substrate by an ALD type process. According to the process, alternating vapour-phase pulses of at least one metal source material, and at least one oxygen source material are fed into a reaction space and contacted with the substrate. According to the invention, an yttrium source material and a zirconium source material are alternately used as the metal source material so as to form an yttrium-stabilised zirconium oxide (YSZ) thin film on a substrate. | 10-21-2010 |
| 20100316793 | Methods Of Forming Capacitors Having Dielectric Regions That Include Multiple Metal Oxide-Comprising Materials - Capacitors and methods of forming capacitors are disclosed, and which include an inner conductive metal capacitor electrode and an outer conductive metal capacitor electrode. A capacitor dielectric region is received between the inner and the outer conductive metal capacitor electrodes and has a thickness no greater than 150 Angstroms. Various combinations of materials of thicknesses and relationships relative one another are disclosed which enables and results in the dielectric region having a dielectric constant k of at least 35 yet leakage current no greater than 1×10 | 12-16-2010 |
| 20110097478 | SCALABLE LEAD ZIRCONIUM TITANATE (PZT) THIN FILM MATERIAL AND DEPOSITION METHOD, AND FERROELECTRIC MEMORY DEVICE STRUCTURES COMPRISING SUCH THIN FILM MATERIAL - A novel lead zirconium titanate (PZT) material having unique properties and application for PZT thin film capacitors and ferroelectric capacitor structures, e.g., FeRAMs, employing such thin film material. The PZT material is scalable, being dimensionally scalable, pulse length scalable and/or E-field scalable in character, and is useful for ferroelectric capacitors over a wide range of thicknesses, e.g., from about 20 nanometers to about 150 nanometers, and a range of lateral dimensions extending to as low as 0.15 μm. Corresponding capacitor areas (i.e., lateral scaling) in a preferred embodiment are in the range of from about 10 | 04-28-2011 |
| 20110165321 | Continuous process for producing spacer-modified nano Graphene electrodes for supercapacitors - A specific embodiment of the present invention is a process for continuously producing a porous solid film of spacer-modified nano graphene platelets for supercapacitor electrode applications. This process comprises: (a) dissolving a precursor material in a solvent to form a precursor solution and dispersing multiple nano graphene platelets into the solution to form a suspension; (b) continuously delivering and forming the suspension into a layer of solid film composed of precursor material-coated graphene platelets overlapping one another, and removing the solvent from the solid film (e.g., analogous to a paper-making, mat-making, or web-making procedure); (c) continuously converting the precursor material into nodules bonded to surfaces of graphene platelets to form a porous solid film composed of spacer-modified graphene platelets; and (d) continuously collecting the porous solid film on a collector (e.g., a winding roller). The roll of porous solid film (mat, paper, or web) can then be cut into pieces for used as supercapacitor electrodes. | 07-07-2011 |
| 20110177235 | COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF - Disclosed is a composition for ferroelectric thin film formation which is used in the formation of a ferroelectric thin film of one material selected from the group consisting of PLZT, PZT, and PT. The composition for ferroelectric thin film formation is a liquid composition for the formation of a thin film of a mixed composite metal oxide formed of a mixture of a composite metal oxide (A) represented by general formula (1): (Pb | 07-21-2011 |
| 20110223320 | Methods Of Forming Material Over A Substrate And Methods Of Forming Capacitors - A method of forming a material over a substrate includes performing at least one iteration of the following temporally separated ALD-type sequence. First, an outermost surface of a substrate is contacted with a first precursor to chemisorb a first species onto the outermost surface from the first precursor. Second, the outermost surface is contacted with a second precursor to chemisorb a second species different from the first species onto the outermost surface from the second precursor. The first and second precursors include ligands and different central atoms. At least one of the first and second precursors includes at least two different composition ligands. The two different composition ligands are polyatomic or a lone halogen. Third, the chemisorbed first species and the chemisorbed second species are contacted with a reactant which reacts with the first species and with the second species to form a reaction product new outermost surface of the substrate. | 09-15-2011 |
