| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 264272140 |
Plural electrical components
| 24 |
| 264272150 |
With component positioning procedure or incorporation of article positioning means
| 21 |
| 264272170 |
Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
| 15 |
| 264272130 |
With curing procedure, or procedure or treatment to compensate for differential expansion
| 9 |
| 264272190 |
Dynamoelectric machine, electromagnet, transformer inductors, or coils | 3 |
| 20140151926 | METHOD OF RESIN SEALING PERMANENT MAGNETS IN LAMINATED ROTOR CORE - A laminated rotor core ( | 06-05-2014 |
| 20100127423 | FERRITE POWDER AND ITS PRODUCTION METHOD - On producing a ferrite sintered body, there is used a ferrite powder having a median diameter D | 05-27-2010 |
| 20140232039 | Method For Manufacturing Detecting Sensor, Detecting Sensor, and Transmission - A detecting sensor is disclosed having a magnet, a plurality of magnetic field detecting sensor elements, and a housing. The magnetic field detecting sensor elements have a plurality of adjacent, overlapped bodies and a plurality of terminals projecting from the bodies in a same direction. The housing is disposed over the magnet and plurality of sensor elements, and has first and second sensor holding members. The first sensor holding member is positioned on a first side of the housing and abutted against a surface of the body on a first side of the plurality of sensor elements. The second sensor holding member is positioned on a second side of the housing and abutted across a portion of a surface of the body of the sensor element on a second side of the plurality of sensor elements. | 08-21-2014 |
| 264272160 |
Transducer, or electric lamp or space discharge device | 1 |
| 20100164138 | Method for Making Shaped LED Light Bulb - A method for making an LED light bulb where the LED light bulb itself is molded into various shapes. The plastic lens used to surround the diode is shaped when manufactured to resemble various items, such as stars, crosses, hearts, trees, pinecones, bulbs, flat panels with designs, or any other shape the user desires. Because the entire light bulb is the LED, uniform and consistent light can be emitted from every part of the plastic lens that makes up the shaped LED light bulb, allowing the user to view the shaped LED light bulb from any angle. The shaped LED light bulb can be used individually, or strung together to form a strand of shaped lights. | 07-01-2010 |
| 264272210 |
Battery or part encapsulated | 1 |
| 20100258975 | METHOD AND APPARATUS FOR PRODUCING BATTERY PACK - A tensile stress is applied to solidified resin. The tensile stress is so small that the solidified resin formed in the sprue by solidification of molding material does not break and is so large that the solidified resin formed in the sprue is separated from the inner surface of the sprue due to a reduction in the diameter of the cross sectional area thereof. For the application of such a tensile stress, the runner stripper plate holding the solidified resin is moved away from the nozzle and sprue bushing. This state is maintained for a predetermined time to separate the solidified resin from the inner surface of the sprue. | 10-14-2010 |
| Entries |
| Document | Title | Date |
|---|
| 20090014909 | PRINTING DEVICE, PRODUCTION UNIT, AND PRODUCTION METHOD OF ELECTRONIC PARTS - A printing device, a production unit and a production method of electronic parts suitable for production of precise electronic parts are provided. A squeegee is attached to a rotating machine, and is autorotated and self-driven, and moreover, a printing pressure is generated in the squeegee, and resin is strongly filled, thereby achieving a print having a precision-shape. Further, with a perforated plate as a boundary, upper and lower chambers are provided so as to control a pressure, thereby performing cutting and dispensing of the resin and achieving a print having a precision-shape. This method is applied to the packaging of electronic parts. A printing device E | 01-15-2009 |
| 20090127740 | Use of polyamide compositions for making molded articles having improved adhesion, molded articles thereof and methods for adhering such materials - The present invention relates to the use of polyamide compositions comprising at least one semi-aromatic polyamide and at least one aliphatic semi-aromatic polyamide for making molded articles made of at least two moulded parts adhered to each other having improved adhesion. | 05-21-2009 |
