| Entries |
| Document | Title | Date |
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| 20080224787 | ACCELERATION FEEDBACK CONTROL FOR CRYSTAL OSCILLATORS - Methods and apparatus for controlling frequency in a crystal oscillator are provided that allows for continued reception of GPS signal solution in a continuous high G environment. One method comprises measuring G-forces asserted on the crystal oscillator, determining a shift in frequency of the crystal oscillator due to the measured G-forces, determining a temperature that would shift the crystal oscillator's frequency back to a rate that would occur without the measured G-forces, and changing the temperature of the crystal oscillator based on the determined temperature to shift the crystal oscillator's frequency back to a rate that would occur if the G-forces were not present. | 09-18-2008 |
| 20080238561 | PIEZOELECTRIC OSCILLATOR - For a piezoelectric oscillator according to the present invention, an oscillator circuit includes: a piezoelectric vibrator; an NMOS transistor and a PMOS transistor that constitute an amplifier connected in parallel to the piezoelectric vibrator; and load capacitors connected in parallel to the piezoelectric vibrator. The gate terminals of the NMOS transistor and the PMOS transistor, which are constituents of the amplifier, are connected by a DC cut capacitor, and the gate terminal of the NMOS transistor and the output terminal of the amplifier are connected by a feedback resistor. An arbitrary bias voltage, to be applied to the gate terminal of the PMOS transistor via a high-frequency elimination resistor, is generated by a circuit provided by a diode-connected, second PMOS transistor. | 10-02-2008 |
| 20080258829 | Integrated quartz oscillator on an active electronic susbtrate - An oscillator having a quartz resonator, and a base wafer containing active electronics, wherein the quartz resonator is bonded directly to the base wafer and subsequently hermetically capped. | 10-23-2008 |
| 20080258830 | IC FOR CONTROL OF TEMPERATURE-COMPENSATED CRYSTAL OSCILLATOR - A temperature-compensated crystal oscillator includes a mode selector circuit | 10-23-2008 |
| 20080266009 | Ultra-low power crystal oscillator - An ultra-low power crystal oscillator architecture that draws less than 2 μA during steady state operation. An amplifier stage is self biased and has input and output clamp circuits that limit its signal swing. Circuit values are selected such that there is sufficient transient load current for the first amplifier stage to oscillate, while at the same time the input and output clamp circuits maintain a sufficiently low swing of the stage such that the steady state average load current is on the order of less than 1 μA. | 10-30-2008 |
| 20080284535 | Two-level mounting board and crystal oscillator using the same - The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same. | 11-20-2008 |
| 20080309424 | Digital Tuning of Crystal Oscillators - Embodiments feature techniques and systems for digitally tuning a crystal oscillator circuit. In one aspect, embodiments feature a method for making a digitally tuned crystal oscillator circuit. The method involves receiving a multi-bit input signal into a digital modulator, modulating the multi-bit input signal with the digital modulator by oversampling or by noiseshaping and oversampling to produce a digitally-modulated output signal having a lower number of bits than the multi-bit input signal. The method also involves coupling a tuning capacitor with the crystal oscillator circuit, and coupling the digitally-modulated output signal from the digital modulator to the crystal oscillator circuit and the tuning capacitor. In some embodiments, the digital modulator can a delta-sigma modulator, a noiseshaping modulator, a delta modulator, a pulse width modulator, a differential modulator, or a continuous-slope delta modulator. | 12-18-2008 |
| 20090027133 | Crystal oscillator with variable-gain and variable-output-impedance inverter system - A crystal oscillator with variable gain and variable output impedance inverter system includes an inverter, a variable impedance feedback circuit, connected between the output and input of the inverter, a crystal oscillator system, having a crystal with first and second electrodes connected across the input and output of the inverter; a serial variable impedance circuit connected between the inverter output and an electrode of the crystal and a control circuit for temporarily, during start up mode, increasing the impedance of the feedback circuit and decreasing the impedance of the serial circuit relative to the stationary mode impedances and then returning the feedback impedance to the lower impedance level and the serial circuit to the higher impedance level that promotes high frequency stability of the oscillator in the normal, stationary mode, of operation. | 01-29-2009 |
| 20090039970 | Crystal Oscillator Frequency Tuning Circuit - Embodiments feature techniques and systems for analog and digital tuning of crystal oscillators. In one aspect, some implementations feature a method for tuning a frequency of a crystal oscillator that can include adjusting the tuning frequency of the crystal oscillator from a nominal frequency via a switched-capacitor frequency tuning circuit, the switched-capacitor frequency tuning circuit can have switchable sections to adjust the tuning of the crystal oscillator. The method can include controlling an analog control input that is coupled to a varactor within each of the switchable sections, where each of the switchable sections can include a fixed capacitor in series with the varactor and a switch. The method can involve controlling a digital control input, where the digital control input can electrically connect or disconnect one or more of the switchable sections from the crystal. There can be independent control between the digital and analog tuning mechanisms. | 02-12-2009 |
| 20090039971 | METHOD OF FABRICATING HERMETIC TERMINAL AND HERMETIC TERMINAL, METHOD OF FABRICATING PIEZOELECTRIC OSCILLATOR AND PIEZOELECTRIC OSCILLATOR, OSCILLATOR, ELECTRONIC APPLIANCE, AND RADIO CLOCK - A method of fabricating a hermetic terminal includes: joining and firing wherein a bar-shaped member to be a lead is inserted into a ring, and they are fired to form a hermetic terminal intermediate having the bar-shaped member fixed in the ring; flattening wherein an end part of the bar-shaped member to be the inner lead portion of the lead is flattened to form a stair portion; and shaping wherein an end part of the stair portion is cut to shape the stair portion into a predetermined shape, wherein in the joining and firing step, a solid round bar longer than the lead is used as the bar-shaped member, and one end side of the bar-shaped member to be the inner lead portion is inserted into the ring so that the one end side is longer than the inner lead portion in the hermetic terminal as a completed product. | 02-12-2009 |
| 20090058547 | METHOD OF FABRICATING HERMETIC TERMINAL AND HERMETIC TERMINAL, METHOD OF FABRICATING PIEZOELECTRIC OSCILLATOR AND PIEZOELECTRIC OSCILLATOR, OSCILLATOR, ELECTRONIC APPLIANCE, AND RADIO CLOCK - A method of fabricating a hermetic terminal having an annular ring, a lead arranged to penetrate through the ring in which one end side thereof is an inner lead portion electrically connected to a piezoelectric vibrating piece and the other end side thereof is an outer lead portion electrically connected to outside as the ring is between them, and a filler fixing the lead to the ring, wherein the hermetic terminal seals the piezoelectric vibrating piece inside a case, the method includes the steps of: applying plating to a hermetic terminal intermediate having the lead fixed in the ring with the filler to plate the ring and the lead; setting the hermetic terminal intermediate after subjected to plating on a holding member; and flattening an end part of an inner lead portion in the lead to form a stair portion in the hermetic terminal intermediate set on the holding member. | 03-05-2009 |
| 20090108949 | TEMPERATURE COMPENSATION FOR CRYSTAL OSCILLATORS - Methods and apparatus for generating a temperature compensated frequency estimate for a crystal oscillator, wherein the temperatures of the crystal and oscillator are both accounted for. A crystal temperature measurement is used to generate a first frequency component. The difference between the oscillator temperature measurement and a second temperature is scaled, and used to generate a second frequency component. The first and second frequency components may be summed to produce a frequency estimate for the crystal oscillator. In an embodiment, the computations may be performed in the slope domain. | 04-30-2009 |
| 20090189705 | Crystal oscillator for surface mounting - A crystal oscillator includes an oscillator circuit, a main body, a first switching circuit, a second switching circuit, and a voltage detecting circuit. The oscillator circuit includes an IC chip including an output circuit and a function circuit. The crystal element includes a first excitation electrode and a second excitation electrode. The main body houses the oscillator circuit and the crystal element and includes a power supply terminal, a ground terminal, an output terminal, and a function terminal. The output terminal is electrically connected to the output circuit and the first excitation electrode via the first switching circuit. The function terminal is electrically connected to the function circuit and the second excitation electrode via the second switching circuit. The first switching circuit and the second switching circuit are operated on the basis of a switching signal from the voltage detecting circuit connected to the power supply terminal. | 07-30-2009 |
| 20090212878 | Oven-controlled crystal oscillator - An oven-controlled crystal oscillator includes a circuit board, a crystal unit surface-mounted on the circuit board, and a temperature control circuit that maintains operating temperature of the crystal unit constant. The temperature control circuit includes a heating resistor, a power transistor that supplies power to a heating resistor, and a temperature sensitive resistor that detects temperature of the crystal unit. The heating resistor is formed, as a film resistor, on a surface of the circuit board in an area thereof in which the crystal unit is located. The temperature sensitive resistor is provided on the circuit board as a film resistor. | 08-27-2009 |
| 20090261914 | CRYSTAL OSCILLATOR CIRCUITS - An oscillator circuit. A gain stage element is coupled between both terminals of the crystal. The gain stage element provides a transconductance for oscillation according to a current provided by a current source, and outputs a periodic signal through an output terminal. A bias element is coupled between an input terminal and the output terminal of the gain stage element to bias the gain stage element. A first capacitor is coupled to the input terminal of the gain stage element. A second capacitor is coupled to the output terminal of the gain stage element. A controller detects the periodic signal, and adjusts the current when the periodic signal is obtained. | 10-22-2009 |
| 20090261915 | Crystal Device for Surface Mounting - There is provided a crystal device in which an area inside a ceramic case is made larger to increase the design freedom of a crystal unit (crystal element). | 10-22-2009 |
| 20090302961 | RESONANT ACTUATOR - A piezoelectric ceramic base member is formed of a bismuth layer compound to have a bar shape. Main electrodes and are provided on two end surfaces of the piezoelectric ceramic base member in an oscillation direction, and connection electrodes are formed at side-surface central portions of the piezoelectric ceramic base member and are electrically connected to the main electrodes through extraction conductors interposed therebetween, respectively. In addition, the oscillation and polarization directions are set in the same direction, and the piezoelectric ceramic base member is driven at a resonant frequency or at a frequency in the vicinity thereof. In the piezoelectric ceramic base member, the crystal c axis is preferably oriented in a direction orthogonal to the polarization direction. Accordingly, a resonant actuator can be realized which is able to obtain a high oscillation speed since having a large mechanical quality factor Qm, and the oscillation of which is not disturbed by mechanical factors. | 12-10-2009 |
| 20090322437 | SYSTEM, METHOD AND APPARATUS EMPLOYING CRYSTAL OSCILLATOR - In some embodiments, an apparatus and system includes a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; an integrated circuit die mounted to one of the outer surfaces, and a crystal oscillator mounted to one of the outer surfaces and electrically connected to the integrated circuit die. In some embodiments, a method includes providing a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; mounting an integrated circuit die to one of the outer surfaces, mounting a crystal oscillator to one of the outer surfaces; and electrically connecting the crystal oscillator to the integrated circuit die. | 12-31-2009 |
| 20100045393 | Crystal oscillator - A crystal oscillator is provided to secure a space for housing the IC and electronic components, even if the vibrator is small in size. In this crystal oscillator, there is not a hindrance to the wire connections between the IC and the electronic components, and the limitation on the vibrator and oscillator design is reduced. Also, the influence of the heat from the IC and the electronic components is made smaller. Thus, desired characteristics can be readily achieved with this crystal oscillator. In this crystal oscillator, the IC and the electronic components are housed in a concave portion formed in the ceramic package. A pedestal formed with a crystal plate made of the same material as the vibrator is provided to cover almost the entire opening of the concave portion, and the vibrator is placed on the pedestal. | 02-25-2010 |
| 20100123524 | OSCILLATOR - An oscillator that includes a movable element formed of silicon, the movable element vibrating by electrostatic force, a stationary element supporting the movable element, a temperature detector located in contact with the stationary element, the temperature detector detecting the temperature of the stationary element, a supporting element joined to a joint surface between the movable element and the stationary element, the supporting element supporting the movable element, the stationary element, and the temperature detector on a surface opposite to the joint surface, a surrounding element contacted with the supporting element, the surrounding element and the supporting element surround the movable element, and electrodes provided on a surface of the surrounding element opposite to a surface of surrounding element contacted with the supporting element. | 05-20-2010 |
