| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 420470000 |
Tin containing
| 121 |
| 420477000 |
Zinc containing
| 37 |
| 420485000 |
Nickel containing
| 7 |
| 420492000 |
Titanium, zirconium or hafnium containing | 4 |
| 20080240974 | Age-hardenable copper alloy - An age-hardenable copper alloy made of 1.2 to 2.7% cobalt, which is able to be partially replaced by nickel, 0.3 to 0.7% beryllium, 0.01 to 0.5% zirconium, optionally 0.005 to 0.1% magnesium and/or iron and in some instances up to a maximum of 0.15% of at least one element from the group including niobium, tantalum, vanadium, hafnium, chromium, manganese, titanium and cerium. The remainder is copper and includes production-conditioned impurities and usual processing-additives. This copper alloy is used as the material for producing mold blocks for the side dams of continuous strip-casting installations. | 10-02-2008 |
| 20120148441 | COPPER ALLOY WIRE AND METHOD FOR PRODUCING THE SAME - The zirconium content of the alloy composition of a copper alloy wire is 3.0 to 7.0 atomic percent; and the copper alloy wire includes copper matrix phases and composite phases composed of copper-zirconium compound phases and copper phases. The copper matrix phases and the composite phases form a matrix phase-composite phase fibrous structure and are arranged alternately parallel to an axial direction as viewed in a cross-section parallel to the axial direction and including a central axis. The copper-zirconium compound phases and the copper phases in the composite phases also form a composite phase inner fibrous structure and are arranged alternately parallel to the axial direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double fibrous structure presumably makes the copper alloy wire densely fibrous to provide a strengthening mechanism similar to the rule of mixture for fiber-reinforced composite materials. | 06-14-2012 |
| 20140205491 | COPPER ALLOY MATERIAL - A copper alloy material includes an additional element M including Ti, and a balance having copper and an inevitable impurity. An atomic ratio of the additional element M to oxygen is in a range of 0.33≦M/O≦1.5. | 07-24-2014 |
| 20140205492 | COPPER ALLOY WIRE ROD AND METHOD FOR MANUFACTURING THE SAME - A copper alloy wire rod according to the present invention includes a copper parent phase and short fiber-shaped composite phases which are dispersed in the copper parent phase and which contain Cu | 07-24-2014 |
| 420491000 |
Lead containing | 3 |
| 20140010705 | COPPER OR COPPER REDUCED IN ALPHA RAY EMISSION, AND BONDING WIRE OBTAINED FROM THE COPPER OR COPPER ALLOY AS RAW MATERIAL - Copper or a copper alloy characterized in having an α-ray emission of 0.001 cph/cm | 01-09-2014 |
| 20150348664 | COPPER ALLOY FOR ELECTRONIC AND ELECTRIC DEVICES, COMPONENT FOR ELECTRONIC AND ELECTRIC DEVICES, AND TERMINAL - A copper alloy for electronic and electric devices has a composition in which the amount of Zr is in a range of 0.05% by mass to 0.15% by mass, the amount of Ca is in a range of 0.001% by mass to less than 0.08% by mass, the amount of Pb is less than 0.05% by mass, the amount of Bi is less than 0.01% by mass, and the balance Cu and inevitable impurities, the ratio Zr/Ca of the amount of Zr to the amount of Ca is 1.2 or more, the copper alloy includes two-phase particles made up of two phases of a phase containing Cu and Zr as main components and a phase containing Cu and Ca as main components and single-phase particles made of a single phase containing Cu and Zr as main components, and the conductivity is more than 88% IACS. | 12-03-2015 |
| 20160148885 | Cu Core Ball - A Cu core ball is provided that prevents any soft errors and decreases any connection failure. The Cu core ball includes a solder plating film formed on the surface of a Cu ball that is a Sn solder plating film or is made of a lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U of 5 ppb or less and Th of 5 ppb or less. The Cu ball has a purity of not less than 99.9% Cu and not more than 99.995% Cu. Pb and/or Bi contents therein are at a total of 1 ppm or more. The sphericity thereof is 0.95 or more. The obtained Cu core ball has an α dose of 0.0200 cph/cm | 05-26-2016 |
| 420497000 |
Noble metal containing | 2 |
