Class / Patent application number | Description | Number of patent applications / Date published |
361813000 | Lead frame | 40 |
20080198568 | Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness - An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness. | 08-21-2008 |
20080205025 | Package Having a Plurality of Mounting Orientations - A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus. | 08-28-2008 |
20080253104 | LEAD FRAME, MOLDING DIE, AND MOLDING METHOD - In a lead frame ( | 10-16-2008 |
20080259586 | Circuit Structure - There is provided a circuit structure in which a control circuit is formed on the upper surface of an insulating plate | 10-23-2008 |
20080266828 | LEAD FRAME WITH SOLDER FLOW CONTROL - A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding. | 10-30-2008 |
20080285251 | Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same - A packaging substrate with fiat bumps for an electronic device and a method of manufacturing the same relate to the production of the packaging substrate for an electronic device, which comprises base islands and pins structurally and wherein the base islands and pins which all exhibit flat bump shape distribute on the front face of the substrate; the bottom side of the bumps, namely the rear faces of the base islands and pins are contiguous in the same substrate; in the packaging body of a single electronic device to be formed in later procedure, one or more base island may be included, the pins may arrange on one single side of the base island, also may arrange on the both sides or three sides of the base island, or may surround the base island so as to form the structure of one or more circuits of pins. The method includes that take a metal substrate is prepared, mask layers are adhered onto both sides of the metal substrate, the parts of the mask layers which need to be etched are removed, then half-etching is performed to form the recessed half-etching area, and then the residual mask layers on the metal substrate are removed to product the packaging substrate with flat bumps. | 11-20-2008 |
20080316729 | Skew controlled leadframe for a contact module assembly - A leadframe for a contact module assembly includes a terminal set having first, second and third terminals configured to operate in one of a signal-signal-ground pattern and a ground-signal-signal pattern. Each of the terminals have a length that extends between a mating end and a mounting end, wherein a difference in lengths between the first terminal and the second terminal is the same as a difference in lengths between the second terminal and the third terminal such that the terminal set has the same amount of skew between the terminals defining signal contacts in both the signal-signal-ground pattern and the ground-signal-signal pattern. | 12-25-2008 |
20090016038 | MATRIX RELAY - To provide a matrix relay which has excellent extensibility that can easily change the number of contact circuits as required, a small number of components to be inventory-controlled, a small number of assembling processes and is highly productive. Therefore, there is provided a matrix relay wherein row leads | 01-15-2009 |
20090161333 | Auto-cling leads of electric device - Automatic clinging leads of an electric device are provided for an unassisted mounting on thru-holes of a printed circuit board. Each of the leads of the device has three continuous right-angled sections including a longitudinal proximal end section extending from the terminal region of the electric element, a latitudinal distal end section extending at right angle with respect to the proximal end section, and a bent midsection for connecting the proximal and distal end sections at the diametrically opposite right angle to the angle between the proximal and distal end sections to provide a generally laterally extending lead with three alternating bends between the three sections. The device leads can be inserted into the thru-holes of the circuit board through a 90-degree swivel motion that causes a secure flush cling of the leads and in turn a low profile mounting of the device onto the circuit board around thru-holes. | 06-25-2009 |
20090168388 | INTEGRATED CIRCUIT DEVICE AND METHOD OF PRODUCING - An electronic device which comprises a lead frame comprising at least one clip, a capacitor comprising at least one terminal, the at least one terminal being received in the at least one clip, and a semiconductor chip attached to the lead frame. | 07-02-2009 |
20090196006 | Substrate structure of secure digital input/output module interface and its manufacturing method - A substrate structure of a secure digital input/output module interface and its manufacturing method are disclosed herein. First, a substrate is provided, wherein the substrate has a plurality of conductive contact portions abreast arranged on a lower surface of the substrate. Next, a lead frame with a side rail and a plurality of fingers abrest arranged thereon is provided, wherein any one of those fingers has an internal contact and an external contact. Then, those internal contacts of those fingers are electrically connected to those conductive contact portions of the substrate. Further, a sigulation process and a molding process are provided to form a single structure of secure digital interface module. Those fingers of the lead frame are positioned one-on-one to those conductive contact portions of the substrate to improve the mechanical properties and reduce the size of the substrate. | 08-06-2009 |
