| Entries |
| Document | Title | Date |
|---|
| 20080205019 | Method for Mutually Connecting Circuit Boards - A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings. | 08-28-2008 |
| 20080232076 | Attaching/Detaching Structure Of Electronic Device - The invention comprises a unit part | 09-25-2008 |
| 20080253101 | Liquid crystal display device - The present invention provides a liquid crystal display device which can establish the reliable connection between a printed circuit board and a semiconductor device in spite of the simple constitution thereof. The liquid crystal display device includes a liquid crystal display panel, a printed circuit board arranged close to the liquid crystal display panel, and a semiconductor device arranged between the liquid crystal display panel and the printed circuit board in a striding manner. The semiconductor device includes a flexible printed circuit board and a semiconductor chip. The flexible printed circuit board includes a plurality of first terminals connected to the printed circuit board and a plurality of second terminals connected to a liquid-crystal-display-panel side. The printed circuit board includes a solder resist film, an opening portion formed in the solder resist film, and a terminal portion arranged in the opening portion and consisting of a plurality of terminals connected to the first terminals of the flexible printed circuit board. The terminal portion of the printed circuit board and the first terminals of the semiconductor device are connected with each other by way of an anisotropic conductive film. The anisotropic conductive film overlaps with at least the respective terminals of the terminal portion of the printed circuit board and the solder resist film. | 10-16-2008 |
| 20080253102 | ELECTRONIC DEVICES FOR SURFACE MOUNT - Electronic devices are disclosed that allow for surface-mounting using solder while preventing solder from overflowing between external terminals of the electronic device, or between pads on a circuit board to which the external terminals are soldered. An exemplary electronic device has a base board made of an insulating material and having an outer surface comprising at least one external terminal for surface mounting of the device to the circuit board. A groove is defined at least part way around the external terminal on the outer surface. The groove accommodates overflowed solder and thus prevents unintended spread flow of the solder to locations that otherwise could cause short circuits and the like. The electronic device can include a resin board containing a thermoset resin, wherein the groove is formed by thermal or mechanical processing. | 10-16-2008 |
| 20080278923 | MULTI CHIP ELECTRONIC SYSTEM - An electronic system adapted to perform a corresponding function and including at least a first subsystem and a second subsystem, the first subsystem and the second subsystem being operatively couplable to each other through a plurality of electric connections to perform the function of the system, in which the first subsystem and the second subsystem are respectively integrated on a first material chip and on a second material chip, the plurality of electric connections including a plurality of conductive through holes formed in at least one of the first and second chips and adapted to form a corresponding plurality of inter-chip electric connections when the first and the second chips are superimposed. | 11-13-2008 |
| 20080278924 | DIE MODULE SYSTEM - A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board. | 11-13-2008 |
| 20080298037 | Mounting panel arrangement - A mounting panel arrangement having a plurality of mounting panels for optoelectronic components. Two adjacent mounting panels ( | 12-04-2008 |
| 20090034222 | Printed circuit board assembly and method of making a printed circuit board - A printed circuit board assembly includes a first printed circuit board having a plurality of electrical traces that is attached to a second printed circuit board having a plurality of electrical traces in a substantially perpendicular fashion. The first printed circuit board has a plurality of male terminal tabs that fit into a plurality of female terminal slots of the second printed circuit board to make a plurality of electrical connections between the electrical traces of the first printed circuit board and the electrical traces of the second printed circuit board. The assembly has at least two mechanical connections between the first printed circuit board and the second printed circuit board comprising connector blades that are substantially perpendicular to the first printed circuit board and to the second printed circuit board. The connector blades may also make electrical connections between electrical traces of the first and second printed circuit boards. A method of making an alternate printed circuit board for the assembly involves punching or drilling the alternate printed circuit board to provide a plurality of female terminals in an elongate slot. | 02-05-2009 |
| 20090116206 | PORTABLE ELECTRONIC DEVICE - A portable electronic device includes: a printed circuit board having opposite first and second surfaces and provided with at least one electronic component, the first surface being provided with at least one conductive pad that is electrically coupled to the electronic component; and a flexible circuit board having a main part stacked on the second surface of the printed circuit board, and an extension part extending and folded from the main part and stacked on the first surface of the printed circuit board. The extension part is provided with at least one conductive bump thereon. An outer surface of the main part is provided with at least one input key that is electrically coupled to the conductive bump. The conductive pad is bonded to the conductive bump. | 05-07-2009 |
| 20090129041 | Stacked semiconductor module, method of fabricating the same, and electronic system using the same - A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs. | 05-21-2009 |
| 20090135572 | Circuit Device and Method of Manufacturing the Same - Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on approximately the same plane. An electronic circuit including a conductive pattern and a circuit element is formed on each top surface of the circuit boards. Furthermore, these circuit boards are integrally supported by a sealing resin. Moreover, a lead connected to the electronic circuit formed on the surface of the circuit board is led out from the sealing resin to the outside. | 05-28-2009 |
| 20090135573 | Circuit board device, wiring board interconnection method, and circuit board module device - A circuit board device includes: plurality of wiring boards ( | 05-28-2009 |
| 20090135574 | WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD OF MANUFACTURING WIRING BOARD - The present disclosure relates to a method of manufacturing a wiring board. The method includes: (a) preparing a first board having a pad; (b) providing an insulating member on the first board, wherein a size of the insulating member is larger than that of the first board, when viewed from the top; (c) forming a via in the insulating member such that the via is directly connected to the pad; and (d) repeatedly forming a wiring layer and an insulating layer on the insulating member in which the via is formed, thereby forming a second board. | 05-28-2009 |
| 20090135575 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components. | 05-28-2009 |
| 20090154130 | Micro-sensor and manufacturing method thereof - The micro-sensor includes a first circuit substrate and a second circuit substrate. One surface of the first circuit substrate has an image sensing device electrically connected to main printed wires formed by a first wire group and a second wire group. On the other surface of the first circuit substrate has a main connector electrically connected to the second wire group. A plurality of first signal transmission lines connected to the first wire group. The second circuit substrate has a sub-connector that is electrically connected to sub printed wires having an equivalent number as and corresponding to the second wire group. The other end of the sub printed wires is electrically connected to a plurality of second signal transmission lines. Through connecting the connectors respectively disposed in different circuit boards to overcome the difficulty in the manufacturing process of concentrating all devices on a single circuit board. | 06-18-2009 |
| 20090154131 | CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE - A package substrate | 06-18-2009 |
| 20090161331 | Circuit Board Device, Wiring Board Connecting Method, and Circuit Board Module Device - A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards | 06-25-2009 |
| 20090168384 | Electronic apparatus - An electronic apparatus has a board; a first connection section which is mounted on the board; a component which is selectively mounted on the board; a flexible board which includes a second connection section and a reinforcing plate attached at a position of the second connection section; and a housing cover which includes a projection section which abuts the reinforcing plate in a state in which the second connection section of the flexible board is connected to the first connection section. The reinforcing plate has a length that allows the reinforcing plate to extend on the selectively mounted component in a state in which the second connection section of the flexible board is connected to the first connection section. | 07-02-2009 |
| 20090175019 | CIRCUIT-BOARD MODULE AND MANUFACTURING METHOD | 07-09-2009 |
| 20090190319 | THREE-DIMENSIONAL MODULE - A three-dimensional module having a first substrate holding a function element, and a second substrate holding other components. The first and second substrates are laid one above the other in a three-dimensional fashion, and are electrically and mechanically connected. The module has inter-substrate joining members interposed between the first and second substrates and joining the first and second substrates. Each inter-substrate joining member has a stress-absorption member and an electrically conductive stress-absorption member. The stress-absorption member has elasticity and mechanically joining the first and second substrates. The electrically conductive stress-absorption member connects the first and second substrates and can deform in a desirable direction. | 07-30-2009 |
