| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361705000 | By specific coating | 55 |
| 20080198553 | ELECTRONIC COMPONENT AND RADIATING MEMBER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE COMPONENT AND MEMBER - A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member, and a part of the recessed metallic member into a solid solution. | 08-21-2008 |
| 20080225490 | Thermal interface materials - In one embodiment, an apparatus comprises a semiconductor device a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises an alloy having a low indium content. | 09-18-2008 |
| 20080298021 | Notebook computer with hybrid diamond heat spreader - Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon has a thermal conductivity greater than a first pre-determined value and a specific heat greater than a second pre-determined value. | 12-04-2008 |
| 20080304238 | ELECTRONIC DEVICE HAVING PASSIVE HEAT-DISSIPATING MECHANISM - The present invention relates to an electronic device having a passive heat-dissipating mechanism. The electronic device includes a circuit board and a radiation enhancement layer. The circuit board has at least an electronic component thereon. The radiation enhancement layer is attached onto at least a portion of a surface of the electronic component for facilitating radiating the heat from the electronic component to the ambient air via natural convection. The radiation enhancement layer is made of a ceramic material. | 12-11-2008 |
| 20090009973 | Nanotube-Based Fluid Interface Material and Approach - A thermal interface material ( | 01-08-2009 |
| 20090040727 | Circuit Carrier Structure with Improved Heat Dissipation - A circuit carrier structure has at least one electronic component and is formed using SMD technology. Underneath the at least one electronic component is arranged a continuous recess in a circuit carrier. A die made of a heat-conducting material is inserted with one end of a joining area into the recess and fixed in place with a layer of heat-conducting cement and connected to the component in a heat-conducting manner. Further the die has on its other side a linkage area, whose cross-sectional area is at least in part of larger dimensions than the recess in the circuit carrier and whose end is connected to a heat sink in a heat-conducting manner. | 02-12-2009 |
| 20090122490 | Heat Sink Having Enhanced Heat Dissipation Capacity - A heat sink includes a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer. Thus, the heat produced by a heat source is conducted quickly and distributed evenly on the metallic heat conducting layer to form an evenly heat conducting effect, while the hollow receiving space has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer to the non-metallic heatsink layer which produces a heatsink effect to dissipate the heat so that the heat is dissipated quickly by provision of the metallic heat conducting layer, the hollow receiving space and the non-metallic heatsink layer. | 05-14-2009 |
| 20090296349 | COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME - According to one embodiment, a component-embedded printed circuit board includes an opening for member fixation provided on part of a peripheral edge of an outer layer side of the first substrate, a metal member for heat radiation laminated to outer layer side, except for the opening for member fixation, of the first substrate with an insulating layer therebetween, a through-hole penetrating the first and second substrates and communicating with the opening for member fixation, and a through-hole conductor provided on an internal wall of the through-hole. | 12-03-2009 |
| 20100020497 | SUBSTRATE STRUCTURE - It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure | 01-28-2010 |
| 20100085713 | LATERAL GRAPHENE HEAT SPREADERS FOR ELECTRONIC AND OPTOELECTRONIC DEVICES AND CIRCUITS - A device and associated method of heat removal from electronic optoelectronic and photonic devices via incorporation of extremely high thermally conducting channels or embedded layers made of single-layer graphene (SLG), bi-layer graphene (BLG), or few-layer graphene (FLG). | 04-08-2010 |
| 20100124023 | METHOD FOR PLATING FILM ON A HEAT DISSIPATION MODULE - A method for plating film on a heat dissipation module includes the steps of: cleaning the heat dissipation module; injecting hydrogen and tetra-methylsilane gases and applying an electric current to generate a bias electric field within a working chamber, thereby plating an adherent film on the heat dissipation module; injecting hydrocarbon gas together with the hydrogen and tetra-methylisilane gases into the working chamber, thereby plating a mixed film on the adherent film; and injecting the hydrogen and tetra-methylisilane gases together with hydrocarbon gas into the working chamber, thereby plating a noncrystalline DLC film on the mixed film. | 05-20-2010 |
| 20100124024 | ELECTRONIC SUBSTRATE DEVICE - This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate. An electronic substrate device according to the present invention, in which a base member ( | 05-20-2010 |
| 20100246133 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL - Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip. | 09-30-2010 |
