| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361687000 | With cooling means | 61 |
| 20080198546 | MOTHERBOARD HAVING ADVANCED FAN CONTROL FEATURES - A motherboard is capable of accepting various types of fans from same or different manufacturers and is capable identifying the type of fan to which it is connected. In one embodiment, the motherboard is capable of decoding bar code data originating from a fan of the type which, rather than including circuitry for generating a single index pulse, includes an integral optical sensor and bar code pair for generating the bar code data, the motherboard being further capable of and identifying the fan based on the bar code data. Fan identification has a variety of uses including, for example, adjusting motherboard parameters to properly operate the fan based on the type of fan presently coupled to the motherboard. Additionally, fan speed may be calculated from pulses which are intended to identify the fan. | 08-21-2008 |
| 20080198547 | ELECTRONIC DEVICE AND HEAT CONDUCTION MEMBER - According to one embodiment, an electronic device includes a case, a heat generation body mounted in the case, a cooling member mounted in the case, and a heat conduction member. The heat conduction member includes a heat receiving section opposed to the heat generation body and thermally connected to the heat generation body, a heat radiation section opposed to the cooling member, and a section provided between the heat receiving section and the heat radiation section. The heat conduction member is formed by laminating a plurality of sheet members each having thermal conductivity. The plurality of sheet members are joined together in a portion of the heat conduction member. | 08-21-2008 |
| 20080212277 | CARD SLOT AND ELECTRONIC DEVICE PROVIDED WITH CARD SLOT - A card slot according to the present invention is provided with a slot body, a heat sink, a first support and a second support. The slot body is configured to internally store an IC card. The heat sink is provided with a heat sink body and a first spring. The first spring is attached to the substantial center of an upper surface of the heat sink body, and supports the heat sink body. Also, the first spring is lowered with insertion of the IC card inside the slot, and presses the heat sink body downward. The first support is provided with two first leg sections, a first linking section and a first pressing spring. The two first leg sections are arranged facing positions sandwiching the heat sink body close to one end side of the slot body. The first linking section links fellow upper end vicinities of the two first leg sections. The first pressing spring extends from either the first leg sections or the first linking section towards an upper surface of the heat sink body, to press the upper surface of the heat sink body downwards. The second support is provided with two second leg sections, a second linking section and a second pressing spring. The two second leg sections are arranged facing positions sandwiching the heat sink body close to another end side of the slot body. The second linking section links fellow upper end vicinities of the two second leg sections. The second pressing spring extends from either the second leg sections or the second linking section towards an upper surface of the heat sink body, to press the upper surface of the heat sink body downwards. | 09-04-2008 |
| 20080218961 | HEAT DISSIPATION MODULE AND DESKTOP HOST USING THE SAME - A heat dissipation module suitable for a desktop host includes a case, a power supply with a fan, and a mother board. The power supply and the mother board are disposed in the case. The mother board includes a work components. The heat dissipation module includes a first heat sink, a second heat sink and a heat pipe. The first heat sink is disposed on the work components. The second heat sink is disposed outside the case and at the outlet port of the fan. The heat pipe is connected between the first heat sink and the second heat sink. Hence, the heat dissipation module can dissipate the heat generated by the work component. | 09-11-2008 |
| 20080218962 | COMPUTER SYSTEM - A computer system includes a chassis ( | 09-11-2008 |
| 20080218963 | DESKTOP PERSONAL COMPUTER AND THERMAL MODULE THEREOF - A thermal module adapted for a desktop personal computer is provided. The desktop personal computer comprises a housing, a power supply, and a motherboard, the power supply being located inside the housing, and including a fan having an outlet oriented toward an outside of the housing, and the motherboard being located inside the housing, and including thereon a plurality of electronic elements. The thermal module comprises a first heat sink, an adjustment device, a first heat pipe, a second heat sink, and a second heat pipe. The first heat sink is disposed on one of the electronic elements. The adjustment device is slidably and thermally connected to the first heat sink by the first heat pipe, and is slidably and thermally connected to the second heat sink, located outside the housing at the outlet of the fan, by the second heat pipe. | 09-11-2008 |
