| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 420473000 | Iron, manganese or nickel containing | 21 |
| 20090035174 | Copper Alloy for Electronic Materials - The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4≦[Ni+Co]/Si≦about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5≦Ni/Co≦about 2. | 02-05-2009 |
| 20090311129 | ABRASION RESISTANT SINTERED COPPER BASE CU-NI-SN ALLOY AND BEARING MADE FROM THE SAME - A Cu—Ni—Sn copper-based sintered alloy has a composition including 10 to 40% by mass of Ni, 5 to 25% by mass of Si, and the remainder containing Cu and inevitable impurities, and if necessary, 0.1 to 0.9% by mass of P, 1 to 10% by mass of C, 0.3 to 6% by mass of calcium fluoride or 0.3 to 6% by mass of molybdenum disulfide. In the structure of the alloy, a phase of a composition containing Cu | 12-17-2009 |
| 20090317290 | Multicomponent Copper Alloy and Its Use - The invention relates to a multicomponent copper alloy comprising [in % by weight]: Ni from 1.0 to 15.0%, Sn from 2.0 to 12.0%, Mn from 0.1 to 5.0%, Si from 0.1 to 3.0%, balance Cu and unavoidable impurities, if desired up to 0.5% of P, if desired individually or in combination up to 1.5% of Ti, Co, Cr, Al, Fe, Zn, Sb, if desired individually or in combination up to 0.5% of B, Zr, S, if desired up to 5% of Pb, and having Mn—Ni silicide phases which have a mass ratio of the elements [w(Mn)+w(Ni)]/w(Si) in the range from 1.8/1 to 7/1. | 12-24-2009 |
| 20100189593 | COPPER ALLOY MATERIAL - A copper alloy material consists of, by mass % Ti: 0.01-2.5%, Cr: 0.01-0.5%, Fe: 0.01% or more and less than 1%, and the balance Cu and impurities. The copper alloy possesses excellent strength, electrical conductivity, and workability without containing any environmentally harmful elements. These properties are attained by control of the total number and the diameter of precipitates and inclusions having a diameter of 1 μm, and control of the relationship between tensile strength TS (MPa) and electrical conductivity, IACS (%). The copper alloy material is a sheet and the relationship between tensile strength and the bending workability in a bad way B | 07-29-2010 |
| 20100310413 | COPPER ALLOY MATERIAL - A copper alloy material, containing Ni 1.8 to 5.0 mass % and Si 0.3 to 1.7 mass %, at a ratio of contents of Ni and Si, Ni/Si, of 3.0 to 6.0, and having a content of S of less than 0.005 mass %, with the balance of being Cu and inevitable impurities, wherein the copper alloy material satisfies formulae (1) to (4): | 12-09-2010 |
| 20110027122 | Cu-Ni-Si-Co-Cr System Alloy for Electronic Materials - The problem to be solved by the present invention is to provide a significant improvement in the properties in Cu—Ni—Co—Si alloy by adding Cr, i.e., to provide Corson alloys having high strength and high electrical conductivity. There is provided a copper alloy for electronic materials comprising 1.0 to 4.5 mass % of Ni, 0.50 to 1.2 mass % of Si, 0.1 to 2.5 mass % of Co, 0.003 to 0.3 mass % of Cr, with the balance being Cu and unavoidable impurities, the mass concentration ratio of the total mass of Ni and Co to Si ([Ni+Co]/Si ratio) satisfies the formula: 4≦[Ni+Co]/Si≦5, and with regard to Cr—Si compound whose size is 0.1 to 5 μm dispersed in the material, atomic concentration ratio of Cr to Si in the dispersed particle is 1-5, and area dispersion density thereof is more than 1×10 | 02-03-2011 |
| 20110038753 | COPPER ALLOY SHEET MATERIAL - A copper alloy sheet material which has a tensile strength of 730-820 MPa and contains at least nickel (Ni) and silicon (Si), with the remainder being copper (Cu) and inevitable impurities. When the sheet material has a shape capable of 180° tight bending and the width and thickness of this sheet material are expressed by W (unit: mm) and T (unit: mm) respectively, then the product of W and T is 0.16 or less. Preferably, the sheet material is constituted of an alloy containing nickel at 1.8-3.3 mass %, silicon at 0.4 mass %, and chromium (Cr) at 0.01-0.5 mass %, with the remainder being copper and inevitable impurities. The sheet material may further contain one or more of: at least one member selected among tin (Sn), magnesium (Mg), silver (Ag), manganese (Mn), titanium (Ti), iron (Fe), and phosphorus (P) in a total amount of 0.01-1 mass %; zinc (Zn) at 0.01-10 mass %, cobalt (Co) at and 0.01-1.5 mass %. | 02-17-2011 |
| 20120148439 | COPPER ALLOY - A copper alloy containing Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 μm; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%. | 06-14-2012 |
| 20120207642 | BRASS ALLOY - The invention relates to a brass alloy substantially consisting of copper and zinc. The alloy has at least one additional alloy component. A lead content is at most 0.1 weight percent. The zinc fraction is 40.5 to 46 weight percent. The alloy comprises a mixed crystal having fractions of an alpha micro structure and of a beta microstructure. The weight proportion of the beta microstructure is at least 30% and at most 70%. | 08-16-2012 |
| 20120237393 | Low Lead Alloy - A composition for a low lead ingot comprising primarily copper and including tin, zinc, sulfur, phosphorus, nickel. The composition may contain carbon. The low lead ingot, when solidified, includes sulfur or sulfur containing compounds such as sulfides distributed through the ingot. The presence and a substantially uniform distribution of these sulfur compounds imparts improved machinability and better mechanical properties. | 09-20-2012 |