| 20100127787 | VOLTAGE CONTROL TYPE TEMPERATURE COMPENSATION PIEZOELECTRIC OSCILLATOR - A voltage control type temperature compensation piezoelectric oscillator, includes: a voltage control type oscillation circuit; an automatic frequency control (AFC) circuit outputting a control voltage for controlling an oscillation frequency of the voltage control type oscillation circuit based on an external control voltage; a temperature compensation voltage generating circuit generating a temperature compensation voltage; and a gain variable circuit varying a gain of the temperature compensation voltage. In the oscillator, the gain variable circuit is controlled by the control voltage outputted from the AFC circuit, and the oscillation frequency of the voltage control type oscillation circuit is controlled by an output voltage of the gain variable circuit. | 05-27-2010 |
| 20100207696 | PIEZOELECTRIC VIBRATOR, METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, AND OSCILLATOR - There is provided a piezoelectric vibrator that can hold the crystal plate parallel to the base substrate regardless of the shape of the crystal plate. A method for manufacturing the piezoelectric vibrator, and an oscillator are also provided. The piezoelectric vibrator includes a base substrate; a lid substrate; a piezoelectric vibrating piece including a crystal plate having on its outer surface excitation electrodes and mount electrodes; through electrodes provided in through holes formed through the base substrate; inner electrodes formed on the upper surface of the base substrate; and metal bumps formed at predetermined positions of the inner electrodes. The piezoelectric vibrating piece is tapered towards the ends along the longitudinal direction, and mounted on the metal bumps in a cantilever fashion. The metal bumps are provided in a plurality along the longitudinal direction of the piezoelectric vibrating piece, and have heights that become higher towards a position corresponding to an end of the piezoelectric vibrating piece along the longitudinal direction. | 08-19-2010 |
| 20100207697 | METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, AND OSCILLATOR - The invention provides a method for manufacturing a piezoelectric vibrator, a piezoelectric vibrator, and an oscillator, whereby mounting of the piezoelectric vibrating piece by flip-chip bonding is ensured. A manufacturing method of a piezoelectric vibrator is a method for manufacturing a piezoelectric vibrator that includes: a base substrate; a lid substrate bonded to the base substrate; a piezoelectric vibrating piece including a crystal plate having on its outer surface excitation electrodes, and mount electrodes electrically connected to the excitation electrodes; inner electrodes to be electrically connected to the piezoelectric vibrating piece; and metal bumps to provide electrical interconnections between the inner electrodes and the mount electrodes. The method includes a inner electrodes forming step of forming the inner electrodes, a metal bump forming step of forming the metal bumps, and a mount step of bonding the mount electrodes of the piezoelectric vibrating piece to the metal bumps, wherein, in the mount step, the piezoelectric vibrating piece is mounted and fixed in such a manner that tips of the metal bumps are not in contact with the crystal plate. | 08-19-2010 |
| 20100207698 | METHOD FOR MANUFACTURING GLASS-SEALED PACKAGE, APPARATUS FOR MANUFACTURING GLASS-SEALED PACKAGE, AND OSCILLATOR - The invention provides a method and an apparatus for manufacturing a glass-sealed package, whereby anodic bonding of a pair of wafers is ensured over substantially the whole area of the wafers, and whereby a vacuum is ensured inside the cavity during the anodic bonding of the wafers. The invention also provides an oscillator having such characteristics. The manufacturing method of a glass-sealed package includes the step of anodically bonding a pair of wafers by applying voltage to positions corresponding to circumferential portions of the wafers stacked in layers, and the step of dividing the pair of anodically bonded wafers into individual pieces. A through hole is formed at a central portion of at least one of the wafers, and the anodic bonding of the wafers is made by applying voltage using a plurality of electrodes disposed at the positions corresponding to the circumferential portions of the wafers. | 08-19-2010 |
| 20100237959 | LAMB-WAVE RESONATOR AND OSCILLATOR - A Lamb-wave resonator includes: a piezoelectric substrate; an IDT electrode disposed on one principal surface of the piezoelectric substrate, having bus bar electrodes each connecting one ends of a plurality of electrode finger elements, the other ends of the plurality of electrode finger elements being interdigitated with each other to form an apposition area; and a pair of reflectors disposed on the one principal surface of the piezoelectric substrate, and respectively arranged on both sides of the IDT electrode in a propagation direction of a Lamb wave, wherein denoting a thickness of the piezoelectric substrate in the apposition area of the electrode finger elements as ti, a thickness of the piezoelectric substrate in areas between respective ends of the apposition area in a direction perpendicular to the propagation direction of the Lamb wave and the bus bar electrodes as tg, and a wavelength of the Lamb wave as λ, the thickness ti exists in a range represented by 0| 09-23-2010 | |
| 20100244973 | FLEXURAL VIBRATION PIECE AND OSCILLATOR USING THE SAME - A flexural vibration piece includes: a flexural vibrator that has a first region on which a compressive stress or a tensile stress acts due to vibration and a second region having a relationship in which a tensile stress acts thereon when a compressive stress acts on the first region and a compressive stress acts thereon when a tensile stress acts on the first region, and performs flexural vibration in a first plane; and a heat conduction path, in the vicinity of the first region and the second region, that is formed of a material having a thermal conductivity higher than that of the flexural vibrator and thermally connects between the first region and the second region, wherein when m is the number of heat conduction paths, α | 09-30-2010 |
| 20100271145 | CRYSTAL OSCILLATOR CIRCUIT AND ELECTRONIC DEVICE USING THE SAME - A crystal oscillator circuit is connected between first and second oscillator pins of a chip and provides clock signals for the chip. The crystal oscillator circuit comprises a crystal, a first capacitor, a second capacitor and a third capacitor. The first capacitor is connected between the first and second oscillator pins of the chip. The second capacitor is connected between the first oscillator pin and ground. The third capacitor comprises one end connected to the second oscillator pin of the chip, and the other end grounded by way of the crystal. | 10-28-2010 |
| 20100271146 | TEMPERATURE COMPENSATED CRYSTAL OSCILLATOR, PRINTED-CIRCUIT BOARD, AND ELECTRONIC DEVICE - A temperature compensated crystal oscillator includes an oscillation circuit including a crystal oscillator; a variable capacitor inserted in series in the oscillation circuit; a thermosensitive circuit element whose resistance value changes in accordance with a temperature of the crystal oscillator, the thermosensitive circuit element being formed on the crystal oscillator by vapor deposition; and a correction circuit configured to correct capacitance of the variable capacitor based on a current value that is used when applying current to the thermosensitive circuit element. | 10-28-2010 |
| 20100277251 | OSCILLATOR, OSCILLATOR ARRAY AND AN ELECTRONIC APPARATUS - A oscillator include: a vibrator that vibrates in a thickness shear vibration mode; a first adsorption film formed in a first region in a first surface of the vibrator; a second adsorption film formed in a second region in a second surface of the vibrator opposing to the first surface; and a substrate with a surface on which the vibrator is erected, wherein the vibrator contacts the substrate in a third surface that is different from the first surface and the second surface. | 11-04-2010 |
| 20100327987 | Method of manufacturing crystal element and crystal resonator manufactured thereby - The present invention relates to a crystal element manufacturing method for manufacturing a plurality of crystal elements at a wafer level, and to a crystal resonator manufactured by this method. The method is comprised when the frequencies of the crystal elements are adjusted by adjusting the thickness of a crystal wafer that constitutes the crystal element in two stages by partial wet etching, the thicknesses of a large number of the step sections are coarse-adjusted in a first stage by collectively subjecting the step sections to partial wet etching, and then variations in the thicknesses of each group of a small number of the step sections are fine-adjusted in a second stage by collectively subjecting the step sections to partial wet etching. Alternatively, variations in the thicknesses of a small number of the step sections are coarse-adjusted and made uniform by means of partial wet etching, and then in a second stage, the thicknesses of a group of a plurality of the step sections having equal thicknesses are fine-adjusted by collectively subjecting the step sections to partial wet etching. Step sections having different areas are respectively formed on both of the front and back surfaces of a crystal wafer; at a crystal wafer level, these step sections are first collectively subjected to partial wet etching and thereby coarse-adjusted; then the thickness of each of the step sections is individually fine-adjusted by means of partial wet etching; and thereby the tact (the amount of operation time) required in partial wet etching is reduced. | 12-30-2010 |
| 20110018649 | ELECTRICAL RESONATOR DEVICE WITH A WIDE FREQUENCY VARIATION RANGE - An electrical resonator device, capable of operating at variable frequency ω, including: an acoustic wave resonator, a first electrical circuit coupled in parallel to the resonator with an adjustable complex impedance whose imaginary part is equal to | 01-27-2011 |
| 20110037527 | FAST START-UP CRYSTAL OSCILLATOR - An exemplary fast start-up crystal oscillator with reduced start-up time. The exemplary oscillator reduces the start-up time (i.e., the time taken to attain sustained stable oscillations after the power is turned on) by increasing the negative resistance of a circuit. Increasing the negative resistance increases the rate of growth of the oscillations, thereby reducing start-up time. The exemplary crystal oscillator includes a gain stage with negative resistance. A crystal with shunt capacitance is placed in the feedback loop of the gain stage. A buffer is coupled to the gain stage such that it blocks the crystal shunt capacitance from loading the gain stage, effectively increasing the negative resistance of the gain stage. Further, an oscillation detection and control circuit is coupled between the crystal and the gain stage. The oscillation detection and control circuit connects the buffer during start-up, and disconnects the buffer once an oscillation signal attains sustained stable oscillations. | 02-17-2011 |
| 20110043295 | Semiconductor device having an ESD protection circuit - A semiconductor integrated circuit, includes an operational amplifier including a first input terminal, a second input terminal, and an output terminal, a first transistor which has a source-drain route connected between an external terminal and a first voltage, and a gate terminal connected to the output terminal of the operational amplifier; and a second transistor which has a source-drain route connected between the first input terminal of the operational amplifier and the first voltage, and a gate terminal connected to the output terminal of the operational amplifier. | 02-24-2011 |
| 20110063041 | RESONATOR ELEMENT, RESONATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A resonator element includes: a base portion; and a resonating arm extending in a first direction from the base portion, wherein the resonating arm includes a first surface, a second surface facing the first surface, a first side surface extending in the first direction so as to connect the first and second surfaces, and a second side surface facing the first side surface, wherein the resonating arm includes a first width portion having a first width and a second width portion provided at a root of the resonating arm so as to have a second width larger than the first width, wherein the resonating arm includes a groove portion provided on at least one of the first and second surfaces so as to extend in the first direction, the groove portion in the second width portion having a width larger than a width of the groove portion in the first width portion, and wherein a sum of the width between the groove portion in the second width portion and the first side surface and the width between the groove portion in the second width portion and the second side surface is smaller than a sum of the width between the groove portion in the first width portion and the first side surface and the width between the groove portion in the first width portion and the second side surface. | 03-17-2011 |
| 20110068876 | VIBRATING REED, VIBRATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A vibrating reed includes: a base; at least one vibrating arm extending from the base; at least one support arm extending from the base, and at least a part of which extends in parallel to the vibrating arm; and at least one receiving section formed of a part of the support arm, the part extending to have a shape of a projection so that a distance from the vibrating arm is reduced. | 03-24-2011 |
| 20110074516 | PIEZOELECTRIC CERAMIC COMPOSITION, PIEZOELECTRIC CERAMIC, PIEZOELECTRIC ELEMENT, AND OSCILLATOR - A piezoelectric ceramic composition is provided which contains Perovskite oxides expressed by General Formula 1 below and an aluminum compound, and in which the content ratio of the aluminum compound to the Perovskite oxides is from 1% by mass to 11% by mass, | 03-31-2011 |
| 20110074517 | Hybrid system having a non-MEMS device and a MEMS device - A hybrid system having a non-MEMS device and a MEMS device is described. The apparatus includes a non-MEMS device and an integrated circuit including a MEMS device, the integrated circuit formed on a substrate. The integrated circuit includes a control circuit for the non-MEMS device and a MEMS control circuit for the MEMS device. | 03-31-2011 |
