| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361714000 | Through component housing | 72 |
| 20080212286 | Closed Type Device with Heat Radiating Structure, and Casing and Composite Sheet for Use in the Device - A closed type device having excellent waterproofness and dustproofness, capable of preventing the entry of a corrosive gas, and having humidity conditioning function. In the heat radiating structure of the device ( | 09-04-2008 |
| 20080212287 | SEMICONDUCTOR PACKAGE STRUCTURE WITH BURIED ELECTRONIC DEVICE AND MANUFACTURING METHOD THEROF - A semiconductor package structure and manufacturing method thereof are provided, wherein the semiconductor package structure comprises a multi-layer circuit board, an electronic device and a slug. The multi-layer circuit board has at least one via hole, and the electronic device having a upper surface is buried in the multi-layer circuit board, wherein a portion of the upper surface is connected with the via hole. The slug is set in the via hole. One end of the slug is in contact with the upper surface of the electronic device and the other end of the slug is exposed out of the multi-layer circuit board through the via hole. | 09-04-2008 |
| 20080259571 | Semiconductor device used for a rectifier of a vehicle alternator - A semiconductor device includes a semiconductor chip, a metal disc portion, a lead, and a sealing material. The semiconductor chip has surfaces both serve as primary electrode surfaces. The metal disc portion is secured to an external cooling metal body. One primary electrode surface of the semiconductor chip is soldered to the disc portion. The lead has a head portion at an end thereof and the head portion is soldered to the other primary electrode surface of the semiconductor chip. The sealing material seals at least a side face of the semiconductor chip and two soldered portions of the disc portion and the head portion. The disc portion is provided with projections on a surface opposite to the surface to which the semiconductor chip is soldered. | 10-23-2008 |
| 20080266809 | ENHANCED THERMAL CONDUCTING FORMULATIONS - A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products. | 10-30-2008 |
| 20090122492 | Junction Box to Protect Individual Solar Panels from Overheating - The invention relates to a junction box for solar panels, with which the heat produced in the protecting diodes, MOSFETs or other corresponding power semiconductors of a solar panel can be reliably dissipated. In the junction box, the electronic components are pressed against the housing ( | 05-14-2009 |
| 20090161320 | ELECTRONIC CIRCUIT APPARATUS FOR COMPRESSOR - An electronic circuit apparatus for a compressor includes a board and a case. One corner of the board is fixed to case such that the board cannot move in the thickness direction and is movable in the flattening direction. According to this structure, even when an electronic part generates heat or outside air temperature of the case varies, the expansion or contraction of the board in the flattening direction is not affected by the expansion or contraction of the case in the flattening direction. Therefore, it is possible to prevent the deformation of the board and stress from being repeatedly applied to a soldering portion of the electronic part. As a result, it is possible to ensure the reliability of soldering strength for a long time. | 06-25-2009 |
| 20090168362 | Thin multi-chip flex module - A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board. | 07-02-2009 |
| 20090168363 | Thin multi-chip flex module - A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers. | 07-02-2009 |
| 20090231815 | ENCLOSURE DEVICE OF WIRELESS COMMUNICATION APPARATUS - An enclosure device of a wireless communication apparatus, which has a tubular structure with increased heat dissipation not unknown heretofore. A section of the enclosure device has a polygonal or circular shape, such as a substantially cylindrical structure, and the enclosure, which has a plurality of radiation fins arranged on an outer surface of the enclosure in a vertical direction, is formed integrally with the radiation fins by using a compression method. Various communication devices of the wire communication apparatus are mounted on the interior of the enclosure. The structure is preferably formed by the radiation fins and exhibits an increased radiation effect than that of a structure where radiation fins are arranged side by side on a flat plane. | 09-17-2009 |
| 20090237891 | HEAT SINK EQUIPPED DRIVING CIRCUIT MODULE ASSEMBLY FOR LED LAMP - A driving circuit module assembly includes a driving circuit module and a heat sink assembly to receive and cool the driving circuit module. The heat sink assembly includes a hollow heat sink, a cover abutting against a top portion of heat sink, and a base abutting against a bottom portion of the heat sink. The driving circuit module is mounted on the base and thermally connects therewith, whereby heat generated by the driving circuit module is transferred to the heat sink via the base. A plurality of screws extends through the cover, grooves in an outer surface of the heat sink and the base to threadedly engage with nuts thereby assembling the driving circuit module assembly together. | 09-24-2009 |
