| Entries |
| Document | Title | Date |
|---|
| 20080197945 | HIGH FREQUENCY COPLANAR STRIP TRANSMISSION LINE ON A LOSSY SUBSTRATE - A substrate ( | 08-21-2008 |
| 20080211605 | Coupling Lines For a Yig Filter or Yig Oscillator and Method For Producing the Coupling Lines - A coupling conductor for a YIG filter or YIG oscillator, which may be produced from a metallic foil by eroding, laser cutting and/or etching of a metallic foil. The coupling conductor includes at least one curved section, which at least partially surrounds a YIG element and at least one conductor section. | 09-04-2008 |
| 20080315977 | Low loss RF transmission lines - A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light. | 12-25-2008 |
| 20090009270 | Stripline Arrangement and a Method for Production Thereof - The present invention relates to a stripline arrangement ( | 01-08-2009 |
| 20090027143 | High Power Hybrid Material Surface Mount Stripline Devices - The present invention is directed to a method for making a hybrid material stripline device. The method includes providing an inner layer of material, the inner layer including a dielectric material and at least one conductive sheet. At least one stripline device is formed in the inner layer by processing the at least one conductive sheet. The at least one stripline device is characterized by a surface area footprint. A first exterior layer and a second exterior layer are provided. At least one of the first exterior layer and/or the second exterior layer includes at least one ceramic portion. The at least one ceramic portion has a ceramic surface area greater than or substantially equal to the surface area footprint of the at least one stripline device. At least one of the first exterior layer and/or the second exterior layer further includes a softboard dielectric material. The inner layer of material is sandwiched between the first exterior layer and the second exterior layer. The first exterior layer, the inner layer and the second exterior layer are laminated to form a laminate panel structure, a surface of the first exterior layer forming a first major surface of the laminate panel structure and a surface of the second exterior layer forming a second major surface of the laminate panel structure. A first conductive sheet is disposed over the first major surface and a second conductive sheet is disposed over the second major surface, the first conductive sheet and the second conductive sheet being configured as parallel ground planes for the at least one stripline device. | 01-29-2009 |
| 20090027144 | PRINTED WIRING BOARD - A printed wiring board includes a board made of insulator; a wiring pattern to transfer an electric signal which is made of patterned metallic conductor and formed on at least one of a main surface and a rear surface of the board; and an electric power layer formed on at least one of the main surface and the rear surface of the board; wherein the electric power layer includes a mechanism for controlling a characteristic impedance of the printed wiring board. | 01-29-2009 |
| 20090058567 | High speed electronics interconnect and method of manufacture - Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. | 03-05-2009 |
| 20090058568 | High speed electronics interconnect and method of manufacture - Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. | 03-05-2009 |
| 20090066447 | High speed interconnect and method of manufacture - Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. | 03-12-2009 |
| 20090072930 | High speed electronics interconnect and method of manufacture - Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. | 03-19-2009 |
| 20090231065 | CIRCUIT STRUCTURE AND CIRCUIT SUBSTANCE FOR MODIFYING CHARACTERISTIC IMPEDANCE USING DIFFERENT REFERENCE PLANES - A circuit structure for modifying characteristic impedance by using different reference planes is provided. The structure comprises an analog signal line, a digital signal line, a corresponding reference plane for analog signals and a corresponding reference plane for digital signals. Wherein, the line width of the analog signal line is the same as that of the digital signal line. In addition, the distance between the analog signal line and the corresponding analog signal reference plane is longer than the distance between the digital signal line and the corresponding digital signal reference plane. Accordingly, the characteristic impedance mismatch during signal transmission can be solved and the quality of signal transmission can be improved. | 09-17-2009 |
| 20090237186 | SEMICONDUCTOR DEVICE HAVING SHIELD STRUCTURE - A semiconductor device comprises a semiconductor substrate; a diffusion layer formed on the semiconductor substrate; at least two wiring layers formed opposite to each other over the semiconductor substrate; signal lines for transmitting a signal maintaining a predetermined voltage, each of the signal lines being formed in each of the two wiring layers; shield lines fixed to a constant voltage to shield the signal lines, each of the shield lines being formed adjacent to each of the signal lines in the two wiring layers; and a gate electrode formed over the semiconductor substrate via an insulation film. In the semiconductor device, at least one of the signal lines formed in a lower wiring layer of the at least two wiring layers is electrically connected to the gate electrode opposed in a stacking direction. | 09-24-2009 |
| 20090243763 | TRANSMISSION LINE AND A METHOD FOR PRODUCTION OF A TRANSMISSION LINE - The invention relates to a transmission line ( | 10-01-2009 |
| 20090267711 | High frequency circuit - A circuit has a first coplanar line including a first strip conductor formed on the first plane of a dielectric substrate and a first grounded conductor formed on the first plane and disposed on one side of the first strip conductor, and a second coplanar line including a second strip conductor formed on a second plane of the dielectric substrate and a second grounded conductor formed on the second plane and disposed on one side of the second strip conductor, where the first strip conductor and the second strip conductor are electrically connected in parallel and are plane symmetric with respect to the dielectric substrate, and the first grounded conductor and the second grounded conductor are electrically connected in parallel and are plane symmetric with respect to the dielectric substrate. | 10-29-2009 |
| 20090267712 | FEED THRU WITH FLIPPED SIGNAL PLANE USING GUIDED VIAS - An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure. | 10-29-2009 |
| 20090267713 | HIGH-FREQUENCY TRANSMISSION LINE - A high-frequency transmission line includes: a dielectric substrate; a signal line formed on one surface of the dielectric substrate; a first and a second surface ground patterns formed so as to sandwich the signal line at a given distance from the signal line on the surface of the dielectric substrate; a backside surface ground pattern formed on another surface of the dielectric substrate; and a plurality of contacts penetrating the dielectric substrate for connecting the first and the second surface ground pattern to the backside surface ground pattern. In a given frequency range, the sum of the shortest distance from any point of the first and the second surface ground patterns to the nearest contact and the thickness of the dielectric substrate is shorter than ¼ of the effective wavelength of a transmission signal converted in the effective permittivity of the dielectric substrate. | 10-29-2009 |
| 20090302976 | Microstrip Lines with Tunable Characteristic Impedance and Wavelength - A microstrip line structure includes a conductive ground plane having a strip opening encircled by the ground plane. The strip opening extends from a top surface to a bottom surface of the ground plane. The microstrip line structure further includes a dielectric strip filling the strip opening; a dielectric layer over and contacting the ground plane; and a signal line over the dielectric layer, wherein the signal line has a portion directly above a portion of the dielectric strip, and wherein the signal line and the dielectric strip are non-parallel. | 12-10-2009 |
| 20090302977 | METHOD OF MANUFACTURING A TRANSVERSE ELECTRIC MAGNETIC (TEM) MODE TRANSMISSION LINE AND SUCH TRANSMISSION LINE - Method of manufacturing a transmission line including the steps:
| 12-10-2009 |
| 20090309679 | CONNECTION METHOD AND SUBSTRATE - A connection method includes the step of connecting, using a line on a dielectric element, two points through which a signal flows, the two points having different heights and the widths of the line at the positions of the two points having been adjusted on the basis of the thickness of the dielectric element. | 12-17-2009 |
| 20090315648 | Waveguide structure and printed-circuit board - A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane. | 12-24-2009 |
| 20090315649 | DIFFERENTIAL TRANSMISSION LINE INCLUDING TWO TRANSMISSION LINES PARALLEL TO EACH OTHER - In a differential transmission line, a substrate has first and second surfaces parallel to each other, and a first grounding conductor is formed on the second surface of the substrate. A dielectric layer is formed on the first grounding conductor, and a second grounding conductor is formed on the dielectric layer. First and the second signal conductors are formed to be parallel to each other on the first surface of the substrate. The first signal conductor and the first and second grounding conductors constitutes a first transmission line, and the second signal conductor and the first and second grounding conductors constitutes a second transmission line. A slot is formed in the first grounding conductor to sterically intersect with the first and second signal conductors and to be orthogonal to a longitudinal direction thereof, and a connecting conductor is formed for connecting the first grounding conductor with the second grounding conductor. | 12-24-2009 |
| 20100079222 | Coplanar waveguide and fabrication method thereof - A coplanar waveguide includes a signal line formed on a major surface of a high-resistivity silicon substrate, a pair of ground conductors placed on opposite sides of the signal line, and a pair of trenches formed in the substrate between the signal line and the ground conductors. Because of the trenches, the attenuation characteristics of the coplanar waveguide are highly uniform, and are comparable to the attenuation characteristics of coplanar waveguides formed on compound semiconductor substrates. | 04-01-2010 |