| 20110080225 | SURFACE ACOUSTIC WAVE DEVICE, MODULE DEVICE, OSCILLATION CIRCUIT, AND METHOD FOR MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE - An SH wave type surface acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate and constituted of Al or an alloy mainly containing Al and that uses a SH wave as an excitation wave. The piezoelectric substrate is a crystal plate in which a cut angle θ of a rotary Y cut quartz substrate is set in a range of −64.0°<η<−49.3° in a counter-clockwise direction from a crystal axis Z and in which a surface acoustic wave propagation direction is set at 90°±5° with respect to a crystal axis X. An electrode film thickness H/λ standardized by a wavelength of the IDT electrode is 0.04| 04-07-2011 | |
| 20110095834 | Dual table temperature compensated voltage controlled crystal oscillator system and method - Dual table temperature compensation for a voltage controlled crystal oscillator is achieved by sensing the temperature of the voltage controlled crystal oscillator (VCXO), retrieving from a first table the frequency error with variations in the temperature sensed, retrieving from a second table the oscillator control voltage corresponding to the frequency error from the first table and applying the oscillator control voltage to the VCXO. | 04-28-2011 |
| 20110095835 | Hybrid system having a non-mems device and a mems device - A hybrid system having a non-MEMS device and a MEMS device is described. The apparatus includes a non-MEMS device and an integrated circuit including a MEMS device, the integrated circuit formed on a substrate. The integrated circuit includes a control circuit for the non-MEMS device and a MEMS control circuit for the MEMS device. | 04-28-2011 |
| 20110133848 | Thin-Film Piezoelectric-on-Insulator Resonators Having Perforated Resonator Bodies Therein - A micro-electromechanical resonator self-compensates for process-induced dimensional variations by using a resonator body having a plurality of perforations therein. These perforations may be spaced along a longitudinal axis of the resonator body, which extends orthogonal to a nodal line of the resonator body. These perforations, which may be square or similarly-shaped polygonal slots, may extend partially or entirely though the resonator body and may be defined by the same processes that are used to define the outer dimensions (e.g., length, width) of the resonator body. | 06-09-2011 |
| 20110140793 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured. The manufacturing method includes a penetration hole forming step of forming a plurality of penetration holes | 06-16-2011 |
| 20110140794 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator including a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; a piezoelectric vibrating reed which has a pair of vibration arm portions extending in parallel, a pair of excitation electrodes that vibrate the pair of vibration arm portions, and a mount electrode that is electrically connected to the pair of excitation electrodes, the piezoelectric vibrating reed being mounted on the base substrate within the cavity via the mount electrode; an insulation film which is formed on the piezoelectric vibrating reed so as to cover the excitation electrodes; and a getter material formed of the metallic material that is formed on any of the base substrate or the lid substrate so as to be arranged within the cavity and improve a degree of vacuum within the cavity by being heated. | 06-16-2011 |
| 20110140795 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE - Provided is a method of manufacturing a piezoelectric vibrator of the invention, the piezoelectric vibrator including a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions, a package that accommodates the piezoelectric vibrating reed, and a pair of regulation films that is formed along a longitudinal direction of the vibration arm portions corresponding to each of the pair of vibration arm portions, the piezoelectric vibrator being capable of regulating a degree of vacuum in the package more than a certain level by irradiating the regulation films with a laser to evaporate a part of the regulation films. The method includes a gettering process of irradiating a laser in symmetrical positions via a center axis of the pair of vibration arm portions in the pair of regulation films. | 06-16-2011 |
| 20110140796 | PIEZOELECTRIC VIBRATOR, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE - A piezoelectric vibrator includes a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions; a package that accommodates the piezoelectric vibrating reed; and a getter material that is formed along the longitudinal direction of the vibration arm portion in an inner portion of the package, wherein a cross-sectional area of a middle portion of the getter material adjacent to a center portion of the longitudinal direction of the vibration arm portion is greater than that of an end portion of the getter material. | 06-16-2011 |
| 20110148539 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; an external electrode that is formed on a lower surface of the base substrate; an internal electrode that is formed on an upper surface of the base substrate so as to be accommodated in the cavity; a through electrode which is formed so as to pass through the base substrate and electrically connect the external electrode with the internal electrode; a piezoelectric vibrating reed which is accommodated in the cavity in a state of being electrically connected to the internal electrode; and a getter material that is formed in the cavity, the getter material being formed of chromium or a metallic material consisting of chromium as a main ingredient. | 06-23-2011 |
| 20110156831 | BENDING VIBRATION PIECE, VIBRATION DEVICE, AND ELECTRONIC APPARATUS - A flexural mode resonator element includes: a vibration arm extending from a base end toward a tip; a base joined to the vibration arm at the base end; and supporting arms arranged on both sides of the base in a width direction perpendicular to an extending direction of the vibration arm and joined to the base, wherein the base has a reduced cross-section portion disposed along the extending direction of the vibration arm between a joint portion with the vibration arm and a joint portion with the supporting arms, and the reduced cross-section portion is disposed so as to satisfy a relationship 2×W | 06-30-2011 |
| 20110169584 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND ATOMIC TIMEPIECE - To provide a piezoelectric vibrator manufacturing method that curbs a dispersion of a bonding film at a time of a gettering step and with which good electrical characteristics can be obtained, and an oscillator, electronic device, and atomic timepiece, in which is mounted a piezoelectric vibrator with which good electrical characteristics can be obtained. A manufacturing method includes a gettering step whereby a getter material is irradiated with a first laser penetrating a base substrate from the outer side of the base substrate, activating the getter material so that it adsorbs gas existing inside a cavity, and a frequency adjustment step whereby a weight metal film formed at leading ends of vibrating arms of a piezoelectric vibrating piece is irradiated with a second laser penetrating the base substrate from the outer side of the base substrate, thus adjusting the frequency of the piezoelectric vibrating piece, wherein the intensity of the first laser in the gettering step is weaker than the intensity of the second laser in the frequency adjustment step. | 07-14-2011 |
| 20110187471 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - There are provided a piezoelectric vibrator capable of suppressing vibration leakage while securing mounting strength of a piezoelectric vibrating reed and an oscillator, an electronic apparatus, and a radio-controlled timepiece each using the piezoelectric vibrator. The piezoelectric vibrator includes: a package that accommodates a piezoelectric vibrating reed; and a bump that mounts the base portion of the piezoelectric vibrating reed on a package. The bump includes a plurality of main bumps which is arranged in a line in the width direction of the base portion so as to be bonded to the base portion; and an auxiliary bump which is bonded to the base portion in an area between the main bumps disposed at both ends in the width direction of the base portion and an area between the main bumps and base ends of the vibrating arms in the longitudinal direction of the base portion. | 08-04-2011 |
| 20110187472 | PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - There are provided a piezoelectric vibrating reed capable of securing a stable bonding strength between a bump and the piezoelectric vibrating reed, a piezoelectric vibrator having the piezoelectric vibrating reed, a method for manufacturing the piezoelectric vibrator, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A piezoelectric vibrating reed includes: a vibrating portion; a base portion adjacent to the vibrating portion; excitation electrodes formed in the vibrating portion; mount electrodes formed in the base portion; and extraction electrodes for electrically connecting the excitation electrodes and the mount electrodes to each other. A bonding film made of gold is formed on the surfaces of the mount electrodes, and the bonding film is formed to a thickness such that, when the bonding film is ultrasonically bonded to a bump made of gold, mutual diffusion occurs over approximately the entire area in the thickness direction of the bonding film. | 08-04-2011 |
| 20110193642 | PIEZOELECTRIC VIBRATOR AND OSCILLATOR USING THE SAME - In a piezoelectric vibrator in which a piezoelectric vibrating reed is mounted on a mounting portion installed on a surface of the base substrate in a cantilevered state and the piezoelectric vibrating reed is accommodated to be covered by a lid substrate, the resistance of a lead-out electrode for supplying a drive power to the piezoelectric vibrating reed is reduced, thereby preventing degradation of vibrating performance. A first lead-out electrode is formed between a first through-electrode and a mounting portion formed on a base substrate, a conductor film is formed from a bonding member on a bonding surface where the base substrate and a lid substrate are bonded to each other, the first lead-out electrode and the conductor film are electrically connected to each other via the first connection portion in the vicinity of the mounting portion and via the second connection portion in the vicinity of the first through-electrode, thereby reducing the resistance of the first lead-out electrode. | 08-11-2011 |
| 20110193643 | METHOD OF MANUFACTURING PACKAGE AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - Provided is a method of manufacturing a package capable of providing a plurality of through-electrodes in a base substrate made of a glass material with high position precision. An electrode member having a plurality of pins erected on a base is prepared, the plurality of pins is inserted into a plurality of through-holes of a glass substrate provided with the plurality of through-holes, the resultant is heated to a temperature higher than the softening point of the glass substrate to weld the corresponding through-holes and the pins to each other, the glass substrate is ground after cooling to remove the base, and the pins are exposed from both surfaces of the glass substrate, thereby forming through-electrodes which are electrically separated from each other. | 08-11-2011 |
| 20110193644 | PIEZOELECTRIC VIBRATOR AND OSCILLATOR USING THE SAME - In a piezoelectric vibrator in which a piezoelectric vibrating reed is mounted on a mounting portion installed on a surface of the base substrate in a cantilevered state and the piezoelectric vibrating reed is accommodated to be covered by a lid substrate, the resistance of a lead-out electrode for supplying a drive power to the piezoelectric vibrating reed is reduced, thereby preventing degradation of vibrating performance. A first lead-out electrode is formed between a first through-electrode and a mounting portion formed on a base substrate, a second lead-out electrode is formed on a surface of a lid substrate on the base substrate side, the first and second lead-out electrodes are electrically connected to the first and second connection portions in the vicinities of the mounting portion and the first through-electrode, respectively, thereby reducing the resistance of the lead-out electrode. | 08-11-2011 |
| 20110193645 | PIEZOELECTRIC VIBRATOR AND OSCILLATOR USING THE SAME - In a piezoelectric vibrator in which a piezoelectric vibrating reed is mounted on a mounting portion installed on a surface of the base substrate in a cantilevered state and the piezoelectric vibrating reed is accommodated to be covered by a lid substrate, the resistance of a lead-out electrode for supplying a drive power to the piezoelectric vibrating reed is reduced, thereby preventing degradation of vibrating performance. A first lead-out electrode formed between a mounting portion of a base substrate and a first through-electrode is formed in a peripheral region so as not to overlap with first and second excitation electrodes formed on outer surfaces of a piezoelectric vibrating reed for driving, thereby reducing the resistance of the first lead-out electrode. | 08-11-2011 |
| 20110193646 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole. | 08-11-2011 |
| 20110193647 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE - A method of manufacturing a piezoelectric vibrating reed from a wafer, the piezoelectric vibrating reed including a pair of vibration arm portions that is arranged in parallel, a base portion that integrally fixes proximal end sides of the pair of vibration arm portions, and groove portions which are formed on both surfaces of the pair of vibration arm portions along the longitudinal direction of the vibration arm portions, respectively, the method including a protective film forming process of forming a protective film in an area other than a position corresponding to the groove portions in the wafer; and a groove portion forming process of forming the groove portions by using the protective film as a mask to perform dry etching with respect to the wafer, wherein, in the protective film forming process, a first protective film forming process of forming the protective film of a predetermined thickness with respect to a first surface of the wafer and a second protective film forming process of forming the protective film of a predetermined thickness with respect to a second surface of the wafer are alternatively performed several times. | 08-11-2011 |
