| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361774000 | Shaped lead on board | 39 |
| 20080310132 | Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can include the operations of forming at least one dam on the surface of the board that surrounds a region corresponding to the bump, forming the bump by printing conductive paste onto the region corresponding to the bump, and stacking the insulation layer onto the surface of the board. This method can be utilized to improve productivity and resolve the problem of spreading. | 12-18-2008 |
| 20090097220 | Printed circuit board - A printed circuit board is disclosed. The printed circuit board, which has at least one pad on which a solder ball is to be placed, includes a solder resist that covers a surface of the printed circuit board, an opening part that exposes the pad and supports the solder ball, and an extended portion formed in a perimeter of the opening part that allows an underfill to flow in between the printed circuit board and the solder ball. With this printed circuit board, the underfill can be filled in more readily between the printed circuit board and the solder balls, when mounting a component on the printed circuit board. | 04-16-2009 |
| 20090251874 | SOLDER BALL INTERFACE - An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package body, and the intercoupling component includes an insulating support member. The support member includes a first surface including first electrical attachment sites, each configured for making an electrical connection with a corresponding one of the device leads of the package. The support member also includes an opposite second surface including second electrical attachment sites in electrical contact with the first electrical attachment sites, each of the second electrical attachment sites including a plurality of solder balls associated with each device lead. The plurality of solder balls are used to form an electrical connection between each surface mount pad on the substrate and the corresponding conductive pad of the intercoupling component. | 10-08-2009 |
| 20090316376 | METHOD AND APPARATUS OF CHANGING PCB PAD STRUCTURE TO INCREASE SOLDER VOLUME AND STRENGTH - The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area. | 12-24-2009 |
| 20100202123 | CIRCUIT BOARD - A circuit board includes balls as electrodes in a grid, a power supply wiring pattern area connected to power supply terminals of an integrated circuit mounted thereon, and a feeding pattern area connected to a feeding point; the balls include first and second power supply ball groups connected respectively to power supply terminal arrays, at a predetermined interval, of the integrated circuit, and the power supply wiring pattern area includes first and second power supply connection patterns connected respectively to the first and second ball groups, and at least one connection pattern connecting the first and second power supply connection patterns noncontact to the balls, and has first and second connection portions connected respectively to the feeding pattern area and one electrode of a first bypass capacitor, and the second power supply connection pattern has a third connection portion connected to one electrode of a second bypass capacitor. | 08-12-2010 |
| 20110075389 | WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME - A semiconductor device comprising a flat wiring board, a first LSI disposed on one surface of the wiring board, a sealing resin for covering the one surface and a side face of the first semiconductor element, and a second LSI disposed on another surface of the wiring board. The wiring board has conductive wiring as a wiring layer, an insulation resin as a support layer for the wiring layer, and a conductive through-hole that passes through the wiring layer and the support layer. Connection points between lands disposed in positions in which the external peripheral edges of the semiconductor elements transverse the interior of the lands as viewed vertically from above, which lands are selected from land portions on which the external connection terminals are formed, and the wiring board formed in the same plane as the lands, are unevenly distributed toward one side of the wiring board. Connections for very small wiring are thereby made possible, and a plurality of semiconductor elements can be very densely connected. | 03-31-2011 |
| 20110080714 | CIRCUIT BOARD AND SEMICONDUCTOR MODULE - A circuit board comprises a first conductive post for electrically connecting to the first electrode of the semiconductor device, a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to the second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to the third electrode of the semiconductor device, and a third metal plate connecting to the third conductive post. | 04-07-2011 |
| 20110103029 | LEAD PIN AND WIRING SUBSTRATE WITH LEAD PIN, AND METHOD OF MANUFACTURING THE SAME - A lead pin includes a shaft portion, a connection head portion provided to a top end side of the shaft portion, and having a diameter which is larger than a diameter of the shaft portion, wherein the connection head portion includes a bonding surface on an opposite side to the shaft portion side, and the bonding surface includes a flat surface provided in a center part, a convex surface which is provided like a ring shape to an outside of the flat surface and rounded by a radius R like a convex shape, and a concave surface which is provided like a ring shape to an outside of the convex surface and rounded by a radius R like a concave shape. | 05-05-2011 |
