Class / Patent application number | Description | Number of patent applications / Date published |
333246000 | Strip type | 46 |
20080231393 | STRUCTURE DESIGN FOR MINIMIZING ON-CHIP INTERCONNECT INDUCTANCE - A semiconductor device comprising a signal line and ground line is disclosed. The signal line comprises an opening and at least a portion of the ground line is in the opening in the signal line. | 09-25-2008 |
20090079523 | LAYOUT OF CIRCUIT BOARD - A layout of a circuit board includes a first signal layer, a second signal layer, and a third signal layer. The first signal layer has a transmission line. The second signal layer is stacked below the first signal layer, and has an opening. The third signal layer is stacked below the first and second signal layers with the second signal layer sandwiched between the first and third signal layers. The third signal layer is electrically connected to the second signal layer, and both of the second and third signal layers are ground layers or power layers. An orthogonal projection of a segment of the transmission line on the third signal layer is overlapped with that of the opening on the third signal layer. Therefore, an equivalent impedance of the segment of the transmission line referring to the second and third signal layers can be increased or decreased. | 03-26-2009 |
20100019871 | Electric Field Coupler, Communication Apparatus, Communication System, and Fabrication Method for Electric Field Coupler - An electric field coupler includes a strip-like coil formed by bending a strip-like conductor which snakes along a plane perpendicular to a coupling direction in which electric field coupling occurs, such that coil axes are perpendicular to the coupling direction, the strip-like coil having an electrical length of one-half wavelength of a predetermined frequency of a radio-frequency signal and having a form in which the coil axes surround a central portion along the plane. The strip-like coil produces coupling by a longitudinal wave electric field which vibrates in the coupling direction at the central portion. | 01-28-2010 |
20100060390 | TRANSMISSION LINE SUBSTRATE - A transmission line substrate comprises: a dielectric substrate; a signal line formed on the upper surface of the dielectric substrate; first and second ground conductors formed on the upper surface of the dielectric substrate, field-coupled to the signal line, having potentials different from each other; a dielectric film formed between a part of the overlapping first ground conductor and a part of the second ground conductor to constitute a MIM capacitor; a capacitor connected between the first ground conductor and the second ground conductor in parallel with the dielectric film; and a resistor connected between the first ground conductor and the second ground conductor in series with the capacitor. | 03-11-2010 |
20100171574 | MICROSTRIP LINE - A microstrip line is constituted by including a grounding conductor and a strip conductor with a dielectric substrate being sandwiched between the grounding conductor and the strip conductor. The microstrip line includes a conductor section having at least one groove formed to sterically intersect the strip conductor, thereby exhibiting a substantially more uniform passing characteristic as compared with a prior art microstrip line. | 07-08-2010 |
20100182107 | SYSTEM AND METHOD FOR IMPROVING PERFORMANCE OF COPLANAR WAVEGUIDE BENDS AT MM-WAVE FREQUENCIES - An apparatus including a liquid crystal polymer substrate having a top surface and a bottom surface, a coplanar waveguide formed on the top surface of the liquid crystal polymer substrate, the coplanar waveguide having a 90 degree bend with a mitered edge, an inner via positioned adjacent to an inner corner of the 90 degree bend, and an outer via positioned adjacent to the mitered edge of the 90 degree bend, the inner and outer vias positioned along a first plane that is perpendicular to a second plane defined by the mitered edge. | 07-22-2010 |
20100237967 | CIRCUIT DEVICE - A circuit device includes a substrate 11, and a transmission line | 09-23-2010 |
20100244999 | TRANSMISSION LINE - The present invention relates to a transmission line in which a physical value of an inductive element can be changed in various ways while minimizing a size. The transmission line of the present invention includes a transmission unit, a ground unit and inductive elements. The inductive element connects the transmission unit and the ground unit, and has a predetermined pattern. The inductive element is provided between two surfaces of a substrate. According to the present invention, a physical value of the inductive element, in particular, an inductance value can be changed in various ways while not increasing an overall size. Accordingly, a transmission line can be designed freely according to its application. | 09-30-2010 |
