Class / Patent application number | Description | Number of patent applications / Date published |
331070000 | WITH TEMPERATURE MODIFIER | 50 |
20080218279 | Crystal oscillator temperature control and compensation - Crystal oscillator control and calibration is disclosed. Temperature and frequency control circuits included on a printed circuit board (PCB) comprising a crystal oscillator are used to determine, for each of a plurality of set points in a range of sensed internal temperatures sensed by an internal temperature sensing circuit or device located adjacent to the oscillator in a thermally insulated region of the PCB, a corresponding compensation required to be applied to maintain a desired oscillator output frequency. The PCB is configured to use at least the determined compensation values and a sensed internal temperature to determine during operation of the PCB a compensation, if any, to be applied to maintain the desired oscillator output frequency. | 09-11-2008 |
20090051447 | Ovenized oscillator - An ovenized oscillator package including a ball grid array substrate seated on a circuit board, a heater and a temperature sensor mounted on the ball grid array substrate, and a crystal package mounted to the ball grid array substrate and overlying at least the heater. A layer of thermally conductive epoxy or adhesive material couples the heater to the crystal package. Stabilizer posts, which are made of an insulative adhesive or epoxy material, are formed between the ball grid array substrate and the circuit board for stabilizing and relieving the stress on the ball grid array substrate. A lid is seated on the circuit board and covers and defines an oven for the ball grid array substrate. | 02-26-2009 |
20090146746 | SELF-CALIBRATING TEMPERATURE-COMPENSATED OSCILLATOR - A self-calibrating temperature compensated oscillator includes a monolithic structure having a first resonator, a second resonator, and a heating element to heat the first and second resonators. The temperature coefficient of the second resonator is substantially greater than the temperature coefficient of the first resonator. A first oscillator circuit operates with the first resonator and outputs a first oscillator output signal having a first oscillating frequency. A second oscillator circuit operates with the second resonator and outputs a second oscillator output signal having a second oscillating frequency. A temperature determining circuit determines the temperature of the first resonator using the second oscillating frequency. A temperature compensator provides a control signal to the first oscillator in response to the determined temperature to adjust the first oscillating frequency and maintain it at a desired operating frequency. | 06-11-2009 |
20090219101 | Ovenized crystal oscillator assembly - An oscillator assembly including an oscillator seated on a pad of thermally conductive material formed on the surface of a printed circuit board and covered by a lid defining an oven for the oscillator. In one embodiment, a plurality of heaters are located on different sides of the oscillator and at least partially seated on the pad for evenly transferring heat to the pad and the oscillator. In one embodiment, the oscillator is a temperature compensated crystal oscillator and an integrated amplifier controller circuit on the printed circuit board integrates at least one operational amplifier for controlling the heater(s) and one or more transistors for providing heat to the oven. A canopy seated on the pad and covering the oscillator can be used for transferring heat more evenly to the oscillator. A cavity in the bottom of the printed circuit board defines an insulative air pocket. | 09-03-2009 |
20100085124 | Ovenized Crystal Oscillator Assembly - An oscillator assembly includes a substrate having a top surface, a bottom surface, and a plurality of side surfaces. At least one of the side surfaces has at least one castellation which is covered with conductive material and includes a lower end spaced from the bottom surface of the substrate. The space is defined by an elongate groove in the side surface which is devoid of conductive material and extends between the lower end of the castellation and the bottom surface of the substrate to eliminate the risk of a short circuit with any of the connection pads on a customers motherboard. The oscillator assembly further incorporates an oscillator circuit in which a current limiting resistor is located in series between the power supply and the heater control circuit. | 04-08-2010 |
