Entries |
Document | Title | Date |
20080198550 | HEAT SINK MODULE FOR DUAL HEAT SOURCES - A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements. | 08-21-2008 |
20080205003 | Redundant Cooling Systems And Methods - Redundant cooling systems and methods are disclosed. In an exemplary embodiment, a method for redundant cooling system of computer systems and other electronics may comprise thermally connecting a cooling fluid to one or more heat-generating components to absorb heat from the heat-generating components during operation. The method may also comprise thermally connecting the cooling fluid to a primary coolant and a secondary coolant. The method may also comprise exchanging heat between the cooling fluid and the primary coolant or the secondary coolant to remove heat from the cooling fluid even if one of the cooling sources is unavailable. | 08-28-2008 |
20080266800 | HEAT SINK WITH SURFACE-FORMED VAPOR CHAMBER BASE - A heat sink comprises a vapor chamber base formed in a three-dimensional arrangement that mirrors topology of underlying structures on a substrate upon which the heat sink can be mounted, and at least one fin coupled to the vapor chamber base. | 10-30-2008 |
20080266801 | Phase change cooled power electronic module - A power electronic module is cooled by a phase change heat spreader or cooling device. The module may include switched or unswitched devices, such as power transistors, diodes, and so forth, forming circuits such as rectifiers, inverters, converters, or the like, or portions of such circuits. Heat is transferred to the heat spreader in which a continuous phase change cycle takes place to cool the circuit components. The heat spreader may extend over an area sufficient to reduce the temperature of the components, and ultimately will render portions of the overall structure more isothermal. | 10-30-2008 |
20080266802 | Phase change cooled electrical connections for power electronic devices - A technique is disclosed for cooling connections points in power electronic circuits, such as points at which wire bonding connections are made. A phase change heat spreader is thermally coupled at or near the connection point and a continuous phase change takes place in the heat spreader to extract heat from the connection point during operation. The heat spreader may extend over a area larger than the connection point to enhance cooling and to dissipate heat over a larger area. Small, specifically directed applications are possible in which specific points are cooled together or individually. | 10-30-2008 |
20080266803 | Phase change cooled electrical bus structure - A technique for cooling electrical bus structures is disclosed, in which a phase change heat spreader is thermally coupled to the bus. A continuous phase change cycle occurs within the heat spreader to draw heat from the bus during operation. The heat spreader may be planar, and extend over an area greater then the surface area of the bus to enhance cooling and to render the overall assembly more isothermal. The heat spreader may be placed near bus joints and circuits to remove heat caused by increased resistance at such locations. | 10-30-2008 |
20080291629 | Liquid-cooled portable computer - Embodiments of a computer system are described. This computer system includes a power source that is coupled to a heat pipe, where the power source includes an integrated circuit. This heat pipe may contain a liquid coolant that has a density greater than a first pre-determined value at room temperature. A pump is coupled to the heat pipe is configured to circulate the liquid coolant through the heat pipe. Furthermore, a heat exchanger coupled to the heat pipe is configured to transfer heat from the heat pipe to an environment external to the computer system. | 11-27-2008 |
20080291630 | METHOD AND APPARATUS FOR COOLING COMPUTER MEMORY - A method and apparatus for cooling chips on a computer memory module. The apparatus includes a primary and secondary heat spreaders, at least a first heatpipe coupled to the primary heat spreader and having a remote portion spaced apart from the primary heat spreader and thermally contacting the secondary heat spreader, and a coolant within the first heatpipe and the primary heat spreader so as to absorb heat from the primary heat spreader and conduct the heat to the secondary heat spreader. The primary heat spreader has at least two panels configured to engage the memory module therebetween, with facing contact surfaces of the panels adapted for thermal contact with the module chips. The secondary heat spreader is configured to increase surface dissipation of heat from the first heatpipe into the environment. The coolant has a boiling point at or below a maximum preselected operating temperature of the module chips. | 11-27-2008 |
20080310111 | TRANSPIRATION COOLING FOR PASSIVE COOLED ULTRA MOBILE PERSONAL COMPUTER - In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. Other embodiments are also disclosed and claimed. | 12-18-2008 |
20080316707 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device includes a base ( | 12-25-2008 |
20090002947 | Evaporative cooling system for electronic components - An apparatus for cooling a number of electronic components comprises an enclosure within which the components are positioned, an arrangement for circulating a cooling fluid to the components so that the cooling fluid can evaporate on or proximate the components and thereby absorb the heat generated by the components, a mechanism for condensing the evaporated cooling fluid, and a reservoir which is in fluid communication with the circulating means and within which the condensed cooling fluid collects. | 01-01-2009 |
20090009969 | HEAT-DISSIPATING CASING STRUCTURE - A heat-dissipating casing structure includes a base seat, a heat-dissipating module, and a casing. The heat-dissipating module is disposed on the base seat. The heat-dissipating module has a first heat-conducting block and a heat pipe, and one side of the heat pipe connects to the first heat-conducting block. The casing has an installed portion, and the casing is slidably assembled on the base seat for connecting the other side of the heat pipe with the casing via the installed portion. When the casing is slidably assembled on the base seat, the heat pipe is connected with the casing via the installed portion. Hence, the heat-dissipating module is assembled and replaced easily and rapidly. Moreover, the heat from a heat-generating element on the base seat is transmitted to the casing through the heat pipe for increasing heat-dissipating efficiency. | 01-08-2009 |
20090016022 | SEMICONDUCTOR MODULE - A semiconductor module includes a base plate, a circuit substrate coupled to a side face of the base plate, a first semiconductor package mounted on the circuit substrate and a radiation channel portion inside the base plate. The radiation channel portion includes at least one heat pipe containing a working fluid. The at least one heat pipe containing the working fluid is configured to transfer heat generated by the first semiconductor package. Thus, the radiation channel portion may provide an efficient and reliable semiconductor module having improved heat transfer and radiation performance. | 01-15-2009 |
20090034194 | MINIATURIZED LIQUID COOLING DEVICE - A miniaturized liquid cooling device ( | 02-05-2009 |
20090034195 | HEAT-DISSIPATING MODULE - A heat-dissipating module dissipating heat generated by a heat-generating element includes a plurality of fins, a fan generating an air current and a heat pipe. Each fin has a first edge facing the fan and a second edge facing the fan. The first edges are located on a first surface. The second edges are located on a second surface not coinciding with the first surface. The air current passing through the first and second surfaces passes by the fins. A first end of the heat pipe is thermally coupled to the heat-generating element. A second end of the heat pipe is thermally coupled to the fins. | 02-05-2009 |
20090040725 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat dissipation unit attached to a top surface of the electronic component of an add-on card and defining a channel therein, a heat pipe, and a second heat dissipation unit. The second heat dissipation unit includes a first portion located at a lateral side of the add-on card, a second portion extending from the first portion to a bottom side of the add-on card, and a joint portion formed between the first portion and the second portion and located at the lateral side of the add-on card. The heat pipe includes an evaporating portion received in the channel of the first heat dissipation unit, and a condensing portion extended through the second heat dissipation unit at the joint portion. | 02-12-2009 |
20090040726 | Vapor chamber structure and method for manufacturing the same - A vapor chamber structure includes a casing, a working fluid, a wick layer, a plurality of structure strengthening bodies, and a plurality of backflow accelerating bodies. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. The structure strengthening bodies are respectively arranged in the airtight vacuum chamber for supporting the casing. The backflow accelerating bodies are respectively arranged in the airtight vacuum chamber for increasing the backflow velocity of the working fluid. Therefore, the present invention can maintain the completeness of the vapor chamber structure and increase the backflow velocity of the working fluid due to the match of the structure strengthening bodies and backflow accelerating bodies. Because the backflow velocity of the working fluid is increased, the heat-transmitting efficiency is increased. | 02-12-2009 |
20090059526 | HEAT SINK ASSEMBLY AND METHOD MANUFACTURING THE SAME - A heat sink assembly includes a base plate, a fin group and a heat pipe thermally connecting the base plate with the fin group. The fin group includes a plurality of fins. The heat pipe includes a straight evaporating section contacting with the base plate, a first condensing section extending upwardly from an end of the evaporating section and through the fins, a second condensing section bent downwardly from a free end of the first condensing section and through the fins, and a third condensing section extending upwardly from an opposite end of the evaporating section and through the fins. Periphery walls of at least two of the first, second and third condensing sections substantially totally contact with the fins to increase a contact area between the heat pipe and the fins. | 03-05-2009 |
20090059527 | Heat dissipating device - A heat dissipating device includes a sealed container having hollow floors and floor-spacing assemblies. Each floor-spacing assembly includes hollow spacing walls. Each hollow spacing wall extends from a respective hollow floor and is spaced apart from an adjacent one of the hollow spacing walls of an adjacent one of the floor-spacing assemblies by an air gap. Each two adjacent ones of the hollow floors are interconnected through the hollow spacing walls disposed therebetween. The sealed container defines a liquid reservoir, a condensate reservoir, and a plurality of fluid passages extending through the hollow spacing walls and the hollow floors that are disposed between the liquid reservoir and the condensate reservoir. | 03-05-2009 |
20090073657 | Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe - An electronic component or assembly that is assembled within a case that is designed to operate as a liquid phase to gas phase heat pipe where the electronic component or assembly is introduced into a liquid or partially liquid partially gaseous environment; whereby said liquid evaporates into a gas absorbing heat energy and transferring it to and through the component's or assembly's case. The case will be engineered out of materials that do not contaminate the liquid and electronics with ions and will be engineered to include a plurality of chambers/towers that extend in various directions providing enhanced heat pipe functionality in any physical orientation. | 03-19-2009 |
20090086434 | Recirculating Gas Rack Cooling Architecture - Cabinet for housing and cooling electronic components with internally circulating air that is cooled at each of a plurality of equipment shelves. | 04-02-2009 |
20090097205 | ELECTRONIC EQUIPMENT SYSTEM - In a space of a data center or the like where many disk array apparatuses and electronic equipment systems are arranged, it is an object of the present invention to reduce the energy required for cooling the apparatus itself and cooling the space. In electronic equipment having heat generating elements such as a disk array apparatus or CPU, low-temperature waste heat exhausted from the equipment is heated through a vapor compression cycle once and then recovered as cold water through an absorption refrigeration cycle. In the space of a data center or the like where many disk array apparatuses and electronic equipment systems are arranged, this can reduce the energy required for cooling the apparatus itself and cooling the space, drastically improve the processing speed and reliability of the apparatus/system and realize capacity and speed enhancements. | 04-16-2009 |
20090109623 | HEAT-RADIATING MODULE WITH COMPOSITE PHASE-CHANGE HEAT-RADIATING EFFICIENCY - The present invention provides a heat-radiating module with composite phase-change heat-radiating efficiency. The cooling pad of the heat-radiating module is fitted with a heating portion and radiating portion. The first and second chambers are placed at intervals into the cooling pad. The first and second phase-change materials are separately placed in two chambers. The reaction temperatures of two phase-change materials differ from each other. The phase-change material of higher reaction temperature assists in heat-absorbing and preventing overheating. There is a heat peak when the cooling pad reaches the preset high-temperature state. When the temperature of the cooling pad declines below a preset temperature, the phase-change material of lower reaction temperature will release the stored latent heat, enabling the cooling pad to maintain an operating temperature and improve the heat-radiating efficiency in a variety of equipment. | 04-30-2009 |
20090122488 | APPARATUS FOR FACILITATING COOLING OF AN ELECTRONICS RACK THROUGH THE USE OF AN AIR-TO-LIQUID HEAT EXCHANGER - An apparatus for facilitating cooling of an electronics rack is provided. The apparatus includes an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to a door of an electronics rack. The inlet and outlet plenums are in fluid communication with the heat exchanger and respectively include a coolant inlet and coolant outlet in the top portions thereof. System coolant supply and return hoses are disposed above the electronics rack and respectively couple in fluid communication the inlet plenum to a system coolant supply header and the outlet plenum to a system coolant return header. The hoses are each flexible, partially looped and of sufficient length to allow for opening and closing of the door. Stress-relief structures are coupled to at least one end of the hoses to relieve stress on the ends of the hoses during opening or closing of the door. | 05-14-2009 |
20090129022 | Micro-chimney and thermosiphon die-level cooling - A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated. | 05-21-2009 |
20090154102 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally connecting the heat sink and the spreader together, a plurality of fasteners each including a fixture having a head at a top thereof, a spring encircling the fixture and a gasket wired on the fixtures. The fixtures extend through the base plate of the heat sink and the spreader, the gaskets are respectively compressed between the heads and the base plate, edge of the base plate of the heat sink is joined with the housing of the computer, and cooperates with the housing to form a hermetic encapsulation which encloses the heat-generating electronic component. | 06-18-2009 |