| 20090213562 | System for interconnecting two substrates each comprising at least one transmission line - The present invention relates to an interconnection system of a first substrate ( | 08-27-2009 |
| 20090213563 | Interconnecting device and method used to electrically mount a daughter board to a motherboard - A device for connecting printed circuit boards. The device comprises an insulative housing and a plurality of conductive terminals arranged in the insulative housing. The insulative housing defines a first mounting surface, a second mounting surface, and flat pickup portions respectively disposed on opposite faces of the first mounting face and the second mounting face; each terminal includes a first leg on the first mounting surface, and a second leg on the second mounting surface. | 08-27-2009 |
| 20090268422 | SCALABLE ELECTRONIC PACKAGE ASSEMBLY FOR MEMORY DEVICES AND OTHER TERMINATED BUS STRUCTURES - A scalable electronic package assembly for memory devices and other terminated bus structures is disclosed. The scalable electronic package assembly includes a first electronic carrier and a second electronic carrier. The first electronic carrier includes a first set of electronic devices controlled by a controller. The second electronic carrier includes a second set of electronic devices that are also controlled by the controller on the first electronic carrier. The second electronic carrier is electrically connected to the first electronic carrier via multiple solder columns. The second electronic carrier is physically stacked on top of the first electronic carrier via an insulator. | 10-29-2009 |
| 20090268423 | INTERCONNECT SUBSTRATE AND ELECTRONIC CIRCUIT MOUNTED STRUCTURE - Interconnect substrate ( | 10-29-2009 |
| 20090279274 | Circuit boards - The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards ( | 11-12-2009 |
| 20100008058 | SEMICONDUCTOR DEVICE - Traffic between logic LSIs and memory is increasing year by year and there is demand for increase of capacity of communication between them and reduction of power consumption in the communication. Communication distances between LSIs can be reduced by stacking the LSIs. However, in a simple stack of logic LSIs and memory LSIs, it is difficult to ensure heat dissipation to cope with increasing heat densities and ensure transmission characteristics for fast communication with the outside of the stacked package. Also required is a connection topology that improves the performance of communication among the stacked LSIs while ensuring the versatility of the LSIs. An external-communication LSI, a memory LSI, and a logic LSI are stacked in this order in a semiconductor package and are interconnected by through silicon vias. Output terminals of multiple stacked LSIs are connected to an input terminal of a through silicon via of the stacked memory LSI and input terminals of multiple stacked LSIs are connected to an output terminal of a through silicon via of the stacked memory LSI, thereby directly connecting both of the external-communication LSI and the logic LSI to a wiring line of the memory LSI. | 01-14-2010 |
| 20100014267 | CIRCUIT BOARD DEVICE, ELECTRONIC DEVICE PROVIDED WITH THE SAME, AND GND CONNECTING METHOD - Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND connecting method are also provided. Circuit board device ( | 01-21-2010 |
| 20100020515 | METHOD AND SYSTEM FOR MANUFACTURING MICRO SOLID STATE DRIVE DEVICES - A method of manufacturing a stacked module is disclosed and in particular a micro solid state device (MSSD). | 01-28-2010 |
| 20100020516 | TERMINAL HAVING BUS BAR - A terminal is provided with a support portion configured to be mounted on a circuit board and having electrical insulation property, and a bus bar supported on the support portion and having electrically conductive property. The bus bar includes an external connecting portion configured to be electrically connected to external equipment, a first connecting portion configured to be electrically connected to the circuit board, and a second connecting portion configured to be electrically connected to another circuit board spaced from the circuit board, without passing through the circuit board. | 01-28-2010 |
| 20100033940 | INTER-BOARD COUPLING CONNECTOR AND CIRCUIT BOARD DEVICE USING INTER-BOARD COUPLING CONNECTOR - An object of the invention is to provide the effects of suppressing noise radiated from a plurality of coupling terminals for coupling between boards to the peripheral space outside of an inter-board coupling connector. | 02-11-2010 |
| 20100046187 | Electronic apparatus - A cable connects a circuit board mounted with an electronic circuit to a BT module that controls wireless communications compliant with Bluetooth (Registered Trademark). The cable is a connection cable that elastically deforms and applies pushing force in a direction to make the BT module leave away from the circuit board. A second holding piece, which is cantilever-shaped, moves to a releasing position at which holding the BT module is released by elastic deformation as well as moves to a supporting position at which the second holding piece presses the BT module by release of elastic deformation. | 02-25-2010 |
| 20100061072 | MULTI-LAYER PRINTED CIRCUIT BOARD - Ground via provided in an end portion of a multi-layer printed circuit board so as to suppress a leakage of magnetic field from the end portion of the board causes a problem that a digital circuit of high density cannot be mounted on the board due to necessity of area for locating the ground via. Further, a case of using solder plating for the end portion of the board causes a problem that manufacturing process is added and that numbers of days and costs for manufacturing the multi-layer printed circuit board are increased. | 03-11-2010 |
| 20100067208 | Packaged device and method of fabricating packaged-device - A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer. | 03-18-2010 |
| 20100073896 | BOARD HARDWARE DEVICE AND RADIO FREQUENCY BLIND-MATE CONNECTION DEVICE - An RF blind-mate connection device disclosed herein includes a duplexer, a power amplification circuit board, a transceiver, an RF signal connector, and a power connector. The duplexer and the transceiver are located at one end of the RF blind-mate connection device, and the transceiver is fixed on the duplexer; the power amplification circuit board is located at the other end of the RF blind-mate connection device, and the location of the power amplification circuit board corresponds to that of the duplexer; the RF signal connector is fixed on the duplexer and the power amplification circuit board; the power connector is fixed on the transceiver and the power amplification circuit board; and the RF signal connector and the power connector transmit both the power signal and the RF signal in a blind-mate way. A board hardware device is disclosed herein to transmit RF signals and power signals inside the RF module through the connector. | 03-25-2010 |
| 20100079967 | ELECTRONIC DEVICE HAVING ELECTRICALLY CONNECTING STRUCTURE - An electronic device is provided which makes it possible to reduce noise generated from a signal line around a connecting portion connecting a first body and a second body. The connecting portion has a first metallic portion. A first circuit board provided in the first body and a second circuit board provided in the second body. The signal line that electrically connects the first circuit board and the second circuit board via the connecting portion, in which the signal line is wound around the first metallic portion. | 04-01-2010 |
| 20100079968 | UPRIGHT CIRCUIT BOARD ASSEMBLY STRUCTURE - An improved upright circuit board assembly structure includes: an electronic component to be mounted on an external device so as for electrical functions of the electronic component to be used; and at least one circuit board including at least one first electrical connection portion and at least one second electrical connection portion. The first electrical connection portion and the second electrical connection portion are coupled to the external device by soldering with a solder paste. By soldering the circuit board to the external device in a double-sided, multi-point manner, the electronic component is mounted securely on the external device, and electric connection between the electronic component and the external device is enhanced. | 04-01-2010 |
| 20100079969 | FUNCTION EXPANSION DEVICE, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS SYSTEM - A function expansion device is electrically connected to an electronic apparatus by being inserted in a socket included in the electronic apparatus and expands a function of the electronic apparatus. The function expansion device includes a substrate on which a component is mounted, a first connecting terminal that is formed at an end portion of the substrate and is electrically connected to a first signal line that connects the electronic apparatus and the component in a one-to-one fashion, a second connecting terminal that is formed at the end portion of the substrate and is electrically connected to a second signal line that connects the electronic apparatus and the component redundantly, and a protection member that is formed to cover only the second connecting terminal. | 04-01-2010 |