20110032056 | HIGH-FREQUENCY SUBSTRATE AND HIGH-FREQUENCY MODULE - A high-frequency substrate in which a coplanar line including a signal line which transmits a signal and a pair of front ground patterns disposed in parallel with the signal line interposed therebetween is formed on one surface of a dielectric substrate, a back ground pattern is formed to cover the other surface of the dielectric substrate, and a plurality of conductive vias which connect the front ground patterns to the back ground pattern are arranged at a predetermined interval, the high-frequency substrate including: a signal line breaking portion which breaks the signal line; a substantially rectangular parallelepiped signal-line capacitor which is formed to connect the breaking ends of the signal line to each other; and ground pattern breaking portions which are disposed on both sides of the signal line breaking portion of the signal line to break the front ground patterns. | 02-10-2011 |
20110115581 | APPARATUS AND METHOD FOR IMPLEMENTING LEFT-HANDED TRANSMISSION LINE - An apparatus for implementing a left-handed transmission line includes: a substrate coated with a conductor and having a rectangular shape with a predefined size; a plurality of concave-convex lines disposed on a bottom surface of the substrate; two conductive vias disposed on a top surface of the substrate; a first bonding wire connecting top portions of a conductive line between the concave-convex lines connected between the first etching surface and the second etching surface; and a second bonding wire connecting bottom portions of a conductive line between the concave-convex lines connected between the first etching surface and the second etching surface. | 05-19-2011 |
20110148550 | METAMATERIAL TRANSMISSION LINE APPARATUS AND METHOD OF IMPLEMENTING THE SAME - A metamaterial transmission line for transmitting an electromagnetic wave. The metamaterial transmission line may include a substrate including a substrate configured to include a an upper portion and a lower portion on which a ground plane is formed, a signal line configured to be formed on the substrate, and a defected ground structure configured to include an etched region and two metal portions, wherein the etched region is generated by etching a part of the ground plane and the metal portions extend from the signal line and are disposed on the etched region. | 06-23-2011 |
20130002377 | STRUCTURE - A second conductor ( | 01-03-2013 |
20130082802 | STRUCTURE AND COMPACT MODELING OF VARIABLE TRANSMISSION LINES - A novel and useful fabricated variable transmission line that is tuned digitally is presented. Digital tuning of the variable transmission line enables the compensation of process variation in both the active and passive devices of the RF design. Along with several embodiments of the variable transmission line, the present invention also provides a method of compact modeling of the variable transmission line. The variable transmission line structure and compact modeling enables circuit level simulation using a parametric device that in one embodiment can be included as an integral part of a silicon foundry design kit. | 04-04-2013 |
20130162376 | DC BLOCK USING MICROSTRIP LINE - A DC block is provided. The present DC block includes a first microstrip line of which one end is connected to a first signal line and of which the other end is bent; and a second microstrip line of which one end is connected to a second signal line, and of which the other end is bent, wherein the second microstrip line is placed parallel to the first microstrip line. Accordingly, the size of the DC block is reduced by at least half. | 06-27-2013 |
20130321105 | STRIPLINE CONNECTION APPARATUS - The present invention relates to a stripline connection apparatus for transmitting signals between at least one pair of striplines. The stripline connection apparatus comprises a coupling member arranged between the pair of striplines so as to transmit signals to each stripline via inductive coupling. The coupling member includes a conductor, both ends of which face the respective striplines, and a gap-maintaining means for maintaining a predetermined gap between the conductor and the striplines. | 12-05-2013 |
20140002213 | REDUCED SIZE BIAS TEE | 01-02-2014 |
20140097918 | PRINTED CIRCUIT BOARD HAVING DC BLOCKING DIELECTRIC WAVEGUIDE VIAS - A printed circuit board is disclosed. The printed circuit board includes a first signal transmission layer, a via and a second signal transmission layer. The via connects the first signal transmission layer to the second signal transmission layer. The via includes a first region made of a first dielectric material having a first dielectric constant, and a second region made of a second dielectric material having a second dielectric constant lower than the first dielectric constant. The via allows AC Component of an electro-magnetic signal to be transmitted from the first signal transmission layer to the second signal transmission layer while blocking any DC component of the electromagnetic signal. | 04-10-2014 |
20140111292 | Module and Coupling Arrangement - The application concerns a surface mount module adapted for transfer of a microwave signal between the module and a motherboard, the module comprising a substrate with a first microstrip conductor and a second microstrip conductor, wherein the two conductors are connected with a connection through the module. The module is distinguished in that the connection comprises the first microstrip conductor connected to a foil of electrically conducting material coated on the first side, the foil being surrounded by electrically conducting trenches running through the substrate from the first side to the second side forming a substrate integrated waveguide, wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected the second microstrip conductor. The application also concerns a coupling arrangement. | 04-24-2014 |
