| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361762000 | With specific dielectric material or layer | 47 |
| 20090086451 | Printed circuit board with embedded cavity capacitor - A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode. | 04-02-2009 |
| 20090175012 | PRESS FIT PASSIVE COMPONENT - A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. | 07-09-2009 |
| 20090185357 | THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD INCLUDING MEMBRANE SWITCH AND RELATED METHODS - An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess. | 07-23-2009 |
| 20090201654 | METHOD AND SYSTEM FOR IMPROVING ELECTRICAL PERFORMANCE OF VIAS FOR HIGH DATA RATE TRANSMISSION - A method and system for reducing via hole parasitic effects on PCB transmission channels. In order to reduce the effects of excess via capacitance in PCB structures, PCB via modeling accuracy for high speed serial data transmissions is improved by utilizing lower permittivity reinforcement and z-axis conducting methods. A method to accomplish this includes creating a channel within the circuit board to accommodate a via hole, filling the created channel with a predetermined amount of dielectric material, forming the via hole, and electrically coupling the top layer of the structure to at least an inner signal substrate layer of the structure. | 08-13-2009 |
| 20090231819 | MULTILAYER SUBSTRATE - A multilayer substrate has a 1st strip line, a 2nd strip line and the 3rd strip line, and those characteristic impedances are different each other. The third strip line has a strip conductor of which length is equivalent to ¼ wavelength of an operating frequency. A strip conductor of the third strip line is the same conductor as a strip conductor of the first strip line, and is a different conductor layer from a strip conductor of the second strip line. Ground conductors of the 3rd strip line are formed of the same conductor layer as one of a ground conductor of the 1st strip line, and the same conductor layer as one of a ground conductor of the 2nd strip line. The strip conductor of the second strip line and the strip conductor of the third strip line are connected through via hole arranged in the multilayer substrate. | 09-17-2009 |
| 20100008055 | METHOD OF FABRICATING ELECTRONIC CARDS INCLUDING AT LEAST ONE PRINTED PATTERN - The invention relates to a method for fabricating electronic cards, that comprises the following steps:
| 01-14-2010 |
| 20100134991 | Chip embedded printed circuit board and manufacturing method thereof - The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The prevent invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof. | 06-03-2010 |
| 20100142170 | Chip embedded printed circuit board and manufacturing method thereof - The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof and provides a chip embedded printed circuit board including: an insulating layer having vias formed therethrough; a first chip and a second chip embedded in the insulating layer and having pads, which are respectively exposed to upper and lower surfaces of the insulating layer, on one surfaces thereof; an upper pattern formed on the upper surface of the insulating layer to be connected to the pads of the first chip and the vias; and a lower pattern formed on the lower surface of the insulating layer to be connected to the pads of the second chip and the vias. Also, the present invention provides a manufacturing method of a chip embedded printed circuit board. | 06-10-2010 |
| 20100226108 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board including a core substrate including a first resin substrate, a second resin substrate having an opening and a third resin substrate in a multilayer manner while interposing bonding plates, insulating layers and conductive circuit layers alternately laminated on the core substrate, solder bumps formed on an outer surface of the printed circuit board, a first capacitor formed in the opening of the second resin substrate, a conductive pad formed on the first resin substrate and connected to an electrode of the first capacitor, a via hole formed in the first resin substrate and directly connected to the conductive pad and a conductive circuit on the core substrate, and a second capacitor mounted on a surface of the printed circuit board. | 09-09-2010 |
| 20110002107 | Transponder and Booklet - A transponder includes an inlet including an antenna sheet, which includes an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet; a sealing material having electrical insulation is provided between the IC module and an inside face of the opening. | 01-06-2011 |
| 20110032684 | TERMINAL STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF - A conductor having a projecting portion is formed which forms a terminal portion. An uncured prepreg including a reinforcing material is closely attached to the conductor and the prepreg is cured to form an insulating film including the reinforcing material. When the prepreg is closely attached, the prepreg is stretched by the projecting portion, so that a region of the prepreg, which is closely attached to the conductor, can be thinner than the other region of the prepreg. Then, by reducing the thickness of the entire insulating film, an opening can be formed in the portion having a smaller thickness. The step of reducing the thickness can be performed by etching. Further, it is preferable not to remove the reinforcing material in this step. The strength of a terminal and an electronic device can be increased by leaving the reinforcing material at the opening. | 02-10-2011 |
| 20110051384 | PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDED THEREIN AND METHOD FOR EMBEDDING AT LEAST ONE COMPONENT IN A PRINTED CIRCUIT BOARD ELEMENT - A printed circuit board element ( | 03-03-2011 |