| 20090200704 | COMPRESSION MOLDING METHOD FOR ELECTRONIC COMPONENT AND COMPRESSION MOLDING APPARATUS EMPLOYED THEREFOR - First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding. | 08-13-2009 |
| 20090267266 | INSERT-MOLDED COVER AND METHOD FOR MANUFACTURING SAME - The present invention relates to an insert-molded cover ( | 10-29-2009 |
| 20090278282 | INSERT-MOLDED COVER AND METHOD FOR MANUFACTURING SAME - The present invention relates to an insert-molded cover ( | 11-12-2009 |
| 20100013120 | TRANSFER MOLDING METHOD AND SYSTEM FOR ELECTRONIC DEVICES - A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot into a runner, and distributing the molding compound through the runner into the molding cavity in order to fill the molding cavity. A movable surface comprised in the molding cavity is positioned to form a first gap between the movable surface and the electronic device when the molding cavity is being filled. After filling the molding cavity with molding compound, the movable surface is driven to form a second gap between the movable surface and the electronic device which is smaller than the first gap, thereby compressing the molding compound in the molding cavity. A molded electronic device thus produced is then separated from the molding cavity. | 01-21-2010 |
| 20100038820 | METHOD OF FABRICATING AN ENTITY AND CORRESPONDING DEVICE - A method of fabricating an electronic entity includes the steps of: forming at least part of the entity by hardening a material ( | 02-18-2010 |
| 20100052212 | METHOD OF RESIN SEALING ELECTRONIC PART - A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus. | 03-04-2010 |
| 20100084786 | Making twist-on wire connectors - A method of making a twist-on wire connector including a method of making a sealant containing twist-on wire connector by in situ formation of a shell around the coil wherein a sealant may be injected into a cavity in the coil prior to removing the shell from the mold to form a ready-to-use sealant containing twist on wire connector without further steps outside the mold. | 04-08-2010 |
| 20100090369 | RESIN SEALING METHOD IN STACKED WIRING SUBSTRATE AND RESIN SEALING DEVICE - A resin sealing device includes a lower die, an upper die which is arranged over the lower die, on a lower surface side of which a concave portion is provided, and to a bottom surface peripheral portion of the concave portion of which a projection portion projecting toward an opening portion side of the concave portion to raise partially a bottom surface is provided, and a protection film provided on a lower surface side of the upper die and adhered along a concave surface of the concave portion by adsorbing, wherein the stacked wiring substrate is sealed with a resin by making a fused resin flow into a cavity including a space between the stacked wiring substrate from a resin supplying portion, in a state that the stacked wiring substrate in which a plurality of wiring substrates are stacked via connection bumps is arranged and sandwiched between the lower die and the concave portion of the upper die. | 04-15-2010 |
| 20100155991 | METHOD OF MANUFACTURING A BUSHING - A bushing can include a shoulder, a ring, and a ground shield. The ring can be arranged circumferentially around a first outside diameter of the bushing, wherein the ring includes a channel. The ground shield can include a semiconductive rubber collar that forms part of an outer surface of the bushing and extends circumferentially under a portion of the ring. The insulative portion can be adjacent to the ring and disposed over a portion of the ground shield. A method of manufacturing the bushing can include placing the ring and the ground shield into a mold, the ground shield including holes therein, and injecting insulative material into the mold to create an insulative layer within a cavity formed by the ring and the ground shield, the holes in the ground shield allowing some of the insulating material to flow therethrough to create the insulative portion adjacent the ring. | 06-24-2010 |
| 20100207295 | METHOD AND DEVICE FOR PRODUCING A MAGNETIC FIELD SENSOR - The invention relates to a method and a device for producing a magnetic field sensor ( | 08-19-2010 |