20140111293 | COUPLING ARRANGEMENT - A coupling arrangement for the transfer of a microwave signal includes a motherboard having a first substrate with a first microstrip conductor, and a module having a second substrate with a second microstrip conductor. The module is attached to the motherboard such that the motherboard conductor by means of a connection is in electrical contact with the module conductor, whereby the microwave signal may be transferred between the motherboard conductor and the module conductor. The connection includes the motherboard conductor connected to a substrate integrated waveguide on the motherboard, which substrate integrated waveguide is connected to the module conductor via a slot coupling. | 04-24-2014 |
20140139300 | Line Isolation of Radio Frequency Devices - A radio frequency (RF) device includes a transmission line arranged on a substrate, the transmission line operative to propagate an RF signal having a wavelength (λ), and a first isolation portion arranged on the substrate proximate to the transmission line, the first isolation portion including an arrangement of stubs, where each stub of the arrangement of stubs has a length (y) where y=¼λ, the first isolation portion operative to substantially prevent electromagnetic interference caused by the propagation of the RF signal in the transmission line from passing through the first isolation portion. | 05-22-2014 |
20140159836 | Laminated Ceramic RF Assembly - The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. | 06-12-2014 |
20140253262 | RF CHOKE DEVICE FOR INTEGRATED CIRCUITS - Among other things, one or more techniques and systems for selectively filtering RF signals within one or more RF frequency band are provided. In particular, an RF choke, such as a 3D RF choke or a semi-lumped RF choke, configured to selectively filter such RF signals is provided. The RF choke comprises a metal connection line configured as an inductive element for the RF choke. In an example, one or more metal lines, such as a metal open stub, are formed as capacitive elements for the RF choke. In another example, one or more through vias are formed as capacitive elements for the RF choke. In this way, the RF choke allows DC power signals to pass through the metal connection line, while impeding RF signals within the one or more RF frequency bands from passing through the metal connection line. | 09-11-2014 |
20140266516 | DIFFERENTIAL PASSIVE EQUALIZER - Disclosed in the present specification is a circuit board. The circuit board includes a first reference plane and a second reference plane, wherein the second reference plane includes a defected ground structure. The circuit board also includes a signal trace coupled to a signal via, wherein the signal trace is disposed above the first reference plane. The circuit board additionally includes a spiral inductor positioned adjacent to the defected ground structure, wherein the spiral inductor is coupled to the signal via. | 09-18-2014 |
20150091676 | FIXING STRUCTURE OF CABLE TO WIRING SUBSTRATE, AND CABLE, AND MANUFACTURING METHOD OF CABLE - A transmission line includes an insulator as a base member, a transmission conductor, and a ground layer. A connector is provided at a wiring substrate to fix the transmission line. The transmission line includes a signal columnar conductor having a solid columnar shape integrated with the transmission conductor, and ground columnar conductors having solid columnar shapes integrated with the ground layer. The connector has a through hole corresponding to the signal columnar conductor, and through holes corresponding to the ground columnar conductors. Conductive films are respectively provided on the inner peripheral surfaces of the through holes. The signal columnar conductor is inserted into the through hole, and the ground columnar conductors are respectively inserted into the through holes. | 04-02-2015 |
20150102874 | ATTENUATION REDUCTION STRUCTURE FOR HIGH FREQUENCY SIGNAL CONTACT PADS OF CIRCUIT BOARD - An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness. | 04-16-2015 |
20150349396 | Air Gap Creation In Electronic Devices - A method for creating an air gap in an electronic device, for example, a passive electronic component chip (PECC) for high frequency microwave transmission is provided. Electronic circuitry of a passive electronic component, for example, a termination, an attenuator, etc., is fabricated in a predetermined configuration on a single layer of a substrate to create the PECC. An air gap of configurable dimensions is created at a configurable location on the substrate by dicing the substrate at the configurable location to create a suspended substrate-like environment in the PECC. The created air gap reduces the dielectric constant at the configurable location and reduces capacitance of the substrate along areas located directly above the air gap. The created air gap also reduces a loss tangent, high frequency attenuation, and electromagnetic fields near a ground plane of the PECC, creates a wide strip dimension, and creates less stringent tolerance in the PECC. | 12-03-2015 |
