| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 381174000 |
Capacitive
| 197 |
| 381176000 |
Conductive diaphragm (e.g., reed, ribbon)
| 20 |
| 381173000 |
Piezoelectric or ferroelectric
| 15 |
| 381175000 |
Semiconductor junction microphone
| 11 |
| 381172000 |
Light modifying
| 9 |
| 381177000 |
Dynamic (e.g., magnetic) | 5 |
| 20080298609 | ELECTROMAGNETIC MICROPHONE - A microphone includes first and second magnet units disposed in a head housing and spaced apart from each other in an axial direction of the head housing. The first and second magnet units generate respectively first and second magnetic fields. A response unit is mounted in the head housing, is disposed between the first and second magnet units in the axial direction, and includes a diaphragm, and a conductive wiring disposed at the diaphragm. When the diaphragm vibrates between the first and second magnet units in response to an external sound wave signal, an electrical signal corresponding to the sound wave signal is induced in the conductive wiring as a result of action of the first and second magnetic fields. | 12-04-2008 |
| 20080317265 | ANTI-EAVESDROPPING DEVICE - An anti-eavesdropping device is described. The device comprises a receiving compartment for receiving an electronic device, a noise generator, and an EMI filter. The receiving compartment is sealable to minimize signal emissions from the interior to the exterior and from the exterior to the interior, and the noise generator is coupled with the receiving compartment and the EMI filter. The EMI filter is operatively coupled with the noise generator. | 12-25-2008 |
| 20100215196 | Electroacoustic Sound Transducer, Receiver and Microphone - There is provided a dynamic sound transducer having a diaphragm with a ridge. First and second grooves ( | 08-26-2010 |
| 20130058510 | Dynamic Microphone Unit and Dynamic Microphone - A dynamic microphone unit includes: a diaphragm | 03-07-2013 |
| 20160183005 | SHARED COIL RECEIVER | 06-23-2016 |
| 381170000 |
Compound | 3 |
| 20100142732 | MICROPHONE ARRAY - A sound capture device comprises a symmetric microphone array that includes non-radially-oriented directional sensors ( | 06-10-2010 |
| 20100220877 | Array speaker system and array microphone system - A plurality of speakers are linked in the present invention. The linked position of each speaker can be detected. Audio signal is input to any one of the master speakers. The master speaker synchronizes the other linked speakers, and supplies audio signals to other speakers. It also controls the delay quantity of the speaker unit of each speaker. For a single speaker, the apparent width of this array speaker system becomes twice the width, and the speaker unit spacing becomes one third the spacing. Consequently, the frequency band at which direction is controllable becomes enhanced. | 09-02-2010 |
| 20160165357 | Dual-Element MEMS Microphone for Mechanical Vibration Noise Cancellation - Disclosed are systems, devices, and methods for minimizing mechanical-vibration-induced noise in audio signals. In one aspect, a microphone is disclosed that includes a first backplate, a first diaphragm, a second backplate, and a second diaphragm. The first diaphragm moves relative to the first backplate in response to acoustic pressure waves in an environment and mechanical vibrations of the microphone, thereby causing a first capacitance change between the first diaphragm and the first backplate. The second diaphragm is substantially acoustically isolated from the acoustic pressure waves, and moves relative to the second backplate in response to the mechanical vibrations of the microphone, thereby causing a second capacitance change between the second diaphragm and the second backplate. The microphone further includes or is communicatively coupled to an integrated circuit configured to generate an acoustic signal based on the first capacitance and the second capacitance. | 06-09-2016 |
| 381171000 |
Micromagnetic | 3 |
| 20110293119 | MICROELECTROMECHANICAL MICROPHONE CARRIER MODULE - An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art. | 12-01-2011 |
| 20130182873 | DEVICE FOR SUPPLEMENTING VOICE INCLUDING SENSING UNIT AND METHOD FOR CONTROLLING THE SAME - A device for supplementing a voice includes: a sensing unit sensing a bio-signal corresponding to a first vibration of vocalization and generating a first signal corresponding to the bio-signal; a vibration unit generating a second vibration using the first signal; and a power unit supplying a power to the sensing unit and the vibration unit. | 07-18-2013 |