| 20080218964 | DESKTOP PERSONAL COMPUTER AND THERMAL MODULE THEREOF - A thermal module adapted for a desktop personal computer is provided. The desktop personal computer comprises a motherboard including a central processing unit and electronic elements. The thermal module comprises a first heat sink, at least one second heat sink, and a heat conductive plate. The first heat sink is disposed above the central processing unit. The second heat sink is disposed above one of the electronic elements. The heat conductive plate is coupled to the second heat sink, extends from the second heat sink to the central processing unit, and is engagingly sandwiched between the central processing unit and the first heat sink. | 09-11-2008 |
| 20080225478 | Heat Exchange System for Blade Server Systems and Method - A heat exchange system for blade server systems is disclosed, wherein said blade server system contains a plurality of server blades arranged in a blade center, wherein the heat exchange system comprises first heat sinks associated to each of said plurality of server blades, and whereby the first heat sinks are adapted to collect heat emitted from heat emitting devices on said associated server blade; means for transferring heat from the heat emitting devices to the first heat sinks; and a liquid cooled second heat sink associated to said blade center, whereby said first heat sinks are connected to said second heat sink by thermal coupling. | 09-18-2008 |
| 20080232062 | Vibration-isolating fixing mechanism for fan frame - A vibration-isolating fixing mechanism for a fan frame. The mechanism, configured to couple the fan frame to first fastening portions of a casing, includes: coupling portions protrudingly disposed on two installation surfaces of the fan frame; positioning brackets each having second fastening portions and through-holes; resilient elements each circumferentially disposed between each coupling portion and each through-hole and extending to two through-hole-corresponding sides of each positioning bracket; and coupling elements coupled to the coupling portions respectively, positioned on one side of each resilient element facing away from the fan frame, and configured to position the positioning brackets and the fan frame relative to one another. Axial vibration isolation is achieved by insertion of the coupling portions into the through-holes circumferentially disposed with the resilient elements and by resilient contact between each resilient element and each coupling element. | 09-25-2008 |
| 20080232063 | COMPUTER - A computer includes a casing in which an opening is formed, a heat generating element which is provided inside of the casing, a main cooling unit which is disposed between the opening of the casing and the heat generating element and cools heat which is generated from the heat generating element, and an auxiliary cooling unit which is provided inside of the casing and additionally cools inside air directed to the main cooling unit. | 09-25-2008 |
| 20080232064 | COOLING SYSTEM FOR INFORMATION DEVICE - To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack. | 09-25-2008 |
| 20080239659 | Data Processing System Storage Unit, Data Processing System Cooling Apparatus And Data Processing System - A data processing system storage unit for storing a plurality of data processing systems is disclosed. In one example of the storage unit, a plurality of storage spaces, each storage space configured for storing a data processing system, is provided. An air inlet duct and an air outlet duct allow air circulation within the storage unit. A plurality of inlet conduits, each inlet conduit configured to connect the inlet air duct to an inlet port of a data processing system, provides air supply to the data processing system. A plurality of outlet conduits, each outlet conduit configured to connect the outlet air duct to an outlet port of a data processing system, provides air exhaust from the data processing system. The example storage unit may also provide a primary air transfer system configured for directing air into the air inlet duct and/or for extracting air from the air outlet duct. | 10-02-2008 |
| 20080247133 | Vehicle-mounted electrical junction box - A casing includes a first casing member and a second casing member. The first casing member is provided on a side with a fuse module mounting section having a side opening. The second casing member is provided on the same side as the first casing member with a relay module mounting section having a side opening and extending downward. An ECU mounting frame extends from a bottom wall of the second casing member. An ECU is disposed on a second side of a bottom wall of the second casing member and in parallel with the relay module mounting section. A fuse module is attached to the fuse module mounting section to receive fuses. A relay module is attached to the relay module mounting section to receive relays. The fuse module and relay module that generate heat are disposed on a side of the casing in a vertical direction. | 10-09-2008 |
