| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 374100000 |
TEMPERATURE MEASUREMENT (E.G., THERMOMETER)
| 1510 |
| 374001000 |
THERMAL CALIBRATION SYSTEM
| 194 |
| 374045000 |
THERMAL TESTING OF A NONTHERMAL QUANTITY
| 158 |
| 374208000 |
HOUSING, SUPPORT, OR ADJUNCT
| 94 |
| 374043000 |
DETERMINATION OF INHERENT THERMAL PROPERTY (E.G., HEAT FLOW COEFFICIENT)
| 81 |
| 374004000 |
LEAK OR FLAW DETECTION
| 71 |
| 374031000 |
CALORIMETRY
| 65 |
| 374016000 |
TRANSFORMATION POINT DETERMINATION (E.G., DEW POINT, BOILING POINT)
| 50 |
| 374029000 |
HEAT FLUX MEASUREMENT
| 38 |
| 374010000 |
DIFFERENTIAL THERMAL ANALYSIS
| 33 |
| 374014000 |
THERMAL GRAVIMETRIC ANALYSIS
| 9 |
| 374006000 |
DISTANCE OR ANGLE
| 8 |
| 374008000 |
FLAMMABILITY TESTING
| 7 |
| 374009000 |
EMISSIVITY DETERMINATION | 3 |
| 20110085582 | METHOD FOR STUDYING THE SURFACE COMPOSITION OF PLANAR STRUCTURES - The invention relates to a method for studying the surface composition of planar structures ( | 04-14-2011 |
| 20130315277 | Method for Evaluating Additives Useful for Improving the Efficiency of Heat Transfer in a Furnace and Systems for Performing Same - Additives for improving furnace heat transfer efficiency may be effectively screened for effectiveness by heating the additive, optionally mixed with ash, to the operating temperature of the furnace and measuring its relative emissivity. Additives that have lower emissivity at furnace operating temperatures may be useful for improving furnace heat transfer efficiency as compared to those that have higher emissivity. | 11-28-2013 |
| 20140269817 | Phosphor Thermometry Fiber Sensor - A high precision phosphor temperature sensor is disclosed. The sensor includes a light source that emits an excitation light through a first optical fiber to a Y-coupler or splitter that connects the first optical fiber to a second optical fiber and a third optical fiber. The second optical fiber connects the Y-coupler to a detector and the third optical fiber connects the Y-coupler to a sensing end of the third optical fiber that is coated with a phosphor that produces a fluorescent emission when engaged by excitation light generated by the light source. The third optical fiber then transmits fluorescent emissions from the phosphor through the Y-coupler whereby at least some of the fluorescent emission passes through the second optical fiber to the detector. The lifetime of the fluorescent emission can be measured and the temperature at the phosphor can be calculated from said lifetime. | 09-18-2014 |
| 374015000 |
BY APPLYING KNOWN THERMAL GRADIENT (E.G., INDICATION OF RESPONSE BY LOCATION) | 2 |
| 20140064322 | ELECTRONIC THERMOMETRY IN TUNABLE TUNNEL JUNCTION - A tunable tunnel junction thermometry circuit includes a variable width tunnel junction between a test object and a probe. The junction width is varied and a change in thermovoltage across the junction with respect to the change in distance across the junction is determined. Also, a change in biased current with respect to a change in distance across the junction is determined. A temperature gradient across the junction is determined based on a mathematical relationship between the temperature gradient, the change in thermovoltage with respect to distance and the change in biased current with respect to distance. Thermovoltage may be measured by nullifying a thermoelectric tunneling current with an applied voltage supply level. A piezoelectric actuator may modulate the probe, and thus the junction width, to vary thermovoltage and biased current across the junction. Lock-in amplifiers measure the derivatives of the thermovoltage and biased current modulated by varying junction width. | 03-06-2014 |
| 20140192835 | DEVICE FOR LOCALIZING HOT SPOTS WITH HEAT FLOW METERS - The electronic device comprises a substrate provided with a surface comprising a region of interest, the thermal behavior of which is to be monitored, and a system for detecting hot spots located in the region of interest. The system for detecting hot spots comprises at least three separate heat flow meters arranged on the surface of the substrate outside of the region of interest. | 07-10-2014 |
| 374210000 |
MISCELLANEOUS | 1 |
| 20100246633 | TESTING APPARATUS FOR COMPUTER MOTHERBOARD DESIGN - A testing apparatus for a motherboard design includes a plurality of electrical elements. The testing apparatus includes a body, a plurality of heat source modules, and a power source terminal. The plurality of heat source modules is positioned on the body and produce heat to simulate the electrical elements of the motherboard. The power source terminal is connected to the plurality of heat source modules via cables and connected to a power supply. When the power supply is turned on, the power supply provides working voltages to the heat source modules to signal the heating source modules to simulate the heat production of the electrical elements of the motherboard design. | 09-30-2010 |