| 20110267790 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The present invention provides a technique capable of suppressing variations in the height of each solder ball where an NSMD is used as a structure for each land. Vias that extend through a wiring board are provided. Lands are formed at the back surface of the wiring board so as to be coupled directly to the vias respectively. The lands are respectively formed so as to be internally included in openings defined in a solder resist. Half balls are mounted over the lands respectively. Namely, the present invention has a feature in that the configuration of coupling between each of the lands and its corresponding via both formed at the back surface of the wiring board is taken as a land on via structure and a configuration form of each land is taken as an NSMD. | 11-03-2011 |
| 20110299259 | CIRCUIT BOARD WITH CONDUCTOR POST STRUCTURE - Various circuit board interconnect conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is disclosed that includes forming a conductor post on a side of a circuit board. The conductor post includes an end projecting away from the side of the circuit board. A solder mask is applied to the side of the circuit board to cover the conductor post. A thickness of the solder mask is reduced so that a portion of the conductor post projects beyond the solder mask. | 12-08-2011 |
| 20120147578 | Radio-Frequency Packaging with Reduced RF Loss - A device includes an interposer and a radio-frequency (RF) device bonded to a first side of the interposer. The interposer includes a first side and a second side opposite to the first side. The interposer does not have through-interposer vias formed therein. First passive devices are formed on the first side of the interposer and electrically coupled to the RF device. Second passive devices are formed on the second side of the interposer. The first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices. | 06-14-2012 |
| 20120195016 | Selective Application by Electroless Plating of a Tin-Whisker Impenetrable Metal Cap to Metals on Electronic Assemblies - Since lead-tin solder was outlawed, electronic circuits constructed with lead-free tin solders have been plagued growth of whiskers of tin emanating from the tin soldered and/or tin coated surfaces. Such whiskers often short out the electronic circuits when present. The growth of tin whiskers in such electronic circuits (i.e., those fully or partially populated with components is addressed here by depositing a tin-whisker-impenetrable metal cap on all exposed tin coated surfaces in the circuit. | 08-02-2012 |
| 20120243194 | PRINTED CIRCUIT BOARD - A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extends through the top layer and the bottom layer, and is electrically connected to the top layer and the bottom layer. A right-angled triangular void area without vias defined therein is formed on the printed circuit board, between the second vias and the electronic component. The second vias are arranged on a hypotenuse of the void area. | 09-27-2012 |
| 20120250281 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a core substrate having first and second surfaces, a first conductor formed on the first surface of the substrate, a second conductor formed on the second surface of the substrate, a first through-hole conductor formed through the substrate and connecting the first and second conductors, and a second through-hole conductor formed through the substrate and connecting the first and second conductors. The second through-hole conductor has a diameter which is greater than a diameter of the first through-hole conductor, the first through-hole conductor has a roughened inner wall forming an interior space, the second through-hole conductor has a roughened inner wall forming an interior space, and the roughened inner wall of the first through-hole conductor has an arithmetic average roughness which is set lower than an arithmetic average roughness of the roughened inner wall of the second through-hole conductor. | 10-04-2012 |
| 20130016488 | STACKED LEADED ARRAY - A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components. The stacked leaded array has a multiplicity of electronic components in a stacked array. Each electronic component comprises a first termination and a second termination. A multiplicity of first leads are provided wherein each first lead is in electrical contact with at least one first termination. Second leads are in electrical contact with second terminations. | 01-17-2013 |
| 20130033837 | MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF - A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein an electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion. | 02-07-2013 |
| 20130107485 | INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME | 05-02-2013 |
| 20130141885 | HOUSING AND METHOD FOR MAKING HOUSING - A housing of an electronic device is provided, which includes a plastic substrate defining a through hole having an inner wall, and an antenna formed on a surface of the plastic substrate. A conductive element is formed on the inner wall of the substrate through hole to electronically connect to the antenna. The conductive element defines a hole. The conductive element hole is filled with solidified poly-putty base. | 06-06-2013 |
| 20130235543 | WIRING BOARD AND SEMICONDUCTOR DEVICE - A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board within the opening portion, and the plating resist layer, when used, is removed. An insulating layer is formed on the electrode, as well as the support board or solder resist layer, and a wiring portion connected to the electrode at the insulating layer is also formed. A solder resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer. Another solder resist layer having an opening portion may then be formed on the exposed surface of the insulating layer. | 09-12-2013 |