20090154103 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a first heat sink located on the base, a second heat sink located on the first heat sink, and a heat pipe contacting with the base and the first and second heat sink. The first heat sink includes a heat spreader and a plurality of fins extending from the heat spreader. The second heat sink includes a heat spreader and a plurality of fins extending from the heat spreader. The heat pipe includes an evaporating portion, first and second condensing portions parallel to the evaporating portion and first and second connecting portions interconnecting corresponding first and second condensing portion and the evaporating portion. The evaporating portion and the first condensing portion are located between the base and the heat spreader of the first heat sink. The second condensing portion is located on the heat spreader of the second heat sink. | 06-18-2009 |
20090154104 | Cooling Device and Electronic Apparatus Using the Same - It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing. | 06-18-2009 |
20090161315 | HEAT DISSIPATING APPARATUS WITH HEAT PIPE - A heat dissipating apparatus includes a heat spreader ( | 06-25-2009 |
20090161316 | HEAT DISSIPATION DEVICE WITH FAN HOLDER - A heat dissipation device includes a heat sink assembly, a fan holder and a fan mounted in the fan holder. The heat sink assembly includes a heat spreader for contacting with a heat-generating electronic component, and two fin assemblies thermally connecting with the heat spreader and sandwiching the fan therebetween. Each fin assembly defines cutouts at opposite ends thereof. The fan holder includes a top plate and a pair of vertical, downward-extending baffle walls. A pair of clamping arms extends from each baffle wall and inserted into the cutouts of the fin assemblies. Screws extend through the top plate to engage in holes defined in the fin assemblies and communicating with the cutouts. A vaulted operating plate is formed by the top plate for a user to grip to conveniently transport the heat dissipation device. | 06-25-2009 |
20090195984 | COOLING DEVICE - A cooling device for dissipating heat generated by an electronic element includes a fixing seat, a cooling body, and a vapor chamber. The fixing seat is arranged an opening. The cooling body includes a bottom plate attached onto the fixing seat and a plurality of cooling fins that are interspaced to each other and are attached to the bottom plate, in which a fixing hole is arranged at one side of the bottom plate, and an accommodating space is configured at the cooling fins in corresponding to the fixing hole. The vapor chamber is accommodated in the opening of the fixing seat, and one side of the vapor chamber contacts a bottom part of the cooling body, while another side contacts the electronic element. | 08-06-2009 |
20090201645 | COOLING SYSTEM FOR ELECTRONIC EQUIPMENT - In a cooling system for an electronic device of the present invention, server rooms in which a plurality of servers are placed, an evaporator which is provided close to each of the servers, and cools exhaust air from the server by vaporizing a refrigerant with heat generating from the server, a cooling tower which is provided at a place higher than the evaporator, cools the refrigerant by outside air and water sprinkling, and condenses the vaporized refrigerant, and a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower. According to the cooling system, an electronic device which is required to perform a precise operation with a heat generation amount from itself being large, such as a computer and a server, can be efficiently cooled at low running cost. | 08-13-2009 |
20090213545 | CONTROL DEVICE, IN PARTICULAR IN THE FORM OF AN ELECTRIC SWITCH FOR ELECTRIC HANDTOOLS - A control device, in particular an electrical switch for use for an electrical tool such as a rechargeable-battery and/or plug-powered electrical tool having an electric motor. The switch has a housing for holding at least one heat-generating component such as a power transistor, a MOSFET, a triac or the like, which is arranged in particular in an electrical circuit arrangement which, for example, is used for open-loop and/or closed-loop control of the electric motor by appropriate open-loop and/or closed-loop control of the electrical load current flowing through the component to the electric motor. A means for thermal conduction is connected on the one hand to the housing of the electrical switch, and/or to the heat-generating component, in particular to the power semiconductor which is located in the housing, and on the other hand to a cooled area which is associated with the switch. | 08-27-2009 |
20090219695 | Electronic Device, Loop Heat Pipe and Cooling Device - According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other. | 09-03-2009 |
20090244846 | Electronic Device, Cooling Device and Loop Heat Pipe - According to one embodiment, an electronic device includes a housing, a heat generating part contained in the housing, and a loop heat pipe contained in the housing. The loop heat pipe includes a heat receiving portion, a heat radiating portion, a vapor flow path and a liquid return flow path. The heat receiving portion includes a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow, connected to the vapor flow path. The heat receiving portion is thermally connected to the heat generating part at a position across the first region and the second region. | 10-01-2009 |
20090257193 | Heat dissipating device - A heat dissipating device is designed with calm, efficient, and space economy performance includes a housing ( | 10-15-2009 |
20090273904 | HEAT-DISSIPATION MODULE AND ELECTRONIC APPARATUS HAVING THE SAME - An electronic apparatus including a circuit board having multiple heat generating elements and a heat-dissipation module is provided. The heat-dissipation module includes a heat-dissipation plate and a heat pipe set. The heat-dissipation plate having a first surface and a second surface is disposed on the circuit board and having multiple contacting portions and at least one heat pipe protecting portion connecting the contacting portions. The contacting portions are used for receiving heat from the heat generating elements. A heat pipe accommodating groove passing through the heat pipe protecting portion is set on the first surface. The heat pipe set is disposed in the heat pipe accommodating groove of the heat-dissipation plate. | 11-05-2009 |
20090284923 | IGBT PACKAGING AND COOLING USING PCM AND LIQUID - A power control system may use power semiconductor devices such as insulated gate bipolar transistors (IGBT's) in a switching unit to provide motor control. The IGBT's may be cooled with a system that is configured and sized to provide proper cooling at steady-state operating conditions of the switching unit. The IGBT's may be placed in thermal communication with a compartment that may contain phase change material (PCM). When and if the switching unit is operated under transient high load conditions, excess heat may be absorbed by melting of the PCM. When steady state operating conditions are restored the PCM may solidify and release its latent heat to a coolant. The PCM may thus act as a thermal buffer for the cooling system and thus may provide that the cooling system may be minimally sized. | 11-19-2009 |
20090284924 | THERMAL TRANSFER TECHNIQUE USING HEAT PIPES WITH INTEGRAL RACK RAILS - A thermal transfer apparatus for cooling a heat-producing electronic component includes an evaporator disposed over the heat-producing electronic component and thermally coupled to the heat-producing electronic component, a plurality of heat pipes carrying a working fluid therein disposed over the evaporator and thermally coupled to the evaporator, a cold plate thermally coupled to a first end of the plurality of heat pipes, and a condenser thermally coupled to a second end of the plurality of heat pipes. The heat pipes extend over the evaporator such that the first end and the second end of the heat pipes couple to the cold plate and condenser at a location not over the heat-producing electronic component. The cold plate and the condenser are supplied with a coolant from outside the thermal transfer apparatus. | 11-19-2009 |
20090284925 | EVAPORATOR FOR A COOLING CIRCUIT - An evaporator is disclosed for a cooling circuit. The evaporator includes a housing having at least one wall for contacting a heat emitting device. A channel, the cross section of which is small enough to allow convection boiling, and a separation volume are located in the evaporator. The separation volume is located at a vapor exiting port of the channel. The evaporator can include a liquid reservoir. | 11-19-2009 |
20090284926 | TWO-PHASE COOLING CIRCUIT - The disclosure relates to a two-phase cooling circuit. The cooling circuit can include an evaporator and a condenser. The evaporator and condenser can be connected by a feeder line and a first return line. A phase separator is arranged at an inlet side of the condenser. The phase separator can be connected with the evaporator by a second return line. | 11-19-2009 |
20090310307 | INTEGRATED HEAT-DISSIPATING DEVICE FOR PORTABLE ELECTRONIC PRODUCT - An integrated heat-dissipating device for a portable electronic product includes a heat-conducting base, a heat-dissipating plate, a first heat-dissipating module and a second heat-dissipating module. The heat-dissipating plate is adhered onto the heat-conducting base. The coefficient of heat conductivity of the heat-dissipating plate is larger than that of the heat-conducting base. The first heat-dissipating module includes a first heat pipe. One section of the first heat pipe is connected to the heat-conducting base, and the other section thereof extends in a direction away from the heat-conducting base. The second heat-dissipating module includes a second heat pipe, an adapting block and a third heat pipe. One section of the second heat pipe is connected to the heat-conducting base, and the other section thereof is connected to the adapting block. One section of the third heat pipe is connected to the adapting block, and the other section thereof extends in a direction away from the adapting block. With a multiple-directional heat-dissipating path, a great amount of heat generated by a heat-generating source can be dissipated to the outside quickly. | 12-17-2009 |
20090310308 | Integrated Replaceable Energy Storage and Coolant Module - There is disclosed a self-contained electronic apparatus containing at least some power-dissipating components which may require cooling. The self-contained electronic apparatus may also include a removable and replaceable energy storage module. The removable and replaceable energy storage module may include a power element to provide electrical energy for the self-contained electronic apparatus and a cooling element to cool at least a portion of the power dissipating components. | 12-17-2009 |
20090323285 | HEAT TRANSPORT DEVICE AND ELECTRONIC APPARATUS - A heat transport device includes an airtight container, a working fluid contained in the airtight container, and a plurality of plate-like members including a first plate-like member and a second plate-like member adjacent to the first plate-like member, the plate-like members each having a first hole having a first opening area and a second hole having a second opening area smaller than the first opening area, the plate-like members being layered in the airtight container so that the first hole of the first plate-like member and the first hole of the second plate-like member are communicated with each other, to retain the working fluid in a liquid phase by applying a capillary force to the working fluid, and so that an opening of the second hole is located within an opening of the first hole, to transfer the working fluid vaporized into a gas phase in the layered direction. | 12-31-2009 |
20100002394 | FASTENING DEVICE FOR THERMAL MODULE - A thermal module includes a heat sink ( | 01-07-2010 |
20100002395 | ELECTRONIC HOUSING WITH ELECTRONIC BOARDS COMPRISING HEAT PIPES - The field of the invention is that of the discharge of heat from electronic cards in operation and more specifically from electronic devices comprising at least one heat pipe. The electronic package according to the invention comprises at least a mechanical structure comprising at least one housing, an electronic card, and means for mechanically attaching the electronic card in the housing of the structure, the electronic card comprising at least one electronic component and a device of high thermal conductivity joined to the electronic card and comprising two ends, the first end being in thermal contact with the electronic component and the second end of the device of high thermal conductivity being mechanically arranged so as to ensure good thermal contact with the walls of the housing of the structure. | 01-07-2010 |
20100008043 | HEAT-TRANSPORTING DEVICE, ELECTRONIC APPARATUS, SEALING APPARATUS, SEALING METHOD, AND METHOD OF PRODUCING A HEAT-TRANSPORTING DEVICE - A heat-transporting device includes a casing, a working fluid, a first substrate, a second substrate, and a third substrate. The casing includes a first side and a second side opposed to the first side. The working fluid is sealed inside the casing and transports heat by a phase change. The first substrate includes an inlet through which the working fluid is injected and constitutes the first side of the casing. The second substrate is disposed opposite to the first substrate and constitutes the second side of the casing. The third substrate includes a contact portion that is brought into contact with the inlet so that the inlet is sealed when the inlet is pressed, the third substrate being interposed between the first substrate and the second substrate. | 01-14-2010 |
20100033933 | HEAT SPREADER, ELECTRONIC APPARATUS, AND HEAT SPREADER MANUFACTURING METHOD - According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion. | 02-11-2010 |
20100073880 | HEAT DISSIPATION DEVICE - A heat dissipation device includes two heat pipes, three extruded heat sinks and a heat conducting plate. Each heat pipe has a substantially G-shaped configuration and includes a heat absorbing section and first and second heat dissipating sections. The first and second heat dissipating sections extend along opposite directions, wherein the second heat dissipating section is located above the first heat dissipating section. Each heat sink includes a main body and a plurality of fins extending from the main body. The main body of each heat sink has a same profile with that of each heat pipe. Each heat pipe is sandwiched between the main bodies of two adjacent heat sinks. The heat conducting plate is attached to the main bodies of the heat sinks and the heat absorbing sections of the heat pipes. | 03-25-2010 |
20100079952 | HEAT-DISSIPATING MODULE AND ELECTRONIC DEVICE HAVING THE SAME - An electronic device having a heat-dissipating module includes a housing and an electronic component (e.g., a central processing unit) disposed within the housing. The heat-dissipating module is used for dissipating heat of the electronic component, and includes a two-phase flow heat-dissipating loop and a thermoelectric cooling component. The two-phase flow heat-dissipating loop can be a loop heat pipe (LHP) or a capillary pumped loop (CPL). The thermoelectric cooling component includes a cooling portion and a heat-generating portion respectively to cool or heat necessary portions of the two-phase flow heat-dissipating loop, or directly cool the electronic component through the cooling portion, thereby increasing the heat-dissipation effect of the two-phase flow heat-dissipating loop. | 04-01-2010 |
20100079953 | Electronic Appartus - According to one embodiment, an electronic apparatus includes a connector electrically connecting a sub-board to a main board, a heat producing component mounted on the sub-board, a heat pipe opposed to the heat producing component, a pressing member, and fixing members. The pressing member includes a main part opposed to the heat pipe, and a plurality of fixing parts extending from the main part and being located closer to the connector than the main part is. The plurality of fixing members fix the fixing parts of the pressing member to the sub-board, and fix the sub-board to support members at positions that are closer to the connector than the main part is. | 04-01-2010 |