| 20100118505 | TERMINATION APPARATUS AND METHOD FOR PLANAR COMPONENTS ON PRINTED CIRCUIT BOARDS - The disclosure involves the efficient termination of a winding PCB of a planar inductive component to a main PCB, using relatively little space and providing a low-resistance connection. The disclosed methods are especially suitable for planar structures where several winding PCBs, and/or winding PCBs and a main PCB, are all enclosed by the magnetic path components. The methods allow for a winding PCB to simply rest on the main PCB, or other winding PCBs, without any clearance. The disclosure employs mating sets of conductive annular rings with an optional interlocking terminal pin that allows two PCBs to be fixedly coupled together, while preserving a minimum distance between the solder-mask layers of the two PCBs in order to prevent the formation of unwanted electrical connections between the two PCBs. Solder is used to ensure effective coupling in each assembly of mating annular rings and optional terminal pin. | 05-13-2010 |
| 20100157560 | Wired circuit board and connection structure between wired circuit boards - A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer. | 06-24-2010 |
| 20100202126 | Stacked Mounting Structure and Method of Manufacturing Stacked Mounting Structure - There is provided a stacked mounting structure in which, it is possible to realize a narrowing of pitch and to secure a height which enables to mount components to be mounted, and a method of manufacturing stacked mounting structure. | 08-12-2010 |
| 20100208444 | CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER - The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group. | 08-19-2010 |
| 20100220457 | CONNECTING PORTION OF CIRCUIT BOARD AND CIRCUIT BOARD-CONNECTING STRUCTURE TECHNICAL FIELD - To provide a connecting portion of a circuit board and a circuit board-connecting structure, in which connecting portions can be positively connected together, and also a connecting process can be simplified. | 09-02-2010 |
| 20100254109 | MOUNT ASSEMBLY AND METHOD FOR MANUFACTURING MOUNT ASSEMBLY - A mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode. | 10-07-2010 |
| 20100265685 | WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PROCESS USING THE SAME - The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles. | 10-21-2010 |
| 20100277884 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE - The circuit-connecting material of the invention is a circuit-connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and the second circuit electrode laid facing each other, the circuit-connecting material comprising a film-forming material, a curing agent that generates free radicals upon heating, a radical-polymerizing substance, an isocyanate group-containing compound and a ketimine group-containing compound represented by the following general formula (I), wherein the isocyanate group-containing compound content is 0.1-5 parts by weight and the ketimine group-containing compound content is 0.1-5 parts by weight with respect to 100 parts by weight as the total of the film-forming material and radical-polymerizing substance. | 11-04-2010 |
| 20100277885 | CIRCUIT CONNECTING MATERIAL AND STRUCTURE FOR CONNECTING CIRCUIT MEMBER - A circuit connecting material which is situated between mutually opposing circuit electrodes and, upon pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, the circuit connecting material having a laminated construction comprising an anisotropic conductive adhesive layer A with conductive particles | 11-04-2010 |
| 20100284161 | STACKED MOUNTING STRUCTURE - There is provided a stacked mounting structure in which, it is possible to carry out testing of each substrate after the formation of (after manufacturing) the stacked mounting structure. | 11-11-2010 |
| 20100296258 | LOW COST, HIGH STRENGTH ELECTRONICS MODULE FOR AIRBORNE OBJECT - An electronics module is provided for utilization onboard an airborne object. In one embodiment, the electronics module includes a housing having a cavity therein, a first printed circuit board (PCB) disposed in the cavity, a second PCB disposed in the cavity above the first PCB, and a supportive interconnect structure. The supportive interconnect structure includes a substantially annular insulative body and a plurality of vias. The substantially annular insulative body extends around an inner circumferential portion of the housing between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB. The plurality of vias is formed through the substantially annular insulative body and electrically couples the first PCB to the second PCB. | 11-25-2010 |
| 20100321915 | CIRCUIT BOARD ARRANGEMENT - An arrangement including a first circuit board having a contact surface for contacting of a connecting element, a second circuit board, and a connecting element. The contact surface has a central contact point and a concentric ring surrounding the central contact point. The connecting element which is electrically contacted at a first side with the second circuit board and which at a second side in opposite relationship to the first side includes a first spring element at least one second spring element. The first spring element is electrically contacted with the central contact point of the first circuit board and the at least one second spring element is electrically contacted with the concentric ring of the first circuit board. | 12-23-2010 |
| 20100321916 | METHOD OF CONNECTION OF FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE OBTAINED THEREBY - An FPC and another circuit board having terminals parts where a plurality of conductive interconnects are arranged are prepared. An adhesive film is arranged between the terminal part of the FPC and the terminal part of the circuit board to form a stack. A rigid head having a pushing face on which a plurality of convex parts are formed is used to hot-press the stack from the FPC side to soften the adhesive film and locally expel the softened adhesive film at the locations pressed by the convex parts of the rigid head. | 12-23-2010 |
| 20100328920 | High-speed transmission circuit board connection structure - A high-speed transmission circuit board connection structure includes a first high-speed transmission circuit board including a laminated substrate including a first signal transmission wiring formed on a surface thereof and a ground plane formed inside thereof, a second high-speed transmission circuit board including a circuit substrate and a second signal transmission wiring formed on a surface of the circuit substrate, a conductive board connecting member for fixing the first and second high-speed transmission circuit boards to a surface thereof, and a bonding wire for electrically connecting the first signal transmission wiring and the second signal transmission wiring. The ground plane is exposed on a side end face of the laminated substrate, and a conductive film is formed on the side end face such that the ground plane of the first high-speed transmission circuit board is electrically connected to the board connecting member with the conductive film. | 12-30-2010 |
| 20110019384 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a central board and a peripheral board. The central board comprises a first connector, and is mounted with one or more of a CPU, memory, a north bridge chipset, and a south bridge chipset. The peripheral board is separated from the central board. The peripheral board comprises a second connector, and is mounted with a power source connector, a video chipset, an audio chipset, and a network card. The second connector is connected to the first connector to achieve communication between the central board and the peripheral board. The first connector and the second connector transmits one or more of DVP signals, VGA signals, SATA signals, LCD controlling signals, audio signals, speaker output signals, PCIE signals, LPC signals, PCI signals, video general input/output signals, USB signals between the central board and the peripheral board. | 01-27-2011 |
| 20110032687 | PLASMA DISPLAY DEVICE - A plasma display device is disclosed. In one embodiment, the device includes 1) a plasma display panel (PDP) configured to display an image, 2) a chassis base having first and second surfaces opposing each other, wherein the first surface of the chassis base supports the PDP and 3) a printed circuit board assembly (PBA) formed on the second surface of the chassis base. The PBA includes i) a plurality of electrode pads formed on a surface of the PBA and ii) a plurality of dummy pads interposed between and not electrically connected to neighboring electrode pads. The device further includes a flexible printed circuit (FPC) configured to electrically connect the PBA and the PDP, wherein the surface of the PBA faces the FPC, wherein the FPC contacts i) at least one of the dummy pads and ii) the electrode pads, and wherein the least one dummy pad and the electrode pads have substantially the same height defined from the surface of the PBA to the FPC. | 02-10-2011 |
| 20110032688 | DISTRIBUTED COMPUTING - On a typical motherboard the processor and memory are separated by a printed circuit data bus that traverses the motherboard. Throughput, or data transfer rate, on the data bus is much lower than the rate at which a modern processor can operate. The difference between the data bus throughput and the processor speed significantly limits the effective processing speed of the computer when the processor is required to process large amounts of data stored in the memory. The processor is forced to wait for data to be transferred to or from the memory, leaving the processor under-utilized. The delays are compounded in a distributed computing system including a number of computers operating in parallel. The present disclosure describes systems, method and apparatus that tend to alleviate delays so that memory access bottlenecks are not compounded within distributed computing systems. | 02-10-2011 |
| 20110051389 | BOARD TERMINAL - A board terminal includes a metal wire and concave portions formed on peripheral surfaces along the length of the wire. The metal wire is cut to a predetermined length, and the concave portions are formed by pressing the peripheral surfaces of the wire at intermediate portions along the length thereof. | 03-03-2011 |
