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SILVER BASE

Subclass of:

420 - Alloys or metallic compositions

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Class / Patent application numberDescriptionNumber of patent applications / Date published
420501000SILVER BASE64
20090074607PROCESS FOR RECOVERING GOLD AND SILVER FROM REFRACTORY ORES - The present invention is directed to flotation of refractory gold sulfide ores in which the ore is ground, floated, the tailings reground, and refloated to produce gold-bearing concentrates.03-19-2009
20090116998HIGHLY CRYSTALLINE SILVER POWDER AND PRODUCTION METHOD OF HIGHLY CRYSTALLINE SILVER POWDER - Object of the present invention is to provide a production method of a highly crystalline silver powder containing powder particles in fine particle region and having a good particle size distribution as well as the highly crystalline silver powder obtained by the production method. In order to achieve the object, the present invention adopts a production method characterized in that the method comprises preparation of a first aqueous solution in which gelatin, silver nitrate and nitric acid are dissolved in water, preparation of a second aqueous solution in which L-sorbic acid and/or ascorbic acid and a water-soluble organic acid are dissolved, adding of the second aqueous solution slowly to mix with the first aqueous solution, stirring of the mixture to grow the silver particles after finishing the mixing, keeping of the mixture still to settle the silver particles, discarding of the supernatant, filtration and rinsing to obtain the highly crystalline silver powder.05-07-2009
20090196788Methods For The Production Of Silver Nanowires - Embodiments of the present invention are directed to novel methods for the solution-based production of silver nanowires by adaptation of the polyol process. Some embodiments of the present invention can be practiced at lower temperature and/or at higher concentration than previously described methods. In some embodiments reactants are added in solid form rather than in solution. In some embodiments, an acid compound is added to the reaction.08-06-2009
20100034693SILVER NANOPARTICLE PROCESS - A process comprising: (a) preparing a reaction mixture comprising a silver salt, the reducing agent comprising a hydrazine compound, a thermally removable stabilizer, and an optional solvent, to form a plurality of silver-containing nanoparticles with molecules of the stabilizer on the surface of the silver-containing nanoparticles, wherein the reaction mixture generates an acid; and (b) removing the acid to produce the silver-containing nanoparticles substantially free of acid.02-11-2010
20100143183PROCESS FOR MANUFACTURE OF NANOMETRIC, MONODISPERSE, STABLE METALLIC SILVER AND A PRODUCT OBTAINED THEREFROM - The present invention relates to a procedure for preparation by a wet reduction method of nanometric particles of metallic silver, with diameter ranging from 1 to 100 nm and an average diameter of 20 to 40 nm, with monodispersion characteristics, stabilities exceeding 12 months and in a wide range of concentrations. The process comprises 4 stages: a) preparation of the reducing agent solution, taken from the tannins group and preferably tannic acid; b) preparation of a solution of soluble silver salts; c) reaction and, d) liquid-solid separation; the particle size is determined by the nature of the reducing agent and by the pH control of the currents. The final stage is designed for separating and concentrating the material after which the user can prepare the product for integration thereof in the desired medium. The particles obtained are redispersable in different media, such as water, alkidalic and phenolic resins, nitrocellulose, polyeurethane, vinylics, acrylics, alcohols, and in a wide range of organic and polymeric products such as high and low density polyethylene, Nylon, ABS and/or mixtures thereof.06-10-2010
20110064603PROCESS FOR PREPARING NANOPARTICLES - A process for producing nanoparticles comprises the steps of preparing silver seeds in the presence of a water soluble polyanionic polymer and growing the silver seeds to form nanoparticles. The polyanionic polymer may be poly (sodium styrenesulphonate).03-17-2011