| 20100008047 | Passive thermal solution for hand-held devices - The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance. | 01-14-2010 |
| 20100020502 | Wafer-To-Wafer Stacking - a wafer-to-wafer stacking having a hermetic structure formed therein is provided. The wafer stacking includes a first wafer, including a first substrate and a first device layer having thereon at least one chip and at least one low-k material layer, a second wafer disposed above the first wafer and having a second substrate, and a closed structure disposed on the at least one chip and arranged inside a cutting edge of the at least one chip, wherein the closed structure is extended from one side of the first device layer far from the first substrate to the other side thereof adjacent to the first substrate. | 01-28-2010 |
| 20100142154 | Thermally Dissipative Enclosure Having Shock Absorbing Properties - A thermally dissipative housing ( | 06-10-2010 |
| 20100149756 | HEAT SPREADER - The present invention relates to a package comprising a plate formed from a diamond-composite material and a frame and its use as a lid or cavity lid in electronic packaging applications. | 06-17-2010 |
| 20100177483 | ELECTRICAL EQUIPMENT UNIT - A substrate includes a pair of surfaces opposing to each other in a direction. First electronic components are provided on one surface. Second electronic components lower than a maximum value of the height of the first electronic components in a direction are provided on the other surface. Insulating resin includes a covering part adhering and covering the second electronic components and the other surface, and side surface part extending from the periphery of the substrate to a side of the second electronic components along the direction. A lid covers the first electronic components from an opposite side of the substrate, and is fixed to the side surface part from the opposite side of the substrate. | 07-15-2010 |
| 20100214744 | Modular outdoor LED power supply - The main objective of the present invention is a modular outdoor LED power supply disposed inside or outside of an outdoor LED light or an LED device so as to decrease the distance between the power supply and a LED light base for preventing an output power drop from an output of the power supply to the LED light base. One or more than one power supply can be disposed in a groove of a main heat-dissipating outer cover of the power supply according to the actual requirements, so that the production and installation thereof become more convenient. The power supply is characterized by being water-resistant, moisture-proof, dust-proof, antirust and direct heat-dissipating, wherein the water-resistant effect is above the IP 65 standard, and thus the reliability and the lifetime of the power supply are increased. | 08-26-2010 |
| 20100265662 | Thermal Mitigation Device and Method - An exemplary thermal protection system includes a body having a first surface, at least one stationary thermal member disposed at least partially proximate the first surface and at least one heat producing device. An aperture, defined by at least one exterior edge can penetrate both the body and the stationary thermal member. At least a portion of the heat producing device can be disposed proximate the aperture. A moveable thermal member translatable between a first position and a second position, can be disposed proximate the stationary thermal member, the aperture, and the heat producing device when in the first position. When in the first position, a first portion of the moveable thermal member can overlap at least a portion of the stationary thermal member. When in the second position, the moveable thermal member can be disposed distal to the aperture and the at least one heat producing device. | 10-21-2010 |
| 20110044005 | CONTROL UNIT HOUSING - The invention relates to a controller housing, particularly for a transmission control module of a transmission of a motor vehicle. The controller housing ( | 02-24-2011 |
| 20110103021 | HEATSINKS OF THERMALLY CONDUCTIVE PLASTIC MATERIALS - The invention relates to a heatsink for an electrical or electronic device, to E&E devices comprising a heat source and a heatsink as well as to processes for producing the heatsink. The comprising a plastic body made of a thermally conductive plastic material comprising of an expanded graphite in an amount of at least 20 wt. %, relative to the total weight of the thermally conductive plastic material and/or has an in-plane thermal conductivity Λ | 05-05-2011 |
| 20110205710 | ELECTRONIC DEVICE - Provided is an electronic device that can reduce a material cost and the number of members to eliminate complex processing. The electronic device has a circuit board on which circuit elements are provided, and a shield case that accommodates the circuit board. The shield case has a frame. The frame has a side plate part having side plates for holding and covering the outer periphery of the circuit board, coupling parts extending parallel to a plane of the circuit board and connecting with at least two of the side plates, and contact parts connected to the coupling parts and directly contacting the circuit elements. The shield case releases the heat produced from the circuit elements via the contact parts and the coupling parts. | 08-25-2011 |
