| Entries |
| Document | Title | Date |
|---|
| 20080266811 | Motor Drive Circuit And Outdoor Unit For Air Conditioner - One of the purpose is to obtain a motor drive circuit and an outdoor unit for an air conditioner using the same, which can flexibly support change of a model at a low price and in a small lot without using unnecessary materials, wherein a stress in a soldering part due to self-heating is low, a solder reliability is high, and design constraints are small, while maintaining a low-noise and low-loss power wiring due to lowering inductance. The motor drive circuit according to the present invention, for driving the motor using the converter circuit and the inverter circuit, whereon electronic components making up a converter circuit and an inverter circuit are mounted, which includes a lead frame molded board | 10-30-2008 |
| 20080285239 | Ic Holder - Provided is an integrated circuit (IC) holder that includes: a case into which an IC package is inserted; a fastening unit for fastening the case to a printed circuit board (PCB); and a heat-dissipation unit for transferring heat generated from the IC package to the case, so that the IC holder is not in contact with the PCB or designed to avoid devices or circuits adjacent to the IC package even though it is contact with the PCB, thereby reducing an unnecessary area not used for layout of the PCB and providing a layout structure similar to that using only the IC package. Further, the IC holder can have a solderless structure to make the devices be readily replaced, solve an environment problem, and be easily applied to various kinds of the IC packages. | 11-20-2008 |
| 20080310120 | Electric Sub-Assembly - An electric sub-assembly has an integrated circuit, which contains at least one power semi-conductor component and additional electronic components, the latter being interconnected and linked to connections by the conductors of a lead frame ( | 12-18-2008 |
| 20080310121 | Electrical Junction Box - The present invention improves heat dissipation of an electrical junction box. An electrical junction box includes a housing which houses a control circuit board disposed perpendicular to a power distribution board. The control circuit board includes a control circuit constructed on one side of an insulating substrate, electrical components mounted on the control circuit, and a heat dissipating means mounted on the other side. The power distribution board includes a plurality of bus bars laminated via a plurality of insulating layers. Consequently, heat generated by the electrical components can be dissipated efficiently by the heat dissipating means, thereby improving heat dissipation of the electrical junction box. | 12-18-2008 |
| 20080310122 | THERMAL DISSIPATING DEVICE - An exemplary thermal dissipating device is for cooling an electronic component of a circuit board. The thermal dissipating device includes a heat conductive plate with a first side and a second side opposite to the first side, a plurality of heat pipes, and a plurality of fin arrays. The heat conductive plate includes a first part with the first side in closely contact with the electronic component, and a second part perpendicularly disposed beside the first part. The heat pipes are embedded in the second side of the conductive plate, extending from the first part to the second part. One of the fin arrays is attached to the second side of the first part of the conductive plate. The others of the fin arrays are attached to the second part of the conductive plate the first and second sides respectively. | 12-18-2008 |
| 20090002952 | Interference mitigation - In some embodiments, an electronic apparatus comprises a display assembly, a printed circuit board comprising a display driver integrated circuit, and at least one structure to alter a resonance frequency characteristic of at least one of the display assembly or the printed circuit board. Other embodiments may be disclosed. | 01-01-2009 |
| 20090002953 | PRODUCTION OF VIA HOLE IN FLEXIBLE CIRCUIT PRINTABLE BOARD - A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole. | 01-01-2009 |
| 20090021918 | STACKED HEAT-TRANSFER INTERFACE STRUCTURE - A stacked heat-transfer interface structure for dissipating heat from a circuit board is disclosed to include a heat plate affixed to the circuit board, and relatively thinner first heat transfer devices and relatively thicker second heat transfer devices respectively attached to first and second heat generating electronic devices of the circuit board that have different heights for transferring heat from the first and second heat generating electronic devices of the circuit board to the heat plate for dissipation. Each first heat transfer device comprises a first heat-transfer sheet member having a high heat conductivity and a low thermal resistance and bonded to one first heat generating electronic device, an elastically deformable second heat-transfer sheet member having a low heat conductivity and a high thermal resistance and bonded to the heat plate to compensate for height tolerance of the respective first heat generating electronic device, and a heat-transfer block for spreading heat energy from the first heat-transfer sheet member onto the heat plate through the second heat-transfer sheet member. | 01-22-2009 |
| 20090073661 | THIN CIRCUIT MODULE AND METHOD - A circuit module includes a printed circuit board (PCB) having a first side, a second side, and a bottom perimeter edge. The PCB exhibits a first thickness along the bottom perimeter edge. The first side includes a recessed area and, in that recessed area, the PCB has a second thickness that is less than the first thickness. A plurality of integrated circuits (ICs) are fixed to the PCB in the recessed area. A plurality of module contacts are connected to the ICs and are disposed along at least one of the first and second sides and are configured to provide electrical connection between the circuit module and an edge connector. | 03-19-2009 |
| 20090080162 | STRUCTURE AND METHOD FOR EFFICIENT THERMAL DISSIPATION IN AN ELECTRONIC ASSEMBLY - One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board. | 03-26-2009 |
| 20090086439 | INTEGRATED ELECTRICAL SHIELD IN A HEAT SINK - A system having a heat exchanger with a bottom side, a first nonconductive layer coupled to the bottom side of the heat exchanger, a heat shield made of an electrically conductive material and being coupled to the first nonconductive layer, and an electrical connector electrically coupled to the heat shield, the electrical connector being capable of being connected to an electrical ground. | 04-02-2009 |
| 20090109631 | ELECTRONIC-COMPONENT-MOUNTING BOARD - The electronic-component-mounting board according to the present invention includes: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a upper surface of the metal plate; an electronic component which is mounted on the high-heat-dissipation substrate and is electrically connected to the circuit pattern; and one external connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic-component-mounting board and an external device. The external-connection terminal is formed of a material having a thermal conductivity less than that of the metal plate and has at least one external electrode to which a lead wire is soldered. Therefore, the lead wire can be connected by soldering even on the high-heat-dissipation substrate. Accordingly, the reliability of the electrical connection is improved, and reduction in size and thickness of the electronic-component-mounting board can be achieved. In addition, the cost of the electronic-component-mounting board can be reduced. | 04-30-2009 |
| 20090116198 | Structure and method to form a heat sink - The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component. | 05-07-2009 |
| 20090122494 | Cooling Device for Printed Circuit Board and Method for the Prosecution Thereof - Disclosed is a cooling device ( | 05-14-2009 |
| 20090122495 | DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD - The present invention provides a device mounting structure and a device mounting method in which the short circuit can be prevented between a device lead part and a device ground part when the reflow process is executed. Thus, in the device mounting structure of the present invention, the device is contained in an aperture part provided in a wired board on a heat-radiating plate, a device main part of the device being fixed on the device ground part, a device lead part extending from opposing sides of the device main part is connected to a wiring part on the wired board, and an internal wall of the aperture part positioned just under the device lead part and the device ground part positioned on the heat-radiating plate are separated by a predetermined distance. | 05-14-2009 |
| 20090135566 | PRINTED CIRCUIT BOARD ASSEMBLY AND LIQUID CRYSTAL DISPLAY HAVING THE SAME - A printed circuit board assembly and a liquid crystal display (“LCD”) having the same, and more particularly, to a printed circuit board assembly, wherein a board mounted with a heat dissipation plate and a time controller using a spring clip or a hook spring can prevent the board from sagging. An exemplary embodiment includes a heat dissipation plate, a protection plate and a thermal interface material to dissipate heat from a time controller, thereby efficiently dissipating heat from the time controller. Another exemplary embodiment includes a spring clip or a hook spring to increase contact forces among a protection plate, a heat dissipation plate and a board, thereby further improving heat dissipation performance. Exemplary embodiments of the present invention make it possible to provide a printed circuit board assembly, wherein a spring clip supports the bottom of a region of a board in which a time controller is mounted, thereby preventing sagging of the region of the board in which the time controller and a heat dissipation plate are mounted. An LCD having the printed circuit board assembly is also described. | 05-28-2009 |
| 20090147481 | ELECTRONIC DEVICE - Provided is an electronic device, which can make the user feel no temperature difference, which can keep the heat liberation of a casing and which can be reduced in size. | 06-11-2009 |
| 20090154113 | THERMAL ENERGY STORAGE FOR MOBILE COMPUTING THERMAL MANAGEMENT - In some embodiments, a device includes power source circuitry, a circuit board supporting electrical components to receive electrical power from the power source circuitry. The device further includes a housing forming a cavity including the circuit board, and thermal energy storage material held in the cavity, wherein the thermal energy storage material is distributed throughout various places in the cavity. Additional embodiments are described. | 06-18-2009 |
| 20090168366 | Thin multi-chip flex module - A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board. | 07-02-2009 |
| 20090168367 | ELECTRONIC APPARATUS - An electronic apparatus includes an electronic element | 07-02-2009 |
| 20090185352 | HIGH PERFORMANCE POWER DEVICE - A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane. Optionally, a conductive via can be formed in portions of the signal carrying layer not occupied by the insert of PG, where the conductive via operably couples a first side of the signal carrying layer to a second side of the signal carrying layer. | 07-23-2009 |
| 20090190313 | THERMAL MODULE - A thermal module includes a heat sink disposed on a contact surface of the heat source, a mounting bracket having first and second ends, a fastening member, a pressing member, and at least one clip. The mounting bracket surrounds the heat source. The first end has at least one latch portion. The second end has at least one mounting slot and at least one first opening in communication with the mounting slot. The fastening member is slidably mounted in the mounting slot. The clip spans the heat sink and has two ends respectively engaged with the latch portion and a portion of the fastening member respectively. The pressing member includes a pressing tightly engaged with the clip and urges the heat sink when an operation portion of the pressing member is rotated from the first predetermined position to the second predetermined position. | 07-30-2009 |
| 20090195991 | Electric device having circuit board and casing and method for manufacturing the same - An electric device includes: a circuit board; an electric element on the board; a casing accommodating the board and including a receiving base and a protruding wall; and a heat radiation element between the board and the base. Heat conducts from the electric element to the casing via the board and the heat radiation element. The electric element is opposite to the heat radiation element across the circuit board. The base has a concavity and a through hole penetrating from the concavity to an outer surface of the casing. The wall surrounds the board. The height of the wall is larger than the height of the base, and smaller than the height of the board. The heat radiation element press-contacts in the concavity, protrudes from a clearance between the circuit board and the receiving base and a clearance between the circuit board and the protruding wall. | 08-06-2009 |
| 20090219699 | CIRCUIT BOARD WITH COOLING FUNCTION - The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided. | 09-03-2009 |
| 20090257197 | HEAT SINK ASSEMBLY - A heat sink assembly includes a first heat sink, a second heat sink, and a wire clip connecting the first and second heat sinks together. Each of the first and second heat sinks includes a base and a plurality of connecting members extending upwardly from the base. The wire clip includes a pivot portion and a pair of pressing portions extending from opposite ends of the pivot portion towards each other. The connecting members of the first and second heat sinks cooperatively clasp the pivot portion of the wire clip. The pressing members of the wire clip resiliently abut against the connecting members of the first and second heat sinks and push the connecting members of the first and second heat sink outwardly away from each other. The bases of the first and second heat sinks clamp an add-on card therebetween. | 10-15-2009 |
| 20090290310 | STRUCTURE AND METHOD FOR MOUNTING A HEAT-GENERATING COMPONENT - A structure for mounting a heat-generating component includes a circuit board on which a heat-generating component is mounted, a base on which the circuit board is disposed upright, a cover having thermal conductivity, a heat-conductive member electrically isolated from the heat-generating component and a heat transfer plate. The heat transfer plate is attached to the circuit board so as to extend in the sliding direction of the cover to cover a surface of the heat-conductive member. The cover presses the heat transfer plate by an inner surface thereof against the heat-conductive member in a direction perpendicular to the heat-conductive member so that the heat-generating component is thermally connected to the inner surface of the cover through the heat-conductive member and the heat transfer plate. | 11-26-2009 |
| 20090316367 | HEAT SINK ASSEMBLY HAVING A CLIP - A heat sink assembly includes a heat sink and a clip. The clip includes a main body, two pressing portions extending outwardly from two opposite ends of the main body, two extension portions each extending upwardly from an outer end of a corresponding pressing portion, a locking arm extending slantwise and upwardly from an upper end of each extension portion, a U-shaped operating portion extending from a far end of the locking arm and a J-shaped hook extending from a free end of the operating portion. The operating portion is provided for receiving a depressing force acting on the clip for moving the hook to engage with a clasp on a printed circuit board. | 12-24-2009 |
| 20090323289 | HEAT SINK ASSEMBLY - An electronic assembly includes a printed circuit board mounted with an electronic component, a heat sink, and a clip securing the heat sink on the printed circuit board to enable the heat sink to have an intimate contact with the electronic component. The printed circuit board forms two engaging portions each defining a receiving hole therein. The heat sink includes a base and a plurality of fins. The clip includes a pressing member pressing the heat sink to the electronic component, two V-shaped operating members extending slantwise from ends of the pressing member, and two clasps extending outwardly from ends of the operating members. Height of each of the clasps is larger than that of each of the receiving holes of the engaging portions. The clasps of the clip lock with the engaging portions by manipulating the operating members. | 12-31-2009 |
| 20100014255 | MOBILE TERMINAL DEVICE AND METHOD FOR RADIATING HEAT THEREFROM - In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure. Furthermore, the rigidity of the circuit board can be raised, and the reliability of the mobile terminal device can be improved. | 01-21-2010 |
| 20100020504 | ELECTRONIC DEVICE AND HEAT DISSIPATION UNIT THEREOF - An electronic device and a heat dissipation unit thereof are provided. The electronic device includes a housing, a circuit board, a heat source, a heat dissipation system and a heat dissipation unit. The circuit board is disposed in the housing and the heat source is disposed on the circuit board. The heat dissipation abuts the heat source, and the heat dissipation unit, disposed on the housing, abuts the heat dissipation system, wherein a portion of the heat dissipation unit is exposed outside of the housing. The heat dissipation unit includes a connecting portion, a heat exchanger, and a heat pipe. The connecting portion, disposed in the housing, abuts the heat dissipation system. The heat exchanger is disposed in the housing, and a portion of the heat exchanger is exposed outside of the housing. The heat pipe connects the connecting portion with the heat exchanger. | 01-28-2010 |
| 20100053904 | LOCKING DEVICE FOR HEAT SINK - A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending toward the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole. | 03-04-2010 |
| 20100053905 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus ( | 03-04-2010 |
| 20100053906 | HEAT DISSIPATION DEVICE - A heat dissipation device for dissipating heat generated by an electronic device on a printed circuit board includes a heat sink and a plurality of mounting devices. A plurality of retaining pillars are secured on the printed circuit board at positions around the electronic device. Each of the mounting devices includes a fixing portion connecting with the heat sink, a mounting portion extending from the fixing portion and a locating portion extending from the mounting portion to a position below the mounting portion. The retaining pillars on the printed circuit board extend through the locating portions and abut against bottoms of the mounting portions to accurately position the heat dissipation device on the electronic device on the circuit board before fasteners are brought to extend through the mounting portions to screw in the retaining pillars. | 03-04-2010 |
| 20100085714 | MOUNTING APPARATUS FOR HEAT SINK - A mounting apparatus includes a heat sink with two first mounting holes receiving two screws respectively, and a printed circuit board (PCB) with a second mounting hole, and a third mounting hole corresponding to the first mounting holes. The second mounting hole includes a second inserting hole, and a second accommodating hole extending from the second inserting hole along a first axis. The third mounting hole includes a third inserting hole, and a third accommodating hole extending from the third inserting hole along a second axis. One screw is inserted into the second inserting hole, and moved along a first axis to be received in the second accommodating hole. Another screw is angled into the third inserting hole, released to return to an upright position and received in the third accommodating hole. | 04-08-2010 |