| 20150365751 | Micromechanical Sensor System Combination and a Corresponding Manufacturing Method - A micromechanical sensor system combination, and a corresponding manufacturing method, includes an interposer chip including a first front side and a first back side which includes first electrical contacts on the first front side and second electrical contacts on the first back side, the interposer chip having first electrical vias which electrically connect the first electrical contacts to the second electrical contacts; as well as a micromechanical sensor chip system including a second front side a second back side including at least one first sensor device and a second sensor device which are laterally adjacent, the first front side being attached on the second front side so that the first sensor device and the second sensor device are electrically and mechanically connected to the first electrical contacts. | 12-17-2015 |
| 381178000 |
Vibrating electrical contract | 1 |
| 20100195850 | MICROPHONE - A microphone includes: a needle-like electrode; an opposite electrode facing the needle-like electrode; a discharge section formed between the needle-like electrode and the opposite electrode; a high-frequency oscillating circuit including the discharge section and producing a high-frequency discharge at the discharge section; a sound wave introduction section through which a sound wave is introduced to the discharge section; and a modulated signal extracting unit that extracts a signal modulated, according to the sound wave oscillated by the high-frequency oscillating circuit and introduced to the discharge section. The high-frequency discharge is produced at the discharge section as the high-frequency oscillating circuit performs high-frequency oscillation with the discharge section between the needle-like electrode and the opposite electrode as a return path, and a frequency modulation is performed as an equivalent impedance of the discharge section changes according to the sound wave. | 08-05-2010 |
| Entries |
| Document | Title | Date |
|---|
| 20080273736 | Electrostatic microphone - An electrostatic microphone has a capsule housing and a diaphragm, a rigid electrode, and an electrical circuit on a printed circuit board arranged in the capsule housing. The diaphragm is connected to a ring shoulder provided on the front side of the capsule housing. Preferably, the capsule housing is divided into a housing bottom and a capsule lid, and the ring shoulder is provided on the capsule lid. | 11-06-2008 |
| 20090010472 | Acoustical grille free from spit moisture maintains frequency to keep realistic and natural sounds - An acoustical grille ( | 01-08-2009 |
| 20090034773 | MEMS MICROPHONE PACKAGE - Provided is a MEMS microphone package that can shield a MEMS microphone chip from noise to greatly improve sound quality and reduce manufacturing costs, by inserting a PCB substrate to which the MEMS microphone chip is mounted into a metal case, and then by ground-connecting the metal case to a main board using an assembly process including bending and clamping an end of the case. The MEMS microphone package includes a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a PCB substrate to which a MEMS microphone chip and an ASIC chip are mounted, the PCB substrate being inserted into the case, and a support configured to support the PCB substrate and define a space between the case and the PCB substrate. | 02-05-2009 |
| 20090046883 | SURFACE MICROMACHINED DIFFERENTIAL MICROPHONE - A differential microphone having a perimeter slit formed around the microphone diaphragm that replaces the backside hole previously required in conventional silicon, micromachined microphones. The differential microphone is formed using silicon fabrication techniques applied only wafer. The backside holes of prior art microphones typically require that a secondary machining operation be performed on the rear surface of the silicon wafer during fabrication. This secondary operation adds complexity and cost to the micromachined microphones so fabricated. Comb fingers forming a portion of a capacitive arrangement may be fabricated as part of the differential microphone diaphragm. | 02-19-2009 |
| 20090092274 | Silicon condenser microphone having additional back chamber and sound hole in pcb - A silicon condenser microphone has an additional back chamber and a sound hole in a PCB. The microphone includes a case for blocking an external sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, an ASIC chip for operating the MEMS chip, a conductive pattern for a bonding to the case, and a sound hole for passing the external sound. A fixing means fixes the case to the substrate and an adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means. When the sound hole is formed through the PCB instead of the case, the mounting space for a microphone is reduced. The chamber case forms the additional back chamber under the MEMS chip and is employed to increase back chamber space to improve sensitivity and reduce noise. | 04-09-2009 |
