Class / Patent application number | Description | Number of patent applications / Date published |
310326000 | Combined with damping structure | 52 |
20080246369 | Clip - A clip for securing a sleeve to the body of a piezoelectric actuator in an actuator assembly. The clip takes the form of a band and has at least a first and a second stable state. The minimum separation of the walls of the band when the clip is in one of the stable states is less than the minimum separation of the walls of the band when the clip is in an unstable state. The clip is forced into an unstable state in order to be fitted over the sleeve of the actuator assembly. The force is then removed to allow the clip to revert towards a stable state. The dimensions of the clip are such that the clip is unable to fully revert to a stable state when fitted to the actuator assembly thereby maintaining sufficient additional strain energy to maintain a sufficient clamping force between the sleeve and the body of the actuator. | 10-09-2008 |
20080290758 | ULTRASONIC SENSOR AND METHOD FOR MANUFACTURING THE SAME - An ultrasonic sensor includes a cylindrical casing having a bottom portion. The casing has a piezoelectric element on a bottom surface thereof. A substrate is attached to an end surface of an opening portion of the casing with a damping member provided therebetween such that the damping member covers the opening portion. Pin terminals are arranged so as to extend through the substrate and the damping member and are electrically connected to the piezoelectric element with lead wires. An inner space of the casing is filled with foamable resin. | 11-27-2008 |
20090001854 | DRIVING APPARATUS - A driving apparatus has a piezoelectric element as a driver. The driving apparatus includes a first vibrator which generates an elliptical vibration when a voltage of a predetermined frequency is applied; a first member which holds the first vibrator; a second member which includes a first sliding member to which the first vibrator is pressed and makes a relative displacement with respect to the first member by being driven by the elliptical vibration of the first vibrator; and a first resonance preventive member which is provided to the second member and prevents a resonance in the second member from being generated by the elliptical vibration of the first vibrator. | 01-01-2009 |
20090085437 | HYBRID THIN FILM HETEROSTRUCTURE MODULAR VIBRATION CONTROL APPARATUS AND METHODS FOR FABRICATION THEREOF - Microelectromechanical systems (MEMS) include critical devices for various highly sensitive applications. However, MEMS operation may be impaired by vibration. A modular vibration control pedestal for integration with a MEMS is provided according to embodiments of the present invention which includes a piezoelectric perovskite oxide disposed on a substrate and a shape memory alloy component disposed on the piezoelectric perovskite oxide. In particular embodiments of a MEMS device including a modular VCP, vibration is reduced by at least 50%. | 04-02-2009 |
20090102319 | ACOUSTIC RESONATOR AND FILTER - A first supporting section | 04-23-2009 |
20090195123 | ULTRASONIC SENSOR - An ultrasonic sensor includes a cylindrical outer case with a bottom and a piezoelectric element fixed to the inner side of the bottom portion of the outer case. A ring-shaped inner case having a central hole extending in the axial direction in the central portion thereof is disposed inside the sidewall portion of the outer case. A flat or substantially flat portion is provided around the central hole of the inner case, and a viscoelastic filler is arranged so as to extend from the central hole to the flat or substantially flat portion of the inner case. A tabular member is disposed on the flat or substantially flat portion so as to face the flat or substantially flat portion with the filler interposed therebetween. When the inner case vibrates, shear deformation occurs in the filler interposed between the flat or substantially flat portion and the tabular member since the tabular member is not substantially deformed, and the vibration is reduced by the viscoelastic damping effect. | 08-06-2009 |
20090218913 | ULTRASONIC TRANSDUCER - A piezoelectric device is attached to an inner bottom surface of the outer case having a tubular shape including a bottom, and an inner case is disposed within the outer case. In an ultrasonic vibration acting surface of the inner case that is arranged to face the bottom surface of the outer case, a mass of the inner case is arranged to restrain vibration of the outer case, which is generated by the piezoelectric device. A first cutout is provided in a portion of the ultrasonic vibration acting surface and arranged to face the piezoelectric device so as to flatten an ultrasonic beam generated by vibrations of the piezoelectric device and the outer case. Second cutouts are provided at locations on the ultrasonic vibration acting surface spaced away from the first cutout in a line symmetrical relationship with a long axis of the first cutout defining a symmetrical axis. | 09-03-2009 |