20110250089Clayish composition for forming sintered silver alloy body, powder for clayish composition for forming sintered silver alloy body, method for manufacturing clayish composition for forming sintered silver alloy body, sintered silver alloy body, and method for manufacturing sintered silver alloy body - A clayish composition for forming a sintered silver alloy body capable of forming a sintered silver alloy body, which is not easily discolored even in the atmosphere and has excellent tensile strength, flexural strength, surface hardness (hereinafter, sometimes collectively referred to as ‘mechanical strength’), elongation or the like, powder for the clayish composition for forming a sintered silver alloy body, a method for manufacturing the clayish composition for forming a sintered silver alloy body, a sintered silver alloy body and a method for manufacturing the sintered silver alloy body.10-13-2011
20120063948NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Preparation methods, compositions, and articles are disclosed and claimed. Methods for reducing metal ions to metals, the metal products, and articles comprising the metal products are claimed. The claimed inventions are useful for electronic and optical applications.03-15-2012
20120148442NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies and reduced nitric oxide co-production relative to previous methods. Such materials are useful in electronic applications.06-14-2012
20120148443NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies relative to previous methods. Such materials are useful in electronic applications.06-14-2012
20120171072NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of preparing nanowires, and compositions and articles comprising the nanowires are disclosed. Such methods allow tailored synthesis of nanowires based on one or more product geometrical parameters. Such tailored nanowires are useful in electronic applications.07-05-2012
20120183433CO-CURRENT AND COUNTER CURRENT RESIN-IN-LEACH IN GOLD LEACHING PROCESSES - A method and system are provided in which a gold and/or silver-collecting resin-in-leach circuit comprises both co-current and counter-current sections.07-19-2012
20120183434NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of producing metal nanowires, compositions, and articles are disclosed. Such methods allow production of metal nanowires with reproducibly uniform diameter and length, even in the presence of catalyst concentration variation. Such metal nanowires are useful for electronics applications.07-19-2012
20120183435NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of producing metal nanowires, compositions, and articles are disclosed. Such methods allow production of metal nanowires with reproducibly uniform diameter and length, even in the presence of catalyst concentration variation. Such metal nanowires are useful for electronics applications.07-19-2012
20120207644NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of producing metal nanowires employing tubular continuous-flow reactors and their products are described and claimed. Such methods can provide superior nanowire uniformity without agglomeration. Such nanowires are useful for electronic applications.08-16-2012
20120219453SILVER POWDER AND METHOD FOR PRODUCING SAME - After a reducing agent is added to a water reaction system containing silver ions to deposit silver particles by reduction, the silver particles are dried to obtain a silver powder which is heat-treated at a temperature of higher than 100° C., and lower than 400° C. The silver powder thus heat-treated has a maximum coefficient of thermal expansion of not greater than 1.5% at a temperature of 50° C. to 800° C., and has no heating peak when the silver powder is heated from 50° C. to 800° C. The silver powder has an ignition loss of not greater than 1.0% when the silver powder is ignited until the weight of the silver powder is constant at 800° C. The silver powder has a tap density of not less than 2 g/cm08-30-2012
20120294755NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Preparation methods, compositions, and articles useful for electronic and optical applications are disclosed. Such methods reduce metal ions to metal nanowires in the presence of bromide ions, IUPAC Group 14 elements in their +2 oxidation state, and optionally chloride ions. The product nanowires are useful in electronics applications.11-22-2012
20120301350NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Nanowire preparation methods, compositions, and articles are disclosed. Such methods which reduce metal ions to metal nanowires in the presence of aluminum or gallium ions, are capable of producing long, narrow, nanowires useful for electronics and optical applications.11-29-2012