| 20110236564 | PREPARATION METHOD OF METAL OXIDE DOPED MONOLITH CARBON AEROGEL FOR CAPACITANCE CAPACITOR - Provided is a preparation method of a metal oxide doped monolith carbon aerogel for a high capacitance capacitor, the including: preparing a monolith carbon aerogel by performing a thermal decomposition of a moist gel dried in condition of a atmospheric pressure and a room temperature in a nitrogen atmosphere; impregnating the monolith carbon aerogel into alcohol where a metal precursor is dissolved; and calcinating the monolith carbon aerogel where the metal precursor is impregnated in an atmospheric atmosphere. By impregnating the metal oxide into the monolith carbon aerogel, a limit of capacitance may be enhanced using a pseudo capacitance effect by an interfacial oxidation reduction reaction. | 09-29-2011 |
| 20110256307 | METHOD FOR MANUFACTURING CAPACITIVE TOUCH SCREEN - Disclosed herein is a method for manufacturing a capacitive touch screen. The method for manufacturing the capacitive touch screen includes forming a plurality of first electrode patterns made of conductive polymer on the upper surface of a first substrate by an inkjet method, thereby making it possible to finely and precisely form the electrode patterns having a complex shape. | 10-20-2011 |
| 20120100283 | Methods of Forming Capacitors - Some embodiments include methods of forming capacitors. A metal oxide mixture may be formed over a first capacitor electrode. The metal oxide mixture may have a continuous concentration gradient of a second component relative to a first component. The continuous concentration gradient may correspond to a decreasing concentration of the second component as a distance from the first capacitor electrode increases. The first component may be selected from the group consisting of zirconium oxide, hafnium oxide and mixtures thereof; and the second component may be selected from the group consisting of niobium oxide, titanium oxide, strontium oxide and mixtures thereof. A second capacitor electrode may be formed over the first capacitor electrode. Some embodiments include capacitors that contain at least one metal oxide mixture having a continuous concentration gradient of the above-described second component relative to the above-described first component. | 04-26-2012 |
| 20120121798 | CONDUCTOR PASTE FOR RAPID FIRING - The present invention provides a conductor paste for rapid firing that is applied to a ceramic green sheet and is fired along with the green sheet under high-rate temperature rise conditions at a high heating rate of at least 600° C./hr from room temperature to the maximum firing temperature. The paste includes as a conductor-forming powder material: a conductive metallic powder comprising, as a main component, nickel powder; and barium titanate ceramic powder with a mean particle diameter of 10 nm to 80 nm as an additive. The ceramic powder content is 5 to 25 mass parts per 100 mass parts of the conductive metallic powder. | 05-17-2012 |
| 20120219702 | NANOMATERIAL-BASED FILMS PATTERNED USING A SOLUBLE COATING - A film can be patterned with a nanomaterial. Such patterning can, in various embodiments, be performed by applying a uniform mixture of a solute in a solvent to a surface of the film to form a coating of a soluble material on the surface of the film in a pre-defined pattern that defines coated parts of the film and uncoated parts of the film, depositing an aqueous dispersion, including the nanomaterial and a surfactant, on the defined coated and uncoated parts of the film, washing the film to remove the coating of the soluble material and the nanomaterial from the defined coated parts of the film, but not removing the nanomaterial from the defined uncoated parts of the film, along with removing the surfactant from the defined coated and uncoated parts of the film, and leaving a pattern of the nanomaterial on the defined uncoated parts of the film. | 08-30-2012 |
| 20120301605 | GRAVURE PRINTING ENGRAVING ROLL AND MANUFACTURING METHOD THEROF - There are provided a gravure printing engraving roll and a manufacturing method thereof. The gravure printing engraving roll includes: a base layer provided with gravure printing patterns; and a reinforcement coating layer applied to the base layer in order to reinforce strength of the base layer, the reinforcement coating layer including a first reinforcement layer formed on the base layer by a wet plating method, a second reinforcement layer forming an outer surface of the reinforcement coating layer, a first adhesive layer disposed between the first and second reinforcement layers and providing adhesive strength to a surface of the first reinforcement layer, and a second adhesive layer providing adhesive strength between the first adhesive layer and the second reinforcement layer. | 11-29-2012 |
| 20130045328 | Electrodes Synthesized from Carbon Nanostructures Coated with a Smooth and Conformal Metal Adlayer - High-surface-area carbon nanostructures coated with a smooth and conformal submonolayer-to-multilayer thin metal films and their method of manufacture are described. The preferred manufacturing process involves the initial oxidation of the carbon nanostructures followed by a surface preparation process involving immersion in a solution with the desired pH to create negative surface dipoles. The nanostructures are subsequently immersed in an alkaline solution containing a suitable quantity of non-noble metal ions which adsorb at surface reaction sites. The metal ions are then reduced via chemical or electrical means. The nanostructures are exposed to a solution containing a salt of one or more noble metals which replace adsorbed non-noble surface metal atoms by galvanic displacement. The process can be controlled and repeated to obtain a desired film coverage. The resulting coated nanostructures may be used, for example, as high-performance electrodes in supercapacitors, batteries, or other electric storage devices. | 02-21-2013 |
