| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361693000 | Circular | 6 |
| 20100020492 | HEAT-DISSIPATING DEVICE - A heat-dissipating device includes a housing having a housing wall that defines an inner space and that is formed with first and second openings. A heat source is disposed inside the inner space. A heat-conductive set is in heat-communication with the heat source inside the inner space. A heat-exchange member is in heat-communication with fins of the heat-conductive set, and includes an inner tunnel that extends from the first opening to the second opening through the inner space so as to open to ambient air. The inner tunnel is free of fluid communication with the inner space, and ambient air can flow through the inner tunnel for heat exchange. | 01-28-2010 |
| 20100097757 | SHIELD CAN AND METHOD FOR FABRICATING THE SAME - A shield can includes a frame having a hole in the top wall thereof, and an enclosure attached to the frame and covering the hole. The frame and the enclosure are formed by punching a metallic piece, the enclosure corresponds to the hole in shape and size, the enclosure is fixed to the upper surface of the top wall. The invention also discloses the method for fabricating the shield can. | 04-22-2010 |
| 20100110630 | SYNTHETIC JET EMBEDDED HEAT SINK - A system and method for cooling heat-producing devices using synthetic jet embedded heat sinks is disclosed. The cooling system includes a heat sink comprising a base portion and a plurality of fins disposed on the base portion and extending vertically out therefrom, the plurality of fins spaced to define a channel between adjacent fins. The cooling system also includes at least one synthetic jet actuator attached to the heat sink, with each of the at least one synthetic jet actuators comprising a plurality of orifices therein and being configured to generate and project a series of fluid vortices out from the plurality of orifices and toward at least a portion of the channels of the heat sink. | 05-06-2010 |
| 20100195282 | WATERPROOF AND HEAT-DISSIPATING MODULE MOUNTED FOR AN ELECTRONIC DEVICE - A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away. | 08-05-2010 |
| 20100246123 | COOLING DEVICE - A cooling device for dissipating heat for an electronic device includes a shell to absorb heat generating from a heat generating element in the electronic device, and a number of fins. The shell bounds a heat exchanging space and defines an air intake and an air outlet. The number of fins extends into the heat exchanging space. The shell guides air outside the shell to enter into the shell through the air intake and to exit from the shell through the air outlet after exchanging heat in the heat exchanging space. | 09-30-2010 |
| 20130100612 | BACKLIGHT MODULE AND VENTILATION COMPONENT THEREOF - The present invention discloses a backlight module and a ventilation component thereof, and a back plate of the backlight module is provided with a plurality of the ventilation components. The ventilation component comprises: a tubular body, a ventilating filter, a filter washer, and a fixing ring. The tubular body is hollow, and the ventilating filter is carried in the tubular body. The ventilating filter can communicate the internal air with the external air of the backlight module circulate to effectively descend the temperature of the internal air, so that the thermal expansion of the light guide plate in the backlight module can be decreased to prevent from generating an optical problem. | 04-25-2013 |