| 20110199161 | Voltage controlled oscillator - A voltage controlled oscillator (VCO) securing a wide range of variable amount of oscillatory frequency is provided. In the VCO, a resistor R | 08-18-2011 |
| 20110199162 | PACKAGE, METHOD OF MANUFACTURING THE SAME, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - Provided are a package and a method of manufacturing the package capable of suppressing corrosion of a bonding material and providing excellent airtightness, and to provide a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A bonding material formed on a front surface of a base substrate is anodically bonded to a frame region of a lid substrate. On the outer surface of a package, a protection film made of a material having higher resistance to corrosion than the bonding material is formed so as to cover at least the bonding material exposed between the base substrate and the lid substrate. | 08-18-2011 |
| 20110199163 | SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND SURFACE ACOUSTIC WAVE MODULE UNIT - In a surface acoustic wave resonator in which an IDT having electrode fingers for exciting surface acoustic waves is formed on a crystal substrate, the line occupying ratio causing the maximum electromechanical coupling coefficient and the line occupying ratio causing the maximum reflection of the surface acoustic waves in the IDT are different from each other, the center of the IDT has the line occupying ratio causing an increase in electromechanical coupling coefficient in comparison with the edges of the IDT, and the edges of the IDT have the line occupying ratio causing an increase in reflection of the surface acoustic waves in comparison with the center of the IDT. | 08-18-2011 |
| 20110204986 | METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a method of manufacturing a package capable of forming a penetration electrode without conduction defects while maintaining the airtightness of a cavity by suppressing the occurrence of voids in a baked glass, a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. The package manufacturing method includes a second glass frit filling step of filling a second glass frit in a penetration hole to be overlapped on a first glass frit and temporarily drying the second glass frit; and a baking step of baking and curing the first and second glass frits filled in the penetration hole. The second particle size of the second glass particles contained in the second glass frit is larger than the first particle size of the first glass particles contained in the first glass frit. | 08-25-2011 |
| 20110210802 | HBAR Resonator with a High Level of Integration - The invention relates to a resonator of the high bulk acoustic resonator HBAR type, for operating at a pre-determined working frequency, comprising: a piezoelectric transducer ( | 09-01-2011 |
| 20110215879 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A method for manufacturing a piezoelectric vibrator is provided. The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; extraction electrodes which are formed on the first substrate so as to be extracted from the inner side of the cavity to an outer edge of the first substrate; a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the extraction electrodes at an inner side of the cavity; and outer electrodes which are formed on an outer surface of the package so as to be electrically connected to the extraction electrodes at the outer side of the cavity. The method includes: a bonding film forming step of forming a bonding film on at least one of the first substrate and the second substrate using a low-melting-point glass so as to bond the two substrates; a mounting step of electrically connecting the piezoelectric vibrating reed to the extraction electrodes formed on the first substrate; and a bonding step of superimposing the first substrate and the second substrate onto each other with the bonding film disposed therebetween while heating the bonding film to a predetermined bonding temperature to thereby bond the two substrates by the bonding film. | 09-08-2011 |
| 20110221537 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; outer electrodes which are formed on an outer surface of the first substrate; inner electrodes which are formed on the first substrate so as to be accommodated in the cavity; penetration electrodes which are formed so as to penetrate through the first substrate so that the outer electrodes and the inner electrodes are electrically connected; and a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the inner electrodes at the inner side of the cavity. The first substrate and the second substrate are bonded by a bonding film that is formed of a low-melting-point glass, and the bonding film is heated to a predetermined bonding temperature when the first substrate and the second substrate are bonded together, and is formed by being heated to a temperature higher than the bonding temperature before the bonding is performed. | 09-15-2011 |
| 20110227661 | GLASS SUBSTRATE BONDING METHOD, GLASS ASSEMBLY, PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a glass substrate bonding method capable of securely anodically bonding a bonding material and a glass substrate even when Si having a large resistance value is used as a material for the bonding material, a glass assembly obtained by the glass substrate bonding method, a package manufacturing method, a package, a piezoelectric vibrator, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezoelectric vibrator. A glass substrate bonding method includes an anodic bonding step of anodically bonding a bonding material fixed to an inner surface of a lid substrate wafer to a base substrate wafer. The bonding material is formed of an ITO film and a Si film which are sequentially formed on the inner surface of the lid substrate wafer. | 09-22-2011 |
| 20110234330 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT - An electronic component includes: a base material having a first conductive section; an oscillation piece having a second conductive section; a first member which is covered with a third conductive section making conductive contact with the first and second conductive sections and is provided between the base material and the oscillation piece; and a second member which is provided so as to be surrounded with the base material, the oscillation piece, and the first member and holds the base material and the oscillation piece. | 09-29-2011 |
| 20110241791 | OSCILLATING SIGNAL GENERATING DEVICE AND RELATED METHOD - An oscillating signal generating device includes an oscillating circuit and a control circuit. The oscillating circuit includes: a resonator having a first terminal and a second terminal for generating an oscillating signal, a resistive element having a first terminal coupled to the first terminal of the resonator, and a second terminal coupled to the second terminal of the resonator, and an oscillating start-up circuit having an input terminal coupled to the first terminal of the resonator and an output terminal coupled to the second terminal of the resonator. The control circuit generates a control signal to change the oscillating start-up circuit into a disable mode from an enable mode when the oscillating circuit generates an oscillating output signal under an operation mode, and outputs the oscillating signal generated by the resonator as the oscillating output signal of the oscillating circuit. | 10-06-2011 |
| 20110241792 | PACKAGE, PIEZOELECTRIC VIBRATOR AND PIEZOELECTRIC OSCILLATOR - A package is configured to accommodate a piezoelectric element. The package includes a guide part having a plurality of spaces into which electrodes of the piezoelectric element is inserted, respectively. The plurality of spaces of the guide part are separated from each other. | 10-06-2011 |
| 20110248788 | GLASS SUBSTRATE POLISHING METHOD, PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO TIMEPIECE - A glass substrate polishing method having polishing processes for polishing a glass substrate surface while supplying a polishing agent. The glass substrate polishing method is characterized in that the polishing processes include a first polishing process in which the surface of the glass substrate is polished using a first polishing pad made from a polishing cloth and a second polishing process in which the surface of the glass substrate is polished using a second polishing pad made from urethane foam. | 10-13-2011 |
| 20110260803 | CRYSTAL OSCILLATOR CLOCK CIRCUIT - A crystal oscillator clock circuit which facilitates switching its output between an internally generated clock signal and an externally generated clock signal. A feedback loop detects the presence of an externally generated clock signal applied to an output pin of a crystal oscillator circuit and powers down the internally generated clock signal. As a result, the crystal oscillator clock circuit simply passes the externally generated clock signal as its output signal. | 10-27-2011 |
| 20110298555 | VIBRATOR ELEMENT, VIBRATOR, VIBRATION DEVICE, ELECTRONIC APPARATUS, AND FREQUENCY ADJUSTMENT METHOD - A vibrator element includes: a base section formed on a plane including a first direction and a second direction perpendicular to the first direction; and a vibrating arm extending from the base section in the first direction, wherein the vibrating arm flexurally vibrates in a normal direction of the plane, and has a first surface one of compressed and extended due to the flexural vibration and a second surface one of extended when the first surface is compressed and compressed when the first surface is extended, the first surface is provided with a first mass section, and the second surface is provided with a second mass section, and at least one of the first mass section and the second mass section has a portion, which fails to be opposed to the other of the first mass section and the second mass section in a plan view in the normal direction. | 12-08-2011 |
| 20110304405 | MEMS RESONATORS - A crystalline semiconductor resonator device comprises two matched resonators which are aligned differently with respect to the crystal structure of the crystalline semiconductor. The resonators each comprise a portion of a material having a different temperature dependency of the Young's modulus to the temperature dependency of the Young's modulus of the crystalline semiconductor material. In this way, the suspension springs for the resonators have different properties, which influence the resonant frequency. The resonant frequency ratios between the first and second resonators at a calibration temperature and an operation temperature are measured. A frequency of one (or both) of the resonators at the operation temperature can then be derived which takes into account the temperature dependency of the one of the resonators. | 12-15-2011 |
| 20110304406 | QUARTZ CRYSTAL RESONATOR ELEMENT, QUARTZ CRYSTAL DEVICE, AND METHOD FOR PRODUCING QUARTZ CRYSTAL RESONATOR ELEMENT - A quartz crystal resonator element includes an AT-cut quartz crystal substrate, the substrate having edges parallel to each of a Z″ axis obtained by rotating a Z′ axis in a range of −120° to +60° about a Y′ axis and an X′ axis perpendicular to the Z″ axis when an angle formed by rotating a +Z′ axis in a direction of a +X axis about the Y′ axis is a positive rotation angle; a thin section that forms a resonating section; and a thick section adjacent to the resonating section, the thin section and the thick section being formed on the quartz crystal substrate by wet etching. The thin section is formed either on a main surface of the substrate corresponding to a +Y′-axis side or on a main surface of the substrate corresponding to a −Y′-axis side. When the thin section is formed by the etching on the main surface of the +Y′-axis side, the thick section is provided at least a +Z″-axis-side end of the thin section, whereas when the thin section is formed by the etching on the main surface of the −Y′-axis side, the thick section is provided at least a −Z″-axis-side end of the thin section. | 12-15-2011 |
| 20120013414 | CRYSTAL OSCILLATOR CIRCUIT FOR ADJUSTING RESONANT FREQUENCY OF CRYSTAL OSCILLATOR - A crystal oscillator includes a clock generator, first and second capacitors, a crystal oscillator, a variable capacitance diode, and a voltage generating circuit. The crystal oscillator is connected between the input pin and the output pin of the clock generator, and connected between the first terminal of the first capacitor and the first terminal of the second capacitor. The variable capacitance diode is connected between the second terminal of the first capacitor and the second terminal of the second capacitor. The voltage generating circuit is connected between two terminals of the variable capacitance diode to supply different voltages for the variable capacitance diode to change a junction capacitance of the variable capacitance diode, to change a resonant frequency of the crystal oscillator. | 01-19-2012 |
| 20120013415 | Method of manufacturing packages, package, piezoelectric, vibrator, and oscillator - A method of manufacturing packages includes a welding step for welding a base substrate wafer to a rivet member by heating the base substrate wafer while pressing the same by a forming die from both sides in the thickness direction is provided, wherein a rivet member receiving portion which can receive a distal end of a core member is formed in a receiving die of the forming die, and an inner surface of the rivet member receiving portion is formed into a tapered shape widening from the bottom side toward the opening side. | 01-19-2012 |
| 20120025923 | VIBRATOR ELEMENT, VIBRATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A vibrator element includes: a base having a mounting surface; a vibrating arm which is extended from the base and has a first surface and a second surface that faces the first surface and is positioned on the mounting surface side, and which performs flexural vibration in a direction normal to the first and second surfaces; and a laminated structure which is provided on at least one of the first and second surfaces of the vibrating arm, and which includes at least a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes, in which the vibrating arm is warped toward the mounting surface side. | 02-02-2012 |
| 20120044025 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD - An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base. | 02-23-2012 |