| 20130258625 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, a second insulation layer formed on the first insulation layer, a wiring structure interposed between the first insulation layer and the second insulation layer and including an insulation layer and conductive patterns formed on the insulation layer, second conductive patterns formed on the second insulation layer, and a via conductor formed through the second insulation layer and connected to one of the second conductive patterns on the second insulation layer. | 10-03-2013 |
| 20130265732 | INTERCHIP COMMUNICATION USING A DIELECTRIC WAVEGUIDE - An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide. | 10-10-2013 |
| 20130265733 | INTERCHIP COMMUNICATION USING AN EMBEDDED DIELECTRIC WAVEGUIDE - An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide. | 10-10-2013 |
| 20130279135 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first semiconductor package on a first surface layer of a printed wiring board and a second semiconductor package on a second surface layer where a bus signal is transmitted from the first to the second semiconductor package. A first bus wiring path from a signal terminal on an inner circumference side of the first semiconductor package via a via hole and the second surface layer to a signal terminal on an outer circumference side of the second semiconductor package and a second bus wiring path from a signal terminal on an outer circumference side of the first semiconductor package via the second surface layer and a via hole to a signal terminal on an inner circumference side of the second semiconductor package are provided, thus securing a return current path for a signal current and realizing a high density wiring while suppressing radiation noise. | 10-24-2013 |
| 20130279136 | ELECTRONIC DEVICE AND ELECTRONIC APPARATUS - A sensor device includes an IC chip, a package which includes a base in which the IC chip is provided and houses the IC chip, the base having a through hole provided in a position that overlaps with the IC chip in the plan view, and a spacer which is provided between the IC chip and the base, and has an aperture communicating the through hole with the space on the opposite side to the base with respect to the IC chip in the package between the IC chip and the space. | 10-24-2013 |
| 20130286619 | INTERCONNECTION ELEMENT WITH POSTS FORMED BY PLATING - An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed. | 10-31-2013 |
| 20140204553 | PRINTED CIRCUIT BOARD HAVING A MOLDED PART AND METHOD FOR THE PRODUCTION THEREOF - A printed circuit board and a method for the production thereof. The printed circuit board can include a shaped part made of an electrically conducting material and can be used to manage the currents and heat volumes that occur in the field of power electronics. | 07-24-2014 |
| 20140254121 | PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board having an insulating layer crack preventing port. The printed circuit board includes: an insulating layer part having at least one pair of insulating layers stacked therein; circuit patterns formed on the insulating layers, respectively; and crack preventing ports formed at positions at which they are not affected by the respective circuit patterns of the insulating layer part and supporting the insulating layer part from external impact. | 09-11-2014 |
| 20140293566 | CIRCUIT BOARD AND ELECTRONIC DEVICE - A circuit board includes a substrate, a first ground electrode group, and a first pair of signal electrodes. The first ground electrode group includes a plurality of first ground electrodes, where each of the plurality of the first ground electrodes is disposed at a corresponding one of vertexes of a first rectangular area in a surface of the substrate. the first pair of signal electrodes is disposed in the first rectangular area and is arranged in a first direction parallel to a side of the first rectangular area. | 10-02-2014 |
| 20140313683 | TAPE CARRIER PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a tape carrier package and a method of manufacturing the same, the method, including: forming through holes by performing a drill process using a laser to an insulating film of a flexible copper clad laminate (FCCL) film consisting of the insulating film and a copper layer; forming a circuit pattern layer by performing an etching process to the copper layer of the FCCL film; and selectively forming a plating layer on the circuit pattern layer. The method of manufacturing the tape carrier package according to the present invention is advantageous because a punching process, and processes for laminating and drying the copper layer which are necessary for the conventional method of manufacturing the tape carrier package can be omitted, a production cost of the tape carrier package is reduced, and the time required for the drying process is saved. | 10-23-2014 |
| 20150055310 | SOLDER WETTABLE FLANGES AND DEVICES AND SYSTEMS INCORPORATING SOLDER WETTABLE FLANGES - An embodiment of a solder wettable flange includes a flange body formed from a conductive material. The flange body has a bottom surface, a top surface, sidewalls extending between the top surface and the bottom surface, and one or more depressions extending into the flange body from the bottom surface. Each depression is defined by a depression surface that may or may not be solder wettable. During solder attachment of the flange to a substrate, the depressions may function as reservoirs for excess solder. Embodiments also include devices and systems that include such solder wettable flanges, and methods for forming the solder wettable flanges, devices, and systems. | 02-26-2015 |