| 20080253080 | PANEL-TYPE HEAT SINK MODULE - The panel-type heat sink module combines the heat-conducting panel, fin heat sink, diversion tank, fan and heat pipe into a single module. There is a heat-conducting surface and an assembly surface of the heat-conducting panel. The fin heat sink is assembled onto the assembly surface. The diversion tank is adapted onto the assembly surface and located nearby the fin heat sink. The diversion tank includes a fan container and a diversion channel. The fan is assembled into the fan container, and the heat pipe is assembled between the assembly surface and the fin heat sink. The heat pipe penetrates through the diversion tank; thus, the heat sources guided by the heat-conducting panel will be uniformly guided into the fin heat sink and diversion tank via the heat pipe. An air stream generated by the fan flows towards the fin heat sink, improving heat-radiation, and reducing assembly space. | 10-16-2008 |
| 20080253081 | Computing device support system - A computing device comprising a support system extendable and retractable relative to a housing, the support system extending across a lateral dimension of the housing between a pair of housing sidewalls to support at least a portion of the housing in an elevated position relative to a support surface. | 10-16-2008 |
| 20080253082 | Cooling system with flexible heat transport element - A computing device cooling system comprising a heat transport element for transferring heat from a heat generating component of a computing device to a heat dissipation element of the computing device, the heat transport element having at least one flexible section to facilitate bending of the heat transport element. | 10-16-2008 |
| 20080253083 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus is provided with a casing, a circuit board contained in the casing, an exothermic body mounted on the circuit board, a cooling fan which is fixed to the inside of the casing and includes a fan case, a heat receiving member which is opposed to the exothermic body and is thermally connected to the exothermic body, and a pressing member opposed to the heat receiving member from the opposite side of the exothermic body. The pressing member is provided to be integral with the fan case. Fixation of the cooling fan to the inside of the casing causes the pressing member to press the heat receiving member against the exothermic body. | 10-16-2008 |
| 20080253084 | COMPUTER CASING WITH A BACKSIDE COOLING CPU HEAT DISSIPATING FUNCTION - A computer casing includes a casing body and a housing covered onto the exterior of the casing body. The casing body constitutes a support framework of the computer casing and includes a sidewall disposed on an internal side of the casing body of the computer casing for erecting a computer panel. The sidewall includes a fan aligning portion having a plurality of ventilation holes. The fan aligning portion is disposed on the computer panel and at a position corresponding to the backside of a central processing unit (CPU) for installing a fan to assist the heat dissipation of the CPU. | 10-16-2008 |
| 20080253085 | 3-Dimensional Multi-Layered Modular Computer Architecture - New and unique apparatuses, systems and methods are provided for constructing and implementing a 3-Dimensional multi-layered modular computer architecture that significantly improves computer mass, volume and power densities through the use of 3-Dimensional layered structure. | 10-16-2008 |
| 20080259556 | Modular graphics expansion system - A modular graphics expansion system comprises a modular graphics expansion base communicatively couplable to a portable electronic device to enable the electronic device to transition from a standard graphics mode of operation to an enhanced graphics mode of operation. | 10-23-2008 |
| 20080259557 | Device cooling system - A device cooling system comprises a heat pipe disposed in a device, the heat pipe having a condenser portion and at least two divergent evaporator portions, the at least two evaporator portions coupled to at least one heat-generating component of the device. | 10-23-2008 |
| 20080259558 | Heat-Receiving Apparatus and Electronic Equipment - A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body. | 10-23-2008 |
| 20080259559 | Apparatus and method for controlling apparatus - An apparatus comprises a device and a processor. The device inputs information. The processor detects an input from the device and controls the operating frequency of the processor on the basis of frequency of the detected inputs. Thus, it is possible to achieve an apparatus capable of lowering the temperature of a case when the user is using the device. | 10-23-2008 |
| 20080266785 | HEAT DISSIPATOR FASTENER KIT - A heat dissipator fastening kit includes two retaining bars, at least one and as many as three different brackets and multiple fasteners. The retaining bars are resilient, attach to opposite sides of an appropriate heat dissipator and respectively have two ends. The bracket attaches to a motherboard around a CPU and to the retaining bars and has several embodiments to accommodate different types of CPUs, e.g. AM2, K8, LGA775 or P4, and their motherboards. The fasteners attach the retaining bars to a heat dissipator and the bracket and the bracket to a motherboard. With such an arrangement, the heat dissipator fastening kit will be convenient and easy to use. | 10-30-2008 |