| 20100102903 | CONFORMAL REFERENCE PLANES IN SUBSTRATES - Methods, systems, and apparatuses for circuit boards are provided herein. An electrically insulating material is formed over one or more traces on a circuit board. One or more further electrically conductive features are present on the circuit board. A layer of an electrically conductive material is formed over the one or more traces that is electrically isolated from the one or more traces by the electrically insulating material, and is in electrical contact with the one or more further electrically conductive features. The electrically conductive material confines magnetic and electric fields produced when the one or more traces conduct an alternating current. By confining the magnetic and electric field distributions in this manner, problems of interference and/or crosstalk with adjacent signal traces are reduced or eliminated. | 04-29-2010 |
| 20100109816 | Complementary-conducting-strip Transmission Line Structure - This invention discloses a complementary-conducting-strip transmission line (CCS TL) structure. The CCS TL structure includes a substrate, at least one first mesh ground plane, m second mesh ground planes having m first inter-media-dielectric (IMD) layers interlaced with and stacked among each other and the first mesh ground plane to form a stack structure on the substrate, a second IMD layer being on the stack structure, and a signal transmission line being on the second IMD layer. Wherein, each first IMD layer has a plurality of vias to correspondingly connect the first and the m second mesh ground planes, therein, m≧2 and m is a nature number, and the m second mesh ground planes under the signal transmission line have at least one slit structure. | 05-06-2010 |
| 20100141359 | Complementary-Conducting-Strip Structure for Miniaturizing Microwave Transmission Line - The present invention provides a complementary-conducting-strip (CCS) structure for miniaturizing microwave transmission line. The CCS structure comprises a substrate; a transmission part formed on the substrate, the transmission part consisted of M metal layers and at least one connecting arm extending from the metal layers to connect to an adjacent CCS structure, the M metal layers interlaminated M-1 dielectric layer(s) perforating a plurality of first metal vias to connect the M metal layers, wherein M≧=2 and M is a nature number; and a frame part formed on the substrate, the frame part surrounding the transmission part and consisted of M-1 metal frame(s), the M-1 metal frame(s) interlaminated M-2 dielectric frame(s) perforating a plurality of second metal vias to connect the metal frames. | 06-10-2010 |
| 20100156572 | CARRIER FOR TRANSMITTING HIGH FREQUENCY SIGNAL AND CARRIER LAYOUT METHOD THEREOF - A carrier for transmitting a high frequency signal and a carrier layout method thereof are provided. The carrier includes a substrate, conducting wires and reference planes both formed on the substrate. The carrier layout method includes defining impedance and thickness of the carrier according to the high frequency signal and defining layout parameters according to the impedance and the thickness. The layout parameters include a conducting layer formed on the conducting wires, a coplanar waveguide formed between the reference planes and the conducting wires, roughness portions formed on the conducting wires, recessed portions formed on the conducting wires, and the substrate being a high loss tangent substrate. The layout is performed according to the layout parameters defined thereabove, so as to increase loss of the high frequency signal in transmission. | 06-24-2010 |
| 20100164653 | Stacked Coplanar Wave-Guides - An integrated circuit structure includes a semiconductor substrate; an interconnect structure over the semiconductor substrate; a first dielectric layer over the semiconductor substrate and in the interconnect structure; a second dielectric layer in the interconnect structure and over the first dielectric layer; and a wave-guide. The wave-guide includes a first portion in the first dielectric layer and a second portion in the second dielectric layer. The first portion adjoins the second portion. | 07-01-2010 |
| 20100194501 | STRUCTURE DESIGN FOR MINIMIZING ON-CHIP INTERCONNECT INDUCTANCE - A semiconductor device comprising a signal line and ground line is disclosed. The signal line comprises an opening and at least a portion of the ground line is in the opening in the signal line. | 08-05-2010 |
| 20100201462 | FLEXIBLE INTERCONNECT CABLE FOR AN ELECTRONIC ASSEMBLY - A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages. | 08-12-2010 |
| 20100201463 | FLAT UNIFORM TRANSMISSION LINE HAVING ELECTROMAGNETIC SHIELDING FUNCTION - Disclosed herein is a flat uniform transmission line having an electromagnetic shielding function. The flat uniform transmission line includes a strip transmission line, an insulating layer, and electromagnetic shielding layers. The strip transmission line is formed on a dielectric layer made of functional polymer material, and includes a plurality of strip lines. The plurality of strip lines are configured to be a ground line, or to transmit signals. The insulating layer is formed on the strip transmission line. The electromagnetic shielding layers are respectively formed on the insulating layer and beneath the strip transmission line. | 08-12-2010 |
| 20100201464 | FLAT UNIFORM TRANSMISSION LINE HAVING ELECTROMAGNETIC SHIELDING FUNCTION - Disclosed herein is a flat uniform transmission line having an electromagnetic shielding function. The flat uniform transmission line includes a strip transmission line, an insulating layer, and electromagnetic shielding layers. The strip transmission line is formed on a dielectric layer made of functional polymer material, and includes a plurality of strip lines. The plurality of strip lines are configured to be a ground line, or to transmit signals. The insulating layer is formed on the strip transmission line. The electromagnetic shielding layers are respectively formed on the insulating layer and beneath the strip transmission line. | 08-12-2010 |
| 20100214041 | Coupled Microstrip Lines with Tunable Characteristic Impedance and Wavelength - A coupled microstrip line structure having tunable characteristic impedance and wavelength are provided. In accordance with one aspect of the invention, a coupled microstrip line structure comprises a first ground plane having a plurality of first conductive strips separated by a dielectric material, and a first dielectric layer over the first ground plane. The coupled microstrip line further comprises a first signal line over the first dielectric layer, wherein the first signal line is directly above the plurality of first conductive strips, and wherein the first signal line and the plurality of first conductive strips are non-parallel, and a second signal line over the first dielectric layer, wherein the second signal line is directly above the plurality of first conductive strips, and wherein the second signal line and the plurality of first conductive strips are non-parallel, and wherein the second signal line is substantially parallel to the first signal line. | 08-26-2010 |
| 20100225424 | MICROSTRIP AND STRIPLINE TRANSMISSION LINES FOR ELECTRONIC DEVICES - Transmission lines for electronic devices such as microstrip and stripline transmission lines may be provided that include patterned conductive lines and a conductive paint in the patterned conductive lines. The transmission lines may include one or more planar ground conductors. The ground conductors may include conductive lines arranged in a crosshatch pattern with spaces between the conductive lines. The ground conductors may also include conductive paint in spaces within the crosshatched pattern. The ground conductors may form one or more ground planes for the transmission lines. | 09-09-2010 |
| 20100225425 | HIGH PERFORMANCE COUPLED COPLANAR WAVEGUIDES WITH SLOW-WAVE FEATURES - A device including a coplanar waveguide structure is disclosed. A coplanar waveguide structure comprises one or more ground lines proximate to one or more signal lines, the signal lines and the ground lines being essentially parallel to each other and oriented substantially along a first direction; a periodic structure included in at least one of the one or more signal lines comprises alternating segments, wherein at least one of the alternating segments extends in a second direction transverse to the first direction. | 09-09-2010 |
| 20100231331 | Printed Wiring Board - The present invention provides a microstrip line for a printed wiring board such as a flexible printed wiring board which includes a sandwiched thin insulating layer and cannot use a solid grounding conductor, the microstrip line being such that shape of grounding conductors relative to signal lines remains unchanged even in the presence of a curved shape and that overlapping areas of signal lines and grounding conductors located opposite to each other remain unchanged even in case of exposure misalignment or stack misalignment. A printed wiring board with a microstrip line structure in which signal lines are curved include wire-type grounding conductors | 09-16-2010 |
| 20100237966 | MICROWAVE CIRCUIT ASSEMBLY - A microwave circuit assembly includes a Liquid Crystalline Polymer (LCP) layer that supports at least one microwave circuit component. First and second ground plane layers form the outer surfaces of the assembly and these are spaced apart at least partially by a gas, a mixture of gases, or a vacuum, from the LCP supporting layer and the at least one microwave circuit. | 09-23-2010 |