20100097766 | FIXING DEVICE FOR HEAT SINK - A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards. | 04-22-2010 |
20100118493 | MOTOR DRIVE WITH HEAT PIPE AIR COOLING - An air cooled switching unit for a motor drive includes a plurality electrical switches and a plurality of heat pipe assemblies. Each heat pipe assembly includes a thermally and electrically conductive evaporator, a condenser, and at least one heat pipe extending between the evaporator and condenser. Each of the switches is abutted with an evaporator of at least one of the heat pipe assemblies for conduction of both electrical power and heat between the switch and the evaporator. Each heat pipe assembly further includes an electrically conductive base abutted with the evaporator, and the air cooled switching unit further includes a plurality of power lugs each connected to a base of a respective one of the heat pipe assemblies for input or output of electrical power to the base and the evaporator plate abutted with the base. Each heat pipe assembly includes at least one evaporator defined by a metallic plate. The condenser of each heat pipe assembly includes a plurality of parallel spaced-apart cooling fins. The at least one heat pipe of each heat pipe assembly includes a sealed pipe containing a phase-change material for transferring heat from said evaporator to said condenser. The at least one heat pipe includes a first end located in the metallic plate and a second end in contact with and extending through the cooling fins of the condenser. A temperature feedback system derives air flow velocity through the condenser. | 05-13-2010 |
20100128436 | METHOD AND APPARATUS FOR COOLING ELECTRONICS - Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink to provide increased cooling for electronic equipment, such as power converters. In one embodiment, a heatsink includes at least one fluid cooled portion and at least one heat pipe disposed adjacent to the fluid cooled portion. The heat pipe improves the conduction of heat away from heat sources. | 05-27-2010 |
20100149755 | Loop Heat Pipe and Electronic Device - According to one embodiment, a loop heat pipe including a fluid circulating channel containing fluid, includes: an evaporating portion configured to vaporize the fluid by heat from a heat generating component; a condensing portion configured to liquefy the vaporized fluid; a first fluid channel connecting the evaporating portion and the condensing portion, the vaporized fluid flowing through the first fluid channel; a second fluid channel connecting the evaporating portion and the condensing portion, the fluid liquefied by the condensing portion flowing through the second fluid channel; a liquid accumulating portion formed on an inner wall of the second fluid channel, and provided between the evaporating portion and the condensing portion, the liquid accumulating portion being configured to accumulate the liquid liquefied by the condensing portion; and a wick provided between the evaporating portion and a position where the liquid accumulating portion is formed. | 06-17-2010 |
20100157533 | HEAT-TRANSPORTING DEVICE, ELECTRONIC APPARATUS, AND METHOD OF PRODUCING A HEAT-TRANSPORTING DEVICE - A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path causes the working fluid in a vapor phase to circulate inside the vessel. The liquid-phase flow path includes a laminated body and causes the working fluid in a liquid phase to circulate inside the vessel, the laminated body including a first mesh member and a second mesh member and being formed such that the first mesh member and the second mesh member are laminated while weaving directions thereof differ relatively. | 06-24-2010 |
20100157534 | HEAT-TRANSPORTING DEVICE AND ELECTRONIC APPARATUS - A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel. | 06-24-2010 |
20100157535 | HEAT-TRANSPORTING DEVICE AND ELECTRONIC APPARATUS - A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, a liquid-phase flow path, and an intermediate layer. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path causes the working fluid in a vapor phase to circulate inside the vessel. The liquid-phase flow path includes a first mesh member having a first mesh number and causes the working fluid in a liquid phase to circulate inside the vessel. The intermediate layer includes a second mesh member and is interposed between the liquid-phase flow path and the vapor-phase flow path, the second mesh member being laminated on the first mesh member and having a second mesh number smaller than the first mesh number. | 06-24-2010 |
20100188818 | HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat dissipating device includes a flat evaporator, a vapor pipe, a liquid pipe, and a condenser. The flat evaporator consists of a bottom plate, a porous material, and a top lid. The porous material is located on the bottom plate and provided with vapor flow passages. The vapor pipe and liquid pipe are communicably connected at respective one end to a vapor port and a liquid port on the evaporator, and at the other end to two sides of the condenser. The evaporator has simple structure and low manufacturing cost, and can fully effectively bear on an electronic chip to enable reduced room needed for installing the evaporator and reduced thermal resistance during heat dissipation. The heat dissipating device can be used to dissipate heat produced by computer chips, and to cool LED illuminating devices, chips for communication devices, high-power heat-producing elements in military, medical, aerial, and aerospace apparatuses. | 07-29-2010 |
20100208428 | COMMUNICATION CHASSIS HEAT DISSIPATION STRUCTURE - A communication chassis heat dissipation structure includes a chassis body defining an inner receiving space. The chassis body is divided into at least one heat concentration portion and at least one heat dissipation portion. A first heat pipe set is arranged in the receiving space to extend between and connect to the heat concentration portion and the heat dissipation portion, so that heat absorbed by the heat concentration portion is quickly transferred via the first heat pipe set to the heat dissipation portion and then dissipates from the heat dissipation portion into ambient air. Therefore, heat inside the chassis body can be quickly dissipated outward, enabling a communication chassis to have excellent heat dissipation effect. | 08-19-2010 |
20100238630 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes. | 09-23-2010 |
20100246128 | Circuit Pack Cooling Solution - An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components. | 09-30-2010 |
20100246129 | Electronic Apparatus - An electronic apparatus including: a body; a circuit board housed in the body; a heating body mounted on the circuit board; a heat pipe having: an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion; and an extension that extends toward the circuit board. | 09-30-2010 |
20100254088 | HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND HEAT TRANSPORT DEVICE MANUFACTURING METHOD - According to an embodiment of the present invention, there is provided a heat transport device including a working fluid, an evaporation portion, a condenser portion, a flow path portion, and an area. The working fluid includes pure water and an organic compound bearing a hydroxyl group. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The area is made of a carbon material and provided on at least one of the evaporation portion, the condenser portion, and the flow path portion. | 10-07-2010 |
20100259897 | HEAT DISSIPATION DEVICE - A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader. | 10-14-2010 |
20100277868 | INSULATED METAL SUBSTRATES INCORPORATING ADVANCED COOLING - A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS. | 11-04-2010 |
20100290189 | HEAT DISSIPATION STRUCTURE FOR COMMUNICATION CHASSIS - A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe assembly are disposed in the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact with the first copper heat absorption component. The first heat pipe assembly serves to quickly transfer heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat. | 11-18-2010 |
20100296249 | MICRO PASSAGE COLD PLATE DEVICE FOR A LIQUID COOLING RADIATOR - A micro passage cold plate device for a liquid cooling radiator includes a upper cover and a lower plate. The upper cover has a working medium inlet at a side thereof and a working medium outlet at another side thereof. The inlet and outlet are trumpet-shaped such that the working medium expansively enters the cold plate gradually and leaves the cold plate with a reduced way gradually. Hence, the cold plate provides an even distribution of temperature, a lower thermal resistance and a better heat dissipation performance such that the stability of the two-state flow of the working medium is enhanced for heat dissipation device in the field of electronic field. | 11-25-2010 |
20100296250 | HEAT DISSIPATION DEVICE FOR COMMUNICATION CHASSIS - A heat dissipation device for communication chassis, which includes an enclosure and at least one second heat pipe assembly. The enclosure includes at least one first copper heat absorption component, at least one first heat pipe assembly and multiple radiating fins disposed on an outer surface of the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact therewith so as to transfer heat absorbed by the first copper heat absorption component to the section to dissipate the heat. The second heat pipe assembly penetrates through the radiating fins of the enclosure for quickly and uniformly distributing the heat to all the radiating fins. Therefore, the heat conduction efficiency is greatly enhanced to provide better heat dissipation effect for the communication chassis. | 11-25-2010 |
20100296251 | HEAT DISSIPATION DEVICE - A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components. | 11-25-2010 |
20100302734 | HEATSINK AND METHOD OF FABRICATING SAME - A heatsink assembly for cooling a heated device includes a ceramic substrate having a plurality of cooling fluid channels integrated therein. The ceramic substrate includes a topside surface and a bottomside surface. A layer of electrically conducting material is bonded or brazed to only one of the topside and bottomside surfaces of the ceramic substrate. The electrically conducting material and the ceramic substrate have substantially identical coefficients of thermal expansion. | 12-02-2010 |
20100315781 | ANTI-GRAVITY THERMOSYPHON HEAT EXCHANGER AND A POWER MODULE - A thermosyphon heat exchanger according to the disclosure includes a set of linear conduit elements and a heat exchange plate mounted in a heat receiving region on the conduit elements. The longitudinal axes of the conduit elements extend in a first direction in a plane defined by the flat side of the heat exchange plate. The conduit elements project above the heat receiving region in the first direction on a first side and an opposing second side such that the extension of the conduit elements on each side of the heat exchange region is suitable for constituting a condensing region for condensing a refrigerant vaporized in the heat receiving region if the first direction is arranged vertically. | 12-16-2010 |
20100328889 | COOLED ELECTRONIC MODULE WITH PUMP-ENHANCED, DIELECTRIC FLUID IMMERSION-COOLING - Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and includes a housing configured to at least partially surround and form a sealed compartment about the electronic device. Additionally, the cooling apparatus includes dielectric fluid and one or more pumps disposed within the sealed compartment. The dielectric fluid is in direct contact with the electronic device, and the pump is an impingement-cooling, immersed pump disposed to actively pump dielectric fluid within the sealed compartment towards the electronic device. Multiple condenser fins extend from the housing into the sealed compartment in an upper portion of the sealed compartment, and a liquid-cooled cold plate or an air-cooled heat sink is coupled to the top of the housing for cooling the condenser fins. | 12-30-2010 |
20100328890 | CONDENSER STRUCTURES WITH FIN CAVITIES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Vapor condensers and cooling apparatuses are provided which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device. The vapor condenser includes a thermally conductive base structure with a plurality of condenser fins extending from the base structure. The condenser fins have a proximal end coupled to the base structure and a remote end remote from the base structure. At least one exposed cavity is provided within each condenser fin extending from the remote end towards the proximal end. The exposed cavities are sized to provide greater condenser fin surface area for facilitating vapor condensate formation, and thereby facilitate cooling of an electronic device using a two-phase coolant. | 12-30-2010 |
20100328891 | CONDENSER BLOCK STRUCTURES WITH CAVITIES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Condenser structures and cooling apparatuses are provided which facilitate vapor condensation heat transfer of a coolant employed in cooling an electronic device. The condenser structure includes a thermally conductive condenser block with multiple exposed cavities therein extending from a first main surface towards a second main surface. The condenser block is a monolithic structure, and the first main surface is a coolant vapor condensate formation surface when the condenser structure is operationally facilitating cooling of an electronic device. The exposed cavities extend from the first main surface into the condenser block to increase a condensation surface area of the condenser block, thereby facilitating coolant vapor condensate formation on the condenser block, and thus cooling of the electronic device using a two-phase coolant. The condenser structure also includes coolant-carrying channels for facilitating cooling of the condenser block, and thus vapor condensate formation on the condenser block. | 12-30-2010 |
20110013364 | MODULAR HIGH-POWER DRIVE STACK COOLED WITH VAPORIZABLE DIELECTRIC FLUID - A high power drive stack system is provided which includes a cabinet ( | 01-20-2011 |
20110038122 | Phase Change Heat Spreader Bonded to Power Module by Energetic Multilayer Foil - Power electronic devices are solder to a phase change heat spreader using an energetic multilayer foil. This foil may be sandwiched between layers of solder, the first layer in contact with the power electronic devices and the second layer in contact with the phase change heat spreader. When activated, this foil may induce the solder to physically and thermally bond the power electronic devices to the phase change heat spreader. Certain embodiments may also employ energetic multilayer foil to thermally bond the phase change heat spreader to a heat dissipation structure. Other embodiments may employ a phase change heat spreader with an integrated heat dissipation structure. In addition, some embodiments may employ a heat sink as the heat dissipation structure, while other embodiments employ a liquid cooling system. | 02-17-2011 |
20110069453 | APPARATUS AND METHOD WITH FORCED COOLANT VAPOR MOVEMENT FOR FACILITATING TWO-PHASE COOLING OF AN ELECTRONIC DEVICE - Apparatus and method are provided for two-phase dielectric cooling of an electronic device. The apparatus includes a coolant flow path, a vapor condenser and one or more vapor fans. The coolant flow path is in fluid communication with the electronic device, where liquid dielectric coolant within the flow path vaporizes upon contacting the electronic device, forming dielectric coolant vapor, and thereby facilitating cooling of the electronic device. The vapor condenser is also in fluid communication with the coolant flow path and facilitates condensate formation from the dielectric coolant vapor. The one or more vapor fans are disposed within the flow path to actively move dielectric coolant vapor into contact with the vapor condenser, and thereby enhance cooling of the electronic device by facilitating coolant condensate formation and thus recirculation of the coolant condensate as liquid dielectric coolant. | 03-24-2011 |