| 20100254092 | DEVICE AND METHOD FOR MITIGATING RADIO FREQUENCY INTERFERENCE - Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss tangent parameter of the thermal energy storage material, the REI of the electronic device is reduced. | 10-07-2010 |
| 20100296253 | METHOD OF FORMING CARBON PARTICLE-CONTAINING FILM, HEAT TRANSFER MEMBER, POWER MODULE, AND VEHICLE INVERTER - A method of depositing a carbon particle-containing film that contains carbon particles includes: manufacturing film deposition slurry by mixing liquid into film deposition powder that contains carbon powder formed of the carbon particles; and depositing the carbon particle-containing film by spraying the film deposition slurry to a surface of a base material so that the liquid is vaporized. | 11-25-2010 |
| 20100309631 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES - According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material. | 12-09-2010 |
| 20110063801 | ELECTRONIC DEVICE WITH A HEAT INSULATING STRUCTURE - An electronic device includes a circuit board and a heat insulating structure. The heat insulating structure includes a heat source, an enclosure for covering the heat source, and a heat insulating plate disposed on a side of the enclosure facing to the heat source for preventing heat generated by the heat source from directly transmitting toward the enclosure, and a space being formed between the heat insulating plate and the enclosure. The heat insulating structure further includes a thermal conductive layer disposed on a side of the heat insulating plate facing to the heat source. The heat insulating structure further includes the thermal conductive layer disposed on a side of the heat insulating plate facing to the enclosure. Therefore, the heat insulating plate can be for altering heat current generated by the heat source so as to dissipate the heat current via holes on the enclosure uniformly. | 03-17-2011 |
| 20110176276 | CTE-MATCHED HEAT PIPE - Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices. | 07-21-2011 |
| 20110188206 | THERMAL INTERFACE - Various embodiments include apparatus and method having a heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface includes nanostructures to facilitate heat transfer and adhesion between the heat source and the thermal management device. | 08-04-2011 |
| 20110194254 | POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS - Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices. | 08-11-2011 |
| 20110228481 | THERMALLY CONDUCTIVE INTERFACE MEANS - A highly thermally conductive interface means comprises a plurality of non-particulate solid components and a liquid bonding paste. The non-particulate solid components are made of high heat-conducting materials and dispersedly disposed on interfaces between heat sources and heat sinks. The liquid bonding paste is applied on interfaces between heat sources and heat sinks and filled into gaps formed among each of said non-particulate solid components so that the heat sources, heat sinks and each of said non-particulate solid components are bonded together. | 09-22-2011 |
| 20110228482 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL - Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip. | 09-22-2011 |
| 20110242764 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES - According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer. | 10-06-2011 |
| 20120106085 | VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING VACUUM SEALED PACKAGE - A vacuum sealed package includes a package main body portion in which a first main body portion and a second main body portion are bonded via a hollow portion, and a getter material and an electronic device that are provided within the hollow portion, and in the state of the hollow portion being evacuated via a through-hole that brings the inside and the outside of the hollow portion into communication, the package main body portion is sealed with a sealing member, the getter material and the electronic device are connected to a first conductor pad and a second conductor pad, the first conductor pad is connected with a third conductor pad via a thermally conductive material, and the second conductor pad is electrically connected with a fourth conductor pad on a wiring substrate. | 05-03-2012 |
| 20120195004 | Porous Thermoplastic Foams as Heat Transfer Materials - Interconnected, open-celled porous or microporous polymeric foams are used for the preparation of heat transfer devices. The use of such porous polymeric foams can generate a turbulent flow within a heat exchanging liquid, thus enabling increased heat transfer to and from the fluid. The present disclosure provides devices having a heat transfer element containing a heat exchange region wherein a heat exchange fluid can be circulated through a porous polymeric foam; and method for making and using such devices. | 08-02-2012 |