| 20080273301 | SECURE DEVICE FOR A HEAT SINK AND CPU - A secure device for a heat sink and CPU includes a main support arm and an operation handler. The main support arm has a first hook section at one end thereof and provides a contact face and a movable second hook section at another end thereof. The operation handle further includes a main operation part and a handle part and the main operation part provides a guide groove with a first end and a second end. The guide groove extends along radial direction of main operation part from the first end to the second end and a uvula is formed between the first end and the second end. The circumferential side of the main operation part defines a press section for touching the contact face and a pivotal shaft is movably joined to the guide groove and the second hook section to actuate the second hook section moving upward or downward to selectively perform engagement or loosening while the pivotal shaft moving along the guide groove between the first and second ends. | 11-06-2008 |
| 20080273302 | RETAINING DEVICE FOR A HEAT SINK - A retaining device for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two opposite sides thereof and the projection has a contact face. The operation member provides a main operation part and a stir part. The main operation part is disposed on top of the contact face and the stir part is actuated to rotate for the main operation part being capable of moving relative to the contact face. The engaging member further has a follower part piercing the projection with an end of the follower part connecting with the main operation part pivotally and another end of the follower part being joined to a first elastic part and a second elastic part respectively. The first elastic part and the second elastic part oppositely extend horizontally and free ends of both the elastic parts are joined to two opposite lateral sides of an engaging part for controlling the engaging force evenly and decreasing plastic deformation. | 11-06-2008 |
| 20080278909 | COMPUTER ACCESSORY DEVICE HAVING RECESS FOR AIRFLOW - An accessory device comprising an accessory device housing having a surface that is adapted to be adjacent a computer housing when the accessory device and computer housings are attached together. The accessory device also comprises an electrical connector provided on the surface of the accessory device housing. The electrical connector is adapted to receive an electrical mating connector from the computer housing. A recess is formed on the surface of the accessory device housing that corresponds to an air vent in the computer housing when said computer housing is attached to the accessory device, thereby enabling air to flow through the recess and air event. | 11-13-2008 |
| 20080285228 | Arrangement For Cooling Electronic Modular Units in Equipment and Network Cabinets - The invention relates to an arrangement for cooling equipment and network cabinets, particularly server cabinets, in which the fans are integrated into a door. The resulting fan door, in the closed position, covers an access area of the rear of the cabinet and longitudinally adjacent to the fan door is arranged in fixed manner an air-to-fluid heat exchanger, whilst covering a residual area of the rear of the cabinet and to which is articulated the fan door. The heat loss given off to a cooling liquid, particularly cold water, in the heat exchanger is removed via a pipe system outside the cabinet installation area and rigid connecting pipes of a gas-tight material can be used for the connection of the heat exchangers of the individual cabinets to the building-side pipe system. | 11-20-2008 |
| 20080285229 | HEAT DISSIPATING MEMBER, HEAT DISSIPATING MECHANISM, AND INFORMATION PROCESSING APPARATUS - A heat dissipating member, a heat dissipating mechanism, and an information processing apparatus capable of improving the cooling efficiency without increasing the size of the apparatus are disclosed. In the information processing apparatus, it becomes possible to effectively transfer heat from a unit such as a memory disposed in an inner space of the apparatus to the outside regardless of the layout position of the unit by using the heat dissipating mechanism fixed to a unit and a heat dissipation surface so that the heat is transferred from the unit to the heat dissipation surface. | 11-20-2008 |
| 20080291622 | Electrical connector assembly having heat sink - An electrical connector assembly is provided for connecting an IC chip ( | 11-27-2008 |