| 20100244996 | SIGNAL TRANSMISSION DEVICE WITH SINGLE OUTPUT CONFIGURATION AND RELATED MOTHERBOARD - A signal transmission device is installed on a motherboard and is electrically connected to a signal control unit and a display output interface. The signal transmission device includes a signal receiving port, a signal output port, and a printed circuit connecting port. The signal receiving port is used for receiving a signal transmitted from the signal control unit. The signal output port is used for single output of the signal to the display output interface. The printed circuit connecting port is used for transmitting the signal from the signal receiving port to the signal output port. Thus, the signal transmission device may be used for single signal output so as to replace a switch integrated circuit of selective signal output. In such a manner, related circuit redesign and manufacturing cost may be reduced accordingly when the motherboard signal output design is changed from selective signal output to single signal output. | 09-30-2010 |
| 20100283559 | Multiple-layer signal conductor - A multiple-layer signal conductor has increased surface area for mitigation of skin effect. Parallel extending elongated strips of conductive material are placed in parallel layers and are separated by a thin layer of dielectric. The elongated strips are conductively connected to one another by regularly spaced vias such that a single signal conductor with multiple conductive layers is formed. During high-speed signaling, the skin effect causes current to concentrate near the surfaces of conductors. The multiple-layer signal conductor, however, has increased surface area with respect to its total cross-sectional area. The effective cross-sectional area which is conductive during high-speed signaling is therefore increased, leading to positive effects on transmission line resistance, heating, signal integrity and signal propagation delay. The multiple-layer signal conductor sees special use on silicon circuit boards and can conduct signals at ten gigahertz or greater for distances of up to five inches without rebuffering or termination. | 11-11-2010 |
| 20100315181 | VERTICAL COPLANAR WAVEGUIDE WITH TUNABLE CHARACTERISTIC IMPEDANCE DESIGN STRUCTURE AND METHOD OF FABRICATING THE SAME - An on-chip vertical coplanar waveguide with tunable characteristic impedance, a design structure, and a method of making the same. An on-chip transmission line includes a signal line, an upper ground line spaced apart from and above the signal line, and a lower ground line spaced apart from and below the signal line. The signal line, the upper ground line and the lower ground line are substantially vertically aligned in a dielectric material. | 12-16-2010 |
| 20110050368 | HIGH FREQUENCY DEVICE - A high frequency device having a membrane structure with improved mechanical strength is provided. The high frequency device includes: a substrate having an aperture; a first dielectric layer that is formed from a material having etching selectivity in relation to a material of the substrate and is provided on the substrate to cover the aperture; a second dielectric layer on the first dielectric layer; and a high frequency element provided in a position opposed to the aperture on the second dielectric layer. | 03-03-2011 |
| 20110050369 | INTEGRATED CIRCUIT - An integrated circuit comprising: a substrate; a first transmission line arranged on the substrate, the first transmission line having a first termination; a die having a first surface on the substrate and an opposed second surface, the die being spaced from the first termination; a second transmission line arranged on the second surface of the die, the second transmission line having a second termination; and a bond wire connected between the first termination and the second termination configured to have a length half the wavelength of the signal central frequency. | 03-03-2011 |
| 20110090028 | MICTOSTRIP TRANSMISSION LINE STRUCTURE WITH VERTICAL STUBS FOR REDUCING FAR-END CROSSTALK - Provided is a microstrip transmission line for reducing far-end crosstalk. In a conventional microstrip transmission line on a printed circuit board, a capacitive coupling between adjacent signal lines is smaller than an inductive coupling therebetween, so that far-end crosstalk occurs. According to the present invention, the capacitive coupling between the adjacent signal lines is increased to reduce the far-end crosstalk. A vertical-stub type microstrip transmission line is provided. | 04-21-2011 |
| 20110109407 | SIGNAL TRANSMISSION LINE - A signal transmission line in which a signal line and a GND, both configured of a conductor foil, are formed within a dielectric, the signal transmission line being influenced by an electrostatic bond in the case where the signal transmission line has been disposed in a housing. In the signal transmission line, the shape of the conductor foil is configured so that a margin from a predetermined mask in an eye pattern in the case where the signal transmission line is disposed in the housing is greater than a margin of a signal transmission line in which the shape of the conductor foil is configured so as to be constant between a transmitting end and a receiving end of the signal transmission line. | 05-12-2011 |
| 20110115578 | RF TRANSITION WITH 3-DIMENSIONAL MOLDED RF STRUCTURE - A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a second flexible layer, and a third flexible layer, wherein a first section of the assembly includes a microstrip transmission line, wherein a second section of the assembly includes a dielectric stripline transmission line, and wherein a third section of the assembly includes a suspended substrate stripline transmission line. | 05-19-2011 |
| 20110121922 | FLEXIBLE INTERCONNECT CABLE FOR AN ELECTRONIC ASSEMBLY - A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages. | 05-26-2011 |
| 20110121923 | VERTICAL TRANSMISSION STRUCTURE - A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core. | 05-26-2011 |
| 20110128100 | HIGH-FREQUENCY WIRING BOARD AND HIGH-FREQUENCY MODULE THAT USES THE WIRING BOARD - The high-frequency wiring board of the present invention includes: first coplanar lines provided with a first signal line and a first planar ground pattern formed on the same wiring layer as the first signal line; second coplanar lines provided with a second signal line formed on a different wiring layer than the first signal line and a second planar ground pattern formed on the same wiring layer as the second signal line; and a first ground pattern formed on the same wiring layer as the first coplanar lines. The first coplanar lines and the second coplanar lines are connected. At least the first ground pattern and the first planar ground pattern are separated in a region following the second signal line from the connection of the first signal line and the second signal line. | 06-02-2011 |
| 20110241803 | SIGNAL TRANSMISSION LINE - A signal transmission line includes a dielectric substrate having first and second surfaces opposite to each other, a first conductor layer provided between the first surface and the second surface and set at a ground potential, a first transmission line having a signal conductor that is provided on the first surface and has a capacitive coupling with the first conductor layer, a second transmission line provided on the second surface, and a connecting conductor that passes through the dielectric substrate and connects the signal conductor of the first transmission line and the second transmission line. The first conductor layer has a first opening in which the connecting conductor is located. A distance between the first conductor layer and the connecting conductor in a first direction in which the signal conductor extends is smaller than a distance between the first conductor layer and the connecting conductor in a second direction orthogonal to the first direction. | 10-06-2011 |
| 20110298567 | SYSTEM AND METHOD FOR CONSTANT CHARACTERISTIC IMPEDANCE IN A FLEXIBLE TRACE INTERCONNECT ARRAY - A system for matching impedance in a flexible trace interconnect array. The array comprising a flexible dielectric film, a plurality of trace conductors disposed along a longitudinal axis of the dielectric film, and a shield disposed along a section of the array, wherein at least one parameter of at least one of an unshielded section and of the shielded section is selected such that impedance of the unshielded section and impedance of the shielded section are substantially the same. | 12-08-2011 |
| 20120056695 | Microstrip and Stripline Transmission Lines for Electronic Devices - Transmission lines for electronic devices such as microstrip and stripline transmission lines may be provided that include patterned conductive lines and a conductive paint in the patterned conductive lines. The transmission lines may include one or more planar ground conductors. The ground conductors may include conductive lines arranged in a crosshatch pattern with spaces between the conductive lines. The ground conductors may also include conductive paint in spaces within the crosshatched pattern. The ground conductors may form one or more ground planes for the transmission lines. | 03-08-2012 |
| 20120075042 | APPARATUS FOR IMPROVING TRANSMISSION BANDWIDTH - An apparatus for improving transmission bandwidth is provided in the embodiments of the present disclosure, which includes: a signal transmission line, side grounds located at two sides of the signal transmission line, and a capacitor disposed between the signal transmission line and the side grounds. The signal transmission line comprises a microstrip line, and the signal transmission line and the side grounds form a coplanar waveguide transmission line together. On a transmission channel connected through a bonding wire, a capacitor is disposed between a signal transmission line and side grounds. An inductor-capacitor (LC) resonance circuit is formed by using inductance characteristics presented by the bonding wire and the capacitor connected in parallel with the bonding wire, and a resonance point is formed within a frequency band in a frequency domain. | 03-29-2012 |