| 20110090657 | PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME - A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element. | 04-21-2011 |
| 20110176284 | MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF - A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein an electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion. | 07-21-2011 |
| 20110216515 | ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering a first electro device on a supporting body through a face-down method; adhering a second electro device on an upper surface of the first electro device through a face-up method; stacking a pure resin layer and a reinforcing layer on an upper side of the supporting body, wherein the first electro device and the second electro device are embedded in the pure resin layer; removing the supporting body; stacking an insulation layer on a lower side of the first electro device, a reinforcing material having been impregnated in the insulation layer; and patterning a circuit on each of the reinforcing layer and the insulation layer. | 09-08-2011 |
| 20110317382 | Insulating resin composition and printed circuit substrate using the same - Disclosed herein are an insulating resin composition soluble fluorine-based resin, thermosetting resin; a solvent capable of simultaneously dissolving the soluble fluorine-based resin and the thermosetting resin, and a printed circuit substrate using the same. | 12-29-2011 |
| 20120224344 | METHOD OF FABRICATING ELECTRONIC CARDS INCLUDING AT LEAST ONE PRINTED PATTERN - A method for fabricating electronic cards includes: A) forming a plurality of card bodies in the form of a thick sheet in which is respectively imbedded a plurality of electronic units or modules; B) printing a plurality of first patterns on a first face of the thick sheet in a printing station in which ink is applied on the first face for making the first patterns; and C) applying a first at least partially transparent coating on each printed first pattern, that adheres to the card body. The method also includes printing a plurality of second patterns on the inner surface of a film forming the first coating. Preferably, the printing of the first patterns is carried out in an offset type station for printing high definition patterns, essentially of the security type. The second patterns define personal data. The printed thick sheet defines an intermediate product. | 09-06-2012 |
| 20120281376 | EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING THE EPOXY RESIN COMPOSITION, AND COMPOSITE UNIT - An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition ( | 11-08-2012 |
| 20130176701 | COMPONENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURING THE COMPONENT- EMBEDDED SUBSTRATE - A component-embedded substrate includes an electrically insulating base ( | 07-11-2013 |
| 20130242517 | COMPONENT ASSEMBLY - A component assembly that can be easily built in a main substrate with high accuracy is formed such that a glass transition temperature of a built-in-component layer of an assembly substrate in which multiple capacitors are embedded is higher than a glass transition temperature of a built-in-component layer of a built-in-component substrate. Thus, thermal deformation of the component assembly is prevented when the built-in-component substrate in which the component assembly is built is heated during reflow, for example. The component assembly can thus be highly accurately built in the built-in-component substrate. Moreover, when the component assembly in which the multiple capacitors are embedded is built in the built-in-component substrate, electrode pads of the component assembly in which the multiple capacitors are embedded can be electrically connected to wiring layers of the built-in-component substrate by soldering despite the variation in height among the capacitors. | 09-19-2013 |
| 20130258622 | INFORMATION CARRYING CARD COMPRISING A CROSS-LINKED POLYMER COMPOSITION, AND METHOD OF MAKING THE SAME - The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof. | 10-03-2013 |
| 20140003011 | ELECTRIC ELEMENT-EMBEDDED MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | 01-02-2014 |
| 20140029222 | CHIP COMPONENT-EMBEDDED RESIN MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - The present invention provides a chip component-embedded resin multilayer substrate including a laminating body obtained by laminating a plurality of resin layers, a predetermined wiring conductor disposed in the laminating body, and a chip component embedded in the laminating body and having a side terminal electrode. A guarding member electrically isolated from the wiring conductor is provided to cover at least a part of a boundary between the side terminal electrode and the resin layers when viewed from a lamination direction of the laminating body, and the guarding member is formed from a material having a melting point higher than a temperature at which the resin layer begins to flow. | 01-30-2014 |
| 20140036461 | FLEXIBLE LED DEVICE FOR THERMAL MANAGEMENT AND METHOD OF MAKING - Provided is a flexible light emitting semiconductor device ( | 02-06-2014 |
| 20140049928 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with a built-in electronic component that can avoid as much as possible the occurrence of malfunctions in the electronic component due to moisture entering, even when an electronic component, provided with a structure in which a terminal pad is present where a hole in the sealing part provided on the main body of a component is located, is built into the substrate. A SAW filter | 02-20-2014 |