| 20110216507 | SEMICONDUCTOR DEVICE - A semiconductor device is provided with a power module capable of supplying an alternate current to a load, while a direct current is supplied from a battery to the power module for conversion into the alternate current, a cooling member capable of radiating heat generated by the power module, and a mounting member, integrally formed with a spring portion protruding in part therefrom and having elasticity, which allows the power module to be mounted on the cooling member under a state where one surface of the power module is caused to face the cooling member and the spring portion is pressed against the other surface of the power module in opposition to the one surface thereof. | 09-08-2011 |
| 20110228483 | COMMUNICATIONS MODULE WITH A SHELL ASSEMBLY HAVING THERMAL MECHANICAL FEATURES - In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel. | 09-22-2011 |
| 20110242767 | MECHANICAL ISOLATION AND THERMAL CONDUCTIVITY FOR AN ELECTRO-MAGNETIC DEVICE - An electro-magnetic device assembly constituted of an electro-magnetic device; a chassis arranged to sink heat; at least one thermally conductive material in thermal communication with the electro-magnetic device and with the chassis; and at least one mechanically isolating material in contact with the thermally conductive material and with the chassis, the at least one mechanically isolating material arranged to dampen the transmission of vibrations experienced by the chassis, in the direction of the magnetic field of the electro-magnetic device, to the electro-magnetic device. | 10-06-2011 |
| 20120039046 | MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE - A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier. | 02-16-2012 |
| 20120063095 | ELECTRONIC MODULE WITH LATERALLY-CONDUCTING HEAT DISTRIBUTOR LAYER - An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure. | 03-15-2012 |
| 20120081857 | TERMINAL BOX FOR SOLAR CELL MODULE - Provided are a heat dissipating plate with good thermal conductivity extending over the body bottom surface of a box body, and four terminal strips with good thermal conductivity to which an output lead wire extending from a solar cell module and a module coupling cable extending to outside is connected. A sealed portion of a diode provided for bypass in reverse loading is interposed between the heat dissipating plate and the terminal strips. The heat can be dissipated efficiently from the lower surface of the sealed portion through the heat dissipating plate to the solar cell module. The heat can also be dissipated efficiently from the upper surface of the sealed portion through the terminal strips to the output lead wire and the module coupling cable. | 04-05-2012 |
| 20120140419 | USING A BATTERY PACK TO FACILITATE THERMAL TRANSFER IN A PORTABLE ELECTRONIC DEVICE - The disclosed embodiments relate to techniques for facilitating thermal transfer in a portable electronic device. This portable electronic device may include a battery pack, which includes a battery cell and enclosure material for enclosing the battery cell. This enclosure material extends beyond the enclosure for the battery cell to facilitate thermal transfer within the portable electronic device. | 06-07-2012 |
| 20120162921 | SHELL STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME - A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point. | 06-28-2012 |
| 20120218715 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT - A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin. | 08-30-2012 |
| 20120281364 | CONDUCTING HEAT AWAY FROM A PRINTED CIRCUIT BOARD ASSEMBLY IN AN ENCLOSURE - A printed circuit board assembly (PCBA) is connected to a frame within a passage. The PCBA includes a circuitry package attached to a printed circuit board. The circuitry package has a peripheral edge extending from the printed circuit board to a distal end joined to a cap. A cover is attached to the frame to enclose the PCBA. A thermal interface material (TIM) is disposed between the cover and the PCBA, the TIM defining an opening sized to receivingly engage the circuitry package in a close mating engagement contacting the TIM simultaneously against the cap and the peripheral edge to conduct heat away from the circuitry package. A heat conductor attached to the other side of the printed circuit board in an overlapping opposition to the circuitry package conducts heat away from the printed circuit board that is generated by the circuitry package. | 11-08-2012 |