20100085125 | CONSTANT-TEMPERATURE TYPE CRYSTAL OSCILLATOR - A constant-temperature type crystal oscillator includes: a crystal unit; an oscillator output circuit; a temperature control circuit; and a circuit substrate, on which circuit elements are installed. A principal surface of the crystal unit is installed so as to face one side board plane of the circuit substrate with interposing a first heat conducting resin, and the heating resistors are installed to be thermally coupled to the crystal unit via a second heat conducting resin. The principal surface of the crystal unit adheres to the one side board plane of the circuit substrate with interposing the first heat conducting resin. The heating resistors are installed on the one side board plane of the circuit substrate so as to sandwich the lead wires including a portion between the pair of lead wires of the crystal unit, and the heating resistors surround an outer circumference of the crystal unit. | 04-08-2010 |
20100225405 | OSCILLATOR DEVICE COMPRISING A THERMALLY-CONTROLLED PIEZOELECTRIC RESONATOR - The crystal oscillator device includes an air-tight case ( | 09-09-2010 |
20100289589 | Temperature controlled crystal oscillator - The present invention provides a temperature controlled oscillator capable of detecting the surrounding temperature at a high level of precision, and obtaining stable oscillating frequencies. The temperature controlled oscillator of the invention is provided with a circuit substrate having a crystal resonator, an oscillating circuit, and a temperature control circuit, arranged on one or both principal surfaces, and a container main body that accommodates the circuit substrate and has mount terminals on an outer bottom surface thereof. The temperature control circuit includes at least a first temperature sensor that detects an operating temperature of the crystal resonator, a second temperature sensor that detects a surrounding temperature of the container main body, and a heating resistor that applies heat to the crystal resonator, and lead wires extend from the circuit substrate and are connected electrically to the mount terminals. An insulation groove that passes through the circuit substrate in a thickness direction is formed between: a first lead wire closest to the second temperature sensor, and the second temperature sensor; and the heating resistor. | 11-18-2010 |
20110215877 | MEMS RESONATOR - A MEMS circuit comprises a MEMS device arrangement with temperature dependent output; a resistive heating circuit; and a feedback control system for controlling the resistive heating circuit to provide heating in order to maintain a MEMS device at a constant temperature. The heating is controlled in dependence on the ambient temperature, such that a MEMS device temperature is maintained at one of a plurality of temperatures in dependence on the ambient temperature. This provides power savings because the temperature to which the MEMS device is heated can be kept within a smaller margin of the ambient temperature. | 09-08-2011 |
20110260800 | DEVICES, SYSTEMS, AND METHODS FOR CONTROLLING THE TEMPERATURE OF RESONANT ELEMENTS - A thermoelectric device transfers heat away from or toward an object using the Peltier effect. In some embodiments, the length of at least one thermoelectric element is at least ten times greater than a combined average cross-sectional dimension, orthogonal to the length, of two thermoelectric elements. | 10-27-2011 |
20110273238 | OVEN CONTROLLED CRYSTAL OSCILLATOR - An oven controlled crystal oscillator includes a thermostatic bath, an inner circuit board, an outer circuit board, a heating element, and a temperature sensor. The inner circuit board is positioned inside the thermostatic bath and electrically connected with the outer circuit board via a pin, and the inner circuit board has a crystal oscillation circuit. The outer circuit board has a temperature control circuit and a power supply circuit electrically connecting with the temperature control circuit. The heating element and the temperature sensor electrically connect with the outer circuit board. A though slot is formed through the outer circuit board, and the thermostatic bath is inserted into the though slot. By inserting the thermostatic bath into the though slot of the outer circuit board, the height and the weight of the oven controlled crystal oscillator are reduced, the electric connection performance is enhanced, and thus the stability of the output frequency of the oven controlled crystal oscillator is improved. | 11-10-2011 |
20120013410 | METHODS AND APPARATUS FOR CALIBRATION AND TEMPERATURE COMPENSATION OF OSCILLATORS HAVING MECHANICAL RESONATORS - Methods and apparatus for calibration and temperature compensation of oscillators having mechanical resonators are described. The method(s) may involve measuring the frequency of the oscillator at multiple discrete temperatures and adjusting compensation circuitry of the oscillator at the various temperatures. The compensation circuitry may include multiple programmable elements which may independently adjust the frequency behavior of the oscillator at a respective temperature. Thus, adjustment of the frequency behavior of the oscillator at one temperature may not alter the frequency behavior at a second temperature. | 01-19-2012 |
