| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 338226000 | INCASED, EMBEDDED, OR HOUSED | 21 |
| 20100156589 | Resistor and method for making a resistor - A resistor having a body, a fuse component, a resistor component, a wire and a cover. The body has a top, a first positioning hole and a second positioning hole being formed in the top of the body. The fuse component is inserted in the first positioning hole. The resistor component is inserted in the second positioning hole. The wire connects the fuse component and the resistor component and is mounted outside the body. The cover is attached to the top of the body around the wire. Therefore, the body of resistor as described may be dried in an oven without damaging the resistor component. A method having steps of forming a body having two positioning holes, drying the body in an oven heated above 130° C., mounting a resistor component and a fuse component respectively in the positioning holes, and covering the positioning holes with an insulating cover. | 06-24-2010 |
| 20100328021 | RESISTOR DEVICE - The resistor device is provided with a resistive plate ( | 12-30-2010 |
| 20140191841 | CONFORMAL COATING TO SCAVENGE ELEMENTAL SULFUR - A corrosion-resistant apparatus may contain an electronic component having a first metal and a polymer coating covering the electronic component. The polymer coating includes polymer chains with unsaturated groups to scavenge sulfur and an anionic initiator dispersed in the polymer coating to convert cyclic elemental sulfur to linear polysulfide. | 07-10-2014 |
| 338243000 | Element in insulation with outer metallic sheath | 1 |
| 338247000 | Plural part sheath | 1 |
| 338248000 | Insulation formed and hardened in situ (e.g., molded) | 1 |
| 20090108985 | IN-MOLDED RESISTIVE AND SHIELDING ELEMENTS - An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film. | 04-30-2009 |
| 338252000 | Element embedded or enclosed in groove or recess | 3 |
| 20110057765 | ARRAY TYPE CHIP RESISTOR - The present invention provides an array type chip resistor including: a substrate having a plurality of grooves formed on both sides thereof at equal spaces; lower electrodes formed on both sides of a bottom surface of the substrate; upper electrodes formed on both sides of a top surface of the substrate; side electrodes electrically connected to the upper and lower electrodes; a resistive element interposed between lower electrodes of the bottom surface of the substrate; a protection layer covered on the resistive element, the protection layer having both sides which cover a part of the lower electrodes and the resistive element; leveling electrodes being in contact with the lower electrodes exposed to outside of the protection layer; and a plating layer formed on the leveling electrodes. The array type chip resistor can prevent the resistive element from being damaged due to external impact when mounted since the resistive element is printed inside of the lower electrodes of the bottom surface of the substrate. | 03-10-2011 |
| 20120019349 | CONFINED RESISTANCE VARIABLE MEMORY CELLS AND METHODS - Methods, devices, and systems associated with resistance variable memory device structures are described herein. In one or more embodiments, a method of forming a confined resistance variable memory cell structure includes forming a resistance variable material such that a first unmodified portion of the resistance variable material contacts a bottom electrode and a second unmodified portion of the resistance variable material contacts a top electrode. | 01-26-2012 |
| 20120256722 | METHOD OF CAVITY FORMING ON A BURIED RESISTOR LAYER USING A FUSION BONDING PROCESS - A method of forming a buried resistor within a cavity for use in electronic packages using two glass impregnated dielectric layers, one with a clearance hole, the second with a resistor core, the clearance hole being placed over the resistor core and the assembly fusion bonded. The space remaining around the resistor core is filled with a soldermask material and the assembly is coated with metal. Thru-holes are drilled, cleaned, and plated and then the metal coating is etched and partially removed. The soldermask is then removed and a layer of gold plating is applied to the exposed metal surfaces. The use of glass impregnated dielectric layers and fusion bonding eliminates the fluorinated ethylene propylene resin (FEP) bleed problem associated with previous buried resistor cavity assemblies. | 10-11-2012 |
| 338258000 | Resistance element formed as a coating on interior of casing or housing | 1 |
| 20080278278 | FINE LINE THICK FILM RESISTORS BY PHOTOLITHOGRAPHY - The present invention is directed to a thick film patterned resistor on a substrate and to a method of forming it. The method involves providing a substrate with opposed surfaces, where one surface is coated with a layer of a resistor composition. A photoresist is applied over the layer of the resistor composition, and a desired pattern in the photoresist is formed, where the pattern leaves certain regions of the resistor composition layer uncovered by the photoresist. The resistor composition layer which is uncovered by the photoresist is etched under conditions effective to leave a mass of loosely bound resistor particles at regions of the resistor composition which are not covered by photoresist. The mass of resistor particles is then removed from the substrate to produce a thick film patterned resistor on the substrate. | 11-13-2008 |
| 338260000 | Plural resistors | 3 |
