| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 420557000 | TIN BASE | 29 |
| 20090208363 | SOLDER ALLOY FOR OXIDE BONDING - A lead-free metal solder material capable of realizing excellent bonding strength and hermetic sealing is provided. The solder alloy is a solder alloy for bonding to an oxide, and includes 2.0-15.0 mass % of Ag, more than 0.1-6.0 mass % of Al, and the remainder is composed of Sn and some inevitable impurities. The content of Al is preferably 0.3-3.0 mass %, and more preferably 0.5-3.0 mass %. The content of Ag is preferably 3.0-13.0 mass %, more preferably more than 5.0-12.0 mass %, and most preferably 6.0-10.0 mass %. A relation between Ag and Al that fits the inequality 0<[(% Ag)−(% Al)×7.8]<10 is desirable. The solder alloy for bonding to an oxide of the present invention is used for bonding between glasses, for instance, and has excellent effects. | 08-20-2009 |
| 20110064604 | PARTICULATE TIN POWER AND MANUFACTURING METHOD THEREOF - The present invention relates to particulate tin powder and a manufacturing method thereof. More particularly, the present invention relates to a method of manufacturing particulate tin powder including i) preparing tin salt solution, ii) adding chelating agents to the tin salt solution, iii) adjusting pH of the tin salt solution to which the chelating agents are added, and iv) reductively depositing tin powder by adding reductant to the tin salt solution. | 03-17-2011 |
| 20110091351 | BONDING COMPOSITION - A bonding composition ( | 04-21-2011 |
| 420558000 | Lead containing | 4 |
| 20130028786 | Low alpha-Dose Tin or Tin Alloy, and Method for Producing Same - Disclosed is tin characterized in that a sample of the tin after melting and casting has an α dose of less than 0.0005 cph/cm | 01-31-2013 |
| 20140186208 | AUDIO SOLDER ALLOY - To provide audio solder alloy which is senary solder alloy (Sn.Ag.Cu.In.Ni.Pb) and has their appropriate contained amounts to obtain excellent sound quality and high auditory assessment, as the joining solder for connecting various kinds of electronics parts used for electronic circuit such as a filter circuit NW for audio system. A preferably example of the contained amounts is as follows: Ag of 1.0 through 1.01% by mass, Cu of 0.71 through 0.72% by mass, In of 0.003 through 0.0037% by mass, Ni of 0.016 through 0.017% by mass, Pb of 0.0025 through 0.0035% by mass and the remainder of Sn. | 07-03-2014 |
| 20160097139 | Method For Manufacturing High Purity Tin, Electrowinning Apparatus For High Purity Tin And High Purity Tin - Provided is a method for manufacturing high purity tin including: depositing electrodeposited tin on the surface of a cathode | 04-07-2016 |
| 420559000 | Antimony, or bismuth containing | 1 |
| 20090098012 | High-Purity Tin or Tin Alloy and Process for Producing High-Purity Tin - Provided is high purity tin or tin alloy wherein the respective contents of U and Th are 5 ppb or less, the respective contents of Pb and Bi are 1 ppm or less, and the purity is 5N or higher (provided that this excludes the gas components of O, C, N, H, S and P). This high purity tin or tin alloy is characterized in that the α ray count of high purity tin having a cast structure is 0.001 cph/cm | 04-16-2009 |
| 420560000 | Copper containing | 20 |
| 20090129970 | PB FREE SOLDER ALLOY - The present invention relates to a solder alloy used for mounting or plating electronic components on a printed circuit board (PCB) and the like, and, more particularly, to a Pb-free Sn—Ag based solder alloy which comprises 0.1˜3.0 wt % of Cu, 0.01˜0.5 wt % of Ni, 0.01˜5.0 wt % of Ag, and the balance of Sn. The Pb-free Sn—Ag based solder alloy of the invention has a lower melting point, and highly enhanced wettability and joining strength, compared with the conventional Pb-free solder alloy, thereby preventing generation of bridges. | 05-21-2009 |
