| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 392411000 | Lamp banks (i.e., array of plural lamps) | 52 |
| 20080298786 | FILAMENT LAMP AND LIGHT IRRADIATION TYPE HEAT TREATMENT DEVICE - To provide a filament lamp and light irradiation type heat treatment device that eliminates device-by-device variation of the irradiation-intensity distribution on the article to be treated, a filament lamp ( | 12-04-2008 |
| 20080298787 | FILAMENT LAMP AND LIGHT-IRRADIATION-TYPE HEAT TREATMENT DEVICE - A filament lamp includes multiple filament assemblies having filaments connected to paired leads, arrayed in order within a light emitting tube and following a tube axis thereof. Each lead is electrically connected in a seal area. Each filament is powered independently. The light emitting tube includes insulating walls or inner tubes between the filaments and leads that have openings through which the leads pass, and located along the tube axis in proximity to the inner wall of the light emitting tube. Multiple lead accommodation spaces corresponding to the number of leads are provided in the light emitting tube by the insulating walls with each lead passing through an opening in the insulating wall and placed without short circuits in its lead accommodation space. | 12-04-2008 |
| 20090041443 | Backside Rapid Thermal Processing of Patterned Wafers - Apparatus and methods of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP) apparatus and methods are disclosed. An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer. In one or more embodiments, the front side of the wafer on which the patterned integrated circuits are being formed faces a radiant reflector. In one or more embodiments, the wafer is thermally monitored for temperature and reflectivity from the side of the reflector. | 02-12-2009 |
| 20090103905 | FILAMENT LAMP AND HEAT TREATMENT DEVICE OF THE LIGHT IRRADIATION TYPE - Filament lamps whose individual filament coils can be set to specific temperatures in filament lamps that are supplied with electric power independently and to provide a heat treatment device of the light irradiation type that uses said lamps. Inside of a light emitting tube of each lamp, which has the hermetically sealed portions at each end, are multiple filament modules which have been made by linking pairs of leads which supply electrical power to both ends of coiled filaments and individual filaments that are placed so that they extend along the axis of the light emitting tube. In the electrically connected filament lamps, whose individual leads are connected to the respective electrically conductive material placed in the hermetically sealed portions, at least one of the individual filaments is made up of a single wire and at least two are made up of bundled wires with the single wire being located between the bundled wires. | 04-23-2009 |
| 20090116824 | LIGHT IRRADIATION TYPE HEAT TREATMENT DEVICE - Light irradiation type heat treatment device composed of a plurality of lamps, including multi-filament lamps, the filaments of which can be independently supplied with power. The filaments are divided into a plurality of filament groups composed of filaments of one lamp put together with filaments of other lamps. Power control units are provided for each group, and drive units are provided corresponding to the power control units. The drive units adjust the electric power supplied from the power supply according to a command from the power control units to supply power to each filament belonging to the group. In a preferred arrangement, the plurality of lamps are arranged in parallel with at least one filament within each lamp having a length so as to form a concentric circle with filaments of other lamps arranged in parallel and the filaments forming the concentric circle are divided into a plurality of filament groups. | 05-07-2009 |
| 20090214193 | LIGHT EMISSION TYPE HEATING METHOD AND LIGHT EMISSION TYPE HEATING APPARATUS - A light emission type heating apparatus comprises a first lamp unit which includes two or more lamps, in which at least one of the lamps includes two or more filaments in its light emission bulb, and intensity of light emitted from each filament is independently controlled, and a second lamp unit which is made up of two or more lamps, and wherein the lamps of the first lamp unit are grouped, in each of which a filament of at least one of the lamps and a filament of another one of the lamps are arranged to form groups, wherein a temperature of the workpiece is detected, and electric power to be applied to each of the groups of filaments is controlled based on the detected temperature of the workpiece. | 08-27-2009 |
