| Entries |
| Document | Title | Date |
|---|
| 20080225913 | Semiconductor Laser Device - A semiconductor laser device has at least one semiconductor laser element, a heat sink having a first bearing area, on which the at least one semiconductor laser element bears, a housing upper part and a housing lower part, which, in the interconnected state, can at least partly surround the semiconductor laser element, and also a sealing for the tight connection of housing upper part and housing lower part. The heat sink services as housing lower part. | 09-18-2008 |
| 20080267234 | APPARATUS FOR DISSIPATING HEAT IN ELECTRO-OPTICAL COMMUNICATIONS SYSTEMS - A laser mounted in a casing is driven by and mounted close to its driving circuit. To reduce the effect on the laser of heat generated by the driver circuit, the casing includes a passive heat sink element on which the driver circuit is mounted whereby heat generated by the driver is dissipated by the passive heat sink element. | 10-30-2008 |
| 20080291955 | Modular diode laser assembly - An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another. | 11-27-2008 |
| 20080304526 | GREEN LASER OPTICAL PACKAGE - A green laser optical package includes a laser light source generating light of an infrared wavelength band, a harmonic wave generator converting an infrared light output from the laser light source into a second harmonic wave so as to output the converted second harmonic wave, and at least one support member attached to side surfaces of the laser light source and the harmonic wave generator. | 12-11-2008 |
| 20080310469 | Laser Device Formed By a Stack of Laser Diodes - The laser device ( | 12-18-2008 |
| 20080317078 | GREEN LASER MODULE PACKAGE - A green laser module package is disclosed. A green laser module package which generates a laser in a wavelength range of green visible lights comprising: a stem located on a basal surface of the green laser module package; a pumping light source that generates a pumping light; a laser medium that converts the pumping light into an infrared light; an optical crystal that converts the infrared light into a laser in wavelength range of green visible lights; a first thermoelectric element, located on the stem and thermally coupled to the pumping light source, that controls working temperature of the pumping light source; an optical part that reflects the green laser from the optical crystal in a perpendicular direction to an optical axis of the pumping light source; and a window that transmits the perpendicularly reflected green laser, toward outside of the green laser module package, is provided. The green laser module package can exclude an undesirable affects of external and inner heat by controlling working temperatures of components of the green laser module and minimize size and volume of the green laser module. | 12-25-2008 |
| 20090003398 | Light-transmitting module capable of responding a high-frequency over 10GHz - The laser diode of the present invention is mounted on the heat sink made of insulating material such as aluminum nitride (AlN). On the heat sink, a metal film, evaporated gold film, is provided and the laser diode is mounted on the heat sink such that the anode electrode of the laser diode faces and is in contact with the metal film. The heat sink is mounted on the grounded metal member, thus the metal member, the heat sink and the metal film forms an capacitor. The bias for the laser diode is provided via the metal film, thereby stabilizing the bias supply even when the operational frequency for the laser diode is over 10 Gbps. | 01-01-2009 |
| 20090016391 | HEADER ASSEMBLY FOR EXTENDED TEMPERATURE OPTICAL TRANSMITTER - A header assembly for extended temperature optical transmitters is disclosed. The header assembly may include a hermetic enclosure and a header base with an interior surface. A plurality of conductive leads penetrate from the outer portion of the header assembly to the interior surface. A thermoelectric cooler (“TEC”) having a planar configuration and a thickness not exceeding 500 microns is positioned adjacent to the interior surface of the header assembly, the TEC being in thermal communication with the header base and a mounting surface. A submount, on which a laser diode is positioned, is in thermal communication with the mounting surface of the TEC. In this manner, the TEC may be configured affect a selective transfer of heat to the laser diode and transfer of heat away from the laser diode. In some embodiments, the header assembly is configured to operate at optical data transmission rates of 10 Gbps or higher in such extended ambient temperatures. | 01-15-2009 |
| 20090046752 | GAS-COOLED LASER DEVICE - A gas-cooled laser device includes heat dissipative components, and housing walls made of a heat conducting material, in which one or more of the housing walls are provided with ventilation channels. At least one heat dissipative component is mounted on a plate of a heat conducting material, and the heat conducting plate is connected in a thermally conducting manner with the at least one housing wall that is provided with ventilation channels. The heat dissipative components can include heat dissipative optical components and heat dissipative non-optical components that are respectively arranged on different sides of the plate or are respectively arranged in different compartments on one side of the plate. | 02-19-2009 |
| 20090052483 | OPTOELECTRONIC SEMICONDUCTOR PACKAGE AND METHOD FOR ATTACHING HEAT DISSIPATION ELEMENT THERETO - An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base. | 02-26-2009 |
| 20090059979 | OPTICAL TRANSMISSION MODULE AND OPTICAL TRANSMISSION SYSTEM - The present invention provides an optical transmission module and an optical transmission system including a plurality of components including a light-emitting device mounted on a holding unit, capable of restraining a distortion caused by a temperature difference between top and bottom faces of a temperature adjusting unit that performs temperature adjusting for the light-emitting device, the holding unit and the like and capable of maintaining stable optical performance. For such exemplary object, an optical transmission module includes: a holding unit, on which a plurality of components including at least a light-emitting device is mounted; a temperature adjusting unit for adjusting temperature of at least the holding unit and the light-emitting device; and a heating unit provided inside the holding unit. | 03-05-2009 |
| 20090092162 | Means for improved implementation of laser diodes and laser diode arrays - A laser diode system is disclosed in which a substrate made of a semiconductor material containing laser diodes is bonded to a substrate made from a metallic material without the use of any intermediate joining or soldering layers between the two substrates. The metal substrate acts as an electrode and/or heat sink for the laser diode semiconductor substrate. Microchannels may be included in the metal substrate to allow coolant fluid to pass through, thereby facilitating the removal of heat from the laser diode substrate. A second metal substrate including cooling fluid microchannels may also be bonded to the laser diode substrate to provide greater heat transfer from the laser diode substrate. The bonding of the substrates at low temperatures, combined with modifications to the substrate surfaces, enables the realization of a low electrical resistance interface and a low thermal resistance interface between the bonded substrates. | 04-09-2009 |
| 20090103581 | SEMICONDUCTOR LASER DEVICE - In a semiconductor laser device, in a case where an emission direction of a laser beam from a semiconductor laser element portion is a front side, a first front end of a first lead is arranged rearward beyond a first rear end of a second heatsink, and a second surface portion of the second heatsink electrically connected to the semiconductor laser element portion is electrically connected to the first front end. | 04-23-2009 |
| 20090141758 | SEMICONDUCTOR LASER EQUIPMENT - The present invention relates to a semiconductor laser apparatus having a structure for preventing the corrosion of a refrigerant flow path in a heat sink and for cooling a semiconductor laser array stably over a long period of time. The semiconductor laser apparatus comprises a semiconductor laser stack in which a plurality of semiconductor laser units are stacked, a refrigerant supplier, a piping for connecting these components, and a refrigerant flowing through these components. The refrigerant supplier supplies the refrigerant to the semiconductor laser stack. The refrigerant is comprised of fluorocarbon. Each of the semiconductor laser units is constituted by a pair of a semiconductor laser array and a heat sink. The heat sink has a refrigerant flow path. | 06-04-2009 |