| 20120112857 | DOUBLE MICROSTRIP TRANSMISSION LINE HAVING COMMON DEFECTED GROUND STRUCTURE AND WIRELESS CIRCUIT APPARATUS USING THE SAME - Disclosed are a microstrip transmission line having a common defected ground structure (DGS) and a wireless circuit apparatus having the same. The microstrip transmission line realizes a common defected ground structure (DGS) and a double microstrip structure, and includes: a first dielectric layer; a first signal line pattern formed on a first surface of the first dielectric layer; a common ground conductive layer formed on a second surface of the first dielectric layer and having a defected ground structure, the first surface facing the second surface; a second dielectric layer having a first surface brought into contact with the common ground conductive layer, and facing the first dielectric layer while interposing the common ground conductive layer between the first dielectric layer and the second dielectric layer; and a second signal line pattern formed on a second surface of the second dielectric layer, the first surface facing the second surface. | 05-10-2012 |
| 20120119854 | SEGMENTED TRANSMISSION SIGNAL CIRCUIT - A segmented transmission signal circuit is provided with a parallel bus of data transmission. The bus includes a plurality of sections, each section transmits a corresponding parallel data of multiple bits, and the parallel data corresponding to different sections are in different bit orders. | 05-17-2012 |
| 20120133458 | SIGNAL LINE - A signal line that can be easily bent and significantly reduces loss generated in a high-frequency signal includes a main body including a plurality of insulating sheets made of a flexible material and stacked on each other in a stacking direction. Ground conductors are provided in the main body on the positive z-axis direction side of a signal line. The ground conductors have a slit S formed therein that overlaps the signal line when viewed in plan from the z-axis direction. A ground conductor is provided in the main body on the negative z-axis direction side of the signal line, and is overlapped by the signal line when viewed in plan from the z-axis direction. The ground conductors and the signal line define a strip line structure. A distance between the ground electrodes and the signal line is smaller than a distance between the ground electrode and the signal line. | 05-31-2012 |
| 20120139667 | ON-CHIP HIGH PERFORMANCE SLOW-WAVE COPLANAR WAVEGUIDE STRUCTURES, METHOD OF MANUFACTURE AND DESIGN STRUCTURE - On-chip high performance slow-wave coplanar waveguide structures, method of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and signal layer provided in a same plane as the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness. The wide portion extends toward the at least one ground. | 06-07-2012 |
| 20120139668 | ON-CHIP HIGH PERFORMANCE SLOW-WAVE MICROSTRIP LINE STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES - On-chip high performance slow-wave microstrip line structures, methods of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and a signal layer provided in a different plane than the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness such that a height of the wide portion is different than a height of the narrow portion with respect to the at least one ground. | 06-07-2012 |
| 20120146748 | Transmission Line Pairs with Enhanced Coupling - According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils. | 06-14-2012 |
| 20120154075 | PRINTED CIRCUIT BOARD - A printed circuit board includes a base, a signal layer lying on the base, and a number of pairs of differential signal traces positioned on the signal layer. The base is made of a grid of glass fiber bundles filled with epoxy resin. Each pair of differential signal traces includes a first signal trace and a second signal trace. Each of the first and second signal traces extends in a zigzag pattern. The first signal trace includes a number of wave crests and wave troughs. The wave crests define a reference straight line that connects all the wave crest of the first signal trace. The ratio of the distance from each wave crest to the reference straight line to the orthogonal distance between each wave crest and an adjacent wave trough along the reference straight line is 1:5. | 06-21-2012 |
| 20120188030 | WAVEGUIDE CONVERSION DEVICE - Embodiments of the present application disclose a waveguide conversion device. The waveguide conversion device includes: a multi-layer circuit board; and a waveguide cavity and a metal reflection cavity, located at two lateral sides of the multi-layer circuit board. The waveguide cavity and the metal reflection cavity are embedded in the multi-layer circuit board. The multi-layer circuit board is disposed with a micro strip line or a strip line and a match patch connected to the micro strip line or the strip line. The match patch is located in the waveguide cavity. | 07-26-2012 |
| 20120194300 | COMMUNICATION SHEET STRUCTURE AND INFORMATION MANAGEMENT SYSTEM - To provide a communication sheet structure that is used in combination with an IC tag, has stable read rate and can be easily introduced and installed on an existing shelf, and also an information management system using the same. | 08-02-2012 |
| 20120274423 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE - A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order. | 11-01-2012 |
| 20120313736 | ON-CHIP SLOW-WAVE THROUGH-SILICON VIA COPLANAR WAVEGUIDE STRUCTURES, METHOD OF MANUFACTURE AND DESIGN STRUCTURE - On-chip high performance slow-wave coplanar waveguide through-silicon via structures, method of manufacture and design structures for integrated circuits are provided herein. The method includes forming at least one ground plane layer in a substrate and forming a signal layer in the substrate, in a same plane layer as the at least one ground. The method further includes forming at least one metal filled through-silicon via between the at least one ground plane layer and the signal layer. | 12-13-2012 |
| 20120326812 | HIGH-FREQUENCY TRANSMISSION LINE AND CIRCUIT SUBSTRATE - In order that the total distance of a first high-frequency current path, which is defined in the periphery of slits ( | 12-27-2012 |
| 20130002375 | TRANSMISSION LINE STRUCTURE WITH LOW CROSSTALK - A transmission line structure is disclosed. The structure includes at least one signal transmission line and a pair of ground transmission lines embedded in a first level of a dielectric layer on a substrate, wherein the pair of ground transmission lines are on both sides of the signal transmission line. A first ground layer is embedded in a second level lower than the first level of the dielectric layer and a second ground layer is embedded in a third level higher than the first level of the dielectric layer. First and second pairs of via connectors are embedded in the dielectric layer, wherein the first pair of via connectors electrically connects the pair of ground transmission lines to the first ground layer and the second pair of via connectors electrically connects the pair of ground transmission lines to the second ground layer. | 01-03-2013 |
| 20130009729 | PRINTED CIRCUIT BOARD HAVING MICRO STRIP LINE, PRINTED CIRCUIT BOARD HAVING STRIP LINE AND METHOD OF MANUFACTURING THEREOF - A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer. | 01-10-2013 |
| 20130021118 | Microstrip and stripline transmission lines for electronic devices - Transmission lines for electronic devices such as microstrip and stripline transmission lines may be provided that include patterned conductive lines and a conductive paint in the patterned conductive lines. The transmission lines may include one or more planar ground conductors. The ground conductors may include conductive lines arranged in a crosshatch pattern with spaces between the conductive lines. The ground conductors may also include conductive paint in spaces within the crosshatched pattern. The ground conductors may form one or more ground planes for the transmission lines. | 01-24-2013 |
| 20130038410 | Thermally Conductive Stripline RF Transmission Cable - A thermally conductive stripline RF transmission cable has a flat inner conductor surrounded by a dielectric layer that is surrounded by an outer conductor. The dielectric layer may include a base polymer and a thermally conductive material to increase a thermal conductivity of the cable. A thermal conductivity of the dielectric layer may be increased between a midsection of the inner conductor and the outer conductor. A jacket may surround the outer conductor, the jacket including a base polymer and a thermally conductive material. Additional conductors may be applied within the dielectric layer and/or in the jacket, proximate the outer conductor. | 02-14-2013 |
| 20130038411 | Self-Supporting Stripline RF Transmission Cable - A stripline RF transmission cable has a flat inner conductor surrounded by a dielectric layer that is surrounded by an outer conductor. A jacket with an attachment feature surrounds the outer conductor. The attachment feature may be a fin aligned parallel or normal to the inner conductor. The attachment feature may be continuous or periodic along a longitudinal extent of the cable. The attachment feature may include male and female portions dimensioned to couple with one another, enabling adjacent cables to be attached to one another. | 02-14-2013 |
| 20130038412 | Corrugated Stripline RF Transmission Cable - A stripline RF transmission cable has a generally planar inner conductor surrounded by a dielectric layer that is surrounded by a corrugated outer conductor. The corrugations may be, for example, annular or helical. The outer conductor has a top section and a bottom section which transition to a pair of edge sections that interconnect the top section with the bottom section. The top section, bottom section and the inner conductor may be provided with generally equal widths. A spacing between the inner conductor and the dielectric layer may be reduced proximate a mid section of the inner conductor. The inner conductor may also be corrugated generally normal to a longitudinal extend of the inner conductor. | 02-14-2013 |
| 20130057365 | ELECTROMAGNETIC FIELD COUPLING STRUCTURE, MULTI-LAYER TRANSMISSION-LINE PLATE, METHOD OF MANUFACTURING ELECTROMAGNETIC FIELD COUPLING STRUCTURE, AND METHOD OF MANUFACTURING MULTI-LAYER TRANSMISSION-LINE PLATE - An electromagnetic field coupling structure that is used in a microwave band frequency band, includes: a laminated body in which an inner dielectric layer | 03-07-2013 |
| 20130063229 | TUNABLE HIGH-FREQUENCY TRANSMISSION LINE - The invention relates to a high-frequency transmission line including a conductive tape ( | 03-14-2013 |