| 20100054718 | APPARATUSES AND METHOD FOR DECORATING OBJECTS - An apparatus for decorating includes a kiln provided with a heating chamber for receiving the objects and a carriage for transferring the objects from a more distant position from the chamber to a position nearer to the chamber. The carriage includes a resting arrangement for restingly receiving the objects and configured to serve as a bottom of the heating chamber in the nearer position. | 03-04-2010 |
| 20100054719 | FILAMENT LAMP AND LIGHT IRRADIATION HEAT TREATMENT DEVICE - A filament lamp has a bulb comprised of a straight light emitting tube from which a pair of flat hermetically sealed portions extend, a plurality of coiled filaments arranged within the light emitting tube, in the tube axis direction a pair of internal leads are connected to ends of the filament by a respective one of a plurality of metal foils that are embedded in the hermetically sealed portions, and external leads are connected to the metal foils. The width of metal foils embedded in the hermetically sealed portions is increased so as not to cause them to melt even when an electric current to be supplied to the filament lamp is increased, the hermetically sealed portions being made wider than the external diameter of the light emitting tube and the width between outer margins of the metal foils in a direction at right angles of the tube axis is greater than the internal diameter of the light emitting tube. | 03-04-2010 |
| 20100111511 | USE OF INFRARED CAMERA FOR REAL-TIME TEMPERATURE MONITORING AND CONTROL - Embodiments of the invention generally contemplate an apparatus and method for monitoring and controlling the temperature of a substrate during processing. One embodiment of the apparatus and method takes advantage of an infrared camera to obtain the temperature profile of multiple regions or the entire surface of the substrate and a system controller to calculate and coordinate in real time an optimized strategy for reducing any possible temperature non-uniformity found on the substrate during processing. | 05-06-2010 |
| 20100209082 | HEATING LAMP SYSTEM - Embodiments of the invention generally relate to apparatuses for chemical vapor deposition (CVD) processes. In one embodiment, a heating lamp assembly for a vapor deposition reactor system is provided which includes a lamp housing disposed on an upper surface of a support base and containing a first lamp holder and a second lamp holder and a plurality of lamps extending from the first lamp holder to the second lamp holder. The plurality of lamps may have split filament lamps and/or non-split filament lamps, and in some examples, split and non-split filament may be alternately disposed between the first and second lamp holders. A reflector may be disposed on the upper surface of the support base between the first and second lamp holders. The reflector may contain gold or a gold alloy. | 08-19-2010 |
| 20100220983 | INFRARED FURNACE SYSTEM - An infrared furnace system provides for adjusting the amount of time a workpiece spends in a respective section of the furnace while at the same time minimizing the footprint, i.e., the amount of floor space that the furnace uses. Various embodiments allow for optimizing the required thermal duration of each section which then also optimizes the heating and/or cooling profile within each section. Transfer conveyors are provided to transfer a workpiece from one conveyor operating at a first speed to a second conveyor operating at a second speed, different from the first speed in order to prevent damage to the workpiece. Rollers are provided to support the workpiece and to maintain a proper orientation. A heating lamp support assembly provides power to the lamp and facilitates exchange and replacement of the lamp. An air delivery system provides process gas maintained at the correct temperature. An exhaust system provides air flow with improved turnover and reduced noise considerations. Infrared heating lamps are cooled by providing gas flow across the end terminals. The wavelength of light emitted by the heating lamps is adjusting by controlling parameters of the process gas being introduced into a section of the furnace. | 09-02-2010 |
| 20110002674 | THERMAL PROCESSING APPARATUS - Disclosed is a heat treatment apparatus for conducting heat treatments such as annealing at a temperature not less than 400° C. on an object such as a silicon wafer. The apparatus comprises a process chamber ( | 01-06-2011 |
| 20110002675 | DIGITAL HEAT INJECTION BY WAY OF SURFACE EMITTING SEMI-CONDUCTOR DEVICES - A method and system are provided for digitally injecting heat into a wide range of products by way of incorporation of a special class of semi-conductor lasers, e.g. surface emitting devices. This technique relates to a more specific, economical, and advantageous way of practicing the art of directly injecting narrowband radiant energy that desirously matches the absorption specification of a particular material at a specified wavelength. | 01-06-2011 |