20120328469NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of preparing nanowires, compositions, and articles are disclosed. Such methods can provide thin nanowires with reduced nanoparticle contamination. Compositions and articles comprising such nanowires are useful in electronics applications.12-27-2012
20130039806NANOWIRE PURIFICATION METHODS, COMPOSITIONS, AND ARTICLES - Processes are disclosed and claimed that allow either purification of nanowire slurries or exchange of liquids in such slurries or both. Such processes avoid the drawbacks of other known methods and are readily scalable to larger production volumes.02-14-2013
20130058826PROCESS FOR MAKING SILVER POWDER PARTICLES WITH VERY SMALL SIZE CRYSTALLITES - The process for making silver powder particles with very small size crystallites uses a combination of gum arabic and maleic acid with the reduction of a silver salt with ascorbic acid. Silver thick film paste containing these silver powder particles can be used in electronic applications to form electrodes for semiconductor devices and, in particular, solar cells.03-07-2013
20130121872Silver Ink Composition and Substrate - There is provided with a silver ink composition which is formed by blending one or more kinds of silver β-ketocarboxylates selected from the group consisting of silver isobutyrylacetate, silver benzoylacetate, silver propionylacetate, silver acetoacetate, silver α-methylacetoacetate, and silver α-ethylacetoacetate, and an aliphatic primary or secondary amine having 1 to 10 carbon atoms, and a substrate with a surface on which a metallic silver layer which is formed by heating the silver ink composition is provided. According to the invention, it is possible to obtain a silver ink composition suitable for forming a metallic silver layer which has superior glossiness and specularity, and a substrate with a surface on which a metallic silver layer is formed using the silver ink composition.05-16-2013
20130156632PROCESS FOR MAKING SILVER POWDER PARTICLES WITH SMALL SIZE CRYSTALLITES - The process for making silver powder particles with small size crystallites uses a combination of gum arabic and maleic acid with the reduction of a silver salt with ascorbic acid. Silver thick film paste containing these silver powder particles can be used in electronic applications to form electrodes for semiconductor devices and, in particular, solar cells.06-20-2013
20130272919Method for Manufacturing Silver Nanowires - Provided is a method for producing Ag nanowires, including, heating a precursor solution that includes: an Ag salt; a water-soluble polymer; a surfactant, or a halide of metal ions having a standard reduction potential of −0.1 to −0.9V as a metal catalyst; and a reduction solvent, to produce the Ag nanowires. According to this method, a time for synthesizing nanowires may be considerably decreased, and an amount of Ag precursor discarded without reaction may be effectively reduced. As a result, the Ag nanowires may be produced with high efficiency and mass-production thereof through a simple scale-up may be successfully achieved.10-17-2013
20130323115METHOD OF MANUFACTURING SILVER PLATELETS - The present invention provides an aqueous solution-based method for producing nano-sized silver platelets, which employs the controlled mixing of a silver ion solution, a reducing solution, and an acidic solution, under suitable conditions. Also provided are the silver platelets produced thereby, and compositions containing the silver platelets.12-05-2013
20130343950NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of producing metal nanowires employing tubular continuous-flow reactors and their products are described and claimed. Such methods can provide superior nanowire uniformity without agglomeration. Such nanowires are useful for electronic applications.12-26-2013
20140023552NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of producing metal nanowires, compositions, and articles are disclosed. Such methods allow production of metal nanowires with reproducibly uniform diameter and length, even in the presence of catalyst concentration variation. Such metal nanowires are useful for electronics applications.01-23-2014
20140112823RECOVERY OF GOLD FROM ROASTER CALCINE LEACH TAILINGS - A method to recover gold lost in roaster calcine-leach tailings, due to the formation of cyanide refractory compounds or morphologies during the roasting process. The process can include acid leaching of magnetic concentrate from roaster leach tailings, combining the acid leach slurry to the pre-acidulation tank for pressure oxidation feed, acid pressure oxidation of the pressure oxidation feed, and recovery of gold.04-24-2014