| 20130069743 | HIGH-FREQUENCY WAVEGUIDE STRUCTURE - For integration into a CMOS/BICMOS process, a high-frequency waveguide structure, a diode-bridge structure and an imaging/spectroscopy system and a method for manufacturing a high-frequency waveguide structure are provided, wherein a height of each of a first and a second conducting lines ( | 03-21-2013 |
| 20130120087 | COPLANAR WAVEGUIDE - An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes. | 05-16-2013 |
| 20130147581 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 06-13-2013 |
| 20130154773 | Waveguide - A waveguide comprises an inner conductor arranged in a first layer, a pair of outer conductors comprising a first outer conductor and a second outer conductor, and a pair of slotted shields comprising a first slotted shield and a second slotted shield. The first slotted shield and the second slotted shield are arranged in a second layer with a spacing in between to form a section of a ground shield, wherein the second layer is parallel to the first layer. The first slotted shield is connected to the first outer conductor and the second slotted shield is connected to the second outer conductor. | 06-20-2013 |
| 20130234808 | SIGNAL TRANSMISSION LINE AND CIRCUIT BOARD - A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction. | 09-12-2013 |
| 20130249653 | Tunable High-Frequency Transmission Line - The invention relates to a high-frequency transmission line including a central conductive strip ( | 09-26-2013 |
| 20130249654 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE - A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order. | 09-26-2013 |
| 20130285769 | MULTI-LAYER INTEGRATED TRANSMISSION LINE CIRCUITS HAVING IMPROVED SIGNAL LOSS CHARACTERISTICS - Multi-layer in integrated transmission line circuits are provided having improved signal loss characteristics. A multi-layer integrated transmission line circuit, such as a stripline circuit or a microstrip circuit, comprises at least one reference layer; at least one conducting layer having one or more conducting strips, wherein the at least one conducting layer is separated from the at least one reference layer by a substrate; and at least one additional layer positioned between the at least one conducting layer and the at least one reference layer. The multi-layer integrated transmission line circuit may also comprise a dielectric insulating material, such as an organic material or a ceramic material. The additional layers increase a dielectric thickness of the multi-layer integrated transmission line circuit to reduce dielectric losses. | 10-31-2013 |
| 20130321104 | MULTILAYER ELECTRONIC STRUCTURE WITH NOVEL TRANSMISSION LINES - A signal carrier for carrying a signal in a direction within the X-Y plane of a multilayer composite electronic structure comprising a plurality of dielectric layers extending in an X-Y plane, the signal carrier comprising a first transmission line comprising a lower continuous metallic layer and further comprising a row of metallic via posts coupled to the continuous metal layer, wherein the transmission line is separated by a dielectric material from an underlying reference plane. | 12-05-2013 |
| 20140049344 | WIRING BOARD - Provided is a wiring board including: a board; a differential transmission line constituted by two wirings disposed on the board in parallel; an insulation resin layer which is formed on part of a face of the board. A stepped portion constituted by a lateral face of the insulation resin layer is formed at a boundary between the face of the board and a top face of the insulation resin layer. The two wirings extend from the face of the board to the top face of the insulation resin layer so as to traverse the stepped portion. The extending direction of the wirings traversing the stepped portion and the direction of a periphery are perpendicular to each other in a plan view of the board, the periphery being defined by a boundary between the top face of the insulation resin layer and the lateral face of the insulation resin layer. | 02-20-2014 |
| 20140077902 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE - A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order. | 03-20-2014 |
| 20140097916 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE - Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ∈ | 04-10-2014 |
| 20140111291 | TRANSMISSION LINE USED TO TRANSMIT HIGH-FREQUENCY ELECTRICAL SIGNALS - Provided is a transmission line used to transmit high-frequency electrical signals which can remove a dip-shaped (S21) loss of transmission characteristics due to wall surface resonance, furthermore, can further decrease the size, and can suppress the manufacturing cost at a low level. The transmission line used to transmit high-frequency electrical signals ( | 04-24-2014 |
| 20140125434 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 05-08-2014 |
| 20140176264 | HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE INCLUDING THE SAME - A high-frequency signal line includes a dielectric element body including regions and a plurality of flexible dielectric sheets. A signal conductive layer is provided in or on the dielectric element body. Ground conductive layers are provided in or on the dielectric element body and face the signal conductive layer. A distance between the ground conductive layer and the signal conductive layer in the region is smaller than a distance between the ground conductive layer and the signal conductive layer in the regions. The dielectric element body is bent in the region. | 06-26-2014 |
| 20140176265 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE - A high-frequency signal transmission line includes a dielectric body including a stack of a plurality of dielectric layers, a linear signal line located in the dielectric body, a first ground conductor located at a first side of the signal line in a stacking direction and including a plurality of first openings arranged along the signal line, and a plurality of floating conductors located at the first side of the signal line in the stacking direction to overlap with the first openings, when viewed from the stacking direction, each of the floating conductors being not connected to any other conductors. | 06-26-2014 |
| 20140176266 | HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE - A high-frequency signal line includes an element assembly including a plurality of flexible insulator layers, a linear signal line provided in or on the element assembly, a first ground conductor arranged in or on the element assembly so as to be opposed to the signal line not in a first section including a portion of the signal line but in a second section adjacent to the first section, and a second ground conductor provided along the signal line in the first section on the insulator layer on which the signal line is provided. The second ground conductor is not opposed at least in part to the first ground conductor in the first section. | 06-26-2014 |
| 20140184359 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE - A high-frequency signal transmission line includes a flexible body including a plurality of insulating layers. A linear signal line is located in or on the body. A first ground conductor is located opposite to the signal line via at least one of the insulating layers. A second ground conductor extends along the signal line. An interlayer connection portion that connects the first ground conductor and the second ground conductor includes a plurality of interlayer connection conductors individually pierced in some of the insulating layers and connected to each other. The plurality of interlayer connection conductors includes two interlayer connection conductors that are pierced in adjacent ones of the insulating layers with respect to a layer-stacking direction and that have central axes located in different positions when viewed from the layer-stacking direction. | 07-03-2014 |
| 20140184360 | HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE - A high-frequency signal line includes an element assembly including a plurality of insulator layers, a linear signal line provided in or on the element assembly, a first ground conductor provided in or on the element assembly and extending along the signal line, and a plurality of floating conductors provided in or on the element assembly on a first side in a direction of lamination relative to the signal line and the first ground conductor, so as to be arranged along the signal line in an orientation crossing the signal line when viewed in a plan view in the direction of lamination. The floating conductors are opposite to the signal line and the first ground conductor with at least one of the insulator layers positioned therebetween, the floating conductors being connected to neither the signal line nor the first ground conductor. A capacitance is created between the first ground conductor and each of the floating conductors, and has a greater value than a capacitance created between the signal line and the floating conductor. | 07-03-2014 |
| 20140184361 | HIGH FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE - A dielectric element assembly includes a plurality of stacked dielectric sheets. A signal line is provided in or on the dielectric element assembly. A ground conductor is provided in or on the dielectric element assembly on the negative direction side of a z-axis direction relative to the signal line and is arranged so as to oppose the signal line via the dielectric sheets. The ground conductor includes a main body portion and protruding portions. The main body portion extends along the signal line on one side of a direction perpendicular or substantially perpendicular to the signal line relative to the signal line when viewed in plan from the z-axis direction. The protruding portions protrude from the main body portion toward the signal line and overlap the signal line when viewed in plan from the z-axis direction. | 07-03-2014 |
| 20140184362 | HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE - A high-frequency signal line includes an element assembly including a plurality of flexible insulator layers. a linear signal line provided in or on the element assembly, a first ground conductor provided in or on the element assembly and extending along the signal line, a plurality of second ground conductors provided in or on the element assembly and arranged at predetermined intervals in a direction in which the signal line extends, on a first side in a direction of lamination relative to the signal line, the second ground conductors being opposite to the signal line with at least one of the insulator layers positioned therebetween, and a plurality of first via-hole conductors extending through at least one of the insulator layers so as to connect the first and second ground conductors. | 07-03-2014 |