| 20100097769 | Heat-dissipating structure for expansion board architecture - A heat-dissipating structure for the expansion board architecture is provided. A fixing element disposed on the heat-absorbing substrate fixes the motherboard and the first expansion board. The heat-generating elements on the motherboard or the first expansion board are directly in touch with the heat-absorbing surface of the heat-absorbing substrate to absorb their heat. The heat-dissipating board extended from the side of the heat-absorbing substrate then dissipates the heat absorbed by the heat-absorbing substrate. The structure thus solves the problems that existing heat-dissipating structures occupy larger space and therefore cannot be effectively used in an expansion board architecture to dissipate heat produced by the heat-generating elements between the motherboard and the expansion board and that it is likely to have assembly tolerance. Using the structure can reduce the space and the assembly tolerance, but effectively enhance heat dissipation in the expansion board architecture. | 04-22-2010 |
| 20100103625 | PRINTED CIRCUIT BOARD AND HEAT SINK - A heat sink for a printed circuit board of power server includes at least one soldering portion. The heat sink is soldered to the printed circuit board at the soldering portion by a lead-free tin soldering process. A plurality of protruding structures protrudes from the soldering portion uniformly. The protruding structures are beneficial for getting a better soldering quality. | 04-29-2010 |
| 20100110640 | Thermally Conductive Covers For Electric Circuit Assemblies - A method of producing a thermally conductive cover for an electric circuit assembly having a plurality of heat dissipating components is disclosed. The thermally conductive cover including a top surface, a bottom surface, and at least one rib extending downwardly from the bottom surface. The method includes selecting a plurality of dimensions for the thermally conductive cover such that the bottom surface will be spaced above and extend over top sides of the plurality of heat dissipating components when the thermally conductive cover is installed over the electronic circuit assembly. The at least one rib will extend over and be spaced from the plurality of heat dissipating components when the thermally conductive cover is installed over the electronic circuit assembly. The method further includes producing the thermally conductive cover with the selected dimensions. Thermally conductive covers are also disclosed. | 05-06-2010 |
| 20100110641 | POWER SUPPLY APPARATUS - A power supply apparatus includes a printed circuit board having the longitudinal direction and including first and second regions where AC and DC circuit components are mounted respectively. A first heat dissipation plate and a second heat dissipation plate provided to stand respectively in the first and second regions each include, as seen in a plan view, a linear first straight portion and two second straight portions extending respectively from the two ends of the first straight portion in opposite directions respectively and in the longitudinal direction. Respective first straight portions of the first and second heat dissipation plates are opposite to each other, and one of the second straight portions of the first heat dissipation plate and one of the second straight portions of the second heat dissipation plate are partially opposite to each other. | 05-06-2010 |
| 20100157544 | ELECTROMAGNETIC SHIELDING DEVICE WITH HEAT DISSIPATING FUNCTION - An electromagnetic shielding device with a heat dissipating function for shielding at least one electronic element on a circuit board is provided. The electromagnetic shielding device includes a frame, a cover, and a heat dissipating element. The frame is disposed on the circuit board and surrounds the electronic element, and the frame is one-piece and seamless. The cover has a top portion and a side portion bent from borders of the top portion. The heat dissipating element is disposed on the top portion. The top portion of the cover is connected to borders of the frame, and the side portion is tightly combined with the frame so that the cover, the frame and the circuit board form a shielding space to surround the electronic element. | 06-24-2010 |
| 20100165580 | FASTENER AND HEAT SINK ASSEMBLY HAVING THE SAME - A fastener includes a connecting pole, a sleeve, an elastic element enclosing the sleeve and a baffling portion. The connecting pole includes a shaft, a head and a thread portion. The sleeve includes an engaging portion and a receiving portion extending from the engaging portion. The engaging portion encloses a top end of the shaft therein and abuts against the head. The receiving portion encloses a bottom end of the shaft and a top end of the thread portion. The receiving portion includes a plurality of spaced resilient pieces. The baffling portion screws onto the thread portion of the connecting pole. When the connecting pole rotates relative to the sleeve, the baffling portion moves upwardly along the thread portion to push the pieces of the receiving portion outwardly to make the pieces abut against a bottom surface of a printed circuit board. | 07-01-2010 |
| 20100177484 | HEAT SINK - A heat sink for cooling an electronic element of a circuit board includes a dissipating part configured for dissipating heat, and a mounting part configured for mounting the heat sink to the circuit board. The mounting part extends from the dissipating part integrally. | 07-15-2010 |
| 20100177485 | FIXING APPARATUS FOR HEAT SINK - A fixing apparatus is provided for retaining a heat sink to a circuit board. The fixing apparatus includes a mount fixed to the circuit board, two locking members attached to the mount, and a clip. The mount defines a receiving hole accommodating the heat sink. The clip includes a positioning portion abutting against the heat sink, and two retaining arms extending from opposite ends of the positioning portion. The positioning portion presses the heat sink against the circuit board in response to the retaining arms engaging with the locking members. | 07-15-2010 |
| 20100188821 | DEVICE HAVING ELECTRONIC COMPONENTS MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH DEVICE - A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component. | 07-29-2010 |
| 20100195287 | SYSTEMS AND METHODS FOR PRINTED BOARD ASSEMBLY ISOLATED HEAT EXCHANGE - Systems and methods for printed board assembly isolated heat exchange are provided. In one embodiment, a printed board assembly comprises: at least one electrical power layer; at least one electrical ground layer; a first signal layer having a first signal routing area providing electrical trace connections for signals and a first heat exchange chassis fill conductor area located adjacent to a periphery of the first signal routing area; at least one thermal interface coupled to a chassis for conducting heat from the printed board assembly to the chassis; and at least one via conductively coupling the first heat exchange chassis fill conductor area to the at least one thermal interface. | 08-05-2010 |
| 20100202111 | Hermetic modular power supply - A hermetic modular power supply is a lumpish power supply which is completely enclosed and fixed as a heating unit formed by a circuit board and electronic elements, with a heat conductive and dissipative material. A modular base has a plural set of power plug holes, and at least one power supply can be plugged into the power plug holes, such that the power supply can be quickly and conveniently plugged into the power plug holes for use, selectively. In addition, the power supply has functions of improving heat dissipation efficiency and prolonging a lifetime of usage of the heating unit. | 08-12-2010 |
| 20100202112 | METAL-BASED PRINT BOARD FORMED WITH RADIATORS - In a metal-based print board formed with radiators, a metal foil is affixed to a front surface of a metal plate having good thermal conductivity, an insulating adhesive layer interposed therebetween. A radiator is integrally provided on a reverse surface of the metal plate, the radiator having a plurality of thin radiating fins formed upright in a tabular shape due to having been dug out by an excavating tool. The radiating fins give the radiator a large area over which heat can be released. The thickness of a first metal plate portion formed between adjacent radiating fins is less than the original thickness of the metal plate. Heat generated by an electronic component or another component provided on a side of the front surface of the metal plate is rapidly transmitted from the reduced-thickness first metal plate portion of the metal plate to each of the radiating fins of the radiator on the reverse surface side, and efficiently released from each of the radiating fins, which have a large area over which heat is radiated. | 08-12-2010 |
| 20100214745 | HEAT SINK ANCHOR ASSEMBLED ON A PRINTED CIRCUIT BOARD - An anchor for attaching a heat sink to a PCB (printed circuit board) includes an elastic fastening member and a locking member. The fastening member includes a resilient link portion, a pair of legs extending from two opposite ends of the resilient link portion, a pair of projections extending inwardly from tip ends of the two legs and a pair of stop portions extending from the legs and spaced from the respective projection. The projections pass through a pair of through holes defined in the PCB respectively until each stop portion abutting against a top surface of PCB. The locking member defines at least one receiving hole. the locking member is mounted onto the fastening member to shift the two leg inward so that the projections abut against a bottom surface of the PCB. | 08-26-2010 |
| 20100232115 | ELECTRONIC CIRCUIT DEVICE - An electronic circuit device including a circuit board having electronic parts, and a flexible wiring board for connection between the circuit board and external equipment. The circuit board has circuit-side connection terminals juxtaposed on a mount surface having the electrical parts mounted thereon or a non-mount surface. The wiring board has terminals juxtaposed on one of the surfaces thereof so that the wiring-board-side connection terminals confront the circuit-side circuit board connection terminals, and free-end portions each formed so as to include at least one of the wiring-board-side connection terminals, and the wiring board free-end portions are not adhesively attached to the circuit board, and the circuit-side connection terminals are electrically connected to the corresponding wiring-board-side connection terminals while the circuit-side connection terminals confront the wiring-board-side connection terminals. | 09-16-2010 |
| 20100254093 | ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME - An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means. | 10-07-2010 |
| 20100259901 | HOUSING FOR ELECTRONIC BALLAST - An electronic housing assembly is formed with an environmental seal ( | 10-14-2010 |
| 20100259902 | HEAT DISSIPATION DEVICE HAVING A CLIP ASSEMBLY - A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board includes a heat sink, a wire clip and two operating members. The heat sink has a bottom for in contact with the electronic component. The wire clip includes a middle part spanning over the heat sink and two latching legs extending oppositely from two opposite ends of the middle part, respectively, the two latching legs being located in front of and in rear of the heat sink, respectively. Each operating member includes a plate cam placed on the heat sink and a handle extending laterally from the plate cam. The middle part of the wire clip extends through the plate cams and can be lifted away from the heat sink by turning the operating members from an unlocking state to a locking state. | 10-14-2010 |
| 20100271786 | HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink main body and a contact member attached to a base of the heat sink main body. The contact member includes a container with thermal grease contained therein and a movable cover movably attached to the container. The container includes a bottom plate configured to contact a heat generating component, and a plurality of holes defined in the bottom plate. When the heat sink is attached to the heat generating component, the movable cover is pressed towards the container and impels the thermal grease out from the holes to spread the thermal grease between the bottom plate of the container and the heat generating component. | 10-28-2010 |
| 20100290195 | Power Semiconductor Heatsinking - A heatsink includes a thermally conductive body including a plurality of fins configured to conduct and dissipate heat. The body is configured to receive a circuit board containing heat-producing electrical components along a width of the body. The heatsink further includes a pivot mechanism pivotally coupled to the body and configured and disposed to contact the heat-producing electrical components. The heatsink further includes a bias device connected to the body and the pivot mechanism and configured to change from a first state to a second state to cause the pivot mechanism to rotate relative to the body to move a contact portion of the pivot mechanism toward the body. The heatsink is configured to receive the heat-producing electrical components between the contact portion of the pivot mechanism and the body, and the bias device is configured to bias the contact portion of the pivot mechanism to urge the heat-producing electrical components against the body when the bias device is in the second state. | 11-18-2010 |
| 20100296255 | TWO-PIECE HEAT SINK STUD - A fastening system for a heat sink mounted on a circuit board utilizes a self-clinching stud assembly constructed by axially interfitting two flat sheet metal members. Each member has forked ends which when axially plugged together in criss-cross fashion create a unified fastener with side structures that can permanently clinch into a heat sink. After attachment to the heat sink, the stud presents two opposite attachment ends with tines which extend from the top and bottom of the heat sink. As finally assembled, a fan attaches to the top end of the studs above the heat sink while the opposite end of the stud which extends from the bottom of the heat sink passes through the circuit board to attach to a retaining leaf spring which presses against the back side of the board. Thus, all of the components are joined by a single stud. | 11-25-2010 |
| 20100321897 | COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES - According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies. In exemplary embodiments, thermal interface material is disposed on or along one side of a flexible thermally-conductive sheet. In other embodiments, a flexible thermally-conductive sheet is bonded to, encapsulated within, or sandwiched between first and second layers of a thermal interface material. The flexible thermally-conductive sheet may be a flexible perforated graphite sheet. The thermal interface material may be thermally-conductive polymer. The perforations in the graphite sheet may enable a polymer-to-polymer bond to form that may help mechanically bond the first and second layers to the graphite sheet and/or may help provide heat conduction between the first and second layers. | 12-23-2010 |
| 20110013366 | ELECTRONIC CIRCUIT BOARD WITH A THERMAL CAPACITOR - An electronic circuit board includes at least one conductor path and at least one component which is one of an electronic component, electric component and heat emitting component, and which is connected to the conductor path. At least one thermal capacitor is thermally connected to the conductor in vicinity to the at least one component. The at least one thermal capacitor is suitable for transmitting and/or buffering thermal energy of the at least one component. | 01-20-2011 |
| 20110032680 | HEAT SINK ASSEMBLY HAVING CLIP - A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotally engages with the linking portion and the heat sink. The handle connects the operating portion. The pressing portion connects the linking portion. A fastener mounted on the PCB extends through the heat sink and the pressing portion. The pressing portion is slidable from a first position to a second position. When the pressing portion is in the second position the handle is operable to drive the operating portion to move upwardly and urge the pressing portion to move along the fastener until the pressing portion abuts against a top portion of the fastener and simultaneously presses the heat sink. | 02-10-2011 |
| 20110038125 | FASTENER AND ELECTRONIC DEVICE HAVING THE SAME - A fastener comprises a fastener post, a clasping element and an elastic element. The fastener post comprises a head, a post body and a threaded portion. The post body has a first extension section connecting with the head, a second extension section connecting with the threaded portion and a recess section connected between the first and second extension sections. The clasping element comprises an annular clasping body, a first clasping portion axially extending from the clasping body and a second clasping portion extending outwardly and then downwardly from the clasping body. The clasping body encloses the post body, the first clasping portion engages with the recess section of the post body, and the second clasping portion engages with the heat sink. The elastic element is set around the post body and located between the head and the clasping body. | 02-17-2011 |
| 20110044008 | TOP ACTUATED, FORCE LIMITING HEATSINK RETENTION SYSTEM - Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module includes a handle pivotally secured to opposing sides of the heatsink body, and bails pivotally secured to the handle. In addition, the bails extend downward to dispose a lower bail member adjacent the spring loaded latches. As the handle pivots between a first position to raise the bails and a second position to lower the bails, the bails automatically move from a locked position to an unlocked position. Each of the spring loaded latches include a hook and at least one pre-loaded spring to transfer a minimum downforce to the lower bail members when the bails are raised. Accordingly, embodiments may be operated from the top of the heatsink without the use of tools, while providing a desired downforce over a range of heatsink heights. | 02-24-2011 |
| 20110044009 | Semiconductor device - An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board. | 02-24-2011 |
| 20110103023 | LOCKING DEVICE AND HEAT DISSIPATION DEVICE USING THE SAME - A heat dissipation device includes a heat sink and locking devices disposed on the heat sink. Each of the locking devices includes a shaft member and an elastic member circling the shaft member. The shaft member includes a body portion, a head portion formed at a top end of the body portion and a foot portion formed at a bottom end of the body portion. The foot portion includes a bucking part having two opposite ends thereof extending beyond the body portion and at least one positioning pole extending towards the head portion from a top surface of the bucking part. The bucking part is located below the heat sink and the elastic member is sandwiched between the head portion of the shaft member and the heat sink. | 05-05-2011 |
| 20110110048 | THERMAL INTERFACE MEMBERS FOR REMOVABLE ELECTRONIC DEVICES - In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of thermal interface member is deformable and thermally-conductive. | 05-12-2011 |
| 20110134610 | ELECTRONIC MODULE - An electronic module contains a printed circuit board having a conductor track structure and at least one receiving surface. The electronic module further contains at least one electronic component which is disposed on the at least one receiving surface and electrically connected to the conductor track structure. A coolant conducting structure is embodied in the printed circuit board and in which a cooling medium circulates during the operation of the electronic module. A section of the coolant conducting structure in the region of the at least one receiving surface being formed by a wall of the printed circuit board and a surface of the electronic component. | 06-09-2011 |