20140119980NOVEL SOLVENTS FOR METAL ION REDUCTION METHODS, COMPOSITIONS, AND ARTICLES - Methods employing novel solvents are disclosed for making metal nanostructures including metal nanowires. Such methods can be carried out at lower temperatures and higher production rates than those employing ethylene glycol. The products of these methods are useful for electronics applications.05-01-2014
20140178246PROCESS FOR MAKING SILVER NANOSTRUCTURES AND COPOLYMER USEFUL IN SUCH PROCESS - A process for making silver nanostructures, which includes the step of reacting at least one polyol and at least one silver compound that is capable of producing silver metal when reduced, in the presence of: (a) a source of chloride or bromide ions, and (b) at least one copolymer that comprises: (i) one or more first constitutional repeating units that each independently comprise at least one pendant saturated or unsaturated, five-, six-, or seven-membered, acylamino- or diacylamino-containing heterocylic ring moiety per constitutional repeating unit, and (ii) one or more second constitutional repeating units, each of which independently differs from the one or more first nonionic constitutional repeating units, and has a molecular weight of greater than or equal to about 500 grams per mole, is described herein.06-26-2014
20140178247PROCESS FOR MAKING SILVER NANOSTRUCTURES AND COPOLYMER USEFUL IN SUCH PROCESS - A process for making silver nanostructures, which includes the step of reacting at least one polyol and at least one silver compound that is capable of producing silver metal when reduced, in the presence of: (a) a source of chloride or bromide ions, and (b) at least one copolymer that comprises: (i) one or more first constitutional repeating units that each independently comprise at least one pendant saturated or unsaturated, five-, six-, or seven-membered, acylamino- or diacylamino-containing heterocylic ring moiety per constitutional repeating unit, and (ii) one or more second constitutional repeating units, each of which independently differs from the one or more first nonionic constitutional repeating units, and has a molecular weight of greater than or equal to about 500 grams per mole, is described herein.06-26-2014
20150086417SILVER-BASED ELECTRICAL CONTACT MATERIAL - The present invention relates to a new silver-based electrical contact material, in which silver is in a continuous phase and carbon being in a nano-dispersed phase is dispersed in continuous phase silver. The content of the dispersed phase carbon in the silver-based electrical contact material can be 0.02% to 5% by weight, on the basis of the total weight of the silver-based electrical contact material. According to the present invention, the carbon contains carbon in a diamond form. Such a silver-based electrical contact material shows excellent mechanical wear resistance and electrical performance.03-26-2015
20150290715METHODS OF CONTROLLING NANOWIRE MORPHOLOGY - Disclosed herein are synthetic methods of producing silver nanowires with controlled morphology, as well as purifying the same. Also disclosed are coating solutions comprising populations of silver nanowires of certain length and diameter distributions.10-15-2015
20150307961Solvent-Free Syntheses of Silver Products Produced Thereby - Described herein are methods of making metallic or elemental silver in the solid state. These methods generally include a step of forming an at least substantially solvent-free solid state reaction mixture that includes a silver-containing compound and an organic acid, followed by heating the reaction mixture at a temperature and for a time effective to form metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.10-29-2015
20150314370SILVER POWDER - The present invention provides a silver powder that has an appropriate viscosity range at the time of paste production, can be easily kneaded, and prevents flake occurrence. The silver powder has a dibutyl phthalate absorption amount, measured by a method of JIS-K6217-4, of 7.0 to 9.5 ml/100 g, and has an oil absorption profile at the time of measurement of the absorption amount, having two peaks, or one peak having a half width of not more than 1.5 ml/100 g.11-05-2015
