| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 414160000 |
Charging of chamber
| 61 |
| 414150000 |
Including driven device and/or inclined flow path to carry or convey material into, within, and out of chamber
| 19 |
| 414148000 |
With alarm, indicator, or signal | 3 |
| 20090116936 | SUBSTRATE PROCESSING APPARATUS - Provided is a substrate processing apparatus. The substrate processing apparatus includes a reaction tube, a substrate holder, a gas nozzle, a heating unit, a temperature detector, and an exhaust unit. The reaction tube accommodates and processes substrates. The substrate holder holds substrates stacked at predetermined intervals in the reaction tube. The gas nozzle is installed along a stacked direction of the substrates. The heating unit heats the substrates. The temperature detector is installed along the stacked direction of the substrates. The exhaust unit exhausts an inside atmosphere of the reaction tube. Each of the gas nozzle and the temperature detector includes first and second parts and is supported by a narrow tube supporting member including first and second supporting parts. The first supporting part makes contact with the first part. The second supporting part is parallel with the second part and supports the second part. | 05-07-2009 |
| 20130004266 | Device for Managing Solder Paste - A device for managing solder paste includes a storage room, a warm up room, a preparing room and a central control device, wherein the storage room, the warm up room and the preparing room respectively have a transportation unit for delivering a solder paste can. There are reading devices disposed respectively at an inlet/outlet of the above rooms for reading information of the solder paste can when the solder paste can passes thereby, and the central control device updates storage information for the solder paste cans. The central control device may access production information of a production line from a production managing system, and thus analyze the mold number and amount of solder paste cans, receive the solder paste cans based on a first-in, first-out manner, and deliver the solder paste cans to the warm up room for the warm up treatment. | 01-03-2013 |
| 20140064884 | Oven and Adjustable Baking System - An oven and an adjustable baking system are proposed. The oven includes a signal receiving module, a baking module, a detecting module, and a feedback module. The signal receiving module is used for receiving a ready-to-send signal sent by a developing apparatus in a previous process from the oven. The ready-to-send signal conveys information of preparing for transferring a glass substrate to the oven. The detecting module is used for detecting the robot to see if the robot takes the glass substrate out of the baking module. The feedback module is used for determining if a confirmation signal is sent back to the developing apparatus according to the detecting result from the detecting module. The confirmation signal conveys information that the developing apparatus should transfer the glass substrate to the feedback module. Because the transferring speed of a glass substrate transferred by the developing apparatus can be adjusted in the oven and the adjustable baking system of the present invention, no buffers are required, reducing equipment costs. In addition, the baking time of the oven is adjusted, which increases efficiency of baking | 03-06-2014 |
| 414209000 |
Discharging of chamber by driven device | 3 |
| 20110027050 | DEVICE FOR COKE OVEN CHAMBER PUSHING LOW IN HEAT EXCHANGE - A device for pushing the contents of a coke oven chamber includes a pusher ram head with pusher rams mounted there behind, wherein guiding plates or aprons are mounted to a pusher ram head which avoid a simultaneous pressing-in of air into the coke oven chamber, thus preventing a non-desired cooling-off of the coke oven chamber during pushing. The aprons also prevent the pusher ram and the rearward side of the pusher ram head from excessive heat burdens. The aprons can also serve for protecting measuring devices mounted in the enclosure. The aprons can be fabricated from a heat-resistant metallic or ceramic material. The aprons or the pusher ram head can also be provided with a heat-resistant or heat-reflecting coating or with heat-resistant or heat-reflecting tiles. Also shown is a method for pushing of coke oven chambers by applying the inventive device. | 02-03-2011 |
| 20160002539 | DEVICE FOR PRESSING COKE OUT OF AN OVEN CHAMBER OF A COKE OVEN - The present invention relates to a device for pressing coke out of an oven chamber of a coke oven, comprising an axially movable pressing rod and a pressing head arranged on the pressing rod at the end of the pressing rod. According to the present disclosure, the pressing head is supported on the pressing rod in such a way that the pressing head can be rotated about a horizontal axis. Furthermore, a swiveling device is provided in order to swivel the pressing head about the horizontal axis and thereby to adjust the vertical orientation of the pressing head to a possible inclined oven position of the oven chamber. | 01-07-2016 |
| 20140199137 | METHOD AND AN APPARATUS FOR REDUCING THE HEAT LOSS IN A HEATED WORKPIECE - A method of reducing the heat loss of a workpiece when the workpiece is displaced from a furnace to a tool includes displacing the workpiece resting on a carrier to the tool. The displacement takes place with the workpiece and the carrier located internally in a box with a heat reflecting inner side. At the tool, the workpiece is exposed. An apparatus for carrying the method into effect his according to the present invention, a box with a heat reflecting inner side and a linear conveyor for insertion and removal of the carrier and the workpiece into and out of the box, respectively. | 07-17-2014 |
| 414149000 |
Driven, rotatable chamber | 1 |
| 20090047102 | Device for charging alternative fuels into a rotary kiln and method for charging such alternative fuels and/or waste products - In a device for charging lumpy alternative fuels and/or waste products into a rotary kiln at a location situated between the charging end and the discharging end of the rotary kiln, wherein a closable opening is provided in the jacket of the rotary kiln, the opening carries an inwardly opening flap which is spring-loaded in the sense of closing, and a lifting device such as, e.g., a fork adjoins the opening in a substantially radial direction, from which lifting device the fuels or waste products to be charged are dischargeable into the rotary kiln under the action of gravity while overcoming the closing force of the flap. | 02-19-2009 |
| 414216000 |