| 20110141699 | APPARATUS AND METHOD FOR ATTACHING SELECTED COMPONENTS TO A PRINTED CIRCUIT BOARD - Various embodiments of the present invention provide an anchor, circuit board assembly, and method for operably engaging an electronic component with a circuit board having a first side and a second side. Anchor embodiments include an anchor portion configured for receiving at least a portion of the electronic component and a pair of anchor legs flexibly extending from the ends of the anchor portion and configured for insertion into apertures defined in the circuit board. The anchor further includes a compression element slidably disposed about the anchor legs and movable between an unlocked position and a locked position. The compression element is configured for urging the anchor legs towards one another when moved from the unlocked position to the locked position such that the anchor is secured in the apertures when the compression element is in the locked position. | 06-16-2011 |
| 20110141700 | HEAT DISSIPATION APPARATUS - An exemplary heat dissipation apparatus includes a heat sink and fasteners mounting the heat sink on an electronic component on a circuit board. The heat sink includes a thermal conductive core, fins extending outwardly from the thermal conductive core and mounting plates extending outwardly from the thermal conductive core. A mounting arm extends outwardly from each of the mounting plates. The mounting arm defines receiving holes therein. Each fastener passes through a selected one of the receiving holes of a corresponding mounting arm. | 06-16-2011 |
| 20110149522 | ELECTRONIC CONTROL UNIT AND METHOD FOR PRODUCING COMPONENT OF SAME - An electronic control unit ( | 06-23-2011 |
| 20110176279 | ELECTROMAGNETIC INTERFERENCE SHIELD WITH INTEGRATED HEAT SINK - A printed circuit board (PCB) assembly is provided that includes a PCB, an integrated circuit package, an electromagnetic interference (EMI) shield ring, and a heat sink lid. A first surface of the package is mounted to a first surface of the PCB. The EMI shield ring is mounted to the first surface of the PCB in a ring around the package. A first surface of the heat sink lid includes a recessed region and first and second supporting portions separated by the recessed region. The heat sink lid is mated with the EMI shield ring such that the package is positioned in an enclosure formed by the EMI shield ring and the recessed region of the heat sink lid. A second surface of the package may interface with a surface of the recessed region. | 07-21-2011 |
| 20110194257 | FIXING DEVICE AND HEAT SINK ASSEMBLY USING THE SAME - A fixing device for fixing a first element to a second element is provided. The fixing device includes a main body including at least one leg, at least one biasing member movably mounted on the at least one leg for generating a compressive force. At least one hook member rotatably connected to an end of the at least one leg, cooperating with the biasing member to fix the first element to the second element. A heat sink assembly using the fixing device are also provided. | 08-11-2011 |
| 20110194258 | Thermal Management System For Electrical Components And Method Of Producing Same - A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member. | 08-11-2011 |
| 20110194259 | DEVICE FOR ELECTROMAGNETIC SHIELDING AND DISSIPATION OF HEAT RELEASED BY AN ELECTRONIC COMPONENT, AND CORRESPONDING ELECTRONIC CIRCUIT - A device is provided for electromagnetic shielding an electronic component and for dissipating heat generated by the component. The component includes a package designed to be fastened to a first face of a printed circuit, called a rear face, by a heat sink, the heat sink passing through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face. The device includes a metal structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure. The metal structure having a first heat discharge opening lying approximately opposite the heat sink. The device further includes at least one thermal connector, a first end of which is fastened to the metal structure and a second end of which is fastened to the heat sink and/or to the front face of the printed circuit near the heat sink. | 08-11-2011 |
| 20110199734 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a heat sink, and a fixing portion. The circuit board includes a heating component. The heat sink has a plate shape and faces the heating component. The fixing portion is attached to the heat sink and fixed to the circuit board at least at two points. | 08-18-2011 |
| 20110205711 | HEAT DISSIPATION FROM A CONTROL UNIT - A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described. | 08-25-2011 |
| 20110222246 | HEAT-DISSIPATING MODULE AND ELECTRONIC DEVICE USING SAME - A heat-dissipating module for use in an electric device includes a circuit board, at least one heat-generating element, and at least one heat-conducting element. The circuit board has a first surface, a second surface and at least one perforation. The heat-conducting element is disposed in the perforation. The heat-conducting element includes a base and a sidewall. The heat-generating element is disposed on the base or the sidewall of the heat-conducting element so that the heat by the heat-generating element is conducted to the second surface of the circuit board through the heat-conducting element. | 09-15-2011 |
| 20110228485 | COOLING STRUCTURE FOR ELECTRONIC EQUIPMENT - A cooling structure for electronic equipment includes a plurality of cooling structural members on a same substrate. In the cooling structural members, a plurality of heating components having a same shape are connected to one thermal diffusion part through a first thermal conductive member. Each of thermal diffusion parts of the plurality of cooling structural members is connected to one heat dissipator through a second thermal conductive member. | 09-22-2011 |
| 20110235280 | HEAT DISSIPATION APPARATUS AND ELECTRONIC ASSEMBLY WITH SAME - A heat dissipation apparatus includes a heat sink and fasteners. The heat sink defines a plurality of through holes therein. An inner thread is formed on an inner surface of each through hole. Each fastener includes a bolt and a spring around the bolt. The bolt includes a main post, a cap formed on a top of the main post, and a engaging portion formed on a bottom of the main post. A retaining thread is formed on an outer surface of the main post near the engaging portion. The retaining thread matches the inner thread of the through hole. The retaining thread of the main post is configured to pass through the through hole by threading the retaining thread though the inner thread of the through hole. After the retaining thread has passed through the through hole, the retaining thread abuts a bottom surface of the heat sink. | 09-29-2011 |
| 20110261537 | WEDGE LOCK FOR USE WITH A SINGLE BOARD COMPUTER, A SINGLE BOARD COMPUTER, AND METHOD OF ASSEMBLING A COMPUTER SYSTEM - A wedge lock for use with a single board computer includes a cooling plate positioned with respect to a printed circuit board (PCB), a clamp device configured to secure the single board computer in an operating environment, and a heat conductance plate positioned along a top surface of the cooling plate and a top surface of the clamp device to facilitate conduction cooling of the PCB. | 10-27-2011 |
| 20110267781 | CIRCUIT BOARD - A circuit board is provided with a plurality of arms and a heat radiation plate. The insulating substrate of the each of the arms includes: a passive element region to which a passive element is connected; an active element region to which an active element is connected; and a wiring region on which wiring lines of the element group are laid. In the each of the arms, the passive element region, the active element region and the wiring region align in a lengthwise direction of the insulating substrate, and the passive element region and the wiring region are arranged on both sides of the active element region which is located centrally. | 11-03-2011 |
| 20110273847 | ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYS - Alloy compositions and techniques for reducing IMC thickness and oxidation of metals and alloys are disclosed. In one particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy or mixture consisting essentially of from about 90% to about 99.999% by weight indium and from about 0.001% to about 10% by weight germanium and unavoidable impurities. In another particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy consisting essentially of from about 90% to about 99.999% by weight gallium and from about 0.001% to about 10% by weight germanium and unavoidable impurities. | 11-10-2011 |
| 20110273848 | CONTROL DEVICE - It is possible to provide a small-size and light-weight control device having a structure which prevents detaching of a board even when an external shock is applied without using a screwed connection. The control device is formed by a case including at least one board, a radiator, and a protection cover. The case includes at least one latch portion in an upper part or a lower part of a board support frame. | 11-10-2011 |
| 20110279981 | Heat Dissipating Assembly - A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit board. The heat generating element includes a heat conducting portion aligned with the through-hole. A heat dissipating unit includes a base having an engaging face in contact with the second face of the circuit board. A metal solder is filled in the through-hole. The metal solder is engaged with the engaging face of the base and the heat conducting portion of the heat generating element. The heat generating element is directly engaged with the heat dissipating unit by the metal solder to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs. | 11-17-2011 |
| 20110279982 | Display Device - A display device having a thinner shape and a uniform luminance includes a display panel that displays images. The display device has upper and lower peripheral regions. A printed circuit board (PCB) is positioned at the back of the display panel to control and drive the display panel and to provide power to the display panel. Thermal conductive sheets are attached to the back of the display panel. In the display device, each of the thermal conductive sheets includes a base film that is attached to the back of the display panel and is formed of an electrical insulating material. A power supply pattern is formed on the base film to provide power to the display panel. A ground pattern is formed to be spaced apart and electrically insulated from the power supply pattern. | 11-17-2011 |
| 20110292613 | LOCKING DEVICE AND METHOD FOR MAKING THE SAME - A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink; and an actuator coupled to at least one of the locking device substrates. The fluid-permeable member is disposed between the locking device substrates. The actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process. A method for making a locking device is also described. | 12-01-2011 |
| 20110292614 | Cooling Module Assembly Method - A cooling module assembly method comprises forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with metal solders; fixing at least one heat-generating element to another face of the circuit board, wherein the at least one heat-generating element aligns with and covers the at least one through-hole; and soldering the at least one heat-generating element and the heat dissipating unit together by melting the metal solders in the at least one through-hole. | 12-01-2011 |
| 20110299252 | EXPANSION CARD ASSEMBLY AND HEAT SINK THEREOF - An expansion card assembly includes an expansion card and a heat sink. The expansion card includes a board and an electronic component mounted on the board. The board has a component side on which the electronic component is mounted and an opposite solder side. The heat sink includes a U-shaped base. The base includes a heat absorbing plate, an opposite heat dissipation plate and a middle connecting plate. An end of the board adjacent to the electronic component is received in a receiving space of the base defined between the heat absorbing plate and the heat dissipation plate. The heat absorbing plate and the heat dissipation plate of the base are respectively located the component side and the solder side of the board to sandwich the end of the board therebetween. The heat absorbing plate is attached to the electronic component. | 12-08-2011 |
| 20110304992 | HEAT DISSIPATION DEVICE - A heat dissipation device is used to cool a storage device. The heat dissipation device includes a heat sink and two parallel conduction boards. The heat sink includes a base and a number of fins extending from a first side of the base. A guiding channel is defined between every two adjacent fins to guide airflow. The two conduction boards are attached to a second side of base opposite to the first side. A receiving space is defined between the two conduction boards for receiving the storage device therein. | 12-15-2011 |
| 20120002374 | ELECTRONIC CONTROL DEVICE - The electronic control device includes: a printed circuit board; a heat-generating member having a plurality of legs which are mounted on the printed circuit board by connections between the legs and the printed circuit board; and a casing which radiates heat that is transferred from the heat-generating member, wherein: the legs are connected via press-fit connections with the printed circuit board. | 01-05-2012 |
| 20120008284 | REPAIR APPARATUS AND METHOD FOR CIRCUIT BOARD ASSEMBLY - A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided. | 01-12-2012 |
| 20120014070 | CONTROL DEVICE - A circuit board unit of an ECU has an upper surface on which semiconductor elements are installed, a lower surface that is on the opposite side of the circuit board unit from the upper surface, and a cutout portion that is formed below the upper surface. A power module includes a conductive protruding and an electrically insulating main portion that holds the protruding piece. The conductive protruding piece is inserted in the cutout portion to support the circuit board unit, and is electrically connected to the semiconductor elements. | 01-19-2012 |
| 20120057305 | SEMICONDUCTOR UNIT - The semiconductor unit includes a wiring board, a conductor layer and a fin. The wiring board has across a thickness thereof a first surface and a second surface. The conductor layer is formed on the first surface of the wiring board. The conductor layer has a length and a width as viewed in the direction of the thickness of the wiring board. The fin is joined to the second surface of the wiring board. The fin has a bent edge that extends in the direction of the length of the conductor layer. | 03-08-2012 |
| 20120063097 | MONOLITHIC MICROWAVE INTEGRATED CIRCUIT - A monolithic microwave integrated circuit structure having a semiconductor substrate structure with a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface and a metal layer on an opposite surface overlaying the interconnection section and absent from overlaying at least one of the input section and the output section. | 03-15-2012 |
| 20120069526 | AUXILIARY DEVICE FOR CONDUCTIVELY REMOVING THE HEAT PRODUCED BY AN ELECTRONIC CARD - An auxiliary device for conductively removing the heat produced by one or more components on an electronic card includes a heat sink covering all or part of the card. The device includes at least a first heat-conducting element mounted to absorb the heat produced by the one or more components, a movable second heat-conducting element, a heat pipe connecting the first element with the second element, and clamping means designed to press the movable second element against a cold wall. | 03-22-2012 |
| 20120075808 | ELECTRONIC PACKAGE STRUCTURE - An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board. | 03-29-2012 |
| 20120087093 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a first heating element in the housing, a heat sink in the housing, a first pressing member, a first heat pipe, and a second heat pipe. The first heat pipe has a plate shape, includes a first portion facing the first heating element and a second portion being outside the first heating element. The first heat pipe is configured to be bent by the first pressing member. The second heat pipe is connected to the second portion of the first heat pipe and the heat sink. | 04-12-2012 |
| 20120087094 | Memory Modules Including Compliant Multilayered Thermally-Conductive Interface Assemblies - According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material. | 04-12-2012 |
| 20120099281 | DISPLAY APPARATUS - A display apparatus that facilitates shielding of electromagnetic waves and heat dissipation is disclosed. The display apparatus may include: i) a substrate, ii) a sealing member disposed to face the substrate, iii) a display unit disposed between the substrate and the sealing member, iv) a driving chip disposed on the substrate and transmitting an electric signal to the display unit and v) a circuit board including a signal line that is electrically connected to the driving chip, and a conductive cover layer disposed to cover the driving chip. In one embodiment, the circuit board includes a heat sink for dissipating heat generated by the driving chip. | 04-26-2012 |
| 20120106088 | THIN FASTENER OF HEAT SINK - The heat sink fastener includes a heat conductive board and a flexible metallic wire. The heat conductive board has a pair of pivot portions. The flexible metallic wire has a pair of flexible arms and a middle portion connecting therebetween. Each flexible arm connects to the pivot portion. The pivot portion side of the heat conductive board is formed with a blocking sheet. The middle portion is provided with a bend for being blocked by the blocking sheet. When the flexible metallic wire is hooked to a ring on a circuit board, it will generate pressure to the heat conductive board resulting from the bent flexible arms and the blocked middle portion. | 05-03-2012 |
| 20120120610 | SEMICONDUCTOR DEVICE - An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board. | 05-17-2012 |
| 20120134115 | ELECTRONIC DEVICE - An electric device with an insulating substrate consisting of an insulating layer and at least one metallization on a surface side of the insulating layer, the metallization being structured and having an electric component on the metallization. The metallization has a layer thickness that is stepped and is greater in an area adjoining the component. | 05-31-2012 |
| 20120147564 | AC photovoltaic module and inverter assembly - An AC photovoltaic module includes a DC photovoltaic module for converting solar energy to DC electrical power, and an inverter for converting DC electrical power to AC electrical power, the inverter being adapted for connection to a frame portion of the module and being sized and configured, and provided with arrangements of electrical components thereof, to dispense heat from the inverter, whereby to prolong operational life and reliability of the inverter. | 06-14-2012 |
| 20120147565 | HEAT DISSIPATION AND TEMPERATURE-HOMOGENIZING STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME - A heat dissipation and temperature-homogenizing structure which includes a body made of a material with low thermal conductivity and a heat conducting member made of a material with high thermal conductivity is disclosed. The body has opposite inner surfaces and outer surfaces. The heat conducting member is embedded inside the body and is completely surrounded between the inner surfaces and the outer surfaces. When the electronic device generates heat, the heat is firstly transferred to the heat conducting member from the inner surfaces, and then rapidly and evenly spreads over the heat conducting member. Finally, the heat inside the heat conducting member is uniformly dissipated through the outer surfaces. Accordingly, the heat dissipation and temperature-homogenizing structure may effectively and evenly spread the heat over the outer surfaces for exchanging heat with the ambient. | 06-14-2012 |