| 20140301892 | SOLID SILVER-COPPER ALLOY - The present invention addresses the problem of providing a novel, solid silver-copper alloy. Provided is a solid silver-copper alloy in which the concentration of copper contained in the silver-copper alloy is 0.1-99.94 wt %, and which has, as the principal constituent thereof, a non-eutectic structure which does not contain a eutectic when the solid silver-copper alloy is at room temperature. This silver-copper alloy can be produced by mixing a fluid containing silver ions and copper ions with a fluid containing a reducing agent, and separating silver-copper alloy particles therefrom. It is preferable to mix the fluid containing the silver ions and copper ions with the fluid containing the reducing agent in a thin-film fluid formed between processing surfaces arranged so as to face one another, capable of approaching toward and separating from one another, and capable of having at least one surface rotate relative to the other. The diameter of the particles of the silver-copper alloy is preferably 50 nm or less. This solid silver-metal alloy may also be a solid alloy comprising one or more types of other metals in addition to silver and copper. | 10-09-2014 |
| 20150030495 | PIVOTABLE TUNDISH AND A METHOD FOR CONTINUOUS CASTING A METAL ALLOY, USE OF A PIVOTABLE TUNDISH AND AN ELONGATED CAST BAR OF A METAL ALLOY - A pivotable tundish ( | 01-29-2015 |
| 420496000 |
Iron or cobalt containing | 2 |
| 20140199204 | CUPROUS OXIDE POWDER AND METHOD FOR PRODUCING SAME - There are provided a cuprous oxide powder having a smaller particle diameter than that of conventional cuprous oxide powders, and a method for producing the cuprous oxide powder by a chemical reducing process. In a method for producing a cuprous oxide powder by adding a reducing agent, such as a reducing sugar, to a solution containing copper hydroxide, which is formed by adding one of an alkali solution and a copper ion containing solution to the other thereof, to deposit cuprous oxide particles by reduction, 0.00001 to 0.04 moles (10 to 40000 ppm) of ferrous ions with respect to the amount of copper ions in the copper ion containing solution are added to the copper ion containing solution before forming copper hydroxide, to produce a cuprous oxide powder which has a mean primary particle diameter of not greater than 0.5 micrometers when it is measured by a scanning electron microscope (SEM), the cuprous oxide powder having a 50% particle diameter (D | 07-17-2014 |
| 20160047017 | HOT-ROLLED COPPER PLATE - A hot-rolled copper plate consists of pure copper having a purity of 99.99 mass % or greater, the hot-rolled copper plate having an average crystal grain diameter of 40 μm or less, and a (Σ3+Σ9) grain boundary length ratio (L σ3+σ9)/L), which is a ratio between a total crystal grain boundary length L measured by an EBSD method and a sum L (σ3+σ9) of a Σ3 grain boundary length Lσ3 and a Σ9 grain boundary length Lσ9, being 28% or greater. | 02-18-2016 |
| 420489000 |
Aluminum, gallium, indium, or thallium containing | 2 |
| 20100172791 | ALUMINUM-BRONZE ALLOY AS RAW MATERIALS FOR SEMI SOLID METAL CASTING - An aluminum-bronze alloy as raw materials for Semi Solid Metal casting has a component composition containing Al of 5 to 10 mass %, Zr of 0.0005 to 0.04 mass %, and P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing Si of 0.5 to 3 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass % as needed. | 07-08-2010 |
| 20130183194 | Copper Alloy - Alloys are demonstrated based on copper, which have additions of manganese and sulfur and/or calcium as well as additional elements. The copper alloys are free from tellurium and lead, and are distinguished by high electrical conductivity and good machinability. | 07-18-2013 |
| 420499000 |
Phosphorus, arsenic, antimony, or bismuth containing | 2 |
| 20110123389 | High Purity Copper and Method of Producing High Purity Copper Based on Electrolysis - High purity copper having a purity of 6N or higher, wherein content of each of the respective components of P, S, 0, and C is 1 ppm or less, and nonmetal inclusions having a particle size of 0.5 μm or more and 20 μm or less contained in the copper are 10,000 inclusions/g or less. As a result of using high purity copper or high purity copper alloy as the raw material from which harmful P, S, C, 0-based inclusions have been reduced and controlling the existence form of nonmetal inclusions, it is possible to reduce the occurrence of rupture of a bonding wire and improve the reproducibility of mechanical properties, or reduce the percent defect of a semiconductor device wiring formed by sputtering a high purity copper target with favorable reproducibility. | 05-26-2011 |