| 20090097687 | Diaphragm for a Condenser Microphone - A microphone for transducing between an acoustical signal and an electrical signal, comprises a housing and a motor assembly disposed within the housing. The motor assembly includes a backplate and a diaphragm attached to the backplate via a spacer. The diaphragm comprising a ring and a film, the diaphragm vibrates in response to an acoustical signal, wherein the film is formed from an amorphous or semi-crystallized polyphenylene sulfide (PPS) and a metal layer is attached to the film. The film is completely covered by the metal layer and a portion of the metal is removed using a direct energy source, leaving a portion of the film directly exposed resulting in reducing the parasitic capacitances between the backplate and the diaphragm and increasing the sensitivity. Alternatively, the film is partially covered by the metal layer. At least one opening is formed on the microphone and acoustically/electrically coupled to an opening formed on a main printed circuit board of an electronic device, defining a surface mountable microphone. | 04-16-2009 |
| 20090116675 | MEMS DIAPHRAGM STRUCTURE AND METHOD FOR FORMING THE SAME - A diaphragm ( | 05-07-2009 |
| 20090129622 | MEMS MICROPHONE MODULE AND MANUFACTURING PROCESS THEREOF - A micro-electro-mechanical system (MEMS) microphone module and a manufacturing process thereof are described. A thickness of a transparent temporary cover plate temporarily disposed in a conventional plastic package structure is adjusted. After a mold for a plastic protector is formed, an UV ray is utilized to irradiate the mold to reduce adherence on the temporary cover plate and a back surface of the MEMS acoustic wave sensing chip. Then, the temporary cover plate is removed, and the left space left is the main source for the back-volume of the MEMS microphone. Finally, a tag is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned process, the size of the back-volume is the same as an area of the whole MEMS microphone chip. In addition, the back-volume can be defined. | 05-21-2009 |
| 20090161901 | ULTRA THIN PACKAGE FOR ELECTRIC ACOUSTIC SENSOR CHIP OF MICRO ELECTRO MECHANICAL SYSTEM - An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed. | 06-25-2009 |
| 20090232339 | DIGITAL MICROPHONE - A digital microphone comprises a ΔΣ modulator. The ΔΣ modulator has a resonator including a membrane which vibrates by receiving a sound wave and a wiring pattern disposed opposite to the membrane, an oscillator, including the resonator, for outputting an FM signal according to the vibration of the membrane, and a one-bit quantizer for outputting a one-bit quantized signal by sampling the FM signal with a high-frequency clock. | 09-17-2009 |
| 20090252365 | METHOD AND APPARATUS FOR MICROPHONES SHARING A COMMON ACOUSTIC VOLUME - The present subject matter provides method and apparatus for improved microphones sharing an acoustic volume. Some embodiments are useful for hearing assistance devices. Examples of an improved microphone module offering omnidirectional and directional microphone capsules are provided. Different mounting and interconnection embodiments are provided. Different electrical connector embodiments are discussed. Improvements in space and performance, and other efficiencies, are provided by the teachings set forth herein. | 10-08-2009 |
| 20090262968 | Electrical connector and method for manufacturing the same and condenser microphone - There is provided an electrical connector especially suitable for a condenser microphone, which connector is, though being small in size, provided with an electromagnetic wave shielding unit that is capable of easily being installed in the connector and is equivalent to an EMI core. The electrical connector includes a cylindrical connector housing | 10-22-2009 |
| 20090316946 | Microphone Assembly with Underfill Agent Having a Low Coefficient of Thermal Expansion - A microphone assembly includes a carrier, a silicon-based transducer, a conducting element, and an underfill agent. The carrier has a first surface holding an electrical contact element. The silicon-based transducer includes a displaceable diaphragm and an electrical contact element. The transducer is arranged at a distance above the first surface of the carrier. The conducting material is arranged to obtain electrical contact between the electrical contact elements of the carrier and the silicon based transducer. The underfill agent is disposed in a space between the silicon based transducer and the silicon based carrier. The underfill agent has an underfill coefficient of thermal expansion, CTE, below 40 ppm/° C. | 12-24-2009 |
