| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361763000 | Capacitor and electrical component | 30 |
| 20080205010 | ACTIVE MATRIX BACKPLANES ALLOWING RELAXED ALIGNMENT TOLERANCE - Backplanes for display devices and systems incorporating such backplanes are described. Pixel electrodes are disposed in an array of rows and columns on a substrate. The pixel electrodes may include electrode extensions. Data lines having a substantially constant width are arranged in relation to the pixel electrodes. Enable lines are configured to carry signals that control current flow between the data lines and the pixel electrodes. Each enable line has a substantially constant width and crosses a row of pixel electrodes and electrode extensions. The backplane design may include storage capacitors at the crossings of the enable lines and the pixel electrodes. | 08-28-2008 |
| 20080212299 | Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same - Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching. | 09-04-2008 |
| 20080285245 | Embedded Passive Device Structure And Manufacturing Method Thereof - Embedded passive device structure and its manufacturing method for mainly embedding the passive device structure in the printed circuit board are presented. In this structure, both the source electrode and the ground electrode of the passive device belong to the same level, and includes several source branches and several ground branches that are formed vertically on the inside of the dielectric layer of the circuit board which are connected, respectively, to avoid the conducting between the source electrode and the ground electrode during lamination. When it is in the form of the capacitor structure, through the use of the ultra-fine wiring technique, these source branches and ground branches are separated by a small gap between each other. Therefore, the side face area and quantities of the source branches and ground branches are both increased. | 11-20-2008 |
| 20080291649 | Capacitor built-in substrate and method of manufacturing the same and electronic component device - A capacitor built-in substrate of the present invention includes; a base resin layer; a plurality of capacitors arranged side by side in a lateral direction in a state that the capacitors are passed through the base resin layer, each of the capacitors constructed by a first electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively such that the projection portion on one surface side of the base resin layer serves as a connection portion, a dielectric layer for covering the projection portion of the first electrode on other surface side of the base resin layer, and a second electrode for covering the dielectric layer; a through electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively; and a built-up wiring formed on the other surface side of the base resin layer and connected to the second electrodes of the capacitors and one end side of the through electrode. | 11-27-2008 |
| 20080316723 | METHODS FOR INTEGRATION OF THIN-FILM CAPACITORS INTO THE BUILD-UP LAYERS OF A PRINTED WIRING BOARD - Provided herein are devices comprising a printed wiring board that comprise, singulated capacitors fabricated from known good, thin-film, fired-on-foil capacitors. Provided are methods of incorporating the singulated capacitors into the build-up layers of a printed wiring board to minimize impedance. The singulated capacitors have a pitch that allows each power and ground terminal of an IC to be directly connected to a power and ground electrode, respectively, of its own singulated capacitor. Using a feedstock of known good, fired-on-foil capacitors allows for improved PWB yield. | 12-25-2008 |
| 20090073667 | Semiconductor chip package and printed circuit board - A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the other side of the semiconductor chip. | 03-19-2009 |
| 20090097219 | MAGNETIC AND DIELECTRIC COMPOSITE ELECTRONIC DEVICE - There is a provided a magnetic and dielectric composite electronic device, comprising: a first region with a plurality of magnetic material sheets being layered; a second region with a plurality of dielectric material sheets being layered; and a third region as a middle layer interposed between the first region and the second region, including a Zn—Ti based material to prevent diffusion of the materials during co-firing of the first region and the second region, and the first region, the second region and the third region are integrally formed in a single body. In accordance with the present invention, the low pass filter including the function of the varistor is realized to obtain the EMI function and the ESD control effect. Furthermore, the one chip electronic device having the composite functions is manufactured by a simple process, and the interdiffusion between the different materials forming the magnetic and the dielectric parts is prevented to secure the durability and electrical characteristics of the product. | 04-16-2009 |