| 20120237394 | Low Lead Brass Alloy - The present invention relates to a low lead brass alloy which ensures reduction of harmful to human health effects of lead that is useful for increasing machinability of brass raw material used in tapwares, valves and water meters, in the event of it's contact with water and which comprises less than 0.25% lead. The inventive brass alloy is an alloy which has machinability, is cost-efficient and environmentally friendly by means of its bismuth content. | 09-20-2012 |
| 20130022492 | CU-NI-SI-CO COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME - A Cu—Ni—Si—Co system alloy having an improved spring bending elastic limit is provided. The alloy is a copper alloy for electronic materials, which contains 1.0% to 2.5% by mass of Ni, 0.5% to 2.5% by mass of Co, and 0.3% to 1.2% by mass of Si, with the balance being Cu and unavoidable impurities, wherein from the results obtainable by an X-ray diffraction pole figure analysis using a rolled surface as a base, among the diffraction peak intensities of the {111}Cu plane with respect to the {200}Cu plane obtained by β scanning at α=35°, the peak height at a β angle of 90° of the copper alloy is at least 2.5 times the peak height of a standard copper powder. | 01-24-2013 |
| 20130045130 | COPPER ALLOY HAVING HIGH STRENGTH, HIGH ELECTRIC CONDUCTIVITY AND EXCELLENT BENDING WORKABILITY - The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. | 02-21-2013 |
| 20130224070 | COPPER ALLOY - To provide a copper alloy sheet excellent in the balance of strength and electroconductivity and excellent in the balance of strength and bending workability also. | 08-29-2013 |
| 20130294965 | ANTIMONY-MODIFIED LOW-LEAD COPPER ALLOY - Alloys and methods for forming alloys of copper, including red brass, and yellow brass, having sulfur and antimony. | 11-07-2013 |
| 20140147332 | White Antimicrobial Copper Alloy - Copper based alloys exhibiting a white/silver hue. The alloys contain copper, nickel, zinc, manganese, sulfur, and antimony. | 05-29-2014 |
| 20140193293 | COPPER ALLOY - Disclosed is a copper alloy containing 1.0% to 3.6% of Ni, 0.2% to 1.0% of Si, 0.05% to 3.0% of Sn, 0.05% to 3.0% of Zn, with the remainder including copper and inevitable impurities. The copper alloy has an average grain size of 25 pm or less and has a texture having an average area percentage of cube orientation of 20% to 60% and an average total area percentage of brass orientation, S orientation and copper orientation of 20% to 50%. The copper alloy has a KAM value of 0.8 to 3.0 and does not suffer from cracking even when subjected to U-bending. The copper alloy has excellent balance between strengths (particularly yield strength in a direction perpendicular to the rolling direction) and bending workability. | 07-10-2014 |
| 20140356224 | COPPER ALLOY - Provided is a copper alloy sheet excellent in strengths, electroconductivity, and bending workability. The copper alloy contains Cr of 0.10% to 0.50%, Ti of 0.010% to 0.30%, and Si of 0.01% to 0.10%, where a ratio (in mass) of the Cr content to the Ti content is from 1.0 to 30, a ratio (in mass) of the Cr content to the Si content is from 3.0 to 30, with the remainder including copper and inevitable impurities. The copper alloy includes grains that have an average major axis length of 6.0 μm or less and an average minor axis length of 1.0 μm or less as measured on a microstructure of the copper alloy in a plane surface perpendicular to a transverse direction by FESEM-EBSP analysis. | 12-04-2014 |
| 20150110668 | Cu-Ni-Si BASED COPPER ALLOY - A Cu—Ni—Si based copper alloy, comprising 1.2 to 4.5% by mass of Ni, 0.25 to 1.0% by mass of Si and the the balance Cu with inevitable impurities, wherein when an X-ray diffraction intensity of a {111} plane of a rolled surface and that of a {111} plane of a pure copper powder standard specimen is represented by I{111}, I | 04-23-2015 |
| 20160040270 | ELECTRIC AND ELECTRONIC PART COPPER ALLOY SHEET WITH EXCELLENT BENDING WORKABILITY AND STRESS RELAXATION RESISTANCE - An electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance is made from a copper alloy containing 1.5 to 4.0 percent by mass of Ni, Si satisfying a Ni/Si mass ratio of 4.0 to 5.0, 0.01 to 1.3 percent by mass of Sn, and the remainder composed of copper and incidental impurities, wherein the average crystal grain size is 5 to 20 μm, the standard deviation of the crystal grain size satisfies 2σ<10 μm, and the proportion of the number of particles having a particle diameter of 90 to 300 nm in Ni—Si dispersed particles having a particle diameter of 30 to 300 nm is 20% or more, where the particles are observed in a cross-section defined by a direction perpendicular to a sheet surface and a direction parallel to a rolling direction. | 02-11-2016 |
| 20160053349 | COMPOSITE ARTICLES COMPRISING SPINODAL COPPER-NICKEL-TIN-MANGANESE-PHOSPHORUS ALLOY MATRIX MATERIAL - A spinodal copper-nickel-tin-manganese alloy is disclosed that contains from 0.001 to about 2 weight percent phosphorus. When combined with small hard particles, the alloy has sufficient fluidity to infiltrate and fill at least 90% of the interstices of the hard particles, resulting in a composite article having superior strength and toughness. This composite article can be used in drilling bits and other cutting tools, either as a support body for cutting elements or as the cutting element itself. | 02-25-2016 |