| 20130077249 | OVERMOLDED IN-LINE PHOTOVOLTAIC CURRENT REGULATING AND HEAT SINK DEVICE - An overmolded in-line photovoltaic current regulating and heat sink device includes one or more diode elements connected at one or more leads to coils of electrically conductive material. The coils serve a dual purpose; they act as heat sinks to draw heat away from the diode and conduct it to the outside environment; and they act as inductor coils to regulate current through the device. These coils can either be of air core or ferromagnetic core construction. On the opposite end of the diode leads, the coils are connected to either a wire lead protruding from the device or a terminal housed in a connector. The entire assembly is encapsulated in a thermoplastic, thermoset, or combination thereof that maintains intimate thermal contact with the diode and coils. The device may include one or more fuse elements in place of, or in addition to, the one or more diode elements. | 03-28-2013 |
| 20130128462 | AMORPHOUS DIAMOND-LIKE CARBON COATINGS FOR INCREASING THE THERMAL CONDUCTIVITY OF STRUCTURAL FRAMES IN PORTABLE ELECTRONIC DEVICES - The disclosed embodiments provide a component for a portable electronic device. The component includes a structural frame within the portable electronic device and an amorphous diamond-like carbon (DLC) coating deposited on the surfaces and the edges of the structural frame, wherein the amorphous DLC coating increases a thermal conductivity of the structural frame. | 05-23-2013 |
| 20130148303 | ADHESIVE, THERMALLY CONDUCTIVE, ELECTRICAL INSULATORS - According to various aspects, exemplary embodiments are disclosed of adhesive, thermally conductive electrically insulators. In an exemplary embodiment, a thermally conductive, electrically insulating material includes 4 to 40 parts by weight of a macromolecular matrix material; 1 to 20 parts by weight of an adhesive additive; and 40 to 85 parts by weight of thermally conductive electrically insulating particles. The adhesive additive includes a reactive group that is the same as or similar to at least one curable active group in the macromolecular matrix material. | 06-13-2013 |
| 20130163205 | HEAT-DISSIPATION STRUCTURE AND ELECTRONIC DEVICE USING THE SAME - A heat-dissipation structure includes a first carbon nanotube layer and a metal mesh layer. The first carbon nanotube layer and the metal mesh layer are stacked on each other. The first carbon nanotube layer includes at least one first carbon nanotube paper. An electronic device applying the heat-dissipation structure is also disclosed. | 06-27-2013 |
| 20130265721 | Thermal Interface Materials with Thin Film or Metallization - According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material. | 10-10-2013 |
| 20130271920 | HEAT DISSIPATION FEATURES, ELECTRONIC DEVICES INCORPORATING HEAT DISSIPATION FEATURES, AND METHODS OF MAKING HEAT DISSIPATION FEATURES - Electronic devices incorporating a heat dissipation feature include an enclosure, and at least one heat-generating component positioned within the enclosure. The heat dissipation feature is sufficiently coupled to the at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component. The heat dissipation feature includes a plurality of protrusions exposed externally to the enclosure. A thermally insulating material may be disposed on at least a tip portion of at least some of the protrusions. The thermally insulating material is selected to provide a touch temperature that is below a predetermined threshold. In some instances, the thermally insulating material can provide such a touch temperature by selecting the material to include properties for thermal conductivity (k), density (ρ), and specific heat (C | 10-17-2013 |
| 20140063742 | Thermally Enhanced Electronic Component Packages with Through Mold Vias - Systems and methods for thermally enhanced electronic component packaging with through mold vias are described. In some embodiments, a method may include forming one or more vias through an encapsulant with a laser, each of the one or more vias having one end proximal a top surface of an electronic component covered by the encapsulant and another end proximal an outer surface of the encapsulant. The method may also include inserting a thermally conductive material into the one or more vias, providing a heat spreader over the outer surface of the encapsulant, the heat spreader thermally coupled to the thermally conductive material, and reflowing the thermally conductive material. | 03-06-2014 |
| 20140092560 | FORCE AND HEAT SPREADING PCB FOR LCD PROTECTION AND INTERCONNECTION - The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed circuit board (PCB) in lieu of a metal backer heat can be evenly spread across the backer by applying a layer of copper configured to normalize a spread of heat across the printed circuit board. The configuration of the copper layer can be configured based on a tested or simulated heat map that accounts for proximate heat producing elements. The PCB can also advantageously act as an interconnection layer between other electrical components disposed within the electronic device. | 04-03-2014 |
| 20140140008 | HEAT DISSIPATION MATERIAL AND METHOD OF MANUFACTURING THEREOF, AND ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF - A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects. | 05-22-2014 |