| 20110002676 | HEATER BLOCK OF RAPID THERMAL PROCESS APPARATUS - Disclosed is a separation type heater block of a rapid thermal processing apparatus, including a lamp housing formed in a plate shape, and provided with a plurality of lamp insertion holes, into which heating lamps are respectively inserted; a socket housing, into which sockets of the heating lamps are inserted, separably covered on the lamp housing; and a reflector housing provided with light emission holes at positions corresponding to the lamp insertion holes, separably installed under the lamp housing such that lower ends of the heating lamps are respectively inserted into the light emission holes, side walls of the light emission holes serving as barriers, wherein a cooling water channel, through which cooling water flows, is formed through the side walls of the light emission holes of the reflector housing. | 01-06-2011 |
| 20110013892 | Rapid Thermal Firing IR Conveyor Furnace Having High Intensity Heating Section - High reflectance element IR lamp module and method of firing multi-zone IR furnaces for solar cell processing comprising lamps disposed backed by a flat or configured plate of ultra-high reflectance ceramic material. Optionally, the high reflectance plate can be configured with ripples or grooves to isolate each lamp from adjacent lamps in the process zone. Furnace cooling air is exhausted and recycled upstream for energy conservation. Lamp spacing can be varied and power to each lamp individually controlled to provide infinite control of temperature profile in each heating zone. The high reflectance element may be constructed of dense ceramic fiber board, and then coated with high reflectance ceramic composition, and baked or fired to form the finished element. | 01-20-2011 |
| 20110052159 | APPARATUS FOR UNIFORM THERMAL PROCESSING - An apparatus of thermal processing is provided. A heating lamp and a reflector are disposed over a wafer and the heat flux distribution on the wafer generated by the individual heating lamp is measured and adjusted. A set of heating lamps formed by heating lamps is disposed over the wafer. The heating lamps are in concentric rings and arranged as an axi-symmetric array. The relative position between the set of heating lamps and the wafer is adjusted so that the wafer center is at the position with local mean heat flux from lamps between the most inner lamp subset and its adjacent lamp subset. Followed by adjusting the heating powers, either or both of the wafer and the set of heating lamps are rotated respect to the center of the wafer, so as to improve uniformity of the heat flux distribution on the heated object. | 03-03-2011 |
| 20110058797 | Halogen Water Heater - A fluid heating apparatus includes a housing containing a flattened tube and lamps. The apparatus further includes a first conduit flow-coupled to the flattened tube, the first conduit being adapted to provide fluid to the flattened tube. The apparatus further includes a second conduit flow-coupled to the flattened tube, the second conduit being adapted to channel fluid from the flattened tube. The lamps are arranged to irradiate the flattened tube, and the flattened tube is adapted to absorb radiation from the lamps and heat fluid contained therein. | 03-10-2011 |
| 20110206358 | High Efficiency High Accuracy Heater Driver - A rapid thermal process chamber having a lamp driver circuit that includes two transistors and two diodes is described. The rapid thermal process chamber includes a plurality of halogen lamps, the lamp driver, a temperature sensor that measures wafer temperature, a temperature controller connected to the temperature sensor and to the lamp driver, the temperature controller providing control signals to the lamp driver that are functions of the wafer temperature and a desired temperature. The lamp driver includes two transistors that are controlled by the control signals so that the power factor of the power supplied to the plurality of halogen lamps is in the range of 0.9 to 1. | 08-25-2011 |
| 20110222840 | Heating Configuration For Use in Thermal Processing Chambers - An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers. | 09-15-2011 |
