| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 310340000 | Encapsulated or coated | 38 |
| 20080224569 | Piezoelectric element and its manufacturing method - A piezoelectric element includes: a base substrate; a lower electrode provided above the base substrate; a lower dummy electrode provided on the base substrate and electrically insulated from the lower electrode; a piezoelectric layer provided on the base substrate, the lower electrode and the lower dummy electrode; and an upper electrode provided on the piezoelectric layer. | 09-18-2008 |
| 20080238261 | Piezoelectric element and its manufacturing method - A piezoelectric element includes: a base substrate; a lower electrode provided on the base substrate; a piezoelectric layer provided on the lower electrode; an upper electrode provided on the piezoelectric layer; and a protection layer that covers a side surface of the piezoelectric layer, wherein the protection layer is formed from polymeric material. | 10-02-2008 |
| 20090200897 | PIEZOELECTRIC ACTUATOR MODULE HAVING A SHEATH, AND A METHOD FOR ITS PRODUCTION - A piezoelectric actuator module having a multilayer structure of piezoelectric elements is proposed as a piezoelectric actuator, wherein a different polarity of an electric voltage is alternately applied to inner electrodes which are arranged between piezoelectric layers of the piezoelectric elements in the direction of the layer structure of the piezoelectric elements, said module having an actuator foot and an actuator head composed of steel and having an elastic insulation medium which surrounds at least the piezoelectric elements in predefined limits. At least one annular groove or recess, into which a material which can be crosslinked with the insulation medium is vulcanized, is provided on the actuator foot and/or on the actuator head, and a flexible, weldable hose or sheath lies encompasses the piezoelectric element, and at least above the grooves or recesses containing the material as an insulation medium the weldable hose is welded to the material in the grooves or recesses. | 08-13-2009 |
| 20090236941 | PIEZOELECTRIC COMPONENT AND METHOD FOR MANUFACTURING SAME - Disclosed is a piezoelectric component ( | 09-24-2009 |
| 20090278423 | PIEZOELECTRIC ACTUATOR WITH GRADIENT ENCAPSULATION LAYER AND METHOD FOR THE PRODUCTION THEREOF - In a method for the production of a gradient encapsulation layer | 11-12-2009 |
| 20090302713 | PIEZO ACTUATOR COMPRISING A MULTILAYER ENCAPSULATION, AND METHOD FOR THE PRODUCTION THEREOF - In a method for producing a multilayer encapsulation ( | 12-10-2009 |
| 20100066209 | ACOUSTIC WAVE DEVICE AND METHOD FOR FABRICATING THE SAME - An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip. | 03-18-2010 |
| 20100079035 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF - An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a resin portion covering the package. The resin portion covers at least the package base and the bonding material, and at least a part of the resin portion has a section outline. The section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device. The outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device. | 04-01-2010 |
| 20100096951 | CONTOUR RESONATOR AND METHOD FOR ADJUSTING CONTOUR RESONATOR - A contour resonator is provided with a vibrating body formed from a flat plate in a square shape, excitation electrodes formed on both front and back surfaces of the vibrating body and regulating a resonance frequency, and temperature characteristic adjustment films formed on surfaces of the excitation electrodes and adjusting a temperature characteristic. | 04-22-2010 |
| 20100156245 | COATING FOR ACTUATOR AND METHOD OF APPLYING COATING - A method includes applying a lip, comprised of a first material, along at least a portion of an actuator of an electronic device, and applying a coating, comprised of an elastic material, to cover a part of the actuator, the coating disposed to facilitate actuation of the actuator. | 06-24-2010 |
| 20100244630 | PIEZOELECTRIC RESONATOR, PIEZOELECTRIC OSCILLATOR, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR - A piezoelectric resonator includes: a package having a cavity; a plurality of electrode pads formed within the cavity; a first bonding section and a second bonding section that include silicone base conductive adhesive and are formed on the plurality of the electrode pads, respectively; and a piezoelectric vibrating element having one end supported by the first bonding section and the second bonding section, wherein the piezoelectric vibrating element has a piezoelectric substrate having mutually opposing first face and second face, a first electrode that is formed on the first face and electrically connected to the first bonding section, and a second electrode that is formed on the second face and electrically connected to the second bonding section, wherein an area of the piezoelectric vibrating element supported by the first bonding section and the second bonding section defines a supported region and an area of the piezoelectric vibrating element that is not supported by the first bonding section or the second bonding section defines a movable region, wherein a fluorocarbon resin film is formed on the movable region. | 09-30-2010 |
| 20100264780 | Piezoelectric Actuator - A piezoelectric actuator ( | 10-21-2010 |