| 20080298011 | ELECTRONIC APPARATUS AND COOLING UNIT - According to one embodiment, an electronic apparatus includes a first heat receiving plate opposed to one side of a circuit board and an exothermic component mounted on the circuit board, and thermally connected to the exothermic component, a second heat receiving plate opposed to another side of the circuit board, and a heat transfer member provided with a heat receiving end portion thermally connected to at least one of the first and second heat receiving plates. The first and second heat receiving plates each extend to a region outside the circuit board, and are joined to each other in the region outside the circuit board so as to be thermally connected to each other. The heat receiving end portion of the heat transfer member is located in a line to the circuit board along a direction parallel with a surface of the circuit board. | 12-04-2008 |
| 20080304229 | AIR-PRESSURE-DEPENDENT CONTROL OF COOLING SYSTEMS USING A SHARED AIR PRESSURE SENSOR - Systems and methods provide altitude-dependent fan control for a plurality of electronic subsystems using a shared air pressure sensor. Each server or multi-server chassis of a rack system is a subsystem of the rack system. Each subsystem receives its own on-board fan or blower module. The shared air pressure sensor senses air pressure and outputs a signal to all of the subsystems. Each subsystem then independently regulates its own fan speed according to the signal output by the shared air pressure sensor. Other fan operational parameters, such as the number of fans recruited, may also be controlled according to altitude according to the invention. A variety of other performance parameters, such as internal air or component temperature, ambient air temperature, server workload, and processor activity level, may also be factored into control of these fan operational parameters. | 12-11-2008 |
| 20080304230 | Heat-Sink Structure With Small Fin Gap Area - A heat-sink structure includes a base and fins, the latter defining gaps with a cross-sectional area less than 24 mm | 12-11-2008 |
| 20080304231 | Portable Computer - A portable computer having a decorative cover is disclosed. The portable computer includes a main housing and a display side housing. The display side housing is openably and closably attached to the main housing. Several apertures for forced air cooling are formed in a bottom and a side of the main housing. The decorative cover is configured to cover surfaces of the display side housing and the main housing. A tray having a flat plate member and a spacer are attached to the bottom of the main housing. The spacer is configured to secure a predetermined space between the flat plate member and the bottom of the main housing to form an air flow passage for allowing outside air to pass through the apertures. The spacer is arranged between the decorative cover and the bottom of the main housing. | 12-11-2008 |
| 20080304232 | Method for controlling system temperature - A computer-implemented method for cooling a modular computer system having multiple cooling devices and multiple heat-generating modules is disclosed. The method includes the steps of determining the number of cooling device installed in the system; determining the positions of the installed cooling devices; applying predefined cooling device placement rules and signaling an error condition if a cooling device is in an unacceptable location; determining locations of all installed heat-generating modules; and applying the predefined cooling device placement rules and signaling an error condition if an installed heat-generating module is in an unacceptable location. | 12-11-2008 |
| 20080304233 | Method for monitoring temperature of computer components to determine ambient chassis temperature - A computer-implemented method for monitoring temperature of a blade server to determine ambient temperature includes the steps of determining temperatures of each of any installed processing components, and determining a temperature of an administrator component. If there are no processing components installed in the computer chassis, the method reports the ambient temperature as the temperature of the administrator component, and if there are processing components installed in the computer chassis, the method reports the highest temperature value of a processing component which is lower than the temperature value of the administrator module as the ambient temperature. | 12-11-2008 |
| 20080310099 | MICROARCHITECTURE CONTROLLER FOR THIN-FILM THERMOELECTRIC COOLING - A device having multiple cores executes an algorithm to control Thin-Film Thermoelectric Coolers (TFTEC) that employ the Peltier effect to remove heat from the various cores of the multi-core processor. The algorithms may combine Thread Migration (TM) and Dynamic Voltage/Frequency Scaling (DVFS) to provide Dynamic Thermal Management (DTM) and TFTEC control. | 12-18-2008 |
| 20080310100 | AIRFLOW ADJUSTMENT IN AN ELECTRONIC MODULE ENCLOSURE - An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening. | 12-18-2008 |