20150359084 | PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND WIRING CONNECTION METHOD - A printed wiring board is provided with a wiring layer, a first ground layer, a second ground layer, a grounding through-hole, a signal through-hole, a first clearance, and a second clearance. The wiring layer has a signal line. The first ground layer has a first ground plane. The second ground layer is positioned between the wiring layer and the first ground layer and has a second ground plane. The grounding through-hole passes through the wiring layer, the first ground layer, and the second ground layer and is connected to the second ground plane. The signal through-hole passes through the wiring layer, the first ground layer, and the second ground layer and is connected to the signal line. The first clearance is formed in the first ground layer, is positioned in the vicinity of the signal through-hole and the grounding through-hole, and separates the first ground plane from the signal through-hole and the grounding through-hole. The second clearance is formed in the second ground layer, is positioned in the vicinity of the signal through-hole, and separates the second ground plane from the signal through-hole. | 12-10-2015 |
333247000 | Semiconductor mounts | 19 |
20080238584 | Reducing crosstalk in electronic devices having microstrip lines - An electronic device may be formed of a printed circuit board having integrated circuits mounted thereon. A backing plate may compress an insulating layer against a microstrip line formed on one surface of said circuit board opposite to the surface that includes integrated circuits. By compressing said backing plate against said insulating layer, less crosstalk may result from the formation of a microstrip on the bottom surface of the printed circuit board. The backing plate may also be used to secure a cooling device, such as a heat sink, on the opposite side of the circuit board. | 10-02-2008 |
20080238585 | Substrate including wiring for transmitting signal, apparatus and system including the substrate - An apparatus includes a substrate which includes an electronic component mounted on the substrate, the electronic component for processing a pair of signals, the substrate including a first wire for transmitting one of the signals, the first wire being formed on a first layer of the substrate, and a second wire for transmitting another one of the signals, the second wire being formed on a second layer of the substrate in a first region under the electronic component and being formed on a third layer in a second region of an other part of the first region. | 10-02-2008 |
20080266031 | SEMICONDUCTOR DEVICE AND WIRING PART THEREOF - A technique capable of achieving both improvement of mounting density and noise reduction for a semiconductor device is provided. An LSI mounted on a printed wiring board comprises a grounding BGA ball and a power BGA ball to get power supply from the printed wiring board, and the grounding BGA ball and the power BGA ball are arranged closely to each other. A decoupling capacitor is mounted on the printed wiring board and has a first terminal and a second terminal. The grounding BGA ball and the first terminal are connected by a first metal electrode plate, and the power BGA ball and the second terminal are connected by a second metal electrode plate. The first metal electrode plate and the second metal electrode plate interpose a dielectric film having a thickness equal to or smaller than 1 μm therebetween. | 10-30-2008 |
20080272862 | Electrically Optimized and Structurally Protected Via Structure for High Speed Signals - An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitance and thus, the via impedance mismatch in the via structure. As a result, the via structure is electrically optimized. The via structure further comprises one or more floating support members placed in close proximity to the via within a via clearance area between the via and the reference planes. The floating support members are “floating” in the sense that they are not in electrical contact with either the via or the reference planes. Thus, they are not provided for purposes of signal propagation but only for structural support. The floating support members may be connected to one another by way of one or more microvia structures. | 11-06-2008 |
20080272863 | PACKAGE CONFIGURATION AND MANUFACTURING METHOD ENABLING THE ADDITION OF DECOUPLING CAPACITORS TO STANDARD PACKAGE DESIGNS - The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The package is implemented with a minimal redesign of the original design and not requiring any redesign of the signal trace pattern. The invention involves replacing top and bottom bond pads with via straps and then covering the top and bottom reference planes with a dielectric layer having conductive vias that electrically connect with the underlying via straps. Planes having the opposite polarity of the underlying reference plane are then formed on the dielectric layer. These planes include an array of bonding pads in registry with the vias. Decoupling capacitors are mounted to the top of the package and electrically connected with the plane on top of the package and the immediately underlying reference plane without the electrical connections to the capacitors passing through the signal planes of the package. | 11-06-2008 |