| 20120056686 | VIBRATOR ELEMENT, VIBRATOR, VIBRATION DEVICE, AND ELECTRONIC DEVICE - A vibrator element includes: a base portion; a plurality of vibrating arms which extends in the Y-axis direction from the base portion so as to be arranged in a line in the X-axis direction, and piezoelectric elements which are formed on the vibrating arms so as to allow the vibrating arms to perform flexural vibration in the Z-axis direction. The respective vibrating arms include first surfaces which are compressed or expanded in response to flexural vibration and second surfaces which are expanded when the first surfaces are compressed and which are compressed when the first surfaces are expanded. The vibrating arms have the piezoelectric elements which are formed close to the first surfaces, and the other vibrating arm has the piezoelectric element which is formed close to the second surface. | 03-08-2012 |
| 20120062329 | SURFACE ACOUSTIC WAVE DEVICE, ELECTRONIC APPARATUS, AND SENSOR APPARATUS - A SAW device | 03-15-2012 |
| 20120086516 | OVEN CONTROLLED CRYSTAL OSCILLATOR - Provided is an oven controlled crystal oscillator which can reduce an occurrence of cracks in an applied solder of a large-sized circuit component and improve reliability. It is an oven controlled crystal oscillator in which a slit is formed in a periphery or below a lower surface of a large-sized circuit component provided on the substrate, further, a plurality of small-sized circuit components, which are smaller than the large-sized circuit component, are disposed around the large-sized circuit component, as necessary, and for the plurality of small-sized circuit components, an electronic component, which is electrically connected, and a dummy electronic component, which is not electrically connected, are used. | 04-12-2012 |
| 20120098609 | Crystal Oscillator With Low-Power Mode - Circuits having corresponding methods and computer-readable media comprise: an amplifier; a crystal port configured to be electrically coupled to a crystal, wherein a first terminal of the crystal port is electrically coupled to an input of the amplifier, and wherein a second terminal of the crystal port is electrically coupled to an output of the amplifier; a first capacitor, wherein a first terminal of the first capacitor is electrically coupled to ground; a second capacitor, wherein a first terminal of the second capacitor is electrically coupled to ground; a first switch configured to selectively electrically couple the input of the amplifier to a second terminal of the first capacitor; and a second switch configured to selectively electrically couple the output of the amplifier to a second terminal of the second capacitor. | 04-26-2012 |
| 20120098610 | OVEN-CONTROLLED CRYSTAL OSCILLATOR AND MANUFACTURING METHOD OF THE SAME - Provided are an oven controlled crystal oscillator in which in a case where a metal lead is soldered to a substrate, even if cracks occur in the solder, its reliability is not reduced, and a production method. That is, an oven controlled crystal oscillator in which pre-tinning solders are formed around openings on a front surface and a rear surface of a substrate in which of a through hole for passing a metal lead therethrough is formed; and in a state where a metal lead including a solder layer (a pre-tinning solder) formed on its surface is inserted into the through hole of the substrate, the metal lead extending from the openings is soldered to the openings on the front surface and the rear surface of the substrate, so as to form a main solder, and a production method of the oven controlled crystal oscillator are provided. | 04-26-2012 |
| 20120098611 | INTEGRATED ACOUSTIC BANDGAP DEVICES FOR ENERGY CONFINEMENT AND METHODS OF FABRICATING SAME - The present invention is directed to monolithic integrated circuits incorporating an oscillator element that is particularly suited for use in timing applications. The oscillator element includes a resonator element having a piezoelectric material disposed between a pair of electrodes. The oscillator element also includes an acoustic confinement structure that may be disposed on either side of the resonator element. The acoustic confinement element includes alternating sets of low and high acoustic impedance materials. A temperature compensation layer may be disposed between the piezoelectric material and at least one of the electrodes. The oscillator element is monolithically integrated with an integrated circuit element through an interconnection. The oscillator element and the integrated circuit element may be fabricated sequentially or concurrently. | 04-26-2012 |
| 20120105165 | SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND SURFACE ACOUSTIC WAVE MODULE DEVICE - A surface acoustic wave resonator includes a piezoelectric substrate and an interdigital transducer (IDT) that includes electrode fingers exciting a surface acoustic wave on the piezoelectric substrate, a first region at a center of the IDT, and a second region and a third region at opposite sides of the IDT. In the IDT, a line occupation rate at which an electromechanical coupling coefficient becomes a maximum is different from the line occupation rate at which reflection of the surface acoustic wave becomes a maximum. | 05-03-2012 |
| 20120133451 | FUNCTION GENERATOR CIRCUIT - A function generator circuit for outputting a control signal to an oscillating circuit includes a temperature detecting circuit for outputting a detection voltage corresponding to an ambient temperature and having a linear temperature characteristic, a zeroth-order component generating circuit for generating a zeroth-order component of the control signal, a first-order component generating circuit for generating a first-order component of the control signal, a second-order component generating circuit for generating a second-order component of the control signal, a third-order component generating circuit for generating a third-order component of the control signal based on the detection voltage, and an adder-subtractor that generates the control signal by obtaining a sum of the zeroth-order component, the first-order component, and the third-order component and adding or subtracting the second-order component to or from the sum. The second-component generating circuit is configured to correct a temperature at an inflection point of the control signal. | 05-31-2012 |
| 20120139652 | VIBRATION DEVICE, OSCILLATOR, AND ELECTRONIC APPARATUS - A vibration device includes: a first vibrator having a 3rd-order function temperature characteristic in which a 3rd-order temperature coefficient is −γ | 06-07-2012 |
| 20120146737 | MULTIPLE-OUTPUT CLOCK SOURCE SIGNAL GENERATOR - A multiple-output clock source signal generator for use with a fiber-optic communication apparatus for multi-dwelling units (MDU) includes a piezoelectric crystal, an input capacitor, an output capacitor, and a buffer unit having output ends. The piezoelectric crystal, the input capacitor, and the output capacitor are connected to the buffer unit so as to form a feedback circuit whereby the piezoelectric crystal oscillates and generates clock source signals to be output from the output ends, respectively. The multiple-output clock source signal generator is advantageously characterized by low costs and multiple output. | 06-14-2012 |
| 20120146738 | PIEZOELECTRIC OSCILLATOR - Provided is a piezoelectric oscillator which can easily perform adjustment of oscillation frequency at a low cost and which can restrain frequency changes due to power supply voltage variations. The piezoelectric oscillator includes a frequency adjustment circuit and an oscillator circuit and is configured such that: a cathode of a variable-capacitance diode D | 06-14-2012 |
| 20120154068 | CRYSTAL OSCILLATOR AND METHOD FOR MANUFACTURING THE SAME - A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided. | 06-21-2012 |
| 20120194284 | OSCILLATION CIRCUIT HAVING SHIELD WIRE, AND ELECTRONIC APPARATUS - There is provided an oscillation circuit including a crystal vibrator that is connected between input and output terminals of a CMOS inverter making up the oscillation circuit; an input wiring line that includes a crystal vibrator-side input terminal connected to an input terminal pad of the CMOS inverter; an output wiring line that includes a crystal vibrator-side output terminal connected to an output terminal pad of the CMOS inverter; a ground power source wiring line that includes a crystal vibrator-side ground power source terminal; and a capacitative element that is connected between the input wiring line and the ground power source wiring line, and between the output wiring line and the ground power source wiring line, wherein the ground power source wiring line is disposed at least a part of between the input wiring line and the output wiring line. | 08-02-2012 |
| 20120194285 | VIBRATOR ELEMENT, VIBRATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A vibrator element includes: a base portion; and three vibrating arms that extend from the base portion in the Y axis direction. The vibrating arms are arranged in the X axis direction, include excitation electrodes on a principal face, and vibrate in the Z axis direction . When an arm width of the vibrating arm, which is located at the center of the arrangement, in the X axis direction is W1, each arm width of the other vibrating arms in the X axis direction is W, an electrode width of the excitation electrode of the vibrating arm, which is located at the center of the arrangement, in the X axis direction is Al, and each electrode width of the excitation electrodes of the other vibrating arms in the X axis direction is A, 1.35| 08-02-2012 | |
| 20120200366 | OSCILLATOR - An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder. | 08-09-2012 |
| 20120206211 | PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE - A piezoelectric vibrating piece includes a pair of vibration arm portions that is placed in a row in a width direction; a base portion to which proximal end sides in the pair of vibration arm portions in an extending direction are connected; and weight metal films that are formed on outer surfaces of the vibration arm portions, wherein the weight metal films are formed in positions that avoid regions of tip portions in the vibration arm portions in a longitudinal direction. | 08-16-2012 |
| 20120212301 | SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND ELECTRONIC INSTRUMENT - A SAW resonator which, using a quartz crystal substrate with Euler angles (−1.5°≦φ≦1.5°, 117°≦θ≦142°, and 41.9°≦|ψ|≦49.57°), includes an IDT that excites a stop band upper end mode SAW, and an inter-electrode finger groove provided between electrode fingers configuring the IDT. When a wavelength of the SAW is λ, a first depth of the inter-electrode finger groove is G, a line occupation rate of the IDT is η, and an electrode film thickness of the IDT is H, λ, G, η and H satisfy the relationship of 0| 08-23-2012 | |
| 20120223784 | VIBRATOR ELEMENT, VIBRATOR, OSCILLATOR, AND ELECTRONIC APPARATUS - A quartz crystal vibrator element having the weight section is provided with the intermediate weight section formed to have an arm width W | 09-06-2012 |
| 20120229225 | PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS - A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included. | 09-13-2012 |
| 20120229226 | Micromechanical Resonator - The invention relates to a micromechanical resonator comprising a substrate ( | 09-13-2012 |
| 20120235761 | SURFACE MOUNTED CRYSTAL OSCILLATOR - A metal base having plural protrusions at its bottom is engaged with and placed on standing metal pins in plural through holes provided in a base board, and a circuit board is fitted to an upper end of the metal pins. A crystal resonator is arranged on the circuit board via a heater element, and the metal base is covered with a metal cover, thereby obtaining a sealed structure of the crystal resonator. A two-stage counterbored portion including a first-stage and a second-stage counterbored portions is formed in the bottom of the base board, and a solder or conductive resin is filled in a gap between the first-stage counterbored portion formed around the metal pin inserted into the through hole, and the through hole and the metal pin to fix the metal pin in the though hole. Slits penetrating through the base board are formed around the metal pin. | 09-20-2012 |
| 20120235762 | PIEZOELECTRIC VIBRATION ELEMENT, PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC OSCILLATOR, AND ELECTRONIC DEVICE - A piezoelectric vibration element includes: a piezoelectric substrate; excitation electrodes that are arranged so as to face each other on both principal faces of the piezoelectric substrate; drawn-out electrodes; and pads. The piezoelectric substrate includes an excitation portion that is located at the center and a peripheral portion that is thin-walled to be thinner than the thickness of the excitation portion and is disposed on a peripheral edge thereof. The pads have support areas that fix the piezoelectric substrate to a support member at positions of the piezoelectric substrate corresponding to corner portions. The excitation electrodes are formed over the excitation portion and a vibration area that is at least a part of the peripheral portion. | 09-20-2012 |
| 20120242420 | RESONANT FREQUENCY ADJUSTABLE OSCILLATION CIRCUIT - An oscillation circuit includes a parallel resonant quartz crystal oscillator and a variable capacitor which are connected with each other in parallel. In addition, the oscillation circuit can further include a first variable resistor and a second variable resistor. The first resistor is connected to the quartz crystal oscillator in parallel. The second resistor is connected to the variable capacitor in series first and then connected to the quartz crystal oscillator in parallel. | 09-27-2012 |
| 20120249255 | CRYSTAL DEVICE AND MANUFACTURING METHOD THEREOF - A crystal device includes; a base, a framed crystal vibrating blank in which a mesa section is formed on an upper face end bonded to a seal path on an upper surface of the base via a low melting point glass layer or a resin adhesive layer, and a lid bonded to a seal path on an upper surface of the framed crystal vibrating blank via a low melting point glass layer or a resin adhesive layer. A pillow made of low melting point glass or a resin adhesive that suppresses vibration amplitude at the time of a drop impact of the framed crystal vibrating blank is formed on a rear surface of the lid simultaneously with the low melting point glass layer or the resin adhesive layer. | 10-04-2012 |
| 20120313721 | ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE SEALING MEMBER - An electronic component package sealing member that can be used as a first sealing member in an electronic component package in which an electrode of an electronic component element is hermetically sealed with the first sealing member and a second sealing member arranged so as to oppose each other, includes: a through hole that passes through a substrate of the electronic component package sealing member; an internal electrode that is formed on a face of the substrate opposing the second sealing member; an external electrode that is formed on a face of the substrate opposite the opposing face; and a through electrode that is formed on an inner side face of the through hole electrically connecting the internal electrode and the external electrode. In the electronic component package sealing member, at least one open face of the through hole is sealed with a resin material. | 12-13-2012 |