Discharging of chamber by gravity, and means beyond exit thereof to guide, move, or stop material | 1 |
| 20110286817 | METHOD AND APPARATUS FOR THE CONVEYANCE OF MATERIAL OUT OF A COMBUSTION BOILER - A method and a device are involved in feeding hot material from a combustion boiler including at least one housing, at least one conveyor belt and at least one redirecting device, wherein the at least one conveyor belt first feeds the material with a first horizontal directional component and after passage through the redirecting device the material is fed with at least a second horizontal directional component that deviates from the first. Also, the material with the first directional component outside the redirecting device is continuously separated from the material with the second directional component. Additionally, the first directional component and the second directional component span an angle of 135° to 180°. | 11-24-2011 |
| Entries |
| Document | Title | Date |
|---|
| 20080286075 | Method for producing semiconductor device, and substrate processing apparatus - Disclosed are a method for producing a semiconductor device and a substrate processing apparatus. The method comprises a step of carrying a substrate into a processing chamber, a step of feeding a material gas into the processing chamber to thereby form a high dielectric constant film on the substrate, a step of carrying the substrate after film formation thereon out of the processing chamber, and a step of feeding an O | 11-20-2008 |
| 20080292430 | DEVICE FOR DOPING, DEPOSITION OR OXIDATION OF SEMICONDUCTOR MATERIAL AT LOW PRESSURE - A device for doping, deposition or oxidation of semiconductor material at low pressure in a process tube, is provided with a tube closure as well as devices for supplying and discharging process gases and for generating a negative pressure in the process tube. A closure of the process chamber that is gas tight with respect to the process gases and the vacuum tight seal of the end of the tube closure are spatially separated from each other in relation to the atmosphere and are arranged on a same side of the process tube in such a manner that a bottom of a stopper, sealing the process chamber, rests against a sealing rim of the process tube and the tube closure end is sealed vacuum tight by means of a collar, which is attached to the process tube and against which a door rests sealingly. | 11-27-2008 |
| 20090016853 | IN-LINE WAFER ROBOTIC PROCESSING SYSTEM - A system for processing semiconductor wafers, includes a plurality of front opening unified pods (FOUPs), loadlocks for receiving the plurality of wafers, a plurality of process chambers configured to perform processing steps and or measurement steps on the wafers, loadlock cooling stations for receiving the wafers from the processing chambers and a transport chamber interconnecting the loadlocks, cooling chambers and process chambers. A first multi-axis robot transfers wafers between the FOUPs, loadlocks and loadlock cooling stations, at an ambient pressure. A second multi-axis robot tranfers wafers between the loadlocks, process chambers and the loadlock cooling stations, and is adapted to operate in a transport chamber at a pressure that is different from the ambient pressure. | 01-15-2009 |
| 20090060686 | SUBSTRATE TRANSPORT APPARATUS AND HEAT TREATMENT APPARATUS - A chilled arm that transports a substrate to and from a heating plate for performing a heating process on the substrate is formed with a flow passage pipe therein, and cools the entire holding area thereof opposed to the substrate held by the chilled arm to a predetermined reference temperature by supplying circulating cooling water through the flow passage pipe. Six polyimide heaters are affixed to the holding area to control the temperature of at least a portion of the holding area at a temperature different from the reference temperature. These two temperature control mechanisms intentionally provide a temperature distribution to the holding area to thereby provide an intentional temperature distribution to the substrate before and after the heat treatment by the heating plate. This reduces the nonuniformity of a temperature distribution which typically occurs in the heating plate to accomplish a uniform heat treatment throughout the heat treatment process step. | 03-05-2009 |
| 20090269170 | Panels-Off Coating Process and Carrier Utilizing Panel Rotation - A panels-off painting process and system adapted for use with a plurality of workpieces includes a carrier having a main platform, stationary support structures, and at least one rotatable assembly interconnected to the platform, configured so as to be caused to shift at least a portion of the workpieces between first and second orientations, and including a counterbalance that reduces the force necessary to cause the shift, and preferably further includes a retrofitted robotic arm programmably configured to apply a coat to the workpieces and subsequently engage the assembly so as to cause the shift. | 10-29-2009 |
| 20100119337 | Thermal Processing System and Method of Using - Embodiments of the invention provide a thermal processing system and methods for uniformly heating and/or cooling a semiconductor wafer. Embodiments of the invention may be applied to provide a more uniform temperature profile when processing 300 mm and larger wafers having different curvature profiles that occur at the same and/or different points in a manufacturing cycle. Wafer curvature can be dependent on the number and thickness of the metal layers. | 05-13-2010 |
| 20160118280 | BUFFER STATION FOR THERMAL CONTROL OF SEMICONDUCTOR SUBSTRATES TRANSFERRED THERETHROUGH AND METHOD OF TRANSFERRING SEMICONDUCTOR SUBSTRATES - A buffer station for thermal control of semiconductor substrates in a semiconductor substrate processing system is configured to interface with first and second vacuum transfer modules of the system so as to allow substrates to be transferred therebetween. The buffer station comprises a first vacuum transfer module interface configured to allow substrates to be transferred between the first vacuum transfer module and the buffer station, and a second transfer module interface configured to allow substrates to be transferred between the second vacuum transfer module and the buffer station. At least one buffer chamber between the first and second vacuum transfer module interfaces includes a lower pedestal configured to receive a substrate on a support surface thereof. One or more semiconductor substrate storage shelves are above the lower pedestal. Each shelf is configured to receive a substrate from the first or second vacuum transfer module and store the respective substrate thereon. | 04-28-2016 |