20120075026 | PACKAGED DEVICE WITH ACOUSTIC RESONATOR AND ELECTRONIC CIRCUITRY AND METHOD OF MAKING THE SAME - A device includes: a base substrate having a bonding pad and a peripheral pad, the peripheral pad encompassing the bonding pad; an acoustic resonator on the base substrate; a cap substrate having a bonding pad seal and a peripheral pad seal, the bonding pad seal bonding around the perimeter of the bonding pad and the peripheral pad seal bonding with the peripheral pad to define a hermetically sealed volume between the cap substrate and the base substrate, the cap substrate having a through hole therein over the bonding pad providing access for a connection to the bonding pad; a low-resistivity material layer region disposed on a portion of a surface of the cap substrate disposed inside the hermetically sealed volume, the material layer region being isolated from the bonding pad seal; and electronic circuitry disposed in the material layer region and electrical connected with the acoustic resonator. | 03-29-2012 |
20120075027 | MEMS RESONATOR - A MEMS resonator comprises a resonator body ( | 03-29-2012 |
20120139648 | TEMPERATURE-CONTROLLED CRYSTAL OSCILLATING UNIT AND CRYSTAL OSCILLATOR - A temperature-controlled crystal oscillating unit and oscillator are provided, which can stabilize an output frequency thereof, have firmness against shock of falling etc., and are suitable for miniaturization and mass production. A crystal blank for the temperature-controlled crystal oscillating unit is formed by an inner region which is an oscillating plate; an outer region which surrounds the periphery of the inner region; and a connection portion which connects the inner region with the outer region. Electrodes are formed on two surfaces of the inner region, and a heater and a temperature sensor are disposed to surround the periphery of the electrode on one surface of the inner region where the electrode is formed thereon. The electrodes, the heater and the temperature sensor are respectively connected with terminals on the outer region by leads. A contact area between the temperature sensor and a crystal is increased. | 06-07-2012 |
20120161887 | Oven controlled crystal oscillator - The present invention relates to an oven controlled crystal oscillator that can obtain stable oscillation frequency by reducing a temperature change in an oscillation element. The oven controlled crystal oscillator comprises; a heat-conducting plate mounted on one surface of a circuit board, a crystal resonator mounted on a surface of the heat-conducting plate opposite to the surface of the circuit board, an oscillation element constituting an oscillation circuit together with the crystal resonator, and a thermistor that detects temperature of the crystal resonator, a heating resistance which heats the crystal resonator, and a temperature control element including at least a power transistor, to constitute a temperature control circuit together with the thermistor and the heating resistance. In the oven controlled crystal oscillator, two or more open areas communicating with the heat-conducting plate at least in the thickness direction thereof are formed on the periphery of the heat-conducting plate at positions point-symmetric with respect to the crystal resonator, and one or more of each of the power transistor and the heating resistance are arranged in the same number in all of the open areas. | 06-28-2012 |
20120176203 | CRYSTAL OSCILLATOR - A crystal oscillator is provided, which varies a frequency drift compensation according to a power consumption and compensates a frequency drift characteristic caused by heat. An adder is used to add a temperature compensation control voltage from a temperature compensation circuit, an oscillating frequency control voltage from an AFC circuit, and a frequency drift compensation voltage corresponding to the power consumption from a frequency drift compensation circuit. A voltage added by the adder is outputted to voltage-variable capacitor elements and, which respectively are connected to an input side and an output side of an inverter IC that is connected in parallel to a crystal oscillating unit. | 07-12-2012 |
20120268216 | Dual-Sensor Temperature Stabilization for Integrated Electrical Component - Method and system ( | 10-25-2012 |