| 20130115367 | METHOD FOR FORMING RUTHENIUM OXIDE FILM - A method for forming a ruthenium oxide film includes: providing a substrate in a processing chamber; supplying a ruthenium compound having a structure of the following formula (1) in which two β-diketons and two groups selected among olefin, amine, nitril, and carbonyl are coordinate-bonded to Ru in a vapor state onto the substrate; supplying oxygen gas onto the substrate; and forming a ruthenium oxide film on the substrate by reaction between the ruthenium compound gas and the oxygen gas. | 05-09-2013 |
| 20130236635 | ROLL-TO-ROLL COMPATIBLE PRESSURE SENSITIVE EVENT SENSING LABEL - The present invention discloses a smart label to be affixed on or integrated in an object and able to provide an electrical signal indicative of the applied pressure or force and/or the position of the applied pressure or force at a touch point on the object to which the label is affixed. The smart label comprises a layer structure and a detector system, the layer structure comprising of at least a stack of a first, a second and a third layer. The first and third layers comprise a flexible, electrically conductive or semiconductive material and at least two electrodes for connecting the layers to the detector system. The second layer comprises a flexible, deformable and compressible material. The second layer is electrically nonconductive or electrically conductive but less conductive than the first and third layers, wherein the second layer separates the first and third layers. | 09-12-2013 |
| 20130337153 | Microcontact Printed Thin Film Capacitors - The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 μμm or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used. | 12-19-2013 |
| 20130344232 | METHODS OF FORMING CONDUCTIVE FEATURES ON THREE-DIMENSIONAL OBJECTS - A method of forming a conductive feature on a three-dimensional object may include depositing a composition comprising nanoparticles onto a portion of the three-dimensional object, and annealing the composition to form the conductive feature. In another embodiment, a method of forming a conductive feature on a three-dimensional object may include printing a composition comprising nanoparticles to produce a contiguous line over a non-planar portion of the three-dimensional object, and heating the composition to form a conductive feature that has conductivity throughout. | 12-26-2013 |
| 20140037835 | MULTI-LEVEL THIN FILM CAPACITOR ON A CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material. A buffer layer may be included between the ceramic substrate and the thin film MLC. The buffer layer may have a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um). | 02-06-2014 |
| 20140147579 | ANALYSIS OF STIMULUS BY RFID - The present invention is directed to a process for manufacturing a capacitor for an RFID device. The process utilizes stencils to spray-coat capacitor electrodes about a substrate, and in other embodiments, the process spray coats a first capacitor on a substrate, then an insulator on the first capacitor, and then a second capacitor on the insulator. | 05-29-2014 |
| 20140212576 | DIELECTRIC THIN FILM-FORMING COMPOSITION AND METHOD OF FORMING DIELECTRIC THIN FILM USING THE SAME - In a thin film capacitor or the like, a dielectric thin film-forming composition capable of improving leakage current characteristics; and a method of forming a dielectric thin film using this composition are provided. Regarding a dielectric thin film-forming composition for forming a dielectric thin film, the dielectric thin film is formed of a barium strontium titanate (BST)-based complex perovskite film, and the composition is doped with aluminum (Al). In addition, a doping amount of the aluminum (Al) is in a range of 0.1 at % to 15 at % with respect to 100 at % of perovskite A site atoms contained in the composition. | 07-31-2014 |
| 20140220236 | PROCESS FOR THE MANUFACTURE OF A CAPACITOR FILM - Process for producing of a capacitor film comprising the steps of (a) polymerizing propylene in the presence of a catalyst comprising a solid catalyst system obtaining a polypropylene, (b) subjecting said polypropylene to a film forming process obtaining a capacitor film, wherein during the polymerization step (a) said catalyst comprising the solid catalyst system fragments into nanosized catalyst fragments being distributed in said polypropylene, said solid catalyst system comprises a transition metal, a metal which is selected from one of the groups 1 to 3 of the periodic table (IUPAC), and an internal electron donor. | 08-07-2014 |
| 20140242263 | ALUMINUM PRECURSOR, METHOD OF FORMING A THIN FILM AND METHOD OF FORMING A CAPACITOR USING THE SAME - An aluminum compound is represented by following Formula 1. In Formula 1, X is a functional group represented by following Formula 2 or Formula 3. | 08-28-2014 |