20090244875 | Lead frame module for manufacturing light emitting diodes - A lead frame module integrally formed from a single thin metal sheet includes: parallel first and second rails extending in a first direction; and first and second lead frame sets connected to the first and second rails, respectively. The first and second lead frame sets respectively include a plurality of lead frames extending in a second direction perpendicular to the first direction. Each of the lead frames of the first and second lead frame sets has a pair of connecting leads and a pair of packaging leads. Each of the packaging leads is connected to a respective one of the connecting leads. The connecting leads of the lead frames of the first lead frame set are interdigitated with and are connected to the connecting leads of the lead frames of the second lead frame set. | 10-01-2009 |
20100014269 | SEMICONDUCTOR MODULE AND METHOD - A semiconductor module and a method. One embodiment provides a housing with a housing frame and a pluggable carrier which is plugged in the housing frame. The pluggable carrier is equipped with a lead which includes an internal portion which is arranged inside the housing, and an external portion which is arranged outside the housing. The internal portion is electrically coupled to an electric component of the power semiconductor module. The external portion allows for electrically coupling the power semiconductor module. | 01-21-2010 |
20100027234 | Display Device - A display device which narrows a width of a frame thereof is provided. A display device includes a first substrate on which a plurality of switching elements is formed, a second substrate which is arranged to face the first substrate in an opposed manner, and a frame which is mounted on an outer peripheral portion of the first substrate by way of an adhesive layer. The adhesive layer and the frame each have an opening at a position corresponding to the plurality of switching elements formed on the first substrate, and an inner peripheral surface of the opening of the frame and an inner peripheral surface of the opening of the adhesive layer are made coplanar with each other. | 02-04-2010 |
20100110654 | INNER-CONNECTING STRUCTURE OF LEAD FRAME AND ITS CONNECTING METHOD - An inner-connecting structure of the lead frame is disclosed in the present invention, which includes a plurality of leads, an insulation film arranged on a portion of a first surface of those leads, a plurality of holes formed on the insulation film to expose a portion of the first surface of a portion of those leads, and a conductive element selectively connecting the exposed portion of those leads electrically. Besides, an inner-connecting method of the lead frame is also disclosed herein. The insulation film is utilized to separate the conductive element from the lead frame so that the lead can be easily interconnected with each other. | 05-06-2010 |
20100165596 | Lead frame for quad flat no-lead package - A lead frame for a quad flat no-lead package includes a plurality of units arranged in a matrix manner and each having four comers. Each of the corners extends outwards to define an attaching portion for attachment to a UV tape such that four sides of each of the units won't fly off when the sides are cut off. | 07-01-2010 |
20100165597 | LASER APPARATUS AND MANUFACTURING METHOD THEREOF - A laser apparatus comprises: a lead frame comprising a first outer lead and a first inner lead connected to the first outer lead; mold resin that has a top surface, does not seal the first outer lead but does seal the first inner lead and leaves part of the first inner lead exposed on the top surface; a sub-mount comprising a mounting surface and a back surface facing each other, the mounting surface facing the top surface of the mold resin and the back surface being not covered with the mold resin; and a laser element mounted on the mounting surface of the sub-mount and electrically connected to the exposed part of the first inner lead. | 07-01-2010 |
20100232131 | FLMP BUCK CONVERTER WITH A MOLDED CAPACITOR - An encapsulated buck converter module includes a low side transistor and a control integrated circuit bonded to a first section on a first side of a leadframe, a first clip between a source of the low side transistor and a second section, a source contact of a high side transistor attached to the first section on a second side of the leadframe with a gate contact of the high side transistor attached to a third section, a conductive member attached to the first and second sections on the second side of the leadframe wherein the first side of the conductive member attached to the second conductive member forms a conductive path with a portion of a second side of the conductive member while any portion of the first side of the conductive member attached to the first component attachment section is insulated from the first side of the conductive member, a first plate of a capacitor attached to a drain contact of the high side transistor and a second plate of the capacitor attached to the second side of the conductive member, and means for forming an external connection to the drain contact of the high side transistor. | 09-16-2010 |
20100302756 | METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE - A method of manufacturing an electronic device, the method includes: preparing a first lead frame having a first lead, the first lead having a first portion located in a first region; electrically connecting the first lead and a first electronic part; bending the first lead such that the first portion is located outside the first region; arranging a second lead frame to overlap the first lead frame such that a second portion of a second lead of the second lead frame is located in the first region; and electrically connecting the second lead and the second electronic part. | 12-02-2010 |