20110069454 | LIQUID-COOLED ELECTRONICS APPARATUS AND METHODS OF FABRICATION - Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the thermally conductive structure. The electronics subassembly includes an electronics card(s) and one or more thermal transfer plates. The electronics card(s) includes electronic devices to be cooled, and the one or more thermal transfer plates are each rigidly affixed to one or more electronic devices of the electronics card(s). Each thermal transfer plate is thermally conductive and couples the electronics subassembly to the liquid-cooled cold rail to thermally interface the one or more electronic devices to the liquid-cooled cold rail to facilitate cooling of the electronic devices. In one embodiment, the electronics subassembly includes multiple interleaved electronics cards and thermal transfer plates. | 03-24-2011 |
20110075369 | ELECTRONIC DEVICE - An electronic device including a heat generation element, a heat dissipation plate, and a heat pipe is provided. The heat dissipation plate includes a top surface, a bottom surface, a pair of longitudinal side surfaces, and a pair of lateral side surfaces including a third side surface and a fourth side surface. The longitudinal side surfaces include first and second side surfaces. The lateral side surfaces include third and fourth side surfaces. The first, second, third and fourth side surfaces are connected to both the top surface and the bottom surface. The heat pipe is disposed in contact with the heat dissipation plate, and the heat pipe and the heat generation element are disposed on the bottom surface of the heat dissipation plate. The heat pipe is disposed on the heat dissipation plate and extension of the heat pipe is not beyond the first, second, third and fourth side surfaces. | 03-31-2011 |
20110075370 | PRESSING MEMBER, PRESSING STRUCTURE FOR HEAT RECEIVING BLOCK OF SUBSTRATE, AND ELECTRONIC DEVICE - According to one embodiment, a pressing member includes: a band-like pressing portion placed on a heat receiving block arranged on an element mounted on a substrate, the pressing portion configured to press the heat receiving block against the element; a first arm, one end of the first arm being connected to one longitudinal end of the pressing portion, other end of the first arm being connected to the substrate; and a second arm, one end of the second arm being connected to other longitudinal end of the pressing portion, other end of the second arm being connected to the substrate, wherein the first arm and the second arm are connected to the pressing portion in a bent shape as seen in a planar view from above a surface of the substrate. | 03-31-2011 |
20110075371 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section. | 03-31-2011 |
20110075372 | EVAPORATORS FOR USE IN HEAT TRANSFER SYSTEMS, APPARATUS INCLUDING SUCH EVAPORATORS AND RELATED METHODS - An evaporator includes a liquid barrier wall made of a ceramic material, a vapor barrier wall made of a ceramic material, and a wick made of a ceramic material and being positioned between the liquid barrier wall and the vapor barrier wall. | 03-31-2011 |
20110080711 | POWER-ELECTRONIC ARRANGEMENT - A power-electronic arrangement comprising semiconductor components ( | 04-07-2011 |
20110096502 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe. | 04-28-2011 |
20110103018 | INTEGRATED ANTENNA STRUCTURE WITH AN EMBEDDED COOLING CHANNEL - According to one embodiment of the disclosure, an integrated antenna structure comprises a plurality of radiating elements, cooling channels embedded directly within each of the plurality of radiating elements, a fluid inlet, and a fluid outlet. Each of the plurality of radiating elements receive or transmit electromagnetic energy. The cooling channels are formed by an internal surface of the radiating elements. The fluid inlet and the fluid outlet are in communication with each of the cooling channels. Each of the cooling channels provides a heat exchanging function by receiving at least a portion of a fluid coolant from the fluid inlet, transferring a least a portion of the thermal energy from the respective radiating element to the received portion of the fluid coolant, and dispensing of at least a portion of the received fluid coolant out of the cooling channel to the fluid outlet. | 05-05-2011 |
20110110042 | ELECTRONIC DEVICE ASSEMBLY WITH HEAT DISSIPATION DEVICE - An exemplary electronic device assembly includes a printed circuit board with an electronic component thereon, and a heat dissipation device. The heat dissipation device includes a heat sink mounted on the printed circuit board and a heat pipe pivotably engaged with the heat sink. The heat sink includes a main body defining a transverse channel therethrough and an injection aperture at a top of the main body to communicate the channel and an exterior of the main body. The heat pipe is pivotably engaging in the channel of the main body. A gap is defined between the heat pipe and the heat sink. Heat conductive grease is injected into the channel and filled in the gap between the heat pipe and the heat sink to thermally connect the heat sink with the heat pipe. | 05-12-2011 |
20110122584 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a first heating element in the housing, a heat sink in the housing, a first pressing member, a first heat pipe, and a second heat pipe. The first heat pipe has a plate shape, includes a first portion facing the first heating element and a second portion being outside the first heating element. The first heat pipe is configured to be bent by the first pressing member. The second heat pipe is connected to the second portion of the first heat pipe and the heat sink. | 05-26-2011 |
20110141692 | CONDUCTION COOLED CIRCUIT BOARD ASSEMBLY - A conduction cooled circuit board assembly may include a frame and at least one circuit board attached to the frame, having at least one area to be cooled. The assembly may also include at least one rail attached to the frame, and at least one heat pipe having a first end and a second end, the first end disposed near the area and the second end in contact with the rail so as to transfer heat from the area to the rail. | 06-16-2011 |
20110149517 | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System - The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system ( | 06-23-2011 |
20110170264 | Semiconductor Module Socket Apparatus - A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus. | 07-14-2011 |
20110182033 | DEVICE FOR COOLING AN ELECTRONIC CARD BY CONDUCTION COMPRISING HEAT PIPES, AND CORRESPONDING METHOD OF FABRICATION - In a device for cooling an electronic circuit board comprising at least one component covered with an exchanger cover, the device includes a heat sink covering all or some of the electronic circuit board, and at least one heat pipe per component, each heat pipe being capable of carrying away the heat from the component with which it is associated to at least one end of the electronic circuit board via a zone of the heat pipe called the condensing zone. The device further includes at least one heat-exchange part located on the end of the electronic circuit board and mounted freely on the heat sink, each heat pipe being attached to the heat-exchange part by means of its condensing zone. | 07-28-2011 |
20110216505 | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System - The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system ( | 09-08-2011 |
20110235277 | HEAT PIPE CAPABLE OF TRANSFORMING DYNAMIC ENERGY INTO ELECTRIC ENERGY AND RELATED HEAT-DISSIPATING MODULE - A heat pipe includes a conductive hollow case, a conductive capillary layer, a piezoelectric component, and a flexible component. The conductive hollow case has a first end and a second end. The first end is connected to a heat-generating component. The second end is a heat-dissipating end. The conductive capillary layer is formed on an inner wall of the conductive hollow case. A liquid stored in the conductive capillary layer can be heated to evaporate by the heat-generating component and then move toward the second end. The piezoelectric component is connected to the conductive capillary layer. The flexible component is disposed at a side of the piezoelectric component for being driven by the evaporated liquid so as to exert force upon the piezoelectric component. Thus, the piezoelectric component can generate electric energy, which can be transmitted from the conductive capillary layer to the conductive hollow case. | 09-29-2011 |
20110249403 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first back plate on the circuit board, a second back plate on the circuit board, and a connecting portion connecting the first back plate with the second back plate. | 10-13-2011 |
20110279978 | COOLING DEVICE - A cooling device of the present invention includes: a substrate having a first surface which supports an electronic component and a second surface on an opposite side to the first surface; a container which can form a space between itself and the second surface of the substrate; and an evaporation section which is thermally connected to the electronic component supported on the substrate, which is arranged in the space so that at least a portion thereof is in contact with a liquid within the space, and which changes a phase of at least a portion of the liquid to gas on a basis of heat generated by the electronic component. | 11-17-2011 |
20110286184 | THERMAL PACKAGING OF A MOTOR CONTROLLER FOR AN AUXILIARY POWER UNIT - A starter motor controller for an auxiliary power unit transfers thermal energy from low thermal capacity electric components to high thermal capacity electric components to control temperature without active cooling systems. | 11-24-2011 |
20110317367 | LIQUID-COOLED ELECTRONICS RACK WITH IMMERSION-COOLED ELECTRONIC SUBSYSTEMS - Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling in fluid communication the vapor outlets of the immersion-cooled electronic subsystems and the vapor-condensing heat exchanger; a reservoir for holding dielectric fluid; a gravity drain line coupled to drain dielectric fluid condensate from the vapor-condensing heat exchanger to the reservoir; an immersed, sub-cooling heat exchanger disposed within the reservoir; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump for supplying under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems. | 12-29-2011 |
20120026691 | APPARATUS AND METHOD FOR FACILITATING DISSIPATION OF HEAT FROM A LIQUID-COOLED ELECTRONICS RACK - Apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure associated with the electronic component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop to receive coolant from and supply coolant to the liquid-cooled structure. The heat exchanger is disposed external to the electronics rack within a cool air plenum of the data center containing the rack, and the plenum is coupled to a cool air source providing cooled air to the data center. Cooled air of the cool air plenum passes across the heat exchanger and cools coolant passing through the heat exchanger, which dissipates heat from the coolant passing therethrough to the cool air passing across the heat exchanger to facilitate liquid cooling of the electronic component(s) associated with the liquid-cooled structure. | 02-02-2012 |
20120063092 | HEAT-DISSIPATING DEVICE AND ELECTRIC APPARATUS HAVING THE SAME - A heat-dissipating device and an electronic apparatus having the same are disclosed. The heat-dissipating device includes a heat-transferring heat pipe unit having a wick type of a heat pipe, in which a wick is formed on an inner surface of the heat pipe and a working fluid is injected into the heat pipe, and a heat-dissipating heat pipe unit having an oscillating capillary type of a loop heat pipe, in which the loop heat pipe is formed as a capillary and a working fluid is injected into the loop heat pipe. Here, the heat pipe includes a radiator being disposed adjacent to a heat source and transporting heat transferred from the heat source to the loop heat pipe, and the loop heat pipe includes a heat-receiving portion, which is thermally coupled to the radiator, and a heat-dissipating portion, which releases heat absorbed from the heat-receiving portion. | 03-15-2012 |
20120069522 | THERMAL MODULE AND ELECTRONIC DEVICE INCORPORATING THE SAME - An electronic device includes a circuit board and a thermal module mounted thereon. The circuit board has a heat-generating chip and an electromagnetic interference (EMI) source mounted thereon. The thermal module includes a shielding cover and a heat conducting member. The shielding cover is heat-conductive and electrically-conductive material, and defines a cavity therein. The shielding cover encloses the EMI source in the cavity for EMI shielding. The heat conducting member has one end thermally connecting with the shielding cover and another end thermally connecting with the heat-generating chip for transferring heat from the heat-generating chip to the shielding cover. | 03-22-2012 |
20120075805 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device for a portable electronic device includes a heat pipe and a heat dissipating member. The heat pipe includes an evaporator section and a condenser section. The evaporator section is attached to a heat source of the portable electronic device. The heat dissipating member includes a sheath, and a porous heat dissipating layer and a working fluid contained in the sheath. The porous heat dissipating layer defines gaps therein. The working fluid is filled in the gaps. The condenser section of the heat pipe is received in the porous heat dissipating layer and thermally contacts the porous heat dissipating layer. | 03-29-2012 |
20120087089 | CARDLOCK CLAMP - A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage. | 04-12-2012 |
20120087090 | HEAT DISSIPATION DEVICE AND RADIO FREQUENCY MODULE WITH THE SAME - A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate ( | 04-12-2012 |
20120106084 | Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Board With A Heat Pipe Function - A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction. | 05-03-2012 |
20120170221 | COMPLIANT VAPOR CHAMBER CHIP PACKAGING - An arrangement for improving the cooling efficiency of semiconductor chips. One embodiment is to construct a vapor chamber with one compliant surface for improving the efficiency of transferring heat from a semiconductor chip to the vapor chamber, and another embodiment is to construct a vapor chamber with the chip substrate such that the chips are embedded inside the vapor chamber. One surface of the vapor chamber has a flexible structure to enable the surface of the vapor chamber to be compliant with the surface of a chip or a heat sink device. | 07-05-2012 |
20120206880 | THERMAL SPREADER WITH PHASE CHANGE THERMAL CAPACITOR FOR ELECTRICAL COOLING - A cooling assembly comprises an electronic component, a thermal spreader, a cold plate, and a phase change thermal capacitor. The thermal spreader conducts heat freely between the electronic component, the phase change thermal capacitor, and the cold plate. The cold plate dissipates heat. The phase change thermal capacitor stores undissipated heat in a phase transition of a phase change material. | 08-16-2012 |
20120218711 | COOLING SYSTEM FOR ELECTRONIC EQUIPMENT - In a cooling system for an electronic device of the present invention, server rooms in which a plurality of servers are placed, an evaporator which is provided close to each of the servers, and cools exhaust air from the server by vaporizing a refrigerant with heat generating from the server, a cooling tower which is provided at a place higher than the evaporator, cools the refrigerant by outside air and water sprinkling, and condenses the vaporized refrigerant, and a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower. According to the cooling system, an electronic device which is required to perform a precise operation with a heat generation amount from itself being large, such as a computer and a server, can be efficiently cooled at low running cost. | 08-30-2012 |