| 20110024944 | Process for producing a toothbrush - The invention relates to a process for producing a toothbrush having a body, which comprises a handle region, a head region and a neck region located between the handle region and the head region, and having functional elements which are arranged, at least in part, within the body and comprise an electrically operated functional unit and an electric supply device which has an energy store and is intended for the functional unit, in the case of which the body is produced, by injection molding, from at least one hard component, which serves as a reinforcement, and at least one soft component, and at least some of the functional elements, during the production of the body, are encapsulated, at least in part, directly by the plastic which forms the soft component. | 02-03-2011 |
| 20110233821 | COMPRESSION RESIN SEALING AND MOLDING METHOD FOR ELECTRONIC COMPONENT AND APPARATUS THEREFOR - A compression resin sealing apparatus includes cooling means ( | 09-29-2011 |
| 20120223457 | METHOD TO MANUFACTURE A SENSOR - A method to manufacture a sensor is provided and includes forming a foamed core of a first material with a hole defined therein, inserting a rod into the hole, filling the core with a slurry of a second material and curing the second material. | 09-06-2012 |
| 20120242000 | FPC CONNECTOR MANUFACTURING METHOD - An FPC connector is manufactured by pouring a resin material into a cavity defined by a mold through a gate formed to the mold so as to fill the cavity to thereby perform an injection molding of the FPC connector. In the manufacture, a mold to which a single gate is formed is used, and the gate is formed at a position between one end portion of the cavity and a portion apart inside by 15/100 of a full length of the cavity from one end in a longitudinal direction thereof. A liquid crystalline polyester may be preferable used as the resin material. | 09-27-2012 |
| 20150327372 | CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin. | 11-12-2015 |
| 20150360402 | METHOD OF MANUFACTURING CABLE WITH RESIN MOLDED BODY - A method of manufacturing a cable with resin molded body, wherein the cable with resin molded body includes a cable and a resin molded body formed by resin molding, wherein the resin molded body includes a main body to cover the tip portion of the cable and a flange integrally molded with the main body, and wherein the flange includes a bolt hole through which a bolt is inserted so as to fix the flange to the attachment object. The method includes molding the resin molded body by injecting a resin into a mold, the mold including a main body-molding portion for molding the main body, a flange-molding portion for molding the flange and an outlet formed behind the flange-molding portion in relation to the main body-molding portion, and draining the resin through the outlet during the molding of the resin molded body. | 12-17-2015 |
| 20150372438 | MOLDING METHOD USING MOLD STRUCTURE - A molding method includes: setting a bus bar at a first mold main body portion of a fixed mold by supporting a terminal base of a tuning-fork terminal with a terminal base receiving portion of the fixed mold in a state where the tuning-fork terminal is protruded outside a cavity formed by the first mold main body portion of the fixed mold and a second mold main body portion of a movable mold being joined together; joining the movable mold together with the fixed mold by abutting an abut step portion of the movable mold to a receiving abut step portion of the fixed mold and nipping the terminal base of the tuning-fork terminal with the terminal base receiving portion and a terminal base abut portion of the movable mold; and injecting resin into the cavity in the nipped state. | 12-24-2015 |
| 20160031134 | MOLDING AND OVERMOLDING COMPOSITIONS FOR ELECTRONIC DEVICES - The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C. | 02-04-2016 |
| 20160139632 | METHOD OF MANUFACTURING SURFACE PANEL - A method manufactures a front panel including a front panel body formed of a single transmissive resin layer and a sensor film attached thereto, using a first mold having a molding recessed portion and a second mold having a molding projecting portion. The first and second molds are joined together such that a cavity is formed between the molding recessed portion and the molding projecting portion, by placing the sensor film between the first mold and the second mold, on the molding projecting portion in the cavity. A melted resin is injected into the cavity to form the single transmissive resin layer having a front surface formed in a shape of the molding recessed portion, and a back surface formed along the sensor film in a shape of the molding projecting portion, thereby laminating the sensor film to the back surface of the transmissive resin layer. | 05-19-2016 |