| 20090002937 | HEAT-DISSIPATING MODULE CONNECTING TO A PLURALITY OF HEAT-GENERATING COMPONENTS AND RELATED DEVICE THEREOF - A heat-dissipating module includes a heat pipe and a heat-dissipating device. The heat pipe has a first end and a second end. The first end is connected to a first heat-generating component. The second end is connected to a second heat-generating component. The heat-dissipating device is disposed on the heat pipe and is located between the first end and the second end. The heat-dissipating device is used for dissipating heat generated by the first heat-generating component and conducted from the first end of the heat pipe, and heat generated by the second heat-generating component and conducted from the second end of the heat pipe. | 01-01-2009 |
| 20090002938 | Upstream dust filters by retrofitting parallel path PCB cooling - An apparatus for cooling a computer system includes a fan for flowing an air to a first assembly and a second assembly, a first filter for filtering an air to a first assembly, and a second filter for filtering an air to a second assembly. The first filter is disposed at a side of the first assembly and the second filter is disposed on an opening of a wall which separates the first assembly and the second assembly. | 01-01-2009 |
| 20090002939 | Systems and methods for fan speed optimization - Systems and methods for controlling cooling fan speed based on ambient noise levels are disclosed. Some embodiments may include a method for controlling cooling fan speed. The method may include receiving an indication of a current ambient noise level at a computer system and predicting noise due to one or more cooling fans at an expected operator position for the computer system based on a first speed of the cooling fan(s). Embodiments of the method may also include comparing the predicted operation position noise due to the cooling fan(s) with the current ambient noise level and adjusting the cooling fan(s) to a second speed based on the comparison between the predicted operator position noise and the current ambient noise level. Other embodiments are disclosed and claimed. | 01-01-2009 |
| 20090002940 | ELECTRONIC DEVICE - An electronic apparatus including a housing having an air outlet and a heat generating component in the housing, a heat sink in the housing and having heat radiating fins arrayed. The apparatus includes heat radiating fins having air flow paths between adjacent pairs of the heat radiating fins, and a fan in the housing. The fan feeds air to an air inlet of the heat sink to exhaust heat of the heat radiating fins from the air outlet of the housing. The air outlet of the housing has openings arrayed which divide the air flow paths formed between the pairs of heat radiating fins. | 01-01-2009 |
| 20090009958 | System and Method for Rack Mounted Information Handling System Supplemental Cooling - Thermal management for information handling systems is provided with a bypass cooling module that allows passive airflow from an exhaust aisle to a cooling aisle in a data center. A thermal extraction device, such as a heat sink with cooling fins or a liquid filled radiator, disposed in the bypass cooling module extracts thermal energy from the passive airflow to enhance the availability of cooled air in the cooling aisle for use by the information handling systems. A thermal energy transfer device, such as a secondary heat exchanger, transfers thermal energy from the bypass module towards a data center air conditioner. The bypass module is sized to fit into standardized rack slots, such as 1 U slots. | 01-08-2009 |
| 20090009959 | WATERPROOFING STRUCTURE FOR MICROCOMPUTER - A waterproofing structure for microcomputer includes a computer case being formed on outer surfaces with radiating fins, and having at least one end panel, on which a plurality of through holes are formed; a motherboard mounted in the computer case and having a CPU, electronic elements, and a storage unit mounted thereon, the motherboard also having a plurality of keys and connectors provided thereon corresponding to the through holes formed on the end panel of the computer case; and a plurality of waterproofing units separately fixedly mounted to the through holes on the end panel of the computer case for enclosing the plurality of keys and connectors therein, and each of the waterproofing units having an end fixedly located at an outer side of the panel with a cap removably mounted thereto. Therefore, the microcomputer is waterproof and usable on ship or under water, and has good heat radiating effect. | 01-08-2009 |
| 20090009960 | METHOD AND APPARATUS FOR MITIGATING DUST-FOULING PROBLEMS - Embodiments of the present invention provide a system for preventing dust-fouling in a computer system. During operation of the computer system, the system monitors the computer system and determines if the computer system is becoming dust-fouled. If so, the system reverses fans in the computer system to circulate air through the computer system in the opposite direction to dislodge and disperse dust from the computer system. | 01-08-2009 |