| 20110058348 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first substrate having a power-source line, an IC device mounted on the first substrate and having a power-source line, a second substrate mounted on the IC device and having a base material, a power-source layer formed inside or on a surface of the base material, an insulation layer formed on the power-source layer, and a pad formed on the insulation layer, and a via conductor connecting the power-source layer and the pad. A first route connects the power-source line of the first substrate and the power-source line of the IC device. A second route connects the power-source line of the first substrate and the power-source layer of the second substrate. A third route connects the power-source layer of the second substrate and the power-source line of the IC device. | 03-10-2011 |
| 20110063815 | Robust FBEOL and UBM Structure of C4 Interconnects - A microcircuit article of manufacture comprises an electrical conductor electrically connected to both a first microcircuit element at a site comprising a first connector site having a first connector site axis and a second microcircuit element at a site comprising a second connector site having a second connector site axis. The first microcircuit element and the second microcircuit element are separated by and operatively associated with a layer comprising a first electrical insulator, whereas the conductor and the first microcircuit element are separated by and operatively associated with a layer comprising a second electrical insulator. At least one of the first electrical insulator layer and the second electrical insulator layer comprise a polymeric electrical insulator. In another embodiment, both electrical insulator layers comprise polymeric insulator layers. The microcircuit includes a UBM and solder connection to a FBEOL via opening. Sufficiently separating the first connector site axis and the second connector site axis so they are not concentric decouples the UBM and solder connection to the FBEOL via opening to substantially eliminate or minimize inter alia, electromigration and the white bump problem typical of lead free solders employed in C4 systems. A process comprises manufacturing this type of microcircuit article. | 03-17-2011 |
| 20110063816 | Wired circuit board, connection structure thereof, and connection method therefor - A wired circuit board includes a first wired circuit board provided with a first conductive pattern which has first terminals comprising placement surfaces for placing a meltable metal and first wires continuous with the first terminals; and a second wired circuit board provided with a second conductive pattern which has second terminals connected with the first terminals through the meltable metal and second wires continuous with the second terminals. The first wired circuit board and the second wired circuit board are arranged so that a first plane containing the first terminals and a second plane containing the second terminals are intersected with each other, and the placement surfaces are zoned so as to gradually widen toward the second terminals. | 03-17-2011 |
| 20110069465 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board (PCB) assembly includes two function boards which can be separated from each other. The PCB assembly can satisfy electronic devices of different dimensions, by arranging the separated function boards in appropriate available space in the electronic devices. | 03-24-2011 |
| 20110069466 | LOW INDUCTANCE POWER ELECTRONICS ASSEMBLY - A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor. | 03-24-2011 |
| 20110075392 | Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive Sheets - An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed. | 03-31-2011 |
| 20110080717 | INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD - An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a conductive plate including a connection terminal to be electrically connected to a power supply terminal or a ground terminal of each of the first circuit board and the second circuit board, an insulating member wrapping the conductive plate except for the connection terminal, and a conductive member penetrating the insulating member to electrically connect a signal terminal of the first circuit board to a signal terminal of the second circuit board. | 04-07-2011 |
| 20110080718 | INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD - An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a first conductive plate including a first connection terminal, a first insulating member wrapping the first conductive plate except for the first connection terminal, a second conductive plate including a second connection terminal, a second insulating member wrapping the second conductive plate except for the second connection terminal, an insulating substrate arranged between the first insulating member and the second insulating member, and a conductive member penetrating the first insulating member, the second insulating member and the insulating substrate. | 04-07-2011 |
| 20110080719 | Circuit board interconnection system, connector assembly, circuit board and method for manufacturing a circuit board - A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention. The circuit board adopts the impedance controlled mechanism which has a shielding function and an impedance controlled function to replace a via hole on the existing circuit board where the via hole has an uncontrollable resistance. | 04-07-2011 |
| 20110085313 | Motherboard Assembly for Interconnecting and Distributing Signals and Power - A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon. It further includes at least one wiring layer (V) designed to only electrically interconnect components on or within the second PCB, and at least one layer (X) designed to only electrically interconnect the components on the second PCB with the components on the first PCB. A first LGA interposer couples to the LGA disposed on the first surface of the first PCB, and electrically connects at least one component to the first PCB. A second LGA interposer is sandwiched between and couples to the LGA disposed on the second surface of the first PCB and to the LGA disposed on the first surface of the second PCB. It electrically connects the first PCB to components on the second PCB. | 04-14-2011 |
| 20110085314 | ELECTRICAL CIRCUIT SYSTEM AND METHOD FOR PRODUCING AN ELECTRICAL CIRCUIT SYSTEM - An electrical circuit system includes at least one first circuit device and at least one second circuit device, the two circuit devices being electrically connected to one another by interconnecting at least one transfer device. The transfer device is electrically connected to the first circuit device by conductive adhesive bonds, and the transfer device is electrically connected to the second circuit device by conductive adhesive bonds and/or solder joints. Furthermore, a method for producing a corresponding electrical circuit system. | 04-14-2011 |
| 20110110064 | Integrating Circuit Die Stacks Having Initially Identical Dies Personalized With Fuses - Integrated circuit die stacks having a first die mounted upon a substrate, the first die manufactured to be initially identical to a second die with a plurality of through silicon vias (‘TSVs’), the first die personalized by blowing fuses on the first die, converting the TSVs previously connected through the blown fuses into pass-through vias (‘PTVs’), each PTV implementing a conductive pathway through the first die with no connection to any circuitry on the first die; and the second die, manufactured to be initially identical to the first die and later personalized by blowing fuses on the second die, the second die mounted upon the first die so that the PTVs in the first die connect signal lines from the substrate through the first die to TSVs in the second die. | 05-12-2011 |
| 20110110065 | Integrated Circuit Die Stacks Having Initially Identical Dies Personalized With Switches - Integrated circuit die stacks having a first die mounted upon a substrate, the first die manufactured to be initially identical to a second die with a plurality of through silicon vias (‘TSVs’), the first die personalized by opening switches on the first die, converting the TSVs previously connected through the open switches into pass-through vias (‘PTVs’), each PTV implementing a conductive pathway through the first die with no connection to any circuitry on the first die; and the second die, manufactured to be initially identical to the first die and later personalized by opening switches on the second die, the second die mounted upon the first die so that the PTVs in the first die connect signal lines from the substrate through the first die to TSVs in the second die. | 05-12-2011 |
| 20110110066 | ANISOTROPIC CONDUCTIVE FILM - A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures. Of the two kinds of organic peroxide, the organic peroxide having the higher one minute half-life temperature produces benzoic acid or a derivative thereof by decomposition. | 05-12-2011 |
| 20110134621 | ELECTRO-OPTICAL DEVICE, ELECTRO-OPTICAL PANEL, AND ELECTRONIC APPARATUS - Disclosed herein is an electro-optical device including: an electro-optical panel including a first terminal portion having a first terminal and a second terminal and a second terminal portion having a third terminal and a fourth terminal, the first and the fourth terminal being electrically connected through a first connection wiring, the second and the third terminal being electrically connected through a second connection wiring; a first circuit substrate having a first external terminal connected to the first terminal and a second external terminal connected to the second terminal through a first connection terminal portion respectively; and a second circuit substrate having a third external terminal connected to the third terminal and a fourth external terminal connected to the fourth terminal through a second connection terminal portion respectively. | 06-09-2011 |