20150314371SILVER POWDER - Provided is a silver powder which has an appropriate viscosity range at the time of paste production, can be easily kneaded, and prevents the occurrence of flakes. The silver powder to be used has a specific surface area ratio SA11-05-2015
20160250689METHOD OF PREPARING SILVER NANOPARTICLES AND SILVER NANORINGS09-01-2016
20160376684SILVER ALLOY MATERIAL AND METHOD FOR MANUFACTURING THE SILVER ALLOY MATERIAL - The present invention provides a silver alloy material and a method for manufacturing the silver alloy material, the silver alloy material comprising essentially by weight of about 65% to 95% Ag, about 5% to 35% In. The silver alloy material has a solid-liquid coexistence zone. The steps for manufacturing the silver alloy material include mixing, heating in vacuum status, cooling and annealing. The characters of the silver alloy are low yield tensile strength (58 Mpa), high ultimate tensile strength (300 MPa) and high elongation (60%) and anti-tarnishing property. The silver alloy material could be used for optics reflector mirror, silver ornament, brazing materials and very fine silver alloy wire for semiconductor bounding application.12-29-2016
420502000 Copper containing 19
20090169417SEMI-REFLECTIVE FILM AND REFLECTIVE FILM FOR OPTICAL RECORDING MEDIUM, AND Ag ALLOY SPUTTERING TARGET FOR FORMING SEMI-REFLECTIVE FILM OR REFLECTIVE FILM FOR OPTICAL RECORDING MEDIUM - A semi-reflective film and reflective film for an optical recording medium, which is made of a silver alloy having a composition consisting of 0.001 to 0.1% by mass of Ca, 0.05 to 1% by mass of Mg, and a remainder containing Ag and inevitable impurities, and a target which is made of a silver alloy having a composition consisting of 0.001 to 0.1% by mass of Ca, 0.05 to 1% by mass of Mg, and a remainder containing Ag and inevitable impurities; and a semi-reflective film for an optical recording medium, which is made of a silver alloy having a composition consisting of 0.05 to 1% by mass of Mg, 0.05 to 1% by mass of one or more of Eu, Pr, Ce and Sm, and a remainder containing Ag and inevitable impurities, and an Ag alloy sputtering target for forming a semi-reflective film for an optical recording medium, which is made of a silver alloy having a composition consisting of 0.05 to 1% by mass of Mg, 0.05 to 1% by mass of one or more of Eu, Pr, Ce and Sm, and a remainder containing Ag and inevitable impurities.07-02-2009
20110070122Alloy Composition - An alloy composition comprises 73.0 to 74.5 wt % of Ag and 25.5-27.0 wt % of Sn; 30.0-67.5 wt % of Ag and 32.5-70.0 wt % of In; or 29.0-60.0 wt % of Ag, 19.0-35.0 wt % of Sn and 20.0-35.2 wt % of In, wherein the particle diameter of Ag is between 10 nm to 200 μm. The alloy composition in the present invention has characters of low melting point, low hardness and high ductility. On the other hand, after a heat treatment, the alloy composition is tended to be high in melting point, hardness, strength, stability and conductivity.03-24-2011
20110211988SPUTTERING TARGET MATERIAL - This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.09-01-2011
20120070332SPUTTERING TARGET MATERIAL - This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.03-22-2012
20140003992TARNISH-RESISTANT STERLING SILVER ALLOYS01-02-2014
20140037492ACTIVE METAL BRAZING MATERIAL - The present invention provides an active metal brazing material composed of a Ag—Cu—Ti—Sn alloy containing by weight 20 to 40% of Cu, 1.0 to 3.0% of Ti, 1.2 to 6.0% of Sn and the balance being Ag, and having a metallographic structure including a Sn—Ti or Cu—Ti intermetallic compound dispersed in a Ag—Cu alloy matrix, wherein the weight ratio Sn/Ti between Ti and Sn is 1.2 or more, and additionally the particle size of the intermetallic compound is 20 μm or less. The foregoing active metal brazing material improves the workability of the hitherto known Ag—Cu—Ti alloy active metal brazing material and enables a critical dimension processing with a high processing rate, and can be produced by melting and casting the foregoing Ag—Cu—Ti—Sn alloy, and by subsequently plastically working the cast at a working rate of 90% or more to make finer the intermetallic compound involved.02-06-2014
20150292113METAL SINGLE CRYSTAL IN WHICH METAL ELEMENT IS SUBSTITUTED - The present invention relates to a metal single crystal in which a metal element is substituted, wherein a metal element A is doped with a metal element B different from the metal element A to form A10-15-2015
420503000 Other noble metal containing 9