| 20090009961 | FAN HOLDER FOR RECEIVING MULTIPLE FANS - A fan holder is used for dissipating heat from electronic devices. The fan holder includes a fan bracket and an expansion bracket. The fan bracket has a first plate and a second plate. A plurality of partitions is configured between the first plate and the second plate, for connecting the first plate with the second plate. Thereby four same-size receiving rooms are formed in the fan bracket. These receiving rooms are used to receive fans. A plurality of insert slots is defined in four corners of the receiving rooms adjacent to the fixing member. The expansion bracket includes a front plate and a pair of side plates extending perpendicularly from two opposite sides of the front plate. A plurality of hooks is formed on corners of the backside of the side plates, inserting into the insert slots to mount the expansion bracket on the fan bracket. | 01-08-2009 |
| 20090009962 | COMPUTER SYSTEM WITH MOTOR COOLER - A computer system comprises a chassis, an electronic component disposed within the chassis, and a cooling fan that comprises a motor support fixed to a housing that is coupled to the chassis and a hub disposed within the housing. A plurality of blades extend radially from the hub. A motor is disposed within a motor enclosure formed by the motor support and the hub. The hub is rotatably coupled to the motor such that the plurality of blades generates a flow of air around the motor enclosure. The system comprises a motor cooler comprising a flow path through the motor enclosure, where the flow path has a first opening and a second opening, and where the second opening is disposed within an area of lowered downstream pressure so as to develop a differential pressure between the first and second openings and generate a flow of air through the motor enclosure. | 01-08-2009 |
| 20090016016 | Chassis Having an Internal Air Plenum and an Arrangement of Multiple Chassis to Form a Vertical Air Plenum - A chassis and rack system is disclosed in which a chassis separated into two separate enclosures by a central partition. Each of the enclosures is sized to receive a computer system. The partition includes a pair of vertically oriented vents, with each of the vents in fluid communication with one of the enclosures and the computer system contained therein. Heated air is removed from each computer system through the vent in the partition that is associated with the computer system. Multiple chassis may be placed one atop another in a vertical configuration in which each chassis is either directly above or directly below another chassis. In this vertical configuration, the vents form a vertically oriented common plenum that can be used to evacuate air from multiple chassis arranged in a rack. | 01-15-2009 |
| 20090016017 | HEAT DISSIPATING SYSTEM - A heat dissipating system comprises a computer enclosure ( | 01-15-2009 |
| 20090027850 | Computer device heat dissipation system - A computer device heat dissipation system comprising a heat exchanger having a plurality of fins connected to a heat pipe, at least one of the plurality of fins comprises at least one aperture to enable an airflow to pass therethrough. | 01-29-2009 |
| 20090034187 | PRESSURE-BASED FAN SPEED ADJUSTMENT - A system comprising a container adapted to house an electronic device. The system also comprises a fan adapted to transfer air between different portions of the container and pressure sensing logic adapted to determine a difference between air pressures at the different portions. The system further comprises control logic adapted to adjust a speed of the fan in accordance with the difference. | 02-05-2009 |
| 20090034188 | Laptop Computer Support - An article for supporting a computer on a user's lap that cools the computer and isolates the user from heat, and methods of manufacture. Some embodiments include a body, a top surface, a bottom surface, a hollow area in between, an aperture through the top surface to the hollow area, and either a fan to move air through the aperture or an indentation in the top surface to allow air to circulate by the computer. Embodiments include a foam portion, a plastic portion that provides stiffness, a fabric covering and one or more side or rear openings to allow airflow. The fan may be powered from a USB port on the computer. | 02-05-2009 |
| 20090040714 | FAN APPARATUS - A fan apparatus includes a fan section having a hollow housing with an inlet and an outlet, and a hollow duct section disposed on the outlet side of the fan section. The housing and the duct section are coupled by a coupling member. | 02-12-2009 |
| 20090040715 | SEMICONDUCTOR DEVICE - A semiconductor device of the present invention includes a wiring substrate, a plurality of semiconductor chips mounted on the wiring substrate, and a radiation plate arranged over a plurality of semiconductor chips, and having a cooling passage to flow water in a horizontal direction to the wiring substrate. A plurality of semiconductor chips are arranged along the cooling passage, and out of the plurality of semiconductor chips, the semiconductor chip arranged on an inflow side of the cooling passage, has a smaller amount of heat generation than the semiconductor chip arranged on an outflow side of the cooling passage. For example, a memory chip is arranged on the inflow side of the cooling passage, and a logic chip is arranged on the outflow side of the cooling passage. | 02-12-2009 |