| 20090154513 | MULTILAYER BOARD AND LIGHT-EMITTING MODULE HAVING THE SAME - Provided are a multilayer board and a light-emitting module having the same. The light-emitting module comprises a light-emitting diode chip and a multilayer board. The multilayer board is electrically connected to the light-emitting diode chip and comprises a nonconductive heat sink via and a thin copper layer. | 06-18-2009 |
| 20090185593 | Method of manufacturing laser diode packages and arrays - A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and at least one exothermic layer. Solder layers are adjacent the heat sink(s) and laser diode bar, respectively. The exothermic layer(s) are positioned between the solder layers. The exothermic layer(s) are exposed to an energy source which causes an exothermic reaction to propagate through the exothermic layer thereby melting the solder layers and solder layers. The exothermic layer(s) may be designed to provide sufficient heat to melt the solder layers and solder layers but provide only minimal heat to the laser diode bar and heat sink(s). Several packages can be stacked together to form a laser diode array. | 07-23-2009 |
| 20090190619 | SEMICONDUCTOR LASER PACKAGE - The present invention provides a semiconductor laser package including a heat sink, a laser bar with a plurality of lasers on the heat sink, an insulated layer arranged between said heat sink and said laser bar, a solder layer combining said insulated layer with said laser bar, and a clearance crossing said solder layer defined between adjacent lasers. | 07-30-2009 |
| 20090196316 | Laser Arrangement having a Laser Diode Apparatus and Method for Stabilizing Operating Temperature Distribution of a Laser Diode Apparatus - A laser arrangement has at least one laser diode apparatus with a side surface which laterally limits the laser diode apparatus. The laser arrangement has a plurality of active regions arranged laterally side by side and configured to generate radiation. The laser diode apparatus is arranged on a mount. The distance between the side surface and an edge which laterally limits the mount on the part of the side surface is shorter than the distance between the side surface and the active region closest to the side surface. Additionally or alternatively, the distance between the side surface and the edge is shorter than one of the distances between two adjacent active regions of the laser diode apparatus. | 08-06-2009 |
| 20090201958 | Lateral optically pumped surface-emitting semiconductor laser on a heat sink - A surface emitting semiconductor laser device comprising at least one surface emitting semiconductor laser ( | 08-13-2009 |
| 20090219963 | OPTICAL MODULE - An optical module includes a laser device, a thermal conduction member, a Peltier device disposed between the laser device and the thermal conduction member, a heat radiation part, and a variable thermal-resistance device disposed between the thermal conduction member and the heat radiation part, the variable thermal-resistance device changing a thermal resistance between the thermal conduction member and the heat radiation part according to an ambient temperature. | 09-03-2009 |
| 20090245308 | ACTIVE SOLID HEATSINK DEVICE AND FABRICATING METHOD THEREOF - An active solid heatsink device and fabricating method thereof is related to a high-effective solid cooling device, where heat generated by a heat source with a small area and a high heat-generating density diffuses to a whole substrate using a heat conduction characteristic of hot electrons of a thermionic (TI) structure, and the thermionic (TI) structure and a thermo-electric (TE) structure share the substrate where the heat diffuses to. Further, the shared substrate serves as a cold end of the TE structure, and the heat diffusing to the shared substrate is pumped to another substrate of the TE structure serving as a hot end of the TE structure. | 10-01-2009 |
| 20090262768 | COMPACT MID-IR LASER - A compact mid-IR laser device utilizes a quantum cascade laser to provide mid-IR frequencies suitable for use in molecular detection by signature absorption spectra. The compact nature of the device is obtained owing to an efficient heat transfer structure, the use of a small diameter aspheric lens and a monolithic assembly structure to hold the optical elements in a fixed position relative to one another. The compact housing size may be approximately 20 cm×20 cm×20 cm or less. Efficient heat transfer is achieved using a thermoelectric cooler TEC combined with a high thermal conductivity heat spreader onto which the quantum cascade laser is thermally coupled. The heat spreader not only serves to dissipate heat and conduct same to the TEC, but also serves as an optical platform to secure the optical elements within the housing in a fixed relationship relative on one another. A small diameter aspheric lens may have a diameter of 10 mm or less and is positioned to provided a collimated beam output from the quantum cascade laser. The housing is hermetically sealed to provide a rugged, light weight portable MIR laser source. | 10-22-2009 |
| 20090274184 | OPTICAL UNIT - The present invention provides an optical unit capable of suppressing a thermal influence on the optical element even if a heating source such as a laser driver is disposed near the optical element. A light pickup unit | 11-05-2009 |
| 20090290608 | Photochemistry Laser Diode Assembly And Photochemistry Sheet Having The Same - A laser diode (LD) assembly for medical therapy and a medical therapy sheet having the same, which are capable of facilitating the assembly and maintenance of a laser diode (LD) which can emit laser beams or beams having a wavelength which is the same as or similar to that of the laser beams, effectively dissipating the heat generated from the laser diode, and recycling the heat for medical therapy, and which has good waterproofness. The medical therapy sheet includes a sheet body having installation holes, and laser diode assemblies detachably installed in the installation holes of the sheet body. Each laser diode assembly includes a laser diode, a first housing having an accommodation space in which the laser diode is received, a driving circuit board connected with the laser diode in order to drive the laser diode, and a second housing detachably coupled to the first housing. | 11-26-2009 |
| 20100054290 | SURFACE EMITTING LASER - VCSELs with a conventional oxide-confined structure have problems to be solved for the purpose of reducing the internal stress and thermal resistance of the device. In particular, the problems should be solved in order to achieve the high reliability of the high-speed modulation-type VCSELs. A surface emitting laser according to an embodiment of the present invention comprising a single current injection opening area, which is provided in a mesa and electrically and optically isolated, wherein the laser comprises: an active layer for emitting light resulted from current injection; a first reflector and a second reflector provided so as to sandwich the active layer between the reflectors, an n electrode and a p electrode for injecting current into the active layer, an ion-implanted nonconductive high-resistance area provided so as to surround the current injection opening area, and | 03-04-2010 |
| 20100118902 | UNITIZED COOLING MODULE FOR LASER DIODE ARRAY - The unitized cooling module for a laser diode array of the invention has at least one cooling unit. The cooling unit has an inlet main channel, an outlet main channel, an inlet subchannel, an outlet subchannel and a chamber. The inlet subchannel connects the inlet main channel and the chamber, and the outlet subchannel connects the outlet main channel and the chamber. A heatsink element carrying a laser diode seals the chamber. With a cooling source flowing through the interior of the cooling unit, the heat produced by the laser diode is removed. Thus, the unitized cooling module of the invention is easily assembled, repaired and expanded, and has the effect of pressing fit. Furthermore, the unitized cooling module of the invention can be arranged and designed according to the heat produced by the laser diode to remove the heat from the laser diode, so that the performance of the unitized cooling module is ensured. | 05-13-2010 |
| 20100150192 | Laser Pump Cavity - A laser pump cavity includes a heat sink holder with a central through hole, a plurality of slot portions, and a plurality of single emitters. The single emitter includes a heat sink and a single core disposed on the heat sink. The slot portions are uniformly spaced and surround the through hole. The single emitters are connected end to end, thereby forming at least one single emitter array. The at least one single emitter array is disposed in corresponding slot portions with each single core facing the through hole. | 06-17-2010 |
| 20100158059 | SEMICONDUCTOR LASER APPARATUS - A semiconductor laser apparatus of the present invention includes: a semiconductor laser chip | 06-24-2010 |
| 20100158060 | Laser Diode Assemblies - Laser diodes ( | 06-24-2010 |