| 20100086164 | MICROPHONE PACKAGE WITH MINIMUM FOOTPRINT SIZE AND THICKNESS - A microphone package includes a carrier, a cap, an integrated circuit chip, and a microphone unit. The cap covers the carrier to form a storage space. The integrated circuit chip is disposed in the storage space. The microphone unit is disposed in the storage space and stacked on the integrated circuit chip. | 04-08-2010 |
| 20100098284 | Apparatus And Method For Reducing Crosstalk Within A Microphone - A microphone is provided. The microphone has a housing; a back plate positioned within the housing; a die positioned within the housing and coupled to a circuit board having conductive traces; and a conductive layer positioned between the die and the back plate, wherein the conductive layer mitigates coupling of an electrical signal between the conductive traces and the back plate. | 04-22-2010 |
| 20100119099 | Microphone and Method for Transmitting the Microphone Audio Data - There is provided a microphone which has a microphone capsule for recording audio signals, an A/D converter for digitizing the audio signals recorded by the microphone capsule and a semiconductor memory for storing the audio signals digitized by the A/D converter. The microphone further has an interface for transmitting the digital audio signals to an external receiver and a controller for controlling the microphone. The controller controls the microphone in a first operating mode for storing the digitized audio signals in the semiconductor memory and for transmitting the stored audio data by way of the interface at a later time. The controller controls the microphone in a second operating mode for direct transmission of the digitized audio signals by way of the interface. The controller switches into the first operating mode when errors occur in the second operating mode. | 05-13-2010 |
| 20100189301 | Condenser microphone unit - There is provided a condenser microphone unit in which the shield of a shielding member that covers a front acoustic terminal from the inside of a unit case is assured to prevent noise caused by electromagnetic waves radiated especially from a cellular phone from being generated. In a condenser microphone unit including a metallic cylindrical unit case | 07-29-2010 |
| 20100254561 | MICROPHONE DEVICE - Provided is a microphone device, i.e., an acoustic sensor, with high reliability for reducing noise caused by light. A microphone device includes: a condenser including a first electrode, and a second electrode opposite to the first electrode, the first electrode and the second electrode are provided on a semiconductor substrate; an amplifier which is electrically connected to the condenser. Each of the first electrode and the second electrode has the same conductivity type as the semiconductor substrate. | 10-07-2010 |
| 20100322451 | MEMS Microphone - A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity. The housing includes a base and a sidewall extending perpendicularly from the base. A conductive case is provided to cover the cover and the sidewall of the housing. The base defines a periphery portion outside of the cavity for forming a step, and the conductive case locates a bottom end thereof on the step. | 12-23-2010 |
| 20110007925 | Condenser microphone - There is provided a condenser microphone in which electromagnetic shielding in the connecting part of a microphone capsule and a microphone main body is made more reliable. In the condenser microphone including a microphone capsule | 01-13-2011 |
| 20110123058 | COMPOSITE MICROPHONE, MICROPHONE ASSEMBLY AND METHOD OF MANUFACTURING THOSE - A composite microphone comprises a flexible and stretchable substrate ( | 05-26-2011 |
| 20110158454 | VOICE INPUT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND INFORMATION PROCESSING SYSTEM - A voice input device, a method for manufacturing the same, and an information processing system are provided. The voice input device has a function of removing a noise component and includes a first microphone | 06-30-2011 |
| 20110170729 | MICROPHONE - A microphone is disclosed. The microphone in accordance with an embodiment of the present invention includes a diaphragm, which is formed with first indentations on the surface thereof, and a back plate, which is installed near a back side of the diaphragm, electrically connected with the diaphragm and formed with second indentations corresponding to the first indentations on the surface thereof. | 07-14-2011 |