20120250257 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first back plate on the circuit board, a second back plate on the circuit board, and a connecting portion connecting the first back plate with the second back plate. | 10-04-2012 |
20120281358 | COOLED ELECTRONIC SYSTEM WITH THERMAL SPREADERS COUPLING ELECTRONICS CARDS TO COLD RAILS - Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader. | 11-08-2012 |
20120307452 | PORTABLE ELECTRONIC DEVICE WITH HEAT PIPE - An exemplary portable electronic device includes a printed circuit board, a heat generating electronic component mounted on the printed circuit board, a shell housing the printed circuit board, the heat generating electronic component and a heat pipe therein. The heat pipe includes an evaporating side and a condensing side. The evaporating side thermally contacts the heat generating electronic component, and the condensing side thermally contacts the shell. | 12-06-2012 |
20120327602 | Providing A Cooling System For A Medum Voltage Drive System - In an embodiment, a medium voltage drive system includes a transformer, multiple power cubes each coupled to the transformer, and a manifold assembly. Each power cube includes cold plates each coupled to a corresponding switching device of the cube, an inlet port in communication with a first one of the cold plates and an outlet port in communication with a last one of the cold plates. The manifold assembly can support an inlet conduit and an outlet conduit and further support first and second connection members to enable blind mating of each of the first connection members to the inlet port of one of the power cubes and each of the second connection members to the outlet port of one of the power cubes to enable two phase cooling of the plurality of power cubes. | 12-27-2012 |
20130021752 | TWO-PHASE, WATER-BASED IMMERSION-COOLING APPARATUS WITH PASSIVE DEIONIZATION - Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment. Transferred heat is subsequently conducted to, for example, a liquid-cooled cold plate or an air-cooled heat sink coupled to the housing for cooling the condenser structure. | 01-24-2013 |
20130027883 | FLOW BOILING HEAT SINK STRUCTURE WITH VAPOR VENTING AND CONDENSING - A heat sink, and cooled electronic structure and cooled electronic apparatus utilizing the heat sink, are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s). | 01-31-2013 |
20130027884 | VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) - A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. | 01-31-2013 |
20130039011 | HEAT-DISSIPATING MODULE - A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure. | 02-14-2013 |
20130039012 | HEAT DISSIPATION DEVICE - The present invention relates to a heat dissipation device, including at least one semiconductor device, at least one first substrate and a cooling substance. The first substrate has a first surface, a second surface and at least one hole, wherein the semiconductor device is located on the first surface of the first substrate, and the hole is opened at the second surface of the first substrate and corresponds to the semiconductor device. The cooling substance is used for flowing in the hole and taking away heat from the semiconductor device, wherein the cooling substance is in contact with the first substrate. Thereby, the temperature of the semiconductor device can be reduced efficiently. | 02-14-2013 |
20130044432 | LOOP HEAT PIPE, AND ELECTRONIC APPARATUS INCLUDING LOOP HEAT PIPE - There is provided a loop heat pipe which includes an evaporator that internally includes at least one wick built, a condenser, a liquid pipe and a vapor pipe that connect the evaporator and the condenser to each other, and a heat dispersion cavity that is formed inside the evaporator, and disperses a vapor, wherein the wick includes, a first wick that is porous, a second wick that is porous, the second wick being inserted into the first wick from the liquid pipe side and including a pore size larger than the first wick, and a vapor channel that is defined between the first wick and the second wick. The vapor channel is connected at an end on the liquid pipe side to the heat dispersion cavity. | 02-21-2013 |
20130044433 | HEAT-DISSIPATING DEVICE FOR ELECTRONIC APPARATUS - A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat generated by the first electronic component mounted on a substrate is absorbed thereby; and a vibrating capillary-shaped heat-pipe loop comprising a first heat-absorption portion coupled with the thermal base in such a manner that enables heat-transfer therebetween and a heat-dissipating portion configured to dissipate heat absorbed by the first heat-absorption portion, the heat-pipe loop having working fluid injected thereinto. The heat-pipe loop can be radially disposed with a central area thereof hollowed out, and an assembly area of a coupling member can be exposed in the central area so that the coupling member for coupling the thermal base to the substrate is coupled through the central area. | 02-21-2013 |
20130058042 | Laminated heat sinks - An apparatus includes a heat sink with a complex 3D structure. The heat sink includes a stack of metal layers. The metal layers are mechanically connected together and being separated by physical interface regions. The stack has array of channels for carrying fluid through the stack. Each channel of the array has a lateral surface formed by portions of more than one of the metal layers. | 03-07-2013 |
20130063896 | HEATSINK APPARATUS AND ELECTRONIC DEVICE HAVING SAME - A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus includes a box-shaped heat receiver, provided with a heat-generating body on an external wall, to transfer heat to an internal wall. The heatsink apparatus includes an inlet pipe supplying the working fluid to the heat receiver, an outlet pipe discharging vapor, into which the working fluid supplied to the heat receiver is evaporated by heat, and a heat dissipater dissipating heat of the vapor passing through the outlet pipe. An opening portion of the inlet pipe is opposite to and near the internal wall so as cause the working fluid near the internal wall to flow. | 03-14-2013 |
20130063897 | Modular High-Power Drive Stack Cooled with Vaporizable Dielectric Fluid - A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module. | 03-14-2013 |
20130070418 | HEAT DISSIPATION MODULE - An electronic device includes printed circuit board having an electronic component and a heat dissipation module mounted the printed circuit board. The heat dissipation module includes a base with a heat absorbing plate and two elastic pieces extending from the heat absorbing plate. The heat absorbing plate thermally engages on the electronic component. The elastic pieces are fixed on the printed circuit board. The base is made of one of copper-nickel-silicon alloy, beryllium copper, a titanium copper or phosphor bronze. | 03-21-2013 |
20130070419 | ELECTRONIC DEVICE WITH HEAT DISSIPATING MODULE - An electronic device includes a circuit board and a heat dissipating module. The circuit board includes a body and a first heat generating part located on the body. The body defines a through hole close to the first heat generating part. The heat dissipating module includes a heat pipe, a first heat dissipating piece attached to the heat pipe and a resilient piece. The resilient piece includes a securing portion secured to the first heat dissipating piece and a resilient arm. The resilient arm is engaged in the through hole to secure the first heat dissipating piece to the body. The first heat dissipating piece abuts the first heat generating part, and the resilient arm is elastically deformable to disengage from the through hole. | 03-21-2013 |
20130070420 | FLOW BOILING HEAT SINK WITH VAPOR VENTING AND CONDENSING - A method is provided for facilitating extraction of heat from a heat-generating electronic component. The method includes providing a heat sink, the heat sink including a thermally conductive structure which has one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s). | 03-21-2013 |
20130077245 | COOLING MODULE FOR COOLING ELECTRONIC COMPONENTS - A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier. | 03-28-2013 |
20130077246 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 03-28-2013 |
20130077247 | VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) - A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. | 03-28-2013 |
20130083485 | HEAT DISSIPATION APPARATUS FOR MEDIUM-VOLTAGE DRIVE - A heat dissipation apparatus is suitable for dissipating heat from heat-generating elements in a medium-voltage drive. The heat dissipation apparatus comprises: a heat-dissipating substrate, wherein the heat-generating elements are placed on at least one of a first surface and a second surface of the heat-dissipating substrate; at least one heat pipe group each of which includes a plurality of heat pipes, each heat pipe having an evaporation section and a condensation section, wherein the evaporation section is buried in an inner layer of the heat-dissipating substrate for absorbing heat from the heat-generating elements; and a plurality of fins arranged to be intersected with each heat pipe and connected to the condensation sections of the heat pipes, so as to transfer the heat released from the condensation sections to air. The contact portions between the heat pipe group and the fins are arranged in triangle staggered arrangements. | 04-04-2013 |
20130088836 | HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE - A heat dissipation structure in which an IC chip that generates heat is mounted on a substrate and a heat dissipation sheet is interposed between a cover member and the IC chip to dissipate heat, wherein chip-pressing parts ( | 04-11-2013 |
20130107458 | HEAT SINK DEVICE | 05-02-2013 |
20130114209 | HEAT MANAGEMENT DEVICE AND ELECTRONIC APPARATUS - An electronic apparatus includes a heat dissipating module and an electronic device. The heat dissipating module includes a base and a plurality of heat dissipating layers. The heat dissipating layers are formed on a surface of the base in sequence. Each heat dissipation layer has at least one heat dissipating structure, and the heat dissipation structure has a heat storage/dissipation area and a heat conductive area. The heat storage/dissipation area surrounds the heat conductive area, and a gap is configured between the heat storage/dissipation area and the heat conductive area. The electronic device is attached to the heat dissipating module. A heat management device is also disclosed. | 05-09-2013 |
20130120937 | HEAT DISSIPATION MODULE - A heat dissipation module for an electronic component is provided. The heat dissipation module includes a supporting structure and a heat pipe. The supporting structure is adjacent to the heat electronic component. The heat pipe is connected to the supporting structure by soldering, and the bottom surface of the heat pipe is directly in contact with the upper surface of the electronic component. | 05-16-2013 |
20130148299 | COOLING DEVICE, PRINTED CIRCUIT BOARD UNIT, AND ELECTRONIC DEVICE - A cooling device includes: a heat sink and a heat pipe that are connected with each other; a metal plate that is connected with the heat pipe; an elastic member that is provided in the metal plate; and a securing member that is attachable with a printed circuit board on which a beating part is mounted, is able to be secured to the elastic member to be elastically deformed such that the metal plate is pushed to the heating part, and is able to position the metal plate in a state where the securing member is not secured to the elastic member. | 06-13-2013 |
20130148300 | Well logging tool - The present invention relates to a device for transfer of heat energy in a well logging tool, where a variable heat flow from a chamber for electronics via a thermovalve is transmitted into a heat sink consisting of cooled metal, thereby establishing an approximately constant temperature in the chamber for electronics. The device comprises an electronics modular unit and a heat sink modular unit, which modular units are connected via an intermediate section, where a heat-regulating thermovalve provides heat conduction between a conical piston and a conical piston seat, for transferring heat energy. | 06-13-2013 |
20130188315 | COOLER OF POWER CONVERTING DEVICE FOR RAILROAD VEHICLE - A cooler of a power converting device for a railroad vehicle has heat exchanger tubes or heat radiator fins disposed to enhance the cooling performance of semiconductor devices arranged on an upper level of the multiple semiconductor devices arranged in multiple rows. Temperature detecting elements are arranged to detect temperature of the semiconductor devices arranged on a lower level on a windward side and a leeward side with respect to a traveling wind performing heat exchange with the heat radiator fins, and are arranged to detect temperature of the semiconductor devices arranged on the upper level at a center area thereof. | 07-25-2013 |
20130208422 | CONTACT COOLED ELECTRONIC ENCLOSURE - Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components. | 08-15-2013 |
20130223010 | SEMICONDUCTOR PACKAGE, COOLING MECHANISM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor package includes a substrate with a first surface on which a semiconductor device is mounted and a second surface opposite to the first surface, and a loop heat pipe including an evaporator and attached to the second surface of the substrate, wherein the substrate has a groove structure in the second surface, the groove structure being in contact with a porous wick provided in the evaporator. | 08-29-2013 |
20130258594 | HEAT EXCHANGER FOR TRACTION CONVERTERS - A heat exchanger including a first heat exchanger module with a first evaporator channel and a first condenser channel. The first evaporator channel and the first condenser channel are arranged in a first conduit. The first evaporator channel and the first condenser channel are fluidly connected to one another by a first upper distribution manifold and a first lower distribution manifold such that the first evaporator channel and the first condenser channel form a first loop for a working fluid. The first heat exchanger module includes a first evaporator heat transfer element and a first condenser heat transfer element. The heat exchanger includes a second heat exchanger module coupled to the first heat exchanger module by a fluid connection element for an exchange of the working fluid between the first heat exchanger module and second heat exchanger module. | 10-03-2013 |
20130279115 | System And Methods For Reduced Power Consumption And Heat Removal In Optical And - A heat removal system for use in optical and optoelectronic devices and subassemblies is provided. The heat removal system lowers the power consumption of one or more active cooling components within the device or subassembly, such as a TEC, which is used to remove heat from heat generating components within the device or subassembly. For any particular application, the heat removal system more efficiently removes the heat from the active cooling component, by using a heat transfer assembly, such as a planar heat pipe type assembly. The heat transfer assembly employs properties like, but not limited to, phase transition change and thermal conductivity to move heat without external power. In some embodiments, the heat transfer assembly can be used to allow the active cooling component, such as a TEC to be removed, leaving the heat transfer assembly to remove the heat from the device or subassembly. | 10-24-2013 |