| 20150085458 | Reducing Far End Crosstalk in Single Ended Interconnects and Buses - Inductive coupling arising between adjacent vias in interconnect technologies (commonly associated with printed circuit boards or package) can be combatted through the addition of metal plates to vias. The plates generate capacitive coupling that can compensate for the inductive crosstalk normally generated between vias in printed circuit boards or packages. When the added plates of two neighboring vias overlap with each other, a capacitive coupling is generated. By balancing the inductive coupling with capacitive coupling, an effective reduction of far end crosstalk may be obtained. | 03-26-2015 |
| 20150116971 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy. | 04-30-2015 |
| 20150351244 | PRINTED BOARD UNIT, PRINTED BOARD, AND INFORMATION PROCESSING APPARATUS - A printed board unit includes: a base material; an electrode formed on the base material; a resist film formed on the base material, the resist film has an opening to expose the electrode; a recess part formed on an inner wall of the resist film; an electronic component including a lead terminal electrically coupled to the electrode; and a bonding material which bonds the lead terminal to the electrode in the opening, a portion of the bonding material being mounted on the lead terminal at an inner side of the opening opposite to the recess part. | 12-03-2015 |
| 20160007466 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first semiconductor package on a first surface layer of a printed wiring board and a second semiconductor package on a second surface layer where a bus signal is transmitted from the first to the second semiconductor package. A first bus wiring path from a signal terminal on an inner circumference side of the first semiconductor package via a via hole and the second surface layer to a signal terminal on an outer circumference side of the second semiconductor package and a second bus wiring path from a signal terminal on an outer circumference side of the first semiconductor package via the second surface layer and a via hole to a signal terminal on an inner circumference side of the second semiconductor package are provided, thus securing a return current path for a signal current and realizing a high density wiring while suppressing radiation noise. | 01-07-2016 |
| 20160029490 | METHOD AND APPARATUS FOR CLEANING AN ELECTRONIC CIRCUIT BOARD - A method and apparatus for cleaning an electronic circuit board is disclosed. The electronic circuit board is provided with a substrate layer and a copper layer. A solder mask is applied to the electronic circuit board and a channel is formed in the solder mask. The channel includes an inlet and an outlet. A component is affixed to the electronic circuit board over the channel and cleaning fluid is passed through the channel to remove residual solder flux from between the component and the electronic circuit board. | 01-28-2016 |
| 20160043027 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an insulating layer, a first conductor layer embedded into first surface of the insulating layer and including multiple wirings such that the wirings include connecting portions positioned to connect an electronic component, respectively, a second conductor layer projecting from second surface of the insulating layer on the opposite side, a solder resist layer formed on the first surface of the insulating layer such that the solder resist layer is covering the first conductor layer and has an opening structure exposing the connecting portions of the wirings, and multiple metal posts formed on the connecting portions respectively such that each of the metal posts has a width which is larger than a width of a respective one of the wirings having the connecting portions. The wirings are formed such that the connecting portions are positioned side by side on every other adjacent one of the wirings. | 02-11-2016 |
| 20160066415 | MULTILAYER WIRING BOARD - A multilayer wiring board includes an insulating layers stacked on one another, lands formed on an upper surface part of the multilayer wiring board, and a differential transmission line formed on or in each of the insulating layer. An electronic component is mounted on the lands. The differential transmission line is constituted of a pair of signal lines which extend from the lands toward a signal receiving end. Each of the signal lines is provided with an open stub which extends in a stacking direction of the insulating layers, and has a same width as a width of the signal lines, one end of the open stub being connected to a corresponding one of the signal lines, and another end of the open stub being open. | 03-03-2016 |
| 20160087361 | TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF SURFACE MOUNTED ELECTRICAL DEVICES - Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed. | 03-24-2016 |
| 20160105964 | ELECTRIC CIRCUIT AND METHOD OF MANUFACTURE - In accordance with an embodiment, a method for manufacturing an electric circuit that includes providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor is provided. A distance between the first sidewall and the second sidewall is increased using a technique such as stamping, etching, or trimming. A first circuit element is coupled to the first conductor and encapsulated in a mold compound. In accordance with another embodiment, an electric circuit includes a support having interconnect with sidewalls wherein notches extend from one or more of the sidewalls into the interconnect. A circuit element is coupled to the interconnect by a bonding agent and protected by a protective structure. | 04-14-2016 |