| 20140085846 | MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTING STRUCTURES FOR HIGH DENSITY PACKAGING - Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure. | 03-27-2014 |
| 20140085847 | WIRING SUBSTRATE - A wiring substrate is provided with a core substrate including a first main surface, a second main surface, and a through hole. An electronic component including a resin cover is arranged in the through hole. A projection projects from an inner wall of the through hole toward the resin cover of the electronic component. An insulator is filled between the inner wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The resin cover of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole. | 03-27-2014 |
| 20140146501 | ELECTRONIC DEVICE IN PLASTIC - The invention concerns a method for forming an electronic device in plastic. The method for forming an electronic device in plastic comprises: (a) placing electronic components ( | 05-29-2014 |
| 20140153204 | ELECTRONIC COMPONENT EMBEDDED PRINTING CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to an electronic component embedded printed circuit board and a method for manufacturing the same. | 06-05-2014 |
| 20140218884 | COMPONENT-EMBEDDED RESIN SUBSTRATE - A component-embedded resin substrate includes a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of the resin layers and a plurality of embedded components arranged as embedded in the resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a planar view, the first embedded component has a first outer side extending along a portion of an end surface | 08-07-2014 |
| 20140307404 | Embedded electronic Device and Method for Manufacturing an Embedded Electronic Device - An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay. | 10-16-2014 |
| 20140321085 | COMPONENT-EMBEDDED SUBSTRATE - A component-embedded substrate includes: a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of the mount surface; a first mounted component mounted on the mount surface; a second mounted component mounted on the mount surface and spaced from the first mounted component; a first chip-type electronic component disposed in the resin substrate; and a second chip-type electronic component disposed in the resin substrate and spaced from the first chip-type electronic component. The first and second chip-type electronic components are spaced from each other along a cross direction crossing an arrangement direction along which the first mounted component and the second mounted component that are arranged with respect to each other. The first and second chip-type electronic components are each arranged to cross the cross direction. | 10-30-2014 |
| 20140321086 | COMPONENT-EMBEDDED SUBSTRATE - A component-embedded substrate includes: a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of the mount surface; a first mounted component mounted on the mount surface; a second mounted component mounted on the mount surface and spaced from the first mounted component; and a first embedded chip-type electronic component disposed in the resin substrate. The first embedded chip-type electronic component is located close to the peripheral surface of the resin substrate. The mount surface includes: a first region located between the first and second mounted components and extending along a cross direction crossing an arrangement direction along which the first and second mounted components are arranged with respect to each other; and a second region located outside the first region. The first embedded chip-type electronic component is arranged to extend in the first and second regions as seen from above the mount surface. | 10-30-2014 |
| 20140347834 | ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - An electronic component embedded printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core having a cavity formed therein; an electronic component unit embedded in the cavity, including a plurality of electronic components, and having a coating layer formed on an outer peripheral surface of the electronic component unit to fix the plurality of electronic components; and an insulating layer laminated at least on the top of the core. An outer layer circuit pattern may be formed on the insulating layer. | 11-27-2014 |
| 20150016078 | Partitioned Hybrid Substrate for Radio Frequency Applications - The presently claimed invention is to provide a package for compact RF signal system, and a method to form the package thereof in order to miniaturize the size of package, improve signal integrity, and reduce manufacturing cost. The package comprises a hybrid substrate with a sandwiched structure, in which the hybrid substrate comprises an upper layer and a lower layer with different dielectric properties being separated by an interposer for improving electrical isolation and mechanical stiffness. Metal layers are formed on the sidewalls of the opening to surround an active component, such that the metal sidewalls together with two ground plates in the upper and lower layers constitute a self-shielding enclosure inside the package to protect the active component. | 01-15-2015 |
| 20150022983 | TECHNIQUES FOR BONDING SUBSTRATES USING AN INTERMEDIATE LAYER - A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region. | 01-22-2015 |
| 20150022984 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An embedded printed circuit board and a method of manufacturing the same. The embedded printed circuit board includes: an insulating layer on which a cavity is formed; a chip mounted on the cavity; and a circuit layer formed on the insulating layer, wherein the insulating layer is made of photosensitive compositions including photosensitive monomer and photoinitiator. As a result, the cavity can be formed by selectively using only the insulating layer, thereby making it possible to secure a degree of freedom in the design of the embedded printed circuit board. | 01-22-2015 |