| 20110211722 | Acoustic device & method of making acoustic device - An acoustic device comprising a diaphragm ( | 09-01-2011 |
| 20110249853 | ACOUSTIC ENERGY TRANSDUCER - Illustrative acoustic transducers are provided. A monolithic semiconductor layer defines a plate, two or more flexible extensions and at least a portion of a support structure. Acoustic pressure transferred to the plate results in tensile strain of the flexible extensions. The flexible extensions exhibit varying electrical characteristics responsive to the tensile strain. An electric signal corresponding to the acoustic pressure can be derived from the varying electrical characteristics and processed for further use. | 10-13-2011 |
| 20110317863 | MICROPHONE UNIT - Disclosed is a microphone unit comprising a film substrate ( | 12-29-2011 |
| 20120002833 | FILMS AND MEMBRANES FOR ACOUSTIC SIGNAL CONVERTER - Films and membranes produced therefrom for acoustic signal converters made of polyester comprising the structural unit of formula (I) | 01-05-2012 |
| 20120039499 | Microphone Having Reduced Vibration Sensitivity - A microphone assembly includes a first transducer and a second transducer. The first transducer is coupled to a first substrate layer on a first side of the first substrate layer. The second transducer is coupled to a second substrate layer on a second side of the second substrate layer. The first side and the second side are opposite to each other. The first substrate layer and the second substrate layer are substantially parallel and mechanically coupled. The first transducer and the second transducer have a shared volume and this shared volume is one of a front volume or a rear volume. | 02-16-2012 |
| 20120076339 | MICROPHONE COMPONENT AND METHOD FOR OPERATING SAME - A system and method are described for reducing the current consumption of a microphone component without adversely affecting performance. The system includes a micromechanical microphone capacitor, an acoustically inactive compensation capacitor, an arrangement for applying a high-frequency sampling signal to the microphone capacitor and for applying the inverted sampling signal to the compensation capacitor, an integrating operational amplifier which integrates the sum of the current flow through the microphone capacitor and the current flow through the compensation capacitor as a charge amplifier, a demodulator, which is synchronized with the sampling signal, for the output signal of the integrating operational amplifier, and a low-pass filter which uses the output signal of the demodulator to obtain a microphone signal that corresponds to the changes in capacitance of the microphone capacitor. The sampling signal is composed of a periodic sequence of sampling pulses and pause times. In addition, at least one first switching element is provided which reduces the current flow through the integrating operational amplifier during the pause times. The low-pass filter has a “sample-and-hold” characteristic so that during the pause times the low-pass filter in each case stores the output signal of the integrating operational amplifier averaged over the preceding sampling operation. | 03-29-2012 |
| 20120114159 | MICROPHONE AND MICROPHONE APPARATUS - A microphone includes a microphone unit having a diaphragm, a fixed electrode and a FET as an impedance converter; a plug outputting audio signals output from the microphone unit; and a jack into which audio signals inputted in the microphone unit are inputted. While the plug of the other microphone is inserted in the jack of the microphone, the audio signals output from the other microphone unit are added to the audio signals output from the microphone unit and are output. | 05-10-2012 |
| 20120189152 | Component having a micro-mechanical microphone structure and method for producing the component - Measures are provided for improving the acoustic properties of a component ( | 07-26-2012 |
| 20120213400 | ACOUSTIC SENSOR AND MICROPHONE - Provided is an acoustic sensor capable of improving an S/N ratio of a sensor without preventing reduction in size of the sensor. A back chamber | 08-23-2012 |
| 20120275634 | MEMS MICROPHONE - A microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed. | 11-01-2012 |