20110038134 | PREVENTING OR MITIGATING GROWTH FORMATIONS ON METAL FILMS - The disclosure, in one aspect, provides an electronics package | 02-17-2011 |
20110038135 | METAL FRAME FOR ELECTRONIC PART - Provided is a metal frame for an electronic part and capable of minimizing defects such as an electric short circuit caused by whiskers. The metal frame may include a lead unit electrically connected to an electronic device, and the lead unit may include a first metal layer that contains copper (Cu) as a main component and further contains boron (B) or beryllium (Be). | 02-17-2011 |
20110199749 | Led lead frame structure - An LED support's lead frame structure includes a side frame, a loading piece connected with the side frame, and at least one electrode pin. The electrode pin is located at one side of the loading piece and is spaced apart therefrom. The loading piece has a thickness same as that of the electrode pin. The electrode pin includes, connected in sequence, a first external leading section, a wire-bonding section, and a second external leading section. Both the first and the second external leading sections are connected with the side frame. The wire-bonding section includes a first protrusion. Therefore, the material required for wire-bonding is decreased, and the steps for machining the lead frame are decreased, so that the manufacturing process can be speeded up. This will help LED products miniaturized and the LED structure superior in thermal conductivity. | 08-18-2011 |
20120020047 | METHOD FOR IMPROVING THE ADHESION BETWEEN SILVER SURFACES AND RESIN MATERIALS - The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode. In a particular embodiment of this method, the present invention provides a method for producing a surface mounted electronic device comprising the following steps: (i) providing a lead frame having copper and silver surfaces, (ii) electrolytically treating the silver surfaces of the lead frame with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the lead frame is the cathode, (iii) encapsulating an electronic device together with the lead frame using a resin material. | 01-26-2012 |
20120106118 | LED LEAD FRAME HAVING INSERT-MOLDED ELECTROSTATIC DISCHARGE PROTECTION DEVICE - An LED lead frame includes an insulative base having a cavity on one side. A pair of conductive leads each has an end exposed in the cavity and another end extended out of insulative base. An electrostatic discharge protection device is insert-molded in the insulative base with only one side thereof exposed out of the insulative base, and is electrically interconnecting with the conductive leads. | 05-03-2012 |
20120162958 | BOND PACKAGE AND APPROACH THEREFOR - Lead-free or substantially lead-free structures and related methods are implemented for manufacturing electronic circuits. In accordance with various example embodiments, circuit components are joined using a copper-tin (Cu—Sn) alloy, which is melted and used to form a Cu—Sn compound having a higher melting point than the Cu—Sn alloy and both physically and electrically coupling circuit components together. | 06-28-2012 |
20120320556 | FRAME MEMBER, FRAME UNIT, MOUNTING BOARD UNIT, AND MANUFACTURING METHOD - Provided are a frame member having a reduced height, a frame unit, a mounting board unit, and a manufacturing method. The frame unit is to be attached to a board ( | 12-20-2012 |
20130094169 | Molded Power Supply System Having a Thermally Insulated Component - A molded system ( | 04-18-2013 |
20130128487 | AIR CAVITY PACKAGE CONFIGURED TO ELECTRICALLY COUPLE TO A PRINTED CIRCUIT BOARD AND METHOD OF PROVIDING SAME - In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole. The one or more second electrically conductive leads can be configured to couple to the printed circuit board at a first side of the one or more sides of the base. Other embodiments are disclosed. | 05-23-2013 |
20130208439 | METHOD OF FORMING AN ELECTRONIC PACKAGE AND STRUCTURE - In one embodiment, an electronic package structure includes multiple rows of I/O pads and is formed without a flag portion. An electronic device may be attached to a pair of adjacent inner rows of I/O pads. The pair of adjacent inner rows of I/O pads is configured to support, at least in part, the electronic device, and to receive connective structures, such as wire bonds. Connective structures may electrically connect the electronic device to the multiple rows of I/O pads, and an encapsulating layer covers portions of the I/O pads, the electronic device and the connective structures. | 08-15-2013 |
20130242524 | LED PACKAGES AND RELATED METHODS - An LED package with trenches traversing a die pad to provide a mechanical interlock mechanism to strengthen bonding between the die pad and an insulator such that de-lamination is less likely to occur between the die pad and the insulator. A chip carrying region is defined by a barrier portion formed by the insulator in the trenches and in gaps between electrodes and the die pad, such that a light converting layer is confined within the barrier portion. | 09-19-2013 |
20130308289 | TAPE FOR ELECTRONIC DEVICES WITH REINFORCED LEAD CRACK - Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion. | 11-21-2013 |