| 20100177796 | LASER DEVICE AND HEAT SINK WITH CORE TO MANAGE STRESS DUE TO THERMAL EXPANSION - A laser module comprising a laser device attached to a heat sink that is configured to provide a relatively low thermal resistance for thermal management of the laser device, and an aggregate coefficient of thermal expansion (CTE) that is substantially matched to the CTE of the laser device for reducing stress caused by thermal cycles. The heat sink includes a shell made out of a first material, and a core situated within the shell and made out of a second material distinct from the first material of the shell. By properly selecting the first and second materials, configuring the thickness of the shell directly under the location to which the laser device will be attached with respect to the thickness of the core, the desired effective or aggregate CTE and thermal resistance of the heat sink may be achieved. | 07-15-2010 |
| 20100189144 | SEMICONDUCTOR LASER APPARATUS - A semiconductor laser apparatus includes a heat dissipating member including a main body having a front end portion that extends in a left-right direction and a pair of protruding portions that protrude forward from both sides of the front end portion; a semiconductor laser device bonded along the front end portion of the main body; and a stiffener configured to bridge the pair of protruding portions. | 07-29-2010 |
| 20100220755 | SPECTRALLY TUNABLER LASER MODULE - The present invention relates to a laser module, comprising a flat substrate basis with a mounting region and with at least one heat conducting region adjoining the mounting region, one heating element arranged in the mounting region and one temperature sensor element arranged in the mounting region. | 09-02-2010 |
| 20100232462 | Thermally Optimized Mechanical Interface for Hybrid Integrated Wavelength Division Multiplexed Arrayed Transmitter - An apparatus comprising a plurality of laser dice and a heat sink positioned between the laser dice and thermally coupled to the laser dice. Also included is an apparatus comprising a chip comprising a laser core, a stopper at least partially defining a groove, wherein the stopper and the groove are positioned adjacent to the chip, and a heater located between the laser core and the groove. | 09-16-2010 |
| 20100260218 | Laser Light Source Device - In a laser light source device having an optical element and a plurality of heat sinks on which the optical element is joined directly or through a sub mount, and obtained by joining the heat sinks to each other by means of a joining material such that optical elements are optically directly joined to each other, the laser light source device includes a groove portion extending in a direction substantially orthogonal to an optical axis of light in the laser light source device on any one of a joining surface of the optical element or the sub mount to join with the heat sink and a joining surface of the heat sink to join with the optical element or the sub mount. | 10-14-2010 |
| 20100290490 | HEAT SINK AND ASSEMBLY OR MODULE UNIT - A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and which is made of a metallic material in the cooling area. | 11-18-2010 |
| 20100296536 | LIGHTING DEVICE USING A LASER DIODE AS A SOURCE OF LIGHT EMISSION - A laser diode lighting device for use in and powered through an incandescent, halogen, or fluorescent light bulb alternating current socket is provided. The lighting device includes a laser diode light, a regulation circuit and a base. The regulation circuit converts an alternating current input to a direct current output. The base is adapted to fit within a conventional light bulb alternating current socket. In addition to the laser diode light, regulation circuit and base, the invention can further include a heat sink that removes heat from the laser diode light, regulation circuit and combinations thereof The laser diode light, regulation circuit, base, and heat sink take the form of a lighting device that is exchangeable with conventional light bulbs in traditional lighting fixtures. | 11-25-2010 |
| 20100303112 | SOLID-STATE LASER ELEMENT - To achieve a solid-state laser element capable of outputting a high-power laser, in a planar waveguide type solid-state laser element that causes a plurality of fundamental laser beams to oscillate in a direction of an optic axis within a flat plate-like laser medium, and forms a waveguide structure in a thickness direction of the laser medium, which is a direction perpendicular to a principal surface of the flat plate-like laser medium, the laser medium is separated in a principal-surface width direction of the laser medium, which is a direction perpendicular to the direction of the optic axis and the thickness direction of the laser medium, by a groove extending in the direction of the optic axis within the laser medium. | 12-02-2010 |
| 20100303113 | Multibeam Arrays of Optoelectronic Devices for High Frequency Operation - A VCSEL array device formed of a monolithic array of VCSELs and short circuited mesas is disclosed. The VCSELs can be spaced symmetrically or asymmetrical, in a manner to improve power or speed, or in phase and in parallel. The VCSELs are connected to a first metal contact pad formed on a heat-spreading substrate. The short-circuited mesas are formed alongside the VCSELs and are bonded to and form a short circuit to a second metal contact pad on the grounding substrate. Each VCSEL is encompassed by a thick metal heat sink to increase the height of VCSEL mesas. The structure of the heat sink, the VCSELs and the shorting mesas reduce parasitic impedance thereby increasing output power and high frequency response. The VCSELs and shorting mesas can be packaged as a coplanar waveguide in a ground-signal-ground configuration that improves signal modulation characteristics. | 12-02-2010 |
| 20110007762 | OPTICAL MODULE - To constitute an optical module in which a comb-shaped submount is fixed on a heat sink and a device having an optical functioning unit is mounted on the comb-shaped submount, a stress buffering block that relaxes a thermal stress acting between the heat sink and the comb-shaped submount is placed between the heat sink and the comb-shaped submount. With this configuration, a thermal stress acting between the comb-shaped submount and the device mounted thereon is relaxed, and as a result, long-term reliability of bonding parts between the comb-shaped submount and the device is enhanced. | 01-13-2011 |
| 20110032962 | Semiconductor Laser Device - The invention relates to a semiconductor laser device comprising a laser bar ( | 02-10-2011 |
| 20110064099 | OPTICALLY-PUMPED EXTERNAL-CAVITY SURFACE-EMITTING SEMICONDUCTOR LASERS WITH FRONT-COOLED GAIN-STRUCTURES - A semiconductor gain-structure functions as a gain-element in a laser-resonator. The gain-structure is bonded to a diamond heat-spreader that is peripherally cooled by a heat-sink configured to allow access to the gain-structure by laser-radiation circulating in the laser-resonator. In one example, the gain-structure is used as a transmissive gain-structure in a traveling-wave ring-resonator. In another example, the gain-structure surmounts a mirror-structure which functions as an end-mirror of a standing-wave laser-resonator. | 03-17-2011 |
| 20110090927 | MOUNTED SEMICONDUCTOR DEVICE AND A METHOD FOR MAKING THE SAME - A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses. | 04-21-2011 |
| 20110103416 | Tunable Quantum Cascade Lasers and Photoacoustic Detection of Trace Gases, TNT, TATP and Precursors Acetone and Hydrogen Peroxide - Methods and apparatus for broad tuning of single wavelength quantum cascade lasers and the use of light output from such lasers for highly sensitive detection of trace gases such as nitrogen dioxide, acetylene, and vapors of explosives such as trinitrotoluene (TNT) and triacetone triperoxide (TATP) and TATP's precursors including acetone and hydrogen peroxide. These methods and apparatus are also suitable for high sensitivity, high selectivity detection of other chemical compounds including chemical warfare agents and toxic industrial chemicals. A quantum cascade laser (QCL) system that better achieves single mode, continuous, mode-hop free tuning for use in L-PAS (laser photoacoustic spectroscopy) by independently coordinating gain chip current, diffraction grating angle and external cavity length is described. An all mechanical method that achieves similar performance is also described. Additionally, methods for improving the sensor performance by critical selection of wavelengths are presented. | 05-05-2011 |