20080240975AG-BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE - An Ag-based alloy wire for a semiconductor package is highly reliable and can be fabricated with low costs. The Ag-based alloy wire includes 0.05˜5 wt % of at least one kind of a first additive ingredient selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), gold (Au), and nickel (Ni), and Ag as a remainder.10-02-2008
20090185946KARATIUM WHITE - A jewelry alloy that is approximately a 10% or 2.4 karat alloy that has similar color huge and shine and characteristics of 10 karat white gold and higher. This alloy is considerably less expensive than traditional 10 karat white gold and higher, but has all the similar working characteristics as working in sterling or 10 karat white gold metal alloys. The alloy has the following compositions by weight; Gold 5.00-20.00%, Silver 75.00-92.50%, Copper 01.00-10.00%. In addition to its nice white (silver) color and low cost it provides retailers with an affordable alloy for jewelry and provides jewelry craftsmen a low cost white (silver) alloy that responds well to the jewelry manufacturing process (e.g., casting, milling, soldering, tooling, stone setting, polishing and plating).07-23-2009
20090297391MANUFACTURING METHOD FOR A SILVER ALLOY BONDING WIRE AND PRODUCTS THEREOF - A manufacturing method for a silver alloy bonding wire and products thereof A primary material of Ag is melted in a vacuum melting furnace, and then a plurality of secondary metal materials are added into the vacuum melting furnace and co-melted with the primary material to obtain a silver alloy ingot. The obtained silver alloy ingot is drawn to obtain a silver alloy wire. The silver alloy wire is then drawn to obtain a silver alloy bonding wire with a predetermined diameter.12-03-2009
20100008818KARATIUM STERLING - A sterling silver jewelry alloy that has approximately 0.01-7.50% fine gold content that has similar color huge and shine and characteristics of sterling silver. Karatium Sterling is a unique alloy blend that will provide the traditional sterling silver jewelry designer with a special metal that is slightly more tarnish resistant than traditional sterling silver. The alloy has the following compositions by weight; Gold 0.01.00-7.50%, Silver 92.50-97.50%, Copper 0.01-7.00%. In addition to its nice silver color it also polishes easier with a better luster and provides jewelry craftsmen a slightly higher cost silver alloy that responds well to the jewelry manufacturing process (e.g., casting, milling, soldering, tooling, stone setting, polishing and plating).01-14-2010
20130094990SPUTTERING TARGET MATERIAL - This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.04-18-2013
20140065011SILVER ALLOY - A platinum-free silver alloy may include about 0.1% to 0.9% Au, about 83% to 90% Ag, about 2% to 3% Pd, about 3% to 5% Zn, about 2% to 8% Cu, about 0.01% to 0.4% B, about 0.1% to 0.3% Ge, and about 0.01% to 0.03% Ir.03-06-2014
20140127075REVERSIBLY AGE HARDENABLE, PALLADIUM CONTAINING TARNISH RESISTANT STERLING SILVER ALLOYS - A silver-based alloy composition which is soft and workable in an annealed condition, is hardenable through heat treatment, and is tarnish resistant. The preferred embodiment of the composition of the present invention includes a small percentage of palladium and a reduction from typical percentages of copper found in a sterling silver alloy. In one embodiment the silver-based alloy includes no copper at all.05-08-2014
20140271340SILVER ALLOY - A silver alloy with exceptional resistance to both tarnishing and firestain includes at least 92.50% silver, from 0.70 to 1.65% germanium, from 1.30 to 1.80% indium, from 0.000 to 0.015% boron, not more than 1.0% palladium and not more than 0.20% copper.09-18-2014
20140369884AG ALLOY FILM TO BE USED AS REFLECTING FILM AND/OR TRANSMITTING FILM OR AS ELECTRICAL WIRING AND/OR ELECTRODE, AG ALLOY SPUTTERING TARGET, AND AG ALLOY FILLER - The present invention provides an Ag alloy film which exhibits a low-level electrical resistivity nearly equivalent to that of a pure Ag film and which is superior to a conventional Ag alloy film in durability (specifically, resistances to salt water and halogen) and in the adhesion to a substrate. Further, the deposition rate of this Ag alloy film by sputtering is as high as that of a pure Ag film. Provided is an Ag alloy film useful as a reflecting film and/or a transmitting film or as an electrical wiring and/or an electrode, including 0.1 to 1.5 atomic % of at least one element selected from Pd, Au and Pt, and 0.02 to 1.5 atomic % of at least one element selected from at least one rare earth element, Bi and Zn with the balance being Ag and inevitable impurities.12-18-2014