| 20120287578 | HEAT-DISSIPATING CASING FOR COMMUNICATION APPARATUS - A heat-dissipating casing for a communication apparatus accommodates a circuit board having a power element and includes an insulating case, a lid coupled to the insulating case, and a thermally conductive metal member. The insulating case has a receiving space, a first opening, and a second opening. The first and second openings communicate with the receiving space. The thermally conductive metal member is fixed to the inside of the insulating case, seals the second opening, and dissipates heat generated by the power element. The heat-dissipating casing is effective in dissipating heat, characterized by its low weight and low production costs, and conducive to protection and dust prevention. | 11-15-2012 |
| 20120293961 | LIGHTING APPARATUS - A lighting apparatus includes a light source, a power supply circuit supplying power to the light source, a heat radiating section made of electrical insulating material and radiating heat from the power supply circuit to outside air, and a heat conducting section conducting heat from the power supply circuit to the heat radiating section, and the heat radiating section and the heat conducting section are thermally connected. A weight reduction of the lighting apparatus is realized and a heat conduction from the heat conducting section to the heat radiating section is improved. | 11-22-2012 |
| 20130021754 | CIRCUIT BOARD DEVICE AND MANUFACTURING METHOD THEREOF AND POWER SUPPLY HAVING THE CIRCUIT BOARD DEVICE - A circuit board device includes a heat dissipation housing, a circuit board, and a heat conductive adhesive. The heat dissipation housing includes a panel, and at least one end plate connected to one end of the panel and formed with a retaining groove. The circuit board is disposed in the heat dissipation housing spaced apart from the panel and has one end inserted into the retaining groove. The heat conductive adhesive is adhered to the panel and the end plate, and covers the circuit board. | 01-24-2013 |
| 20130033823 | Electronic Control Unit - An electronic control unit includes a casing, a circuit board, and a thermally conductive member. The circuit board is housed in and fixed to the casing. A heating element is mounted on the circuit board. The thermally conductive member is arranged between the casing and heating element for thermal conduction therebetween. The casing includes an internal surface including a contact section in intimate contact with the thermally conductive member. The contact section includes a projecting portion projecting toward the thermally conductive member. The projecting portion is located out of an area of the circuit board, wherein the heating element is located in the area. The heating element is mounted on one side of the circuit board. The thermally conductive member is fixed to another side of the circuit board, and located to face the heating element via the circuit board. | 02-07-2013 |
| 20130058044 | ELECTRONIC CONTROL DEVICE - An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged to fix a peripheral portion of the circuit board to the case; and at least one second fixing unit that is arranged to fix a given area of the circuit board to the case while pressing the given area against the heat receiving portion through the heat generating part, the given area being an area where the heat generating part is placed. | 03-07-2013 |
| 20130077252 | ELECTRICAL CONNECTOR ASSEMBLY - The invention relates to an electrical connector assembly. The electrical connector assembly includes a main circuit board having a through hole, a processor, and an auxiliary circuit board. The processor includes a chip and a substrate. The chip is electrically connected to the substrate and located in the through hole. The substrate is at least partially located in the through hole. The auxiliary circuit board has a transitional connecting surface. A first conducting region and a second conducting region electrically connected to each other are disposed on the transitional connecting surface. The first conducting region is electrically connected to the substrate, and the second conducting region is electrically connected to the main circuit board. | 03-28-2013 |
| 20130094151 | Electrical Insulator Casing - Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment. | 04-18-2013 |
| 20130208425 | Electronic Device having a Housing Made of Profile Material - The disclosure relates to an electronic device comprising an insertion housing produced from a profile element having a closed cross-section and including a first opening and a second opening, a circuit board having at least one electronic component, and a first closure element. The first closure element is disposed at the first opening, and the first opening lies in a plane at an angle to a direction of insertion of the circuit board. | 08-15-2013 |
| 20130215575 | HEAT-DISSIPATION STRUCTURE FOR MOTOR CONTROLLER - A heat-dissipation structure for a motor controller. The heat-dissipation structure includes a control box, a circuit board, a plurality of radiators, and IGBT modules. The circuit board is installed in the control box. Each radiator includes a side plate and a heat dissipation block protruding from the side plate. The side plate is attached to an inner wall surface of the control box. The IGBT modules are installed on the heat dissipation block, and the pin terminals protruding from the IGBT modules are in electric or electronic connection with the circuit board. | 08-22-2013 |