| 20140218137 | MICROSTRIP LINE STRUCTURES - The invention is related to a microstrip line structure, which comprises: a first microstrip line and a second microstrip line, paralleled with the first microstrip line for transferring a transmission signal, and a plurality of grooves periodically arranged on both sides of the second microstrip line by using subwavelength, and each period length in the plurality of grooves is smaller than the wavelength of the transmission signal. | 08-07-2014 |
| 20140232488 | FLAT CABLE - A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided in the dielectric element assembly, a first ground conductor provided on one side in a direction of lamination relative to the signal line and including a plurality of first openings arranged along the signal line, and a second ground conductor provided on the other side in the direction of lamination relative to the signal line and including a plurality of second openings arranged along the signal line. The first ground conductor is more distant from the signal line in the direction of lamination than is the second ground conductor. The first openings are larger than the second openings. | 08-21-2014 |
| 20140292449 | HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRONIC DEVICE - A high-frequency transmission line includes a laminate including dielectric layers, a first signal line provided in the laminate, a second signal line provided in the laminate and positioned on a first side in a direction of lamination relative to the first signal line, so as to cross the first signal line when viewed in a plan view in the direction of lamination, a first ground conductor positioned on a second side in the direction of lamination relative to the first signal line, a second ground conductor positioned on the first side in the direction of lamination relative to the second signal line, and an intermediate ground conductor provided between the first and second signal lines in the direction of lamination, so as to overlap with crossing portions of the first and second lines when viewed in a plan view in the direction of lamination. An area of overlap of the first ground conductor with the first signal line is smaller than an area of overlap of the second ground conductor with the first signal line. An area of overlap of the second ground conductor with the second signal line is smaller than an area of overlap of the first ground conductor with the second signal line. | 10-02-2014 |
| 20140292450 | HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRONIC DEVICE - A high-frequency transmission line includes a laminate including dielectric layers, a first signal line provided on one of the dielectric layers, a second signal line crossing the first signal line when viewed in a plan view in a direction of lamination, the second signal line being positioned on the same dielectric layer as the first signal line except for a crossing portion that crosses with the first signal line, and an intermediate ground conductor provided between the first and second signal lines in the direction of lamination, so as to overlap with crossing portions of the first and second signal lines when viewed in a plan view in the direction of lamination. | 10-02-2014 |
| 20140361854 | COMPACT 3-D COPLANAR TRANSMISSION LINES - This disclosure provides systems, methods and apparatus for a compact 3-D coplanar transmission line (CTL). In one aspect, the CTL has a proximal end and a distal end separated, in a first plane, by a distance D, the first plane being parallel to a layout area of a substrate. The plane is defined by mutually orthogonal axes x and z The CTL provides a conductive path having pathlength L. D is substantially aligned along axis z, L is at least 1.5×D, and the CPW is configured such that at least one third of the pathlength L is disposed along one or more directions having a substantial component orthogonal to the first plane. Less than one third of the pathlength L is disposed in a direction having a substantial component parallel to axis x. | 12-11-2014 |
| 20140361855 | COMMUNICATION SHEET, SMART SHELF - A communication sheet ( | 12-11-2014 |
| 20150015345 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE - A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors. | 01-15-2015 |
| 20150022288 | HIGH-FREQUENCY SIGNAL LINE - A high-frequency signal line includes a body with a first layer level and a second layer level; a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion; a first ground conductor including a first ground portion provided at the first layer level; a second ground conductor including a second ground portion provided at the second layer level; and a second interlayer connection connecting the first ground portion and the second ground portion. A distance between the first interlayer connection and the second interlayer connection is not less than a maximum distance between the first line portion and the first ground portion and is not less than a maximum distance between the second line portion and the second ground portion. | 01-22-2015 |
| 20150022289 | HIGH-FREQUENCY SIGNAL LINE - A signal line includes a first line portion at a first layer level and a second line portion at a second layer level, which are connected by a first interlayer connection. A first ground portion at the first layer level includes end portions closer to the first line portion than an intermediate portion, and a second ground portion at the second layer level includes end portions closer to the second line portion than an intermediate portion. A second interlayer connection connects one of the end portions of the first ground portion and one of the end portions of the second ground portion. A distance between the first and second interlayer connections is less than a distance between the first line portion and the intermediate portion of the first ground portion and is less than a distance between the second line portion and the intermediate portion of the second ground portion. | 01-22-2015 |
| 20150028971 | FLEXIBLE SUBSTRATE AND OPTICAL DEVICE - A flexible substrate is disclosed. The flexible substrate includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first connection portion having a first conductor, a first ground pattern, and a second ground pattern on the first surface, the first ground pattern and the second ground pattern being spaced apart from the first conductor and respectively located at either side of the first conductor, a conductor pattern formed on the second surface, the conductor pattern being connected to the first conductor, and a third ground pattern formed on the second surface, the third ground pattern being connected to the first ground pattern, wherein a distance between the conductor pattern and the third ground pattern is smaller than a distance between the first conductor and the first ground pattern. | 01-29-2015 |
| 20150042420 | OPTICALLY TRANSPARENT, RADIO FREQUENCY, PLANAR TRANSMISSION LINES - A high radio frequency transmission line having a dielectric substrate with two sides and constructed of a transparent material. An electrically conductive strip extends along at least a portion of one side of the substrate. An electrically conductive film is deposited on one of the sides of the substrate at a position spaced from the conductive strip. This conductive film has a thickness sufficiently small so that the film is substantially transparent. | 02-12-2015 |
| 20150042421 | LAMINATED FLAT CABLE AND METHOD FOR PRODUCING SAME - A laminated flat cable includes a laminate, a signal line for high-frequency signal transmission, a reference ground conductor, and an auxiliary ground conductor. The laminate includes a first base layer with first and second principal surfaces and a second base layer with third and fourth principal surfaces, and the second principal surface is opposed to the third principal surface. The signal line is located on the second principal surface. The reference ground conductor is located on the first principal surface and is opposite to the signal line. The auxiliary ground conductor is located on the third or fourth principal surface and is opposite to the signal line. The auxiliary ground conductor includes a plurality of openings arranged along the signal line. | 02-12-2015 |
| 20150048906 | HIGH-FREQUENCY SIGNAL LINE AND METHOD FOR PRODUCING BASE LAYER WITH SIGNAL LINE - A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion. | 02-19-2015 |
| 20150054600 | HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE INCLUDING THE SAME - A high-frequency signal line includes a dielectric body including flexible dielectric sheets laminated in a direction of lamination and also including a first line portion, a second line portion extending along the first line portion, and a third line portion connecting ends in a specified direction of the first and second line portions. In the dielectric body, a signal line extends through the first, second and third line portions, and a first ground conductor and a second ground conductor face the signal line from both sides in the direction of lamination. One or more interlayer connection conductors are pierced in the dielectric sheets to connect the first ground conductor and the second ground conductor. None of the interlayer connection conductors is provided in a portion of the third line portion that is farther in a direction opposite to the specified direction than the signal line when viewed from the direction of lamination. | 02-26-2015 |
| 20150054601 | HIGH-FREQUENCY SIGNAL LINE AND MANUFACTURING METHOD THEREOF - In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together. | 02-26-2015 |