20090015354 | Electromagnetic bandgap structure, printed circuit board comprising this and method thereof - An electromagnetic bandgap structure and a printed circuit board including it as well as a method of manufacturing thereof that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. The electromagnetic bandgap structure in accordance with an embodiment of the present invention can include: a first metal layer; a first dielectric layer, stacked on the first metal layer; a metal plate, stacked on the first dielectric layer; a second dielectric layer, stacked on the metal plate and the first dielectric layer; a second metal layer, stacked on the second dielectric layer; and a via, directed from the metal plate to the first metal layer and the second metal layer. The via can be connected to the first metal layer and is not connected the second metal layer. | 01-15-2009 |
20090033443 | Transmission line - A circuit board is provided, and a method for manufacturing the same, suitable for use in high frequency circuits, and comprising a planar pattern of transmission line conductors for linking components formed on or within the circuit board, the transmission line conductors being formed within a corresponding pattern of trenches arranged so that the conductors lie beneath a finished surface of the circuit board which is polished flat to permit one or more cover boards to be bonded thereto. | 02-05-2009 |
20090051469 | MULTI-FUNCTIONAL COMPOSITE SUBSTRATE STRUCTURE - A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be formed above each substrate, so that one or more inductors may be fabricated thereon. One or more capacitors may be fabricated on the first substrate. Also, one or more signal transmission traces of the system impedance are formed on the second substrate of the outside layer. Therefore, the inductance of the inductor(s) is effectively enhanced. Moreover, the area of built-in components is reduced. Furthermore, it has shorter delay time, smaller dielectric loss, and better return loss for the transmission of high speed and high frequency signal. | 02-26-2009 |
20090058570 | WIRING BOARD, METHOD OF DESIGNING THE SAME, AND ELECTRONIC APPARATUS - According to one embodiment, a wiring board includes a transmission line provided to perform communications between a first semiconductor chip and a second semiconductor chip, the transmission line is formed of a distributed constant wiring portion having a characteristic impedance matched to one of an output impedance of the first semiconductor chip and an output impedance of the second semiconductor chip, and a lumped constant wiring portion which is narrower than the distributed constant wiring portion and shorter than a length which can be regarded as a lumped constant circuit. | 03-05-2009 |
20090160583 | HYBRID SURFACE MOUNTABLE PACKAGES FOR VERY HIGH SPEED INTEGRATED CIRCUITS - In one example, a hybrid surface mountable package includes a housing at least partially defining a sealed cavity, two microwave integrated circuits (MIC) chips positioned inside the sealed cavity, and a very-high-speed interconnect connecting the two MIC chips to each other. The very-high-speed interconnect includes strong coupling co-planar waveguide (CPWG) transmission lines. | 06-25-2009 |
20090184784 | Reference Plane Voids with Strip Segment for Improving Transmission Line Integrity over Vias - Reference plane voids with a strip segment for improving transmission line integrity over vias permits routing critical signal paths over vias, while increasing via insertion capacitance only slightly. The transmission line reference plane defines voids above (or below) signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. In order to provide increased routing density, signal paths are routed over the voids, but disruption of the signal paths by the voids is prevented by including a conductive strip through the voids that reduces the coupling to the signal-bearing PTHs and maintains the impedance of the signal path conductor. | 07-23-2009 |
20090206958 | High Voltage Isolation Semiconductor Capacitor Digital Communication Device and Corresponding Package - According to one embodiment, there is provided a semiconductor digital communication device comprising communication drive and sense electrodes formed in a single plane, where the electrodes have relatively high sidewalls. The relatively high sidewalls permit low electrical field densities to be obtained in the sense and drive electrodes during operation, and further permit very high breakdown voltages to be obtained between the electrodes, and between the drive electrode and an underlying ground plane substrate. The device effects communications between drive and receive circuits through the drive and sense electrodes by capacitive means, and in a preferred embodiment is capable of effecting relatively high-speed digital communications. The device may be formed in a small package using, by way of example, CMOS or other semiconductor fabrication and packaging processes. | 08-20-2009 |