| 20130302205 | High Purity Copper and Method of Producing High Purity Copper Based on Electrolysis - High purity copper having a purity of 6N or higher, wherein content of each of the respective components of P, S, 0, and C is 1 ppm or less, and nonmetal inclusions having a particle size of 0.5 μm or more and 20 μm or less contained in the copper are 10,000 inclusions/g or less. As a result of using high purity copper or high purity copper alloy as the raw material from which harmful P, S, C, O-based inclusions have been reduced and controlling the existence form of nonmetal inclusions, it is possible to reduce the occurrence of rupture of a bonding wire and improve the reproducibility of mechanical properties, or reduce the percent defect of a semiconductor device wiring formed by sputtering a high purity copper target with favorable reproducibility. | 11-14-2013 |
| 420493000 |
Manganese containing | 1 |
| 20130094989 | COPPER-BASED ALLOYS, PROCESSES FOR PRODUCING THE SAME, AND PRODUCTS FORMED THEREFROM - Copper-manganese alloys, optionally with potentially other alloying elements, whose compositions are at or sufficiently near the congruent (minimum) melting point of the Cu—Mn system to substantially avoid dendritic growth during solidification. Processes for producing such alloys are also provided, as well as products produced from such alloys. | 04-18-2013 |
| Entries |
| Document | Title | Date |
|---|
| 20090035173 | Electrically Conductive Material - An electrically conductive material includes: a supersaturated solid solution of a polycrystalline copper alloy having a composition represented by the formula: Cu | 02-05-2009 |
| 20100028198 | Process for Copper Electrowinning and Electrorefining - A method of electrowinning or electrorefining copper from a copper electrolyte solution which contains chloride ions, the method comprising the steps of: (a) forming a polyacrylamide solution by dissolving polyacrylamide, having a molecular weight range of 5,000 to 20,000,000 Daltons, in an acidic medium and under conditions to form a polyacrylamide block copolymer having blocks of carboxyl groups dispersed along the polymer backbone; (b) introducing the polyacrylamide solution into an electrolytic cell containing the copper electrolyte solution at a polyacrylamide concentration of 0.01-10 mg/L; and (c) electroplating copper from the copper electrolyte solution to form a copper cathode. | 02-04-2010 |
| 20100111752 | COMPOSITION OF MATTER TAILORING: SYSTEM IA - The present invention relates to tailored materials, particularly metals and alloys, and methods of making such materials. The new compositions of matter exhibit long-range ordering and unique electronic character. | 05-06-2010 |
| 20110103999 | METAL COATING FORMING METHOD AND AEROSPACE STRUCTURAL MEMBER - Provided are a method for forming a metal coating at high speed by using a simple cold spray apparatus, and an aerospace structural member on which a metal coating is formed by the cold spray method. In the metal coating forming method, nonspherical heteromorphous particles made of metal are projected onto a base material surface by the cold spray method to form a metal coating on the base material surface. | 05-05-2011 |
| 20120093680 | METHOD FOR OBTAINING COPPER POWDERS AND NANOPOWDERS FROM INDUSTRIAL ELECTROLYTES INCLUDING WASTE INDUSTRIAL ELECTROLYTES - The method for obtaining copper powders and nanopowders from industrial electrolytes including waste industrial electrolytes through electrochemical deposition of metallic copper on a cathode consists in using potentiostatic pulse electrolysis without the current direction change or with the current direction change, using the cathode potential value close to the plateau or on the plateau of the current voltage curve on which the plateau of the current potential range is from −0.2 V÷−1 V, and a moveable or static ultramicroelectrode or an array of ultramicroelectrodes made of gold, platinum or stainless steel wire or foil is used as a cathode, whereas metallic copper is used as an anode and the process is carried out at temperature from 18-60° C., and the electrolysis lasts from 0.005 to 60 s. Said method can be used to obtain nanopowders and powders characterised by particle structure and dimension repeatability and purity from 99%+ to 99.999% from waste industrial electrolytes and wastewaters from copper industry and electroplating plants without additional treatment. | 04-19-2012 |