20130286591 | Power Electronics Cooling - A system for cooling components of a power generation system. The system may include a working fluid, 100% of which may be sent to a heat exchanger for cooling the components. During cooling, the working fluid may be retained in liquid form. All of the working fluid exiting the heat exchanger may be introduced to an evaporator which may transform the working fluid to a gas for use by an expander or other device to create motive power to run a generator. Upon exiting the expander, the gas may be condensed back to liquid form, 100% of which may be sent back to the heat exchanger to cool the components. | 10-31-2013 |
20130294030 | ELECTRONIC DEVICE AND HEAT DISSIPATION MODULE THEREOF - The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree. | 11-07-2013 |
20130308271 | TWO-PHASE ELECTRONIC COMPONENT COOLING ARRANGEMENT - An electronic component assembly includes a housing that provides a cavity filled with a cooling fluid that has a liquid phase and a vapor phase. An electronic element is arranged in the cavity and is configured to generate heat. A wicking material is arranged in the cavity between the housing and the electronic device. The cavity provides a gap adjacent to the wicking material. The wicking material is configured to absorb the liquid phase, and the vapor phase is provided in the gap. | 11-21-2013 |
20130308272 | HEAT PIPE AND ELECTRONIC COMPONENT HAVING THE HEAT PIPE - A heat pipe includes a laminate formed by laminating a plurality of flat plates and having capillary tubes formed in the interior thereof, and a working fluid contained in the capillary tubes and operable to transfer heat. In the heat pipe, the laminate has insulating layers made of an insulating material and metal layers made of a metal material, which are alternately laminated. | 11-21-2013 |
20140029200 | HIGH VOLTAGE POWER SUPPLY SYSTEM AND METHOD - A high voltage alternator feeding power electronics and then one or more magnetic components to create a high current low voltage power system includes a substrate/buss plate performs heat extraction and electrical termination. The system includes a substrate ( | 01-30-2014 |
20140036448 | DISPLAY APPARATUS - A display apparatus and a method of spreading heat in the display apparatus are provided. The display apparatus includes: a display panel which display an image on a front surface thereof; an intermediate panel disposed on a rear surface, opposite the front surface, of the display panel; and a heat spreader disposed on the rear surface of the intermediate panel and which spreads heat, the heat spreader extending in a longitudinal direction from a first position of the rear surface of the intermediate panel in which the heat is present to a second position of the rear surface of the intermediate panel. | 02-06-2014 |
20140036449 | Method for limiting the variation in the temperature of an electrical component - A method for limiting temperature variation of an electrical component includes detecting a switch from passive to active states and, in response, varying a potential difference between capacitor electrodes from a first value to a second value, the electrodes being mechanically and electrically insulated from each other by a layer of electrocaloric dielectric, and in response to detecting a switch from active to passive states, varying the potential difference between the electrodes from the second to the first value. | 02-06-2014 |
20140043766 | MULTI-LAYER MESH WICKS FOR HEAT PIPES - Methods for fabricating heat pipes and heat pipes therefrom are provided. The heat pipe ( | 02-13-2014 |
20140055954 | HEAT PIPE STRUCTURE, AND THERMAL MODULE AND ELECTRONIC DEVICE USING SAME - An electronic device has a heat source and a thermal module. The thermal module includes a plurality of radiating fins respectively provided with a through hole, and a heat pipe structure having a pipe body. The pipe body has a vaporizing section in contact with the heat source and a condensing section extended through the radiating fins via the through holes thereon. The vaporizing section has a first pipe thickness and is internally provided with a first wick structure to define a first flow channel. The condensing section has a second pipe thickness smaller than the first pipe thickness, and is internally provided along part of its length with at least one second wick structure to define at least one second flow channel communicating with the first flow channel. | 02-27-2014 |
20140063741 | POWER ELECTRONICS SYSTEM WITH LIQUID COOLING SYSTEM - A power electronics system includes a multipart housing having three housing elements of cuboid basic structure to define a central element with inlet and outlet ports for a cooling liquid, an upper and lower cover elements which are arranged on opposite connection surfaces of the central element. A plurality of power electronics switching devices is accommodated in the housing, and a condenser device having condenser connection elements is arranged in the central element of the housing> Further provided is a liquid cooling system having at least one first upper cooling chamber between the central element and the upper cover element, and at least two first and second lower cooling chambers between the central element and the lower cover element. The upper and lower cooling chambers are configured for circulation of the cooling liquid entering through the inlet port and exiting through the outlet port of the housing. | 03-06-2014 |
20140071626 | VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE - A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels. | 03-13-2014 |
20140071627 | COOLANT DRIP FACILITATING PARTIAL IMMERSION-COOLING OF ELECTRONIC COMPONENTS - Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component. | 03-13-2014 |
20140071628 | CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL FLOW - A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold. | 03-13-2014 |
20140078673 | HEAT TRANSFER ASSEMBLY WITH HEAT PIPE BRACE AND METHOD FOR ASSEMBLING A HEAT TRANSFER ASSEMBLY - An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis. | 03-20-2014 |
20140078674 | COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 03-20-2014 |
20140078675 | COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 03-20-2014 |
20140085822 | WICKING AND COUPLING ELEMENT(S) FACILITATING EVAPORATIVE COOLING OF COMPONENT(S) - Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component. | 03-27-2014 |
20140092559 | COOLING DEVICE AND ELECTRONIC APPARATUS - A cooling device includes: a heat dissipating part disposed at an end of a heat transfer member; a heat-receiving plate disposed at the other end of the heat transfer member, provided opposite to a noise-generating part mounted on a circuit board, and thermally coupled to the noise-generating part; and a shielding unit disposed at the other end of the heat transfer member, the shielding unit covering the noise-generating part. | 04-03-2014 |
20140104789 | CHILLER-LESS COOLING SYSTEM AND METHOD FOR INTERVENTIONAL DETECTOR - A chiller-less cooling system for cooling an interventional detector comprising a detector housing. The detector housing comprising a detector tray to which the detector is attached, a lift frame on which a driving mechanism is installed to lift up/down the detector housing, a connecting arm to connect the detector tray and the lift frame, and a cover. The cooling system comprising a heat pipes connecting the detector tray and the lift frame so as to reduce a thermal resistance between the detector tray and the lift frame and transfer more heat from the detector, an external heat sink connected with the heat pipe for reducing a thermal resistance between the lift frame and an ambient environment, and a high heat transfer coefficient device embedded into the detector tray for collecting heat leading to the heat pipe, obtaining a uniform temperature distribution, and reducing a thermal resistance of the detector tray. | 04-17-2014 |
20140118942 | ELECTRONIC DEVICE - An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material and 15 to 20 percent volume of air. The heat dissipation device has a surface thermally contacting the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. The heat source is located in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal conduction. | 05-01-2014 |
20140118943 | ELECTRONIC DEVICE - An electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The heat dissipation device has a surface facing the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. An orthographic projection region on the surface is in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal radiation. | 05-01-2014 |
20140133102 | HEAT DISSIPATING ASSEMBLY AND ELECTRONIC DEVICE ASSEMBLY WITH HEAT DISSIPATING ASSEMBLY - An electronic device assembly includes an electronic device, an internal heat dissipating mechanism, an external heat dissipating mechanism, and the heat dissipating mechanism. The electronic device includes a bottom base, and the internal heat dissipating mechanism is secured inside the bottom base, to dissipate heat generated by the electronic device. The external heat dissipating mechanism is secured outside the bottom base. The heat conduction block is secured to the internal heat dissipating mechanism and contacts with the external heat dissipating mechanism. The heat conduction block directs heat from the internal heat dissipating mechanism, and the external heat dissipating mechanism directs heat from the heat conduction block, to increase the heat dissipating efficiency of the internal heat dissipating mechanism, to make the electronic device work in a proper temperature. | 05-15-2014 |
20140140006 | Cooling Apparatuses Having Sloped Vapor Outlet Channels - Jet impingement and two-phase cooling apparatuses with sloped vapor outlet channels are disclosed. In one embodiment, a cooling apparatus includes a fluid inlet channel, a jet orifice surface having one or more jet orifices fluidly coupled to the fluid inlet channel such that coolant fluid within the fluid inlet channel flows through the one or more jet orifices as one or more impingement jets, and a target surface. The target surface and the jet orifice surface define an impingement chamber where the one or more impingement jets impinge the target surface at an impingement region such that at least some of the coolant fluid changes to a vapor. The cooling apparatus further includes a plurality of sloped vapor outlet channels that are fluidly coupled to the impingement chamber. Coolant fluid flows through the plurality of sloped vapor outlet channels after it impinges the target surface. | 05-22-2014 |
20140146475 | FLEXIBLE THERMAL INTERFACE FOR ELECTRONICS - A planar heat pipe for removing heat from an electronic device. The heat pipe includes a planar portion defining a cool end of the heat pipe and a plate portion mounted to the electronic device and defining a hot end of the heat pipe. The heat pipe also includes a serpentine portion coupled to the planar portion and the plate portion, where each of the planar portion, the plate portion and the serpentine portion include an internal chamber being in fluid communication with each other and containing a working fluid. The serpentine portion can include a plurality of elements where each element is coupled to an adjacent element at substantially a 90° angle so as to allow the serpentine portion to flex in three-degrees of freedom. | 05-29-2014 |
20140153191 | Electronic Component Cooling Hood and Heat Pipe - An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis. | 06-05-2014 |
20140160679 | INTERFACE CARD COOLING UISNG HEAT PIPES - A device may have: a frame section having a cage with a first receiving portion and a second receiving portion, the second receiving portion receiving a module; a first plate having an end, the first plate being received by the first receiving portion; a heat pipe having a first end attached to the end of the first plate and having a second end; a second plate attached to the second end of the heat pipe; and a spring attached to the first plate to bias the first plate against the module, the first plate being capable of receiving heat dissipated by the module, the heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate, the second plate receiving the heat transferred by the heat pipe and dissipating the received heat. | 06-12-2014 |
20140160680 | VAPOR PORTS FOR ELECTRONIC DEVICES - An electronic device that has components is provided with a housing that defines an exterior and an interior of the electronic device. The housing includes a vapor port that prevents ingress of liquid through the vapor port from the exterior of the electronic device to the interior of the electronic device. The vapor port also permits egress of vapor through the vapor port from the interior of the electronic device to the exterior of the electronic device. The vapor port may include a breathable, but water-resistant or waterproof barrier to prevent water from entering through barrier while enabling water vapor to exit through the barrier and, thus, the vapor port. | 06-12-2014 |
20140192485 | VEHICLES, POWER ELECTRONICS MODULES AND COOLING APPARATUSES WITH SINGLE-PHASE AND TWO-PHASE SURFACE ENHANCEMENT FEATURES - Jet-impingement, two-phase cooling apparatuses and power electronics modules having a target surface with single- and two-phase surface enhancement features are disclosed. In one embodiment, a cooling apparatus includes a jet plate surface and a target layer. The jet plate surface includes a jet orifice having a jet orifice geometry, wherein the jet orifice is configured to generate an impingement jet of a coolant fluid. The target layer has a target surface, single-phase surface enhancement features, and two-phase surface enhancement features. The target surface is configured to receive the impingement jet, and the single-phase surface enhancement features and the two-phase enhancement features are arranged on the target surface according to the jet orifice geometry. The single-phase surface enhancement features are positioned on the target surface at regions associated with high fluid velocity, and the two-phase surface enhancement features are positioned on the target surface at regions associated with low fluid velocity. | 07-10-2014 |
20140247556 | HEAT REMOVAL IN AN INTEGRATED CIRCUIT ASSEMBLY USING A JUMPING-DROPS VAPOR CHAMBER - Embodiments of the present disclosure are directed towards techniques and configurations for thermal management of an integrated circuit assembly using a jumping-drops vapor chamber. In one embodiment, an apparatus includes a die having a first side including a plurality of integrated circuit devices that are configured to generate heat when in operation, and a second side disposed opposite to the first side, and a vapor chamber including a liquid, an evaporator including a surface that is thermally coupled with the second side of the die, the evaporator being configured to evaporate the liquid to vapor, and a condenser including a superhydrophobic surface and configured to condense the vapor, wherein energy released from coalescence of condensed vapor on the superhydrophobic surface causes the condensed vapor to jump from the superhydrophobic surface of the condenser to the surface of the evaporator. Other embodiments may be described and/or claimed. | 09-04-2014 |
20140247557 | PHASE-CHANGE CHAMBER WITH PATTERNED REGIONS OF HIGH AND LOW AFFINITY TO A PHASE-CHANGE MEDIUM FOR ELECTRONIC DEVICE COOLING - A phase-change chamber, a method for fabricating a phase-change chamber and a heat dissipation apparatus for electronic device cooling are disclosed. The phase-change chamber includes: a phase-change medium capable of transitioning between a plurality of phases; a first surface for transitioning a portion of the phase-change medium from a first phase into a second phase; a second surface for transitioning a portion of the phase-change medium from the second phase into the first phase; and at least one supporting member along the circumference of the first surface and the second surface for separating and enclosing the first surface and the second surface. The first surface is patterned on a first plate and includes regions of high and low affinity to the phase-change medium. The second surface is received on a second plate and comprises low affinity to the phase-change medium. | 09-04-2014 |