| 20110255848 | APPARATUS AND METHOD FOR CONTROLLING HEATING LAMP OF RAPID HEAT TREATMENT EQUIPMENT - The method of the present invention for controlling a heating lamp of rapid heat treatment equipment comprises: a step wherein a heating lamp group is divided into a plurality of subgroups to determine graphical data regarding input voltage versus the reference input current that is applied to the subgroups uniformly; a step wherein actual input current respectively applied to each group is measured to obtain graphical data regarding input voltage versus actual input current; a step wherein a difference value for calibration of each subgroup is obtained from the difference between the reference input current and the actual input current; and a step wherein the difference value for calibration is reflected to apply a voltage to said subgroup individually. According to the present invention, substrate heating takes place uniformly because differences of calibration are reflected in actual input current to apply a voltage to a subgroup. | 10-20-2011 |
| 20110274417 | IRRADIANCE PULSE HEAT-TREATING METHODS AND APPARATUS - A method of heat-treating a workpiece includes generating an initial heating portion and a subsequent sustaining portion of an irradiance pulse incident on a target surface area of the workpiece. A combined duration of the initial heating portion and the subsequent sustaining portion is less than a thermal conduction time of the workpiece. The initial heating portion heats the target surface area to a desired temperature and the subsequent sustaining portion maintains the target surface area within a desired range from the desired temperature. Another method includes generating such an initial heating portion and subsequent sustaining portion of an irradiance pulse, monitoring at least one parameter indicative of a presently completed amount of a desired thermal process during the irradiance pulse, and modifying the irradiance pulse in response to deviation of the at least one parameter from an expected value. | 11-10-2011 |
| 20120045190 | VACUUM HEATING DEVICE AND VACUUM HEAT TREATMENT METHOD - A uniform voltage is applied to loads even to other than a multiple of three loads made of heating lamps connected in parallel to each other, without causing any burden on a primary side. The number of loads is divided into a multiple of three and a multiple of two. A three-phase AC voltage is applied to three primary windings, which are connected as a Y-connection or a Δ-connection. Secondary windings, which are each magnetically coupled to a primary winding of a plurality of three-phase transformers and have the same number of turns, are connected with the multiple of three loads. The number of turns of the M-seat primary winding of a Scott transformer is divided into two at a midpoint, to which an end of the T-seat primary winding having a number of turns equal to (√3)/2 times that of the M-seat primary winding, is connected and to which the three-phase AC voltage is applied. The M-seat primary winding and the T-seat primary winding in at least one Scott transformers are each magnetically coupled with each of the secondary windings having the same number of turns. The multiple of two loads are connected to the secondary windings so that no secondary windings appear without a load connected thereto. Thus, an AC voltage can be uniformly applied to the heating lamps without increasing any burden on the primary side. | 02-23-2012 |
| 20120093492 | APPARATUS FOR AND METHOD OF HEAT-TREATING THIN FILM ON SURFACE OF SUBSTRATE - A semiconductor wafer having a surface with a thin film formed thereon is transported into a chamber and held by a holder. After an atmosphere provided in the chamber is replaced, flashes of light are directed from flash lamps in a light irradiation part toward the semiconductor wafer to perform a baking process on the thin film. The irradiation of the semiconductor wafer with light from halogen lamps in the light irradiation part also starts at the same time as the irradiation thereof with the flashes of light. The flashes of light emitted for an extremely short period of time and having a high intensity allow the surface temperature of the thin film to rise momentarily. This prevents the occurrence of abnormal grain growth resulting from prolonged baking in the film. | 04-19-2012 |
| 20120106934 | DIFFUSION FURNACE - A diffusion furnace is disclosed, which includes an outer housing, an inner housing, and a plurality of infrared heating elements. The inner housing is arranged within the outer housing, and a chamber is formed inside of the inner housing. A portion of each infrared heating element is arranged on the outer housing. Each of the infrared heating elements has a heating portion and at least one fixing portion connected thereto. The heating portion of each infrared heating element is arranged within the outer housing. The fixing portion of each infrared heating element is secured onto the outer housing. Therefore, the heating elements would neither distort nor have any issues in staying secured to the furnace. Moreover, the furnace can be cooled down more quickly after operation. | 05-03-2012 |