| 20120114521 | STABILIZED METAL NANOPARTICLES AND METHODS FOR PRODUCTION THEREOF - Processes for synthesizing metal nanoparticles, particularly copper nanoparticles, are described. The processes can involve reacting an insoluble complex of a metal salt with a reducing agent in a reaction mixture containing a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant. More specifically, processes for forming copper nanoparticles can involve forming a first solution containing a copper salt, a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant; allowing an insoluble complex of the copper salt to form from the first solution; combining a second solution containing a reducing agent with the insoluble complex; and forming copper nanoparticles from the insoluble complex. Such copper nanoparticles can be about 10 nm or smaller in size, more particularly about 3 nm to about 6 nm in size, and have a fusion temperature of about 200° C. or lower. | 05-10-2012 |
| 20120148438 | NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies relative to previous methods. Such materials are useful in electronic applications. | 06-14-2012 |
| 20120219452 | COPPER ALLOY AND COPPER ALLOY MANUFACTURING METHOD - A copper alloy having an electrical resistivity lower than those of current copper alloys and a tensile strength higher than those of current copper alloys and a method of manufacturing such a copper alloy are provided. | 08-30-2012 |
| 20120251381 | ARTICLES CONTAINING COPPER NANOPARTICLES AND METHODS FOR PRODUCTION AND USE THEREOF - Articles containing a matrix material and plurality of copper nanoparticles in the matrix material that have been at least partially fused together are described. The copper nanoparticles are less than about 20 nm in size. Copper nanoparticles of this size become fused together at temperatures and pressures that are much lower than that of bulk copper. In general, the fusion temperatures decrease with increasing applied pressure and lowering of the size of the copper nanoparticles. The size of the copper nanoparticles can be varied by adjusting reaction conditions including, for example, surfactant systems, addition rates, and temperatures. Copper nanoparticles that have been at least partially fused together can form a thermally conductive percolation pathway in the matrix material. | 10-04-2012 |
| 20120301348 | NOVEL SOLVENTS FOR METAL ION REDUCTION METHODS, COMPOSITIONS, AND ARTICLES - Methods employing novel solvents are disclosed for making metal nanostructures including metal nanowires. Such methods can be carried out at lower temperatures and higher production rates than those employing ethylene glycol. The products of these methods are useful for electronics applications. | 11-29-2012 |
| 20120301349 | NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of preparing metal nanowire are disclosed that employ quaternary phosphonium salts. Such processes can produce long and thin nanowires. Compositions and articles comprising such nanowires are useful in electronics applications. | 11-29-2012 |
| 20120328468 | PROCESSED HIGH-PURITY COPPER MATERIAL HAVING UNIFORM AND FINE CRYSTALLINE STRUCTURE, AND PROCESS FOR PRODUCTION THEREOF - This worked high-purity copper material includes Cu having a purity of 99.9999% by mass or more, wherein an average crystal grain size is in a range of 20 μm or less, and in a grain size distribution of crystal grains, an area ratio of crystal grains having grain sizes that exceed 2.5 times the average crystal grain size is in a range of less than 10% of an area of the entire crystal grains. This method for producing a worked high-purity copper material includes: subjecting an ingot composed of high-purity copper having a Cu purity of 99.9999% by mass or more to hot forging at an initial temperature of 550° C. or higher, and then water-cooling the ingot; subsequently, subjecting the ingot to warm forging at an initial temperature of 350° C. or higher, and then water-cooling the ingot; subsequently, subjecting the ingot to cold cross-rolling at a total reduction ratio of 50% or more; and subsequently, subjecting the ingot to stress relief annealing at a temperature of 200° C. or higher. | 12-27-2012 |