| 20100295420 | PIEZOCERAMIC SURFACE ACTUATOR AND METHOD FOR THE PRODUCTION THEREOF - A piezoceramic surface actuator having a plurality of piezoceramic plates ( | 11-25-2010 |
| 20100295421 | ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND BASE MEMBER MANUFACTURING METHOD - An electronic component capable of withstanding stress from a printed-circuit board or the like is provided. In an electronic component, a cavity hermetically sealed by a base and a lid is formed. In the cavity, a crystal resonator is supported by a supporting member over the top surface of the base. The base is made of glass. A stress buffer layer made of a conductive resin or the like is formed over the whole bottom surface of the base. An external electrode and an external electrode that are in continuity with the electrodes of the crystal resonator individually extend to the bottom surface of the stress buffer layer via the side surfaces of the base and stress buffer layer. The thus configured electronic component is surface-mounted by, for example, soldering the external electrode and external electrode formed on the bottom surface of the stress buffer layer to a printed-circuit board. | 11-25-2010 |
| 20100308693 | Piezoelectric Stack Actuator Assembly - A piezoelectric actuator assembly comprising at least a stack of interior piezoelectric wafers which, in one embodiment, each include first and second spaced-apart strips of conductive material defining first and second wrap-around electrodes. The interior wafers are stacked in an alternating relationship wherein the first electrodes and the second electrodes are disposed in an opposed relationship. In one embodiment, the assembly includes an end piezoelectric wafer located at each end of the stack of interior wafers and includes a wrap-around electrode in contact with the interior wafers. A conductive end plate is coupled to each of the end piezoelectric wafers. A terminal wire is coupled to each conductive end plate. | 12-09-2010 |
| 20100327699 | ENCAPSULATION COATING TO REDUCE PARTICLE SHEDDING - Various embodiments of the present invention relate to an encapsulated ceramic element coated with polymer material applied precisely to the element edges that are exposed during dicing. Methods of applying the polymer, as well as specific polymers that are particularly useful are disclosed. For example, the polymer material may be applied using precise application methods such as ink-jet printing to direct-write the material precisely where specifically desired. Another method described in the use of photolithographic methods. Additionally, the inventors have identified polyimide as a particularly useful polymer material in connection with certain aspects. | 12-30-2010 |
| 20110057548 | Piezoelectric Actuator Unit - A piezoelectric actuator unit includes a piezoactuator and a casting compound enclosing the piezoactuator. The casting compound is disposed in a sleeve that includes a hydrophobic material. | 03-10-2011 |
| 20110074250 | MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, AND ELECTRONIC EQUIPMENT - A manufacturing method for electronic device, includes: preparing a first substrate having a plurality of first regions; preparing a second substrate having a plurality of second regions; facing the first region and the second region each other, and connecting the first substrate and the second substrate while disposing at least a part of a functional element within a space between the first region and the second region; obtaining a plurality of first divisional substrates by cutting the first substrate at each of the first regions, after the connecting of the first substrate and the second substrate; forming a sealing film covering the plurality of the first divisional substrates on the second substrate, after cutting the first substrate; obtaining a plurality of second divisional substrates by cutting the second substrate at each of the second regions, after forming the sealing film; and obtaining a plurality of individual electronic devices. | 03-31-2011 |
| 20110084573 | ELASTIC WAVE DEVICE AND ELECTRONIC DEVICE USING THE SAME - An elastic wave device has the following elements: a piezoelectric substrate; an inter-digital transducer (IDT) electrode disposed on the piezoelectric substrate; internal electrodes disposed above the piezoelectric substrate and electrically connected to the IDT electrode; side walls disposed above the internal electrodes surrounding the IDT electrode; a cover disposed above the side walls so as to cover a space above the IDT electrode; an electrode base layer disposed on the internal electrodes outside the side walls; and connection electrodes disposed on the electrode base layer. Each connection electrode has a first connection electrode disposed on the electrode base layer, and a second connection electrode disposed on the first connection electrode. The horizontal sectional shape of the second connection electrode is non-circular. | 04-14-2011 |
| 20110084574 | SANDWICH PIEZOELECTRIC DEVICE WITH SOLID COPPER ELECTRODE - Disclosed are apparatus and methodology for minimizing and compensating for cracking in piezoelectric devices so as to maintain long term functionality of the devices. Compensation for cracking is achieved by applying solid conductive electrodes over the entire surface of the piezoelectric device and extending the electrodes beyond the perimeter of the piezoelectric device. In this way electrical connections are maintained even in the presence of cracking. Cracking of the piezoelectric device is limited by minimizing the local bending moment of the piezoelectric device by way of applying insulative support materials that may vary in thickness. | 04-14-2011 |
