| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 356388000 | BY CONFIGURATION COMPARISON | 26 |
| 20090066955 | Device and method for determining an optical property of a mask - A coordinate measuring machine ( | 03-12-2009 |
| 20090135423 | LIGHT INTENSITY MEASURING METHOD AND ELECTRONIC DEVICE - The present invention discloses a method for measuring an intensity of a part of an electromagnetic spectral range, and an electronic device implementing the method. The method comprises the steps of providing an electronic device comprising an optical device ( | 05-28-2009 |
| 20090135424 | Inspection Method and Apparatus, Lithographic Apparatus, Lithographic Processing Cell and Device Manufacturing Method for Determining A Parameter of a Target Pattern - In a method for determining a structure parameter of a target pattern, a first series of calibration spectra are determined from at least one reference pattern, each spectra being determined using a different known value of at least one structure parameter of the respective reference pattern. The first series of calibration spectra does not take into account parameters of an apparatus used to produce the reference pattern. A representation of each of the first series calibration spectra is stored in a central library. A second series of calibration spectra corresponding to at least one of the stored spectra for a target spectrum is determined using the parameters of the apparatus for measuring the target spectrum. A measured target spectrum is produced by directing a beam of radiation onto the target pattern. The measured target spectrum and the second series of calibration spectra are compared, where this comparison is used to derive a value for the structure parameter of the target pattern. | 05-28-2009 |
| 20100103422 | GOODNESS OF FIT IN SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING - A sequence of current spectra is obtained with an in-situ optical monitoring system, and each current spectrum is compared to a plurality of reference spectra from a plurality of reference spectra libraries. The library that provides a best fit to the sequence of current spectra is determined, and a polishing endpoint is determined based on the sequence of current spectra and the library that provides a best fit to the sequence of current spectra. | 04-29-2010 |
| 20100177314 | METHODS FOR ON-LINE CALIBRATING OUTPUT POWER OF OPTICAL PICK-UP - The present invention relates to methods for on-line calibrating output power of an optical pick-up. A power adjusting circuit of the optical pick-up has an optical power regulator and an optical power detector. The on-line output power calibrating method includes the steps of: performing a recording pre-process; providing a focus offset value and/or a tilt offset value to the optical pick-up; providing a setting value, corresponding to power under test, to the optical power regulator; detecting laser power emitted from the optical pick-up using the optical power detector; comparing the laser power with the power under test to adjust the setting value of the optical power regulator corresponding to the power under test; and performing an optimum power calibration if the laser power emitted from the optical pick-up conforms to the power under test. | 07-15-2010 |
| 20100284006 | ENVIRONMENTAL CONTROL OF FLUID SAMPLES, CALIBRATION, AND DETECTION OF CONCENTRATION LEVELS - According to example configurations herein, a system includes an inertial filter, a temperature controller, and analyzer. The inertial filter has multiple ports including a first port, a second port, and a third port. A sample gas flows between the first port and the third port of the inertial filter. The second port of the inertial filter outputs a portion of the gas flowing between the first port and the second port. The temperature controller controls a temperature of the inertial filter and/or the gas flowing through the inertial filter. The analyzer receives the portion of the gas flow outputted by the second port of the inertial filter and produces a value indicative of a concentration of sulfur trioxide in the portion of the gas flow. | 11-11-2010 |
| 20100284007 | Spectrum Based Endpointing For Chemical Mechanical Polishing - Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra. | 11-11-2010 |
| 20120133938 | MEASURING METHOD, APPARATUS AND SUBSTRATE - A pattern formed on a substrate includes first and second sub-patterns positioned adjacent one another and having respective first and second periodicities. The pattern is observed to obtain a combined signal which includes a beat component having a third periodicity at a frequency lower than that of the first and second periodicities. A measurement of performance of the lithographic process is determined by reference to a phase of the beat component. Depending how the sub-patterns are formed, the performance parameter might be critical dimension (CD) or overlay, for example. For CD measurement, one of the sub-patterns may comprise marks each having of a portion sub-divided by product-like features. The measurement can be made using an existing alignment sensor of a lithographic apparatus. Sensitivity and accuracy of the measurement can be adjusted by selection of the first and second periodicities, and hence the third periodicity. | 05-31-2012 |
| 20150308965 | Whisker Manufacturing, Detection, Response, and Compound Manufacturing Apparatus and Method - An invention for making productive uses of normally undesirable whiskers is provided. Embodiments of the invention include a variety of apparatuses and methods associated with forming and using whiskers as well as forming whisker compounds is disclosed. For example, whisker detection modules can be created which provide a whisker surveillance capability. The whisker detection modules can further be coupled with a whisker response system such as an alarm or insulating material dispersing system. Another aspect of the invention is providing a variety of environments or microenvironments with regard to a whisker forming structure to affect whisker creation such as maximizing whisker formation. Another example includes provision of a variety of embodiments for manufacturing compounds of whiskers of various metal and metal alloys, including structures and methods is provided. Whisker compounds produced using various embodiments of the invention can be used for various applications. | 10-29-2015 |
| 356390000 | With two images of single article compared | 1 |