| 20090046421 | System and Method for Reducing Information Handling System Cooling Fan Noise - A brushless DC electric fan cools an information handling system with reduced audible noise by skewing a seam in a permanent magnet relative to a rotation axis of the fan. For instance, the permanent magnet is formed from a sheet of magnetic material having a parallelogram shape. The parallelogram is rolled into a cylindrical shape having a seam skewed relative to the axis of rotation of the cylinder. The discontinuity in the magnetic field is moderated by passing the seam through the magnetic field over several degrees of rotation, such as approximately ten degrees. | 02-19-2009 |
| 20090059513 | Cooling Subsystem with Easily Adjustable Mounting Assembly - An apparatus for mounting a motherboard includes a mounting boss and a boss backing. The mounting boss is alignable in a first orientation with a first hole spacing in the motherboard, and alignable in a second orientation with a second hole spacing in the motherboard. The boss backing is adapted to connect with the mounting boss in the first orientation through the motherboard having the first hole spacing, and adapted to connect with the mounting boss in the second orientation through the motherboard having the second hole spacing. | 03-05-2009 |
| 20090059514 | Heat dissipating apparatus of computer - A heat dissipating apparatus applied in a tower computer includes a housing, and the housing includes a motherboard, a storage device and a fixing frame. Electronic components and interface cards are installed on the motherboard and storage devices are installed on the motherboard. The fixing frame has a fan at a position opposite to the motherboard and the storage device, so that the airflow direction of the fan is parallel to the interface cards. The housing further includes an external port on a corresponding surface away from the standing position of the housing, and a hood covered onto the corresponding opposite surface, such that the fan blows air in a single direction directly at the heat generating components. The outside cold air is sucked directly into the crevice at the bottom of the housing by a positive wind pressure difference to reduce dusts from entering the house through other crevices. | 03-05-2009 |
| 20090059515 | COMPUTER APPARATUS AND METHOD HAVING DUAL AIR CHAMBERS - A computer system including an enclosure having a plurality of components; a first chamber including a first set of components; and a second chamber including a second set of components, the second chamber located adjacent to the first chamber and the first set of components being different than the second set of components; wherein air flow is prevented from flowing between the first chamber and the second chamber; and wherein the first chamber includes a first set of cooling devices and the second chamber includes a second set of cooling devices. | 03-05-2009 |
| 20090059516 | COMPUTER - A computer includes a chassis, a motherboard, an air guiding member, and a fan. The chassis includes a rear wall at a rear side thereof and a sidewall at a lateral side thereof. The rear wall defines a plurality of inlet holes therein, and the sidewall defines a plurality of outlet holes therein. The motherboard is received in the chassis opposite to the sidewall, a heat sink is installed on the motherboard for dissipating heat generated by a processor mounted on the motherboard. The air guiding member is received in the chassis at a front side, for guiding air drawn into the chassis through the inlet holes toward the outlet holes. The fan is used for drawing air from outside of the chassis through the inlet holes, and blowing the air out of the chassis through the outlet holes. | 03-05-2009 |
| 20090059517 | INFORMATION PROCESSING APPARATUS - An information processing apparatus includes a casing having a first accommodating unit, and a second accommodating unit which protrudes from at least one area of the first accommodating unit; a main body which includes at least one heat generating component which is accommodated in the first accommodating unit, and a port unit which is formed at an outer side of the first accommodating unit; and a heat radiating unit which is accommodated in the second accommodating unit, and discharges heat of the heat generating component to an outside of the casing. | 03-05-2009 |
| 20090059518 | Technique for Cooling a Device - A cooling system that promotes cooling of a device including a heat source therein is provided, the cooling system includes: a cooling unit that absorbs, upstream from the heat source, heat from intake air that the device takes in from an outside to cool the heat source and dissipates the heat to an outside of a flow path of the intake air; and a fluid control unit that lets fluid flow toward the cooling unit so as to discharge the heat absorbed by the cooling unit from the intake air to an outside of the cooling unit. | 03-05-2009 |
