| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361722000 | For electronic circuit | 24 |
| 20090027860 | COOLING DEVICE WITH A PREFORMED COMPLIANT INTERFACE - An integrated circuit package includes: a substrate; an electronic circuit located on the substrate, the electronic circuit comprising a topography of at least one level; a cooling device located over the electronic circuit; a compliant interface disposed between the electronic circuit and the cooling device, wherein the compliant interface comprises a first surface and a second surface and wherein the first surface is in thermal contact with the electronic circuit, and wherein the compliant interface is preformed from a compliant material such that the first surface substantially conforms to the topography of the electronic circuit. | 01-29-2009 |
| 20090116199 | Heat dissipating device - A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base forms a protrusion. The block defines a first recess and a second recess in two opposite surfaces of the block respectively. The protrusion of the heat sink engages in the first recess, and an electronic component is received in the second recess. | 05-07-2009 |
| 20090135567 | METAL THERMAL INTERFACE MATERIAL AND THERMAL MODULE AND PACKAGED MICROELECTRONIC COMPONENT CONTAINING THE MATERIAL - The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material. | 05-28-2009 |
| 20090168368 | DISCRETE ELECTRONIC COMPONENT AND RELATED ASSEMBLING METHOD - The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on the electronic printed circuit board. The body has a heat dissipating header having at least one surface emerging from the body and laying on a plane whereas the pins project from the body for a first section initially extended parallel to the plane. Advantageously a pair of pins has a substantially U-shaped bending, after the first section parallel to the plane for allowing a more stable bearing of the component during the step of welding to a heat dissipating intermediate die. | 07-02-2009 |
| 20090284933 | COMBINATION TYPE HEAT DISSIPATION MODULE - A combination type heat dissipation module applied to dissipate at least one heat source is disclosed. The combination type heat dissipation module comprises a heat dissipation base and a plurality of heat dissipation cells. A base heat conduction surface of the heat dissipation base is applied to connect the heat source, a plurality of assembling grooves are recessed from a base heat dissipation surface of the heat dissipation base, and a cell body of each heat dissipation cell has a cell heat dissipation surface. At least two of the heat dissipation cells are respectively assembled to at least two of the assembling grooves, and keep their cell heat dissipation surfaces being exposed from the base heat dissipation surface. | 11-19-2009 |
| 20110141701 | ELECTRONIC CIRCUIT DEVICE - An electronic circuit device includes a bus bar, a base component and an electronic component. The bus bar has an external connector terminal capable of receiving electric power from an external power source. The base component has a metallic heat radiation portion and is disposed to oppose the bus bar. The electronic component is held between the bus bar and heat the radiation portion of the base component. The bus bar further includes fixing terminals extending toward the base component. The fixing terminals are fixed to the base component to constitute fixing portions. The fixing portions are configured to have elasticity and exert a restoring force such that a distance between the bus bar and the base component reduces. The electronic component is in pressure contact with the bus bar and the base component by the restoration force of the elasticity of the fixing portions. | 06-16-2011 |
| 20110170266 | 4D DEVICE PROCESS AND STRUCTURE - a 4D device comprises a 2D multi-core logic and a 3D memory stack connected through the memory stack sidewall using a fine pitch T&J connection. The 3D memory in the stack is thinned from the original wafer thickness to no remaining Si. A tounge and groove device at the memory wafer top and bottom surfaces allows an accurate stack alignment. The memory stack also has micro-channels on the backside to allow fluid cooling. The memory stack is further diced at the fixed clock-cycle distance and is flipped on its side and re-assembled on to a template into a pseudo-wafer format. The top side wall of the assembly is polished and built with BEOL to fan-out and use the T&J fine pitch connection to join to the 2D logic wafer. The other side of the memory stack is polished, fanned-out, and bumped with C4 solder. The invention also comprises a process for manufacturing the device. In another aspect, the invention comprises a 4D process and device for over 50× greter than 2D memory density per die and an ultra high density memory. | 07-14-2011 |
| 20110199736 | POWER CONVERTER - An inverter device has a control unit, a power unit, and a capacitor unit. The power unit has six semiconductor devices. Each semiconductor device has a semiconductor module and a pair of heat sinks disposed in both sides of the semiconductor module. The heat sinks are arranged in a ventilation path of cooling air. An, accommodation chamber of a control unit | 08-18-2011 |
| 20110228486 | Power supply with low touch-temperature surface - A power supply provides a low touch-temperature surface by utilizing a plurality of spaced apart pegs which extend from a surface of a case away from heat generating components enclosed within the case. The top and side surfaces of the pegs and the surface of the case not occupied by the pegs are entirely directly exposed to ambient air. The tops of the pegs provide a touch surface having a temperature which is cooler than that at the base of the pegs. The pegs are preferably arranged to minimize heat transfer between adjacent pegs. | 09-22-2011 |
| 20120002375 | METHOD AND STRUCTURE FOR DISSIPATING HEAT AWAY FROM A RESISTOR HAVING NEIGHBORING DEVICES AND INTERCONNECTS - A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects. The semiconductor structure includes a semiconductor substrate, a resistor disposed above the semiconductor substrate, and a thermal protection structure disposed above the resistor. The thermal protection structure has a plurality of heat dissipating elements, the heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate. The thermal protection structure receives the heat generated from the resistor and the heat dissipating elements dissipates the heat to the semiconductor substrate. | 01-05-2012 |