| 20120170224 | CIRCUIT BOARD FRAME WITH INTEGRAL HEAT SINK FOR ENHANCED THERMAL TRANSFER - A circuit board frame and a circuit board assembly that includes the circuit board frame includes a first region designed for receiving a circuit board, and a second region contiguous with the first region and including a heat sink. The circuit board frame and circuit board assembly are designed and fabricated so that the first region is located inside a circuit board chassis and the heat sink is located outside the circuit board chassis when the circuit board frame or the circuit board assembly is assembled into the circuit board chassis by insertion into at least one slot within a sidewall of the circuit board chassis. The at least one slot within the sidewall of the circuit board chassis may have straight sidewalls, or alternatively tapered sidewalls that may ease insertion and assembly of the circuit board frame or circuit board assembly into the circuit board chassis. Protrusion of the heat sink, which is contiguous with the first region, through the circuit board chassis sidewall improves thermal transfer efficiency from a circuit board to the heat sink in-part via reduction of thermal transfer inhibiting interfaces. | 07-05-2012 |
| 20120170225 | ELECTRONIC SYSTEM AND HEAT DISSIPATION DEVICE THEREOF - An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The printed circuit board is secured on a casing of an electronic system. The heat dissipation device includes a heat sink disposed on the electronic component; and a plurality of fasteners extending through the heat sink, respectively, to assemble the heat sink to the printed circuit board. Each of the fasteners includes a supporting member fixed in the printed circuit board, an engaging member fixed in the board, and a screwing post engaging with the heat sink. A bottom portion of the screwing post extends through the printed circuit board via the supporting member, and is screwed into the engaging member. | 07-05-2012 |
| 20120188722 | HEAT SINK ASSEMBLY - A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance. | 07-26-2012 |
| 20120188723 | HEAT DISSIPATION ASSEMBLY AND ELECTRONIC DEVICE WITH SAME - A heat dissipation assembly comprises a heat conducting plate, a fixing assembly for securing the heat conducting plate on an electronic module, a back plate opposite to the heat conducting plate. The fixing assembly comprises a bolt, an elastic element coiled around the bolt, and a nut. The heat conducting plate defines a through hole thereon, and a flange is defined at one end of the bolt and received in the nut. The nut is sandwiched between the heat conducting plate and the back plate and is made of elastically plastic. The back plate comprises a hollow fixed leg defined thereon correspond to the through hole of the heat conducting plate. Two ends of the nut are respectively attached to the heat conducting plate and the electronic module by tension from the elastic element. | 07-26-2012 |
| 20120188724 | DISPLAY AND ELECTRONIC UNIT - A display capable of inhibiting deformation of a component during transport or the like and an electronic unit including the display are provided. A display includes: a main section; and a board-mounting plate disposed on one surface of the main section, and having a board-mounting region on a main surface on a side opposite to a side facing the main section, in which the board-mounting plate includes, at corners at both ends of a side of the mounting region, hook sections allowing corners of a board to be hooked thereto, and the hook sections each are fixed to the main surface on two sides of the corner of the mounting region. | 07-26-2012 |
| 20120195007 | SOLENOID CONTROL APPRATUS - A solenoid control apparatus includes a resin housing having a solenoid mounting portion, a connector portion, and a circuit board mounting portion in which a circuit board is mounted. Terminals extending from the solenoid mounting portion and the connector portion are soldered to the electrical circuit on the circuit board. The circuit board has a reduced-rigidity portion in its area corresponding to a portion of the resin housing through which the connector portion is connected to the solenoid mounting portion. The reduced-rigidity portion is formed by reducing the amount of material forming the circuit board per unit area, and is more easily deformable than the remaining portion of the circuit board. When the connector portion is thermally deformed, the circuit board is also easily deformable about the reduced-rigidity portion. This reduces stress on the soldered portions. | 08-02-2012 |
| 20120201008 | CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES - A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module. | 08-09-2012 |
| 20120224329 | PORTABLE ELECTRONIC DEVICE WITH ENHANCED HEAT DISSIPATION - A portable electronic device includes a circuit board, a heat sink a hinge and a heat dissipating plate. The circuit board is equipped with a heat generating component. The heat sink is for dissipating heat generated by the heat generating component. The heat dissipating plate is pivotably connected to the heat sink by the hinge for helping with the heat dissipation of the heat sink. | 09-06-2012 |
| 20120229986 | POWER CONVERSION SYSTEM USING FERROMAGNETIC ENCLOSURE WITH EMBEDDED WINDING TO SERVE AS MAGNETIC COMPONENT - Unique construction methods enabling footprint and volume reduction of a power conversion system are disclosed. The embodiments of the invention allow high power densities to be achieved. The novelty of this invention is the use of a ferromagnetic enclosure as a multi-function component serving the following purposes: a) The ferromagnetic enclosure functions as the enclosure for the power converter, b) The ferromagnetic enclosure incorporates various embedded electrical winding structures, allowing it to function as one or more magnetic energy storage or magnetic coupling devices for the power converter circuit, c) The ferromagnetic enclosure allows thin, low profile magnetic storage or coupling devices to be implemented, d) The ferromagnetic enclosure functions as a thermal management device to guide heat from the power converter away from the PCB or substrate. | 09-13-2012 |
| 20120250260 | MEDIA CONTENT DEVICE WITH CUSTOMIZED PANEL - A media device, which may take the form of a set top box (STB), includes a housing or chassis that incorporates an interface panel having selectively configured regions that cooperate with components mounted on a printed circuit board. The selectively configured regions of the interface panel may advantageously provide desired clearance or contact between the interface panel and one or more of the components. In addition, the selectively configured regions of the interface panel may be arranged to provide structural support to a top panel of the chassis while providing specific heat transfer pathways between the components and the chassis. In this manner, the interface panel may be controllably designed with a desired thermal mass and/or a desired thermal conductivity in specific regions of the interface panel by varying properties of the interface panel which may include, but are not limited to, the panel thickness and material. | 10-04-2012 |
| 20120257356 | MOTHERBOARD - A motherboard includes a circuit board, a plurality of electronic components, a metal cover and a flexible heat-conducting component. The electronic components are disposed at the circuit board. The metal cover covers the circuit board. The flexible heat-conducting component is disposed between the circuit board and the metal cover and contacts the electronic components and the metal cover. | 10-11-2012 |
| 20120268896 | METAL CORE PRINTED CIRCUIT BOARD AND ELECTRONIC PACKAGE STRUCTURE - An electronic package structure is provided which comprises a metal core PCB, an energy storage device and at least one electronic component. The at least one electronic component is disposed between the metal core PCB and the energy storage device. The metal core PCB defines at least a through hole. A thermal passage is disposed in the through hole. An insulating layer is disposed in the through hole and located between the metal layer of the metal core PCB and the thermal passage to prevent the electric coupling between the thermal passage and the metal layer. The energy storage device comprises at least a connecting pin in thermal contact with the thermal passage. | 10-25-2012 |
| 20120275116 | HEAT RADIATING SUBSTRATE - Disclosed herein is a heat radiating substrate employed in an LED package. The heat radiating substrate includes a printed circuit board made of a metal material, and having a light emitting device mounted on an upper surface thereof; a heat radiating plate provided on a lower surface of the printed circuit board to receive the heat conducted from the light emitting device to the printed circuit board and radiate the heat to the outside; and a heat radiating layer formed on a lateral surface of the printed circuit board to radiate the heat conducted to the printed circuit board to the outside through the lateral surface of the printed circuit board. | 11-01-2012 |
| 20120275117 | APPARATUS AND METHOD FOR EMBEDDING COMPONENTS IN SMALL-FORM-FACTOR, SYSTEM-ON-PACKAGES - According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including: a first layer having a first conformable material; a second layer having a second conformable material; a third layer having a third material; and one or more electronic components embedded within the stack of layers, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing. | 11-01-2012 |
| 20120281365 | THERMAL INTERFACE MEMBERS FOR REMOVABLE ELECTRONIC DEVICES - In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of the thermal interface member is deformable and thermally-conductive. | 11-08-2012 |
| 20120287579 | Board-Level Package With Tuned Mass Damping Structure - A board-level package includes a printed circuit board, a semiconductor die package mounted on the printed circuit board, a tuned mass structure, and a support structure mounted to the printed circuit board and supporting the tuned mass structure. | 11-15-2012 |
| 20120287580 | HEAT SINKING DEVICE, NOTABLY FOR VERTICAL COMPONENTS AND/OR COMPONENTS OF COMPLEX FORM - A heat sinking device for a component mounted on an electronic circuit board, including: a hollow body, of straight cylindrical or prismatic form, including a first material, arranged vertically on top of the electronic circuit board, the useful volume of the body including at least the component, a resin including a second material, at least partially filling the internal volume of the body so as to contain the component. The heat sinking device can be arranged on an insulating separator element, the resin can be introduced in the liquid state. | 11-15-2012 |
| 20120287581 | Circuit Board Having a Plurality of Circuit Board Layers Arranged One Over the Other Having Bare Die Mounting for Use as a Gearbox Controller - The invention relates to a circuit board ( | 11-15-2012 |
| 20120293963 | SYSTEMS FOR CIRCUIT BOARD HEAT TRANSFER AND METHOD OF ASSEMBLING SAME - A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the PCB and the heatframe, and at least one thermal via extending through the PCB and coupled to the TIM, wherein the assembly is configured to transfer heat from the PCB to the chassis through the TIM and the at least one thermal via. | 11-22-2012 |
| 20120300408 | HEAT-DISSIPATION DEVICE AND ELECRTONIC DEVICE THEREON - A heat dissipation device is used for a circuit board, and plural electronic components are mounted on a surface of the circuit board. The heat dissipation device includes a heat dissipation plate that is made of metal. Once the heat dissipation plate shields above a surface of the circuit board, a distance exists between the heat dissipation plate and the surface so as to form an air flow passage to increase the heat dissipation performance. | 11-29-2012 |
| 20120307455 | MINIATURE MULTILAYER RADIATIVE COOLING CASE WTIH HIDDEN QUICK RELEASE SNAPS - A passive cooling arrangement for an electronic housing assembly is disclosed which comprises a frame disposed in the housing assembly; a circuit board supported in the frame; a heat generating component disposed on the circuit board; and a heat sink configured with a substantially flat peripheral portion and a depression portion, the substantially flat peripheral portion facing and being nearly coextensive with an outer wall of said housing assembly, and the depression portion being in thermal engagement with the heat generating component on the circuit board, whereby heat generated by the heat generating component can be passively thermally conducted through the depression portion and into the substantially flat peripheral portion of the heat sink, and thereafter dissipated in a generally uniform manner through the outer wall of the housing assembly. The frame comprises a base with embosses which support the circuit board in a position enabling the thermal engagement of the heat generating component and the depression portion of the heat sink. The outer wall of the housing assembly is preferably unvented and the housing assembly is preferably oriented in use with the outer wall facing upwardly. | 12-06-2012 |
| 20120314374 | HEAT DISSIPATING HIGH POWER SYSTEMS - An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components. | 12-13-2012 |
| 20120314375 | HEAT RELEASE DEVICE - A heat release device is for use with a multilayer board that has an inner layer serving as a power layer. The heat release device includes a heat release member thermally and electrically connected to the power layer, and a heat release board having a heat release layer and a shield layer electrically insulated from each other. The heat release layer is thermally and electrically connected to the heat release member. The shield layer serves to shield against electromagnetic noise radiated from the heat release layer. The shield layer is electrically insulated from the heat release member connected to the heat release layer. The heat release device also includes an electrically conductive member electrically connected to the shield layer and grounded, and an insulator through which the heat release layer is thermally connected to the electrically conductive member. | 12-13-2012 |
| 20120320531 | BOARD HOUSING CASE FOR VEHICLE-MOUNTED ELECTRONIC DEVICE - A circuit board is hermetically-sealed and housed in a steel case that is composed of a metal base and a metal cover, the cover disposed opposite to a first board surface has a tall flat portion disposed opposite to a connector housing and a short flat portion disposed opposite to a heating component, and the heat generated from the heating component is directly transferred to a heat transfer base portion of the base via a heat transfer mechanism and a heat transfer filling material. Surface finishing in which the coefficients of heat radiation are mutually 0.7 to 1.0 is applied to the surface of the heating component and the opposite inner surface of the cover, and radiation and heat transfer are efficiently performed to the short flat portion of the cover. | 12-20-2012 |
| 20120320532 | Flexible circuit assembly and method thereof - An embedded device | 12-20-2012 |
| 20120327606 | WIRE CLIP AND HEAT SINK ASSEMBLY USING THE SAME - A heat sink clip for fastening a heat sink on a printed circuit board (PCB) includes a wire clip and two hooks. The wire clip can be deformed in assembly to make the hooks extend through two locking slots of the PCB to lock to a second side of the PCB, the clip functions as a lever, a clip, and a latch. | 12-27-2012 |
| 20130003315 | HEAT DISSIPATER AND PRINTED CIRCUIT BOARD MODULE - A heat dissipater and a printed circuit board module using the heat dissipater are disclosed. The heat dissipater includes at least two electrode plates and a number of rotatable charged particles between the at least two electrode plates. The at least two electrode plates are respectively connected to a positive terminal and a negative terminal of a variable power supply, and generating an alternating electric field therebetween. Each of the plurality of charged particles is made of thermal conductive material and includes a positive portion and a negative portion coupled to the positive portion. | 01-03-2013 |
| 20130003316 | Card Lock Retainer For Pluggable Conduction Cooled Circuit Card Assemblies - A system is disclosed for releasably locking a circuit card assembly to a cold plate of a chassis. The system includes a locking mechanism having a base and a locking wedge. The base and locking wedge have triangular cross-sections, and mate with each other along respective diagonal surfaces of the base and locking wedge. The locking wedge is mounted to the base such that axial movement of the locking wedge relative to the base also results in sliding of the locking wedge up the diagonal surface of the base to increase the overall height of the base and locking wedge together. | 01-03-2013 |
| 20130010429 | METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND POWER MODULE - A method for producing a substrate for a power module with a heat sink includes a heat sink bonding step for bonding a heat sink to the surface of a second metal plate. The heat sink bonding step includes: a Cu layer forming step for forming a Cu layer on at least one of the surface of the second metal plate and a bonding surface of the heat sink; a heat sink laminating step for laminating the second metal plate and the heat sink via the Cu layer; a heat sink heating step for pressing in the lamination direction and heating the second metal plate and the heat sink, to diffuse Cu in the Cu layer into the second metal plate and the heat sink; and a molten metal solidifying step for solidifying the molten metal formed with Cu diffusion, to bond the second metal plate and the heat sink. | 01-10-2013 |
| 20130016480 | PRINTED CIRCUIT BOARD HAVING HEAT GATHERING STRUCTURES AND MANUFACTURING PROCESS THEREOFAANM SUN; Wen-JiAACI ShanghaiAACO CNAAGP SUN; Wen-Ji Shanghai CN - A printed circuit board (PCB) having heat gathering structures is used for enabling electronic components with pins to be inserted thereon. The PCB includes a base, at least one insertion hole, and at least one heat gathering hole. The base has a first surface and a second surface. The insertion hole penetrates the base, and the base has soldering pad on the periphery of the insertion hole. A first electric conducting layer is disposed on the inner wall of each insertion hole. The heat gathering hole penetrates the base. A second electric conducting layer is disposed on the inner wall of each heat gathering hole. The temperature of the insert holes will be increased for improving soldering process. A manufacturing process of the PCB having heat gathering structures is also disclosed. | 01-17-2013 |
| 20130027889 | COOLING DEVICE INSTALLATION USING A RETAINER ASSEMBLY - A system includes a retainer assembly to align each of a group of cooling devices with a corresponding electrical component of a group of electrical components that are mounted to a circuit board, where the retainer assembly includes a group of apertures, such that each of the cooling devices protrudes through a corresponding aperture when the retainer assembly is installed on the circuit board, and where the retainer assembly includes a group of retaining springs, each of which is associated with a corresponding aperture, that applies a respective force, of a group of forces, to a corresponding one of the cooling devices when the retainer assembly is installed on the circuit board. The system also includes a set of fasteners to mount the retainer assembly to the circuit board, such that the cooling devices dissipate heat that is generated by the electrical components. | 01-31-2013 |
| 20130039013 | FILM SYSTEM FOR LED APPLICATIONS - The present invention relates to a composite assembly of plastic ( | 02-14-2013 |