20120268217 | Calibration of Temperature Sensitive Circuits with Heater Elements - One or more heating elements are disposed on a semiconductor substrate proximate a temperature sensitive circuit disposed on the substrate (e.g., bandgap circuit, oscillator). The heater element(s) can be controlled to heat the substrate and elevate the temperature of the circuit to one or more temperature points. One or more temperature measurements can be made at each of the one or more temperature points for calibrating one or more reference values of the circuit (e.g., bandgap voltage). | 10-25-2012 |
20130033332 | QUARTZ-CRYSTAL CONTROLLED OSCILLATOR - An atmosphere temperature at which a quartz-crystal oscillator and an oscillation circuit are placed is controlled in high accuracy, and an output frequency with high stability is obtained. If oscillation outputs of first and second quartz-crystal oscillators are set to f | 02-07-2013 |
20130127552 | Ovenized System Containing Micro-Electromechanical Resonator - Disclosed an electronic device comprising an ovenized system containing a micro-electromechanical (MEM) resonator and a method for controlling such an MEM resonator. In one embodiment, the MEM resonator comprises a resonator body suspended above a substrate by means of at least a first and a second mechanical support forming a first and a second heating resistance, respectively, configured to heat the resonator body through Joules heating, biasing means configured to apply a bias voltage to the resonator body to enable vibration at a predetermined operating frequency, a temperature control system configured to control the temperature of the micro-electromechanical resonator, and an internal voltage monitoring system configured to monitor a voltage level of the resonator body. | 05-23-2013 |
20130214869 | TEMPERATURE-COMPENSATED SEMICONDUCTOR RESISTOR DEVICE - A semiconductor device includes: a resistance R whose resistance value varies in response to a substrate temperature variation; a resistance corrector that is coupled in series with the resistance R and switches its resistance value by a preset resistance step width to suppress a resistance value variation of the resistance R; a first voltage generator for generating a first voltage that varies in response to the substrate temperature; a second voltage generator for generating second voltages Vf | 08-22-2013 |
20130222073 | Design and Control of Multi-Temperature Micro-Oven for MEMS Devices - Disclosed are microelectromechanical system (MEMS) devices and methods of using the same. In some embodiments, a MEMS device comprises a micro-oven comprising a MEMS oscillator configured to generate a reference signal. The device further comprises a control unit comprising at least one input node configured to receive a parameter set, where the parameter set comprises at least a first parameter indicative of a sensed ambient temperature, and where the control system is configured to (i) based on the parameter set, select from a plurality of pre-characterized operation temperatures an operation temperature for the MEMS oscillator, and (ii) generate a temperature-setting signal indicating the selected operation temperature. The device still further comprises a temperature control system communicatively coupled to the control unit and configured to (i) receive the temperature-setting signal and (ii) maintain the MEMS oscillator at the selected operation temperature. | 08-29-2013 |
20130293312 | OSCILLATOR - An oscillator outputs a control signal to suppress an influence caused by temperature characteristic of f | 11-07-2013 |
20130293313 | OSCILLATION CIRCUIT - An oscillation circuit including a reference voltage generation circuit that adds a proportional-to-absolute-temperature (PTAT) output, which increases in proportion to an absolute temperature, to a complementary-to-absolute-temperature (CTAT) output, which decreases in proportion to an absolute temperature, to generate and output a reference voltage. The oscillation circuit generates an oscillation signal having a desired and fixed frequency. | 11-07-2013 |
20130321088 | SURFACE MOUNT OVENIZED OSCILLATOR ASSEMBLY - An oscillator assembly including a base substrate with a cavity defining an insulative air pocket. A component substrate is seated on the base substrate. An oscillator and a combination heater/temperature control assembly are located on one side and a temperature control assembly is located on the opposite side and extends into the cavity. An interior lid covers and defines an oven for the oscillator and the heater/temperature control assembly. An exterior lid covers the interior lid. A thermal resistance/heat transfer element is seated on the oscillator for increasing thermal resistance and is seated on both the oscillator and the heater/temperature control assembly for decreasing thermal resistance. | 12-05-2013 |