| 20150070110 | SLOW-WAVE RADIOFREQUENCY PROPAGATION LINE - The instant disclosure describes a radiofrequency propagation line including a conducting strip connected to a conducting plane parallel to the plane of the conducting strip, wherein the conducting plane includes a network of nanowires made of an electrically conductive, non-magnetic material extending orthogonally to the plane of the conducting strip, in the direction of said conducting strip. | 03-12-2015 |
| 20150091674 | HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRONIC DEVICE - A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region. | 04-02-2015 |
| 20150091675 | HIGH-FREQUENCY SIGNAL LINE - A high-frequency signal line includes a dielectric body including a first dielectric layer and one or more other dielectric layers laminated together. A first signal line is provided on a first main surface, which is a main surface located on one side in a direction of lamination, of the first dielectric layer. A second signal line is provided on a second main surface, which is a main surface located on another side in the lamination direction, of the first dielectric layer so as to face the first signal line via the first dielectric layer. The second signal line is electrically connected to the first signal line. A first ground conductor is located on one side in the lamination direction than the first signal line. A second ground conductor is located on another side in the lamination direction than the second signal line. | 04-02-2015 |
| 20150097640 | TRANSMISSION LINE FOR 3D INTEGRATED CIRCUIT - A semiconductor transmission line substructure and methods of transmitting RF signals are described. The semiconductor transmission line substructure can include a substrate; a first signal line over the substrate; a first ground line over the substrate; and a second semiconductor substrate over the substrate. The first signal line, the first ground line and the second semiconductor substrate are each vertically spaced apart from one another and can be separated from one another by at least one electrically insulating layer. | 04-09-2015 |
| 20150116060 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE - A high-frequency signal transmission line includes a plate-shaped dielectric element assembly, a linear signal line, and a first ground conductor. The linear signal line is provided at the dielectric element assembly and includes a plurality of thick portions and a plurality of thin portions with a smaller width than the thick portions. The first ground conductor is provided at the dielectric element assembly and positioned on one side in a normal direction to the dielectric element assembly relative to the signal line. The first ground conductor includes a plurality of openings overlapping with the signal line and also includes bridge portions provided between the openings so as to cross the thin portions. The bridge portions cross the thin portion obliquely when viewed in a plan view in the normal direction to the dielectric element assembly. | 04-30-2015 |
| 20150137912 | Millimeter Wave Connector and Band Conductor - A RF connector assembly, suitable for millimeter waves comprises a housing, holding a transmission line and a RF connector. The transmission line has a band conductor held in an outer conductor. The band conductor is supported by a plurality of holding pins. The holding pins are fixed by holes in the outer conductor and penetrate the inner conductor through holes therein. The holding pins are injection molded parts made of plastic. They comprise of two sections which can be connected together by a plug and socket connection. One end of the transmission line has a printed circuit board contact for contacting a strip line, while the other end of the transmission line has a contact for connecting the inner conductor of the RF connector. | 05-21-2015 |
| 20150305142 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board ( | 10-22-2015 |
| 20150318596 | PACKAGE SUBSTRATE - A package substrate includes a core substrate, a first buildup layer and a second buildup layer. The first buildup layer includes an uppermost interlayer, an upper inner interlayer, an uppermost conductive layer including first pads and second pads, an upper first conductive layer, an upper second conductive layer, vias formed through the uppermost interlayer and connecting the upper first conductive layer and the second pads, and skip vias formed through the uppermost and upper inner interlayers and connecting the uppermost and upper second conductive layers. The second buildup layer includes a lowermost interlayer, a lower inner interlayer, a lowermost conductive layer including third pads, a lower first conductive layer, a lower second conductive layer, vias formed through the lowermost interlayer and connecting the lower first conductive layer and third pads, and skip vias formed through the lowermost and lower inner interlayers and connecting the lowermost and lower second conductive layers. | 11-05-2015 |
| 20150325897 | ELECTRICALLY CONTROLLABLE RADIO-FREQUENCY CIRCUIT ELEMENT HAVING AN ELECTROCHROMIC MATERIAL - We disclose an electrically controllable RF-circuit element that includes an electrochromic material. In an example embodiment, the electrically controllable RF-circuit element is configured to operate as a phase shifter whose phase-shifting characteristics can be changed using a dc-bias voltage applied to a multilayered structure containing a layer of the electrochromic material. | 11-12-2015 |
| 20150325901 | COMPENSATION FOR LENGTH DIFFERENCES IN VIAS ASSOCIATED WITH DIFFERENTIAL SIGNALING - A circuit may include a differential via that may include a first via having a first-via length and a second via having a second-via length longer than the first-via length. The circuit may also include a differential stripline coupled to the differential via. The differential stripline may include a first trace and a second trace that are broadside coupled to each other over at least a portion of the differential stripline to form a broadside coupled portion of the differential stripline. The first trace may be coupled to the first via and may have a first-trace length. The second trace may be coupled to the second via and may have a second-trace length. The broadside coupled portion of the differential stripline may be offset from a plane intersecting substantially half-way between the first via and the second via such that the second-trace length is shorter than the first-trace length. | 11-12-2015 |
| 20150327359 | Printed Circuit Board - A printed circuit board that includes conductive layers separated by insulation layers of dielectric material, at least one conductive layer being patterned and having at least one signal line embedded in an insulation material, whereby a conductive ground plan layer, separated by the insulation material and lying in a predetermined distance (d) from the at least one signal line includes a ground plane area associated to and extending along the at least one signal line, the conductive layer associated to and extending along the at least one signal line is provided with openings therein. Preferably the openings are spaces between conducting stripes, extending, seen from above, across the at least one signal line, the conducting stripes being integrally connected with the conductive remainder of the conductive layer. | 11-12-2015 |
| 20150333388 | FLAT CABLE - A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided in the dielectric element assembly, a first ground conductor provided on one side in a direction of lamination relative to the signal line and including a plurality of first openings arranged along the signal line, and a second ground conductor provided on the other side in the direction of lamination relative to the signal line and including a plurality of second openings arranged along the signal line. The first ground conductor is more distant from the signal line in the direction of lamination than is the second ground conductor. The first openings are larger than the second openings. | 11-19-2015 |
| 20150334819 | TRANSMISSION DEVICE - Transmission device including at least one electric conductor for the transmission of an AC signal and a dielectric material at least partly surrounding the at least one conductor. The dielectric material includes dipoles. The device further includes a dipole orienting system adapted to orient the dipoles and to force the dipoles in a saturation regime in order to limit the movement of the dipoles when the at least one electric conductor conducts an AC signal. | 11-19-2015 |
| 20150351222 | RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS - A flat cable includes a plurality of resin layers that are flexible and stacked together, a line conductor, and grounding conductors. The flat cable includes a triplate line in which both surfaces of the line conductor oppose the corresponding grounding conductors, and a microstrip line in which only one of the surfaces of the line conductor opposes the corresponding grounding conductor. A width of the line conductor in the microstrip line is greater than a width of the line conductor in the triplate line, and the flat cable is bent at a position where the microstrip line is provided. | 12-03-2015 |
| 20150357698 | WIDEBAND TRANSITION BETWEEN A PLANAR TRANSMISSION LINE AND A WAVEGUIDE - A wideband transition between a planar transmission line and a waveguide of this invention comprises a substrate, a segment of the planar transmission line and a section of the waveguide. The substrate includes a plurality of conductor-layers stacked from top to bottom and isolated by an insulating material. The segment of the planar transmission line is disposed in a top conductor-layer of the plurality of conductor-layers. The section of the waveguide is disposed on a bottom conductor-layer of the plurality of conductor-layers by a first end. The substrate comprises a conductive patch and a conductive dispersion plate. The conductive patch is disposed in the top conductor-layer and connected to a first end of said segment. The conductive dispersion plate is disposed in the bottom conductor-layer and under the conductive patch. The conductive dispersion plate comprises a corrugation. | 12-10-2015 |