| 20110122905 | SEMICONDUCTOR LASER ASSEMBLY AND PACKAGING SYSTEM - A system for self-aligning assembly and packaging of semiconductor lasers allows reduction of time, cost and testing expenses for high power density systems. A laser package mounting system, such as a modified TO-can (transistor outline can), has modifications that increase heat transfer from the active laser to a heat exchanger or other heat sink. A prefabricated heat exchanger assembly mounts both a laser package and one or more lenses. Direct mounting of a fan assembly to the package further minimizes assembly steps. Components may be physically and optically aligned during assembly by clocking and other indexing means, so that the entire system is self-aligned and focused by the assembly process without requiring post-assembly adjustment. This system can lower costs and thereby enable the use of high powered semiconductor lasers in low cost, high volume production, such as consumer items. | 05-26-2011 |
| 20110142087 | Heat transfer device with at least one semiconductor element, particularly a laser or light-emitting diode element, and method for the assembly thereof - The invention relates, among other things, to a method for the assembly of a semiconductor component, wherein the semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat-conducting body each. For this purpose, the heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element, wherein a spacer, which with regard to the third connection is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the requirement that the joining zone thickness of the third connection is greater than that of the first or the second joining zone, ensures that defined joining zone thicknesses in the bonded connection are maintained during the joining process. The third connection is used for the at least partial heat transfer of the waste heat of the semiconductor component, particularly to a heat sink that is connected to the heat transfer device produced according to the invention. | 06-16-2011 |
| 20110176566 | SEMICONDUCTOR LASER PUMPED SOLID-STATE LASER DEVICE - A compact semiconductor laser pumped solid-state laser device is provided that can suppress unnecessary parasitic oscillation in a microchip and efficiently extract energy. The semiconductor laser pumped solid-state laser device comprises: a solid-state laser core | 07-21-2011 |
| 20110176567 | MULTIBEAM ARRAYS OF OPTOELECTRONIC DEVICES FOR HIGH FREQUENCY OPERATION - A VCSEL array device formed of a monolithic array of raised VCSELs on an electrical contact and raised inactive regions connected to the electrical contact. The VCSELs can be spaced symmetrically or asymmetrically, in a manner to improve power or speed, or in phase and in parallel. The VCSELs include an active region positioned between two mirrors generating a pulsed light operating at a frequency of at least 1 GHz. The VCSELs having an output power of at least 120 mW. The raised VCSELs and raised inactive regions are positioned between the electrical contact and an electrical waveguide. | 07-21-2011 |
| 20110182309 | LASER DIODE PACKAGE WITH ENHANCED COOLING - A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir. | 07-28-2011 |
| 20110194578 | LASER LIGHT-SOURCE APPARATUS AND PROJECTOR APPARATUS - A laser light-source apparatus according to the present invention is equipped with: a laser-driving circuit board, thermal insulators that are placed on the laser-driving circuit board; a heat receiving plate that is placed on the thermal insulators and thermally insulated from the laser-driving circuit board, a laser light-source module that is installed on the heat receiving plate so as to be thermally connected to the heat receiving plate and is also electrically connected to the laser-driving circuit board so as to be driven thereby, and a heat sink that is thermally connected to the heat receiving plate via a heat pipe. | 08-11-2011 |
| 20110222567 | OPTOELECTRONIC TRANSISTOR OUTLINE (TO)-CAN HEADER ASSEMBLY HAVING A CONFIGURATION THAT IMPROVES HEAT DISSIPATION AND REDUCES THERMAL RESISTANCE - A TO-can header assembly is provided that has improved heat dissipation and thermal resistance characteristics. The TO-can header assembly includes a relatively large ceramic heat dissipation block that functions as both a carrier for the laser diode and as a heat dissipation device. The ceramic heat dissipation block is in contact with the upper mounting surface of the header to allow a relatively large amount of heat to quickly pass from the laser diode through the heat dissipation block and into the upper mounting surface of the header. The cylindrical side wall of the header is smooth, rather than notched, and at least a substantial portion of the smooth cylindrical side wall is in continuous contact with an external heat sink device. Heat moves rapidly from the header into the external heat sink device where it is dissipated, thereby reducing the thermal resistance of the header. | 09-15-2011 |
| 20110268143 | Vertical Surface Emitting Semiconductor Device - A semiconductor light emitting device includes a pump light source, a gain structure, and an out-coupling mirror. The gain structure is comprised of InGaN layers that have resonant excitation absorption at the pump wavelength. Light from the pump light source causes the gain structure to emit light, which is reflected by the out-coupling mirror back to the gain structure. A distributed Bragg reflector causes internal reflection within the gain structure. The out-coupling mirror permits light having sufficient energy to pass therethrough for use external to the device. A frequency doubling structure may be disposed between the gain structure and the out-coupling mirror. Output wavelengths in the deep-UV spectrum may be achieved. | 11-03-2011 |
| 20110286483 | LASER DIODE PACKAGE WITH ENHANCED COOLING - A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir. | 11-24-2011 |
| 20110305253 | SEMICONDUCTOR LASER MODULE - A semiconductor laser module includes a semiconductor laser section, a light selecting section, and an optical converting section. The semiconductor laser section includes a semiconductor laser substrate, a plurality of semiconductor laser elements mounted on the semiconductor laser substrate, and a first temperature adjusting element for adjusting temperature of the semiconductor laser elements. The light selecting section includes a light selecting element substrate and a light selecting element mounted on the light selecting element substrate and optically connected to the semiconductor laser elements, which selects laser light output from at least one of the semiconductor laser elements. The optical converting section includes an optical converting element substrate, an optical converting element mounted on the optical converting element substrate and optically connected to the light selecting element, which converts laser light output from the light selecting element, and a second temperature adjusting element for adjusting temperature of the optical converting element. | 12-15-2011 |
| 20120008655 | HEAT SINK, METHOD OF PRODUCING SAME, AND SEMICONDUCTOR LASER DEVICE - A heat sink enabled to prevent structural deterioration of an inner wall of a flow channel caused by corrosion a semiconductor laser device are provided. The heat sink includes a main body, a flow channel which is provided in the main body, and inside which a cooling medium passes through, and a passivation film covering an inner-wall surface of the flow channel. | 01-12-2012 |
| 20120027036 | OPTICAL DEVICE AND METHOD FOR FABRICATING OPTICAL DEVICE - An optical device including: a carrier having a first area and a second area, both edges of the second area having a wall of a step, one edge of the second area being adjacent to the first area, the first area having a first thickness, the second area having a second thickness larger than the first thickness; and a first optical component mounted on the first area of the carrier, the second area of the carrier being an absence area of a component. | 02-02-2012 |
| 20120076162 | DEVICE FOR TRANSFORMING ELECTROMAGNETIC IR ENERGY FROM SPATIALLY INCOHERENT, LOW-POWER DENSITY, BROAD-BAND RADIATION IN SPATIALLY COHERENT, HIGH-POWER DENSITY, QUASI-MONOCHROMATIC RADIATION - A device to be positioned between a heat source and a heat sink may transform infrared electromagnetic (IR-EM) energy exchanged therebetween from a first form to a second form. The device may include a pair of layers facing each other and having dielectric material with molecular excitability characteristics to produce the second form of IR-EM energy. The pair of layers may define a gap therebetween. The device may include a conversion circuit configured to convert the second form of IR-EM energy into electrical energy. | 03-29-2012 |
| 20120082176 | CONDUCTION COOLED PACKAGE LASER AND PACKAGING METHOD FOR FORMING THE SAME - A packaging method for forming a conduction cooled package (CCP) laser is provided and includes soldering a semiconductor laser device on the first heat spreader; and then bonding the first heat spreader on the second spreader via an Al/Ni nano-laminated foil. Moreover, a CCP laser is also provided herein. | 04-05-2012 |
| 20120093184 | STRUCTURES AND METHODS FOR ADJUSTING THE WAVELENGTHS OF LASERS VIA TEMPERATURE CONTROL - One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths. | 04-19-2012 |