| 20130044435 | SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM IN PACKAGE - System in package including a substrate having a first external layer including a first conductive patterned layer and being externally accessible for electrically connecting the system in package to an external electric circuit and a second internal layer including a second conductive patterned layer and being covered by the first layer and electronic devices provided on the substrate and electrically connected to external contact pads of the first conductive patterned layer. The devices and the first and second conductive patterned layer being electrically connected to form an internal electric circuit electronically connected to the external electric circuit, the first and the second layer being adjacently positioned, the electronic devices being enclosed in an overmould compound. At least one of the devices is electrically connected to at least one hidden contact pad of the second conductive patterned layer which is accessible after removal of a removable strip of the first layer. | 02-21-2013 |
| 20130044436 | Device for Screening an Electronic Module - A device for screening an electronic module which has electronic components fixed to a printed circuit board and which is connected to a heat sink. The heat sink comprises an electrically conductive material. The printed circuit board has at least one layer composed of electrically conductive material. The heat sink and the printed circuit board serve as screening elements. | 02-21-2013 |
| 20130050950 | SYSTEMS AND METHOD FOR PROVIDING A GRAPHITE LAYER IN AN ELECTRONIC DEVICE - Systems and methods are provided for a sheet of graphite material on an electromagnetic interference shield for enhanced heat transfer. An electronic device component may be enclosed by an EMI shield, which may retain heat generated by the component. To help dissipate heat, a sheet of material selected for its heat transfer properties may be disposed over the EMI shield. A portion of the sheet may be folded over an edge of the EMI shield such that the sheet may cover a top surface of the sheet as well as tabs extending perpendicular to the top surface of the EMI shield. To facilitate the adhesion of the sheet to a smaller surface area of tabs, the sheet may include features forming a discontinuity in regions of the sheet aligned with the edge of the shield to facilitate folding the sheet. The discontinuity can include, for example, one or more holes or windows. | 02-28-2013 |
| 20130050951 | AIR DUCT - An air duct for guiding airflow of a fan includes a cover and an auxiliary plate. The cover includes a base plate, and a first side plate and a second side plate extending from a first side surface of the base plate. The auxiliary plate is slidably attached to the first side surface of the base plate between the first side plate and the second side plate, in a direction substantially parallel to the first and second side plates. | 02-28-2013 |
| 20130050952 | ELECTRICAL EQUIPMENT CASING - An electrical equipment casing includes a circuit board on which many electrical parts are mounted and a heat sink to which the circuit board is fixed. The heat sink is provided with a reactor housing dent that opens in a surface on which the circuit board is placed and radiator fins that reach a bottom portion of the reactor housing dent on a surface opposite to the surface on which the circuit board is placed at a position surrounding an outer circumference of the reactor housing dent. The reactor is housed in the reactor housing dent and a terminal thereof is electrically connected to the circuit board. This structure of the electrical equipment casing can contribute to an achievement of both of a size reduction of the overall casing and enhanced heat dissipation of the reactor. | 02-28-2013 |
| 20130050953 | ELECTRONIC DEVICE AND METHOD OF RADIATING HEAT FROM ELECTRONIC DEVICE - An electronic device including a housing including a frame member exposed to an outer surface of the electronic device; a circuit substrate disposed within the housing on which a plurality of electronic components are disposed; and a heat-radiating member provided in contact with or in close proximity to the electronic components disposed on the circuit substrate, and in contact with the frame member. | 02-28-2013 |
| 20130050954 | Thermal Management System and Method - A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermal conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired. | 02-28-2013 |
| 20130058046 | PRINTED CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF - A printed circuit board assembly and a manufacturing method thereof are provided. The method includes mounting an electrical component on a printed circuit board; depositing a curable gel on the electrical component by discharging the curable gel through a nozzle; and hardening the curable gel deposited on the electrical component to form a heat radiation member. | 03-07-2013 |
| 20130077257 | ELECTRONIC DEVICE AND IMAGE SENSOR HEAT DISSIPATION STRUCTURE - An electronic device including a main board, an image sensor heat dissipation structure and a lens module is provided. The image sensor heat dissipation structure includes a heat dissipation plate, a thermal interface layer, an image sensor package and a cover glass. The heat dissipation plate is fixed to the main board. The thermal interface layer is disposed on the heat dissipation plate. The image sensor package including a circuit board, a plurality of pads, an image sensor and an encapsulant is fixed to the thermal interface layer. The circuit board has an opening. The image sensor is electrically connected to the circuit board through the pads, wherein the light receiving surface faces the opening and the back surface faces the thermal interface layer. | 03-28-2013 |
| 20130083490 | ELECTRONIC SYSTEM FOR WAVE SOLDERING - An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for mounting to the board includes insulating windows that define gluing sites within one or more pins. An electronic system is formed by one or more of such surface mount technology electronic devices mounted to electronic board. The devices are attached using a wave soldering technique that flows through channels formed by the sunken conductive traces. | 04-04-2013 |
| 20130094152 | ELECTRONIC DEVICE AND HEAT SINK EMPLOYING THE SAME - A heat sink is used to cool electronic components, and includes a metal base portion, a motherboard and a heat conducting sheet. The motherboard and the heat conducting sheet are positioned on the metal base portion. The motherboard includes a copper foil. The electronic components are electrically connected on the copper foil; the heat conducting sheet is positioned between the metal base portion and the motherboard, and contacts the metal base portion and the motherboard. The heat of the electronic components is conducted to the metal base portion through the copper foil, the motherboard and the heat conducting sheet. | 04-18-2013 |
| 20130120940 | HOUSING FOR A CHIP ARRANGEMENT AND A METHOD FOR FORMING A HOUSING - A housing for a chip arrangement is provided, the housing including: a carrier including a first carrier side configured to receive a chip arrangement, a second carrier side and one or more through-holes extending from the first carrier side to the second carrier side; at least one electrical connector inserted through a through-hole, the at least one electrical connector arranged to extend from the second carrier side to the first carrier side; wherein the at least one electrical connector may include: a first portion on the first carrier side; a second portion on the first carrier side, wherein the first portion is configured to extend away from the first carrier side at an angle to the second portion; and a third portion on the second carrier side, wherein the third portion is configured to extend away from the second carrier side at an angle to the second portion. | 05-16-2013 |
| 20130135825 | FIXING DEVICE AND THERMAL MODULE INCORPORATING THE SAME - An exemplary fixing device is for mounting a heat conduction plate to two electronic components. The fixing device includes a first mounting clip and a second mounting clip connected to the first mounting clip through arms. The first mounting clip includes a pressing plate pressing a first contacting portion of the heat conduction plate against one electronic component. The second mounting clip includes two pressing tabs pressing a second contacting portion of the heat conduction plate against the other electronic component. The pressing plate and the two pressing tabs are made of a single monolithic piece of material. | 05-30-2013 |
| 20130141873 | Method of Cooling Electronic Circuit Boards Using Surface Mounted Devices - The invention relates to a method of cooling electronic circuit boards using surface mounted devices (SMD), the method comprising the steps of: after or during the board layout, filling empty spaces V1, V2, V3, V4, V5, V6, V7, V8, V9, V10 with at a number of heat sink devices 1, 2, 3, 4, 5 near a thermal hot spot and connecting the number of heat sink devices 1, 2, 3, 4, 5 to a thermally conducting path 25, 27, 29, 31, 33, 35 of the board N, respectively. Further, the invention relates to a heat sink device 1, 2, 3, 4, 5 adapted to implement the method according to the invention. | 06-06-2013 |
| 20130148306 | LOAD DISTRIBUTED HEAT SINK SYSTEM - The invention provides a load distributed heat sink system for securing a heat sink to a heat-generating electronic component while distributing the load on the circuit board. Provided is a heat sink system having heat sink, a heat sink clip, and a circuit board. The heat sink is generally disposed on one side of the circuit board over a component, and the heat sink clip is generally disposed on the opposing side of the circuit board. The ends of heat sink clip reach to the other side and attach onto the heat sink on. The heat sink clip further includes a load spreader, which is urged onto the circuit board by the heat sink clip, both retaining the heat sink system in place and distributing load on the circuit board. | 06-13-2013 |
| 20130148307 | METHOD FOR PRODUCING AND ELECTRICAL CIRCUIT AND ELECTRICAL CIRCUIT - The invention relates to a method for producing an electrical circuit. A prefabricated substrate is provided, said substrate having a first and a second conductor layer and having a dielectric between the first and the second conductor layers. According to the invention, the first conductor layer is multiple times thicker than the second conductor layer. At least one component to be cooled is mounted on the first conductor layer of the prefabricated substrate, forming a heat-transferring connection between the component and the first conductor layer. The invention further relates to an electrical circuit produced in said manner. According to the invention, the electrical circuit comprises a prefabricated substrate which is produced having a first and a second conductor layer and a dielectric located therebetween. According to the invention, the first conductor layer is multiple times thicker than the second conductor layer. At least one component to be cooled is mounted on the first conductor layer. According to the invention, there is a heat-transferring connection between the component and the first conductor layer. | 06-13-2013 |
| 20130155622 | ELECTRONIC DEVICE WITH HEAT DISSIPATION APPARATUS - A heat dissipation apparatus for an electronic component mounted in a casing of an electronic device includes a first heat sink attached to the component, a second heat sink located outside the casing, and a heat pipe connected between the first heat sink and the second heat sink. The heat pipe contacts the casing. | 06-20-2013 |
| 20130155623 | HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink, two first fixing structures, and two second fixing structures. The heat sink includes a base. The base includes two opposite sidewalls each forming a fixing portion. When the heat sink is mounted to a first motherboard, the first fixing structures are respectively and detachably connected to the fixing portions of the heat sink, and fix the heat sink to the first motherboard. When the heat sink is mounted to a second motherboard, the second fixing structures are detachably connected to fixing portions of the heat sink, and fix the heat sink to the second motherboard. | 06-20-2013 |
| 20130155624 | HEAT DISSIPATION STRUCTURE - A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board. | 06-20-2013 |
| 20130155625 | HEAT DISSIPATION SYSTEM WITH DIMM BAFFLE - A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots. | 06-20-2013 |
| 20130163207 | HEAT SINK - A heat sink for mounting to any circuit board with locating holes is provided. The heat sink includes a main body attached on the circuit board, a number of fixing arms each defining a number of mounting holes, and a number of connecting members allowing a fixing arm to pivot about the connecting member. The fixing arms can make use of locating holes in different locations in different circuit boards for attaching the heat sink to any circuit board. | 06-27-2013 |
| 20130176684 | Printed Circuit Board Cover - A sheet metal cover for a printed circuit board (PCB) includes a plurality of legs continuous with a substantially planar elevated section. The legs are attached to the PCB, and electrical connections are provided between the legs and an internal ground plane of the PCB at the attachment locations. The sheet metal cover is thereby grounded, inhibiting the transmission of electromagnetic signals through the sheet metal cover. The elevated section of the sheet metal cover prevents select electronic devices on the PCB from being viewed or probed. Openings through the sheet metal cover allow heat sinks or heat generating electronic devices (e.g., inductors) to be exposed through these openings, thereby facilitating cooling of these elements by airflow. An electrically conductive gasket attached to the underside of the elevated section may contact the heat sinks, further minimizing the radiation of EMI emissions. | 07-11-2013 |
| 20130194753 | GUIDE RAIL SYSTEM AND A METHOD FOR PROVIDING HIGH-DENSITY MOUNTING OF OPTICAL COMMUNICATIONS MODULES - A guide rail system is provided that allows multiple optical communications modules to be mounted in close proximity to one another on a host circuit board. A first portion of the guide rail system is secured to a bottom surface of the host circuit board at locations on the bottom surface of the circuit board adjacent an opening formed in the circuit board. A second portion of the guide rail system is disposed on bottom surfaces of the optical communications modules. The first portion includes one or more pairs of rails and the second portion includes one or more guide blocks configured to slidingly engage the rails. The opening formed in the circuit board allows the rails to be accessed and also allows heat from the module to be dissipated down into the first portion and then into a heat dissipation structure secured to the first portion. | 08-01-2013 |
| 20130194754 | TRANSMISSION LINE TRANSITION HAVING VERTICAL STRUCTURE AND SINGLE CHIP PACKAGE USING LAND GRIP ARRAY COUPLING - An apparatus for a single chip package using Land Grid Array (LGA) coupling is provided. The apparatus includes a multi-layer substrate, at least one integrated circuit chip, and a Printed Circuit Board (PCB). The a multi-layer substrate has at least one substrate layer, has at least one first chip region and at least one second chip region in a lowermost substrate layer, configures a transmission line transition of a vertical structure for transmitting a signal from at least one integrated circuit chip coupled in the first chip region in a coaxial shape or in a form of a Co-Planar Waveguide guide (CPW), and has an LGP coupling pad for connecting with a Printed Circuit Board (PCB) in the lowermost layer. The at least one integrated circuit chip is coupled in the first chip region and the second chip region. The PCB is connected with the multi-layer substrate using the LGA coupling via the LGA coupling pad. | 08-01-2013 |
| 20130201630 | ELECTRONIC DEVIEC HAVING HEAT DISSIPATION DEVICE - An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate. | 08-08-2013 |
| 20130208427 | GROUNDING MECHANISM FOR HEAT SINK ASSEMBLY - A ground mechanism for a heat sink is attached to a circuit board. The ground mechanism includes a first latching member, a second latching member, a conductive member, and an elastic member. The first latching member and a second latching member latch the heat sink on the circuit board. The conductive member is formed on the circuit board. The elastic member is sandwiched between the first latching member and the heat sink. The elastic member electrically connects the first latching member to the heat sink, and the second latching member electrically connect the first latching member to the conductive member to conduct electromagnetic charges from the heat sink to a grounding pin of the circuit board. | 08-15-2013 |
| 20130208428 | Integrated Direct Couple Heat Sink and Shock/Vibration Protection - The rear cover of an electronics device is made up of two sections including an external heat sink and a rear cover frame. The electronics for the computing device are directly coupled to the heat sink section. The two sections are fastened together with a layer of cushioning material to simultaneously provide shock-vibration protection as well as efficient cooling of the electronics. | 08-15-2013 |
| 20130235531 | ELECTRONIC COMPONENT BOARD AND PRODUCTION METHOD OF THE SAME - An electronic component board is made by attaching bus bars to an insulating plate, and by electrically connecting electronic components to the bus bars. In the electronic component board, heat radiating portions integrally formed with specific bus bars are provided along an outer periphery of the insulating plate. A width of a portion extended parallel to the outer periphery of the insulating plate of the heat radiating portion is constant. The electronic component board | 09-12-2013 |
| 20130250523 | HEAT DISSIPATING ASSEMBLY AND ELASTIC FASTENING MEMBER THEREOF - A heat dissipating assembly which releases heat produced by an electronic device comprising a heat dissipating device and a plurality of elastic fastening members. The heat dissipating assembly includes a base plate having a plurality of engaging holes formed thereon. Each elastic fastening member includes a connecting member and a spring. The connecting member has a head portion and a bolt body that extends therefrom. The bolt body has an outer thread formed on the surface thereof and is being insertable into the respective engaging hole. The spring includes a winding portion woundable around the outer periphery of the bolt body, a clutching portion outwardly extended and downwardly bent from the bottom end of the winding portion to the base surface of the base plate, and a fastening segment extending from the clutching portion back under the winding portion. The instant disclosure further provides an elastic fastening member. | 09-26-2013 |
| 20130265725 | STORAGE ENCLOSURE AND A METHOD OF ACCESSING COMPONENTS WITHIN A STORAGE ENCLOSURE - The invention provides storage enclosure, comprising an enclosure housing; one or more drawers slidably arranged within the enclosure housing, wherein each drawer has a pivotably mounted midplane having storage media coupled thereto wherein the storage media are coupled to both sides of the pivotably mounted midplane. | 10-10-2013 |
| 20130286596 | ELECTRONIC DEVICE WITH MECHANISM FOR SECURING CONNECTOR THEREOF - An electronic device includes a circuit board, a connector fixed on the circuit board, and a heat sink mounted on the circuit board. The heat sink includes a securing portion. The securing portion defines a first cutout, a second cutout, and an arm located between the first and second cutouts. The arm resiliently urges the connector against the circuit board so as to firmly hold the connector between the heat sink and the circuit board. | 10-31-2013 |