| 20110149543 | PRINTED WIRING BOARD CONNECTION STRUCTURE - A printed wiring board connection assembly includes a first printed wiring board and a plurality of connecting pieces having a first connecting pattern made of an electrically conductive material formed on first and second opposing surfaces. A second printed wiring board has a plurality of connecting holes shaped to receive respective connecting pieces and having second connecting patterns arranged to correspond with the first connecting patterns of the respective connecting pieces. Each of the connecting pieces has one or more through-holes extending between the opposing surfaces of the respective connecting pieces and positioned such that upon receiving of the connecting pieces by the respective connecting holes a portion of at least one through-hole is exposed proximate the first surface of the second printed wiring board and a portion of at least one through-hole is exposed proximate the second surface of the second printed wiring board. | 06-23-2011 |
| 20110157857 | Circuit board laminated module and electronic equipment - A circuit board laminated module includes: a first circuit board having a multi-layer structure in which ground layers are provided in a plurality of layers; a second circuit board mounted on the first circuit board; and a semiconductor chip mounted on the second circuit board, wherein in the first circuit board, a noise guiding through via which guides an electromagnetic noise generated in the semiconductor chip to a lower layer side is provided on a side different from a circuit portion or a circuit element desired to be protected against influence of the electromagnetic noise in a surrounding direction of an occurrence place of the electromagnetic noise. | 06-30-2011 |
| 20110157858 | SYSTEM-IN-PACKAGE HAVING EMBEDDED CIRCUIT BOARDS - Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed. | 06-30-2011 |
| 20110228503 | POWER STRUCTURE - A power structure including a circuit board, a power transforming circuit board, and a fixing element is provided. The circuit board includes a substrate, a set of power supply connector, and a first power output structure. The set of power supply connector and the first power output structure are electrically connected. The first power output structure has a first fixing hole and at least one cable connecting hole. The power transforming circuit board has a power input structure and at least one power transforming circuit. The power input structure having a second fixing hole is electrically connected to the power transforming circuits. The fixing element penetrates through the first fixing hole of the first power output structure and the second fixing hole of the power input structure, so as to electrically connect the first power output structure to the power input structure. | 09-22-2011 |
| 20110249419 | CIRCUIT BOARD ASSEMBLY AND CONNECTING BRACKET THEREOF - A circuit board assembly includes a circuit board, a daughter card, and a connecting bracket with a supporting portion. The circuit board includes a first connector and a first position element. The daughter card includes a second connector and a second position element. A first connecting portion extends down from the supporting portion, a second connecting portion extends up from the supporting portion and is electrically connected to the first connecting portion. Two position portions extend from the supporting portion. The first connector of the circuit board is connected to the first connecting portion of the connecting bracket. The second connector of the daughter card is connected to the second connecting portion of the connecting bracket. The first position element of the circuit board and the second position element of the daughter card are latched with the position portions of the connecting bracket, respectively. | 10-13-2011 |
| 20110273858 | CIRCUIT BOARD SOCKET WITH SUPPORT STRUCTURE - Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion of the circuit board. The support structure includes a plurality of nested frames. | 11-10-2011 |
| 20110273859 | ELECTRICAL APPARATUS - A first connector has a plurality of terminals arranged in the direction along a first pattern, and the first pattern is connected to a terminal disposed far from an image sensor in the plurality of terminals of the first connector. A second connector has a plurality of terminals arranged in the direction along a second pattern, and the second pattern is connected to a terminal disposed closer to an image processing circuit in the plurality of terminals of the second connector. | 11-10-2011 |
| 20110286193 | ASSEMBLY OF AT LEAST TWO ELECTRIC BOARDS - An assembly of at least two electric boards, and in particular two printed circuit boards, the two boards being welded to one another, wherein at least one of the two boards comprises at least one orifice which shows a trace of the welding. | 11-24-2011 |
| 20110286194 | CONNECTION STRUCTURE, CIRCUIT DEVICE, AND ELECTRONIC EQUIPMENT - To provide a connection structure in which terminals having different functions can be connected separately in an insulation state while suppressing the generation of problems such as a crack or an exfoliation of the terminal, a circuit device having the connection structure and an electronic equipment having the circuit device. A connection structure | 11-24-2011 |
| 20110292629 | RECEIVING APPARATUS - A receiving apparatus includes two electronic boards having flat surfaces that are disposed substantially-parallel to each other and that at least partially overlap each other, and an antenna that is mounted on the two electronic boards. The antenna includes a first metal line that is mounted along the flat surface of a first electronic board out of the two electronic boards, and a second metal line that is disposed substantially-perpendicular to the flat surfaces of the two electronic boards, a first end of the second metal line electrically connected to the first metal line and a second end of the second metal line electrically connected to a circuit on a second electronic board out of the two electronic boards. This enables the antenna to be integrated with the two electronic boards. As a result, it is possible to reduce the production cost while higher performance in receiving a radio wave is provided. | 12-01-2011 |
| 20120002389 | PRINTED CIRCUIT BOARD UNIT AND COMPUTER DEVICE HAVING THE SAME - A printed circuit board unit usable with a computer device includes a main board on which a first component and a second component are mounted on an upper surface, and a routing unit mounted on at least one of the upper surface and a lower surface of the main board and including a sub-wire forming at least part of a wire to transmit a data between the first component and the second component. | 01-05-2012 |
| 20120008298 | CONNECTOR FOR ELECTRONIC ASSEMBLIES THAT SCREENS AND DOES NOT REQUIRE SOLDERING - A device interconnects two circuit boards each comprising electrical connection pads, and which are respectively placed in two cavities. The device includes intercavity microwave screening means. The device also comprises several electrical conductors that pass through the device from end to end and that are not soldered, the two ends of which conductors are respectively intended to make direct contact with the connection pads of the two circuit boards; and mechanical means for holding the two circuit boards against the device, at either end of the latter. The screening means are provided by a microwave absorber in contact with each conductor and surrounding it over all or some of its length. | 01-12-2012 |
| 20120026709 | PCI-E MODULE - A PCI-E module includes a circuit board, an insulated housing and a plurality of connection terminals. Each connection terminal has a connection end and a welding end away from the connection end. The connection terminals are alternately and parallelly arranged in the housing to form a structure of the PCI-E module. The circuit board has a plurality of gold fingers on both sides of one end thereof, and each connection end of the connection terminals is electronically connected to the gold fingers. Each welding end of the connection terminals is bent down through and extends out of the housing. Therefore, the PCI-E module can be welded directly on a main board of a computer through the welding ends of the connection terminals. | 02-02-2012 |
| 20120026710 | RISER CARD FOR POWER SUPPLY - A riser card is used for connecting at least one power supply to a motherboard in an electronic device. The riser card includes a first printed circuit board (PCB) and a second PCB. The first PCB includes at least one power connector for laterally receiving the at least one power supply. The second PCB is located parallel to the first PCB. The second PCB includes an insert terminal for connecting to the motherboard. The first PCB is spaced from the second PCB, and the first PCB and the second PCB are electrically connected. | 02-02-2012 |
| 20120063109 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained. | 03-15-2012 |
| 20120063110 | MODULE BOARD - A module board has a configuration in which a first circuit board, a first composite sheet, a second circuit board, a second composite sheet, and a third circuit board are laminated in this order. Inspection terminals are arranged in a matrix shape in a predetermined region on an upper surface of the third circuit board. Electronic components are mounted on the first and second circuit boards. The inspection terminals are electrically connected to the electronic components mounted on the first and second circuit boards through vias and wiring patterns. | 03-15-2012 |
| 20120081873 | IMPLEMENTING HIGH-SPEED SIGNALING VIA DEDICATED PRINTED CIRCUIT-BOARD MEDIA - Some embodiments of the inventive subject matter are directed to a first circuit board configured to include an electronic component. The electronic component includes a plurality of leads. The first circuit board includes first wires configured to connect to a first portion of the plurality of leads. The second circuit board is affixed to the first circuit board. The second circuit board includes second wires. The second circuit board is smaller in size than the first circuit board. A plurality of electrical connectors extend through a thickness of the first circuit board and are configured to connect a second portion of the plurality of leads to the second wires. | 04-05-2012 |