20090278422 | PIEZOELECTRIC MULTILAYER COMPONENT - The invention relates to a piezoelectric multi-layer component with a plurality of piezoelectric layers ( | 11-12-2009 |
20090289527 | Electrical Multi-layer Component - A piezoelectric multi-layer component is described herein. The component includes a plurality of ceramic layers, and one or more electrode layer. The one or more electrode layer has a material structure that is different than the plurality of ceramic layers and is configured to at least partially block a propagation in a longitudinal direction of pressure waves acting on the piezoelectric multi-layer component. | 11-26-2009 |
20110304243 | Thin-Film Piezoelectric Acoustic Wave Resonator and High-Frequency Filter - A thin-film piezoelectric acoustic wave resonator that has a large k2, can trap acoustic energy in a resonating part, does not excite spurious resonance, or can finely adjust resonance frequency and a high-frequency filter using the thin-film piezoelectric acoustic wave resonator are provided without increasing the number of processes. At both ends of a vibrating part ( | 12-15-2011 |
20120104900 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes: a first piezoelectric thin film resonator including a first lower electrode, a first upper electrode and a first piezoelectric film sandwiched between the first lower and upper electrodes; a decoupler film provided on the first upper electrode; and a second piezoelectric thin film resonator provided on the decoupler film and including a second lower electrode, a second upper electrode and a second piezoelectric film sandwiched between the second lower and upper electrodes, wherein the first piezoelectric film and the second piezoelectric film comprise aluminum nitride and include an element increasing a piezoelectric constant of the aluminum nitride. | 05-03-2012 |
20120112604 | ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF - A manufacturing method of an ultrasonic probe that has a signal foil made of a copper foil patterned by an additive method is provided. The manufacturing method includes preparing a base material and forming an insulating layer on a surface of the material, patterning the insulating layer by exposure, development, and peeling according to a lithographic technique, forming a cavity reaching an upper surface of the base material in the insulating layer along the patterning, forming a signal foil by performing plating in the cavity in the order of copper plating and solder plating, and demolding the formed signal foil from the cavity. | 05-10-2012 |
20120153775 | PIEZOELECTRIC ACTUATOR - Disclosed herein is a piezoelectric actuator. The piezoelectric actuator includes a piezoelectric element generating vibrations by repetitively expanding and restoring according to power applied from the outside to be linearly driven; a support member contacts the piezoelectric element in order to support the piezoelectric element; and vibration control members attached to one surface of and the support member and the piezoelectric element. | 06-21-2012 |
20120248935 | HAPTIC FEEDBACK APPARATUS - Disclosed is an apparatus used in an electronic device for providing haptic feedback. The apparatus includes a main board defining a mounting surface, a vibration unit mounted on the mounting surface of the main board, the vibration unit being capable of vibrating along a direction parallel to the mounting surface. At least two screws are provided to fix the vibration unit on the main board, and a pair of stop block is provided to restricting the position of the vibration unit. | 10-04-2012 |
20120299444 | PIEZOELECTRIC THIN-FILM RESONATOR, COMMUNICATION MODULE AND COMMUNICATION DEVICE - A piezoelectric thin-film resonator includes a substrate, a lower electrode provided on the substrate, a piezoelectric film provided on the lower electrode and an upper electrode that is located opposite the lower electrode across at least a part of the piezoelectric film. A mass load film is provided on the upper electrode. The mass load film includes a plurality of concave or convex patterns in at least a region that faces the lower electrode. The plurality of concave or convex patterns are densely arranged in a central portion of the region and are sparsely arranged in a peripheral portion of the region. | 11-29-2012 |
20130038173 | MULTI DEGREE-OF-FREEDOM PIEZOELECTRIC MICRO-ACTUATOR WITH AN ENERGY EFFICIENT ISOLATION STRUCTURE - A multi-DOF piezoelectric actuator that may be constructed with sizes of about or less than one millimetre. The multi-DOF piezoelectric actuator is capable of generating motion of a rotor element or slider element, about or in, each of the three fundamental axes of three dimensional space. The actuator can comprise a piezoelectric element ( | 02-14-2013 |