| 20120033386 | HEAT DISSIPATING DEVICE WITH DELAY FUNCTION AND ELECTRONIC APPARATUS USING SAME - A heat dissipating device is used in an electronic apparatus. The electronic apparatus includes a standby unit and a power supply. The heat dissipating device includes a delay unit connected to the standby unit, a switch connected to the delay unit and the power supply, and a heat sink connected to the switch. The delay unit turns on the switch when the electronic apparatus operates in a working mode, and the delay unit turns off the switch after a predetermined delay time when the electronic apparatus enters a standby mode. | 02-09-2012 |
| 20120140421 | ASSEMBLIES INCLUDING HEAT SINK ELEMENTS AND METHODS OF ASSEMBLING - A heat sink assembly comprises a plurality of components and a plurality of mounting tabs. A component attachment surface of each mounting tab is attached to a component and heat sink attachment surfaces of the plurality of mounting tabs are at least substantially coplanar. A heat sink element is attached to at least some of the plurality of mounting tabs at the heat sink attachment surface thereof. A method of assembling a heat sink assembly comprises attaching a plurality of mounting tabs to at least one substantially planar assembly surface of an assembly fixture. Each mounting tab is attached to a heat-generating component to form a mechanical and thermal coupling therebetween. The assembly fixture is removed from the plurality of mounting tabs, and a heat sink element is attached to mounting tabs of the plurality. | 06-07-2012 |
| 20120262884 | POWER CONVERTER ARRANGEMENT AND METHOD FOR OPERATING A POWER CONVERTER ARRANGEMENT - A power converter arrangement has two static switching element bridges that are alternatively operable and comprise static switching elements. The power converter arrangement has one housing that houses the two static switching element bridges; the housing has one cooling system for the static switching element bridges housed therein. | 10-18-2012 |
| 20130083491 | Electronic Devices With Cover Layers Mounted to Displays - An electronic device may be provided with a display cover layer mounted to the device using an adhesive bond with a display. The display may be a flexible display. The flexible display may include Organic Light Emitting Diode display technology. The display may be mounted to a rigid support structure. The rigid support structure may be mounted to a device housing member. Mounting the display cover layer to the display may eliminate the need to mount the display cover layer to the device housing and may allow active display pixels to be visible under the display cover layer closer to the device housing than in conventional devices. Providing the electronic device with active display pixels closer to the device housing may reduce the need for an inactive border around the display and may improve the aesthetic appeal of the electronic device. | 04-04-2013 |
| 20130279119 | ELECTRONIC ASSEMBLIES AND METHODS OF FABRICATING ELECTRONIC ASSEMBLIES - Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink. | 10-24-2013 |
| 20130294033 | THERMALLY ENHANCED ELECTRONIC PACKAGE - A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages. | 11-07-2013 |
| 20140085832 | ELECTRONIC DEVICE WITH EFFICIENT HEAT RADIATION STRUCTURE FOR ELECTRONIC COMPONENTS - An electronic device includes a metallic body, a circuit substrate having electronic components and wiring conductors, a heat conduction member that absorbs a heat generated by the electronic components, and a heat radiation member provided between the metallic body and the heat conduction member. The heat radiation member includes a heat introduction portion surface-contacted with the heat conduction member, a heat discharge portion surface-contacted with the metallic body, and a heat conduction portion that conducts the heat from the heat introduction portion to the heat discharge portion. The heat conduction portion is provided to be separated from the wiring conductors so as not to electromagnetically couple to the wiring conductors. | 03-27-2014 |
| 20140092563 | HEAT RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer. | 04-03-2014 |
| 20140098499 | ELECTRONIC DEVICE, STRUCTURE, AND HEAT SINK - An electronic device includes a substrate ( | 04-10-2014 |
| 20140321065 | DC-DC CONVERTER - A DC-DC converter is provided with a transformer provided with a primary coil and a secondary coil; switching elements connected to the primary coil for switching the flow of electrical current to the primary coil; rectifying elements connected to the secondary coil; a case having a first accommodating portion in which the transformer is accommodated and a second accommodating portion in which the switching elements and the rectifying elements are accommodated; and a metal heat sink mounted on the case, the metal heat sink being thermally connected to the switching elements and the rectifying elements and having a radiator portion exposed on the outer surface of the case. | 10-30-2014 |
| 20150092354 | Pluggable Module Housing Assembly - A pluggable module housing assembly comprises a base at least partially surrounding a socket having an entrance sized and dimensioned to receive a pluggable module. At least one guide extends adjacent to the socket. A heat sink assembly includes a riding heat sink having a module-contacting surface facing the socket, and an actuating assembly coupled to the base and to the riding heat sink. The actuating assembly is configured to move the riding heat sink relative to the base between a deployed position a first distance from the at least one guide, and a stowed position a second distance from the at least one guide, the second distance being greater than the first distance. | 04-02-2015 |
| 20160165716 | POWER CONVERSION APPARATUS - An AC/DC converter of a power conversion apparatus includes filters, a PFC circuit, a first full bridge circuit, a first transformer, and a first rectifier circuit and converts an AC voltage supplied from the outside to a DC voltage. A DC/DC converter includes filters, a second full bridge circuit, a second transformer, and a second rectifier circuit and lowers a DC voltage output from the AC/DC converter. Constituent circuits of the AC/DC converter located on the primary side of the first transformer are mounted on the upper face of a cooling chassis which cools both the converters. Constituent circuits of the AC/DC converter located on the secondary side of the first transformer and constituent circuits of the DC/DC converter are mounted on the lower face of the cooling chassis. | 06-09-2016 |
| 20180023792 | DEVICE FOR CONNECTING A LIGHT SOURCE TO AN ELECTRICAL POWER SUPPLY DEVICE | 01-25-2018 |
| 20180027694 | ELECTRONIC APPARATUS | 01-25-2018 |