| 20120319792 | PIEZOELECTRIC DEVICE AND FABRICATING METHOD THEREOF - A piezoelectric device and a fabricating method thereof are provided. Variation of output frequency is suppressed by forming an organic resin to protect an IC chip that is mounted in a cavity of a container body, and damage that may occur to the IC chip during the mounting process is prevented. The piezoelectric device includes a container body, a crystal resonator, an IC chip and a cover body. A surface of the IC chip, which is a mounting surface for mounting to the container body, has bumps thereon for connecting to terminal pads of a circuit wiring pattern configured on a bottom surface of a bottom cavity of the container body, and the other surface of the IC chip has an insulating protective sheet adhered and fixed thereon. | 12-20-2012 |
| 20130002365 | METHOD OF REGULATING A TIMEOUT DELAY INTRODUCED AT START-UP OF A DIGITAL SYSTEM TO ENSURE READINESS OF A MASTER AMPLITUDE-REGULATED CRYSTAL OSCILLATOR AND IMPLEMENTING CIRCUIT - A crystal oscillator circuit is configured to output an oscillation signal. A bias circuit responds to control signal to generate a bias current for application to the crystal oscillator circuit. A current generator generates a sense current from the control signal. The sense current is compared to a reference current by a comparator circuit. The comparator circuit generates a ready signal in response to the comparison. The ready signal is indicative of whether the oscillation signal output from the crystal oscillator circuit is ready for use by other circuitry. The reference current may be generated by a circuit which replicates the bias circuit. | 01-03-2013 |
| 20130021110 | SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND SURFACE ACOUSTIC WAVE MODULE UNIT - It is possible to reduce the size of a surface acoustic wave resonator by enhancing the Q value. In a surface acoustic wave resonator in which an IDT having electrode fingers for exciting surface acoustic waves is formed on a crystal substrate, a line occupying ratio is defined as a value obtained by dividing the width of one electrode finger by the distance between the center lines of the gaps between one electrode finger and the electrode fingers adjacent to both sides thereof, and the IDT includes a region formed by gradually changing the line occupying ratio from the center to both edges so that the frequency gradually becomes lower from the center to both edges than the frequency at the center of the IDT. | 01-24-2013 |
| 20130027147 | SURFACE ACOUSTIC WAVE RESONATOR AND SURFACE ACOUSTIC WAVE OSCILLATOR - A surface acoustic wave resonator includes: an IDT which is disposed on a quartz crystal substrate with an Euler angle of (−1.5°≦φ≦1.5°, 117°≦θ≦142°, 41.9°≦|ψ|≦49.57°) and which excites a surface acoustic wave in an upper mode of a stop band; and an inter-electrode-finger groove formed by recessing the quartz crystal substrate between electrode fingers of the IDT, wherein the following expression: | 01-31-2013 |
| 20130038400 | TEMPERATURE-COMPENSATED CRYSTAL OSCILLATOR - A temperature-compensated crystal oscillator includes a crystal resonator; and an oscillator circuit for performing temperature compensation. The oscillator circuit has a temperature sensor unit that measures an ambient temperature of the crystal resonator, a temperature compensation unit that outputs a first voltage for temperature compensation based on the measured temperature, a high-temperature load capacitance adjustment unit that outputs a second voltage for temperature compensation based on the temperature measured in a high temperature area exceeding a particular temperature range, an oscillator unit having first and second variable capacitance elements used for temperature compensation within a particular temperature range, third and fourth variable capacitance elements used for temperature compensation in the high temperature area, and an oscillation integrated circuit (IC) connected to the crystal resonator to perform an oscillation operation, and a buffer that amplifies the output from the oscillator unit. | 02-14-2013 |
| 20130043959 | RESONATING ELEMENT, RESONATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOBILE OBJECT - A piezoelectric resonating element includes a piezoelectric substrate that includes a rectangular vibrating section and a thick section integrally formed with the vibrating section, excitation electrodes, and lead electrodes. The thick section includes a first thick section and a second thick section of which one end is formed continuous to the first thick section. The first thick section includes a first inclined section of which the thickness changes and a first thick section main body of a quadrangle column shape, and at least one slit is provided in the first thick section. | 02-21-2013 |
| 20130043960 | RESONATING ELEMENT, RESONATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING VEHICLE, AND METHOD OF MANUFACTURING RESONATING ELEMENT - A piezoelectric resonating element includes a piezoelectric substrate having a rectangular vibrating portion and a thick-walled portion, excitation electrodes and, and lead electrodes. The thick-walled portion includes a fourth thick-walled portion, a third thick-walled portion, a first thick-walled portion, and a second thick-walled portion. The third thick-walled portion includes a third slope portion and a third thick-walled body, and at least one slit is formed in the third thick-walled portion. | 02-21-2013 |
| 20130057355 | PIEZOELECTRIC VIBRATION DEVICE AND OSCILLATOR - A piezoelectric vibration device is provided that can reduce the stress and strain that transmit through a base substrate. The piezoelectric vibration device includes a piezoelectric vibrating reed that oscillates in an AT mode, and that includes excitation electrodes respectively formed on the front and back surfaces of the reed. One of the excitation electrodes is connected to the base substrate via a metal bump on a center line passing across the shorter sides of the piezoelectric vibrating reed and in the vicinity of one of the shorter sides of the piezoelectric vibrating reed. The other excitation electrode is connected to the base substrate via a metal bump on the same side as the above shorter side, and in the vicinity of a portion where the shorter side of the piezoelectric vibrating reed crosses one of the longer sides of the piezoelectric vibrating reed. | 03-07-2013 |
| 20130076452 | OSCILLATOR CIRCUIT, OSCILLATOR, ELECTRONIC APPARATUS, AND ACTIVATION METHOD OF OSCILLATOR CIRCUIT - An oscillator circuit includes a resonator (SAW resonator), an amplifier circuit, and a switching element (NMOS switch). The amplifier circuit has a feedback path from one end to the other end of the resonator, a first inductance element (elongated coil) provided in the feedback path, and a variable capacitance element (variable capacitance diode) provided in the feedback path in series with the first inductance element. The switching element is provided in parallel to a circuit part including the first inductance element and the variable capacitance element. | 03-28-2013 |
| 20130082791 | OSCILLATION DEVICE - There are disclosed a constant voltage circuit which can realize a low consumption current, and a crystal oscillation circuit using the constant voltage circuit. When the constant voltage circuit is provided with a temperature characteristic regulation element, it is possible to minimize a difference between a negative tilt of a constant voltage to a temperature change and a negative tilt of the smallest operation voltage that can oscillate in the crystal oscillation circuit to the temperature change, so that the consumption current of the crystal oscillation circuit can be decreased. Furthermore, when a constant current generated by the constant voltage circuit is decreased, the consumption current of the constant voltage circuit can be decreased, and the consumption current of the whole oscillation device can be decreased. | 04-04-2013 |
| 20130082792 | PIEZOELECTRIC VIBRATION REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC INSTRUMENT, AND RADIO TIMEPIECE - A piezoelectric vibration reed includes a pair of vibrating arm portions arranged in parallel to each other and a base portion. The base portion is integrally coupled to proximal ends of the pair of the vibrating arm portions in a longitudinal direction that the vibrating arm portions extend. The base portion includes a connecting portion, a mount portion, and a narrow portion between the connecting portion and the mount portion. The base portion further includes a pair of notched portions notched respectively inwardly from both sides of the base portion in the width direction and ribs projecting outwardly in the width direction of the base portion and arranged in the interiors of the notched portions. | 04-04-2013 |
| 20130141179 | OSCILLATING DEVICE FOR FREQUENCY DETECTION, ULTRASONIC TRANSCEIVER SYSTEM AND FREQUENCY DETECTION METHOD THEREOF - The present invention discloses an oscillating device for frequency detection, an ultrasonic transceiver system and a frequency detection method thereof. The oscillating device for frequency detection, which is applicable for detecting a transducer having a lowest impedance frequency and a highest impedance frequency, comprises an oscillating circuit. The oscillating circuit has a loop gain whose maximum value occurs at the lowest impedance frequency of the transducer and whose minimum value occurs at the highest impedance frequency of the transducer, wherein a difference of a phase of the loop gain and an impedance phase of the transducer is zero between the lowest impedance frequency and the highest impedance frequency, and the loop gain is of a value greater than 1 at a frequency where the phase difference is zero. | 06-06-2013 |
| 20130187723 | PIEZOELECTRIC MODULE - A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package. The plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by metal bonding. The whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of the thermoset resin that constitutes the thermoset resin with solder particles. | 07-25-2013 |
| 20130187724 | Micromechanical resonator and method for manufacturing thereof - The invention relates to a temperature compensated micromechanical resonator and method of manufacturing thereof. The resonator comprises a resonator element comprising a semiconductor crystal structure, which is doped so as to reduce its temperature coefficient of frequency, transducer means for exciting to the resonator element a vibrational mode. According to the invention the crystal orientation and shape of the resonator element are chosen to allow for a shear mode having a saddle point to be excited to the resonator element, and said transducer means are adapted to excite said shear mode to the resonator element. Accurate micromechanical resonators with now temperature drift can be achieved by means of the invention. | 07-25-2013 |
| 20130194049 | VIBRATOR ELEMENT, VIBRATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A vibrator element includes: a base having a mounting surface; a vibrating arm which is extended from the base and has a first surface and a second surface that faces the first surface and is positioned on the mounting surface side, and which performs flexural vibration in a direction normal to the first and second surfaces; and a laminated structure which is provided on at least one of the first and second surfaces of the vibrating arm, and which includes at least a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes, in which the vibrating arm is warped toward the mounting surface side. | 08-01-2013 |
| 20130207735 | VIBRATING DEVICE AND OSCILLATOR - The vibrating device of the invention includes a base member, a lid member joined the base member to constitute a cavity, and a vibrating strip housed in the cavity. The vibrating strip includes a thick center portion and a thin outer peripheral portion, the center portion includes an exciting electrode exciting vibration, and the outer peripheral portion includes terminal electrode electrically connected to exciting electrode and having a thickness larger than that of the exciting electrode. The base member is provided with a connecting portion on the surface thereof, and the connecting portion is connected to the terminal electrode and holds the vibrating strip in a cantilevered manner. Accordingly, the vibrating strip is supported by a very small bonding surface, and a compact vibrating device subjected to little deterioration in frequency characteristics with respect to the temperature change is realized. | 08-15-2013 |
| 20130257553 | RESONATOR ELEMENT, RESONATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOBILE OBJECT - A resonator element includes a substrate including a first principal surface and a second principal surface respectively forming an obverse surface and a reverse surface of the substrate, and vibrating in a thickness-shear vibration mode, a first excitation electrode disposed on the first principal surface, and a second excitation electrode disposed on the second principal surface, and being larger than the first excitation electrode in a plan view, the first excitation electrode is disposed so as to fit into an outer edge of the second excitation electrode in the plan view, and the energy trap confficient M fulfills 15.5≦M≦36.7. | 10-03-2013 |
| 20130257554 | RESONATOR ELEMENT, RESONATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOBILE OBJECT - A resonator element includes a substrate vibrating in a thickness-shear vibration mode, a first excitation electrode disposed on one principal surface of the substrate, and has a shape obtained by cutting out four corners of a quadrangle, and a second excitation electrode disposed on the other principal surface of the substrate, and a ratio (S | 10-03-2013 |
| 20130257555 | PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS - A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included. | 10-03-2013 |