| 20120163406 | DIAMOND HEAT SINK IN A LASER - A laser has a laser material in thermal contact with a diamond, such that the diamond is operable to carry heat away from the laser material. In further embodiments, the diamond has a reduced nitrogen content, is a reduced carbon-13 content, is a monocrystalline or multilayer low-strain diamond, or has a thermal conductivity of greater than 2200 W/mK. | 06-28-2012 |
| 20120177074 | HIGH RELIABILITY LASER EMITTER MODULES - Embodiments are directed to laser emitter modules, or subassemblies thereof, and methods and devices for making or using the modules. Some module embodiments are configured to provide hermetically sealed enclosures that are thermally stable during use, highly reliable in adverse environments, convenient and cost effective to manufacture or any combination of the foregoing. | 07-12-2012 |
| 20120201259 | SUBMOUNT, SUBMOUNT ASSEMBLY, AND SUBMOUNT ASSEMBLING METHOD - A submount having a structure and a configuration resistant to an increase in manufacturing cost and a reduction in yields or reliability, and including an oblique waveguide is provided. A submount having a first surface and allowing a semiconductor light-emitting element including a waveguide to be fixed on the first surface, the waveguide having an axis line inclined at θ | 08-09-2012 |
| 20120219028 | Ceramic Slab, Free-Space and Waveguide Lasers - A laser may comprise a ceramic body including a first wall and a second wall opposite the first wall, a first mirror positioned at first ends of the first and second walls, a second mirror positioned at second ends of the first and second walls opposite the first ends, the first and second walls and the first and second mirrors defining a slab laser cavity within the ceramic body. The laser may further comprise a first electrode positioned outside the laser cavity and adjacent to the first wall of the ceramic body and a second electrode positioned outside the laser cavity and adjacent to the second wall of the ceramic body, wherein a laser gas disposed in the laser cavity is excited when an excitation signal is applied to the first and second electrodes. In some embodiments, the first and second mirrors may form a free-space multi-folded resonator in the slab laser cavity. In other embodiments, the first and second mirrors may form a free-space unstable resonator in the slab laser cavity. In still other embodiments, the first and second mirrors may form a waveguide unstable resonator in the slab laser cavity. | 08-30-2012 |
| 20120257646 | THERMAL MANAGEMENT SYSTEM - Various embodiments are disclosed for a thermal management system and related method for selectively thermally isolating and thermally connecting a target component. One embodiment of a system includes a first component having a first surface proximate to a target component, and an electromagnet between the first surface and the target component. A second component is spaced apart from the first component to form a gap that serves as a thermal boundary between the first component and the second component. A carrier fluid disposed within the gap includes multiple thermally conductive, ferrous particles. The carrier fluid is configured to align at least a portion of the thermally conductive, ferrous particles when the electromagnet generates a magnetic field that attracts the particles, and to displace at least a portion of the particles when the electromagnet generates a magnetic field that repels the particles. | 10-11-2012 |
| 20120257647 | COOLING APPARATUS FOR OPTICALLY PUMPED SEMICONDUCTOR LASER - An OPS-chip is soldered mirror-structure-side down on an upper surface of diamond-heat spreader. A metal frame is also soldered to the upper surface of the heat-spreader. The lower surface of the diamond heat-spreader is either soldered to, or clamped against, a surface of a heat-sink. The dimensions of the frame and the heat spreader are selected such that at a solidification temperature of the solder at the center of the upper surface of the heat-spreader has an effective CTE comparable with that of the OPS-chip. The lower surface of the heat-spreader can be soldered to the heat sink surface or clamped against the heat-sink surface by the frame. | 10-11-2012 |
| 20120263200 | LASER MODULE - A laser module includes: a heat sink that releases heat from a member in contact with the heat sink; a sub-mount substrate that is disposed on the heat sink and made of an insulating material; a feeding layer that is disposed on the sub-mount substrate; and a laser diode array that has plural light-emitting portions disposed on the feeding layer in a parallel arrangement. A linear expansion coefficient of the sub-mount substrate is made smaller than a linear expansion coefficient of the laser diode array, and the linear expansion coefficient of the sub-mount substrate in a state connected to the heat sink having a larger linear expansion coefficient than the laser diode array is set to fall within a predetermined range including the linear expansion coefficient of the laser diode array. | 10-18-2012 |
| 20120263201 | BROAD-AREA EDGE-EMITTING SEMICONDUCTOR LASER WITH LIMITED THERMAL CONTACT - A diode-laser having an elongated diode-laser emitter is mounted on a relatively massive heat-sink. Two parallel grooves are machined into the heat-sink to leave a relatively narrow elongated ridge of the heat-sink between the grooves. The ridge has a width about equal to or narrower that the width of the emitter. The diode-laser is mounted on the heat-sink such that thermal communication between the emitter and heat-sink is essentially limited to thermal communication with the ridge. | 10-18-2012 |
| 20120269216 | OPTICALLY-PUMPED SURFACE-EMITTING SEMICONDUCTOR LASER WITH HEAT-SPREADING COMPOUND MIRROR-STRUCTURE - A gain-module for use in an OPS-laser includes a multilayer semiconductor gain-structure surmounting a multilayer compound mirror-structure. Within the multilayer compound mirror-structure is a relatively thick layer of diamond which serves as a heat-spreader. | 10-25-2012 |
| 20120281725 | MEANS FOR IMPROVED IMPLEMENTATION OF LASER DIODES AND LASER DIODE ARRAYS - A laser diode system is disclosed in which a substrate made of a semiconductor material containing laser diodes is bonded to a substrate made from a metallic material without the use of any intermediate joining or soldering layers between the two substrates. The metal substrate acts as an electrode and/or heat sink for the laser diode semiconductor substrate. Microchannels may be included in the metal substrate to allow coolant fluid to pass through, thereby facilitating the removal of heat from the laser diode substrate. A second metal substrate including cooling fluid microchannels may also be bonded to the laser diode substrate to provide greater heat transfer from the laser diode substrate. The bonding of the substrates at low temperatures, combined with modifications to the substrate surfaces, enables the realization of a low electrical resistance interface and a low thermal resistance interface between the bonded substrates. | 11-08-2012 |
| 20120320938 | SEMICONDUCTOR LASER DEVICE - The semiconductor laser device of the present invention has a structure that allows a cooling medium to be directly fed into heatsink disposed inside package. Besides, the structure ensures that the inside of package is kept at hermetically sealed condition. The structure suppresses temperature rise in semiconductor laser element and package, enhancing the reliability and quality of the semiconductor laser device. At the same time, a high-power semiconductor laser element can be employed. | 12-20-2012 |
| 20120327965 | SEMICONDUCTOR LASER ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR LASER ELEMENT, AND OPTICAL MODULE - In order to provide a semiconductor laser element or an integrated optical device with high reliability, a horizontal-cavity semiconductor laser or an optical module includes a deeply dug DBR mirror serving as a cavity mirror, the deeply dug DBR mirror being composed of a material that is lattice-matched to a substrate and that has a band gap energy that does not absorb light emitted from an active layer. | 12-27-2012 |
| 20130003765 | THERMO-ELECTRIC COOLING SYSTEM AND METHOD FOR COOLING ELECTRONIC DEVICES - A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom. The control unit is configured and operable to carry out at least one of the following: (i) operating said second heat pumping assembly to provide a desired temperature condition such that temperature of the heat drain of said first heat pumping assembly is either desirably low or by a certain value lower than temperature of the heat source of said first heat pumping assembly; and (ii) operating said second heat pumping assembly to maintain predetermined temperature of said thermal interface. | 01-03-2013 |