20130043766 | ACTUATOR, PIEZOELECTRIC ACTUATOR, ELECTRONIC DEVICE, AND METHOD FOR ATTENUATING VIBRATION AND CONVERTING VIBRATION DIRECTION - A viscoelastic body is interposed between a vibrating membrane vibrating in association with a piezoelectric vibrator composed of a piezoelectric element and a base and a support member supporting the vibrating membrane. The viscoelastic body attenuates vibration transmitted from the support member to the vibrating membrane and converts vibration of the vibrating membrane in the surface direction parallel to its main surfaces to vibration of the vibrating membrane in the direction nearly perpendicular to the surface direction. The vibrating membrane is annular with an opening at the center, and the base is joined to the vibrating membrane coaxially with opening. | 02-21-2013 |
20130076207 | TRANSDUCER STRUCTURE FOR A TRANSDUCER PROBE AND METHODS OF FABRICATING SAME - A composite ceramic transducer structure for use in the construction of an ultrasound probe includes a substrate and a plurality of piezoelectric transducer posts. The plurality of piezoelectric transducer posts are controllably formed on the substrate in a plurality of spatial positions located on an X-Y plane of the substrate. The plurality of piezoelectric posts includes a plurality of shapes defined in an X-Y-Z plane of the substrate, wherein the plurality of piezoelectric transducer posts are configured to facilitate minimizing shear waves within the ultrasound probe. | 03-28-2013 |
20130300256 | PIEZOELECTRIC VIBRATION MODULE - Disclosed herein is a piezoelectric vibration module that includes a side damper between a vibration plate with a piezoelectric element and an upper case so as to ensure reliability against external shock applied to the side and narrows a spaced distance between the vibration plate and the upper case. | 11-14-2013 |
20130300257 | PIEZOELECTRIC VIBRATION MODULE - Disclosed herein is a piezoelectric vibration module including a vibration plate that is surrounded by an upper case and a lower case, and includes a stopper capable of preventing direct collision between a piezoelectric element and an internal constituent member, for example, a lower case while vibrating linearly therein. | 11-14-2013 |
20140009033 | ULTRASOUND TRANSDUCER WITH ACOUSTIC ISOLATOR AND CORRESPONDING MOUNTING METHOD - An ultrasonic transducer device is disclosed. The device includes a body and an ultrasonic transducer mounted onto the body. The ultrasonic transducer comprises a shoulder and an O-ring placed on the shoulder. The O-ring substantially covers the interface between the ultrasonic transducer and the body. | 01-09-2014 |
20140070667 | VIBRATION GENERATION DEVICE - There is provided a vibration generation device, including: a housing including an inner space; a direction conversion member mounted in the housing to be disposed within the inner space; a piezoelectric actuator including a piezoelectric element fixed to the direction conversion member and horizontally deformed; and a vibrator fixed to the direction conversion member and disposed within the inner space and vertically displaced due to horizontal deformation of the piezoelectric actuator. | 03-13-2014 |
20140167561 | ULTRASONIC VIBRATION APPARATUS - An ultrasonic vibration apparatus includes a vibrator, wherein the vibrator includes at least two vibration elements to generate ultrasonic vibration when a driving voltage is applied to the vibration elements, at least three electrode portions wherein the vibration elements and the electrode portions is alternately arranged side by side in a vibrating direction, at least the three electrode portions includes at least two first electrode portions and at least one second electrode portion alternately arranged in the vibrating direction, the vibrator integrally vibrates ultrasonically in the vibrating direction when the driving voltage is applied to the first electrode portions and the second electrode portion, and a bridging portion coupling and electrically connecting two first electrode portions of at least the two first electrode portions with each other, and the ultrasonic vibration apparatus further includes an anti-vibration portion to suppress vibration of the bridging portion in any other direction except the vibrating direction. | 06-19-2014 |
20140203686 | RESONATOR AND FABRICATING METHOD THEREOF - Provided are a resonator and a method of fabricating the same. The resonator may include a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode, a second electrode disposed on the piezoelectric layer, and a control layer disposed on the second electrode and having a frame with an uneven surface. | 07-24-2014 |
20140210312 | METHOD OF DAMPING ACTUATOR WITH TRANSLATION MECHANISM AND ACTUATOR - According to one embodiment, a method of damping an actuator to reduce an amplitude of a resonance peak of the actuator, including a piezoelectric element and a translation mechanism, includes securing one surface of a restraint member having at least two surfaces to a movable part of the translation mechanism with an elastic or viscoelastic body therebetween, securing the other surface of the restraint member to a support portion of the translation mechanism with an elastic or viscoelastic body therebetween, and converting vibration energy of the movable part into thermal energy, based on distortion caused by deformation of the elastic or viscoelastic body. | 07-31-2014 |