| 20110115339 | Acoustic Wave Device - An acoustic wave device according to one embodiment of the present invention has a base with a vibrating body, a sealing member which is joined to the base in a frame-shaped region surrounding the vibrating body and faces the vibrating body with a space therebetween, and an intermediate layer between the frame-shaped region of the sealing member and the base. The frame-shaped region has a recess and at least a portion of the intermediate layer is located inside the recess. | 05-19-2011 |
| 20110198970 | ENCAPSULATED ACTIVE TRANSDUCER AND METHOD OF FABRICATING THE SAME - A micro-electromechanical systems (MEMS) ultrasonic transducer device includes a substrate defining an opening and an active transducer having multiple of active layers stacked over the opening of the substrate. The active transducer is completely encapsulated by multiple passivation layers. | 08-18-2011 |
| 20120007474 | PIEZOELECTRIC/ELECTROSTRICTIVE ELEMENT AND METHOD OF MANUFACTURING THE SAME - A piezoelectric/electrostrictive element with improved moisture resistance while having less degradation in its piezoelectric/electrostrictive properties and a method of manufacturing such a piezoelectric/electrostrictive element are provided. A laminated vibrator of a piezoelectric/electrostrictive element has a structure in which an electrode film, a piezoelectric/electrostrictive film, another electrode film, another piezoelectric/electrostrictive film, and another electrode film are laminated one above the other. In the manufacture of the piezoelectric/electrostrictive element, the laminated vibrator and a counter electrode are immersed in an electrodeposition coating fluid containing a coating component so that the electrodeposition coating fluid is brought into contact with the surfaces of the laminated vibrator and the counter electrode. Thereafter, voltage is applied between an internal electrode film and the counter electrode to induce electrophoresis of the coating component toward a surface-exposed defect, whereby the coating material is selectively electrodeposited on the surface-exposed defect. | 01-12-2012 |
| 20120062071 | PIEZOELECTRIC/ELECTROSTRICTIVE ACTUATOR - A piezoelectric/electrostrictive actuator, including a piezoelectric/electrostrictive element that includes at least one laminate including one piezoelectric/electrostrictive layer and one pair of electrodes disposed respectively on both sides of said piezoelectric/electrostrictive layer and has a moving part corresponding to a portion where said piezoelectric/electrostrictive layer is sandwiched by one pair of said electrodes and a non-moving part corresponding to a portion where said piezoelectric/electrostrictive layer is not sandwiched by one pair of said electrodes, and a moisture proof membrane disposed to cover at least the proximity of the boundary between said moving part and said non-moving part and consisting of silicone-based organic insulation material with storage elastic modulus of 100 kPa or less obtained by dynamic viscoelastic measurement using a parallel cone with diameter of 25 mm under a condition with strain of 0.1%, frequency of 1 Hz, gap of 0.5 mm and temperature of 22° C. | 03-15-2012 |
| 20120274183 | PROTECTED RESONATOR - A bulk acoustic wave resonator structure that isolates the core resonator from both environmental effects and aging effects. The structure has a piezoelectric layer at least partially disposed between two electrodes. The structure is protected against contamination, package leaks, and changes to the piezoelectric material due to external effects while still providing inertial resistance. The structure has one or more protective elements that limit aging effects to at or below a specified threshold. The resonator behavior is stabilized across the entire bandwidth of the resonance, not just at the series resonance. Examples of protective elements include a collar of material around the core resonator so that perimeter and edge-related environmental and aging phenomena are kept away from the core resonator, a Bragg reflector formed above or below the piezoelectric layer and a cap formed over the piezoelectric layer. | 11-01-2012 |
| 20130002095 | BENDING TRANSDUCER - The bending transducer has a layer construction containing a piezoelectrically active element, which is formed of a piezoactive material, in particular a piezoceramic, and electrode layers fitted thereon. In order to enable a high bending loading of the bending transducer and to reduce the risk of fracture, it is provided that a protective layer is applied to the layer construction on the outer side, preferably on both sides, which protective layer is applied to the layer construction in particular under prestress. | 01-03-2013 |