| 20130028279 | VERTICAL CAVITY SURFACE EMITTING LASER CAVITY WITH LOW THERMAL IMPEDANCE - The present invention concerns new designs of VCLs with high contrast gratings (HCG) combined with diamond layer as a bottom mirror. They can be realized either with a classical V-shaped pumping scenario, or through the introduction of the pumping beam from the bottom direction, through the HCG that can be designed to be transparent at the wavelength of the pumping light. They can also be completed by a HCG combined with diamond layer as top mirror, reflecting the pump diode laser and transparent to the VCL emission in the case the pumped and emitted beams are collinear. | 01-31-2013 |
| 20130051413 | INTERNALLY COOLED, THERMALLY CLOSED MODULAR LASER PACKAGE SYSTEM - An internal laser module may be capable of providing a similar high performance as that provided by traditional internally cooled laser modules, but with improved cost efficiency and manufacturability. In the internally cooled laser module, a laser subassembly, such as a coaxial semiconductor laser, may be mounted on a thermoelectric cooler cooler-base with several other components enclosed in a properly designed case. | 02-28-2013 |
| 20130051414 | Compression Mount for Semiconductor Devices, and Method - A mount for semiconductor laser devices comprises thermally conductive anode and cathode blocks on either side of a semiconductor laser device such as a laser diode. Interposed between at least the anode block and the anode of the semiconductor laser device is a sheet of conformable material with high thermal conductivity such as pyrolytic highly-oriented graphite. In some embodiments, a second sheet of such thermally conductive conformable material is interposed between the cathode of the semiconductor laser device and the cathode block. The semiconductor laser device can be either a single laser diode or a diode bar having a plurality of emitters. A thermally conductive, but electrically insulating, spacer of essentially the same thickness as the laser diode or bar surrounds the diode or bar to prevent mechanical damage while still permitting the conformable material to be maintained in a compressed state. | 02-28-2013 |
| 20130058367 | Mount for Semiconductor Devices Using Conformable Conductive Layers, and Method - Mount for semiconductor laser devices comprises thermally conductive anode and cathode blocks on either side of semiconductor laser device such as laser diode. Interposed between at least the anode block and the anode of the semiconductor laser device is a sheet of conformable electrically conductive material with high thermal conductivity such as pyrolytic highly-oriented graphite. In some embodiments, a second sheet of such electrically and thermally conductive conformable material is interposed between the cathode of the semiconductor laser device and the cathode block. The semiconductor laser device can be either a single laser diode or a diode bar having a plurality of emitters. A thermally conductive, but electrically insulating, spacer of essentially the same thickness as the laser diode or bar surrounds the diode or bar to prevent mechanical damage while still permitting the conformable material to be maintained in a compressed state and directing current through the laser device. | 03-07-2013 |
| 20130107900 | LIGHT EMITTING DEVICE AND METHOD OF CONTROLLING LIGHT EMITTING DEVICE | 05-02-2013 |
| 20130107901 | BRANCHED SHAPE OPTICAL ISOLATOR AND OPTICAL APPARATUS, METHOD AND APPLICATIONS | 05-02-2013 |
| 20130121355 | MODE CONTROL WAVEGUIDE-TYPE LASER DEVICE - In a laser device, a control range of focal distance of a generated thermal lens is broadened and reliability is improved. A mode control waveguide-type laser device includes: a planar laser medium having a waveguide structure in a thickness direction of a cross section perpendicular to an optical axis, for generating gain with respect to laser light; a cladding bonded onto the laser medium; and a heat sink bonded onto the laser medium. The laser medium generates a lens effect, and the laser light oscillates in a waveguide mode in the thickness direction, and oscillates in a spatial mode due to the lens effect in a direction perpendicular to the optical axis and the thickness direction. The refractive index distribution within the laser medium is created by generating a temperature distribution in the laser medium depending on a junction area of the cladding and the heat sink. | 05-16-2013 |
| 20130163627 | Laser Illuminator System - An optical illuminator using Vertical Cavity Surface Emitting Laser (VCSEL) is disclosed. Optical modules configured using single VCSEL and VCSEL arrays bonded to a thermal submount to conduct heat away from the VCSEL array, are suited for high power and high speed operation. High speed optical modules are configured using single VCSEL or VCSEL arrays connected to a high speed electronic module on a common thermal submount or on a common Printed Circuit Board (PCB) platform including transmission lines. The electronic module provides low inductance current drive and control functions to operate the VCSEL and VCSEL array. VCSEL apertures are designed for a desired beam shape. Additional beam shaping elements are provided for VCSELs or VCSEL arrays, for desired output beam shapes and/or emission patterns. VCSEL arrays may be operated in continuous wave (CW) or pulse operation modes in a programmable fashion using a built-in or an external controller. | 06-27-2013 |
| 20130235892 | MINIATURIZED SOLID-STATE LASING DEVICE, SYSTEM AND METHOD - A solid-state lasing device includes a micro-chip oscillator (MCO) affixed to a first tube, and a volume Bragg grating (VBG) plate affixed to a second tube. The second tube is configured to be telescopically coupled to the first tube with a slip fit such that the VBG plate is concentrically aligned with and is positioned at a specified distance from the MCO. | 09-12-2013 |
| 20130243018 | GAIN MEDIUM WITH IMPROVED THERMAL CHARACTERISTICS - A laser assembly ( | 09-19-2013 |
| 20130243019 | LASER DIODE ARRAY AND LASER DIODE UNIT - A laser diode array includes: a heat dissipator; a plurality of submounts disposed independently of one another on the heat dissipator; and a plurality of laser diode devices including two or more kinds of laser diode devices with different oscillation wavelengths, the laser diode devices being disposed on the respective submounts, and being electrically connected to one another. | 09-19-2013 |
| 20130243020 | Epitaxial-Side-Down Mounted High-Power Semiconductor Lasers - A laser apparatus configured for epitaxial-side-down mounting on a heat sink. The laser apparatus includes a semiconductor laser structure and at least one post on a substrate where the laser structure and post are separated from each other by a channel. The laser structure and the posts optionally are coated with a heat-spreading material layer and are configured so that the maximum height of the posts is about the same as the maximum height of the laser structure. When the laser apparatus is mounted to a heat sink in an epi-down configuration using solder applied to the top of the laser structure and the at least one post, the channels between the at least one post and the laser structure provide a relief flow path for the solder and ensure that the laser structure does not come directly into contact with the solder. | 09-19-2013 |
| 20130250986 | OPTICALLY PUMPED SURFACE EMITTING LASERS INCORPORATING HIGH REFLECTIVITY/ BANDWIDTH LIMITED REFLECTOR - Optically pumped laser structures incorporate reflectors that have high reflectivity and are bandwidth limited to a relatively narrow band around the central laser radiation wavelength. In some cases, the reflectors may be ¾-wavelength distributed Bragg reflectors (DBRs). | 09-26-2013 |
| 20130250987 | SEMICONDUCTOR LASER DEVICE - A semiconductor laser device comprises a base, a first conductive layer, a second conductive layer, a third conductive layer, and a semiconductor laser chip in this order, each of which has a respective emitting-side end portion. The emitting-side end portion of the first conductive layer is in a common plane with the emitting-side end portion of the base. A thickness of the second conductive layer is greater than a thickness of the first conductive layer. The emitting-side end portion of the second conductive layer is disposed inward of the emitting-end portion of the first conductive layer. The emitting-side end portion of the third conductive layer is in a common plane with the emitting-side end portion of the second conductive layer. The emitting-side end portion of the semiconductor laser chip is disposed outward of the emitting-side end portion of the third conductive layer. | 09-26-2013 |