| 20120308066 | COMBINED MICRO-ELECTRO-MECHANICAL SYSTEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME - A combined MicroElectroMechanical Systems (MEMS) microphone includes a first substrate, a second substrate, a vibrating diaphragm, a backplate, and an accommodating slot. The first substrate has a first chamber, the vibrating diaphragm is disposed on the first chamber, the second substrate has a second chamber, one side of the backplate is disposed on the second chamber, and the other side of the backplate is disposed on the vibrating diaphragm, so that the second substrate is combined with the first substrate. In addition, the backplate has multiple sound holes, and the accommodating slot is disposed between the first substrate and the second substrate to form a space between the vibrating diaphragm and the backplate. | 12-06-2012 |
| 20130028459 | Monolithic Silicon Microphone - A monolithic silicon microphone including a first backplate, a second backplate and a diaphragm displaced between said first backplate and said second backplate. Said first backplate is supported by a silicon substrate with one or more perforation holes. Said second substrate is attached to a perforated plate which itself is supported on said substrate. Said monolithic silicon microphone has integrated signal conditioning circuit, and is said diaphragm, said first backplate, said second backplate, and said signal conditioning circuit are electrically interconnected. Signals from said diaphragm, said first backplate, and said second backplate are fed into said signal conditioning circuit, and are amplified differentially. | 01-31-2013 |
| 20130077813 | Printed Circuit Boards with Embedded Components - Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices. | 03-28-2013 |
| 20130148837 | MULTI-FUNCTIONAL MICROPHONE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - A multi-functional microphone assembly that has a reduced number of components by installing circuit devices for additional functions in a printed circuit board (PCB) of a microphone so as to reduce the number of components and to increase an area of a back electrode plate, thereby improving sound quality, and a method of manufacturing the multi-functional microphone assembly. The multi-functional microphone assembly includes a microphone cell unit; and a printed circuit board (PCB) assembly that is coupled to the microphone cell unit and in which components for a microphone function and components for an additional function are mounted on a PCB on which a metal pattern and a connection terminal are formed. | 06-13-2013 |
| 20130177192 | Vented Microphone Module - A microphone module includes an outer housing and a microphone apparatus. The outer housing includes port that extends through the outer housing. The microphone apparatus is disposed in the outer housing and defines an extended back volume with the outer housing. The microphone apparatus includes a microphone apparatus housing, an acoustic sensing element, a front volume, and a back volume. The acoustic sensing element is disposed within the microphone apparatus housing. An opening in the microphone apparatus housing allows the extended back volume to communicate with the back volume. | 07-11-2013 |
| 20130243234 | COMPONENT HAVING A MICROMECHANICAL MICROPHONE STRUCTURE - A micromechanical microphone structure configured as a layered structure includes: a semiconductor substrate; a diaphragm structure having an acoustically active diaphragm which at least partially spans a sound opening in the back side of the substrate and is provided with a movable electrode of a microphone capacitor, which diaphragm structure has openings via which pressure compensation occurs between the back side and the front side of the diaphragm; a stationary acoustically permeable counterelement having vents, which counterelement is situated in the layered structure above the diaphragm and which functions as a carrier for a nonmovable electrode of the microphone capacitor; and at least one ridge-like structural element which is situated at the outer edge area of the diaphragm, and which protrudes from the diaphragm plane into corresponding recesses in an adjoining layer. | 09-19-2013 |
| 20130336511 | Micro-Sensor Package And Associated Method Of Assembling The Same - A micro-sensor package is provided that includes a micro-sensor and printed circuit board (PCB), or that includes an array of micro-sensors and PCB. The micro-sensor includes a first substrate having opposing front and back surfaces, a sensing element on the front surface of the first substrate, and a through-chip via disposed within the first substrate and electrically connected to the sensing element. The PCB includes a second substrate to which the back surface of the first substrate is bonded. The second substrate defines a recess within which a bond pad is disposed, and the through-chip via of the micro-sensor is electrically connected to the bond pad of the PCB. The micro-sensor package may further include a shim bonded to the PCB, and that may surround an outer boundary of the micro-sensor and have approximately the same thickness as the micro-sensor. | 12-19-2013 |