20140268572 | ADVANCED COOLING FOR POWER MODULE SWITCHES - A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer, spreading the heat through a heat spreader, transferring the heat from the heat spreader to a heat sink that contains microchannels, and releasing the heat from the heat sink into an ambient. | 09-18-2014 |
20140285971 | HAND POWER TOOL - A hand power tool, in particular an angle grinder, includes a drive unit, an electronic unit, and a cooling device configured, at least partially, to cool the drive unit and/or the electronic unit. The cooling device includes at least one cooling unit configured, at least partially, for localized cooling. | 09-25-2014 |
20140313671 | POWER CONVERSION APPARATUS - A power conversion apparatus includes a refrigerant supply and discharge portion and a laminated body. The refrigerant supply and discharge portion performs supply and discharge of refrigerant with respect to the cooler. The refrigerant supply and discharge portion is placed on a first end face of the laminated body, the first end face intersecting with a first vertical direction vertical to a laminating direction in the laminated body. One of the terminal portion and the electrode terminal of the semiconductor module is placed on a second end face of the laminated body, the second end face intersecting with the first vertical direction. | 10-23-2014 |
20140313672 | COOLING APPARATUS - Exemplary embodiments of the present disclosure are directed to an apparatus including pipes having internal longitudinal walls dividing the pipes into channels, a first and a second connecting part for providing a flow path between the channels of the pipes, a first heat transfer element having a first base plate with a first surface for receiving a heat load from one or more electric components and for transferring the heat load to a fluid, and a second heat transfer element. In order to obtain an efficient apparatus at least one first pipe that is at a location of an electric component is at least partly embedded in the first base plate via a second surface of the first base plate, while the pipes which are not at the location of an electric component are not embedded in the first base plate. | 10-23-2014 |
20140321058 | APPARATUS AND METHOD FOR DISSIPATING HEAT - An apparatus includes a display. The display may include a frame disposed at a bottom surface of the display. The apparatus may include a semiconductor chip. A heat pipe constructed of a thermally conductive material may be affixed to the frame. A surface of the heat pipe may oppose the semiconductor chip at a predetermined distance from the semiconductor chip. | 10-30-2014 |
20140321059 | HEAT DISSIPATION MODULE WITH HEAT PIPE - A heat dissipation module configured on a substrate having a heat producing element thereon includes a holder configured on the substrate and a heat sink having a base opposite to the heat producing element and pivotally connected to the holder and capable of joining to the substrate with the heat producing element covered by the base. | 10-30-2014 |
20150016062 | HIGHLY INTEGRATED POWER ELECTRONIC MODULE ASSEMBLY - A power electronic module assembly according to an exemplary aspect of the present disclosure includes, among other things, a vapor chamber and a substrate integrated with a first surface of the vapor chamber. At least one cooling feature is integrated with a second surface of the vapor chamber. | 01-15-2015 |
20150022975 | METHOD AND SYSTEM FOR AN IMMERSION BOILING HEAT SINK - A method and system for cooling a heat-generating component are provided. The system includes a heat generating electronic component including a heat conductive face, a heat sink device including at least one open face pin fin array surface directly coupled to the conductive face, each fin including a distal end including an outwardly facing contact area, the contact areas covering only a portion of the conductive face, the contact areas configured to carry electrical current therethrough, and an immersion of dielectric fluid contained in a vessel, the vessel including a heat-conductive hull at least partially submerged in a heat sink fluid. | 01-22-2015 |
20150029667 | RECEPTACLE ASSEMBLY FOR RECEIVING A PLUGGABLE MODULE - A receptacle assembly includes a cage having an interior cavity and a divider that divides the interior cavity into first and second ports. The cage has a front end that is open to the first and second ports, which are configured to receive first and second pluggable modules, respectively, therein through the front end. The divider includes an internal compartment that extends between the first and second ports. The receptacle assembly includes a thermal transfer assembly having a base and a spring. The base is received within the internal compartment of the divider and includes a module side that faces the first port. The spring is operatively connected between the divider and the base such that the spring is configured to bias the base toward the first port and thereby press the module side of the base into thermal communication with the first pluggable module. | 01-29-2015 |
20150055300 | HEAT DISSIPATION STRUCTURE AND HANDHELD ELECTRONIC DEVICE WITH THE HEAT DISSIPATION STRUCTURE - A heat dissipation structure includes a heat conduction support body disposed in a handheld electronic device. The heat conduction support body has a first face and a second face opposite to the first face. A chamber is defined between the first and second faces. More than one capillary structure and a working fluid are disposed in the chamber. One of the first and second faces or both of the first and second faces are in contact with the electronic components of the handheld electronic device. One of the first and second faces is in contact with the housing of the handheld electronic device. Accordingly, the heat generated by the electronic components can be quickly conducted and dissipated outward. | 02-26-2015 |
20150062819 | APPARATUS AND METHODS USING HEAT PIPES FOR LINKING ELECTRONIC ASSEMBLIES THAT UNEQUALLY PRODUCE HEAT - An apparatus includes at least one heat sink and first and second electronic assemblies mounted on the at least one heat sink at respective first and second mounting sites and configured to unequally (e.g., at least partially non-concurrently) produce heat. At least one heat pipe is thermally coupled to the at least one heat sink and extends between locations proximate the first and second mounting sites. For example, the first and second electronic assemblies may be components of respective subsystems of an uninterruptible power supply (UPS), such as a rectifier and a battery converter, that generate heat in an at least partially non-concurrent manner. | 03-05-2015 |
20150062820 | HEAT TRANSFER FOR ELECTRONIC EQUIPMENT - An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit. | 03-05-2015 |
20150062821 | Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same - The size of an electronic device using a cooling structure for an electronic circuit board is increased when using a heating element with a large amount of heat generation, therefore, a cooling structure for an electronic circuit board according to an exemplary aspect of the present invention includes an evaporator with an evaporation container storing a refrigerant; a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; and a pipe connecting the evaporator to the condenser, wherein the evaporator includes a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area including the heat receiving area, extending in the direction parallel to the electronic circuit board; and a vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in the vertical direction, in the arrangement condition that the drawing direction of the flow path plates is approximately parallel to the vertical direction. | 03-05-2015 |
20150070846 | System and Method for Powering Multiple Electronic Devices Operating Within an Immersion Cooling Vessel - An immersion cooling tank comprises: a dielectric liquid disposed within a lower volume of the tank; at least one electronic equipment immersed within the dielectric liquid and which requires electrical power to operate; and at least one power distribution unit and/or a bus bar distribution system submerged beneath a surface of the dielectric liquid and providing electrical power to the at least one electronic equipment. The immersion cooling tank further includes a condenser located vertically above the dielectric fluid and the at least one electronic equipment, and through which is flowing a condensation fluid that has a lower density than the dielectric liquid. A leak of the condensation fluid into the tank volume results in the condensation fluid floating atop the dielectric liquid and prevents the condensation liquid from coming into contact with the power distribution unit. The bus bar distribution system enables blind mating of inserted electronic components. | 03-12-2015 |
20150077937 | APPARATUS FOR COOLING BOARD MOUNTED OPTICAL MODULES - An apparatus comprising a fluid-circulator loop configured to be located on a circuit board, wherein a heat-removal portion of the fluid-circulator loop is configured to be located adjacent to an optical transceiver module on the circuit board. | 03-19-2015 |
20150077938 | VARIABLE CONDUCTANCE THERMOSIPHON - The present invention relates cooling system comprising at least one Thermo syphon, which Thermo syphon comprises at least one indoor evaporator, which is by first tubing connected to at least one outdoor condenser. It is the object of the present application to achieve effective automatic cooling of electronic systems placed inside a housing. This can be achieved by a system as disclosed in that the second tubing comprises a valve, which valve comprises a valve seat and a moveable valve piston, which valve piston is by decreasing temperature by the actuator moving towards the valve seat for closing the valve. Hereby a highly efficient cooling system can be achieved which can operate automatically without any energy supply from the outside, due to the use of the Thermo syphon principle. In situations where the outdoor temperature is decreasing to a low level which could occur in situations where the outdoor condensers in winter periods is cooled to a low temperature, there is a valve, which reduces or stops condensate and liquid refrigerant backwards to the evaporator. | 03-19-2015 |
20150077939 | AIR CONDITIONER - An air conditioner is provided. The air conditioner may include an electronic device, which may include a control component to drive a refrigerant cycle, and a cooling tube through which a refrigerant to cool the electronic device may flow. The cooling tube may be coupled to one side of the electronic device. The electronic device may include an electronic case having at least one through hole, an electronic board to which the control component may be coupled, the electronic board being disposed in the electronic case, at least one heat transfer plate disposed to contact the control component, the at least one heat transfer plate being coupled to the electronic case, and at least one heat sink, to which the cooling tube may be coupled, the at least one heat sink contacting the at least one heat transfer plate through the at least one through hole. | 03-19-2015 |
20150109735 | PUMP-ENHANCED, IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) - Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling. | 04-23-2015 |
20150109736 | Electronic Device Assemblies and Vehicles Employing Dual Phase Change Materials - Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state. | 04-23-2015 |
20150109737 | POWER CONVERSION APPARATUS - A power conversion apparatus includes an electrical circuit including a heat source, a heat pipe cooler in which a refrigerant is enclosed, the heat pipe cooler configured to cool the heat source, a freeze determiner configured to determine whether the refrigerant is frozen, and an output limiter configured to limit output when the freeze determiner determines that the refrigerant is frozen. | 04-23-2015 |
20150116940 | CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME - A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component. | 04-30-2015 |
20150116941 | FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER - Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 04-30-2015 |
20150131229 | CONNECTING STRUCTURE OF COOLING DEVICE, COOLING DEVICE, AND METHOD FOR CONNECTING COOLING DEVICE - It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening. | 05-14-2015 |
20150138731 | COOLING APPARATUS WITH DYNAMIC LOAD ADJUSTMENT - A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to facilitate heat transfer away from the heat producing units. The cooling apparatus may also have multiple heat sink columns located above, and designed to conduct heat away from, corresponding heat producing units, through thermally conductive contact with corresponding portions of the TIM layer. The cooling apparatus may also have a load plate located above the heat sink columns, designed to hold the heat sink columns in a relatively fixed position above the heat producing units. The TIM layer may have an initial compressed state between the heat sink columns and the corresponding heat producing units. Each of the heat sink columns may be designed so that, in operation, the corresponding portion of the TIM layer may have a further compressed state. | 05-21-2015 |
20150296661 | HEAT SINK APPARATUS AND METHOD FOR POWER SEMICONDUCTOR DEVICE MODULE - A heat sink has a base plate that has a first central portion, a second central portion, and a periphery, a first plurality of heat pipes embedded in the base plate that are arranged to convey heat away from the first central portion, and a second plurality of the heat pipes embedded in the base plate that are arranged to convey heat away from the second central portion, each of the heat pipes of the first and second pluralities having a hot end for receiving heat flow and a cool end for releasing heat flow. A switch package comprises an inner casing half mounted to a module facing surface of the heat sink base plate, a semiconductor module mounted to the module facing surface of the heat sink within the inner casing half, and an outer casing half that encloses the heat sink. | 10-15-2015 |
20150319885 | OUTDOOR UNIT AND REFRIGERATION CYCLE APPARATUS - An outdoor unit includes: a heat exchanger in which heat transmission fins are fitted to and fixed to heat transmission pipes with predetermined distances so that heat is exchanged between refrigerant passing through the heat transmission pipes and air passing between the heat transmission fins; an electric component that controls equipment; and a cooling member disposed above a channel of air that has passed through the heat exchanger and configured to dissipate heat from the electric component to the air. The distance between the heat transmission fins in a position corresponding to the position of the cooling member and serving as a passage of the air passing through the cooling member is larger than that in the other positions. | 11-05-2015 |
20150323262 | HEAT DISSIPATING APPARATUS AND ELECTRONIC DEVICE HAVING THE SAME - A heat dissipating apparatus and an electronic device having the same are provided. The electronic device includes a body, an internal circuit board provided in the body and including at least one heat generating element, and a heat diffusion type heat dissipating module provided in the body and stacked on a surface of the internal circuit board, so as to diffuse heat generated by the heat generating element toward a low temperature region having a temperature lower than a temperature of the at least one heat generating unit. The heat diffusion type heat dissipating module has a sheet shape which extends from the heat generating element toward a circumference surface of an inside of the body so that the heat is transferred from the heat generating element to the low temperature region. | 11-12-2015 |