| 20130272330 | MULTIBEAM ARRAY OF TOP EMITTING VCSEL ELEMENTS - A top emitting VCSEL array may be coupled to a separate heat spreading superstrate that may be positioned above the apertures of the array and that may be able to transmit the emitted beams through the heat spreading superstrate. The VCSEL devices in the array may be controlled by an electrical connection to a pattern of conductive elements positioned in close contact with, but electrically isolated from, the heat spreading superstrate. The conductive elements may electrically control one or more of the VCSEL devices to enable sectional control of the light output. The elements may also be arraigned in a ground-signal-ground or coplanar waveguide configuration to improve the frequency response of the array. | 10-17-2013 |
| 20130287053 | METHOD AND DEVICE FOR EMITTING A LASER BEAM IN A HOUSING - A device for emitting a laser beam comprises, in a housing, a laser-emitting component emitting a laser beam and mounted on a base, a heat-dissipating component, at least one collimating lens, and a lens mounting. The heat-dissipating component dissipates the heat produced by the laser of the laser-emitting component and secures the base of the laser-emitting component. The heat-dissipating component has a positioning mark and at least three holes for centering pins machined together with the positioning mark. The lens mounting secures the lens opposite the laser-emitting component and is positioned relative to the heat-dissipating component by at least three centering pins positioned in the holes of the heat-dissipating component. | 10-31-2013 |
| 20130308667 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS - A semiconductor light emitting device includes a nitride semiconductor layer, an insulating film, a first electrode, and a second electrode which are provided on a substrate. The nitride semiconductor layer includes a second cladding layer having a stripe-shaped ridge. The insulating film is provided on a portion of the second cladding layer including the at least one ridge. The first electrode is provided to contact the upper surface of the ridge. The second electrode is provided to contact the upper surface of the first electrode, the upper surface of the insulating film, and a portion of the second cladding layer exposed from the insulating film. | 11-21-2013 |
| 20130336348 | SEMICONDUCTOR OPTICAL CRYOCOOLER - There is provided a laser cooling apparatus including: a laser for providing an emission; a silicon-on-insulator substrate; and a thin film microstructure thermally anchored to the silicon-on-insulator substrate, the thin film microstructure being made from a material selected from either a II-VI binary compound semiconductor or a II-VI tenary compound semiconductor. | 12-19-2013 |
| 20140003457 | Interposer Configuration With Thermally Isolated Regions For Temperature-Sensitive Opto-Electronic Components | 01-02-2014 |
| 20140098831 | SEMICONDUCTOR LASER DEVICE - A semiconductor laser includes a ridge section on top of a semiconductor laminated section. The ridge section is a stripe-shaped projection or ridge and serves as a constriction structure for constricting current and light. A pair of terrace sections is located on top of the semiconductor laminated structure. The terrace sections are raised island portions sandwiching and spaced from the ridge section. An active region is located below the ridge section as viewed in plan. High refractive index regions are located on both sides of the active region and below the terrace sections, respectively. Cladding regions are located between the active region and the high refractive index regions. The high refractive index regions have a higher refractive index than the cladding regions. | 04-10-2014 |
| 20140126592 | AIR-COOLED LASER DEVICE - Air-cooled laser devices and formation methods are provided. An exemplary air-cooled laser device can include at least a laser active slab, a first silicon carbide clad, a second silicon carbide clad, a first laser diode array, and a first cylindrical lens. The first and second silicon carbide clads can be symmetrically bonded to the laser active slab and can have a surface area greater than the laser active slab to form an air duct surrounding side surfaces of the laser active slab and between the silicon carbide clads. The first laser diode array can emit first input pump laser beams to be collimated by the first cylindrical lens to provide parallel and quasi-parallel pump laser beams that are guided by the air duct to enter into the laser active slab from at least a first side surface of the laser active slab. | 05-08-2014 |
| 20140169395 | SOLID LASER APPARATUS - A solid laser apparatus which includes: two reflection elements for forming an oscillator; a plate-shaped gain medium being disposed between the two reflection elements, thereby augmenting a stimulated emission light in a thickness-wise direction; a doughnut- or deformed-doughnut-type planar waveguide being disposed so as to make an inner peripheral face thereof come in contact with an outer peripheral face of the plate-shaped gain medium; and a plurality of excited-light sources being directed in five or more directions, the excited-light sources being coupled to an outer peripheral face of the doughnut- or deformed-doughnut-type planar waveguide so as to make excited lights propagate from the outer peripheral face of the doughnut- or deformed-doughnut-type planar waveguide to the plate-shaped gain medium. | 06-19-2014 |
| 20140211819 | SEMICONDUCTOR LASER APPARATUS AND METHOD FOR MANUFACTURING SAME - The semiconductor laser device of the present invention has a conductive first heatsink member, a conductive first adhesive, and a semiconductor laser element. The first adhesive is disposed on the first heatsink member, and the semiconductor laser element is disposed on the first adhesive. The first adhesive reaches an upper part of the side surface of the first heatsink member under the laser emission surface for laser emission of the semiconductor laser element. The structure further improves heat dissipation of the semiconductor laser element; at the same time, it is effective in obtaining laser light from the semiconductor laser element. | 07-31-2014 |
| 20140219302 | THERMAL MANAGEMENT IN LASER DIODE DEVICE - Embodiments are disclosed that relate to reducing inductive losses and controlling driver and laser diode temperatures in an optical assembly comprising a laser diode. For example, one disclosed embodiment provides an optical assembly comprising a printed circuit board, and a laser diode package and laser diode driver mounted to the printed circuit board. Further, a heat sink is coupled to the laser diode driver and configured to provide a first thermal path for conducting heat from the laser diode driver. Additionally, a coupler may further be coupled to the laser diode package and printed circuit board, wherein the coupler is configured to provide a second, different thermal path for conducting heat from the laser diode package. | 08-07-2014 |
| 20140247846 | Low Inductance Laser Diode Bar Mount - The laser mount arrangement can have a laser bar and a driver positioned adjacent to one another and secured against a connection face of a heat sink base. The heat sink base is connected to and forms a first electrical connection between the laser bar and the driver. A second electrical connection is also provided between the laser bar and the driver opposite the heat sink base, which can be in the form of a flexible metal sheet with a narrow upward fold. This arrangement can provide a low inductance path for the current. | 09-04-2014 |
| 20140294025 | LASER DIODE MOUNTING SUBSTRATE FOR AUTOMOTIVE LAMP MODULE - Provided is a laser diode mounting substrate for an automotive lamp module using a laser diode. The substrate includes: a substrate body with a power supply circuit pattern, which electrically connects a connector with a contact point of the laser diode, on the top; a first heat conduction layer disposed at the area except for the power supply circuit pattern, on the top of the substrate body; and a second heat conduction layer disposed on the bottom of the substrate body, in which at least one heat transfer hole is disposed through the first heat conduction layer, the substrate body, and the second heat conduction layer. Therefore, the present invention provides an effect that heat generated by the laser diode can be effectively dissipated. | 10-02-2014 |
| 20140321489 | Silicon-Based Cooling Package for Light-Emitting Devices - Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a non-metal base plate and a silicon-based cover element disposed on the base plate. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the one or more light-emitting devices between the base plate and the cover element with at least a portion of a light-emitting surface of each of the one or more light-emitting devices exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate. | 10-30-2014 |