| 20130156631 | METHOD OF REMOVING OXIDE FILM ON SURFACE OF COPPER OR COPPER-BASE ALLOY AND COPPER OR COPPER-BASE ALLOY RECOVERED USING THE METHOD - A pickling solution, including: 50 g/L to 400 g/L of sulfuric acid; 1 g/L to 100 g/L of at least one oxidant selected from a group consisting of nitric acid, hydrogen peroxide, peroxodisulfate ions, and iron (III) ions; 0.01 g/L to 10 g/L of at least one additive selected from a group consisting of aromatic sulfonic acid, aromatic sulfonate, alkylamine, aromatic carboxylic acid, and aromatic carboxylate; 0.005 g/L to 10 g/L of at least one surfactant selected from a group consisting of alkylbenzene sulfonic acid and alkylbenzene sulfonate; and 10 g/L to 300 g/L of copper sulfate, is used to remove oxide film, and then reused by being electrolyzed and adding the oxidant, the additive and the surfactant in amounts equivalent to consumed amounts. | 06-20-2013 |
| 20130177471 | COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR PRODUCING SAME - There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction. | 07-11-2013 |
| 20130309127 | COMPOSITION OF MATTER TAILORING: SYSTEM IA - The present invention relates to tailored materials, particularly metals and alloys, and methods of making such materials. The new compositions of matter exhibit long-range ordering and unique electronic character. | 11-21-2013 |
| 20140003991 | NANOPARTICLE COMPOSITION AND METHODS OF MAKING THE SAME | 01-02-2014 |
| 20140241937 | Coating Method Using Special Powdered Coating Materials and Use of Such Coating Materials - The invention relates to the use of a particle-containing powdered coating material in a coating method selected from the group consisting of cold gas spraying, flame spraying, high-speed flame spraying, thermal plasma spraying and non-thermal plasma spraying, wherein the particles have a relative deformability factor V | 08-28-2014 |
| 20140322069 | NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of producing metal nanowires, compositions, and articles are disclosed. Such methods allow production of metal nanowires with reproducibly uniform diameter and length, even in the presence of catalyst concentration variation. Such metal nanowires are useful for electronics applications. | 10-30-2014 |
| 20150086416 | PRODUCTION OF NANOPARTICLES USING HOMOGENEOUS MILLING AND ASSOCIATED PRODUCTS - A method of producing nanoparticles can comprise milling a plurality of milling bodies sufficient to produce the nanoparticles from exterior surfaces of the plurality of milling bodies. In this manner, the milling bodies are simultaneously the milling media and the feedstock for production of nanoparticles such that additional solids are not present during milling. Nanoparticles can be readily formed and optional milling agent and capping agents can be provided to stabilize and/or customize the nanoparticles for a particular application. | 03-26-2015 |
| 20150354025 | METHODS OF COPPER EXTRACTION - The hydrometallurgical copper extraction processes of the present teachings generally including two steps: a conditioning or activating step using low concentrations of ammonia and ammonium in an aqueous solution; and an acid leaching step. The processes of the present teachings can be performed at low temperature, for example, at ambient temperature, and at atmospheric pressure. | 12-10-2015 |
| 20160053342 | INTEGRATED RECOVERY OF METALS FROM COMPLEX SUBSTRATES - Described is a method of recovering a metal from a substrate having a metal sulphide, metal oxide, or combination thereof, by contacting the substrate with an aqueous oxidant to oxidize the metal sulphide to elemental sulphur and oxidized metal or convert the complex metal oxide to a metal salt, contacting the oxidized metal or simple metal oxide with ammonium hydroxide to form soluble a ammine complex of the metal to obtain a leachate and residual solids; separating the leachate from the residual solids; and recovering the metal. | 02-25-2016 |
| 20160189820 | Ti-INCLUDED OXIDE DISPERSION STRENGTHENED COPPER ALLOY AND METHOD FOR MANUFACTURING DISPERSED COPPER - The present invention relates to a Ti-included oxide dispersion strengthened copper alloy and a method for preparing oxide dispersion copper by an internal oxidation Ti-included copper alloy, which thus allows spheronization and refinement of the oxides, and reduction of distance between the oxides. According to the present invention, there is provided oxide dispersion copper having excellent hardness and tensile strength as well as electrical conductivity by performing spheronization and refinement for Ti-included oxide and thus further reducing the distance between oxides. | 06-30-2016 |