20140265730 | Damper - An illustrative embodiment of a damper for use with rotary machinery may include a damper mass connected to an electronics housing via one or more piezo elements. The illustrative embodiment of the damper may include one or more electrical components wherein the electrical components, piezo elements, and/or damper mass may be tuned such that the damper is configured with an electrical resonance frequency corresponding to a mechanical resonance frequency present in a component of the rotary machinery. The piezo elements may be extension/retraction type or bending type, and they may have any orientation with respect to the rotational axis of the rotary machinery depending on the specific embodiment and/or application of the damper. | 09-18-2014 |
20140339958 | PIEZOELECTRIC VIBRATING DEVICE - Provided is a piezoelectric vibrating device including a case provided with a certain space therein, a piezoelectric vibrating member provided in the case and vibrating according to an applied voltage, a weight member provided in the case and connected to a part of the piezoelectric vibrating member in a vibration direction of the piezoelectric vibrating member, and a limitation member for limiting movement of the weight member. | 11-20-2014 |
20140346927 | VIBRATION GENERATING APPARATUS - There is provided a vibration generating apparatus including: a housing having an internal space; a vibrator disposed and vibrating within the housing; and a plurality of damper members installed in at least one of the housing and the vibrator and formed of different materials, wherein the plurality of damper members are overlapped and formed integrally with each other or are disposed to be adjacent to each other. | 11-27-2014 |
20150008794 | PIEZOELECTRIC-TYPE ELECTROACOUSTIC CONVERSION DEVICE - A lower surface of a circular support plate made of resin is fixed to an upper surface of a ring-shaped frame. A circular through hole is provided in a center portion of the support plate, a lower surface of a circular metal plate is fixed to a portion of an upper surface of the support plate positioned at the circumference of the through hole. An upper-groove is provided in a ring shape positioned inward of an upper surface of the metal plate. A shock absorbing member made of elastic materials is provided in the upper groove of the metal plate. A piezoelectric element is provided on a portion of the upper surface of the metal plate positioned inward from the shock absorbing member, and a portion of an upper surface of the shock absorbing member positioned on an inner periphery portion of the shock absorbing member. | 01-08-2015 |
20160074907 | VIBRATING GENERATING DEVICE - There is provided a vibration generating device including: a piezoelectric element which is deformed when power is applied thereto; an installation member below which the piezoelectric element is installed; a weight fixedly installed below the installation member to be disposed below the piezoelectric element; a plurality of elastic members connected to the installation member to change a displacement direction by deformation of the installation member and disposed to face each other; and a damper member fixedly installed on a lower surface of the weight, wherein a thickness of the damper member is determined to allow the damper member to be disposed in a space formed by the plurality of elastic members when the elastic members are driven normally. | 03-17-2016 |
310327000 | On back of piezoelectric element | 22 |
20080303381 | ULTRASONIC PROBE, BACKING MATERIAL FOR ULTRASONIC PROBE, AND METHOD OF MANUFACTURING THE SAME - A backing material that is advantageous in insulation property and can realize a desired acoustic impedance without making the cross-linking and curing reaction of elastomer or resin as a parent material unstable. The backing material is provided on a backside of vibrators for transmitting and/or receiving ultrasonic waves in an ultrasonic probe, and the backing material includes: a parent material containing elastomer or resin and having an insulation property; and composite powder dispersed to fill the parent material, and the composite powder includes powder of a material having a larger acoustic impedance than that of the parent material and an insulation coating for covering a surface of the powder, and the insulation coating contains an oxide of an element of group XIII to group XV except for carbon (C), nitrogen (N), phosphorus (P). | 12-11-2008 |
20090009035 | ACOUSTIC BACKING COMPOSITION, ULTRASONIC PROBE AND ULTRASONIC DIAGNOSTIC APPARATUS - Disclosed is an acoustic backing composition comprising an ethylene-vinyl acetate copolymer containing 20 to 80% by weight of the vinyl acetate units and a filler contained in the ethylene-vinyl acetate copolymer. | 01-08-2009 |
20090015101 | Embedded circuits on an ultrasound transducer and method of manufacture - One or more chips, integrated circuits, or semiconductors are embedded within a backing block. Planar sheets of backing material are formed with integrated circuits within holes in the sheets. Traces connect the integrated circuit to electrodes or exposed conductive surfaces. A plurality of the planar sheets may be manufactured using wafer processing, such as pick and place of chips in a wafer of backing material and IC redistribution for forming the traces. The different sheets are cut from the wafer and stacked adjacent each other. The transducer connects with the exposed electrodes or conductive surfaces of the backing. | 01-15-2009 |