| 20140328361 | SEMICONDUCTOR PACKAGE - A metallic ring is located on a multilayer ceramic substrate. An optical semiconductor laser is located on the multilayer ceramic substrate, inside the metallic ring. A metallic cap with a window is joined to the metallic ring. The metallic cap covers the optical semiconductor laser. An external heat sink is joined to an external side surface of the metallic cap. These features make it possible to improve high-frequency characteristics, producibility, and heat dissipation. | 11-06-2014 |
| 20140334508 | Semiconductor Laser Diode - A semiconductor laser diode is provided. A semiconductor layer sequence has semiconductor layers applied vertically one above the other. An active layer includes an active region having a width of greater than or equal to 30 μm emitting laser radiation during operation via a radiation coupling-out surface. The radiation coupling-out surface is formed by a lateral surface of the semiconductor layer sequence and forms, with an opposite rear surface, a resonator having lateral gain-guiding in a longitudinal direction. The semiconductor layer sequence is heated in a thermal region of influence by reason of the operation. A metallization layer is in direct contact with a top side of the semiconductor layer sequence | 11-13-2014 |
| 20140341242 | RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - According to the present invention, a resin composition having superior workability is provided. The paste-like resin composition of the present invention adheres a semiconductor element and a base material, and contains (A) a thermosetting resin and (B) metal particles. d | 11-20-2014 |
| 20140348192 | METHOD OF ASSEMBLING VCSEL CHIPS ON A SUB-MOUNT - The present invention relates to a method of assembling VCSEL chips ( | 11-27-2014 |
| 20140362883 | Laser Diode Assembly - A laser diode assembly includes a housing having a housing part and a mounting part, which is connected to the housing part and which extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part. The laser diode chip has, on a substrate, semiconductor layers with an active layer for emitting light. The housing part and the mounting part have a main body composed of copper and at least the housing part is steel-sheathed. A first solder layer having a thickness of greater than or equal to 2 μm is arranged between the laser diode chip and the mounting part. The laser diode chip has a radiation coupling-out area, on which a crystalline protective layer is applied. | 12-11-2014 |
| 20140376581 | Solid-State Laser System - A laser system includes a laser-active solid and a heat sink. The heat sink is thermally coupled with the laser-active solid. The laser-active solid and the heat sink are joined together by at least one of direct bonding or laser welded with one another via at least one weld location. | 12-25-2014 |
| 20150016481 | Laser Diode With Internal Air Cooling - The invention relates to a laser diode ( | 01-15-2015 |
| 20150023376 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a first heat sink and a second heat sink both formed of an insulating member and facing and thermally connected to each other, and a semiconductor light-emitting element. The semiconductor light-emitting element is held in a cavity between the first heat sink and the second heat sink. The second heat sink has a first electrode and a second electrode on a surface facing the first heat sink, and a third electrode and a fourth electrode on a surface opposite to the surface facing the first heat sink. The first electrode is connected to a lower electrode of the light-emitting element. The second electrode is connected to an upper electrode of the light-emitting element. The first electrode and the third electrode are connected to each other, and the second electrode and the fourth electrode are connected to each other. | 01-22-2015 |
| 20150023377 | INTERPOSER CONFIGURATION WITH THERMALLY ISOLATED REGIONS FOR TEMPERATURE-SENSITIVE OPTO-ELECTRONIC COMPONENTS - An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices. | 01-22-2015 |
| 20150030044 | Conduction Cooled High Power Semiconductor Laser And Method For Fabricating The Same - A conduction cooled high power semiconductor laser and a method for fabricating the same are provided. The conduction cooled high power semiconductor laser comprises a heat sink ( | 01-29-2015 |
| 20150036706 | TRANSITION-METAL-DOPED THIN-DISK LASER - A laser includes a Ti:sapphire gain-medium in the form of a thin-disk. The thin-disk gain-medium is optically pumped by pump-radiation pulses having a wavelength in the green region of the electromagnetic spectrum. The pump-radiation pulses have a duration less than twice the excited-state lifetime of the gain-medium. | 02-05-2015 |
| 20150055667 | LASER COMPONENT AND METHOD OF PRODUCING IT - A laser component includes a housing in which a first carrier block is arranged. A first laser chip having an emission direction is arranged on a longitudinal side of the first carrier block. The first laser chip electrically conductively connects to a first contact region arranged on the first carrier block and a second contact region arranged on the first carrier block. There is a respective electrically conductive connection between the first contact region and a first contact pin of the housing and between the second contact region and a second contact pin of the housing. | 02-26-2015 |
| 20150063387 | HIGH BRIGHTNESS PULSED VCSEL SOURCES - A VCSEL device having a mesa for generating laser light includes a centralized thermal containment area and a thermal discharge area surrounding the centralized thermal containment area. The device includes a thermal lensing structure for enhancing or controlling heat flow within the centralized thermal containment area and the thermal discharge area and creating and maintaining an index of refraction between the centralized thermal containment area and the thermal discharge area. The VCSEL device operates as a multimode device when driven at a first current in a continuous wave and the VCSEL device operates as a single mode device when driven at a second current at a pulse rate shorter than an overall thermal time constant of the VCSEL device. | 03-05-2015 |
| 20150092802 | OPTICALLY PUMPED VERTICAL EXTERNAL-CAVITY SURFACE-EMITTING LASER DEVICE - The present invention relates to an optically pumped vertical external-cavity surface-emitting laser device comprising at least one VECSEL ( | 04-02-2015 |
| 20150131687 | LASER MODULE - A laser module includes a Transmitter Optical Sub-Assembly (TOSA) and a heat radiating means. The TOSA generates light by an electrical signal and transmits the generated light through an optical fiber. The heat radiating means is in contact with the TOSA to discharge heat generated by the TOSA. | 05-14-2015 |
| 20150146749 | LIGHT-EMITTING ELEMENT ARRAY - A light-emitting element array includes light-emitting elements that emit light in a direction perpendicular to a substrate. Each light-emitting element includes the substrate, a first nitride semiconductor layer on the substrate and having a mesa portion, an active layer made of a nitride semiconductor disposed on the surface of the mesa portion of the first semiconductor layer opposite the substrate, a second nitride semiconductor layer on the active layer, and a heat radiation layer disposed so that the surface formed by projecting the heat radiation layer on a plane perpendicular to the optical axis of the light-emitting element does not overlap with the surface formed by projecting the mesa portion on the same plane when viewed in the optical axis direction. When the light-emitting element is projected on a plane perpendicular to the optical axis, the surface has an area in a specific range. | 05-28-2015 |
| 20160079729 | Heat Dissipation System for Optical Module - A heat dissipation system for an optical module, related to communication fittings technologies, is provided to improve heat dissipation efficiency of the optical module. The heat dissipation system for an optical module includes a circuit card on which at least one optical module is mounted, where the optical module includes a housing and a laser disposed inside the housing. A first heat dissipation apparatus is fixedly disposed on the circuit card. A heat dissipation window is provided in an area that is above the laser and on the housing of the optical module. The first heat dissipation apparatus performs heat dissipation on the heat dissipation window. | 03-17-2016 |
| 20160099543 | SEMICONDUCTOR LASER DEVICE - In at least one opening of a plurality of openings | 04-07-2016 |
| 20160118771 | METHOD AND APPARATUS FOR MOUNTING A SEMICONDUCTOR DISK LASER (SDL) - The present invention describes a method and apparatus for mounting a semiconductor disc laser (SDL). In particular there is described a cooling apparatus assembly ( | 04-28-2016 |
| 20160204575 | LASER DIODE WITH COOLING ALONG EVEN THE SIDE SURFACES | 07-14-2016 |
| 20160254639 | SEMICONDUCTOR LASER LIGHT SOURCE | 09-01-2016 |
| 20170237227 | SEMICONDUCTOR LASER DEVICE | 08-17-2017 |
| 20180026423 | MECHANICALLY ISOLATED OPTICALLY PUMPED SEMICONDUCTOR LASER | 01-25-2018 |