| 20130286597 | WATERPROOF CONTROLLER USED FOR ELECTRIC POWER STEERING - A waterproof controller used for electric power steering includes a shell, a chamber, at least one sealing block, a circuit board, at least one cable, and at least one board mounting accessory. The chamber is formed in the shell. The sealing block is disposed on the shell, and includes at least one hole. The circuit board is accommodated in the chamber. The cable includes a first terminal and a second terminal opposite to the first terminal. The first terminal passes through the hole of the sealing block. The board mounting accessory covers the second terminal, in which the board mounting accessory and the second terminal insert into the circuit board together. | 10-31-2013 |
| 20130286598 | ELECTRICAL APPARATUS AND METHOD FOR PRODUCING ELECTRICAL APPARATUS - Regarding an electrical apparatus, in an opposing part facing a board, the opposing part being on a surface of in a heat dissipator, a contact part which is brought into contact with a first region of a second main surface corresponding to an electrical component and a surrounding region of the electrical component and which is brought into contact with a second region of the second main surface corresponding to a fixing member and a surrounding region of the fixing member protrudes relative to a portion of the opposing part other than the contact part. The degree of flatness of a contact surface, in the contact part, that is brought into contact with the first region and the second region is higher than the degree of flatness of a surface of the opposing part other than the contact surface. | 10-31-2013 |
| 20130308278 | ACHIEVING POWER SUPPLY AND HEAT DISSIPATION (COOLING) IN THREE-DIMENSIONAL MULTILAYER PACKAGE - A computer-implemented structure for optimizing a route for power supply and heat dissipation in a multilayer chip. The method includes: setting a heat conductive thermal value for the multilayer chip by way of density, preparing a substrate that contains silicon where a wiring layer is formed facing the upper surface side of the multilayer chip, setting the power from the wiring layer of the substrate that uses silicon, manipulating the value of the power supply, and manipulating the heat conductive thermal value based on density. Both apparatus's include an organic substrate, a multilayer chip, a substrate containing silicon, a wiring layer, and a heat dissipater, wherein the components are configured to perform the steps of the above method. The method of configuring an apparatus ensures that all the multilayer chips are stored in the concave part of the organic substrate. | 11-21-2013 |
| 20130308279 | Thermal Energy Storage With A Phase-Change Material In A Non-Metal Container - A thermal energy storage apparatus that absorbs thermal energy from a heat-generating device is described. In one aspect, the thermal energy storage apparatus comprises a non-metal container and a phase-change material. The non-metal container is configured to receive the heat-generating device thereon. The phase-change material is contained in the non-metal container and configured to absorb at least a portion of heat from the heat-generating device through the non-metal container. | 11-21-2013 |
| 20130314878 | CONTROL MODULE AND METHOD FOR PRODUCING SAME - A control module includes a circuit board having conductor paths arranged on at least one plane and having at least one rigid, inflexible conductor path section. The control module also includes an electronic control circuit which electrically contacts the conductor paths and has electrical components. The control module also includes a pan-shaped cover part protecting the control circuit. The cover part is arranged over a part of the electronic control circuit and contacts a side of the circuit board in a sealing manner with a flat contact region aligned parallel to the side. At least part of the electronic control circuit is protectively arranged in a housing inner chamber between the cover part and the circuit board, and electrical contacts of the circuit board are provided outside of the housing inner chamber, which is covered by the cover part, to contact electrical components of the control module. | 11-28-2013 |
| 20130322022 | HEAT-DISSIPATING APPARATUS - The present disclosure provides a heat-dissipating apparatus for printed circuit board. The heat-dissipating apparatus adopts a ceramic device arranged between the printed circuit board and ground. Therefore, the apparatus can achieve the purpose of heat dissipation and save space of the printed circuit board and save cost of using a fan and cooling fins. | 12-05-2013 |
| 20130322023 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEATSINK CAP AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; molding an encapsulation directly on the integrated circuit and the substrate; forming a trench in the encapsulation having a trench bottom surface and surrounding the integrated circuit; and mounting a heatsink having a heatsink rim over the integrated circuit with the heatsink rim within the trench and the heatsink electrically isolated from the substrate. | 12-05-2013 |
| 20130329369 | ELECTRONIC DEVICE - An electronic device includes a circuit board, a heat generating component positioned on the circuit board, a casing receiving the circuit board and the heat generating component, and a working medium. The working medium is contained in the casing and covers the heat generating component. The working medium is electrically insulated and phase-change material, and represents solid state at normal temperature. | 12-12-2013 |
| 20130329370 | Electronic Device, Method for Producing the Same, and Printed Circuit Board Comprising Electronic Device - An electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides and with at least one electronic component arranged in a cutout of the first layer, wherein the first layer is covered in each case with an electrically insulating, thermally conductive layer and a further layer composed of electrically conductive material is provided in each case on the thermally conductive layer, the further layer being coated in each case with a covering layer composed of electrically conductive material, and furthermore having plated-through boles composed of the material of the covering layer, which extend through the electrically insulating, thermally conductive layer covering the electronic component and the further layer composed of electrically and thermally conductive material for the purpose of making contact with the electronic component. | 12-12-2013 |
| 20130343004 | Thermally Actuated Printed Circuit Board Retainers - Thermally actuated printed circuit board (PCB) retainer assemblies that utilize at least one thermally actuated element to secure a received PCB to a heat sink in accordance with embodiments of the invention are disclosed. In one embodiment, a thermally actuated PCB retainer assembly includes a heat sink having an elongated groove configured to receive a PCB and a PCB retainer that includes a pair of complementary elongated bodies each having a first elongated face and a second elongated face where the second elongated faces of the elongated bodies are disposed in a cooperative sliding relation and at least one thermally actuated element in contact with at least one of the elongated bodies such that the thermally actuated element applies a force on the at least one elongated body in response to temperature changes such that the elongated bodies move in the cooperative sliding relation. | 12-26-2013 |
| 20140009891 | PLANAR HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE UTILIZING THE SAME - The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure. | 01-09-2014 |
| 20140016272 | CIRCUIT BOARD AND HEAT DISSIPATION DEVICE THEREOF - A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device. | 01-16-2014 |
| 20140016273 | ELECTRONIC COMPONENT WITH HEAT-DISSIPATING PLATE AND BOARD EMPLOYING SAID COMPONENT - Electronic component includes a plurality of pins ( | 01-16-2014 |
| 20140016274 | LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD - A lightweight radio/Audio player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. | 01-16-2014 |
| 20140036451 | HEAT SINK ASSEMBLY - A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs. | 02-06-2014 |
| 20140043769 | THERMAL BUFFERING ELEMENT - A thermal buffering element applied to an electronic device is provided. The thermal buffering element includes a heat absorbing material and a plurality of metal particles. The heat absorbing material is disposed corresponding to a heat source of the electronic device. The metal particles are distributed in the heat absorbing material. The invention solves the problem of uneven heat dissipation of an electronic product, which makes a user feel more comfortable. | 02-13-2014 |
| 20140055957 | Composite Material and Electronic Device - A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device. | 02-27-2014 |
| 20140063745 | HOUSING UNIT WITH HEAT SINK - Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover. | 03-06-2014 |
| 20140063746 | ELECTRONIC DEVICE WITH HEAT DISSIPATION ASSEMBLY - An electronic device includes a sidewall, a circuit board arranged on the sidewall, an electronic component set on a side of the circuit board opposite to the sidewall, and a heat dissipation assembly connected between the sidewall and the circuit board. | 03-06-2014 |
| 20140063747 | COOLING STRUCTURE FOR A SHUNT RESISTOR AND INVERTER APPARATUS USING THE SAME - A cooling structure for a shunt resistor has a semiconductor switching element mounted on a component side of a circuit board, a shunt resistor surface-mounted a solder side of the circuit board, a radiator for releasing heat generated from the semiconductor switching element and the shunt resistor, and an insulating material interposed between the shunt resistor and the radiator and having a high thermal conductivity. | 03-06-2014 |
| 20140063748 | METHOD FOR PRODUCING A CIRCUIT BOARD SYSTEM AND A CIRCUIT BOARD ARRANGEMENT - Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder. | 03-06-2014 |
| 20140071631 | PRINTED CIRCUIT BOARD UNIT - A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board. | 03-13-2014 |
| 20140078678 | ELECTRONIC DEVICE WITH HEAT DISSIPATING MODULE - An electronic device includes a circuit board, a heat dissipating module, and a latch member. A heat generating part is located on the circuit board. The heat dissipating module includes a plurality of heat pipes and a heat sink. The heat sink abuts the heat generating part, and the plurality of heat pipes abuts the heat sink. The latch member clips the heat sink, to prevent the heat sink from disengaging from the heat generating part, and the plurality of heat pipes are clipped between the heat sink and the latch member. | 03-20-2014 |
| 20140078679 | ELECTRONIC DEVICE - An electronic device includes: a resin plate; an electronic component disposed on one side of the resin plate in a thickness direction; and a heat transfer member having higher heat conductivity than the resin plate, the heat transfer member transferring heat from the one side to the other side of the resin plate in the thickness direction. | 03-20-2014 |
| 20140078680 | Power Supply Device and Display Device - This power supply device includes a substrate, a transformer mounted on a first surface of the substrate, and a switch element electrically connected to the transformer, mounted on a second surface of the substrate, while the switch element is arranged in a position different from a position on the second surface corresponding to a position on the first surface in which the transformer is mounted. | 03-20-2014 |
| 20140085830 | HEAT DISSIPATING SUBSTRATE, AND ELEMENT EQUIPPED WITH SAME - A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 μm to 20 μm. | 03-27-2014 |
| 20140085831 | CIRCUIT BOARD STRUCTURE HAVING MEASURES AGAINST HEAT - To achieve efficient heat spreading and heat releasing by using a metal core of a circuit board, a terminal block includes an insulating block body and terminals. At least one of the terminals is provided with terminal portions for a connection with a circuit board. The terminal portions are inserted into respective through holes of the circuit board, the circuit board having a pattern circuit at a surface layer thereof and a conductive metal core at an intermediate portion in a thickness direction, so that heat of the metal core or of both the metal core and the pattern circuit is absorbed and transferred to the terminals. A bus-bar block includes an insulating block body and several parallel bus-bars with different lengths. Terminal portions at a tip end of the bus-bars are inserted, near heat-generating component on the circuit board, into the through holes of the circuit board. | 03-27-2014 |
| 20140092561 | HANDHELD MOBILE DEVICE AND BACK COVER FOR THE SAME - In various embodiments, a handheld mobile device and back cover for the same are provided. The back cover for a handheld mobile device comprises: a back cover body having a first surface and a second surface opposite to the first surface; and a heat dissipating plate fixed to the first surface of the back cover body; wherein a hole is provided in a region of the back cover body corresponding to the heat dissipating plate. The heat dissipating plate covers the heat-generating elements on the circuit board, and the heat dissipating plate is partly exposed to the outside via the corresponding hole in the back cover body, such that the heat dissipating plate eliminates the partial heat-generating points and dissipates heat to the outside via the hole effectively. | 04-03-2014 |
| 20140092562 | INSULATION AND HEAT RADIATION STRUCTURE OF POWER DEVICE, CIRCUIT BOARD, AND POWER SUPPLY APPARATUS - Embodiments of the present application provide an insulation and heat radiation structure of a power device, a circuit board, and a power supply apparatus. The insulation and heat radiation structure of the power device includes a power device, an insulation ceramic piece, and a heat radiator, where the power device is of a sheet structure, the insulation ceramic piece is an alumina ceramic piece, a heat radiator pin is disposed on the heat radiator, the heat radiator pin is used for being mechanically connected to the circuit board, a heating surface of the power device is adhesively fixed to one surface of the insulation ceramic piece through a first insulating thermal conductive adhesive, and the other surface of the insulation ceramic piece is adhesively fixed to a contact heat radiation surface of the heat radiator through a second insulating thermal conductive adhesive. | 04-03-2014 |
| 20140098498 | POWER SYSTEM AND POWER CONVERTING DEVICE THEREOF - A power converting device includes a first substrate, a driving module, and a converting module. The first substrate is inserted into a main plate. The first substrate has a first axial direction and a second axial direction perpendicular to the first axial direction, the second axial direction is perpendicular to the main plate. The driving module is located at one side of the first substrate and electrically connected to the first substrate. The converting module is located at the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to a length of the first substrate in the first axial direction, and a width of the converting module is smaller than the length of the first substrate in the first axial direction. | 04-10-2014 |
| 20140104791 | MOUNTING APPARATUS FOR BRACKET OF HEAT SINK - A circuit board assembly includes a circuit board and a bracket of a heat sink. The bracket of the heat sink includes a pair of first securing feet and a pair of second securing feet opposite to the pair of first securing feet. A pair of first securing members is secured to the circuit board. A pair of second securing members is secured to the circuit board facing the pair of first securing members. The pair of first securing members includes a pair of elastic pieces which faces the pair of second securing members. The pair of first securing feet abuts against the pair of elastic pieces to elastically deform the pair of elastic pieces. The pair of elastic pieces exerts force on the bracket to push the pair of second securing feet to abut against the pair of second securing members. | 04-17-2014 |
| 20140111944 | HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE - A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator. | 04-24-2014 |
| 20140111945 | CIRCUIT BOARD - The invention relates to a circuit board for populating with at least one electronic component, at least one heat conducting element being provided, connected to a surface of a sheet-like circuit board body by way of a boundary layer. The boundary layer consists in certain areas of an electrically non-conducting layer and in certain areas of an electrically conducting layer, the non-conducting layer combining with the circuit board body and the heat conducting element to provide at least one receiving space with a pocket-like volume for the conducting layer. | 04-24-2014 |
| 20140111946 | ARRANGEMENT FOR COOLING SUBASSEMBLIES OF AN AUTOMATION OR CONTROL SYSTEM - An arrangement for cooling subassemblies of an automation or control system is disclosed, wherein the subassemblies each comprise at least one printed circuit board (LP) having electronic components of different temperature sensitivity arranged thereon. The printed circuit board (LP) has at least one first portion for temperature-sensitive components and at least one second portion for temperature-insensitive components that generate waste heat. Interspaces are arranged between the first portion and the second portion, the interspaces each forming a thermally insulated trench. Means can be provided which keep away the heat over the temperature-sensitive components in a suitable manner and dissipate the waste heat from the printed circuit board (LP) before the heat reaches the temperature-sensitive components. | 04-24-2014 |
| 20140118952 | FLAT PANEL DISPLAY - A flat panel display (FPD) including a display panel for displaying an image; a film substrate electrically connected to the display panel, the film substrate including driving circuits; a printed circuit board (PCB) electrically connected to the film substrate, the printed circuit board providing a signal for displaying the image; and a heat radiating unit attached to one surface of the film substrate, the heat radiating unit contacting at least one of the display panel and the PCB. | 05-01-2014 |
| 20140118953 | HEAT DISSIPATION STRUCTURE - An exemplary heat dissipation structure includes a circuit board, at least one electronic element, and a heat sink. The electronic element is mounted on the circuit board to form a circuit. The heat sink is mounted on the circuit board corresponding to the electronic element to dissipate heat generated by the electronic element. The heat sink is mounted by surface mount technology. | 05-01-2014 |
| 20140118954 | ELECTRONIC DEVICE WITH HEAT-DISSIPATING STRUCTURE - There is disclosed an electronic device having a heat-dissipating structure. The electronic device comprises a circuit board; a heat conduction plate arranged to face the circuit board, and dissipate heat generated by the circuit board only in a direction parallel to the heat conduction plate. According to the present invention, the electronic device is particular suitable for the application wherein the electronic device will be stacked up on another electronic device and requires no any forced convection arrangement such as a fan. | 05-01-2014 |
| 20140133105 | METHOD OF EMBEDDING CPU/GPU/LOGIC CHIP INTO A SUBSTRATE OF A PACKAGE-ON-PACKAGE STRUCTURE - Embodiments of the invention provide an IC system in which low-power chips can be positioned proximate high-power chips without suffering the effects of overheating. In one embodiment, the IC system may include a first substrate, a high-power chip embedded within the first substrate, a second substrate disposed on a first side of the first substrate, the first substrate and the second substrate are in electrical communication with each other, and a low-power chip disposed on the second substrate. In various embodiments, a heat distribution layer is disposed adjacent to the high-power chip such that the heat generated by the high-power chip can be effectively dissipated into an underlying printed circuit board attached to the first substrate, thereby preventing heat transfer from the high-power chip to the low-power chip. Therefore, the lifetime of the low-power chip is extended. | 05-15-2014 |