| 20130250521 | ELECTRONIC CONTROL APPARATUS - An electronic control apparatus includes housing members, and a circuit board. At least one of the housing members is opposed to a heat-generating region which is heated by the heat-generating electronic component. A heat radiating portion of the housing member includes a convex portion protruding from an inner wall surface at a location opposed to the heat-generating region, and a concave portion opened to an outer wall surface at a location shifted from the convex portion in a thickness direction. The convex portion is close to the heat-generating region through a clearance. The concave portion has a lateral wall formed in a tapered shape such that an opening area of the concave portion is larger than a bottom area of the concave portion. A thickness of the heat radiating portion is smaller than a thickness of a region peripheral to the heat radiating portion in the housing member. | 09-26-2013 |
| 20130258601 | HEAT DISSIPATION APPARATUS FOR ELECTRONIC DEVICE - A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and plural of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing. | 10-03-2013 |
| 20130294031 | ROTARY ENCODER - A rotary encoder includes a rotary encoding unit attached to a rotary shaft which is rotatably held in a metal casing, a number-of-revolution detection unit supported by the metal casing for detecting a number of revolutions of the rotary encoding unit and producing heat, a cylindrical insulating resin cover having a base end attached to the metal casing for accommodating therein the rotary encoding unit and the number-of-revolution detection unit, a metal lid for blocking an opening of the other end of the insulating resin cover, and a shield cable electrically connected to the number-of-revolution detection unit and drawn out from a cable outlet of the metal lid. A shield of the shield cable is heat-transferably and electrically connected to the metal lid. | 11-07-2013 |
| 20130314876 | Electrical Device - An electrical device includes a printed-circuit board which is fitted with heat-generating components, the printed-circuit board being disposed in a housing of the device, the housing having a housing part, particularly a cup-shaped housing part, and a cooling plate connected to the printed-circuit board being pressed by a wedge against the inner wall of the housing part, in particular, being pressed such that heat from at least one heat-generating component, especially a power module having power semiconductor switches, is able to be dissipated at a contact surface to the housing part. | 11-28-2013 |
| 20130322021 | ELECTRICAL DEVICE - An electrical device has a housing that includes a main body and a lid both of which are electrically conductive. The lid is fastened to a top surface of a sidewall of the main body so as to cover the main body. On at least one of a bottom surface of the lid and the top surface of the sidewall of the main body, there are formed a plurality of protrusions at predetermined positions; each of the protrusions abuts against that one of the bottom surface of the lid and the top surface of the sidewall which is opposed to the protrusion. Except at those predetermined positions where the protrusions are formed, there is provided, between the bottom surface of the lid and the top surface of the sidewall of the main body, a gap via which the internal and external spaces of the housing communicate with each other. | 12-05-2013 |
| 20130342998 | Electronic Assembly with Detachable Components - An electronic assembly including a substrate, an electronic component, a fixture, and a housing. The substrate includes a first contact array. The electronic component includes a second contact array. The fixture includes an opening adapted to position the electronic component on the substrate and to connect the second contact array to the first contact array when the fixture is aligned at a first position on the substrate. The housing is adapted to hold the substrate populated with the electronic component. The housing includes a first conductive pathway adapted to connect from an external surface at the housing to the substrate in a serial continuous conductive path when the fixture is aligned at the first position on the substrate. The electronic assembly includes a sensing device connected to the continuous conductive path to detect the integrity of the electronic assembly. | 12-26-2013 |
| 20140002996 | Thermally Conductive Printed Circuit Board Bumpers | 01-02-2014 |
| 20140029203 | ELECTRONIC DEVICE ASSEMBLIES AND VEHICLES EMPLOYING DUAL PHASE CHANGE MATERIALS - Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state. | 01-30-2014 |