| 20150357699 | MULTILAYER WIRING PLATE AND METHOD FOR FABRICATING SAME - A multilayer wiring plate includes a coaxial wire includes a signal line, an insulation coating and an outer peripheral conductor. An insulating layer is arranged on an inner or outer layer side. A metal film circuit is arranged by the intermediary of the insulating layer, and the metal film circuit and the outer peripheral conductor and signal line of the coaxial wire are connected. A signal line connection part that connects the signal line to the metal film circuit includes a penetration hole A that passes through the insulating layer and the outer peripheral conductor; the coaxial wire from which the outer peripheral conductor is removed inside the penetration hole A; a hole filling resin filled inside the penetration hole A; a penetration hole B that passes through the hole filling resin and the signal line; and a plated layer arranged on an inner wall of the penetration hole B. | 12-10-2015 |
| 20150359082 | CABLE WITH CONNECTORS AND CONNECTOR - A cable with connectors includes a differential transmission path disposed in a paddle card and configured to allow transmission of differential signals between a device and differential signal transmission cables; a chip component mounted on the differential transmission path; and a plurality of foot pads disposed on the differential transmission path to allow mounting of the chip component, the foot pads being greater in width than traces forming the differential transmission path. The differential transmission path has a high-impedance portion at a connection thereof to the foot pads. The high-impedance portion has a differential impedance higher than that of the differential transmission path excluding the high-impedance portion. | 12-10-2015 |
| 20150372366 | COUPLING OF SIGNALS ON MULTI-LAYER SUBSTRATES - A signal distribution structure including: a dielectric material; an overlying conducting layer on a first level of the dielectric material; a first signal line on a second level of the dielectric material, the first signal line being physically separated from the overlying conducting layer by the dielectric material; wherein the overlying conducting layer includes a window running parallel to the first signal line, and further comprising within the window a first coupler electrode on the first level of the dielectric material, the first coupler electrode above, parallel to, and electrically isolated by the dielectric material from the first signal line, wherein the first coupler electrode is electrically isolated from the overlying conducting layer along at least most of its periphery. | 12-24-2015 |
| 20150382450 | TRANSMISSION LINE STRUCTURE - A transmission line structure emplaces at a substrate which includes a first layout layer, a first dielectric layer, a second dielectric layer, a second dielectric layer, and a grounding layer includes a first transmission line pair and at least one second transmission line. The first transmission line pair is set on the first layout layer. The second transmission line is set on the second layout layer. A line of first transmission line pair and a line of the second transmission line cross each other and form a crossing area. A width of the line is narrow. A distance between the first transmission line pair and the second transmission line at the crossing area is less than a distance at an outstanding area. | 12-31-2015 |
| 20160013536 | 3-D INTEGRATED PACKAGE | 01-14-2016 |
| 20160020500 | FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, and a pair of ground layers and, includes a pleated part PL having a plurality of curved portions which are curved so as to be opened or closed, in which in the ground layers, mesh ground layers in which conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided, in which the mesh ground layers are arranged on an outer peripheral side of the curved portions PL | 01-21-2016 |
| 20160021735 | THROUGH-HOLE LAYOUT STRUCTURE, CIRCUIT BOARD, AND ELECTRONIC ASSEMBLY - A through-hole layout structure is suitable for a circuit board. The through-hole layout structure includes a pair of first differential through-holes, a pair of second differential through-holes, a first ground through-hole, a second ground through-hole, and a third ground through-hole, which are all arranged on a first line. | 01-21-2016 |
| 20160028140 | HIGH-FREQUENCY TRANSMISSION LINE - A transmission line portion of a high-frequency transmission cable includes a dielectric body in which a first ground conductor, a signal conductor, and a second ground conductor are arranged along a thickness direction of the dielectric body from a first principle surface side. The second ground conductor is arranged at a position that does not overlap the signal conductor when viewed in a direction perpendicular or substantially perpendicular to the first principle surface. The third ground conductor and the signal conductor are located at the same position in the thickness direction of the dielectric body. The second and third ground conductors are connected to the first ground conductor via interlayer-connector conductors. The width of the second and third ground conductors is narrower than the width of the signal conductor, but a sum of the widths of the second and third ground conductors is larger than the width of the signal conductor. | 01-28-2016 |
| 20160049713 | Stress Relieved High Power RF Circuit - The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure. | 02-18-2016 |
| 20160064793 | SIGNAL TRANSMISSION COMPONENT AND ELECTRONIC DEVICE - A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level. | 03-03-2016 |
| 20160079646 | SIGNAL TRANSMISSION FLAT CABLE - A signal transmission flat cable is provided with an upper electrically insulating thin-film layer ( | 03-17-2016 |
| 20160087325 | Processes For Forming Waveguides Using LTCC Substrates - The present invention describes processes for forming waveguides ( | 03-24-2016 |
| 20160087326 | RADIO FREQUENCY CONNECTION ARRANGEMENT - A radio frequency transmission arrangement comprises a ground plate ( | 03-24-2016 |
| 20160088724 | GROUNDING PATTERN STRUCTURE FOR HIGH-FREQUENCY CONNECTION PAD OF CIRCUIT BOARD - Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads. | 03-24-2016 |
| 20160104928 | INSULATED COVERED WIRE AND MULTI-WIRE WIRING BOARD - The present invention provides an insulated coated wire comprising a wire, a wire coating layer disposed around the wire, and a wire adhesive layer disposed around the wire coating layer, wherein the wire coating layer is of one type of or a combination of two or more types of a fluorine resin, a polyamide-imide resin and a low dielectric polyimide resin having a relative permittivity of less than 3.6 at 10 GHz, and a multi-wire wiring board using the insulated coated wire. | 04-14-2016 |
| 20160149281 | COPLANAR WAVEGUIDE STRUCTURE - A coplanar waveguide structure is provided, which includes a transparent substrate, a center conductor, a first ground conductor and a second ground conductor. The center conductor is disposed on the transparent substrate. The center conductor has a first light transmissive area. The first light transmissive area is greater than 80% of the area of the center conductor. The first ground conductor is disposed on the transparent substrate and opposite to a side of the center conductor. The first ground conductor has a second light transmissive area. The second light transmissive area is greater than 83% of the area of the first ground conductor. The second ground conductor is disposed on the transparent substrate and opposite to another side of the center conductor. The second ground conductor has a third light transmissive area. The third light transmissive area is greater than 83% of the area of the second ground conductor. | 05-26-2016 |
| 20160156087 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE | 06-02-2016 |
| 20160164158 | TRANSMISSION LINE IMPLEMENTATION IN WAFER-LEVEL PACKAGING - In an integrated circuit package that houses radio-frequency (RF) circuits or components using wafer-level packaging (WLP), an RF-signal transmission structure includes a signal-carrying conductive line positioned between grounded conductive lines to avoid undesirable coupling between the signal-carrying conductive line and other RF circuits or components in the same package. | 06-09-2016 |
| 20160164159 | PACKAGE SUBSTRATE - A printed wiring board includes a first insulating layer, a first conductor layer formed on first surface of the first insulating layer, a second conductor layer formed on second surface of the first insulating layer, a first via structure formed in the first insulating layer such that the first via structure is connecting the first and second conductor layers, a second insulating layer formed on the second surface of the first insulating layer such that the second conductor layer is embedded into the second insulating layer, a third conductor layer formed on the second insulating layer, and a second via structure formed in the second insulating layer such that the second via structure is connecting the second and third conductor layers. The second conductor layer includes a dedicated wiring layer which transmits data between two electronic components to be mounted to the first surface of the first insulating layer. | 06-09-2016 |
| 20160254622 | SIGNAL TRANSMISSION CABLE | 09-01-2016 |
| 20160380326 | FLEXIBLE CIRCUIT STRUCTURES FOR HIGH-BANDWIDTH COMMUNICATION - Techniques and mechanisms for enabling small radius bending of a flexible circuit. In an embodiment, the flexible circuit includes a first section, a second section and a third section between the first section and second section. Stacked structures of the first section include a first trace portion and a first conductor, and stacked structures of the second section include a second trace portion and a second conductor. In another embodiment, a first span structure of the third section exchanges a first signal between the first trace portion and the second trace portion while the first conductor and the second conductor are maintained at a reference potential. While the first signal is exchanged, a second span structure of the third section—coplanar with the first span structure—is maintained at the reference potential or propagates a second signal complementary to the first signal. | 12-29-2016 |
| 20190148807 | MILLIMETER WAVE TRANSMISSION LINE ARCHITECTURE | 05-16-2019 |
| 20190150271 | ADDITIVE MANUFACTURING TECHNOLOGY (AMT) FARADAY BOUNDARIES IN RADIO FREQUENCY CIRCUITS | 05-16-2019 |