20150334876 | EVAPORATOR, COOLING DEVICE, AND ELECTRONIC DEVICE - An evaporator includes a housing in which an evaporator chamber configured to evaporate a refrigerant is formed; a heat transfer surface provided on an inner wall of the housing and having a hot area which is a part that becomes hot due to heat transferred from a heating element to the housing; and a supply port formed in the housing, opposed to the hot area and configured to eject the refrigerant supplied from a supply pipe to the hot area, wherein a narrow groove is formed in the heat transfer surface. | 11-19-2015 |
20150342089 | MOBILE TERMINAL - A mobile terminal having a structure increasing heat dissipation efficiency, including a printed circuit board (PCB) disposed within a terminal body and having a heating element which generates heat mounted thereon, a frame having a space formed on one surface thereof and allowing the PCB to be installed therein, and a heat pipe supported by the frame, disposed on one surface of the frame, and connected to the PCB to dissipate heat generated by the heating element outwardly from the terminal body, wherein the frame includes a hold portion extending from an end portion thereof to cover at least a portion of the heat pipe in order to prevent the heat pipe from being released from the frame by external force applied to the terminal body. | 11-26-2015 |
20150348869 | Two-Sided Jet Impingement Assemblies and Power Electronics Modules Comprising the Same - Power electronics modules having jet impingement assemblies utilized to cool heat generating devices are disclosed. In one embodiment, a jet impingement assembly includes coupled manifold plates having a fluid inlet and outlet, a distribution surface, and a collection surface. The distribution surface of the first and second manifold plate is coupled to define a distribution manifold having a fluid distribution channel and one or more arrays of orifices extending through both manifold plates. Heat transfer plates are coupled to each manifold plate's collection surface forming impingement chambers. The heat transfer plates include one or more arrays of fins extending toward the collection surface of each manifold plate fluidly coupled to the fluid outlet. The first and second manifold plates and the first and second heat transfer plates are positioned in a horizontal stack such that the fluid inlets of both manifold plates are adjacent. | 12-03-2015 |
20150359132 | FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS - A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink. | 12-10-2015 |
20150359133 | TWO-PHASE COOLING SYSTEMS, POWER ELECTRONICS MODULES, AND METHODS FOR EXTENDING MAXIMUM HEAT FLUX - Two-phase cooling systems, power electronics modules, and methods for extending a maximum heat flux point of a two-phase cooling device are disclosed. In one embodiment, a method of operating a two-phase cooling device having an inlet, a chamber fluidly coupled to the inlet, and a heat transfer surface configured to receive heat flux from a heat generating device includes detecting at least one two-phase process parameter of the two-phase cooling device, and controlling a temperature of a coolant fluid at the inlet such that it is e a first inlet temperature T | 12-10-2015 |
20160007504 | ELECTRONIC SUBSTRATE WITH HEAT DISSIPATION STRUCTURE - An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation layer from top to bottom. The wiring layer has at least one heat-producing element mounted thereon, and is formed with a receiving hole for the heat pipe to tightly fit therein. Heat produced by the heat-producing element and distributed over a high-temperature zone of the substrate plate surrounding the heat-producing element is absorbed by the heat pipe and then transferred to a low-temperature zone of the substrate plate distant from the heat-producing element, from where the heat is dissipated into ambient air to achieve cooling effect at upgraded heat dissipation efficiency. | 01-07-2016 |
20160021786 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a heat-producing element, a first heat absorber, a second heat absorber and a heat transfer member. The heat-producing element produces heat in the housing. The first heat absorber is provided on an inner surface of the housing to face the heat-producing element. The first heat absorber absorbs heat from the heat-producing element in the housing. The second heat absorber is provided on the inner surface of the housing at a position separate from the first heat absorber. The heat transfer member transfers heat from the heat-producing element absorbed by the first heat absorber to the second heat absorber. | 01-21-2016 |
20160029511 | ELECTRONIC DEVICE INCLUDING HEATING ELEMENT - A heat transfer apparatus is provided. The heat transfer apparatus includes a first thermal conductor. The heat transfer apparatus also includes a second thermal conductor. The heat transfer apparatus further includes an interface member configured to transfer heat between the first thermal conductor and the second thermal conductor. A portion of the interface member contains a thermoplastic material reacting via an application of the heat. | 01-28-2016 |
20160037684 | SET-TOP BOX - A set-top box with a heat dissipation device is provided to improve heat dissipation efficiency. The set-top box includes a main body configured to form an exterior, a circuit board provided inside the main body, and a heat dissipation device provided to cool heat generated from the circuit board. The heat dissipation device includes a heat pipe provided to be in contact with at least one surface of the circuit board. | 02-04-2016 |
20160073548 | COOLING MODULE, COOLING MODULE MOUNTING BOARD AND ELECTRONIC DEVICE - A cooling module includes a casing that stores a heating element and a coolant in which the heating element is immersed; and a liquid channel through which a cooling liquid that condenses vapor of the coolant in an upper portion of the casing flows. | 03-10-2016 |
20160081224 | ARRANGEMENT AND METHOD FOR COOLING LIQUID-COOLED ELECTRONICS - An arrangement and a method are provided for cooling liquid-cooled electronics. The arrangement includes a pipe system, said pipe system including receiving and exit coolant flow pipes for connecting the arrangement to a liquid-cooling system of said liquid-cooled electronics, inlet and outlet coolant flow pipes for connecting the arrangement to a heat exchanger arrangement, and an expansion tank connected to the coolant flow pipes. The arrangement further includes a coolant level transmitter arranged to detect the amount of the coolant in the expansion tank, a temperature measure arrangement arranged for measuring temperature of the coolant in the arrangement, and a leakage control system. The leakage control system includes a calculator for calculating a temperature corrected reference value for the amount of the coolant in the expansion tank and for calculating a temperature corrected coolant volume by using said temperature corrected reference value. | 03-17-2016 |
20160088762 | ELECTRONIC DEVICE AND HEAT DISSIPATING CASING THEREOF - An electronic device includes an electronic component and a heat dissipating casing configured to dissipate heat from the electronic component. The casing includes top and bottom sides of the heat dissipating casing forming a sealed chamber, and a pore structure formed within the sealed chamber. The sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium, whereby the heat generated from the electronic component is dissipated by a phase change of the working medium. | 03-24-2016 |
20160088769 | ELECTRONIC DEVICE AND HEAT DISSIPATION PLATE - An electronic device and a heat dissipation plate are provided. The electronic device includes a frame or a housing, a first heat generating component, a second heat generating component and a heat pipe, and the heat dissipation plate includes the frame and the heat pipe. The heat pipe is installed at the frame or housing and has branches. An orthogonal projection of the heat pipe on the frame or the housing overlaps at least part of orthogonal projections of the first heat generating component and the second heat generating component on the frame or the housing. | 03-24-2016 |
20160095197 | CIRCUIT BOARD MODULE AND CIRCUIT BOARD STRUCTURE - A circuit board module includes a circuit board structure, a heat generating element, and a cooling element. The circuit board structure has a plate component and a heat conductive component. The heat conductive component has a heat pipe and a resin excluding fiber glass. The heat pipe is disposed in the plate component and not protruding from the plate component. The resin fills a gap between the heat pipe and the plate component, and the resin substantially connects the heat pipe and the plate component without any gap. The heat generating element contacts the heat conductive component, and a portion of the heat conductive component adjacent to the heat generating element is defined as a heat absorbing portion. The cooling element contacts the heat conductive component, and a portion of the heat conductive component adjacent to the cooling element is defined as a heat dissipating portion. | 03-31-2016 |
20160095199 | CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF - A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component. | 03-31-2016 |
20160095254 | MANAGING HEAT TRANSFER FOR ELECTRONIC DEVICES - An apparatus for cooling a heat-producing electronic device is disclosed. The apparatus may include a thermally conductive vessel to mate with and contain a working fluid in contact with the heat-producing electronic device. A bottom side of the thermally conductive vessel may include a sealing surface defining an aperture and configured to mate with, and inside a perimeter of, a top surface of the heat-producing electronic device. The thermally conductive vessel may also include an evaporative cavity formed by mating the thermally conductive vessel with the heat-producing electronic device, and having a wall that is the top surface of the heat-producing electronic device and a wall that is an interior surface of the thermally conductive vessel. The thermally conductive vessel may also include a condensing cavity adjoining the evaporative cavity, to receive heat by condensing the working fluid from a vapor state to a liquid state. | 03-31-2016 |
20160106003 | AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING HEAT REMOVAL ASSEMBLY FOR MULTI-CHIP PACKAGES - Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed. | 04-14-2016 |
20160120066 | PLANAR HEAT CUP WITH CONFINED RESERVOIR FOR ELECTRONIC POWER COMPONENT - A cooling system for cooling an electronic component has a heat pipe defined by an inner wall and an outer wall with an intermediate fluid chamber. The heat pipe has a wall to be put in contact with a cold plate and extends away from the cold plate to define a cup shape with a fluid movement member positioned within the chamber to move the fluid from an end of the chamber adjacent to the cold plate to a spaced end of the cup shape. | 04-28-2016 |
20160120067 | SYSTEM AND METHODS FOR COOLING ELECTRONIC EQUIPMENT - Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid circuit that cools electronic equipment using a first fluid flowing therethrough and a second fluid circuit that free cools a second fluid flowing therethrough. The second fluid circuit cools the first fluid using the free-cooled second fluid. The system further includes a third fluid circuit that mechanically cools the second fluid using a third fluid flowing therethrough as a function of the wet bulb temperature of atmospheric air. The third fluid circuit includes at least one compressor compresses the third fluid and is driven by a motor coupled to the variable frequency drive. At least a portion of the first fluid flowing through the third fluid circuit is diverted to cool the inverter of the variable frequency drive. | 04-28-2016 |
20160128232 | INTERLAYER CHIP COOLING APPARATUS - An integrated circuit (IC) can be cooled by using a structure that includes two elements, such as integrated circuits (ICs) or electronic packages, in a stacked arrangement, with the elements having surfaces that face each other. The structure also includes a pair of fluidic channel boundaries, between the facing surfaces, where each fluidic channel boundary is formed by an arrangement of adjacent discrete connecting structures. The primary and secondary fluidic channel boundaries and the facing surfaces define a fluidic channel that is useful for promoting boiling of and directing the flow of a refrigerant between the two surfaces. | 05-05-2016 |
20160128234 | COOLING DEVICE AND ELECTRONIC APPARATUS - A cooling device including: a heat receiver in which a working fluid is enclosed, a heat sink in which the working fluid is enclosed, an air tube made of metal so as to have flexibility, the air tube coupling the heat receiver and the heat sink, the air tube in which the working fluid of a gas phase flows through, and a liquid tube made of metal so as to have flexibility, the liquid tube coupling the heat receiver and the heat sink, the liquid tube in which the working fluid of a liquid phase flows through. | 05-05-2016 |
20160135331 | DISPLAY MODULE WITH HEAT DISSIPATION STRUCTURE AND HANDHELD DEVICE THEREOF - A display module with heat dissipation structure and a handheld device thereof. The display module includes a touch panel, a display panel and a vapor chamber. One face of the display panel is correspondingly attached to the touch panel, while the other face of the display panel is correspondingly attached to the vapor chamber. The vapor chamber serves to support the touch panel and the display panel. Moreover, the vapor chamber serves to absorb the heat generated by the electronic component and quickly and uniformly spread the heat to dissipate the heat to achieve a heat spreading effect. | 05-12-2016 |
20160143186 | HEATPIPE IMBEDDED COLDPLATE ENHANCING IGBT HEAT SPREADING - A cold plate for a power circuit is disclosed. The power circuit includes a plurality of transistors and each of the plurality of transistors includes a plurality of dies. The cold plate includes a liquid cooling system that includes a plurality of cooling channels and each of the plurality of cooling channels is aligned with at least one die. The liquid cooling system includes a heat sink associated with each of the plurality of cooling channels. The cold plate further includes a plurality of heat pipes, wherein each of the plurality of heat pipes is aligned with at least one of the plurality of cooling channels and at least one die. Each heat pipe includes a wick lining an interior of the heat pipe, a vapor flow area, and a fluid. | 05-19-2016 |
20160157382 | APPARATUS | 06-02-2016 |
20160165758 | CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL FLOW - A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold. | 06-09-2016 |
20160165762 | STRUCTURAL FRAME COOLING MANIFOLD - A variable speed drive includes a converter connected to an AC power source, a DC link connected to the converter, and an inverter connected to the DC link. The inverter converts DC voltage into an output AC power having a variable voltage and frequency. The inverter includes at least one power electronics module and associated control circuitry; a heat sink in thermal communication with the power electronics module and in fluid communication with a manifold. The manifold includes a tubular member having at least one vertical member portion and at least one horizontal member portion in fluid communication. A plurality of ports conduct cooling fluid into and out of the manifold. A bracket attaches the manifold to a structural frame. Brackets are provided for attachment of power electronics modules to the manifold. | 06-09-2016 |
20220142017 | DOUBLE-SIDED HYBRID COOLING OF PCB EMBEDDED POWER ELECTRONICS AND CAPACITORS - A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider. | 05-05-2022 |