20090206959 | RF MODULE - In a radio-frequency wave module including a transmission path based on a distributed parameter element, the transmission path being part of an input/output terminal, a plurality of cavity-structured concave portions for containing semiconductor-including mounted components therein, grounding-use metallic electrodes, dielectric substrates of at least two or more layers, and semiconductors, electrical separation is established between the grounding-use metallic electrodes which form the transmission paths based on the distributed parameter element and at least one of the grounding-use metallic electrodes which are formed on bottom surfaces of the plurality of cavity-structured concave portions for containing the semiconductor-including mounted components therein. | 08-20-2009 |
20090206960 | High Voltage Isolation Dual Capacitor Communication System - According to one embodiment, there is provided a high voltage isolation dual capacitor communication system comprising communication drive and sense electrodes and corresponding first and second capacitors that are formed in two separate devices. The two devices are electrically connected in series to provide a single galvanicly-isolated communication system that exhibits high breakdown voltage performance in combination with good signal coupling. The system effects communications between drive and receive circuits through the first and second capacitors, and in a preferred embodiment is capable of effecting relatively high-speed digital communications. The system may be formed in a small package using, by way of example, CMOS or other semiconductor fabrication and packaging processes. | 08-20-2009 |
20120068793 | MICROPSTRIP TRANSMISSION LINE/COPLANAR WAVEGUIDE (CPW) TRANSISTOR STRUCTURE - A structure having a coplanar waveguide transistor; and a microwave section, coupled to the transistor, having: a strip conductor coplanar with the electrodes of the coplanar waveguide transistor and a ground plane conductor disposed under the strip conductor. | 03-22-2012 |
20120194302 | STRUCTURE, STRUCTURE AND METHOD FOR PROVIDING AN ON-CHIP VARIABLE DELAY TRANSMISSION LINE WITH FIXED CHARACTERISTIC IMPEDANCE - A design structure, structure, and method for providing an on-chip variable delay transmission line with a fixed characteristic impedance. A method of manufacturing a transmission line structure includes forming a signal line of the transmission line structure, forming a first ground return structure that causes a first delay and a first characteristic impedance in the transmission line structure, and forming a second ground return structure that causes a second delay and a second characteristic impedance in the transmission line structure. The first delay is different from the second delay, and the first characteristic impedance is substantially the same as the second characteristic impedance. | 08-02-2012 |
20130257565 | STACKED MODULE - A stacked module includes a first multilayer substrate including an opening having a stepwise wall face, and a first transmission line including a first grounding conductor layer, a second multilayer substrate supported on a stepped portion of the stepwise wall face and including a second transmission line including a second grounding conductor layer, a first chip mounted on a bottom of the opening and coupled to a third transmission line provided on the first multilayer substrate, and a second chip mounted on the front face of the second multilayer substrate and coupled to the second transmission line. A face to which the second grounding conductor layer or a fourth grounding conductor layer coupled thereto is exposed is joined to the stepped portion to which the first grounding conductor layer or a third grounding conductor layer coupled thereto is exposed, and the first and second grounding conductor layers are coupled. | 10-03-2013 |
20140091885 | WIRING BOARD AND HIGH FREQUENCY MODULE USING SAME - A high frequency module wiring board includes a wiring section for high frequency transmission, and a solder resist layer formed upon the wiring section. The solder resist layer covers the wiring section so as to have an opening section at a part of the wiring section in a region extending within a predetermined distance from an input/output terminal of a chip component. | 04-03-2014 |
20160134249 | LAMINATE RF CHOKE FOR FLIP-CHIP POWER AMPLIFIER - A circuit includes a flip-chip die and a laminate substrate. The flip-chip die includes a first bump and a second bump. A first metal layer is disposed on the laminate substrate. The first metal layer includes a first transmission line having a plurality of segments forming a first spiral inductor. A first end of the first transmission line is electrically coupled to the first bump. A second end of the first transmission line is electrically coupled to a first power supply pin. | 05-12-2016 |