| 20120106935 | HEATING LAMP SYSTEM AND METHODS THEREOF - Embodiments of the invention generally relate to apparatuses and methods for chemical vapor deposition (CVD). In one embodiment, a heating lamp assembly for a CVD reactor system is provided which includes a lamp housing disposed on an upper surface of a support base and containing a plurality of lamps extending from a first lamp holder to a second lamp holder. The lamps may have split filament lamps and/or non-split filament lamps, and in some examples, split and non-split filament may be alternately disposed between the first and second lamp holders. A reflector may be disposed on the upper surface of the support base between the first and second lamp holders. In another embodiment, the method includes exposing a lower surface of a wafer carrier to energy emitted from the heating lamp assembly and heating the wafer carrier to a predetermined temperature. | 05-03-2012 |
| 20120114317 | APPARATUS AND METHOD FOR PROCESSING SEALANT OF AN INSULATING GLASS UNIT - A method and apparatus for heating and/or pressing sealant of an insulating glass unit. The apparatus may include an oven and a press. The oven includes a detector that detects an optical property of the insulating glass unit. The detected optical property is used to regulate the amount of energy applied to the insulating glass unit to adjust the amount of energy applied to the sealant. The press may include a displacement transducer that detects a pre-pressed thickness of the insulating glass unit. The measured pre-pressed thickness is used to automatically select a press thickness from a set of pressed IGU thicknesses. | 05-10-2012 |
| 20120207456 | HEATER BLOCK FOR A RAPID THERMAL PROCESSING APPARATUS - The present invention relates to a heater block for a rapid thermal processing apparatus, and more particularly, to a heater block in which heating lamps are densely arranged in a tessellation. The tessellation has a structure such that the plurality of heating lamps are arranged at right angles to form a zigzag line, and the thus-formed zigzagged line is repeated such that the zigzagged line is combined with the adjacent zigzagged line. According to the present invention, a temperature gradient caused by a void between heating lamps is prevented, and heating lamps are densely arranged to increase heat density for a heat radiation area as opposed to conventional heater blocks, thus achieving improved heat treatment efficiency using less energy. In addition, fully uniform temperature control is enabled, in terms of sector allocated temperature control, even when the area to be independently controlled is enlarged as opposed to conventional heater blocks, thereby simplifying the configuration of a temperature control circuit. | 08-16-2012 |
| 20120213499 | HEATER BLOCK FOR A RAPID THERMAL PROCESSING APPARATUS IN WHICH A COOLING WATER FLOW IS DIVIDED INTO AN UPPER LAYER AND A LOWER LAYER - The present invention relates to a heater block for a rapid thermal processing apparatus, wherein a plurality of lamp pockets ( | 08-23-2012 |
| 20120315023 | CAPILLARY COLUMN CURING SYSTEM - A curing system comprising an oven which may be usefully employed in the fabrication of long polymer columns of various morphologies and formats is described. In accordance with an exemplary arrangement the invention relates to a curing system comprising an oven that allows for the formation of very long capillary columns. | 12-13-2012 |
| 20130011125 | Rolling lumens heating systems(5) - This is an invention which replaces the costly use of combustible fuels to provide heating for all types of structures including homes, businesses, commercial buildings and various other types of structures. By eliminating the use of combustible fuels, the cost to the consumer is significantly reduced and the amount of pollutants released into the atmosphere is eliminated as well. The “Rolling Lumens Heater” utilizes the lumens generated by light bulbs to heat the air in a chamber which is then pushed by a fan into the area which requires heat. The end result is an area which is heated to and maintains a temperature of 70 degrees. | 01-10-2013 |