| 20150092368 | ELECTRONIC MODULE - An electronic module includes a substrate, a built-in electronic component and a surface mount electronic component. A suckable region is provided on a front surface of the substrate. When viewed in a see-through manner in a direction perpendicular or substantially perpendicular to the front surface of the substrate, the suckable region is inside of a region in which one built-in electronic component is built in and a center of gravity of the electronic module is located inside of the suckable region. A protective layer is not provided on the front surface of the substrate on which the surface mount electronic component is mounted. | 04-02-2015 |
| 20150092369 | COMPONENT-EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF - A component-embedded substrate includes a multilayer body formed by stacking up a plurality of resin layers in a predetermined direction, a component embedded in the multilayer body, the component having a plurality of terminal electrodes, a plurality of joining conductors provided in the multilayer body and joined to the plurality of terminal electrodes, a plurality of wiring conductors provided in the multilayer body and electrically coupled to the plurality of joining conductors and at least one auxiliary member enclosed within an outer boundary of the component provided in the multilayer body. The auxiliary member may be electrically insulated from each of the plurality of wiring conductors and arranged to balance pressures acting on the plurality of terminal electrodes when pressure is applied on the multilayer body. | 04-02-2015 |
| 20150098203 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively. | 04-09-2015 |
| 20150109748 | ACTIVE CHIP PACKAGE SUBSTRATE AND METHOD FOR PREPARING THE SAME - An active chip package substrate and a method for preparing the same. The active chip package substrate includes: a core board; at least one upper active chip, embedded in the core board and having an active surface facing toward a lower surface of the core board, the upper active chip being an active bare chip; and at least one lower active chip, embedded in the core board and having an active surface facing toward an upper surface of the core board, the lower active chip being an active bare chip. | 04-23-2015 |
| 20150116964 | COMPONENT-EMBEDDED SUBSTRATE - A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and the respective inner electrodes. The resin portion is stacked on the substrate portion, with the embedded electronic component embedded therein. The resin portion includes a no-filler-added layer and a filler-added layer. The no-filler-added layer extends from the inner principal surface to a height which allows at least the solder fillets to be covered. The filler-added layer contains an inorganic filler and extends from an interface with the no-filler-added layer to a height which allows at least the embedded electronic component to be covered. | 04-30-2015 |
| 20150138741 | CHIP EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a chip embedded board and a method of manufacturing the same. The chip embedded board includes: a core substrate; a first build-up layer formed on one surface of the core substrate and having a cavity formed therein; a chip disposed in the cavity; and an insulating layer filled in the cavity in which the chip is disposed, wherein one surface of the chip is positioned in a circuit layer positioned at the outermost layer of the first build-up layer. | 05-21-2015 |
| 20150296625 | PRINTED CIRCUIT BOARD - Provided is a printed circuit board including: an insulating layer; electronic devices embedded, in the insulating layer; and an adhesive layer for fixing the electronic devices. | 10-15-2015 |
| 20160128177 | MULTILAYER ELECTRONIC COMPONENT - A multilayer electronic component includes a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body. The body includes a first capacitor part and a second capacitor part having different levels of capacitance, the first and second capacitor parts each comprising at least two among the plurality of internal electrodes with at least one of the ceramic layers or magnetic layers interposed therebetween, and a third capacitor part comprising at least one among the plurality of internal electrodes and at least one among the coil portions with at least one of the ceramic layers or magnetic layers interposed therebetween. | 05-05-2016 |
| 20160128178 | MULTILAYER ELECTRONIC COMPONENT - A multilayer electronic component includes a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body. The body includes a first capacitor part and a second capacitor part having different levels of capacitance. The first and second capacitor parts each include at least two among the plurality of internal electrodes and at least one of the ceramic layers or magnetic layers is interposed therebetween. | 05-05-2016 |
| 20160165732 | PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A printed circuit board with embedded electronic component and a method of manufacturing the same are provided. The method of manufacturing a printed circuit board involves processing a cavity in a core substrate, attaching a support to one surface of the core substrate, inserting an electronic component into the cavity, affixing the electronic component to a side wall of the cavity by use of a liquid adhesive, removing the support, and stacking an insulation layer and a copper thin layer simultaneously on both surfaces of the core substrate. | 06-09-2016 |