20100176688 | PROBE FOR ULTRASONIC DIAGNOSTIC APPARATUS AND METHOD OF MANUFACTURING THE SAME - A probe for an ultrasonic diagnostic apparatus and a method of manufacturing the same are disclosed. The probe includes a backing layer having a first electrode part, a piezoelectric member connected to the first electrode part, a sound matching layer having a second electrode part connected to the piezoelectric member, and a PCB connected to the first and second electrode parts. The probe is configured to allow easy and rapid connection between the piezoelectric member and the PCB while providing improved durability and uniformity to a connected part between the piezoelectric member and the PCB, thereby enabling easy and rapid manufacture of the probe while preventing deterioration in performance caused by defective connection between the piezoelectric member and the PCB. | 07-15-2010 |
20110050039 | MULTILAYER ACOUSTIC IMPEDANCE CONVERTER FOR ULTRASONIC TRANSDUCERS - An impedance conversion layer useful for medical imaging ultrasonic transducers comprises a low impedance polymer layer and a high impedance metal layer. These layers are combined with corresponding thicknesses adapted to provide a function of converting from a specific high impedance to specific low impedance, wherein the polymer layer is at the high impedance side and the metal layer is at the low impedance side. The effective acoustic impedance of the polymer and metal layer combination may be adapted to configure an impedance converter in the same way as a quarter wavelength impedance converter, converting from low impedance to high impedance (metal to polymer) or from a high impedance to low impedance (polymer to metal). This structure may be used for front matching with the propagation medium and back matching with an absorber for ultrasonic transducers. | 03-03-2011 |
20110074246 | ULTRASONIC TRANSDUCER - An ultrasonic transducer includes a case, a reflective portion, and a piezoelectric body. The case has a substantially cylindrical shape including one closed end in the center axis direction that defines a top. The piezoelectric body is disposed on the inner surface of the top of the case. The reflective portion is arranged to oppose and be spaced apart from the piezoelectric body. The distance between the piezoelectric body and the reflective portion is greater than the maximum displacement of the piezoelectric body and is substantially an odd number multiple of a ¼ wavelength of sound waves or less than or equal to the ¼ wavelength. | 03-31-2011 |
20110181149 | ULTRASOUND TRANSDUCER, ULTRASOUND PROBE, AND A METHOD FOR MANUFACTURING ULTRASOUND TRANSDUCERS - In the ultrasound transducer of the present embodiment, front surface electrodes and rear surface electrodes are provided for a plurality of ultrasound vibrators. A circuit board is disposed on the rear surface side of the ultrasound vibrators, and connected to the rear surface electrodes. An electronic circuit is connected to the surface opposite to that of the rear surface electrodes side on the circuit board, and has signal paths to each ultrasound vibrator through the circuit board. A backing material is disposed on the rear surface side of the ultrasound vibrators, and is provided so as to sandwich between it and the ultrasound vibrators the circuit board and the electronic circuit. | 07-28-2011 |
20130002094 | MULTILAYER ACOUSTIC IMPEDANCE CONVERTER FOR ULTRASONIC TRANSDUCERS - An impedance conversion layer useful for medical imaging ultrasonic transducers comprises a low impedance polymer layer and a high impedance metal layer. These layers are combined with corresponding thicknesses adapted to provide a function of converting from a specific high impedance to specific low impedance, wherein the polymer layer is at the high impedance side and the metal layer is at the low impedance side. The effective acoustic impedance of the polymer and metal layer combination may be adapted to configure an impedance converter in the same way as a quarter wavelength impedance converter, converting from low impedance to high impedance (metal to polymer) or from a high impedance to low impedance (polymer to metal). This structure may be used for front matching with the propagation medium and back matching with an absorber for ultrasonic transducers. | 01-03-2013 |
20130020907 | WIRE BOND FREE CONNECTION OF HIGH FREQUENCY PIEZOELECTRIC ULTRASOUND TRANSDUCER ARRAYS - A piezoelectric ultrasound transducer array connected to a planar electronic component, the planar electronic component having one or more through hole adapted to receive a conducting element to provide an electrical connection which extends through the planar electronic component. | 01-24-2013 |