| 20140029204 | DISSIPATING HEAT WITHIN HOUSINGS FOR ELECTRICAL COMPONENTS - Embodiments of various electrical housings, particularly display housings, are provided. In this regard, a representative housing, among others, includes one or more electrical components that are disposed at the housing, a thermal attachment that is designed to transfer heat generated by the one or more electrical components; and a rear enclosure that is designed to engage the thermal attachment. The rear enclosure is further designed to dissipate the heat received from the thermal attachment. | 01-30-2014 |
| 20140126154 | Power Converter - A power converter includes an inverter in an inverter case, and a DC/DC converter in a converter case detachably fixed to the inverter case. The inverter includes power semiconductor modules, and the DC/DC converter includes a down-converter circuit and/or a boost converter circuit. The inverter case includes first and second path-forming members thermally contacting the converter case. In the first path-forming member, the power semiconductor module is inserted into a first coolant path. In the second path-forming member, the power semiconductor module inserted into the second coolant path, which is parallel to the first coolant path. The DC/DC converter includes an inductance device, and a switching device board on which a switching device con rolling electric current in the inductance device is mounted. The inductance and switching devices are in an area of the converter case thermally contacting first and second path forming members. | 05-08-2014 |
| 20140140010 | CURRENT CONVERTING DEVICE - A current converting device comprises a casing, a current converting module arranged in the casing, a buffer structure, and a heat dissipative structure abutting on at least half of an outer surface of the casing. The current converting module has a circuit board. The buffer structure has a first and a second buffer portions disposed on the inner surface of the casing and facing to each other. The circuit board has a thru hole, the second buffer portion passes through the thru hole and inserts into the first buffer portion, the first buffer and the second buffer portions surroundingly define a buffer space and a gap in communication with the buffer space. When the casing is pressed, the air in the buffer space flows out via the gap for reducing the relative speed between the first and the second buffer portions. | 05-22-2014 |
| 20140146478 | AUTOMATION DEVICE HAVING A HEATSINK - An automation device configured for an automation environment and for automating an industrial process includes a basic housing, a front hood, a primary heatsink for dissipating heat from a microprocessor, wherein the front hood is slottable onto the basic housing and assembles to form a closed housing which encloses the primary heatsink, the primary heatsink is rigidly connected to the basic housing on a bottom side of the basic housing via a locating bearing, the front hood includes a projecting retaining element on an inner side, a recess is arranged on a top side of the primary heatsink and into which the retaining element engages when the housing is closed, an elastic shaped element is arranged between the projecting retaining element and the recess, and the elastic shaped element absorbs oscillating forces of the primary heatsink in three spatial axes (x,y,z). | 05-29-2014 |
| 20140218870 | HEAT DISSIPATION DEVICE LOADING MECHANISMS - The present description relates to the field of microelectronic assemblies, wherein a heat dissipation device may be incorporated into the microelectronic assembly with a loading mechanism having at least one outrigger that is rotatable or pivotable between a first position and a second position to accommodate different heat dissipation device sizes or shapes. | 08-07-2014 |
| 20140233187 | HOUSING APPARATUS AND METHOD - A housing is described which is configured to dissipate heat from one or more heat sources within the housing and which comprises and inner layer and an outer layer. The outer layer comprises a material with a lower thermal conductivity than the inner layer. The outer layer is configured to have an overall thermal insulance of at least 2.5×10 | 08-21-2014 |
| 20140254102 | DIFFERENTIAL CARRIER ELECTRONICS PACKAGE - A differential carrier electronic package has a package housing that is made of upper and lower portions that are sealed together, where the upper portion has high thermal conductive properties and the lower portion has low thermal conductive properties. The upper and lower portions are in thermal contact with an environment that is external to a differential carrier housing. The lower portion extends through an opening in the differential housing, thereby further being in thermal contact with a fluid within the differential housing. The package housing further has an electronic circuit that is attached to and in thermal conduction with the upper portion, within the package housing. The lower portion may have a connector portion formed in it for electrically connecting between external electrical devices and sources, the electronic circuit, and control devices within the differential housing. | 09-11-2014 |
