Class / Patent application number | Description | Number of patent applications / Date published |
264081000 | GAS OR VAPOR DEPOSITION OF ARTICLE FORMING MATERIAL ONTO MOLD SURFACE | 9 |
20090289390 | Direct silicon or reactive metal casting - A method for producing solid multicrystalline silicon ingots or wafers, comprising:
| 11-26-2009 |
20100032857 | Ceramic components, coated structures and methods for making same - Methods of forming ceramic components are disclosed. One method calls for chemical vapor depositing a ceramic material over a substrate having first and second opposite surfaces to define a coated structure, the ceramic material forming a layer overlying both the first and second opposite surfaces. The layer and the substrate have a difference in thermal expansion coefficients of at least 0.5 ppm/K. The substrate is removed, leaving behind the layer. Ceramic components and coated structures are also disclosed. | 02-11-2010 |
20100219548 | FINE-STRUCTURE TRANSFER APPARATUS AND METHOD - A fine-structure transfer method in which a fine-featured pattern formed on one of the two surfaces of a stamper is pressed against a coating of a resist on one of the two surfaces of a transfer element so as to transfer the fine-featured pattern to the resist coating, wherein the atmosphere in the space between the stamper and the transfer element is replaced by the vapor of the resist before the stamper is pressed against the transfer element. Also disclosed is a fine-structure transfer apparatus having at least a stamper and a stage on which to place a transfer element having a coating of a resist, further having a device for heating the resist coating to be vaporized or a device for supplying the vapor of the resist into the space between the stamper and the transfer element. | 09-02-2010 |
20110031640 | Process for Making Angstrom Scale and High Aspect Functional Platelets - A process for making functional or decorative flakes or platelets economically and at high production rates comprises applying a multi-layer sandwich of vapor deposited metal and release coats in alternating layers to a rotating chilled drum or suitable carrier medium contained in a vapor deposition chamber. The alternating metallized layers are applied by vapor deposition and the intervening release layers are preferably solvent soluble thermoplastic polymeric materials applied by vapor deposition sources contained in the vapor deposition chamber. The multi-layer sandwich built up in the vacuum chamber is removed from the drum or carrier and treated with a suitable organic solvent to dissolve the release coating from the metal in a stripping process that leaves the metal flakes essentially release coat free. The solvent and dissolved release material are then removed by centrifuging to produce a cake of concentrated flakes which can be air milled and let down in a preferred vehicle and further sized and homogenized for final use in inks, paints or coatings. In one embodiment the finished flakes comprise single-layer thin metal or metal alloy flakes or flakes of inorganic materials, and in another embodiment flakes are coated on both sides with protective polymeric coatings that were applied from suitable vacuum deposition sources or the like contained in the vapor deposition chamber. | 02-10-2011 |
20110304067 | AGGREGATE-BASED MANDRELS FOR COMPOSITE PART PRODUCTION AND COMPOSITE PART PRODUCTION METHODS - A method for forming a composite structure, using a mandrel that is later removed from the composite structure, involves production of a mandrel by depositing a particulate mixture, including an aggregate and a binder, into a mold and removing the mandrel from the mold. The mandrel may be treated while still in the mold by heating, curing with an agent, microwave energy, or by some combination thereof. Once finished, the mandrel can be used in manufacturing polymer and/or composite components. The mandrel can also include materials that can be easily removed from the finished composite structure by water, shakeout, chemically dissolving, or by some combination thereof. | 12-15-2011 |
20120199996 | COMPLEX PIERCED MICROMECHANICAL PART - The invention relates to a method of fabricating a micromechanical part ( | 08-09-2012 |
20130175726 | METHOD FOR MANUFACTURING SILICON WAFER - A method for manufacturing a silicon wafer is provided in which a low-temperature thermal process for growing a thermal donor to be a precipitate nucleus of BMD is not needed, a defect-free layer is formed in a surface layer portion even in a short thermal processing time, a BMD density is increased in a bulk portion. A silicon single crystal having a predetermined oxygen concentration and a predetermined nitrogen concentration is grown by Czochralski method in which nitrogen is added in an inert gas atmosphere containing hydrogen gas, by controlling V/G to form a region where a vacancy-type point defect exists, a silicon wafer sliced from the silicon single crystal is subjected to a planarization process and a mirror polish process, and this wafer is subjected to an RTP in an oxidizing gas atmosphere at a maximum achievable temperature from 1250° C. to 1380° C. for 1 second to 60 seconds. | 07-11-2013 |
20140015158 | VERTICALLY ALIGNED ARRAYS OF CARBON NANOTUBES FORMED ON MULTILAYER SUBSTRATES - Multilayer substrates for the growth and/or support of CNT arrays are provided. These multilayer substrates both promote the growth of dense vertically aligned CNT arrays and provide excellent adhesion between the CNTs and metal surfaces. Carbon nanotube arrays formed using multilayer substrates, which exhibit high thermal conductivity and excellent durability, are also provided. These arrays can be used as thermal interface materials. | 01-16-2014 |
20140015159 | ARRAY OF METALLIC NANOTUBES - A method for producing an array or bed of metallic nanotubes includes formation of nanowires made from sacrificial material on a growth support, deposition of a metal layer on the nanowires so as to form metallic nanotubes concentric with the nanowires, deposition of a polymer binding layer between the nanowires, elimination of the support, the binding layer supporting the metallic nanotubes, and etching of the sacrificial material. | 01-16-2014 |