| 20140287136 | LaNiO3 THIN FILM-FORMING COMPOSITION AND METHOD OF FORMING LaNiO3 THIN FILM USING THE SAME | 09-25-2014 |
| 20140295063 | METHOD OF MANUFACTURING A CAPACATIVE TOUCH SENSOR CIRCUIT USING A ROLL-TO-ROLL PROCESS TO PRINT A CONDUCTIVE MICROSCOPIC PATTERNS ON A FLEXIBLE DIELECTRIC SUBSTRATE - Mutual capacitance touch sensor circuits are used in manufacturing displays, including touch screen displays, such as LED, LCD, plasma, 3D, and other displays used in computing as well as stationary and portable electronic devices. A flexographic printing process may be used, for example, in a roll to roll handling system to print geometric patterns on a substrate, for example, a flexible dielectric substrate. These patterns may then be coated with a conductive material by, for example, an electroless plating process. | 10-02-2014 |
| 20140308435 | HYBRID SINGLE-SIDE TOUCH SCREEN METHOD - A method of making a single-side touch-screen device includes providing a substrate and forming a patterned arrangement of micro-wires on the substrate. A patterned dielectric insulator is formed over one or more middle portions of at least some of the micro-wires forming insulated micro-wire portions and exposed micro-wire portions. A plurality of patterned transparent conductors is conformally coated in an array over at least a part of the patterned dielectric insulator, at least a part of the insulated micro-wire portions, and at least a part of the exposed micro-wire portions. The at least a part of the exposed micro-wire portions are electrically connected to at least a portion of the patterned transparent conductors and form an array of electrically connected horizontal electrodes and an array of electrically connected vertical electrodes electrically isolated from the horizontal electrodes. | 10-16-2014 |
| 20140342082 | Forming Structures Using Aerosol Jet .RTM. Deposition - Method and apparatus for direct writing of passive structures having a tolerance of 5% or less in one or more physical, electrical, chemical, or optical properties. The present apparatus is capable of extended deposition times. The apparatus may be configured for unassisted operation and uses sensors and feedback loops to detect physical characteristics of the system to identify and maintain optimum process parameters. | 11-20-2014 |
| 20140349008 | METHOD FOR PRODUCING RECONSTITUTED WAFERS WITH SUPPORT OF THE CHIPS DURING THEIR ENCAPSULATION - A method for collectively fabricating a reconstituted wafer comprising chips exhibiting connection pads on a front face of the chip, comprises: positioning the chips on an initial adhesive support, front face on the support, vapor deposition at atmospheric pressure and ambient temperature, of an electrically insulating layer on the initial support and the chips, having a mechanical role of holding the chips, transfer of the chips covered with the mineral layer onto a provisional adhesive support, rear face of the chips toward this provisional adhesive support, removal of the initial adhesive support, overlaying the chips onto a support of “chuck” type, front faces of the chips toward this support, removal of the provisional adhesive support, deposition of a resin on the support of “chuck” type to encapsulate the chips, and then polymerization of the resin, removal of the support of “chuck” type, production of an RDL layer active face side. | 11-27-2014 |
| 20150093497 | MULTI-LEVEL THIN FILM CAPACITOR ON A CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material. A buffer layer may be included between the ceramic substrate and the thin film MLC. The buffer layer may have a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um). | 04-02-2015 |
| 20150125593 | METHOD OF PATTERNING ELASTOMERIC POLYMER MATERIAL - A method of patterning an elastomeric polymer material includes: (a) dissolving a precursor of the elastomeric polymer material in a solvent to give an elastomeric polymer precursor solution; and (b) forming a pattern from the elastomeric polymer precursor solution on a base by using a printer, wherein a temperature of the base is maintained to be about 10° C.-30° C. higher than a boiling point of the solvent. | 05-07-2015 |
| 20150332853 | METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT - A method for manufacturing a ceramic electronic component by forming a dielectric layer by ejecting a dielectric layer ink having a pigment volume concentration of 60% or more and 95% or less with an ink-jet system, forming a conductor layer by ejecting a metal pigment ink having a pigment volume concentration of 70% or more and 95% or less with the ink-jet system, forming a body having a conductor circuit by combining the formed dielectric layer and the formed conductor layer appropriately, removing organic components of the resulting formed body by degreasing, and sintering the dielectric layer and the conductor layer by firing. | 11-19-2015 |
| 20160133398 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal. | 05-12-2016 |
| 20160189864 | PLATED TERMINATIONS - Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations. | 06-30-2016 |