| 20090219532 | SYSTEM AND METHOD FOR QUALITY CHECKING OF ANISOTROPIC CONDUCTIVE FILM - An exemplary system for calculating the number of conductive particles dispersed in an anisotropic conductive film includes an image capturing device and an image processing device. The image capturing device captures a color image of the anisotropic conductive film. The image processing device processes the color image to generate a first binary image. The second binary image includes a plurality of first objects. The first objects occupy a first area in the first binary image. The image processing device processes the first binary image to generate a second binary image having different size with respect to the first binary image by a predetermined value. The second binary image includes a plurality of second objects. The second objects occupy a second area in the second binary image. The image processing device calculates a number of the conductive particles according to the first area, the second area, and the predetermined value. | 09-03-2009 |
| 356391000 | With projection on viewing screen | 6 |
| 20120127468 | THROUGH-THE-LENS ILLUMINATOR FOR OPTICAL COMPARATOR - An illumination system shares portions of an objective of an optical inspection system. A plurality of beam-shaping optics collects light from a plurality of effective light sources and directs the light through a portion of the objective for illuminating an object under inspection. The objective includes a front relay lens, a rear relay lens, and an objective stop disposed between the front and rear relay lenses for collecting light scattered from the object and forming an image of the object with the collected light. The beam-shaping optics, which surround the objective stop, are arranged together with the associated effective light sources for non-uniformly distributing light within a range of angles required for illuminating the object. | 05-24-2012 |
| 356392000 | For comparison with master or desired configuration | 5 |
| 20090153860 | OPTICAL COMPARATOR USING LIGHT- EMITTING DIODE LIGHT SOURCES - The invention provides a source of illumination comprising a base having mounted thereon at least one light-emitting diode light source, a parabolic reflector mounted on the base and surrounding the at least one light-emitting diode, and a transmissive diffuser at the narrow end of the parabolic reflector. | 06-18-2009 |
| 20120307246 | Method of Inspecting Test Parts with an Optical Comparator Having Digital Gage - An optical comparator arranged for rear projection onto a viewing screen combines an optical projector that projects an optical image of a test part under inspection onto the viewing screen with a video projector that projects an optical image of a pixilated template pattern containing illustrated specifications of the test part onto the same viewing screen. The images of the test part and the pixilated template pattern are projected concurrently onto the viewing screen for visually comparing the form of the test part against its specified form. | 12-06-2012 |
| 356393000 | Having master or desired configuration projection | 3 |
| 20080316487 | Method of Timing Headlamps or Lighting Projectors - Comprises the following phases: in first phase a vehicle ( | 12-25-2008 |
| 20110001973 | OPTICAL COMPARATOR WITH DIGITAL GAGE - An optical comparator arranged for rear projection onto a viewing screen combines an optical projector that projects an optical image of a test part under inspection onto the viewing screen with a video projector that projects an optical image of a pixilated template pattern containing illustrated specifications of the test part onto the same viewing screen. The images of the test part and the pixilated template pattern are projected concurrently onto the viewing screen for visually comparing the form of the test part against its specified form. | 01-06-2011 |
| 20120140225 | STEREOSCOPIC EXTINCTION RATIO TEST PATTERN - A test pattern for evaluating L/R crosstalk extinction ratio in a stereoscopic 3D system has a strip of one characteristic—polarization, white, color—associated with a plurality of calibrated chips in a left eye image and a strip of a contrasting characteristic—orthogonal polarization, white, contrasting color—associated with a plurality of calibrated chips in a right eye image such that, when the two images are superimposed, the strip of one image overlays the calibrated chips of the other image. By alternately occluding one eye while observing the superimposed image with the other eye, a portion of the strip of the occluded eye image appears across the chips of the viewing eye image when there is crosstalk. The extinction ratio value associated with the chip of the viewing eye image that most closely matches the portion of the strip from the occluded eye image is an estimate of the L/R crosstalk. | 06-07-2012 |
| 356394000 | With comparison to master, desired shape, or reference voltage | 8 |
| 20080231856 | Substrate Inspection Apparatus, Substrate Inspection Method and Semiconductor Device Manufacturing Method - A substrate inspection method includes forming a conductive thin film on a surface of an inspection target substrate with a pattern formed thereon, generating an electron beam and irradiating the substrate having the thin film formed thereon with the electron beam, detecting at least any of secondary electrons, reflected electrons and backscattered electrons released from the surface of the substrate and outputting signals constituting an inspection image, and selecting at least any of a material, a film thickness and a configuration for the thin film, or at least any of a material, a film thickness and a configuration for the thin film and an irradiation condition with the electron beam according to an arbitrary inspection image characteristic so that an inspection image according to an inspection purpose can be obtained. | 09-25-2008 |
| 20080239319 | INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge. | 10-02-2008 |
| 20090073445 | BONDING AGENT STICKING INSPECTION APPARATUS, MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELECTRICAL COMPONENT - A bonding agent sticking inspection apparatus includes a photographing section, a movement section, and a control section. The photographing section photographs an image of a substrate. The image includes a sticking expected range indicating a range in which a bonding agent should be positioned. The control section controls the photographing section and the movement section, sets an inspection region having a width equal to the pitch between electrodes in an entire edge part in a direction in which the electrodes are arranged in a peripheral edge part of the sticking expected range in the image, detects a ratio of a nicked part of the bonding agent to the inspection region, and judges whether or not an abnormality is present in the bonding agent on the basis of a comparison between the ratio of the nicked part and a threshold set in advance. | 03-19-2009 |