420504000 Zinc, or cadmium containing 3
20100239454SILVER TERNARY ALLOY - A firestain and tarnish-resistant ternary alloy of silver, copper and germanium contains from more than 93.5 wt % to 95.5 wt % Ag, from 0.5 to 3 wt % Ge, optionally 0.5 wt % Zn and the remainder, apart from incidental ingredients (if any), impurities and grain refiner, copper. In order to further protect an article made from the alloy, it may be surface treated with an alkanethiol, alkyl thioglycollate, dialkyl sulphide or dialkyl disulphide. Embodiments of the above alloy exhibit relatively low elution of copper when subjected to a simulated sweat test.09-23-2010
20110052444LEAD-FREE SOLDER ALLOY FOR PRINTED CIRCUIT BOARD ASSEMBLIES FOR HIGH-TEMPERATURE ENVIRONMENTS - A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.03-03-2011
20130004363Nickel-free Sterling Silver Alloy Compositions and Method of Preparation - A new nickel-free sterling silver alloy with superior tarnish resistant, yet substantially similar cold working and mechanical properties is disclosed using a specified mixture of zinc, copper, silicon, iridium, and indium with pure silver. A new and improved method of manufacture involving a four-step process whereby the non-silver components are fabricated in an inert gas or reducing atmosphere into a master alloy of pre-determined composition, and in a final step mixed with a predetermined mass of pure silver to produce the new alloy.01-03-2013
420505000 Other noble metal containing 7
20090191088MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCTS THEREOF - A manufacturing method for a composite metal bonding wire and products thereof. A material of Ag and Au is co-melted in a vacuum melting furnace, and then a plurality of trace metal elements are added into the vacuum melting furnace and co-melted with the material to obtain a composite metal ingot. The obtained composite metal ingot is drawn to obtain a composite metal wire. The composite metal wire is then drawn to obtain a composite metal bonding wire with a predetermined diameter.07-30-2009
20100239455COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF - A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain a Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain a Ag—Pd alloy bonding wire with a predetermined diameter.09-23-2010
20100239456COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF - A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Au and Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Au—Ag—Pd alloy solution. The obtained Au—Ag—Pd alloy solution is drawn to obtain a Au—Ag—Pd alloy wire. The Au—Ag—Pd alloy wire is then drawn to obtain a Au—Ag—Pd alloy bonding wire with a predetermined diameter.09-23-2010
20110229368White precious metal alloy - The present disclosure relates to white precious metal alloy compositions comprising at least one of platinum and palladium alloyed with gold, silver, and optionally one or more additional alloying elements. More specifically, and in one embodiment, the present disclosure relates to white precious metal alloy compositions that are suitable for the manufacture of jewelry and other finished articles. In addition, the present invention also relates to a method of manufacturing finished articles from such white precious metal alloy compositions.09-22-2011
20120093681COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF - A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain an Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain an Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain an Ag—Pd alloy bonding wire with a predetermined diameter.04-19-2012
20120263624Ag-Au-Pd TERNARY ALLOY BONDING WIRE - An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999 mass % or higher, 2-5 mass % of palladium having a purity of 99.99 mass % or higher, and remaining mass % of silver (Ag) having a purity of 99.999 mass % or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag10-18-2012
20130164169COMPOSITE ALLOY BONDING WIRE - A manufacturing method for a composite alloy bonding wire and products thereof are provided. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain an Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain an Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain an Ag—Pd alloy bonding wire with a predetermined diameter.06-27-2013

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