| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 365185100 | Extended floating gate | 6 |
| 20080232162 | One time programming cell structure and method of fabricating the same - A One Time Programming (OTP) cell structure, a method of fabricating an OTP structure, and a method of programming a OTP cell structure. The OTP structure comprises a semiconductor substrate; an n Metal-Oxide-Semiconductor (nMOS) programming structure formed on the substrate; wherein respective electrical contacts to a source of the nMOS programming structure and to a p-bulk of the substrate are separated for individual biasing of the source and the p-bulk of the substrate. | 09-25-2008 |
| 20090207655 | MULTIPLE TIME PROGRAMMABLE (MTP) PMOS FLOATING GATE-BASED NON-VOLATILE MEMORY DEVICE FOR A GENERAL PURPOSE CMOS TECHNOLOGY WITH THICK GATE OXIDE - A multiple time programmable (MTP) memory cell, in accordance with an embodiment, includes a floating gate PMOS transistor, a high voltage NMOS transistor, and an n-well capacitor. The floating gate PMOS transistor includes a source that forms a first terminal of the memory cell, a drain and a gate. The high voltage NMOS transistor includes a source connected to ground, an extended drain connected to the drain of the PMOS transistor, and a gate forming a second terminal of the memory cell. The n-well capacitor includes a first terminal connected to the gate of the PMOS transistor, and a second terminal forming a third terminal of the memory cell. The floating gate PMOS transistor can store a logic state. Combinations of voltages can be applied to the first, second and third terminals of the memory cell to program, inhibit program, read and erase the logic state. | 08-20-2009 |
| 20100157669 | Floating Gate Inverter Type Memory Cell And Array - A non-volatile memory (NVM) cell and array includes a control capacitor, tunneling capacitor, CMOS inverter and output circuit. The CMOS inverter includes PMOS and NMOS inverter transistors. The control capacitor, tunneling capacitor and PMOS and NMOS inverter transistors share a common floating gate, which is programmed/erased by Fowler-Nordheim tunneling. The output circuit includes PMOS and NMOS select transistors. The PMOS inverter and select transistors share a common source/drain region. Similarly, the NMOS inverter and select transistors share a common source/drain region. This configuration minimizes the required layout area of the non-volatile memory cell and allows design of arrays with smaller footprints. Alternately, the tunneling capacitor may be excluded, further reducing the required layout area of the NVM cell. In this case, the NMOS inverter transistor functions as a tunneling capacitor for programming and erasing the cell, and the PMOS inverter transistor functions as a tunneling capacitor for erasing the cell. | 06-24-2010 |
| 20110157972 | FTP MEMORY DEVICE PROGRAMMABLE AND ERASABLE AT CELL LEVEL - An embodiment of non-volatile memory device integrated in a chip of semiconductor material is proposed. The memory includes at least one sector of a plurality of memory cells; each sector includes a storage region of a first type of conductivity and a further storage region of a second type of conductivity. Each memory cell includes a first region and a second region of the second type of conductivity, which are formed in the storage region for defining a storage transistor of floating gate MOS type of the first type of conductivity; the memory cell likewise includes a further first region and a further second region of the first type of conductivity, which are formed in the further storage region for defining a further storage transistor of floating gate MOS type of the second type of conductivity. The memory cell also includes a common floating gate of the storage transistor and the further storage transistor. The memory device further includes programming means for programming each memory cell individually by programming the corresponding floating gate through the corresponding storage transistor, and erasing means for erasing each memory cell individually by erasing the corresponding floating gate through the corresponding further storage transistor. | 06-30-2011 |
| 20120236635 | Logic-Based Multiple Time Programming Memory Cell - A non-volatile memory system includes one or more non-volatile memory cells. Each non-volatile memory cell comprises a floating gate, a coupling device, a first floating gate transistor, and a second floating gate transistor. The coupling device is located in a first conductivity region. The first floating gate transistor is located in a second conductivity region, and supplies read current sensed during a read operation. The second floating gate transistor is located in a third conductivity region. Such non-volatile memory cell further comprises two transistors for injecting negative charge into the floating gate during a programming operation, and removing negative charge from the second floating gate transistor during an erase operation. The floating gate is shared by the first floating gate transistor, the coupling device, and the second floating gate transistor, and extends over active regions of the first floating gate transistor, the coupling device and the second floating gate transistor. | 09-20-2012 |
| 20160035421 | Non-volatile memory for high rewrite cycles application - A non-volatile memory has an array of non-volatile memory cells. Each of the non-volatile memory cells includes a coupling device formed on a first well, a read device, a floating gate device formed on a second well and coupled to the coupling device, a program device formed on the second well, and an erase device formed on a third well and coupled to the first floating gate device. The read device, the program device, and the erase device are formed on separate wells so as to separate the cycling counts of a read operation, a program operation and an erase operation of the non-volatile memory cell. | 02-04-2016 |