| 20100039212 | Dry-type high-voltage load system apparatus and method of preventing chain breaking and arc discharge for use therewith - A dry-type high-voltage load system apparatus has a space-saving structure, which is resistant to chain breaking, arc discharge and vibration, and a method of preventing the chain breaking and the arc discharge for use with the system apparatus. The system apparatus includes a dry-type high-voltage load system circuit including a low-voltage bank formed of lower-capacity configuration banks which include three-phase resistor circuits which are low-voltage resistor circuit. A high-voltage bank includes lower-capacity configuration banks for a high-voltage resistor circuit formed of three-phase resistor circuits. The three-phase resistor circuits are connected to a high-voltage power generator in parallel and are in the form of a Y-connection of three resistor arrays so that an isolated and independent neutral point is unconnected to other neutral points. The three phase resistor circuits may also be in the form of a Δ-connection. | 02-18-2010 |
| 20130106567 | OVERVOLTAGE PROTECTION ELEMENT | 05-02-2013 |
| 338261000 | Helical or wound element | 1 |
| 20100090794 | A RESISTOR FOR ELECTRIC HIGH-VOLTAGE APPARATUS AND A METHOD OF MOUNTING A RESISTOR - A resistor for electric high-voltage apparatus, especially for connection to a diverter switch in an on-load tap changer for a high-voltage transformer. The diverter switch and the resistor are arranged in a housing with transformer oil. The resistor includes a number of resistor elements, wherein each resistor element includes a resistive element, arranged in a frame, which are electrically interconnected by a connection member. The frames are designed to enclose resistive elements that include spring elements formed from spirally wound resistance wire. Connection members include a connection plug. A method of mounting a resistor for electric high-voltage apparatus. | 04-15-2010 |
| 338262000 | Casing or housing formed as a coating | 4 |
| 20100060409 | RESISTOR AND METHOD FOR MAKING SAME - A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip. | 03-11-2010 |
| 20110057766 | SURFACE MOUNT RESISTOR - A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer. | 03-10-2011 |
| 20110080251 | CHIP-LIKE ELECTRIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A chip-like electric component such as a chip resistor is provided, which is easy to manufacture and in which cracks or fractures of an insulating substrate are unlikely to occur. A pair of surface electrodes | 04-07-2011 |
| 20130335191 | SULFURATION RESISTANT CHIP RESISTOR AND METHOD FOR MAKING SAME - A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process. | 12-19-2013 |
| 338267000 | Helical or wound element | 2 |
| 20080266047 | Power resistor module - A power resistor module for electrical circuits has at least one resistor element and at least one housing element. The at least one resistor element is mounted at least section-wise between two electrically insulating, thermally conductive insulation elements in the housing element. The insulation elements at least section-wise abut against the at least one housing element. Methods for producing an electrical power resistor module for an electrical circuit include compressing, at least one resistor element with two electrically insulating, thermally conductive insulation elements. At least one of the two insulation elements is pressed at least section-wise against a housing element. If a wire is used as the resistor element, the use of possible fillers such as magnesium oxide may be waived by providing that the wire abuts at least section-wise against at least one of the two insulation elements during the compression. | 10-30-2008 |
| 338269000 | Casing or housing formed on and hardened on resistor (e.g., molded) | 1 |
| 20130293343 | DEVICE COMBINING A THERMAL FUSE AND A RESISTOR - A device combining a thermal fuse and a resistor has a solid ceramic base of the wirewound resistor is changed to be hollow, a thermal fuse is disposed inside the ceramic base, the ceramic tube is the housing of the thermal fuse, one lead wire of the thermal fuse is passing through the end cap of one end of the wirewound resistor, the other end of the thermal fuse is extended out of the end cap of the other end of the wirewound resistor, the end cap of the wirewound resistor is extended out with a lead wire, then the whole product is encapsulated by epoxy resin. The device can serve as a basic unit, which is directly assembled to an existing high-frequency charger, it can take the place of the existing simple wirewound resistor or the wirewound resistor with a thermal fuse external contacted. | 11-07-2013 |
| 338275000 | Casing or housing formed on and hardened on resistor (e.g., molded) | 3 |
| 20090085715 | POWER RESISTOR - A resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the resistor. The resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material. The resistive element may be a metal strip, a foil, or film material. | 04-02-2009 |
| 20110063071 | POWER RESISTOR - A power resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the power resistor. The power resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material. | 03-17-2011 |
| 20110241819 | SURFACE MOUNTED CHIP RESISTOR WITH FLEXIBLE LEADS - A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor. | 10-06-2011 |
| 338276000 | Terminal or lead extends through casing or housing wall | 1 |
| 20080204188 | Resistor Component for an Electric Machine - Disclosed is a resistor component ( | 08-28-2008 |