| 20120155049 | ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS - A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements. | 06-21-2012 |
| 20120162949 | DISPLAY APPARATUS - Provided herein is a display apparatus including a hinge having a coupling part coupled to a panel and a body part connected to the coupling part, a stand neck coupled to the body part, a main base having a fixing part, to which the hinge and the stand neck are fixed, a main board including a power board and a signal board connected to each other so as to form a two-layer stacked structure so that the power board and the signal board are mounted in a space of the main base as a single module, and a cover assembly including a middle cover to accommodate the main base, the middle cover being provided with a mounting part corresponding to the fixing part. | 06-28-2012 |
| 20120170242 | CIRCUIT BOARD, CONNECTING STRUCTURE OF CIRCUIT BOARDS, AND DISPLAY PANEL ASSEMBLY - A circuit board that allows a conductive material such as an anisotropic conductive film to improve its connection strength. A circuit board ( | 07-05-2012 |
| 20120182706 | STACKED SHIELD COMPARTMENTS FOR ELECTRONIC COMPONENTS - The present disclosure is related to an electronic assembly in a stacked configuration. Electronic components are formed on substrates at each level of the stacked configuration. Electromagnetic shield compartments may be provided which substantially encapsulate the electronic components. Conductive vias are formed within the substrates on each level of the stacked configuration and coupled to one another so that the electromagnetic shields at each level of the stack can couple to a common node. | 07-19-2012 |
| 20120206892 | CIRCULAR INTERPOSERS - Non-rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment pin, wherein the pin aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards. | 08-16-2012 |
| 20120212920 | CIRCUIT CARD ASSEMBLIES HAVING CONNECTOR-LESS PERPENDICULAR CARD-TO-CARD INTERCONNECTS - A coupled circuit card assemblies (CCCA) includes a first CCA (CCA1) having at least one board receiving side aperture including electrical conductor lined through-holes above and/or below the aperture. A second CCA (CCA | 08-23-2012 |
| 20120212921 | MOTHERBOARD - A motherboard includes a first circuit board, a second circuit board, and wiring. The first circuit board includes at least a programmable chip, a programming interface, a first data interface, and at least one jumper corresponding to the programmable chip. The second circuit board includes a CPU (central processing unit), a RAM unit, and at least a second data interface corresponding to the programmable chip. The motherboard of the present disclosure concentrates programmable chips on the first circuit board, thereby providing a unified programming interface to enhance the convenience of programming multiple programmable chips. | 08-23-2012 |
| 20120230000 | FLEXIBLE FLAT CABLE AND IMAGE DISPLAY DEVICE - A flexible flat cable includes a cable main body and a pair of reinforcing plates. The cable main body includes a pair of resin films and a plurality of linear conductors. The linear conductors are exposed with respect to one of the resin films to form longitudinally extending electrical terminals. Each of the reinforcing plates has a fixed end section. The fixed end sections are fixedly coupled to end portions of the cable main body on the other of the resin films, respectively. The fixed end sections define a pair of bending lines such that the end portions of the cable main body are bendable relative to a middle portion of the cable main body to form acute corners between the end portions and the middle portion, respectively. | 09-13-2012 |
| 20120287591 | CONNECTION MEMBER - A connection member that connects different boards, includes a plurality of conductive elastic members each of which includes two contact portions that are in contact with the different boards at ends, respectively, and an elastic portion that is provided between the two contact portions and is stretchable according to a force applied from outside the connection member, and an insulating restraining member that restrains movement of each of the elastic members by holding part of each of the elastic members, so that the force due to board vibrations applied to a joint of solder or the like can be relaxed. | 11-15-2012 |
| 20120300426 | CONNECTION STRUCTURE OF PRINTED CIRCUIT BOARD, METHOD FOR PRODUCING SAME, AND ANISOTROPIC CONDUCTIVE ADHESIVE - There are provided a connection structure of printed circuit boards, and so forth, the connection structure including a first printed circuit board, a second printed circuit board located above the first printed circuit board, and an anisotropic conductive adhesive configured to establish a conductive connection between a conductor of the first printed circuit board and a conductor of the second printed circuit board, in which the anisotropic conductive adhesive contains a conductive filler, and in which the conductive filler is formed of crystallized metal-particle wires produced by allowing metal particles to crystallize and grow linearly. It is thus possible to easily achieve sufficiently high connection strength while a flying lead of one printed circuit board is electrically connected to a conductive lead (substrate pad) of the other printed circuit board. | 11-29-2012 |
| 20130003336 | MACHINE PLACEABLE CIRCUIT BOARD INTERPOSER - An interposer for connecting two or more circuit boards is a circuit carrying substrate with two or more solder pads on each of two sides. Each of the solder pads are connected to an electrically conductive via in the substrate, providing electrical interconnection from one side to the other side. One or more solder pads have a solder ball on it. The interposer has a contact area suitable for the interposer to be picked up and placed by an automated part placement machine. An electrical assembly is made by soldering the solder balls on one side of the interposer to corresponding solder pads on a circuit board. The solder balls on the other side of the interposer are likewise soldered to the corresponding solder pads of a second circuit board. | 01-03-2013 |
| 20130010447 | PACKAGED DEVICE AND METHOD OF FABRICATING PACKAGED-DEVICE - A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer. | 01-10-2013 |
| 20130033842 | BOARD AND METHOD FOR MANUFACTURING BOARD - The board has a transformer, choke coil and, for example, is used for a DC-DC converter such as for an automobile. At the board, a circuit conductor therein is exposed to outside at an electronic component mounting part, a printed board mounting part and a conductor part, and other portions are covered with resin to form an injection molded board, which installs an electronic component, etc. The printed board mounting part is a section that is provided for installing a printed board. A conductor part of the printed board and the conductor part of the printed board mounting part are joined via an electronic component by soldering, etc. | 02-07-2013 |
| 20130063919 | LIQUID CRYSTAL DISPLAY MODULE AND LIQUID CRYSTAL PANEL - Disclosed is a liquid crystal display module comprising a display panel, and a plurality of panel lands is positioned on the display panel, and lengths of the panel lands extend along a straight direction of wire directions, and the module further comprise a flexible circuit board, and the flexible circuit board comprises a plurality of flexible circuit board lands, and the flexible circuit board lands are soldered with the panel lands one-to-one correspondingly. Two adjacent panel lands and corresponding flexible circuit board lands constitute a soldering unit, comprising a first panel land, a second panel land, a first flexible circuit board land corresponding to the first panel land and a second flexible circuit board land corresponding to the second panel land. The first panel land and the second panel land stagger transversely. The present invention also discloses a liquid crystal panel. | 03-14-2013 |
| 20130114230 | MOTHERBOARD ASSEMBLY HAVING SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE - A motherboard assembly includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a memory slot, a platform controller hub (PCH), a storage device interface, and a storage controller connected to the PCH and the storage device interface. An edge connector is set on a bottom edge of the circuit board. A port is arranged on the circuit board, and connected to the storage chips and the storage device interface, enabling a motherboard to communicate with the SATA DIMM module. | 05-09-2013 |
| 20130135836 | EMBEDDED COPLANAR INTERCONNECT - A first printed circuit board (PCB) assembly can include an embedded electrical connector configured to be mechanically coupled to a corresponding tab-shaped portion of a second PCB assembly, such as to permit insertion of the tab-shaped portion of the second PCB assembly into the embedded electrical connector when the second PCB assembly is aligned in a specified orientation. In an example, the second PCB assembly can include an approximately planar conductive antenna. | 05-30-2013 |
| 20130148322 | INTERPOSER CONNECTORS WITH ALIGNMENT FEATURES - Non-rectangular or rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment post, wherein the post aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards. | 06-13-2013 |
| 20130201648 | STACKED SUBSTRATE STRUCTURE - The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder. | 08-08-2013 |
| 20130250537 | MOUNTING APPARATUS FOR MEMORY CARD - A latching apparatus for a memory card includes a socket and a pair of latching members assembled on opposite ends of the socket. A cutout is defined in each end of the memory card. Each latching member includes a main body, two pivoting portions extending from opposite ends of the main body for pivotably attaching the latch member to one end of the socket, and a C-shaped locking portion extending down from a middle portion of the main body. The insertion of the memory card in the socket causes the bottom edge of the memory card to engage with distal ends of the locking portions and so rotate the latch member, until the main bodies of the latching members engage in the cutouts of the memory card. | 09-26-2013 |