20130026885 | ULTRASONIC SENSOR - An ultrasonic sensor includes a case having an inner space provided therein, and having an upper stepped part and a lower stepped part respectively provided at an upper part and a lower part on an inside wall surface thereof; a piezoelectric element seated on a bottom surface of the case; a sound absorbent fixed above the piezoelectric element, a lateral portion of the sound absorbent being seated on the lower stepped part; and a substrate fixed above the sound absorbent, and configurated in a cross (+) shape of which respective lateral portions are seated on the upper stepped part. | 01-31-2013 |
20130038174 | ULTRASONIC SENSOR - Disclosed herein is an ultrasonic sensor including: a case including an inner space formed therein and including an electrode layer formed on an inner side wall surface thereof; a piezoelectric element seated on the electrode layer on a lower surface of the case, configured in a stack type, and including anode and cathode terminals formed on an outer peripheral surface thereof; a sound absorbing material fixed to an upper portion of the piezoelectric element; and first and second lead wires led from the outside of the case and electrically connected to the electrode layer formed on the inner side wall surface of the case. | 02-14-2013 |
20130088122 | DIRECT WRITING OF FUNCTIONALIZED ACOUSTIC BACKING - An acoustic transducer and method of making the acoustic transducer is disclosed. A transducer element for converting a signal between one of an electrical signal and an acoustic signal and the other of the electrical signal and the acoustic signal is provided. A backing to the transducer is additively fabricated to a side of the transducer element. The backing includes an electrically conductive path therein for conducting the electrical signal. | 04-11-2013 |
20130127295 | PIEZOELECTRIC MICRO POWER GENERATOR AND FABRICATION METHOD THEREOF - Disclosed are a piezoelectric micro power generator which converts mechanical energy to electric energy to produce electric power and a fabrication method thereof. The piezoelectric micro power generator according to an exemplary embodiment of the present disclosure includes a piezoelectric structure having a silicon base, a lower electrode formed on the silicon base, a piezoelectric film formed on the lower electrode and configured to generate electric energy in response to a change of mechanical strain, an upper electrode formed on the piezoelectric film and a proof mass coupled to a portion of a bottom surface of the silicon base and configured to control response characteristics to vibration frequency, and a frame having an opened cavity of a predetermined size and coupled to a portion of the bottom surface of the silicon base such that the proof mass is located within the cavity so as to suspend the piezoelectric structure. | 05-23-2013 |
20130134833 | ULTRASONIC SENSOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are an ultrasonic sensor and a method of manufacturing the same. The ultrasonic sensor includes: a case having one end closed and the other end opened; a piezoelectric element fixedly coupled to one end of an inner portion of the case; a sound absorbing member coupled to an upper surface of the piezoelectric element so as to cover a portion of the piezoelectric element; a conductive member having one end connected to the piezoelectric element and the other end connected to the sound absorbing member; and a lead wire electrically coupled to the conductive member and the case. | 05-30-2013 |
20130147316 | ENHANCED BANDWIDTH TRANSDUCER FOR WELL INTEGRITY MEASUREMENT - A single critically damped acoustic stack yields a wide frequency range as an acoustic transmitter or as an acoustic transducer having particular use in well integrity determination. The critically damped present acoustic stack utilizes a plurality of stacked acoustic elements such as piezoelectric ceramics that are energized in two manners, providing different center frequencies; each producing a respective center frequency of 100% bandwidth to yield an acoustic stack having a total bandwidth exceeding the bandwidth of an acoustic element or the bandwidth of the plurality of acoustic elements. One manner of energizing is to pulse only one of the acoustic elements. The other manner is to pulse a first acoustic element the pulse a second acoustic element after a delay equal to the amount of time it takes for the first pulse to reach the face of the second acoustic element. The acoustic elements are bonded together and onto a critically damped backing of tungsten. The assembly is retained in a housing that is preferably made of PEEK. The acoustic stack is primarily used in pulse-echo analysis of metal casing wall thickness and cement bond quality detection of wells. | 06-13-2013 |
20130169112 | ULTRASOUND PROBE AND MANUFACTURING METHOD THEREOF - An ultrasound probe including a backing layer provided with grooves in which a piezoelectric member is allowed to be installed and a manufacturing method thereof. The ultrasound probe includes the piezoelectric member, and the backing layer disposed on a rear-side surface of the piezoelectric member and provided, on a front-side surface thereof, with grooves in which the piezoelectric member is installed. | 07-04-2013 |