| 20090213378 | Method for calculating out an optimum arrangement pitch between each two LED chip package units - A method for calculating out an optimum arrangement pitch between each two LED chip package units, including: providing a backlight module with a predetermined brightness value and a predetermined material information that a customer needs; determining what brightness level and amount of LED chip package units need to be used by a designer according to the brightness value and the material information of the backlight module; and dividedly arranging the LED chip package units determined by the designer on a light-entering area of the backlight module in order to define what the optimum arrangement pitch between each two LED chip package units is. | 08-27-2009 |
| 20090310136 | Method for Detection of Oversized Sub-Resolution Assist Features - Disclosed are methods and apparatus for inspecting a sub-resolution assist features (SRAF) on a reticle. A test flux measurement for a boundary area that encompasses a width and a length portion of a test SRAF is determined, and at least one reference flux measurement for one or more boundary areas of one or more reference SRAF's is determined. The test flux measurement is compared with the reference flux measurements. The comparison is used to then determine whether the test SRAF is undersized or oversized. If the test SRAF is determined to be oversized, it may then be determined whether the test SRAF is defective based on the comparison using a first threshold | 12-17-2009 |
| 20100002232 | Inspection method of circuit substrate - An inspection method for a circuit substrate is disclosed, which inspects electrical properties of a circuit substrate having a multilayered structure, by controlling inspection environments so that dew forms on a surface of the circuit substrate and detecting change of states of the dew to thereby determining variation of a thermal capacity of a conductor with respect to defective contacts or vias, micro vias and a circuit pattern of an inner layer. According to this, the inspection can be performed with respect to a wide area simultaneously and therefore the inspection productivity can be improved. In addition, since the temperature of the conductive wire can be measured directly through change of the dew, the cost for the temperature measurement can be saved. Moreover, the cost for an area sensor to sense the temperature of a wide area may be reduced while improving the inspection speed. | 01-07-2010 |
| 20100073677 | METHOD AND SYSTEM OF DEVICE IDENTIFICATION - A medical device susceptible to identification using interference patterns for performing device identification is disclosed. A source signal may be directed from an energy source towards the surface of a device for reflection therefrom. An interference pattern may be detected from the surface of the device, such as by a sensor. A determination as to whether a match exists between the representation of the interference pattern and a stored representation of an interference pattern may be performed. If a match exists, the device may be identified based on the stored representation of the interference pattern. Otherwise, a representation of the interference pattern may be stored and a unique identifier may be assigned to the stored representation of the interference pattern. | 03-25-2010 |
| 20110043802 | BOX INSPECTOR - A box inspector for detecting at an inspection station an unacceptable skew in, an item missing from, and/or an unacceptable gap in a box. The box inspector has pairs of aligned emitters and receivers generating a signal when an unacceptable skew is detected, at least two item present sensors corresponding to the number of items adapted to be located in a single row within the box and generating an item absent signal when an item is missing from the box, a gap detect sensor generating an unacceptable gap signal when the gap is larger than a predetermined gap size, and a box present sensor generating a box present signal when a box arrives at the inspection station. A controller receives signals from these components and generates indications when the box is unacceptably skewed, an item is missing from the box, and/or an unacceptable gap exists in the box. | 02-24-2011 |
| 356395000 | With relatively movable optical grids | 1 |
| 20090190130 | DEVICE FOR DETERMINING THE POSITION OF AN OBJECT MOVABLE ALONG AT LEAST ONE DISPLACEMENT DIRECTION - A device for determining the position of an object that is movable along at least one displacement direction, the or each displacement direction having assigned to it one length measuring device for measuring the position of the object along the respective spatial direction, includes: at least one scale extending along a displacement direction of the object to be measured as a first component of the respective length measuring device; a scanning head for scanning the scale as a second component of the respective length measuring device such that a change in the position of the scale with respect to the scanning head along the associated displacement direction of the object to be measured is measurable, one of the two components of the respective length measuring device being moved together with the object to be measured along the respective displacement direction when the latter is moved; and a device for determining the distance of the component of the respective length measuring device, which is movable together with the object to be measured, from the object to be measured along the measuring direction of the associated length measuring device. | 07-30-2009 |
| 356398000 | With object being compared and light beam moved relative to each other (e.g., scanning) | 1 |
| 20100149534 | SIX AXIS MOTION CONTROL APPARATUS - A motion control apparatus for measuring and scanning an object. The motion control apparatus includes a base. The motion control apparatus also includes an object support assembly that is coupled to the base. The object support assembly receives the object to be scanned and measured. The motion control apparatus includes a scanner track that extends above from the base. The scanner and object are moveable about multiple axes to position to the scanner with respect to the object for viewing the object by the scanner for obtaining measurements of the object. | 06-17-2010 |