| 20140146477 | HYBRID SHEET MATERIALS AND METHODS OF PRODUCING SAME - A hybrid sheet material includes an EMI absorption layer bonded to a thermal absorption layer. The EMI absorption layer may include a homogeneous mixture of a binder, silicon, and at least one metal. The thermal absorption layer may include a homogeneous mixture of a graphite material and a binder. According to a further aspect, a mobile device that includes a hybrid sheet material is provided. Other aspects include methods for producing the hybrid sheet material. | 05-29-2014 |
| 20140168898 | HEAT DISSIPATION ELEMENT AND COMMUNICATION DEVICE USING THE SAME - The present invention relates to a heat dissipation element and a communication device using the same. The heat dissipation element comprises a ceramic powder sintered layer and a thermal conductive metal layer. The ceramic powder sintered layer has a plurality of voids. Partial material of the thermal conductive metal layer is formed in the voids of the ceramic powder sintered layer. | 06-19-2014 |
| 20140218868 | CIRCUIT BOARD SYSTEM COMPRISING A COOLING ARRANGEMENT - A circuit board system includes a circuit board ( | 08-07-2014 |
| 20140247560 | SYSTEM AND METHOD TO FACILITATE THERMAL TRANSFER FOR MOTOR DRIVE FEATURES USING DIAMOND LIKE CARBON COATING - The present disclosure includes a motor drive that includes a rectifier module, an inverter module, drive circuitry, and a heat dissipation feature. The heat dissipation feature is at least partially coated with a diamond-like carbon material in accordance with present embodiments. The diamond-like carbon material is configured to cooperate with the heat dissipation feature placement to dissipate heat from the rectifier module, the inverter module, or the drive circuitry. | 09-04-2014 |
| 20150098191 | Silicon Heat-Dissipation Package For Compact Electronic Devices - Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween. | 04-09-2015 |
| 20160029476 | Circuit Boards With Thermal Control and Methods for Their Design - Circuit boards and computer-implemented methods for designing circuit boards are disclosed. In one embodiment, a method of designing a circuit board having an insulator substrate includes determining, by a computer, a plurality of thermal conductor traces that is arranged to direct heat flux generated by a heat generating component away from a temperature sensitive component, and determining a plurality of electrical connection traces based on an input schematic. At least a portion of the plurality of electrical connection traces incorporate at least a portion of the plurality of thermal conductor traces to define a conductive trace pattern that electrically connects pins of two or more components located on the substrate. The conductive trace pattern includes the plurality of thermal conductor traces and the plurality of electrical connection traces. Disruption of the plurality of thermal conductor traces is avoided while determining the plurality of electrical connection traces. | 01-28-2016 |
| 20160081226 | HEAT DISSIPATION STRUCTURE FOR MOBILE DEVICE - A heat dissipation structure for mobile device includes an element holding member internally defining a first receiving space, in which a plurality of electronic elements of a mobile device is mounted; and a heat dissipation layer formed on at least one side of each of the electronic elements. The heat dissipation layer is formed on one side of each of the electronic elements through a micro arc oxidation (MAO) process, a plasma electrolytic oxidation (PEO) process, an anodic spark deposition (ASD) process, or an anodic oxidation by spark deposition (ANOF) process. Therefore, heat produced by the electronic elements in the mobile device can be quickly removed away from the electronic elements via the heat dissipation layer. | 03-17-2016 |
| 20160095198 | CIRCUIT BOARD INCLUDING HEAT DISSIPATION STRUCTURE - Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part. | 03-31-2016 |
| 20160157334 | HEAT DISSIPATING STRUCTURE | 06-02-2016 |
| 20170238411 | CIRCUIT ASSEMBLY AND METHOD FOR MANUFACTURING CIRCUIT ASSEMBLY | 08-17-2017 |
| 20190144729 | TOPOLOGICAL INSULATOR TUBES APPLIED TO SIGNAL TRANSMISSION SYSTEMS | 05-16-2019 |
| 20190150315 | TOPOLOGICAL INSULATOR THERMAL MANAGEMENT SYSTEMS | 05-16-2019 |
| 361706000 | Containing silicon or aluminum | 9 |
| 20090116193 | STRUCTURE AND MANUFACTURING METHOD OF SUBSTRATE BOARD - A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an arrangement surface and a heat-dissipating surface; executing an anodic treatment on the arrangement surface and the heat-dissipating surface to respectively form a first anodic treatment layer and a second anodic treatment layer; forming a heat conduction and electrical isolation layer on the second anodic treatment layer; and forming a diamond like carbon (DLC) layer on the heat conduction and electrical isolation layer. The heat expansion coefficient of the substrate layer is greater than that of the second anodic treatment layer, the heat conduction and electrical isolation layer, and the DLC layer in turn. | 05-07-2009 |