20130328634 | COMPENSATION FOR CRYSTAL FREQUENCY USING MULTIPLE TEMPERATURES - A method in a mobile communication device includes: measuring a first temperature associated with a crystal configured to provide a reference signal having a frequency; measuring a second temperature associated with a component that is coupled to the crystal by an electrically and thermally conductive line; and compensating, based upon the measuring of the first and second temperatures, for a change in the frequency of the reference signal of the crystal. | 12-12-2013 |
20130335153 | OSCILLATOR AND IC CHIP - There is provided an oscillator capable of lowering the power supply voltage without degrading the phase noise, while employing the conventional circuit configuration. According to one aspect of the present invention, there is provided an oscillator comprising: an oscillation circuit; a bias generation circuit for generating a bias signal to drive the oscillation circuit; and a booster circuit for boosting a power supply voltage to generate a boosted voltage for driving the bias generation circuit. In addition, the oscillation circuit, the bias generation circuit, and the booster circuit are provided in a single IC chip, and the booster circuit may receive the power supply voltage VDD from the power supply arranged at the exterior of the IC chip. | 12-19-2013 |
20140085015 | OSCILLATION DEVICE - An oscillation device is provided. The oscillation device includes: a main circuit portion, a heating unit, first and second crystal units, first and second oscillator circuits, a frequency difference detector, a first addition unit, an integration circuit unit, a circuit unit configured to control an electric power to be supplied to the heating unit, a compensation value obtaining unit, and a second addition unit. The compensation value obtaining unit is configured to obtain a frequency compensation value for compensating an output frequency of the main circuit portion based on an integrated value output from the integration circuit unit, and based on a change in the clock signal due to a difference between the temperature of the atmosphere and the temperature setting value of the heating unit. The second addition unit is configured to add the frequency compensation value to a frequency setting value. | 03-27-2014 |
20140091867 | INTEGRATED CIRCUIT, VIBRATING DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD OF SWITCHING MODES OF INTEGRATED CIRCUIT - An oscillator IC includes a VDD terminal (first terminal), an OUT terminal (second terminal), an oscillation circuit for oscillating a resonator element, a mode switching circuit that switches between a normal mode (the first mode in which an oscillation signal output by the oscillation circuit is output from the OUT terminal) and a serial I/F mode (the second mode in which a signal than the oscillation signal is output or input from the OUT terminal) based on a voltage of the VDD terminal, and a control circuit that controls stop of the oscillation circuit in the serial I/F mode based on setting information that can be changed from outside. | 04-03-2014 |
20140159823 | Silicon-Based Oscillator for A Downhole Tool - Systems, methods, and assemblies to provide clock signals to electrical components of downhole tools are provided. In one example, an oscillator assembly may include a silicon-based oscillator having a variable capacitor circuit. The silicon-based oscillator may provide an output signal at a frequency within a range of frequencies. The oscillator assembly may also include control circuitry electrically coupled to the silicon-based oscillator. Moreover, the control circuitry may include a temperature input that receives a temperature corresponding to the silicon-based oscillator. The control circuitry may also include a control signal output electrically coupled to the silicon-based oscillator. The control signal output may be used to change a capacitance of the variable capacitor circuit based on the temperature received by the temperature input to maintain the output signal of the silicon-based oscillator within the range of frequencies. | 06-12-2014 |
20140292421 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - An electronic device includes: a support member including a first terminal, a second terminal, and a support portion extending from the first terminal and coupling the first terminal with the second terminal; an electronic component; and a bonding member connecting the first terminal with the electronic component. In a plan view along a direction in which the first terminal and the electronic component overlap each other, a portion of the first terminal is adjacent to the support portion with a notch portion therebetween and protrudes toward the extending direction side of the support portion. The support portion is bent at a portion adjacent to the protruding portion of the first terminal along the overlapping direction. | 10-02-2014 |