| 20130265116 | SIGNAL GENERATING CIRCUIT FOR REAL TIME CLOCK DEVICE AND METHOD THEREOF - A signal generating circuit for a real time clock device is disclosed, having an oscillating circuit, a voltage detecting circuit, and a control circuit. The oscillating circuit is used for generating oscillating signals. The voltage detecting circuit is used for detecting a voltage level coupled with the signal generating circuit. The control circuit is coupled with the oscillating circuit and the voltage detecting circuit. When the voltage level detected by the voltage detecting circuit locates in a predetermined range, the control circuit configures the oscillating circuit to generate the oscillating signals with a larger current at a first interval and to generate the oscillating signals with a smaller current at a second interval. The control circuit further generates a clock signal according to the oscillating signals at a third interval. | 10-10-2013 |
| 20130335157 | RESONATING ELEMENT, RESONATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING BODY - A resonating element includes a resonator element that includes a vibrating portion and an excitation electrode provided on both main surfaces of the vibrating portion, an intermediate substrate in which the resonator element is mounted so as to be spaced from the excitation electrode, and a spiral electrode pattern that is provided on at least one main surface of the intermediate substrate, in which the electrode pattern is electrically connected to the excitation electrode. | 12-19-2013 |
| 20140015618 | PIEZOELECTRIC DEVICE WITH A PACKAGE INCLUDING A CONVEX PART - A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view. | 01-16-2014 |
| 20140035689 | SEMICONDUCTOR DEVICE AND CONTROL METHOD THEREOF - The present invention provides a semiconductor device including a first terminal and a second terminal respectively coupled to both ends of a crystal resonator, an inverter circuit having an input coupled to the first terminal and an output coupled to the second terminal, a feedback resistor which couples between the first terminal and the second terminal, a variable capacitor coupled to at least one of the first and second terminals, and a control circuit. The control circuit performs control to increase both of the drive capability of the inverter circuit and the capacitance value of the variable capacitor in a second mode rather than a first mode. | 02-06-2014 |
| 20140104011 | PIEZOELECTRIC OSCILLATOR - Provided is a piezoelectric oscillator to attain high-frequency performance and frequency stabilization with the use of reflection characteristics of a reflective element. A piezoelectric oscillator is configured such that a resonant circuit is connected to a gate of a field effect transistor; an output terminal is connected to a drain and a power supply voltage V is applied to the drain; a piezoelectric resonator is connected to a source, as a reflective element; and a resonance frequency of the resonant circuit and an oscillation frequency of the piezoelectric resonator as a reflective element are set to substantially the same frequency, and further, the piezoelectric oscillator may be configured such that a first matching circuit is provided between the resonant circuit and the gate, second matching circuit is provided between the drain and the output terminal, and a third matching circuit is provided between the source and the reflective element. | 04-17-2014 |
| 20140167869 | Apparatus to Provide A Time Reference - Apparatus to provide a time reference are disclosed herein. An example apparatus disclosed herein includes a resonator. A first cap is coupled to a first side of the resonator to define a first cavity, and a second cap is coupled to a second side of the resonator to define a second cavity. The first cavity and the second cavity provide a first vacuum in which the resonator is to resonate. The resonator, the first cap and the second cap have substantially identical thermal expansion coefficients. The example apparatus also includes a vacuum chamber surrounding the resonator, the first cap and the second cap. The vacuum chamber is to provide a second vacuum in which the resonator, the first cap and the second cap are disposed. A frequency of resonance of the resonator in the first vacuum is to provide a time reference. | 06-19-2014 |
| 20140167870 | RESONATOR ELEMENT, RESONATOR, OSCILLATOR, ELECTRONIC DEVICE, AND MOVING OBJECT - A quartz crystal resonator element includes: a base portion and a pair of vibrating arms which extend from a first end portion of the base portion along a Y-axis direction. The base portion includes a second end portion provided on the opposite side to a first end portion in the Y-axis direction. The base portion is provided with a protrusion in at least one of a third end portion and a fourth end portion which respectively connect both ends of the first end portion and both ends of the second end portion. | 06-19-2014 |
| 20140210565 | AMPLITUDE LOOP CONTROL FOR OSCILLATORS - Systems and methods for amplitude loop control for oscillators. In some embodiments, an electronic circuit may include oscillator circuitry configured to produce a periodic signal, and control circuitry operably coupled to the oscillator circuitry, the control circuitry including switched capacitor circuitry configured to determine a difference between maximum and minimum peak voltage values of the periodic signal, the control circuit configured to control a voltage amplitude of the periodic signal based upon the difference. In other embodiments, a method may include receiving a clock signal from a clock generator, determining, using a switched capacitor circuit, a first peak voltage value of the clock signal, determining, using the switched capacitor circuit, a second peak voltage value of the clock signal, and controlling a bias current applied to the clock generator based upon a difference between the first and second peak voltage values. | 07-31-2014 |
| 20140210566 | CRYSTAL RESONATOR, CRYSTAL RESONATOR PACKAGE, AND CRYSTAL OSCILLATOR - A crystal resonator includes a crystal element and excitation electrodes. The crystal element includes an α crystal region and a β crystal region that have mutually different positive/negative directions along an X-axis. Each two or more of the α crystal regions and the β crystal regions are alternately formed along a direction perpendicular to the X-axis. The excitation electrodes are formed on both surfaces of the respective α crystal region and β crystal region other than crystal regions positioned at both end portions of a row of the α crystal regions and the β crystal regions. | 07-31-2014 |
| 20140210567 | CRYSTAL RESONATOR, CRYSTAL RESONATOR PACKAGE, AND OSCILLATOR - A crystal resonator includes a plate-shaped crystal element, excitation electrodes, and a second crystal region. The plate-shaped crystal element is supported to a supporting portion. The crystal element is configured to vibrate at a thickness shear vibration. The excitation electrodes are disposed at both surfaces of a first crystal region of the crystal element. The second crystal region is positioned outside with respect to the excitation electrodes. The second crystal region is formed at a peripheral edge portion of the crystal element so as to occupy a region of equal to or more than 75% of a whole circumference of the crystal element. The second crystal region has a positive/negative direction of an X-axis of a crystal different from a positive/negative direction of an X-axis of a crystal of the first crystal region. | 07-31-2014 |
| 20140266485 | RESONATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A resonator includes a resonator element, which includes a quartz crystal substrate formed of crystal, and a package in which the resonator element is housed. The quartz crystal substrate includes a base portion and two vibrating arms that are aligned in the X-axis direction of the crystal and extend from the base portion in the +Y′-axis direction (or the −Y′-axis direction) of the quartz crystal. The principal surface of the base portion on the −Z′-axis side (+Z′-axis side when the vibrating arms extend in the −Y′-axis direction) in the quartz crystal is fixed to the package. | 09-18-2014 |
| 20140285275 | OSCILLATOR - An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder. | 09-25-2014 |
| 20140292434 | VIBRATION ELEMENT, VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along another first outer edge. An inclined outer edge section that intersects with each of an X axis and a Z′ axis is provided in a tip section of the piezoelectric substrate. | 10-02-2014 |
| 20140292435 | RESONATOR ELEMENT, RESONATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A resonator includes a resonator element including a base section, vibrating arms extending from the base section, and a support arm disposed between the vibrating arms, a package adapted to support the resonator element, and electrically-conductive adhesives adapted to fix the support arm to the package, the support arm includes a tip portion and a width-decreasing portion having a width smaller than the width of the tip portion, and the electrically-conductive adhesive has contact with at least a part of the width-decreasing portion in a planar view. | 10-02-2014 |
| 20140292436 | VIBRATION ELEMENT, VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge thereof, and a third thick section provided along a third outer edge thereof. When a maximum size of the second thick section in the vibration direction is Lmax and a minimum size thereof is Lmin, an average size expressed by (Lmax+Lmin)/2 is 100 μm or smaller. | 10-02-2014 |
| 20140292437 | RESONATOR ELEMENT, RESONATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A resonator element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along a third outer edge. A first inclined outer edge section that is inclined with respect to both of an X axis direction and a Z′ axis direction is provided in a corner section of the piezoelectric substrate where the second thick section and the third thick section are connected to each other. | 10-02-2014 |
| 20140320225 | BONDING TYPE CRYSTAL CONTROLLED OSCILLATOR - A bonding type crystal controlled oscillator includes a crystal package and a circuit package bonded by two-tier bonding. An anisotropy conductive adhesive is interposed between back surface of the crystal package facing the circuit package and an upper surface of the circuit package facing the crystal package. The anisotropy conductive adhesive includes a thermosetting resin containing solder micro particles dispersed in the thermosetting resin. Assuming that a thickness of the output terminal formed at the crystal package is C μm, a thickness of the external terminal formed at the circuit package is D μm, and an average outside diameter of the solder micro particles dispersed in the anisotropy conductive adhesive is E μm the dimensional relation is set to (C+D)>E. | 10-30-2014 |
| 20140340163 | OSCILLATOR DEVICE AND METHOD OF MOUNTING OSCILLATOR DEVICE - A oscillator device includes: a first substrate that has a first surface, a second surface, and a through hole extending between the first surface and the second surface; a crystal oscillator that is disposed on the first surface of the first substrate, the crystal oscillator including an electrode; a second substrate that is disposed on the crystal oscillator; a through electrode that is disposed in the through hole, that has a diameter smaller than a diameter of the through hole, that is electrically coupled to the electrode, and that extends between the first surface and the second surface; and a filling member with which an area between an inner wall of the through hole and the through electrode is filled. | 11-20-2014 |
| 20150015341 | SURFACE MOUNT TYPE PIEZOELECTRIC OSCILLATOR - A piezoelectric oscillator has an insulating base having a housing portion where internal terminal pads are formed, an integrated circuit (IC) element having rectangular pads bonded to the internal terminal (IT) pads, and a piezoelectric oscillation element (POE) connected to the base and IC element. The IT pads include two opposing first IT pads connected to the POE, two opposing second IT pads, one of which is for AC output, and two opposing third IT pads formed between the first IT pads and the second IT pads. Along a part of perimeter of the first IT pads, the third IT pads and wiring patterns which respectively extend the third IT pads are formed as conductive paths for blocking radiation noise. The first IT pads and the second IT pads are spaced apart with the conductive paths interposed therebetween. | 01-15-2015 |
| 20150022275 | VIBRATOR ELEMENT, VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A vibrator element includes a base portion, a vibrating arm extending from the base portion, a first electrode provided on the vibrating arm, a second electrode provided above the first electrode, a piezoelectric body arranged between the first electrode and the second electrode, and an insulating film arranged between the first electrode and the piezoelectric body, in which the material of the first electrode contains TiN, the material of the insulating film contains SiO | 01-22-2015 |
| 20150022276 | RESONATOR ELEMENT, RESONATOR, OSCILLATOR, ELECTRONIC DEVICE, AND MOVING OBJECT - A resonator element is provided. A base portion includes a first base portion, a second base portion, and a connecting portion. The base portion includes a width-decreasing portion that is provided at an end of the connecting portion on the first base portion side and that has a width along an X-axis direction which continuously decreases toward the second base portion. An outer edge of the width-decreasing portion and an outer edge of the connecting portion form a continuous line that does not include a corner portion, when seen in a plan view. When an angle between a tangent of a portion of the curved line on the first base portion side and a segment parallel to the X-axis direction is set to θ, a relation of 0°<θ<90° is satisfied. | 01-22-2015 |
| 20150028959 | RESONATING ELEMENT, RESONATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOBILE OBJECT - A resonating element has a quartz crystal substrate having a vibrating portion and a thin-walled portion that is thinner than the vibrating portion, and a pair of excitation electrodes respectively disposed on opposite surfaces of the vibrating portion. Moreover, in the excitation electrode, each of a pair of sides arranged in a Z′-axis direction is convexly curved toward the center so that the excitation electrode has a constricted portion in which a length in the Z′-axis direction increases gradually from a central portion toward both ends in an X-axis direction. | 01-29-2015 |
| 20150042410 | CONTROL METHOD FOR OSCILLATION CIRCUIT, CIRCUIT FOR OSCILLATION, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - An oscillation circuit includes a temperature compensating section to which electric power is supplied from a main power supply and a backup power supply, an oscillating section, a function of which is compensated by a signal from the temperature compensating section, and a switch and a power-supply monitoring circuit configured to select, when the temperature compensating section is not operating, at least one of the main power supply and the backup power supply and control connection to the temperature compensating section. | 02-12-2015 |