| 20090262503 | Control Device - A control device as a module comprises a control board, a sub-module and a housing cover. A microcomputer is mounted on the control board. The sub-module has a sub-module case provided with a wiring layer into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts. | 10-22-2009 |
| 20100302736 | HEAT RADIATION STRUCTURE OF ELECTRIC APPARATUS - A heat radiation structure of an electric apparatus provided herein is capable of readily releasing heat of electronic components to the outside and suppressing heat conduction to a rotational position sensor. A metal electromagnetic wave shielding member is fixed to a casing body of a casing. The electromagnetic wave shielding member includes a first portion that is connected to an opposed wall portion of the casing body to face a circuit substrate and a cylindrical second portion that is extending from a peripheral end of the first portion and along a peripheral wall portion of the casing body without being in contact with a housing. A heat conductive member having electrical insulating and heat conductivity properties as well as flexibility is disposed between the circuit substrate and the electromagnetic wave shielding member to closely contact both of the plurality of electronic components and the first portion of the electromagnetic wave shielding member. | 12-02-2010 |
| 20110096505 | PACKAGE SUBSTRATE - A package substrate includes a circuit board, an electronic component, an electromagnetic shield cover, and a heat conducting member. The electronic component is disposed on the circuit board. The electromagnetic shield cover is fixedly coupled to the circuit board. The electromagnetic shield cover houses the electronic component within an inside space defined between the electromagnetic shield cover and the circuit board. The heat conducting member is disposed between the electronic component and the electromagnetic shield cover within the inside space. The heat conducting member contacts both of the electronic component and the electromagnetic shield cover such that the heat conducting member establishes a thermal connection between the electronic component and the electromagnetic shield cover. | 04-28-2011 |
| 20110255246 | METHOD FOR MANUFACTURING A RIGID POWER MODULE SUITED FOR HIGH-VOLTAGE APPLICATIONS - Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps:
| 10-20-2011 |
| 20130258599 | CONDUCTION COOLING OF MULTI-CHANNEL FLIP CHIP BASED PANEL ARRAY CIRCUITS - A method of forming a heat-dissipating structure for semiconductor circuits is provided. First and second semiconductor integrated circuit (IC) chips are provided, where the first and second semiconductor chips each have first and second opposing sides, wherein the first and second semiconductor IC chips are configured to be fixedly attached to a top surface of a substantially planar circuit board along their respective first sides. The respective second opposing sides of each of the first and second semiconductor IC chips are coupled to first and second respective portions of a sacrificial thermal spreader material, the sacrificial thermal spreader material comprising a material that is thermally conductive. The first and second portions of the sacrificial thermal spreader material are planarized to substantially equalize a respective first height of the first semiconductor chip and a respective second height of the second semiconductor chip. | 10-03-2013 |
| 20140313673 | ELECTRONIC DEVICE - A structure for efficiently transferring heat generated from an electronic part or the like to a heat dissipation member is provided. A bus bar is used for a wiring pattern in an electronic device ( | 10-23-2014 |
| 20160021788 | ELECTRONIC DEVICE ASSEMBLY - An electronic device assembly includes a heat sink coupled to an electronic device to dissipate the heat produced by the electronic device. A heat spreader is coupled between the electronic device and the heat sink to transfer heat from the electronic device to the heat sink. Furthermore, at least one of the electronic device, the heat spreader, and the heat sink is disposed with a disordered carbon coating. | 01-21-2016 |
| 20160135332 | THERMAL SPREADING FOR AN EXTERNALLY PLUGGABLE ELECTRONIC MODULE - A cooling apparatus for dissipating heat from an electronic module is disclosed. The cooling apparatus may include a thermally conductive shell having a surface in contact with, and configured to conduct heat away from, the module. The apparatus may also include an electrically insulative layer positioned between, and configured to conduct heat from, the module to the shell. The apparatus may also include an electrical cord, attached to the module that contains a thermally conductive layer in thermally conductive contact with the shell that is configured to conduct heat away from the shell. The apparatus may also include an electrically insulative layer between the thermally conductive layer and an electrical conductor within the electrical cord. The apparatus may also include an electrically insulative layer, positioned between the thermally conductive layer and an electrical cord outer surface, configured to convectively dissipate heat from the thermally conductive layer. | 05-12-2016 |