| 20130049541 | SURFACE MOUNT TYPE PIEZOELECTRIC DEVICE - A piezoelectric device includes a rectangular base plate having a first face where a pair of mounting terminals are formed, a second face opposite to the first face, where a bonding face is formed in a circumference, and a pair of connecting electrodes formed in the bonding face; a rectangular piezoelectric vibrating piece having a pair of excitation electrodes and lead electrodes extracted from a pair of the excitation electrodes, so that the lead electrode is fixed to the connecting electrode using a conductive adhesive; a lid plate that covers the piezoelectric vibrating piece; and a ring-shaped encapsulating material arranged in a ring shape between the bonding face and the lid plate to encapsulate the base plate and the lid plate. The connecting electrode is formed in a comb-tooth shape as seen from a normal direction of the second face to increase a lateral length of the connecting electrode. | 02-28-2013 |
| 20130106245 | FIBRE COMPOSITE COMPONENT ACTING AS AN ACTUATOR, A SENSOR AND/OR A GENERATOR AND METHOD FOR THE PRODUCTION THEREOF | 05-02-2013 |
| 20130147319 | LOADING ELEMENT OF A FILM BULK ACOUSTIC RESONATOR - Manufacturing a semiconductor structure including modifying a frequency of a Film Bulk Acoustic Resonator (FBAR) device though a vent hole of a sealing layer surrounding the FBAR device. | 06-13-2013 |
| 20130147320 | BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD THEREOF, AND RADIO FREQUENCY DEVICE USING BULK ACOUSTIC WAVE RESONATOR - Provided is a bulk acoustic wave resonator (BAWR). The BAWR may include a first electrode, a piezoelectric layer disposed on the first electrode, a second electrode disposed on the piezoelectric layer. In various aspects, at least one of the first electrode, the piezoelectric layer, and the second electrode are formed of a carbon-based material. | 06-13-2013 |
| 20130285511 | ACTUATOR UNIT, METHOD FOR PRODUCING AN ACTUATOR UNIT, AND SLEEVE FOR ACCOMMODATING A PIEZOACTUATOR - The invention relates to an actuator unit, which comprises a piezoactuator ( | 10-31-2013 |
| 20130300259 | PROTECTED RESONATOR - A bulk acoustic wave resonator structure that isolates the core resonator from both environmental effects and aging effects. The structure has a piezoelectric layer at least partially disposed between two electrodes. The structure is protected against contamination, package leaks, and changes to the piezoelectric material due to external effects while still providing inertial resistance. The structure has one or more protective elements that limit aging effects to at or below a specified threshold. The resonator behavior is stabilized across the entire bandwidth of the resonance, not just at the series resonance. Examples of protective elements include a collar of material around the core resonator so that perimeter and edge-related environmental and aging phenomena are kept away from the core resonator, a Bragg reflector formed above or below the piezoelectric layer and a cap formed over the piezoelectric layer. | 11-14-2013 |
| 20130320808 | INTEGRATED RESONATOR WITH A MASS BIAS - An integrated resonator apparatus includes a piezoelectric resonator and an acoustic Bragg reflector formed adjacent the piezoelectric resonator. The integrated resonator apparatus also includes a mass bias formed over the Bragg reflector on a side of the piezoelectric resonator opposite the piezoelectric resonator. | 12-05-2013 |
| 20130328448 | PIEZO ACTUATOR WITH PROTECTION AGAINST ENVIRONMENTAL INFLUENCES - A piezo actuator with protection against environmental influences comprises a layer stack ( | 12-12-2013 |
| 20140239772 | ELECTRONIC COMPONENT - In an electronic component, when L0 is a dimension of an electronic component body in a first direction, L1 is a distance between a first outer electrode and a second outer electrode on a first surface in the first direction, and L2 is a dimension of each of the first and second outer electrodes on the first surface in the first direction, 0%| 08-28-2014 | |
| 20140333183 | PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING SAME - A resin is provided so as to cover four side faces of a piezoelectric multilayer body integrally and thus is effectively prevented from peeling from the piezoelectric multilayer body, whereby high adhesion is attained between the piezoelectric multilayer body and the resin. At the same time, the resin covers dicing surfaces in the side faces of the piezoelectric multilayer body, thereby effectively restraining the piezoelectric body and the electrodes from producing particles. | 11-13-2014 |
| 20150035412 | Piezo-Stack with Passivation, and a Method for the Passivation of a Piezo-Stack - A piezo-stack includes a plurality of lateral surfaces and a first passivation layer applied to a first lateral surface. The first passivation layer terminates flush with opposing lateral surfaces that adjoin the first lateral surface. | 02-05-2015 |
| 20160028368 | WAFER SCALE PACKAGING - A method of wafer scale packaging acoustic resonator devices and an apparatus therefor. The method including providing a partially completed semiconductor substrate comprising a plurality of single crystal acoustic resonator devices, each having a first electrode member, a second electrode member, and an overlying passivation material. At least one of the devices to be configured with an external connection, a repassivation material overlying the passivation material, an under metal material overlying the repassivation material. Copper pillar interconnect structures are then configured overlying the electrode members, and solder bump structures are form overlying the copper pillar interconnect structures. | 01-28-2016 |