| 20130223824 | HEATING LAMP HAVING BASE TO FACILITATE REDUCED AIR FLOW ABOUT THE HEATING LAMP - Embodiments of heating lamps and heating lamp arrays are disclosed herein. In some embodiments, a heating lamp may include a heating lamp envelope having a filament disposed within the heating lamp envelope; a base coupled to the heating lamp envelope to support the heating lamp envelope; and one or more recesses formed in the base to provide an improved grip for a user. In some embodiments, a heating lamp array for use in a semiconductor process chamber may include a plurality of heating lamps, each heating lamp comprising a heating lamp envelope having a filament disposed within the envelope and a base coupled to the heating lamp envelope to support the envelope, the base having one or more recesses formed in the base to provide an improved grip for a user, wherein a distance between adjacent heating lamp bases is about 0.02 inches to about 0.08 inches. | 08-29-2013 |
| 20130287376 | HEATER BLOCK AND HEAT TREATMENT APPARATUS HAVING THE SAME - A heater block according to the present invention comprises a light-emitting lamp; a concave reflecting member that is placed opposite the lamp and has a concave reflecting surface at one surface faced with the lamp; a lens module that is inserted into the concave reflecting member and has at least one lens; and a flat reflecting member that is placed opposite the lens module. According to embodiments of the present invention, light emitted from the lamp is reflected by the concave reflecting member. Then, light and heat are collected from the reflected light by the flat reflecting member and the lens module and are irradiated on a substrate. That is, light having energy greater than a conventional manner is irradiated on the substrate to enhance the instant heating temperature and temperature increasing rate of substrate and to increase a heat-focusing area. Therefore, it has an advantage that the productivity of semiconductor or display device manufacture that requires a rapid thermal process is improved. | 10-31-2013 |
| 20130287377 | DIRECT CURRENT LAMP DRIVER FOR SUBSTRATE PROCESSING - Methods and apparatus for heating a substrate in a process chamber are provided herein. In some embodiments, an apparatus for heating a substrate in a process chamber includes a lamp group comprising one or more sets of lamps to provide radiant energy to heat a substrate when disposed in the process chamber, wherein each set of lamps comprises a plurality of lamps wired in series, and wherein each set of lamps is wired in parallel with respect to other sets of the one or more sets of lamps; an alternating current (AC) power source to produce an AC input waveform; and a lamp driver to power the lamp group, the lamp driver including a rectifier coupled to the AC power source to convert the AC input waveform to DC voltage; and a direct current to direct current (DC/DC) converter to reduce voltage of the DC power. | 10-31-2013 |
| 20130294756 | APPARATUS FOR SUBSTRATE TREATMENT AND HEATING APPARATUS - The present invention relates to an apparatus for heat-treating a substrate, and more particularly to an apparatus for substrate treatment to perform a heat treatment of a substrate for a flat panel display panel. | 11-07-2013 |
| 20130308928 | HEATER BLOCK AND A SUBSTRATE TREATMENT APPARATUS - The present invention relates to a heater block and a substrate treatment apparatus, and more particularly to a heater block to perform heat treatment on a substrate and a substrate treatment apparatus having the same. According to embodiments of the present invention, it is provided a heater block for a substrate treatment apparatus having heating lamps on its one side to transfer heat to a target subjected to heat treatment, the heating lamps having different arrangement patterns in a plurality of regions on said one side. | 11-21-2013 |
| 20140178056 | APPARATUS AND METHOD FOR BAKING SUBSTRATE - The present invention discloses an apparatus for baking a substrate. The apparatus includes a supporting platform, a plurality of supporting pins, a heating unit, and a thermal insulation layer. The supporting platform has a supporting surface and a bottom surface. The supporting pins are disposed in the supporting platform, and the supporting pins are capable of movably protruding from the supporting surface to lift the substrate up. The heating unit is utilized to heat the substrate. The thermal insulation layer is disposed opposite to the bottom surface of the supporting platform and utilized to prevent the heating unit from heating the supporting platform. The present invention further discloses a method for baking a substrate, and the method can effectively prevent a Mura defect appearing on the substrate. | 06-26-2014 |
| 20140241707 | INTEGRATED SOLUTION FOR SOLID STATE LIGHT SOURCES IN A PROCESS CHAMBER - Apparatus for providing pulsed or continuous energy in a process chamber, and methods of fabricated said apparatus, are provided herein. The apparatus may include a substrate having a plurality of electrical terminals disposed on one or more surfaces of the substrate, a plurality of solid state sources grown on top of the plurality of electrical terminals, the plurality of solid state sources providing pulsed or continuous energy when electrically powered, and one or more cooling channels formed in one or more areas of the substrate. | 08-28-2014 |