| 20140146481 | Circuit Cooling - An apparatus (e.g., an audio amplifier) includes a housing cover configured to be fitted to a heat sink for enclosing a circuit board therebetween. The apparatus also includes a contact member formed separately from and mounted to the housing cover to cause electrical components on the circuit board to engage with the heat sink when the housing cover is fastened to the heat sink. The contact member includes first and second projections connected to each other and configured such that displacement of the first projection in a first direction causes a proportional displacement of the second projection in a second direction opposite the first direction. | 05-29-2014 |
| 20140153193 | PHASE CHANGE HEAT SINK FOR TRANSIENT THERMAL MANAGEMENT - A heat dissipating assembly, for dissipating heat, having at least one heat producing component and a heat sink having phase change material conductively coupled to the at least one heat producing component. | 06-05-2014 |
| 20140160685 | Composite Heat Sink Device For Cooling Of Multiple Heat Sources In Close Proximity - In one aspect, an apparatus comprises a substrate, a first electrically-driven device disposed on the substrate, a second electrically-driven device disposed on the substrate, and a composite heat sink device. The composite heat sink device comprises a first thermal conduction member, a second thermal conduction member, and a thermal insulation member. The first thermal conduction member is disposed on the first electrically-driven device such that at least a portion of the heat generated by the first electrically-driven device is transferred to the first thermal conduction member by conduction. The second thermal conduction member is disposed on the second electrically-driven device such that at least a portion of the heat generated by the second electrically-driven device is transferred to the second thermal conduction member by conduction. The thermal insulation member is disposed between and thermally decouples the first thermal conduction member and the second thermal conduction member from one another. | 06-12-2014 |
| 20140168903 | PASSIVE COOLING SYSTEM INTEGRATED INTO A PRINTED CIRCUIT BOARD FOR COOLING ELECTRONIC COMPONENTS - A passive cooling system is provided for dissipating heat from an electronic component. The system includes a printed circuit board including a first dielectric layer and a first conductive layer, an electronic component coupled to the printed circuit board via a plurality of electrical contacts, and a cooling component thermally coupled to the electronic component through the first conductive layer by a micro via thermal array. | 06-19-2014 |
| 20140168904 | WIRELESS INTERNET ROUTER - Wireless Internet routers are disclosed. The routers include a casing that has a front side, a backside, a top side, a bottom side, and two additional sides. The casing is configured to house at least one printed circuit board of the router. An indentation area is located in the backside of the casing. The indentation area includes one or more walls, and a surface that meets and is integrally formed with the one or more walls. A plurality of connection ports that are located within the one or more walls of the indentation area (which may be oriented in a variety of positions). The router is configured to visually hide the cables that are attached to the connection ports, regardless of whether the router is oriented in a vertical, horizontal, vertically slanted, or flush wall mounted position. | 06-19-2014 |
| 20140185245 | SWITCHING CIRCUIT LAYOUT WITH HEATSINK - A circuit board adapted for use in an switching converter for connecting a plurality of switches including a first switch, a second switch, a third switch and a fourth switch. The circuit board has a layout for connecting the switches. The layout is adapted for locating the switches substantially at or symmetrically with respect to the endpoints of a right-angle cross. The right-angle cross is formed from two line segments intersecting with a ninety degree angle. The circuit board may offsets the switches perpendicularly to the line segments at the endpoints of the line segments either in a clockwise or a counterclockwise direction. | 07-03-2014 |
| 20140198454 | INTEGRATED POWER MODULE PACKAGING STRUCTURE - An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first L-shaped bending portion and a second L-shaped bending portion connected to each other. The first printed circuit board is disposed with at least a power device and is electrically connected to at least a part of the first L-shaped bending portions. Two opposite surfaces of the second printed circuit board are respectively disposed with at least an electronic device, and the second printed circuit board is electrically connected to at least a part of the second L-shaped bending portions. | 07-17-2014 |
| 20140198455 | MOTOR-DRIVE UNIT HAVING HEAT RADIATOR - A compact motor-drive unit wherein each component can be stably fixed to the unit. A motor-drive unit has a plurality of substrates each having a circuit for driving a motor; semiconductor devices mounted on the respective substrates; at least one smoothing capacitor mounted on at least one of the substrates; and a heat radiator having a heat-transferring surface adjacent to the semiconductors. The smoothing capacitor is positioned within a swept area formed by moving the first substrate arranged generally parallel to a base surface, in a counter-front direction, so that the smoothing capacitor is separated from the first substrate. | 07-17-2014 |
| 20140198456 | SET TOP BOX HAVING SNAP-IN HEAT SINK AND SMART CARD READER WITH A HOLD DOWN FOR RETAINING THE HEAT SINK - A hold down for an electronic device is provided that includes a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, and a heat sink associated with the thermal pad. The hold down includes a frame that defines a perimeter having a plurality of retainers that are configured to engage with a plurality of mating locations defined on at least a bottom frame to provide a biasing force that retains the heat sink against a circuit board that is positioned between the bottom frame and the hold down. | 07-17-2014 |
| 20140233189 | CIRCUIT BOARD ASSEMBLY USING METAL PLATES AS CONDUCTING MEDIUM EMBEDDED THEREIN - A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop. | 08-21-2014 |
| 20140240929 | HETEROGENEOUS THERMAL INTERFACE - An electronic apparatus, such as a lighting fixture, includes a substrate, an electronic device such as a chip-on-board light emitting diode and a thermal interface located between the substrate and the electronic device. The thermal interface includes at least two distinct materials, including a dielectric material and a thermally conductive material. The dielectric material includes a cutout into which the thermally conductive material is located. The dielectric material can completely surround the perimeter of the electronic device or can be located proximate portions of the electronic device that are prone to arcing in order to protect the substrate from arcing. The electronic apparatus operates at a reduced temperature as compared to an electronic apparatus that does not include the thermal interface. Methods for making an electronic apparatus having a thermal interface with a discrete dielectric material and thermally conductive material are also described. | 08-28-2014 |
| 20140247564 | SHIELDING STRUCTURE FOR ELECTRONIC DEVICE - The invention provides an electromagnetic shielding for electronic device. The electromagnetic shielding comprises: an opening provided at a position corresponding to the electronic device, through which a heat sink passes to be in contact directly with the electronic device; and at least one elastic arm made of conductive material provided at the circumference of the opening which are extending in a direction away from the shielding to be in a conductive contact with the side surface of the heat sink when the heat sink is mounted in position. | 09-04-2014 |
| 20140254104 | HEAT DISSIPATING MODULE - A heat dissipating module comprises at least one substrate and a heat dissipating layer. The substrate has a first surface and a second surface. The heat dissipating layer is disposed on the second surface. At least one heat generating device is electrically connected to the first surface, and the heat dissipating module is disposed on a main board uprightly. The heat dissipating module is advantageous for shortening the manufacturing time, raising the efficiency of automated production, decreasing the assembling cost and further achieving high heat dissipating efficiency. | 09-11-2014 |
| 20140254105 | DRIVE CIRCUIT DEVICE - A drive circuit device includes a circuit board having a multilayer structure, which includes first to fourth circuit conductor layers, and first to third insulating layers; and heat sinks that dissipate heat of the circuit board to an outside. An upper FET state is embedded in the first insulating layer, and a lower FET state is embedded in the second insulating layer. The upper FET and the lower FET are disposed so that a region in which the upper FET is positioned and a region in which the lower FET is positioned overlap each other in a stacking direction. A lead-out portion is formed at a second circuit pattern of the circuit conductor layer, the lead-out portion extending from the circuit board in a direction orthogonal to the stacking direction, and being connected to the heat sinks so that heat is transferred to the heat sinks. | 09-11-2014 |
| 20140268580 | METHOD AND APPARATUS FOR PROVIDING A GROUND AND A HEAT TRANSFER INTERFACE ON A PRINTED CIRCUIT BOARD - In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component. The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion and a second portion. At least a part of the first portion is positioned in the through-hole, and the second portion is coupled to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion. | 09-18-2014 |
| 20140307391 | THREE DIMENSIONAL PACKAGING - Representative implementations of devices and techniques provide a printed circuit board (PCB) arranged to at least partly surround an electrical component having a plurality of non-coplanar outer surfaces. The PCB is arranged to fold at one or more predetermined boundaries. | 10-16-2014 |
| 20140307392 | Aluminum EMI / RF Shield - A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for circuitry on a circuit board comprising an aluminum material plated with a solderable material, the shield providing electromagnetic interference and radio frequency interference shielding and heat transfer when positioned over a circuit. | 10-16-2014 |
| 20140313676 | ELECTRONIC COMPONENT PACKAGE - An electronic component package includes: a first insulation layer; an electronic component mounted in one surface of the first insulation layer; a heat sink formed with a cavity corresponding to the electronic component, bonded to the one surface of the first insulation layer to cover the electronic component, and formed with an inset hole and with an inlet hole; an adhesive charged in the cavity; and a circuit pattern formed in another surface of the first insulation layer. | 10-23-2014 |
| 20140321064 | HOLD DOWN FOR RETAINING A HEAT SINK - At least one implementation provides a hold down for an electronic device. The electronic device includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad. The hold down includes a generally planar portion adapted to be positioned over a surface of the heat sink. The hold down also includes a plurality of connecting structures extending angularly from the generally planar portion. The connecting structures and configured to engage the support frame to cause the hold down to apply the biasing force to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. A method is also provided for attaching the hold down. | 10-30-2014 |
| 20140328024 | THERMAL INTERFACE MATERIAL PAD AND METHOD OF FORMING THE SAME - A thermal interface material (TIM) pad is disclosed for dissipating heat from a component. The TIM pad includes a plurality of thermal interface material layers and at least one graphene layer interposed between the plurality of TIM layers. A method for forming the TIM pad includes stacking the plurality of TIM layers with at least one graphene layer interposed between the plurality of TIM layers to reach a length for the TIM pad. The stacked layers are cut corresponding to a thickness for the TIM pad for compression against the component. | 11-06-2014 |
| 20140328025 | CONTROLLER - A controller including a case provided with at least one opened surface, a cover opening and closing the at least one opened surface, and a circuit board provided within the case and provided with a heating unit. The cover includes a cover body and a heat radiation unit in which at least a portion of the inner surface of the cover body is concave toward the circuit board so as to be closely adhered to the heating unit for the purpose of heat radiation. Thereby, heat within the controller may be effectively radiated and the lifespan of electrical devices may be extended. | 11-06-2014 |
| 20140334107 | SYSTEM AND METHODS FOR THERMAL CONTROL USING SENSORS ON DIE - A portable electronic device including a temperature sensor embedded in a die is provided. To process temperature measurements the portable electronic device includes a processor circuit coupled to the temperature sensor, the processor circuit configured to read a measurement from the temperature sensor when an integrated circuit in the die is inactive. Furthermore, a memory circuit coupled to the processor circuit and the temperature sensor stores a temperature gradient provided by the temperature sensor. A Printed Circuit Board for use in a portable electronic device as above is also provided. A method for performing thermal control in a portable electronic device as above is also provided. | 11-13-2014 |
| 20140340850 | COOLING ASSEMBLY - A cooling assembly includes a chassis, a circuit board secured to the chassis, a cooling layer, a cooler secured to the circuit board, and a housing receiving the cooler and the circuit board and secured to the chassis. The housing includes a front plate. The cooling layer is located between the front plate and the cooler. A first surface of the cooling layer is secured to the cooler. A second surface of the cooling layer, opposite to the first surface, is secured to the front plate. The cooling layer transfers heat from the cooler to the housing to cool a heating element on the circuit board. | 11-20-2014 |
| 20140347821 | THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING LINK BETWEEN AT LEAST ONE ELECTRONIC COMPONENT AND A COMPLETELY OR PARTIALLY METAL RADIATOR - The invention relates to a method for producing a thermally conductive and electrically insulating link between at least one electronic component ( | 11-27-2014 |
| 20140355215 | Embedded Heat Slug to Enhance Substrate Thermal Conductivity - An electronic package is fabricated wherein a substrate is provided having three or more layers. A heat slug is embedded completely within the substrate. A die is attached above the substrate. Thermal paths to the heat slug are linked through the ground signal interconnects (traces, vias and planes). | 12-04-2014 |
| 20140362538 | FASTENING DEVICE FOR HEAT SINK - A fastening device for a heat sink includes a circuit board, four fasteners, two slide poles, four resilient members, and two wrenches. An electronic component is attached to the circuit board. The protrusions extend up from the circuit board. The fasteners are engaged in the protrusions. The slide poles are located at opposite sides of the electronic component, each slide pole is slidably connected to two of the fasteners. The resilient members are connected to the fasteners. The wrenches are pivotably connected to the heat sink. Each wrench includes a hook. When the wrenches are rotated, the hooks abut against bottoms of the slide poles to bias the slide poles to move up and deform the resilient members. When the wrenches are perpendicular to the circuit board, the slide poles enter the hooks and press down the hooks, the wrenches make the heat sink press the electronic component. | 12-11-2014 |
| 20140369007 | COMPLEX HEAT DISSIPATION ASSEMBLY FOR ELECTRONIC CASE - A complex heat dissipation assembly for electronic case, which includes: a heat conduction plate assembly composed of multiple electroconductive heat conduction plates, the heat conduction plate assembly having a contact face in contact with a surface of the case; and a heat spreader assembly composed of multiple heat spreaders, which are able to quickly transversely conduct heat. The heat spreaders are disposed between the heat conduction plates in contact therewith. Each heat spreader has a proximal-to-heat-source section and a distal-from-heat-source section. The heat conduction plate assembly and the heat spreader assembly cooperate with each other to complexly conduct and spread the heat of the case in different directions so as to uniformly and quickly dissipate the heat. Accordingly, the heat is prevented from accumulating around the case and the temperature will not locally abnormally rise. | 12-18-2014 |
| 20140376190 | ELECTRONIC SYSTEM WITH HEAT EXTRACTION AND METHOD OF MANUFACTURE THEREOF - An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism. | 12-25-2014 |
| 20140376191 | HYBRID INSULATION SHEET AND ELECTRONIC APPARATUS USING THE SAME - Provided are an insulation sheet and an electronic apparatus using the same. The insulation sheet includes: a radiating layer that spreads and radiates heat generated from a heat generating component of an electronic apparatus; and an insulating layer that suppresses the heat saturated in the radiating layer from being delivered to the outside of the electronic apparatus. | 12-25-2014 |
| 20150029673 | ELECTRONIC ELEMENT AND ELECTRONIC DEVICE - An electronic element surface-mounted on a substrate has a leg part that protrudes from a back surface of the electronic element toward a heat sink along a peripheral portion of a back electrode. As such, if the substrate warps, the protruding leg part abuts a heat reception surface of the heat sink, thereby preserving an insulation gap between the back electrode and the heat sink. As a result, short-circuiting is prevented. | 01-29-2015 |
| 20150029674 | PRINTED CIRCUIT BOARD SET HAVING HIGH-EFFICIENCY HEAT DISSIPATION - A printed circuit board set having high-efficiency heat dissipation includes a printed circuit board (PCB) and a heat dissipating device. The PCB has multiple electronic elements, at least one heat dissipating hole, and at least one thermally conductive material. The electronic elements are disposed on the top surface of the PCB. Each of the at least one heat dissipating hole is formed through the top and bottom surfaces of the PCB and aligns with one of the electronic elements. Each of the at least one thermally conductive material is disposed in the corresponding heat dissipating hole and in contact with the corresponding electronic element. The heat dissipating device is attached to the bottom surface of the PCB and in contact with the at least one thermally conductive material. With a high thermal conductivity, the at least one thermally conductive material rapidly transfers the waste heat produced by the PCB in operation to the heat dissipating device for heat dissipation. | 01-29-2015 |
| 20150062826 | ELECTRONIC DEVICE WITH HEAT DISSIPATION FUNCTION - An electronic device includes a housing defining an opening, a circuit board mounted in the housing, and a cover capable of conducting heat and covering the opening. An element and a hollow partition portion receiving the element are mounted on the circuit board. The cover includes a block formed on an inner surface of the cover. The block enters the partition portion and contacts the element. | 03-05-2015 |