20130322046 | METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE - A method of manufacturing an electronic device, the method includes: preparing a first lead frame having a first lead, the first lead having a first portion located in a first region; electrically connecting the first lead and a first electronic part; bending the first lead such that the first portion is located outside the first region; arranging a second lead frame to overlap the first lead frame such that a second portion of a second lead of the second lead frame is located in the first region; and electrically connecting the second lead and the second electronic part. | 12-05-2013 |
20130343027 | METHOD FOR STACKING ELECTRONIC COMPONENTS - A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes:
| 12-26-2013 |
20140036471 | Thin Leadframe QFN Package Design of RF Front-Ends for Mobile Wireless Communication - Systems and methods are disclosed herein for a low cost, compact size, and thin half-etched leadframe quad-flat no-leads (QFN) package that integrates RF passive elements in the QFN leadframe for linearized PA design and RF FEMs. The integrated RF passive elements in the QFN leadframe may include RF inductors (e.g., meanders lines or spirals) for amplifier bias or RF matching, extension bar of the ground paddle for inter-stage matching or jumper pads for connection. The integrated RF passive elements may also include transmission lines for output power matching, coupled line structures such as RF couplers, RF divider or combiner realized using transmission lines with proper impedance and length, jumper pads for adjusting the bond wire length, etc. The RF parameters of the integrated passive elements are adjustable using different length and number of wire bond for fine tuning the performance of the PAM or the RF FEM. | 02-06-2014 |
20140071650 | WIRELESS MODULE WITH ACTIVE DEVICES - A wireless multichip module has a leadframe structure | 03-13-2014 |
20140111960 | LEADFRAME MODULE FOR AN ELECTRICAL CONNECTOR - A leadframe module for an electrical connector includes a leadframe having contacts initially held together as part of the leadframe. The contacts have mating ends configured to be mated to corresponding mating contacts. The contacts having mounting ends configured to be terminated to corresponding conductors. Dielectric shells coat corresponding contacts. Outer shields are applied to corresponding dielectric shells. Each of the contacts, dielectric shells and outer shields define corresponding shielded transmission lines of the leadframe module. Optionally, a ground plate may be coupled to each of the transmission lines and electrically connected to the outer shields of the transmission lines to electrically common each of the outer shields. | 04-24-2014 |
20140192506 | LEAD FRAME - A lead frame includes adjacent die pads which lie adjacent to each other; grounding leads extended from the adjacent die pads; a connecting bar by which the grounding leads extended from the adjacent die pads are interconnected. The grounding leads and the connecting bar are formed to be thinner at one surface than a maximum thickness of leads of the lead frame, the grounding leads extended from the adjacent die pads are aligned on a common axis while providing the connecting bar between the grounding leads, and a support projection is provided at the one surface on the connecting bar in the common axis. | 07-10-2014 |
20140247576 | HIGH-VOLTAGE PLATFORM - A device for carrying high-voltage equipment in an electrically-insulated manner includes a carrier platform which is mounted and electrically insulated by way of support insulators. The high-voltage equipment is supported on the carrier platform. The carrier platform has primary carriers with which the platform rests on the support insulators. In order to achieve a device that prevents deflections of the carrier platform in a cost-effective manner, the high-voltage equipment is at least partially arranged in a carrier structure that is equipped with support feet, with each foot arranged vertically above a primary carrier. | 09-04-2014 |
20140268624 | CARRIER FOR MOUNTING A PIEZOELECTRIC DEVICE ON A CIRCUIT BOARD AND METHOD FOR MOUNTING A PIEZOELECTRIC DEVICE ON A CIRCUIT BOARD - A carrier for mounting a piezoelectric device, e.g., a surface acoustic wave (SAW) device, on a circuit board and a method of mounting a piezoelectric device on a circuit board using such a carrier are disclosed. The carrier includes a carrier bottom, a plurality of metal contacts, and a carrier lid attached to the carrier bottom. The carrier bottom has an opening extending partially through the carrier bottom from a top surface thereof and the opening is configured such that when a piezoelectric device to be mounted in the carrier is inserted into the carrier bottom, the piezoelectric device is at least partially recessed within the carrier bottom. The metal contacts include a cantilevered end configured for electrical connection to a piezoelectric device. The carrier lid is configured to retain a piezoelectric device within the carrier bottom and to apply substantially even pressure across a top surface of a piezoelectric device. The method includes mounting the carrier bottom to the circuit board prior to insertion of the piezoelectric device and connection of the carrier lid. | 09-18-2014 |
20140328042 | Power Supply Module - A power supply module and a method for manufacturing the same are disclosed. The power supply module includes a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs. | 11-06-2014 |