| 20140255013 | LAMPHEAD PCB WITH FLEXIBLE STANDOFFS - The embodiments described herein generally relate to a flexible standoff for use with a lamphead assembly in a thermal processing chamber. In one embodiment, the lamphead assembly can include a lamphead with one or more fixed lamphead positions, a lamp bulb, a lamp base with a standoff contact adaptor and a flexible standoff capable of attaching and positioning the lamp assembly. The flexible standoff can include a socket configured to receive a lamp base of a lamp assembly, a housing configured to position a lamp bulb of a lamp assembly in thermal connection with a processing chamber, a contact adaptor configured to electrically connect to a power supply and a conductive material to electrically connect the socket and the contact adaptor. | 09-11-2014 |
| 20140270732 | HEATING LAMP ASSEMBLY - Embodiments of heating lamps and heating lamp assemblies are disclosed herein. In some embodiments, a heating lamp may include a bulb; a reflector circumscribing the bulb proximate a first end of the bulb; a base coupled to the reflector on a side opposite the bulb; a handle coupled to the base on a side opposite the reflector, wherein the handle comprises a body having a first end coupled to the base and an opposing second end; a first conductor extending from the bulb and through the base and the handle in a direction opposite the bulb; and a second conductor extending from the bulb and through the base and the handle in a direction opposite the bulb. | 09-18-2014 |
| 20140270733 | HEATING DEVICE FOR THE TEMPERING OF PREFORMS - A heating device for tempering preforms before processing in a stretch blow device. The heating device includes a heating alley with a plurality of infra red emitters, arranged parallel to the longitudinal axis of the tempered preforms. At least one back reflector and/or one filter is assigned to the infra red emitters, whereby the at least one back reflector and/or the at least one filter is segmented. | 09-18-2014 |
| 20140328579 | METHOD AND SYSTEM FOR MONITORING ULTRAVIOLET LIGHT FOR A FIBER CURE SYSTEM - A system and method for monitoring and operating one or more light emitting devices is disclosed. In one example, light intensity within a dual elliptical reflecting chamber is sensed and operation of a fiber curing system is adjusted in response to an amount of sensed light energy. | 11-06-2014 |
| 20140328580 | METHOD AND SYSTEM FOR DETERMINING CURING TUBE CLARITY - A system and method for monitoring a fiber curing system is disclosed. In one example, transmittance of a curing tube is determined so that curing of a coating applied to a fiber may be more uniform. | 11-06-2014 |
| 20140334805 | SYSTEM AND/OR METHOD FOR HEAT TREATING CONDUCTIVE COATINGS USING WAVELENGTH-TUNED INFRARED RADIATION - Certain example embodiments relate to systems and/or methods for preferentially and selectively heat treating conductive coatings such as ITO using specifically tuned near infrared-short wave infrared (NIR-SWIR) radiation. In certain example embodiments, the coating is preferentially heated, thereby improving its properties while at the underlying substrate is kept at low temperatures. Such techniques are advantageous for applications on glass and/or other substrates, e.g., where elevated substrate temperatures can lead to stress changes that adversely effect downstream processing (such as, for example, cutting, grinding, etc.) and may sometimes even result in substrate breakage or deformation. Selective heating of the coating may in certain example embodiments be obtained by using IR emitters with peak outputs over spectral wavelengths where the conductive coating (or the conductive layer(s) in the conductive coating) is significantly absorbing but where the substrate has reduced or minimal absorption. | 11-13-2014 |
| 20140355972 | METHODS AND APPARATUS FOR INCREASING ACCURACY OF RMS MEASUREMENTS OF SIGNALS WITH A HIGH CREST FACTOR - Methods and apparatus for determining the root-mean-square (RMS) voltage of an input voltage are provided herein. In some embodiments, an apparatus for determining the root-mean-square (RMS) voltage of an input voltage includes an amplifier to modify an amplitude of the input voltage signal; an amplitude detector, coupled to the amplifier, to transform the spectrum of the modified input voltage signal so that an increased portion of the signal is disposed within a desired frequency region; and a root-mean-square (RMS) converter, coupled to the amplitude detector, to determine the RMS voltage of the transformed input voltage signal, wherein a bandwidth of the RMS converter includes the desired frequency region. | 12-04-2014 |