| 20100092335 | PB-FREE SOLDER ALLOY - The present invention is provided to prevent the generation of whiskers via a lead (Pb)-free solder alloy. To achieve this objective, the present invention provides a Pb-free solder alloy including tin (Sn) as a first element and either boron (B) or beryllium (Be) as a second element. | 04-15-2010 |
| 20100189594 | SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT USING SAME - Disclosed is a Pb-free solder alloy consisting of, in mass %, 0.1-1.5% of Ag, 0.5-0.75% of Cu, Ni in an amount satisfying 12.5≦Cu/Ni≦100, and the balance of Sn and unavoidable impurities. The solder alloy preferably contains, in mass %, 0.3-1.2% of Ag and 0.01-0.04% of Ni. Also disclosed is a solder ball obtained by spheroidizing the solder alloy. In addition, the solder alloy is suitable for a solder joint onto an Ni electrode. The solder alloy has excellent drop impact resistance, while being suppressed in decrease of joining strength under high temperature conditions for a long time. | 07-29-2010 |
| 20100272598 | LEAD FREE SOLDER ALLOY AND MANUFACTURING METHOD THEREOF - Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same. | 10-28-2010 |
| 20100296965 | ALLOY SOLDER AND ALLOY SOLDER MANUFACTURING METHOD - The present invention solves the problem of the bonding strength of a Pb-free alloy solder being inferior to that of the conventional Pb-containing alloy solder and provides a Pb-free alloy solder satisfactory in bonding reliability. | 11-25-2010 |
| 20110110813 | Tin-indium based lead-free solders with zinc addition - A new kind of Sn—In based Pb-free solders with Zn addition is disclosed, which includes: 15˜25 wt % In; 0.05˜1.5 wt % Zn; and balance Sn. When the solder of the present invention is used in the assembly of electrical products, the dissolution rates of the substrates and the growth of the intermetallic compounds formed at the interfaces can be reduced; and thereby the properties of joints can be improved. | 05-12-2011 |
| 20140030140 | SOLDER ALLOY - A solder alloy may include a Sn—Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, Al | 01-30-2014 |
| 20140044589 | LEAD-FREE SOLDER COMPOSITION FOR GLASS - The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component. | 02-13-2014 |
| 420561000 | Antimony, or bismuth containing | 12 |
| 20080292492 | Solder Alloy - An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt. % bismuth, from 0.15-1.5 wt. % copper, from 0.1-1.5 wt. % silver, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminium, from 0-0.3 wt. % zinc, and at least one of the following elements from 0.02-0.3 wt % nickel, from 0.008-0.2 wt % manganese, from 0.01-0.3 wt % cobalt, from 0.01-0.3 wt % chromium, from 0.02-0.3 wt % iron, and from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities. | 11-27-2008 |
| 20080292493 | Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In - Provided is a quaternary Pb-free solder composition incorporating Sn—Ag—Cu—In, which can prevent a cost increase and sufficiently ensure proccessability and mechanical property as a solder material. To this end, indium (In) with appropriate amount is added into the Pb-free solder composition, and the addition amount of Ag is optimized, thus preventing a decrease in wettability caused by a decrease in the amount of Ag and improving resistance to a thermal cycling and a mechanical impact. The quaternary Pb-free solder composition includes silver (Ag) of about 0.3 wt. % or more, and less than about 2.5 wt. %, copper (Cu) of about 0.2 wt. % or more, and less than about 2.0 wt. %, indium (In) of about 0.2 wt. % or more, and less than about 1.0 wt. % or less, and a balance of tin (Sn). | 11-27-2008 |
| 20090232696 | Lead-free solder alloy - A lead-free solder alloy is provided which has improved impact resistance to dropping even after thermal aging and which is excellent with respect to solderability, occurrence of voids, and yellowing. A solder alloy according to the present invention consists essentially of, in mass percent, (1) Ag: 0.8-2.0%, (2) Cu: 0.05-0.3%, (3) at least one element selected from In: at least 0.01% and less than 0.1%, Ni; 0.01-0.04%, Co: 0.01-0.05%, and Pt: 0.01-0.1%, optionally (4) at least one element selected from Sb, Bi, Fe, Al, Zn, and P in a total amount of up to 0.1%, and a remainder of Sn and impurities. | 09-17-2009 |