| 20140334105 | Integrated Electrical and Thermal Solution for Inverter DC-Link Capacitor Packaging - An improved capacitor packaging solution is presented that incorporates both thermal and electrical considerations. A package can include capacitor elements electrically coupled to a bus bar, and a thermally enhanced isolation layer between the bus bar and a case. The isolation layer can be provided adjacent a case base and sidewall portions. The bus bar can be disposed adjacent the isolation layer and be configured to extend along the package side and along the package length below the capacitor elements to provide an extended path for heat dissipation from the bus bar prior to its contact with capacitor elements. The enhanced isolation layer is configured to conduct heat away from the bus bar to the case to avoid the hotspot temperature of the capacitor. Reduced capacitor temperature allows use of smaller, cheaper capacitors, reducing inverter costs without compromising performance. | 11-13-2014 |
| 20140347819 | Electronics Module for a Vehicle - An electronics module for a vehicle includes a plate element, a circuit carrier element, and a cover element. The electronics module further includes an inner region and an outer region. The plate element is configured to provide at least one conductive connection between the inner region and the outer region in order to electrically connect the circuit carrier element. The circuit carrier element is positioned on the cover element, and at least one electrical connection element is positioned between the circuit carrier element and the plate element. The at least one electrical connection element is an automatic connection element which is configured to automatically provide an electrically conductive connection between the circuit carrier element and the conductive connection of the plate element when the cover element and the plate element are fitted. | 11-27-2014 |
| 20150009630 | ELECTRONIC SIGNAL TRANSMITTING DEVICE AND INTEGRATED CIRCUIT THEREOF - An electronic signal transmitting device is disposed in a housing of an integrated circuit. The integrated circuit includes at least one first signal end and at least one second signal end. The electronic signal transmitting device includes at least one electromagnetic transmitting unit, coupled between the first signal end and the second signal end for transmitting an electronic signal between the first signal end and the second signal end; and an electromagnetic insulating layer covering the electromagnetic transmitting unit for protecting the integrated circuit from electromagnetic interference. | 01-08-2015 |
| 20150016063 | Power Semiconductor Module - Reliability of power semiconductor modules that excel in cooling performance is to be improved. | 01-15-2015 |
| 20150029670 | SN-CU-BASED LEAD-FREE SOLDER ALLOY - Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn. | 01-29-2015 |
| 20150036295 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING FOR SAME - An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device. | 02-05-2015 |
| 20150049438 | ELECTRONIC DEVICE COOLING SYSTEMS - An electronic device includes: a housing having one or more interior surfaces; an electronic circuit that is disposed within the housing, that does not directly contact any of the one or more interior surfaces of the housing, and that includes at least one electrical component that consumes electrical power; and a thermally conductive material that surrounds the electronic circuit within the housing, that directly contacts both the at least one electrical component and the one or more interior surfaces of the housing, that absorbs heat from the at least one electrical component, and that transfers heat to the housing. | 02-19-2015 |
| 20150098192 | MOTOR CONTROL DEVICE - An illustrative example motor control device includes a printed circuit board including electronics for motor control. At least one connector is associated with the electronics. The connector is configured for communicating at least one of control signals or power to a motor. A housing includes a first portion configured to receive the printed circuit board and cover over a first side of the printed circuit board. A second portion of the housing is configured to provide access to the at least one connector from outside of the housing. The second portion of the housing inhibits exposure of the printed circuit board to outside contaminants. A third portion of the housing is configured to cover over a second side of the printed circuit board. At least one heat transfer element on at least one of the housing or the printed circuit board facilitates heat transfer from the printed circuit board to the housing. | 04-09-2015 |