| 20150147053 | EASY ACCESS LAMPHEAD - Embodiments described herein generally relate to an improved power distribution assembly for a lamphead assembly used in a thermal processing chamber. In one embodiment, the lamphead assembly includes a plurality of lamps for thermal processing of semiconductor substrates, and a power distribution assembly having a plurality of openings, the power distribution assembly provides power to the plurality of lamps, and each opening is sized to allow passage of the lamp therethough. | 05-28-2015 |
| 20160007413 | HEATING PLANT FOR CONTAINER PREFORMS - A heating plant ( | 01-07-2016 |
| 20160113061 | APPARATUS FOR THERMAL TREATMENT OF AN INNER SURFACE OF A TUBULAR OR OTHER ENCLOSED STRUCTURE - A heat treatment apparatus for heat treating an interior surface of a longitudinally extending cavity of a target structure has a processing head which comprises a longitudinally extending central support member and distal and proximal end caps protruding laterally from the central support member. Each end cap has a plurality of apertures configured to respectively receive distal and proximal ends of elongated plasma arc lamps and position the plasma arc lamps to extend longitudinally along and laterally around the central support member such that radiation emitted collectively by the plasma arc lamps is directed generally radially outwards from the processing head. The processing head also comprises a coolant pathway having heat exchange zones in thermal communication with the plasma arc lamps and coolant supply and return conduits in fluid communication with the heat exchange zones. | 04-21-2016 |
| 20160130724 | HEATING LAMP SYSTEM - Embodiments of the invention generally relate to apparatuses for chemical vapor deposition (CVD) processes. In one embodiment, a heating lamp assembly for a vapor deposition reactor system is provided which includes a lamp housing disposed on an upper surface of a support base and containing a first lamp holder and a second lamp holder and a plurality of lamps extending from the first lamp holder to the second lamp holder. The plurality of lamps may have split filament lamps and/or non-split filament lamps, and in some examples, split and non-split filament may be alternately disposed between the first and second lamp holders. A reflector may be disposed on the upper surface of the support base between the first and second lamp holders. The reflector may contain gold or a gold alloy. | 05-12-2016 |
| 20160169536 | RADIATION HEATER ARRANGEMENT | 06-16-2016 |
| 20170232654 | Thermoregulation system of rotating metal cylinders in plants for extrusion and conversion/transformation of plastic films by infrared heaters | 08-17-2017 |
| 392412000 | Adjustable lamps position | 1 |
| 20160111305 | APPARATUS FOR ADJUSTABLE LIGHT SOURCE - Apparatus for adjusting the position of lamp modules of a processing chamber are disclosed herein. Implementations generally include a process chamber comprising an enclosure defining an internal volume, a substrate support disposed in the internal volume of the process chamber, and a plurality of adjustable lamp modules. Each adjustable lamp module can include a radiation source, a lamp connector in connection with the radiation source, an adjustable mounting bracket connected to the lamp connector, the adjustable mounting bracket being pivotably connected to the process chamber; and a adjustable force device mounted in connection with the adjustable mounting bracket. | 04-21-2016 |
| 392415000 | Lamp banks movable relative to stationary work during use | 1 |
| 20140044426 | APPARATUS AND A METHOD FOR CURING A LINER OF A PIPELINE - A system for curing a pipeline liner that includes a resin curable by exposure to radiation includes first and second liner curing apparatuses, each of which includes a housing defining opposite first and second ends, and outer and inner walls defining a passage between the first and second ends; a plurality of LED's on the outer wall and operable to irradiate the radiation; and a plurality of heat dissipating elements on the inner wall. The LED's are connected in thermally-conductive relationship to the heat dissipating elements, whereby heat is dissipated from the heat dissipating elements to cool the LED's when a stream of cooling fluid passes through the passage. In use, the apparatuses, joined end-to-end, are moved within the liner while irradiating radiation from the LED's onto the liner, and the velocity of the apparatuses moving through the liner is adjusted to cause a complete curing of the resin. | 02-13-2014 |