| 20150062827 | HEAT SINK AND SUBSTRATE UNIT - A heat sink includes: a fixing unit fixed to a heating element; and a heat dissipation unit including a heat dissipation protruding portion and configured to slide with respect to the fixing unit. | 03-05-2015 |
| 20150070848 | Extended Heat Frame For Printed Circuit Board - A circuit board assembly for installation in a cabinet includes a first standards based size first mounting frame portion having a PCB mounted thereto. A second mounting frame portion is connected to the first mounting frame portion having no portion of the PCB connected thereto. A combination size of the first and second mounting frames defines a larger second standards based size. Multiple heat transfer components may be connected to the first or second mounting frame portion provide a conduction/convection cooling path. The first mounting frame portion may include a first false board edge and the second mounting frame portion includes one or more false board edge(s) positioned laterally and oppositely directed to the first false board edge. The first and second false board edges are slidably received in opposed slots created in a cabinet. | 03-12-2015 |
| 20150077945 | PORTABLE ELECTRONIC DEVICE AND BATTERY PACK FOR THE SAME - A portable electronic device and a battery pack for the portable electronic device are provided. The portable electronic device includes a Printed Circuit Board (PCB) in which at least one electronic component is disposed, and a battery pack including a heat conductor separately disposed at a gap from the PCB and that transfers heat generated in the electronic component to a battery cell. | 03-19-2015 |
| 20150092352 | Thermal Interface Solution With Reduced Adhesion Force - An article of manufacture comprises a composite, layered, and compressible TIM differentially adhered to a heat-spreader surface and a heat-source surface, such as a circuit card, where at least one of the surfaces comprises an uneven surface, and the TIM is compressively bonded to the uneven surface. The adhesive strength of the TIM to the heat-spreader surface is unequal to the adhesive strength of the TIM to the heat-source surface, and is adjusted so that the heat-spreader surface and the heat-source surface can be separated without damaging the heat-source surface. A process comprises manufacturing the article of manufacture. | 04-02-2015 |
| 20150092353 | DISPLAY DEVICE - Disclosed is a display device having reduced noise during curvature varying. The display device includes a display module configured to display an image and a curvature varier configured to change a shape of the display module to a plane shape or a curvature shape with respect to a front surface of the display module. The curvature varier changes the shape of the display module to the plane shape or the curvature shape according to a shape change caused by a temperature. | 04-02-2015 |
| 20150116947 | ADVANCED GROUNDING SCHEME - A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an “inner” routing layer that is coplanar with, and coupled with, the slug. | 04-30-2015 |
| 20150116948 | ELECTRONIC DEVICE AND ELECTROMAGNETIC WAVE SHIELDING MODULE THEREOF - An electronic device including a circuit board, a heat generating component and an electromagnetic wave shielding module is provided. The circuit board has a ground plane. The heat generating component is disposed on the circuit board. The electromagnetic wave shielding module includes a plurality of conductive components and a heat dissipating component. The conductive components are disposed on the circuit and electrically connected to the ground plane, wherein the conductive components are arranged with intervals and surround the heat generating component. The heat dissipation component is disposed on the heat generating component and connected to the conductive components, wherein the heat dissipating component covers and contacts with the heat generating component to dissipate heat from the heat generating component and shield an electromagnetic wave generated by the heat generating component, and the electromagnetic wave is transmitted to the ground plane and drained through the conductive components. | 04-30-2015 |
| 20150303164 | PACKAGE STRUCTURE - A package structure includes a first insulation layer, a first conductive layer, a direct bond copper substrate, and a first electronic component. A first conductive via is formed in the first insulation layer. The first conductive layer is disposed on a top surface of the first insulation layer and in contact with the first conductive via. The direct bond copper substrate includes a second conductive layer, a third conductive layer and a ceramic base. The ceramic base is disposed on a bottom surface of the first insulation layer and exposed to the first insulation layer by press-fit operation. The first electronic component is embedded within the first insulation layer and disposed on the second conductive layer. The first electronic component includes a first conducting terminal. The first conducting terminal is electrically connected with the second conductive layer and/or electrically connected with the first conductive layer through the first conductive via. | 10-22-2015 |
| 20150305191 | METHOD TO ALIGN SURFACE MOUNT PACKAGES FOR THERMAL ENHANCEMENT - A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink. | 10-22-2015 |
| 20150327354 | ELECTRONIC DEVICE - An electronic device includes a circuit board, first and second electronic components, a housing, and a heat conduction member. The first electronic component is mounted on a first surface of the circuit board, and the second electronic component is mounted on a second surface of the circuit board. The first electronic component and the second electronic component are arranged in an arrangement direction. The heat conduction member is disposed between the housing and a first component-opposite portion of the circuit board opposite to the first electronic component, and between the housing and a second component-opposite portion of the circuit board opposite to the second electronic component. The circuit board has a through hole in a formation area between the first electronic component and the second electronic component. The heat conduction member integrally covers each of the first component-opposite portion and the second component-opposite portion and the formation area of the circuit board. | 11-12-2015 |
| 20150327394 | MULTI-COMPONENT HEATSINK WITH SELF-ADJUSTING PIN FINS - A heatsink includes a rigid plate and a plurality of pin fins. The plate has a two dimensional array of holes through the rigid plate from a first face to a second face. Each pin fin is received in one of the holes and has a proximal end extending beyond the first face of the plate for conductively receiving heat, a distal end extending beyond the second face of the plate for convective heat exchange with air, a biasing member biasing the pin fin in a proximal direction, and a shoulder limiting the proximal extension of the pin fin through the hole. An apparatus may include the pin fin heatsink secured to a printed circuit board having at least two components that have different heights. Accordingly, each component is contacted by the proximal end of one or more self-adjusting pin fins that are aligned with the component. | 11-12-2015 |
| 20150342024 | MOBILE TERMINAL - A mobile terminal is disclosed. A mobile terminal according to the present invention comprises a housing; PCB installed inside the housing; and a battery pack disposed at least one side of the PCB and including at least one heat conductive layer radiating heat generated from the PCB. According to the present invention, a mobile terminal is capable of radiating heat generated from PCB by disposing part of a battery pack on one side of the PCB and of increasing capacity of the battery pack by utilizing a housing for the battery pack. | 11-26-2015 |
| 20150342025 | MOUNTING STRUCTURE OF ELECTRONIC COMPONENTS PROVIDED WITH HEAT SINK - There is provided a mounting structure of electronic components wherein the heat sink is disposed so as to allow a high heat releasing property to be achieved and ensure that manufacturing is easy. The resin film is provided at the lower surface side of the whole circuit element to which the lead is connected; a molding resin is molded at the upper side from the lower surface of the lead including the side portions of the lead, the circuit element and the connecting portions of the lead and the circuit element; the lead is connected to the electrode of the circuit board so that flattened back surfaces of a plurality of one side resin-molded elements are on the same horizontal plane; and a single heat sink is mounted on the back surfaces of the plurality of one side resin-molded elements. | 11-26-2015 |
| 20150342084 | Serviceable Electrical Box Thermal Management - An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader. | 11-26-2015 |
| 20150351239 | SUBSTRATE AND METAL LAYER MANUFACTURING METHOD - This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section. | 12-03-2015 |
| 20150351279 | ANISOTROPIC THERMAL ENERGY GUIDING SHELLS AND METHODS FOR FABRICATING THERMAL ENERGY GUIDING SHELLS - Anisotropic thermal energy guiding shells and methods for fabricating thermal energy guiding shells are provided. An anisotropic thermal energy guiding shell includes an interior volume defined within the anisotropic thermal energy guiding shell, a plurality of thermally conductive fibers, and at least one component attachment region. The plurality of thermally conductive fibers are arranged to guide thermal energy received by the anisotropic thermal energy guiding shell non-uniformly relative to the at least one component attachment region according to a thermal energy management objective. A method for fabricating a thermal energy guiding shell includes forming a composite fabric of thermally conductive fibers, impregnating the composite fabric of thermally conductive fibers with a resin, curing the impregnated composite fabric of thermally conductive fibers, and forming the impregnated composite fabric of thermally conductive fibers into the thermal energy guiding shell. | 12-03-2015 |
| 20150359134 | COMPRESSIBLE THERMALLY CONDUCTIVE ARTICLES - A compressible thermally conductive sheet comprises a plurality of through holes in a foam material substantially connecting first and second heat transfer surfaces to provide thermal pathways between surfaces. The though holes are filled with a non-foam thermally conductive composition in which thermally-conductive particulate filler is dispersed in a polymeric matrix. Also disclosed is a heat management assembly comprising the compressible thermally conductive sheet. | 12-10-2015 |
| 20160014927 | HEAT DISSIPATING MODULE AND METHOD OF COMBINING THE SAME | 01-14-2016 |
| 20160021730 | ELECTRONIC, OPTOELECTRONIC, OR ELECTRIC ARRANGEMENT - An electronic, optoelectronic or electric arrangement contains a circuit carrier having a metallic heat conductor, and a component, which is embedded, inserted or formed in the circuit carrier. The component has at least one electric, electronic or optoelectronic construction element and a rewiring layer, which contains a metallic heat conducting path. A metallic-thermal connection of the rewiring layer and the metallic heat conducting layer of the circuit carrier is provided by the heat conducting path. | 01-21-2016 |
| 20160021787 | FIXATION OF HEAT SINK ON SFP/XFP CAGE - An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements. | 01-21-2016 |
| 20160037623 | Solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture - A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections. | 02-04-2016 |
| 20160037642 | RECEPTACLE ASSEMBLY AND MODULE ASSEMBLY - In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector. | 02-04-2016 |
| 20160050743 | CIRCUIT BOARD AND ELECTRONIC APPARATUS - A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board. | 02-18-2016 |
| 20160066422 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE - A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insulating layer, and a wiring structure positioned on the first resin insulating layer and including a second resin insulating layer and a second conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the first conductor pattern and that the second conductor pattern includes second mounting pads. The second mounting pads are embedded in the second resin insulating layer such that the second mounting pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane. | 03-03-2016 |
| 20160081179 | MANUFACTURING OF A HEAT SINK BY WAVE SOLDERING - An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink. | 03-17-2016 |
| 20160105960 | MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive layer including first mounting pads such that the first mounting pads are positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body including a second conductive layer which includes second mounting pads such that the second mounting pads are positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board. The first via conductors are formed such that the first via conductors have diameters which increase in a same direction. | 04-14-2016 |
| 20160106002 | Internal heat-dissipation terminal - The disclosure provides an internal heat-dissipation terminal, wherein the terminal comprises at least one cavity in which heat-storage material is arranged. The cavity is located in an area without a device in the terminal. The technical solution of the disclosure can be applied to substantially enhance the heat storage capability of the terminal. | 04-14-2016 |
| 20160113117 | Electronic module and the fabrication method thereof - An electronic module is disclosed. The electronic module includes a substrate, a plurality of electronic components electrically connected to a first side of the substrate, and another plurality of electronic components embedded in the substrate. In some other embodiments, the electronic module further comprises a heat sink disposed on at least one of the plurality of electronic components to dissipate the heat generated by the at least one of the plurality of electronic components. And, in some other embodiment, the electronic module further comprises a molding disposed on the plurality of electronic components and, in further embodiments, the heat sink. | 04-21-2016 |
| 20160120017 | Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board - A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more. | 04-28-2016 |
| 20160120060 | PRINTED CIRCUIT BOARD, ELECTRONIC MODULE AND METHOD OF MANUFACTURING THE SAME - A printed circuit board, an electronic module and a method of manufacturing the printed circuit board are provided. The printed circuit board includes a plurality of insulation layers, metal layers formed on the plurality of insulation layers, a via formed for interlayer electrical connection of the metal layers, a trench penetrating the insulation layers, and a heat-transfer structure formed in the trench. | 04-28-2016 |
| 20160135280 | COOLED PRINTED CIRCUIT WITH MULTI-LAYER STRUCTURE AND LOW DIELECTRIC LOSSES - The printed circuit with a multi-layer structure comprises: a first layer machined to form a spotface passing through the layer, a second layer comprising a first cavity passing through the layer, a third layer comprising, on one face, an electronic component that it is in the first cavity, a fourth layer comprising a second cavity, a heat-conducting element with two parts: one made of metal, called a thermal cover, inserted into the spotface of the first layer so as to close, mechanically and electrically, the first cavity, the other made of a dielectric material with heat conduction >30 W/(m·K), placed in the first cavity so as to be in contact with the electronic component. | 05-12-2016 |
| 20160135282 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus comprises a circuit board, a metal member and a thermal coupling member. The circuit board comprises a heat-producing component and a ground plane which comprises an exposed portion exposed on a surface of the circuit board and is thermally coupled to the heat-producing component. The metal member covers the exposed portion of the ground plane. The thermal coupling member is sandwiched between the exposed portion of the ground plane and the metal member. | 05-12-2016 |
| 20160135286 | BENDABLE ELECTRONIC DEVICE - Disclosed is a flexible electronic device, including: a body made of a flexible material; a display unit; a flexible circuit board; a bending adjuster having a first plate that maintains a flat shape at room temperature, and a second plate that maintains a bent state at a specific temperature or more and having an elastic force larger than that of the first plate in a superelastic state, and is configured to adjust bending of the body by these plates, such that it is possible to improve reality of an image on a display unit by controlling the overall electronic device to be bent at a predetermined angle, more stably maintain a bent state and a flat state, reliably prevent a display unit and a flexible circuit board from being damaged, and stably maintain the bent state and the flat state despite using for a long period of time. | 05-12-2016 |
| 20160143128 | ELECTRONIC DEVICE - An electronic device includes: a casing; a board disposed inside the casing and having a heating element mounted thereon; an opposing member disposed inside the casing and having an opposing face opposed to a face of the board on which the heating element is mounted; a heat sink formed by alternately laminating thermal diffusion sheets and adhesive layers each having an opening at a location corresponding to the heating element on the opposing face of the opposing member; and a press member configured to press the heating element against a region of the heat sink corresponding to the opening of the adhesive layer, thus joining the thermal diffusion sheets together at the location of the opening. | 05-19-2016 |
| 20160150631 | COOLING DEVICE - The object of the present invention is to provide a cooling device capable of more efficiently cooling heating components heated. The cooling device has a first heat sink and a heat conductor. The first heat sink is thermally coupled to a first heating component mounted on a first surface of a circuit board. The heat conductor is thermally coupled to a second heating component mounted on a second surface of the circuit board and is thermally coupled to the first heat sink. | 05-26-2016 |
| 20160157333 | Thermal Energy Storage With A Phase-Change Material In A Non-Metal Container | 06-02-2016 |
| 20160165763 | FLAT PANEL DISPLAY - A flat panel display (FPD) including a display panel for displaying an image; a film substrate electrically connected to the display panel, the film substrate including driving circuits; a printed circuit board (PCB) electrically connected to the film substrate, the printed circuit board providing a signal for displaying the image; and a heat radiating unit attached to one surface of the film substrate, the heat radiating unit contacting at least one of the display panel and the PCB. | 06-09-2016 |
| 20160192472 | DEVICE AND METHOD FOR DETERMINING THE TEMPERATURE OF A HEAT SINK - A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner. | 06-30-2016 |
| 20160192488 | CIRCUIT BOARD, MULTILAYERED SUBSTRATE HAVING THE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD - Disclosed is a circuit board that includes a core portion having a first via disposed therein in the general shape of an hourglass. The circuit board implements a finer via that penetrates a core and improves heat dissipation performance. The circuit board includes a core portion including a first core and a second core made of a metallic material, the first core and the second core being disposed adjacent to each other, and a first via penetrating the core portion. | 06-30-2016 |
| 20160205762 | MULTI-LAYER HEAT SPREADER ASSEMBLY WITH ISOLATED CONVECTIVE FINS | 07-14-2016 |
| 20180027646 | CIRCUIT ASSEMBLY, ELECTRICAL JUNCTION BOX, AND MANUFACTURING METHOD FOR CIRCUIT ASSEMBLY | 01-25-2018 |
| 20190150278 | CERAMIC CIRCUIT BOARD AND SEMICONDUCTOR MODULE | 05-16-2019 |