| 20150301568 | Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader - Example embodiments of the present disclosure generally relate to thermal solutions and methods for dissipating or removing heat from electronic devices using the same side of an anisotropic heat spreader. In an example embodiment, a thermal solution generally includes a heat removal structure and an anisotropic heat spreader. The anisotropic heat spreader is configured such that the heat removal structure and the heat source are in thermal contact with a same side of the anisotropic heat spreader and such that a thermally-conductive heat path is provided along that same side of the anisotropic heat spreader from the heat source to the heat removal structure. Heat from the heat source may be transferrable to the same side of the anisotropic heat spreader from which heat is also transferrable to the heat removal structure. | 10-22-2015 |
| 20150327402 | HEAT MANAGEMENT FOR ELECTRONIC ENCLOSURES - An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure. | 11-12-2015 |
| 20160021789 | ELECTRONIC CONTROL APPARATUS AND METHOD FOR CONNECTING SUBSTRATE OF ELECTRONIC CONTROL APPARATUS - In a configuration that a thermal grease is applied between a circuit board having an electronic component mounted thereon and a case body containing the board to thermally connect both by the thermal grease, the application has not been easy since the thermal grease is high in initial viscosity. | 01-21-2016 |
| 20160044825 | ENCLOSURE FOR AN ELECTRONIC ASSEMBLY FOR A BATTERY POWERED LAWN MOWER - An enclosure includes a housing defining an interior chamber for receiving an electronic assembly. The housing is made of a thermally conductive material so as to operate as a heat sink. The housing has a heat transfer surface within the interior chamber for receiving heat generating components thereon, and an interior groove within the interior chamber. The enclosure also includes a retaining clip having a clip length, a first portion extending along the clip length for engaging the interior groove, and a second portion extending along the clip length for engaging the heat generating components. The retaining clip is made from a resilient material and is sized and shaped such that positioning the first portion in the interior groove flexes the retaining clip and presses the second portion against the heat generating components so as to bias the heat generating components into thermal contact with the heat transfer surface. | 02-11-2016 |
| 20160088771 | ELECTRICAL DEVICE - An electrical device includes a printed-circuit board which is fitted with heat-generating components, the printed-circuit board being disposed in a housing of the device, the housing having a housing part, particularly a cup-shaped housing part, and a cooling plate connected to the printed-circuit board being pressed by a wedge against the inner wall of the housing part, in particular, being pressed such that heat from at least one heat-generating component, especially a power module having power semiconductor switches, is able to be dissipated at a contact surface to the housing part. | 03-24-2016 |
| 20160100505 | DEVICE WITH HEAT TRANSFER PORTION - A subsea electronic device ( | 04-07-2016 |
| 20160135336 | EMI SHIELDING STRUCTURE FOR ELECTRONIC COMPONENTS - An EMI shielding structure for electronic components includes a cover body for enclosing and shielding at least one electronic component. The cover body includes a top section defining a chamber. A working fluid is contained in the chamber. At least one capillary structure is disposed in the chamber. One side of the top section faces the electronic component and is in contact with a top face of the electronic component. The EMI shielding structure can prevent the electronic component from electromagnetic wave interference. Also, the EMI shielding structure can enhance the heat dissipation efficiency for the electronic component. | 05-12-2016 |
| 20160150671 | Subsea Unit With Cooling Of Electronic Devices - A subsea unit with an external housing, a passive pressure compensator arranged to reduce a pressure difference between ambient subsea pressure and pressure inside the external housing, a dielectric liquid for counteracting deformation of the external housing, an electronic device, and an electrical insulator which is thermally conductive and arranged between an internal surface of the external housing and the electronic device. The electronic device is in thermal and electrical connection with the electrical insulator, and the electrical insulator is arranged to transfer heat from the electronic device to the external housing. | 05-26-2016 |
| 20160150683 | DISPLAY ENCLOSURE - A display enclosure having a thermal management system may include a display enclosure sized and configured to receive a display device in an interior of the display enclosure. The display enclosure may include a thermoelectric module having a first portion and a second portion. The first portion is positioned within the interior of the display enclosure and may heat or cool the interior of the display enclosure. The second portion is coupled to a portion of the display enclosure exposed to an external environment to dissipate heat or cool to the external environment. A thermal controller electrically may be coupled to the thermoelectric module and operable to control the heating or cooling of the first portion of thermoelectric module. | 05-26-2016 |
| 20170238435 | WATERPROOF ELECTRONIC EQUIPMENT UNIT | 08-17-2017 |