| 20130258632 | JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF - A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin. | 10-03-2013 |
| 20130279138 | TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME - Provided is a method for manufacturing a touch panel. In the method, a substrate is prepared, a transparent electrode is formed on the substrate, an interconnection electrode material is applied to the substrate by printing, an interconnection electrode is formed by drying the interconnection electrode material, and a circuit board is disposed on the interconnection electrode. | 10-24-2013 |
| 20130286622 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF - A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film. | 10-31-2013 |
| 20130301232 | RETAINING AND CONTACTING ELEMENT, CONTACTING ARRANGEMENT AND METHOD FOR ESTABLISHING A CONTACTING ARRANGEMENT - The invention relates to a retaining and contacting element ( | 11-14-2013 |
| 20130322042 | TOUCH PANEL - Disclosed is a touch panel. The touch panel includes a substrate including a view area and a dead area; a bridge electrode on the view area of the substrate; a print part on the dead area of the substrate; a wire electrode formed on the printed part to make direct contact with the print part; and an insulation pattern on the bridge electrode and the wire electrode. | 12-05-2013 |
| 20130322043 | EXPLOSION-PROOF ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF - An explosion-proof electronic device includes: a first circuit board provided with a first connector on one surface thereof; and a second circuit board provided with a second connector on a surface facing the one surface of the first circuit board, the second connector being fit to the first connector. A packing is attached to a position on the second connector which is away from the surface of the second circuit board, surrounds the outer circumference of the second connector, and extends toward the first circuit board to form a closed space including an interface between the first and second connectors. The space between the first and second circuit boards is filled with a filler with the first and second connectors fit to each other. | 12-05-2013 |
| 20130329393 | PRINTED CIRCUIT BOARD WITH DAUGHTERBOARD - A printed circuit board includes a motherboard and a daughterboard. The motherboard includes at least one first signal pad. The daughterboard includes at least one second signal pad electronically connected to the at least one first signal pad for electronically connecting the daughterboard to the motherboard. | 12-12-2013 |
| 20130343025 | MODULAR ELECTRONIC BUILDING SYSTEMS WITH MAGNETIC INTERCONNECTIONS AND METHODS OF USING THE SAME - Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together. | 12-26-2013 |
| 20140029229 | LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME - A liquid ejection head includes two or more substrates disposed side by side, each having energy generating elements and primary terminals electrically connected to the respective energy generating elements, and an electrical wiring member having primary flying leads electrically connected to the respective primary terminals by means of gang bonding. Each of the substrates has an auxiliary terminal located adjacent to the primary terminals and the auxiliary terminals of the two or more substrates are disposed adjacent to each other. The electrical wiring member has an auxiliary flying lead connected to the auxiliary terminals of the substrates by means of a gang bonding system. | 01-30-2014 |
| 20140029230 | PLASTIC PANEL AND FLAT PANEL DISPLAY DEVICE USING THE SAME - Discussed is a flat display panel. The flat display panel includes a display area to display an image with a plurality of panel electrodes, and a non-display area. A plurality of link lines connected to the panel electrodes are provided in the non-display area. The display area and the non-display area are provided in a base substrate. A plurality of link pads, electrically connected to the link lines and a plurality of link terminals provided in a driving element, are provided in a bonding part adhered to the driving element in the non-display area. Two resistance pads are respectively connected to two link terminals which are electrically connected to each other through the driving element. At least two pads are respectively connected to the two resistance pads. | 01-30-2014 |
| 20140055972 | FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY AND FLAT PANEL DISPLAY APPARATUS USING THE SAME - A flexible printed circuit board assembly includes a circuit board main body and a connection terminal provided at one side of the circuit board main body. The connection terminal has a shape in which a width of a portion farther from the circuit board main body is greater than a width of a portion closer to the circuit board main body. | 02-27-2014 |
| 20140055973 | CIRCUIT BOARD FOR PERIPHERAL CIRCUITS OF HIGH-CAPACITY MODULES, AND A HIGH-CAPACITY MODULE INCLUDING A PERIPHERAL CIRCUIT USING THE CIRCUIT BOARD | 02-27-2014 |
| 20140085855 | ELECTRONIC DEVICE - An electronic device includes a first circuit board, a second circuit board, and a third circuit board. A plurality of loads are mounted on the first circuit board, a plurality of direct current (DC) to DC converters are mounted on the second circuit board, and an alternating current (AC) to DC converter is mounted on the third circuit board. The first circuit board is electrically connected to the second circuit board, the DC to DC converters are configured to convert an input DC voltage from the third circuit board to a plurality of output DC voltages correspondingly, and the output DC voltages power the loads correspondingly. The electronic device separates the voltage-conversion processes from other working components, thus the electronic device is protected from electromagnetic interference. | 03-27-2014 |
| 20140085856 | FLEXIBLE PRINTED CIRCUIT BOARD AND CIRCUIT-BOARD CONNECTION STRUCTURE - A terminal portion configured to obtain electrical connection with a printed circuit board includes a first signal pad that is formed in a first conductor layer and is electrically separated from a ground layer, a pair of first ground pads that is formed in the first conductor layer to sandwich the first signal pad and is connected to the ground layer, a second signal pad that is formed in a second conductor layer and is connected to a signal line, a pair of second ground pads that is formed in the second conductor layer to sandwich the second signal pad and is electrically separated from the signal line, a third signal pad formed in a third conductor layer, and a pair of third ground pads formed in the third conductor layer to sandwich the third signal pad. The second signal pad is wider than the third signal pad. | 03-27-2014 |
| 20140098509 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THEREOF - An electronic device includes a first substrate, a second substrate that is disposed to be superposed over the first substrate, a connector that connects the first substrate to the second substrate, an inter-substrate frame that is disposed between the first substrate and the second substrate and includes a wall portion, and a wall member that is disposed on at least one of the first substrate and the second substrate to be opposed to the wall portion and locks the wall portion of the inter-substrate frame in response to displacement that is generated between the first substrate and the second substrate. | 04-10-2014 |
| 20140111957 | THREE-DIMENSIONAL BACKPLANE - An objective of the present invention is to provide a three-dimensional backplane to solve the problem that the number of layers of a printed circuit board for producing a backplane increases linearly along with the number of connectors. The three-dimensional backplane includes: a first group of connectors, a second group of connectors, a first group of printed circuit boards, and a second group of printed circuit boards. Any printed circuit board in the first group of printed circuit boards is connected to any printed circuit board in the second group of printed circuit boards. Any connector in the second group of connectors is connected to any connector in the first group of connectors. With the foregoing solution, the number of wires on each printed circuit board is reduced, so that the number of layers of a printed circuit board for producing a backplane is reduced. | 04-24-2014 |
| 20140140031 | WIRELESS MODULE - A wireless module, in which a first board ( | 05-22-2014 |
| 20140153210 | ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS - A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element. | 06-05-2014 |
| 20140168926 | CONTROLLED IMPEDANCE FLEX CIRCUIT - A flat flexible-printed-circuit cable is provided that is designed to route high speed digital bus signals across various printed circuit boards without substantial signal attenuation. The flat flexible-printed-circuit cable can include a polyimide substrate; a first layer of copper being a solid ground plane over the polyimide substrate; a dielectric continuous layer; a second layer of copper being a routing layer for high speed digital bus signals across various printed circuit boards; and connectors at ends of the cable having ground terminals to which the first layer contacts. | 06-19-2014 |
| 20140198470 | PRINTED CIRCUIT BOARD STACK - Provided is a printed circuit board stack having a structure that connects between printed wirings of printed circuit boards that are arranged so as to face each other across a gap. A first printed circuit board and a second printed circuit board are arranged so as to face each other across a gap; a first fork terminal soldered to a printed wiring is vertically provided on the first printed circuit board, whereas a second fork terminal soldered to a printed wiring is vertically provided on the second printed circuit board. The printed wiring of the first printed circuit board and the printed wiring of the second printed circuit board are electrically connected to each other via a conductive member with a pair of connection portions that each are pressure-contacted between pressure contact blades of a respective one of the first fork terminal and the second fork terminal. | 07-17-2014 |