| 20140037121 | Microphone and Method to Position a Membrane Between Two Backplates - A microphone includes two backplates. A membrane is located between the two backplates. A voltage source applies a first bias voltage to the membrane and the first backplate and applies a second bias voltage to the membrane and the second backplate. A control unit adjusts the first and the second bias voltage. A method to center the membrane in a final electro-mechanic equilibrium position between the two backplates in a microphone is also disclosed. | 02-06-2014 |
| 20140169608 | MICROPHONE ACTUATOR - The present invention relates to a microphone actuator for fitting a microphone through the upper surface of a table such as that used in a boardroom. The microphone actuator comprises a stepper motor ( | 06-19-2014 |
| 20140198942 | MICROPHONE - A back air room of a microphone unit can be enlarged and a model with a sound signal output switch can easily be diverted to a switchless model. A reed switch | 07-17-2014 |
| 20140205128 | CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING THE SAME - In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip including a microphone structure, depositing adhesive material laterally disposed from the microphone structure, and arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier. | 07-24-2014 |
| 20140307909 | Microphone System with a Stop Member - A microphone system has a package with an interior chamber and an inlet aperture for receiving an acoustic signal, and a microphone die having a backplate and a diaphragm. The microphone is positioned within the package interior to form a front volume between the diaphragm and the inlet aperture. Accordingly, the microphone is positioned to form a back volume defined in part by the diaphragm within the interior chamber. The system also has a stop member positioned in the back volume so that the diaphragm is between the stop member and the backplate. | 10-16-2014 |
| 20140307910 | MICROPHONE BIASING CIRCUITRY AND METHOD THEREOF - A host device for use with a removable peripheral apparatus having a microphone, and to the biasing circuitry for said microphone. The host device may have a device connector for forming a mating connection with a respective peripheral connector. A source of bias is arranged to supply an electrical bias to a device microphone contact of the device connector via a biasing path. A capacitor is connected between a reference voltage node and a capacitor node of the biasing path. A first switch is located between the capacitor node and the device microphone contact. Detection circuitry detects disconnection of the peripheral connector and device connector; and control circuitry controls the switch to disable the biasing path. | 10-16-2014 |
| 20150086058 | Microphone having a microphone capsule, dynamic sound transducer for headphones, earphones or headsets and method for producing a microphone capsule or a sound transducer - A microphone having a microphone capsule ( | 03-26-2015 |
| 20150104056 | Electret Condenser Microphone - The electret condenser microphone according to the present invention includes an electret condenser microphone unit including a diaphragm and a fixed pole disposed opposite to the diaphragm; and a three-pin plug including a hot terminal and a cold terminal and being capable of producing a balanced output, wherein each of the hot terminal and the cold terminal is coupled to an FET that functions as an impedance converter a gate terminal of one of the FETs is coupled to the diaphragm, a gate terminal of the other of the FETs is coupled to the fixed pole, and the gate terminal of the FET coupled to the cold terminal is AC-grounded. | 04-16-2015 |
| 20150146906 | MICROPHONE - Provided is a microphone. The microphone includes a substrate including an acoustic chamber, a lower backplate disposed on the substrate, a diaphragm spaced apart from the lower backplate on the lower backplate, the diaphragm having a diaphragm hole passing therethrough, a connection unit disposed on the lower backplate to extend through the diaphragm hole, and an upper backplate disposed on the connection unit, the upper backplate being spaced apart from the diaphragm. Thus, the microphone may be improved in sensitivity and reliability. | 05-28-2015 |
| 20150304752 | MICROPHONE UNIT - There is provided a microphone unit having a plurality of miniature microphones for respectively recording audio signals and a carrier unit. The miniature microphones can be arranged on a side of the carrier unit. | 10-22-2015 |