| 20090304545 | LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER FOR AUTOMOBILE-MOUNTED ELECTRONIC MEMBER - A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu | 12-10-2009 |
| 20100233018 | LEAD-FREE SOLDER ALLOY - Provided is an SnCu lead-free solder alloy which eliminates a drawback that an intermetallic compound excessively precipitates and the precipitate serves as nuclei to form dross to thereby cause soldering defects including a needle-like protrusion to occur, thus to satisfy all of the properties required for practical use. | 09-16-2010 |
| 20130084209 | White Metal Babbitt for Rolling Mill Bushing - A tin based white metal alloy consisting essentially by weight of approximately 5.0%-0-9.0% antimony, approximately 3.0%-8.0% copper, approximately 0.1%-0.7% cobalt, and the balance tin. | 04-04-2013 |
| 20130259738 | Low Melting Temperature Solder Alloy - A solder composition is provided. The solder composition consists essentially of from about 6.0 to 7.5 percent by weight of bismuth, from about 0.5 to 0.7 percent by weight of copper, and the remainder of the composition being tin. | 10-03-2013 |
| 20140134042 | SILVER-FREE AND LEAD-FREE SOLDER COMPOSITION - A silver-free and lead-free solder composition includes: 2 wt % to 8 wt % of Bi, 0.1 wt % to 1.0 wt % of Cu, 0.01 wt % to 0.2 wt % of at least one of Ni, Fe, and Co, and the balance of Sn based on 100 wt % of the silver-free and lead-free solder composition. | 05-15-2014 |
| 20140328719 | LEAD-FREE SOLDER COMPOSITION - A lead-free solder composition includes: 3 wt % to 5 wt % of Ag, 0.2 wt % to 0.8 wt % of Cu, 1 wt % to 7 wt % of Bi, 0.005 wt % to 0.06 wt % of Ni, 0.005 wt % to 0.02 wt % of Ge, and the balance being Sn based on 100 wt % of the lead-free solder composition. | 11-06-2014 |
| 20150328723 | LEAD-FREE SOLDER ALLOY FOR PRINTED CIRCUIT BOARD ASSEMBLIES FOR HIGH-TEMPERATURE ENVIRONMENTS - A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed. | 11-19-2015 |
| 20160084306 | TIN-BASED SLIDING BEARING ALLOY - A tin-based sliding bearing alloy contains zinc as its principal alloying element at a content of 2 to 14% w/w and has the Sn—Zn eutectic as its main structural element. The content of zinc as the principal alloying element can be expanded to 2 to 30% w/w by the addition of additional alloying elements. Antimony and/or copper can additionally be used as further principal alloying elements. | 03-24-2016 |
| 20160107267 | SOLDER ALLOY - An alloy suitable for use in a wave solder process, hot air levelling process, a ball grid array or chip scale package comprising no more than 3 wt.% bismuth, from 0.15-1.5 wt.% copper, from 0.1-1.5 wt.% silver, and the balance tin, with optionally other alloying elements in certain embodiments, together with unavoidable impurities. | 04-21-2016 |
| 420562000 | Antimony, or bismuth containing | 2 |
| 20090104071 | SOLDER ALLOY FOR BONDING OXIDE MATERIAL, AND SOLDER JOINT USING THE SAME - The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substantially Sn. The invention can be used for bonding an oxide material, such as bonding glasses to each other. According to the invention, a low-cost solder joint of an oxide material is also provided. | 04-23-2009 |
| 20150343570 | Pb-FREE SOLDER ALLOY - A Pb-free solder alloy contains 4-12 wt % of Zn, 0.5-4 wt % of Bi, 0.5-5 wt % of In, 0.005-0.5 wt % of P, 0.001-0.5 wt % of Zr and at least one selected from a group consisting of: 0-0.1 wt % of Y, 0-0.2 wt % of Ge, 0-0.05 wt % of Mg, 0-0.02 wt % of B, 0-0.05 wt % of Al, 0-0.2 wt % of Ni and 0-0.3 wt % of Ag. And a balance of the Pb-free solder alloy is Sn. | 12-03-2015 |