| 20150084710 | RESONATING ELEMENT, RESONATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING BODY - A resonating element includes a resonator element that includes a vibrating portion and an excitation electrode provided on both main surfaces of the vibrating portion, an intermediate substrate in which the resonator element is mounted so as to be spaced from the excitation electrode, and a spiral electrode pattern that is provided on at least one main surface of the intermediate substrate, in which the electrode pattern is electrically connected to the excitation electrode. | 03-26-2015 |
| 20150091664 | CIRCUIT DEVICE, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A circuit device includes an oscillation circuit that includes a variable capacitance circuit and performs an operation of oscillating an oscillation element; and a control unit. The variable capacitance circuit includes a plurality of variable capacitance elements. When an operation mode is a first operation mode, the control unit supplies applied voltages in which at least one thereof is a variable voltage to the plurality of variable capacitance elements, and when the operation mode is a second operation mode, the control unit supplies applied voltages which are all fixed voltages to the plurality of variable capacitance elements. | 04-02-2015 |
| 20150091665 | RESONATOR ELEMENT, RESONATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - A resonator element includes a substrate that vibrates in a thickness shear vibration, a first excitation electrode that is provided on one main surface of the substrate and has a shape in which at least three corners of a virtual quadrangle are cut out, and a second excitation electrode that is provided on the other main surface of the substrate, and a ratio (S2/S1) of an area S1 of the virtual quadrangle and an area S2 of the first excitation electrode satisfies a relationship of 69.2%≦(S2/S1)≦80.1%. | 04-02-2015 |
| 20150116051 | ULTRA LOW-POWER HIGH FREQUENCY CRYSTAL OSCILLATOR FOR REAL TIME CLOCK APPLICATIONS - An oscillator circuit may selectively switch between a normal mode and a low-power mode in response to a mode signal. During the normal mode, the oscillator circuit may employ a first amplifier configuration and a first capacitive loading to generate a high-accuracy clock signal having a relatively low frequency error. During the low power mode, the oscillator circuit may employ a second amplifier configuration and a second capacitive loading to generate a low-power clock signal using minimal power consumption. A compensation circuit may be used to offset a relatively high frequency error during the low-power mode. | 04-30-2015 |
| 20150116052 | PACKAGE, RESONATION DEVICE, OSCILLATOR, ELECTRONIC DEVICE, AND MOVING OBJECT - A quartz crystal resonator includes a quartz crystal resonator element, a thermistor, a second layer including a first principal surface and a second principal surface, and a third layer having a through hole. internal terminals are provided on the first principal surface side, and electrode pads are provided in a portion exposed from the through hole on the second principal surface side. The quartz crystal resonator element is attached to the internal terminals, and the thermistor is attached to the electrode pads. Two mounting terminals are provided on a first diagonal line on the third principal surface side of the third layer, and two mounting terminals are provided on a second diagonal line. At least one of the two electrode pads is connected to any one of the two mounting terminals on the second diagonal line through a first conductive film provided on an inner wall of the through hole. | 04-30-2015 |
| 20150123742 | RESONATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A resonator includes: a package; a support section that is provided on a surface of the package; and a vibration element in which an attachment section, which is disposed between an outer edge of a vibration substrate, in which excitation electrodes are provided on main surfaces thereof, and an outer edge of the excitation electrode, is attached to the support section through a conductive adhesive. The attachment section is disposed in a region S obtained by rotating a virtual line which connects the center of the vibration element and one end of the vibration element, in a range of −35° to +35° of a rotation angle θ about the center, and an attachment area becomes 0.7 mm | 05-07-2015 |
| 20150137903 | SURFACE ACOUSTIC WAVE DEVICE AND OSCILLATOR CIRCUIT - A surface acoustic wave device includes a quartz substrate and a periodic structure portion. The quartz substrate is constituted such that a surface acoustic wave is to propagate on a surface with an Euler angle of (0°, 16°<θ≦18.5°, 0°). The periodic structure portion is disposed on the quartz substrate and includes a plurality of electrodes extending in a direction intersecting with a direction of the propagation of the surface acoustic wave. The electrodes are disposed in parallel to one another along the propagation direction. The periodic structure portion is constituted to mainly contain aluminum. When a width dimension of the electrode in the propagation direction and a separation dimension between the electrodes adjacent to one another are respectively defined as L and S, a metallization ratio η (η=L÷(L+S)) is set to 0.4 or less. | 05-21-2015 |
| 20150145613 | PIEZOELECTRIC OSCILLATOR - A piezoelectric oscillator includes a piezoelectric vibrating piece, an integrated circuit, and a package. The package includes a first layer, a second layer, a third layer, and a fourth layer. The ceiling surface as a portion of the inferior surface of the third layer has a rectangular shape surrounded by short sides and long sides. The ceiling surface includes a pair of frequency checking terminals electrically connected to the connecting electrodes and control terminals to control the integrated circuit. The pair of the frequency checking terminal are adjacent to one another. The respective frequency checking terminals are disposed in contact with any of the long sides and one of the short sides. The control terminals are extracted to the top surface of the third layer, and overlap the frequency checking terminals in a vertical direction on the top surface of the third layer to be connected to the mounting terminals. | 05-28-2015 |
| 20150295580 | OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A temperature-compensated piezoelectric oscillator as an oscillator includes a piezoelectric resonator incorporating a resonator element, an electronic component (IC) as a circuit element having a function of driving the resonator element and a thermosensor, and a wiring board provided with a conductor film, and the piezoelectric resonator element and the electronic component (IC) are disposed side by side in an area where the conductor film is disposed. | 10-15-2015 |
| 20150326209 | SEMICONDUCTOR DEVICE AND CONTROL METHOD THEREOF - The present invention provides a semiconductor device including a first terminal and a second terminal respectively coupled to both ends of a crystal resonator, an inverter circuit having an input coupled to the first terminal and an output coupled to the second terminal, a feedback resistor which couples between the first terminal and the second terminal, a variable capacitor coupled to at least one of the first and second terminals, and a control circuit. The control circuit performs control to increase both of the drive capability of the inverter circuit and the capacitance value of the variable capacitor in a second mode rather than a first mode. | 11-12-2015 |
| 20160020748 | VIBRATION ELEMENT, VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A vibration element includes a substrate having first and second principal surfaces, a first excitation electrode on the first principal surface, a second excitation electrode on the second principal surface, and a first extraction electrode on the first principal surface, and connected to the first excitation electrode. The first extraction electrode includes a first electrode section, and a second electrode section extending from the first electrode section in a first direction and connected to the first excitation electrode. The second electrode section is narrower in a second direction than the first electrode section. When an area of the first excitation electrode is S1, and an area of an overlapping part where the second electrode section overlaps the second excitation electrode is S2, (S2/S1)≦0.1. | 01-21-2016 |
| 20160028348 | CRYSTAL DEVICE - A crystal device having electrode lands on a principal surface of a first package member, a crystal oscillator bonded to and held by the electrode lands, a second package member bonded to the principal surface of the first package member by an adhesive layer, a glass layer provided on the principal surface of the first package member, and the glass layer having adhesive spread preventing parts and an extended portion. The adhesive spread preventing parts prevent the adhesive of the adhesive layer from spreading out. The extended portion is extended to reach the lower surfaces of the electrode lands. | 01-28-2016 |
| 20160028369 | RESONATOR ELEMENT, RESONATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOBILE OBJECT - A resonator element includes a substrate region sandwiched by first and second excitation electrodes. The region is located within a quadrangle having four 90° corners, a pair of first sides along a thickness-shear vibration direction, and a pair of second sides perpendicular to the vibration direction. The region includes a side or a circular arc in contact with each of the first and second sides, and an outer edge recessed from at least two corners of the quadrangle in a direction intersecting the vibration direction. Further, assuming a maximum length of the region along the vibration direction is Lx, and a length of the outer edge along the vibration direction is lx, 13.7%≦(lx/Lx)≦46.0%. | 01-28-2016 |
| 20160029484 | Electronic Component, Manufacturing Method for Electronic Component, Electronic Apparatus, and Moving Object - In order to prevent deformation or damage of a base of a lead terminal by alleviating stress which concentrates on the base of the lead terminal protruding from an electronic component main body, the lead terminal includes a connection pad connected to a connection terminal provided on a first substrate, and a lead portion extending from the connection pad, and the lead terminal also includes a first surface connected to the connection terminal, a second surface that is a rear surface thereof, and a third surface that is a side surface, and in which the lead portion includes a first bent section and a third bent section that are bent in a direction intersecting the first surface or the second surface, a second bent section that is bent in a direction intersecting the third surface between the first bent section and the third bent section. | 01-28-2016 |
| 20160036413 | RESONATOR ELEMENT, RESONATOR, RESONATOR DEVICE, OSCILLATOR, ELECTRONIC DEVICE, AND MOBILE OBJECT - A resonator element includes a quartz crystal substrate having a main surface along a plane including an X-axis and a Z′-axis, and a thickness in a Y′-axis direction. The quartz crystal substrate includes a vibrating portion including a side along the X-axis, a side along the Z′-axis, and a peripheral portion having a thickness smaller than that of the vibrating portion, which is provided along an outer edge of the vibrating portion. The vibrating portion includes a first portion and a second portion having a thickness smaller than that of the first portion, which is provided on at least an outer edge on a +X side of the X-axis and an outer edge on a −X side thereof, among outer edges of the first portion. When Z is a length of the quartz crystal substrate along the Z′-axis, and t is a thickness of the first portion, 11| 02-04-2016 | |
| 20160065170 | ELECTRONIC COMPONENT, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - An electronic component includes: an oscillation circuit that is electrically connected to a resonator element; and a substrate that includes a first surface on which the oscillation circuit and wiring that is electrically connected with the resonator element and the oscillation circuit to form an oscillation loop are disposed, and a second surface opposite to the first surface. The substrate includes a conductor layer between the first surface and the second surface. The conductor layer overlaps the wiring in a plan view. A distance between the wiring and the conductor layer in a thickness direction as a direction along a direction intersecting the first surface and the second surface is from 0.35 mm to 0.7 mm. | 03-03-2016 |
| 20160099677 | CRYSTAL OSCILLATOR CIRCUIT WITH REDUCED STARTUP TIME - A crystal oscillator achieves fast start-up by injecting an in-band periodic signal into the crystal oscillator driver circuit. The in-band periodic signal has a frequency that is within a bandwidth of the crystal oscillator. Injection of the in-band periodic signal begins in response to a power-up condition and stops after a predetermined time period corresponding to the amount of time it takes to ensure the crystal driver is achieving full swing. | 04-07-2016 |
| 20160156312 | CRYSTAL OSCILLATOR PACKAGE | 06-02-2016 |
| 20160173058 | RESONATOR APPLICATIONS FOR LANGASITE AND ITS ISOMORPHS | 06-16-2016 |
| 20160181976 | CRYSTAL OSCILLATOR | 06-23-2016 |
| 20160197595 | RESONATION DEVICE, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT | 07-07-2016 |
| 20160254798 | ELECTRONIC COMPONENT, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT | 09-01-2016 |
| 20170237441 | Oscillator Circuit with Bias Current Generator | 08-17-2017 |
| 20220140785 | OSCILLATOR CIRCUIT, OSCILLATOR, AND METHOD FOR CONTROLLING OSCILLATOR CIRCUIT - An oscillator circuit includes an oscillating circuit coupled to a vibrator, and a control circuit that controls the oscillating circuit. The oscillator circuit has a normal operation mode in which the oscillating circuit oscillates in a state where a negative resistance value is a first value, and a start mode in which the oscillator circuit shifts from a state where oscillation is stopped to the normal operation mode. In the start mode, the control circuit controls the negative resistance value to increase from a second value which is smaller than the first value. | 05-05-2022 |