| 20090116204 | Capacitor assembly of electrical circuit system - This invention is about the capacitor assembly improvement of electrical circuit system, including a central partitioning board, its surface has connecting hole installed through conductive component, both sides are distributed with insertion slots; first base board installed with sleeve hole connecting to one end of conductive component and an insertion hole corresponding to the insertion slot, its one side is soldered with multiple capacitors; and second base board, having a sleeve hole connecting to the other end of the conductive component and the insertion hole corresponding to the insertion slot, one side is soldered with multiple capacitors; thus the conductive component is inserted through central partitioning board and assemble the first and second base boards to both ends of the conductive component, to replace cable layout to form electrical connectivity, so that the problem of electrical circuit system of prior art having noise and high assembly cost can be overcome. | 05-07-2009 |
| 20090237900 | COMPONENT BUILT-IN WIRING BOARD - A component built-in wiring board is provided. The component built-in wiring board | 09-24-2009 |
| 20090244864 | Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof - Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which are buried in the insulation resin layer, a dielectric layer, which is stacked on a surface of the insulation resin layer, a first adhesive resin layer, which is stacked on the dielectric layer, and a second electrode and a second circuit pattern, which are formed on a surface of the first adhesive resin layer to correspond with the first electrode. With the present invention, the manufacturing process can be simplified and the reliability of products can be improved by reducing the variation of the capacitor (C). | 10-01-2009 |
| 20100014261 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board includes a core substrate having an opening portion, an electronic component provided in the opening portion of the core substrate and including a dielectric body, a first electrode formed over the dielectric body, and a second electrode formed over the dielectric body such that the dielectric body is interposed between the first electrode and the second electrode, and a resin filling a gap between the core substrate and the electronic component in the opening portion of the core substrate. The resin filling the gap includes a filler. | 01-21-2010 |
| 20100134992 | Embedding Thin Film Resistors in Substrates in Power Delivery Networks - Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples. | 06-03-2010 |
| 20100208440 | PASSIVE ELECTRICAL ARTICLE - A passive electrical article includes a first electrically conductive substrate having a major surface and a second electrically conductive substrate having a major surface. The major surface of the second substrate faces the major surface of the first substrate. An electrically resistive layer is on at least one of the major surface of the first substrate and the major surface of the second substrate. An electrically insulative layer is between the first and second substrates and in contact with the electrically resistive layer. The insulative layer is a polymer having a thickness ranging from about 1 μm to about 20 μm. The insulative layer has a substantially constant thickness. | 08-19-2010 |
| 20110019375 | Z-DIRECTED PASS-THROUGH COMPONENTS FOR PRINTED CIRCUIT BOARDS - A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. | 01-27-2011 |
| 20110019376 | Z-Directed Filter Components for Printed Circuit Boards - A Z-directed filter component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed filter component is mounted within the thickness of the PCB allowing other components to be mounted over it. The filter may be T-filter or a Pi-filter within the body of the Z-directed component. The body may also contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided. | 01-27-2011 |
| 20110211319 | Electric discharge protection for surface mounted and embedded components - Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage. | 09-01-2011 |
| 20120087097 | PRINTED CIRCUIT BOARD HAVING ELETRONIC COMPONENTS EMBEDDED THEREIN - Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer. | 04-12-2012 |
| 20120092843 | ELECTRONIC CIRCUIT - In order to keep impedance characteristics to desired values across the entire operating frequency band, an electronic circuit of the present invention includes an integrated circuit, a decoupling capacitor, and a multilayer circuit board on which the integrated circuit and the decoupling capacitor are mounted. In the electronic circuit, a planar land is formed on one or both of a power layer and a ground layer of the multilayer circuit board, the land having densely disposed therein a plurality of via holes that connect a terminal of the integrated circuit and a corresponding terminal of the decoupling capacitor, and the land formed on the power layer or the ground layer is discontinuously disposed at a predetermined interval with a gap having a predetermined width provided therebetween. | 04-19-2012 |
| 20120307466 | COMPONENT-EMBEDDED SUBSTRATE - In a component-embedded substrate, a component and wiring block units are embedded in a component-embedded layer; conductive layers are located on all surfaces of the wiring block units; the component and the wiring block units are arranged such that lower surface side conductive layers of the wiring block units and electrodes of the component contact lower surface side wiring layers; via-hole conductors are located in respective upper positions relative to upper surface side conductive layers of the wiring block units and the electrodes of the component; and upper surface side wiring layers of the component-embedded layer are thus electrically connected to upper surface side conductive layers of the wiring block units, and the electrodes of the component by the via-hole conductors. | 12-06-2012 |