| 20150350790 | ROBUST DIAPHRAGM FOR AN ACOUSTIC DEVICE - A rigid, flat plate diaphragm for an acoustic device is illustrated. The internal supporting structure of the diaphragm provides a combination of torsional and translational stiffeners, which resemble a number of crossbars. These stiffeners brace and support the diaphragm motion, thus causing its response to not be adversely affected by fabrication stresses and causing it to be very similar in dynamic response to an ideal flat plate operating in a frequency range that extends well beyond the audible. | 12-03-2015 |
| 20150358709 | LOW NOISE ELECTRET MICROPHONE - An electret microphone having reduced noise due to reduced leakage current is provided. The microphone includes a flexible diaphragm, and sensor member disposed in opposing, spaced relation to the diaphragm and comprising a semi-conductor channel. At least one electret surface, comprised of a dielectric material having a permanently-embedded static electric charge, is disposed on one of the diaphragm and the sensor member. In turn, the semi-conductor channel of the sensor member has an electrical conductivity dependent upon relative movement of the diaphragm and support member responsive to acoustic signals incident upon the diaphragm, wherein the channel provides an output signal indicative of the acoustic signals. The electret surface may be disposed on the diaphragm. Alternatively, the electret surface may be disposed on the sensor member in spaced, face-to-face relation to an electrically conductive surface located on the diaphragm. | 12-10-2015 |
| 20160014491 | BOUNDARY MICROPHONE AND BOUNDARY PLATE | 01-14-2016 |
| 20160029110 | Silicon Condenser Microphone - A silicon condenser microphone is disclosed. The silicon condenser microphone includes a substrate including a side surrounding a cavity, a transducer unit supported by the substrate, a partition positioned in the cavity of the substrate for dividing the cavity into an upper cavity and a lower cavity. The transducer unit includes a backplate and a diaphragm forming a capacitor. The partition includes a main body connected to an inner surface of the side of the substrate, and a perforation penetrating the main body for communicating the upper cavity with the lower cavity. The sensitivity of the silicon condenser microphone is accordingly improved. | 01-28-2016 |
| 20160050473 | ELECTRONIC DEVICE - An electronic device is provided. The electronic device includes a circuit board having a sound input hole penetrating through both surfaces of the circuit board, a microphone mounted on the circuit board, the microphone configured to receive a sound through the sound input hole, a first grounding pad surrounding the sound input hole on a surface of the circuit board, and a second grounding pad surrounding the first grounding pad on the surface of the circuit board. The microphone is mounted on the circuit board by soldering the microphone to the first and second grounding pads. | 02-18-2016 |
| 20160080871 | MEMS Device with Acoustic Leak Control Features - A microelectromechanical system (MEMS) microphone in one embodiment includes a backplate, a back cavity aligned with the backplate, at least one post extending from the backplate toward the back cavity, a membrane positioned between the backplate and the back cavity and including an inner portion and an outer portion, a gap defined by a planar portion of the inner portion and the backplate, a spring arm defined in the outer portion and supported by the at least one post, a first leak path between the back cavity and the gap defined between the inner portion and the spring arm, a second leak path between the back cavity and the gap defined between the spring arm and the back cavity, and a first leak path constriction configured to restrict leakage through at least one of the first leak path and the second leak path. | 03-17-2016 |
| 20160112785 | MICROPHONE AND METHOD OF MANUFACTURING THE SAME - A microphone includes a substrate including a penetration hole; a vibration membrane disposed over the substrate and covering the penetration hole; a fixed electrode disposed over the vibration membrane and spaced apart from the vibration membrane; a fixed plate disposed over the fixed electrode; and a plurality of air inlets disposed in the fixed electrode and the fixed plate. The vibration membrane includes a plurality of slots positioned over the penetration hole, and an entire area of the plurality of slots is approximately 8% to approximately 19% of an entire area of the vibration membrane. | 04-21-2016 |
| 20160157012 | MICROPHONE MANUFACTURING METHOD, MICROPHONE, AND CONTROL METHOD | 06-02-2016 |