20130257226 | SIGNAL RETURN FOR ULTRASONIC TRANSDUCERS - A transducer useful for medical imaging ultrasonic transducers comprises a front impedance matching layer, a piezoelectric array, and a rear layer. The front impedance matching layer may include a return connection region electrically coupled to a distal end of the piezoelectric array and a front metal layer with a return signal portion for routing the return signal from the distal end of the transducer to a flex circuit of the rear layer at a proximal end of the transducer. In an embodiment, the rear layer may include a return connection region that is electrically coupled to the piezoelectric array at a distal end of the transducer and also electrically coupled to the signal return lines of a flex circuit at the distal end of the transducer. | 10-03-2013 |
20130342077 | LOW FREQUENCY BROAD BAND ULTRASONIC TRANSDUCERS - Low frequency pulse-echo ultrasonic transducers are provided especially suited for use in downhole cement bond evaluation, but usable for various applications. One frequency pulse-echo ultrasonic transducer comprises a transducer stack having alternating layers of a piezoceramic element and an ultrasonic attenuating element that is preferably acoustic impedance matched to the piezoceramic elements in order to reduce the Q of the transducer stack. Another low frequency pulse-echo ultrasonic transducer comprises an assembly having the present transducer stack disposed on an acoustic attenuating backing and a front face. Yet another low frequency pulse-echo ultrasonic transducer comprises a transducer composite made from a lead metaniobate. Still another frequency pulse-echo ultrasonic transducer comprises a composite stack. A further low frequency pulse-echo ultrasonic transducer comprises a composite stack, wherein multiple drive elements allow driving individual elements at different times. The transducers may be driven in a multiple-pulse time delayed manner. | 12-26-2013 |
20140145561 | ULTRASOUND BACKING ELEMENT, TRANSDUCER AND ULTRASOUND PROBE INCLUDING THE SAME - An ultrasound backing element, a transducer including the ultrasound backing element, and an ultrasound probe. The ultrasound backing element includes: a first concave/convex unit formed of a material capable of absorbing ultrasonic waves, and comprising a first surface and a second surface that are not in parallel with each other; and a first electrode unit comprising a first electrode and a second electrode that are respectively disposed on the first surface and the second surface. | 05-29-2014 |
20140184023 | Layout and Method of Singulating Miniature Ultrasonic Transducers - The present disclosure provides a method of singulating a plurality of miniature ultrasound transducers from a wafer. The method includes receiving a wafer on which a plurality of miniature ultrasound transducers is formed. The miniature ultrasound transducers each include a transducer membrane containing a piezoelectric material. The method includes etching, from a front side of the wafer, a plurality of trenches into the wafer. Each trench at least partially encircles a respective one of the miniature ultrasound transducers in a top view. Each trench includes an approximately rounded segment. The method includes thinning the wafer from a back side opposite the front side. The thinning the wafer is performed such that the trenches are open to the back side. The method includes performing a dicing process to the wafer to separate the miniature ultrasound transducers from one another. The dicing process is performed without making crossing cuts in the wafer. | 07-03-2014 |
20140292147 | ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF - An ultrasonic probe including an acoustic module including a transducer layer to generate an ultrasonic wave, a matching layer to reduce an acoustic impedance difference between the transducer layer and a subject, and a backing layer to absorb a ultrasonic wave generated from the transducer layer and proceeding toward a rear, and a plurality of lens layers configured to focus a ultrasonic wave proceeding toward a front of the transducer layer, and each including a different physical property, so that the reception of the ultrasonic wave signal is improved while maintaining wear resistance characteristic and chemical resistance characteristic, as well as the stability with respect to withstanding voltage. | 10-02-2014 |
20160375466 | ULTRASONIC PROBE - According to one embodiment, an ultrasonic probe includes piezoelectric elements, a flexible printed circuit, and one of an air gap layer and a resin layer. The piezoelectric elements transmit and receive ultrasonic waves. The flexible printed circuit located on a rear surface side of the piezoelectric elements and electrically connected to the piezoelectric elements. The air gap layer locates on a rear surface side of the flexible printed circuit and has air gaps. The resin layer is obtained by filling the air gap layer with a resin and locates on the rear surface side of the flexible printed circuit. | 12-29-2016 |