| 20130107482 | PRINTED CIRCUIT BOARD | 05-02-2013 |
| 20130223033 | PRINTED WIRING BOARD, INDUCTOR COMPONENT, AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT - A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole. | 08-29-2013 |
| 20130258623 | PACKAGE STRUCTURE HAVING EMBEDDED ELECTRONIC ELEMENT AND FABRICATION METHOD THEREOF - A package structure having an embedded electronic element includes: a substrate having two opposite surfaces and a cavity penetrating the two opposite surfaces; at least a metal layer disposed on the sidewall of the cavity and extending to the surfaces of the substrate; an electronic element disposed in the cavity and having a plurality of electrode pads disposed on side surfaces thereof; and a solder material electrically connecting the electrode pads of the electronic element and the metal layer, thereby effectively alleviating the problems of alignment difficulty and high fabrication cost as encountered in the prior art. | 10-03-2013 |
| 20140003012 | CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD | 01-02-2014 |
| 20140118976 | PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT - A printed wiring board includes a core substrate having opening, an electronic component device accommodated in the opening of the substrate and including inductor and passive components, a wiring structure connecting the inductor and passive components in the electronic device, a filler resin body filling space formed between the substrate and electronic device in the opening of the substrate, a first buildup layer including a first interlayer insulation layer on first surface of the substrate, a first conductive layer on the first insulation layer, and a first via conductor in the first insulation layer, and a second buildup layer including a second interlayer insulation layer on second surface of the substrate on the opposite side of the first surface of the substrate, a second conductive layer on the second insulation layer, and a second via conductor in the second insulation layer. | 05-01-2014 |
| 20140153205 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion such that the electronic devices are arrayed in the lateral direction of each of the electronic devices, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other. | 06-05-2014 |
| 20140247572 | PRINTED CIRCUIT BOARD - A printed circuit board includes an accommodating layer, chip capacitor devices accommodated in the accommodating layer, and a buildup structure formed on the accommodating layer such that the buildup structure covers the chip capacitor devices in the accommodating layer. The buildup structure has mounting conductor structures positioned to mount an IC chip device on a surface of the buildup structure such that the IC chip device is mounted directly over the chip capacitor devices, each of the chip capacitor devices has a dielectric body having a surface facing the buildup structure, a first electrode formed on the dielectric body and extending on the surface of the dielectric body, and a second electrode formed on the dielectric body and extending on the surface of the dielectric body, and the dielectric body is interposed between the first electrode and the second electrode. | 09-04-2014 |
| 20150016079 | PRINTED WIRING BOARD - A wiring board includes a first resin insulation layer, an electronic component positioned on first surface of the first insulation layer, a second resin insulation layer formed on the first surface of the first insulation layer such that the second insulation layer is embedding the electronic component, a conductive layer formed on the second insulation layer, a third resin insulation layer formed on the conductive layer and second insulation layer, and a connection via conductor formed in the second insulation layer such that the connection via conductor is connecting electrode of the electronic component and conductive layer on the second insulation layer. The first insulation layer has a pad structure on second surface side of the first insulation layer on opposite side of the first surface, and the first insulation layer has coefficient of thermal expansion set lower than coefficients of thermal expansion of the second and third insulation layers. | 01-15-2015 |
| 20150022985 | DEVICE-EMBEDDED PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A package substrate includes a core layer having a core top surface and a core bottom surface, and a build-up layer having a stacked structure in which a plurality of interconnection layers and a plurality of insulating layers are alternately stacked on the core top surface. The core bottom surface includes a board connecting area. A surface of the build-up layer includes a chip mounting area. The core layer includes at least one cavity defined by recess sidewalls extending upward from the core bottom surface and a recessed surface located at a higher level than or the same level as the core top surface, at least one device mounted in the at least one cavity, and through-electrodes electrically connecting the core top surface and the core bottom surface. | 01-22-2015 |
| 20150382471 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. The boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm. | 12-31-2015 |
| 20160157354 | COMPONENT-EMBEDDED SUBSTRATE | 06-02-2016 |