| 20140268621 | Edge Mounting for Printed Circuit - An electric apparatus is adapted to be electrically coupled to a target platform. The electric apparatus includes a first printed circuit including a first surface parallel to a first plane and a second surface parallel to a second plane perpendicular to the first plane. The first surface has a first area and the second surface has a second area smaller than the first area. A multitude of conductive traces are formed in a layer of the first printed circuit parallel to the first plane. First and second contact regions respectively overlay first and second portions of the second surface. The first and second contact regions are electrically connected to first and second ones of the multitude of conductive traces respectively. The first printed circuit is coupled to the target platform at the first and second contact regions when the first printed circuit is electrically coupled to the target platform. | 09-18-2014 |
| 20140293568 | FIXING MECHANISM AND ELECTRONIC DEVICE THEREOF - A fixing mechanism includes a base, a substrate and a latch. The base includes a constraining component and a contacting component. The substrate is slidably disposed on the base. The substrate includes a body, a fixing hole structure and a connecting portion. The base and the body respectively hold circuit boards. The fixing hole structure is disposed on the body for sheathing the constraining component. The fixing hole structure includes a first opening and a second opening, the second opening is connected to the first opening in a linearly stretching manner. The latch is rotatably disposed on the substrate. The latch includes a bar and a driving portion. The driving portion is disposed on an end of the bar and movably contacts against the contacting component. The driving portion slides relative to the contacting component with rotation of the bar to connect the connectors of the circuit boards. | 10-02-2014 |
| 20140369017 | ELECTRIC AND/OR ELECTRONIC CIRCUIT INCLUDING A PRINTED CIRCUIT BOARD, A SEPARATE CIRCUIT BOARD AND A POWER CONNECTOR - The present invention relates to an electric and/or electronic circuit including a printed circuit board ( | 12-18-2014 |
| 20150043188 | Method For Manufacturing A Printed Circuit Board, Printed Circuit Board And Rear View Device - The invention relates to a method for manufacturing a printed circuit board ( | 02-12-2015 |
| 20150062856 | CONNECTION PORT CONFIGURING METHOD AND COMBINED CIRCUIT BOARD MODULE MOUNTED WITH MULTIPLE CONNECTION PORTS - A connection port configuring method and a combined circuit board module mounted with multiple connection ports, characterized in that connection ports are mounted on a first circuit board and a second circuit board; the connection ports each comply with a communication port protocol and send a data at a transmission speed by the communication port protocol; the connection port configuring method involves assigning the connection ports to a high-speed connection port group and a low-speed connection port group according to the transmission speed of each connection port, mounting the connection ports of the high-speed connection port group on the first circuit board, and mounting the connection ports of the low-speed connection port group on the second circuit board. With a connection unit connecting the first circuit board and the second circuit board, the data can be transmitted between the first circuit board and the second circuit board. | 03-05-2015 |
| 20150077963 | PRINTED WIRING BOARD WITH METAL POST AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH METAL POST - A printed wiring board includes a wiring board, and multiple posts formed on the wiring board and positioned to mount a second printed wiring board onto the wiring board. Each of the metal posts has a first surface connected to the wiring board, a second surface formed to connect the second printed wiring board, and a side surface between the first surface and the second surface, and the side surface of each of the metal posts forms a curved surface. | 03-19-2015 |
| 20150085461 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD - A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards. | 03-26-2015 |
| 20150109751 | ELECTRONIC DEVICE AND METAL THIN FILM-PROVIDED SPACER - Provided is an electronic device such as an electrochromic device or a liquid-crystal device in which a bus bar can be disposed with a simple structure for at least one electrode film and a width of a region that does not provide an intended function of the electronic device can be reduced. An electronic device is formed by integrating two substrates with spacers interposed therebetween, the substrates including respective electrode films on respective surfaces facing each other. At least one of the spacers is formed by a metal thin film-provided spacer obtained by forming a metal thin film on one surface of an insulating plate material. The electrode film of the substrate and the metal thin film of the metal thin film-provided spacer are conductively joined to each other. The electrode film is conductively connected to a terminal connected to an external circuit, via the metal thin film. | 04-23-2015 |
| 20150366061 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a first circuit board having a first surface and a second surface, and a second circuit board having a third surface and a fourth surface and having a mounting area on the third surface of the second circuit board. The first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board is in contact with the third surface of the second circuit board, the first circuit board includes reinforcing material and has an opening portion exposing the mounting area of the second circuit board, and the first circuit board and the second circuit board are formed such that a ratio H | 12-17-2015 |
| 20150366062 | PRINTED WIRING BOARD - A printed wiring board includes a first circuit board having a first surface and a second surface on the opposite side with respect to the first surface, and a second circuit board having a third surface and a fourth surface on the opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board. | 12-17-2015 |
| 20160081182 | PACKAGE BOARD, METHOD FOR MANUFACTURING THE SAME AND PACKAGE ON PACKAGE HAVING THE SAME - There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity. | 03-17-2016 |
| 20160088723 | STACK STRUCTURE OF HIGH FREQUENCY PRINTED CIRCUIT BOARD - A stack structure of a high frequency printed circuit, mainly includes a transmission conductor pin group in a form of single row, where each signal pair and each transmission pair of the transmission conductor pin group respectively have a through hole portion thereon, and the inner layer of the circuit board has a trace portion in electric connection with the through hole portion, allowing each four terminals to be formed into one group. Utilizing the clever arrangement of the through hole portions and trace portions separates each terminal properly, thereby increasing the property of transmitted signals, and, at the same time, reducing noise interferences such as EMI and RFI. | 03-24-2016 |
| 20160165727 | Electronic Module having Circuit Boards and a Plastic Sealing Ring that can be Molded on by Injection Molding, in Particular for a Motor Vehicle Transmission Control Unit, and Method for Producing said Electronic Module - An electronic module has a first circuit board element, a second circuit board element, and a spacer. Together, the first circuit board element, the second circuit board element, and the spacer enclose a central cavity, in which components attached to the first circuit board element are accommodated. Respective annular circumferential microstructures are provided on a surface of the first circuit board element directed outward and on a surface of the second circuit board element directed outward, adjacent to an outer periphery of the first circuit board element. In this region, a sealing ring is formed, which has a form-closed connection to both the first and the second circuit board element by means of the microstructures of the first and the second circuit board element. The sealing ring can be made of a resistant plastic, which is molded on by injection molding in the liquid state in the region of the outer periphery of the first circuit board element and flows into recesses of the microstructures and, after the curing, forms the form-closed and sealing connection between the two circuit board elements and the sealing ring thereby formed. | 06-09-2016 |
| 20160192492 | CIRCUIT MODULE SYSTEM - A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes a first base connected to a side of the first circuit board and at least one first conductor. A top surface of the first base forms a fillister connecting to outside, the first conductor is clamped on the first base and electrically connects the first circuit board to outside. The second circuit module includes a second circuit board and a second connecting housing, the second connecting housing includes a second base connected to a side of the second circuit board and at least one second conductor. A protruding part protrudes from an outer side of the second base, the second conductor is clamped on the second base and electrically connects the second circuit board to outside. | 06-30-2016 |
| 20160198585 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | 07-07-2016 |
| 20160205786 | PRINTED CIRCUIT BOARD UNIT DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE DISPLAY APPARATUS | 07-14-2016 |
| 20190148066 | Capacitors, Integrated Assemblies Including Capacitors, and Methods of Forming Integrated Assemblies | 05-16-2019 |