20140292422 | RESONATION DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - A quartz crystal oscillator as a resonation device includes a substrate, a quartz crystal resonator as a resonator attached with a heating element, terminals adapted to fix the resonator and the substrate to each other, and intermediate members having an electrical insulation property and lower in thermal conductivity than the terminals. The intermediate members intervene between the resonator and the substrate via the terminals, and a gap is disposed between the quartz crystal resonator and the substrate. | 10-02-2014 |
20140292423 | OSCILLATOR, ELECTRONIC DEVICE AND MOVING OBJECT - An oscillator includes an oscillation element; an oscillation circuit which causes the oscillation element to oscillate; a heat generation element which heats the oscillation element; a temperature control circuit which controls the heat generation element; and a temperature correction circuit which corrects frequency-temperature characteristics of an output signal of the oscillation circuit. | 10-02-2014 |
20140292424 | PIECE-CRYSTAL OSCILLATOR AND OSCILLATION DEVICE - A crystal oscillator includes: an oscillation circuit; first and second oscillation circuits connected to first and second temperature detection crystal units, respectively; a heating portion configured to constantly maintain an ambient temperature; a frequency difference detection portion that obtains, as a temperature detection value, “{(f | 10-02-2014 |
20140320220 | OVEN CONTROLLED CRYSTAL OSCILLATOR AND MANUFACTURING METHOD THEREOF - The present invention discloses an Oven Controlled Crystal Oscillator and a manufacturing method thereof. The Oven Controlled Crystal Oscillator comprises a thermostatic bath, a heating device, a PCB and a signal generating element, where the signal generating element is used for generating a signal of a certain frequency, the heating device, the PCB and the signal generating element are mounted in the thermostatic bath, the signal generating element is mounted in a groove formed on one side of the PCB, while the heating device is mounted against the other side of the PCB that is opposite to the groove. The signal generating element may be a passive crystal resonator or an active crystal oscillator. The Oven Controlled Crystal Oscillator according to the invention is advantageous for a small volume and a high temperature control precision. | 10-30-2014 |
20140320221 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - An electronic device includes: a substrate; a resonation device; a heating element; a first support which is mounted on the substrate and supports the resonation device; and a second support which supports the substrate, in which the relationship between thermal conductivity λ1 of the first support and thermal conductivity λ2 of the second support satisfies an expression, λ1>λ2. | 10-30-2014 |
20140320222 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - An electronic device includes a resonator provided with a heating element, and a circuit component opposed to the heating element, and provided with at least an oscillating amplifier element, and a distance between the heating element and the circuit component is in a range not smaller than 0 mm and no larger than 1.5 mm. | 10-30-2014 |
20140347138 | METHODS FOR NOISE REDUCTION AND QUALITY FACTOR IMPROVEMENT IN RESONATORS - A low phase noise dual mode resonator and a method of making and using said resonator is disclosed. The dual mode resonator is capable of sustaining two frequency vibration modes simultaneously. The two frequency vibration modes are capable of exhibit non-linear coupling when one is driven at a higher voltage than the other. The dual mode resonator is configured such that the ratio of the two vibration frequency modes is a value that maximizes the non-linear coupling effect. As a result of the non-linear effect, the phase noise on the mode that is not overdriven is reduced. | 11-27-2014 |
20140347139 | FREQUENCY GENERATOR ASSEMBLY - The invention relates to a frequency generator assembly, including at least one oscillator and an electronic signal processing device, which is designed in such a way that the electronic signal processing device provides an electric clock signal (f) having a defined frequency as an output signal of the frequency generator assembly, wherein the defined frequency depends on the vibration frequency of the oscillator, wherein the oscillator includes at least one micromechanical seismic mass which is vibrationally excited by at least one driving device, whereupon the electronic signal processing device generates and provides the electric clock signal (f) according to the vibration frequency of the at least one seismic mass. | 11-27-2014 |
20140354365 | Device for Compensating Temperature Drift of a VCO, and to a Method Thereof - A device for compensating temperature drift of a voltage controlled oscillator (VCO) is provided. The VCO has at least one varactor arranged for controlling an output frequency f | 12-04-2014 |
20140361843 | MONOLITHIC BODY MEMS DEVICES - A technique decouples a MEMS device from sources of strain by forming a MEMS structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation. | 12-11-2014 |
20140361844 | SUSPENDED PASSIVE ELEMENT FOR MEMS DEVICES - A technique decouples a MEMS device from sources of strain by forming a MEMS structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation. An apparatus includes a MEMS device including a first electrode and a second electrode, and a body suspended from a substrate of the MEMS device. The body and the first electrode form a first electrostatic transducer. The body and the second electrode form a second electrostatic transducer. The apparatus includes a suspended passive element mechanically coupled to the body and electrically isolated from the body. | 12-11-2014 |
20140368283 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface. | 12-18-2014 |
20150054590 | OVEN CONTROLLED CRYSTAL OSCILLATOR - An oven controlled crystal oscillator (OCXO) is provided for improving temperature characteristics of a frequency. In the OCXO, a thermostatic oven | 02-26-2015 |
20150061783 | CRYSTAL CONTROLLED OSCILLATOR - A crystal controlled oscillator includes a crystal unit, an oscillator circuit, a temperature detector for crystal unit, a heating unit for crystal unit, a temperature detector for oscillator circuit, and a heating unit for oscillator circuit. The heating unit for crystal unit is configured to control an output of the crystal unit based on a temperature detected by the temperature detector for crystal unit to compensate the temperature of the atmosphere where the crystal unit is placed to be constant. An output of the heating unit for oscillator circuit is controlled independently from the heating unit for crystal unit based on a temperature detected by the temperature detector for oscillator circuit to compensate the temperature of the atmosphere where the oscillator circuit is placed to be constant. | 03-05-2015 |
20150084705 | TEMPERATURE CONTROL CIRCUIT AND OVEN CONTROLLED CRYSTAL OSCILLATOR - A temperature control circuit of an oven controlled crystal oscillator is a circuit in which a supply voltage is applied to a first terminal of a resistance R | 03-26-2015 |
20150084706 | OSCILLATOR - An oscillator according to the disclosure includes a crystal unit, an IC chip, an adhesive agent flow prevention film, and a lead frame. The lead frame is disposed in a peripheral area of the pair of crystal terminals and the IC chip in an approximately same surface as the one surface of the flat container of the crystal unit. The lead frame includes a wiring part that is connected to an IC terminal of the IC chip by a bonding wire and is buried in the resin mold, and a mounting terminal forming portion that extends from the wiring part and is folded along an outside of the resin mold in a back surface that is another surface side opposite to the one surface of the crystal unit so as to form a mounting terminal. | 03-26-2015 |
20160079917 | METHOD AND APPARATUS OF A SELF-BIASED RC OSCILLATOR AND RAMP GENERATOR - A self-biased RC (resistor-capacitor) oscillator and ramp generator circuit includes a combined current and voltage reference circuit for providing a reference current, a first reference voltage, and a second reference voltage. The combined current and voltage reference circuit includes a circuit branch of an NMOS transistor in a diode connection, a PMOS transistor in a diode connection, and a resistor coupled in series. The circuit also has a signal generating circuit that includes a capacitor. The signal generating circuit is configured to charge and discharge the capacitor between the first reference voltage and the second reference voltage. The self-biased RC oscillator and ramp generator circuit is configured to provide a ramp or saw tooth signal at a node of the capacitor and to provide an oscillator output signal at an output of the signal generating circuit. | 03-17-2016 |
20160142010 | ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND MOVING OBJECT - An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. Each of the first support and the second support includes a protrusion portion, and the protrusion portion of the second support is shorter than the protrusion portion of the first support. | 05-19-2016 |