Class / Patent application number | Description | Number of patent applications / Date published |
257789000 | With specified filler material | 29 |
20090057928 | Semiconductor Chip with Stratified Underfill - Various semiconductor chip underfills and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate to leave a gap therebetween, and forming an underfill layer in the gap. The underfill layer includes a first plurality of filler particles that have a first average size and a second plurality of filler particles that have a second average size smaller than the first average size such that the first plurality of filler particles is concentrated proximate the substrate and the second plurality of filler particles is concentrated proximate the semiconductor chip so that a bulk modulus of the underfill layer is larger proximate the substrate than proximate the semiconductor chip. | 03-05-2009 |
20090250826 | Process for manufacturing semiconductor device and semiconductor device manufactured by such process - A process for manufacturing a semiconductor device that inhibits deterioration in the quality of the semiconductor device and a semiconductor device manufactured on such manufacturing process are presented. An operation of determining time-variation of water content in the resin substrate | 10-08-2009 |
20100193972 | SPHERICAL SINTERED FERRITE PARTICLES, RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION COMPRISING THEM AND SEMICONDUCTOR DEVICES PRODUCED BY USING THE SAME - A resin composition for semiconductor encapsulation having good moldability, of which the cured product has effective electromagnetic wave shieldability, is provided. A resin composition for semiconductor encapsulation, containing spherical sintered ferrite particles having the following properties (a) to (c) : (a) the soluble ion content of the particles is at most 5 ppm; (b) the mean particle size of the particles is from 10 to 50 μm; (c) the crystal structure of the particles by X-ray diffractiometry is a spinel structure. | 08-05-2010 |
20100193973 | SEMICONDUCTOR WAFER COATED WITH A FILLED, SPIN-COATABLE MATERIAL - This invention is a semiconductor wafer having an active side and a back side opposite the active side, which back side is coated with a filled, spin-coatable coating, wherein the coating comprises a resin and a spherical filler characterized by an average particle diameter of greater than 2 μm and a single peak particle size distribution. In another embodiment the invention is a method for producing a spin-coatable, B-stageable coating with a thixotropic index of 1.2 or less. In a third embodiment the invention is a method for producing a coated semiconductor wafer. | 08-05-2010 |
20100237513 | APPLICATIONS OF SMART POLYMER COMPOSITES TO INTEGRATED CIRCUIT PACKAGING - Applications of smart polymer composites to integrated circuit packaging. | 09-23-2010 |
20100244286 | NANOCOMPOSITES FOR OPTOELECTRONIC DEVICES - Nanoparticles (<100 nm) and submicron particles (<400 nm) can be used as filler material to form a nanocomposite that can be used as an encapsulant for optoelectronic devices. These nanocomposites can function to reduce light scattering and increase thermal, mechanical and dimensional stability of the optoelectronic device. Such nanocomposites can also improve moisture barrier characteristics, lower the dielectric constant and increase resistivity of the optoelectronic device. | 09-30-2010 |
20100276818 | DEVICE COMPRISING AN ORGANIC COMPONENT AND AN ENCAPSULATION LAYER WITH A MOISTURE-REACTIVE MATERIAL - The device includes at least one optoelectronic component positioned on a substrate and at least one transparent face. The component is covered by a packaging layer which includes at least one barrier layer and a moisture-reactive layer. The reactive layer includes a moisture-reactive material chosen from alkaline-earth metals, alkali metals and organo-metallic derivatives. The material can be positioned in the moisture-reactive layer in the form of a continuous layer or in the form of a plurality of nodules dispersed in an organic matrix. | 11-04-2010 |
20110140289 | RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE - A resin composition containing a silica-based filler which differs in refractive index by ±0.03 from the curable base resin and has a thermal conductivity no lower than 0.5 W/m·K, and a light-emitting diode encapsulated with said resin composition. The resin composition is preferably prepared from a curable silicone resin which imparts a cured product having a refractive index of 1.45 to 1.55 and cristobalite powder dispersed therein. | 06-16-2011 |
20110147954 | SEMICONDUCTOR DEVICE, AND RESIN COMPOSITION USED FOR SEMICONDUCTOR DEVICE - A semiconductor device of the present invention ( | 06-23-2011 |
20110156283 | Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages - A microelectronic package comprises a die ( | 06-30-2011 |
20110241227 | LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - The invention is aimed at providing a liquid resin composition capable of densely containing a filler and of filling up a narrow gap in a flip-chip-bonded semiconductor device, and a highly-reliable semiconductor device using the same. The liquid resin composition of the present invention contains (A) an epoxy resin; (B) an epoxy resin curing agent; and (C) a filler, wherein content of (C) the filler is 60% by weight or more and 80% by weight or less of the whole liquid resin composition, and contact angle (θ) of the liquid resin composition, measured at 110° C. in accordance with JIS R3257, is 30° or smaller. | 10-06-2011 |
20120018906 | CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - In a circuit device of the present invention, the lower surface side of a circuit board and part of side surfaces thereof are covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved. | 01-26-2012 |
20120080809 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is a resin composition for encapsulating a semiconductor containing a curing agent, an epoxy resin (B) and an inorganic filler (C), wherein the curing agent is a phenol resin (A) having a predetermined structure. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor. | 04-05-2012 |
20120146248 | Resin Composition for Encapsulation and Semiconductor Unit Encapsulated with Resin - A resin composition for encapsulation, which contains 100 parts by weight of a synthetic resin, 10 to 500 parts by weight of a carbon precursor having a volume resistivity of 10 | 06-14-2012 |
20130009327 | RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING SAME - Disclosed is a resin composition for semiconductor encapsulation, containing an epoxy resin (A), a curing agent (B), and an inorganic filler material (C), the epoxy resin (A) including an epoxy resin (A-1) represented by formula (1), and the epoxy resin (A-1) containing a component represented by the formula (1) in which n≧1, and a component (a1) represented by the formula (1) in which n=0 (wherein in the formula (1), R1 represents a hydrocarbon group having 1 to 6 carbon atoms; R2 represents a hydrocarbon group having 1 to 6 carbon atoms, or an aromatic hydrocarbon group having 6 to 14 carbon atoms, while R1s and R2s may be respectively identical with or different from each other; a represents an integer from 0 to 4; b represents an integer from 0 to 4; and n represents an integer of 0 or larger). | 01-10-2013 |
20130062789 | MANUFACTURING A FILLING OF A GAP REGION - A method of manufacturing a filling of a gap region. The method includes the steps of: applying a carrier fluid and filler particles in a gap region between a first surface and a second surface; exposing the filler particles to a force field for driving the filler particles towards a preferred direction; and withholding the filler particles in a gap region by using a barrier element for forming a path of attached filler particles between the first surface and the second surface. | 03-14-2013 |
20130087933 | STRUCTURE FOR ENCAPSULATING AN ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A STRUCTURE - A structure for encapsulating at least one electronic device, including at least one first cavity bounded by a support and at least one cap provided on the support and wherein the electronic device is encapsulated, at least one aperture passing through the cap and communicating the inside of the first cavity with at least one portion of getter material provided in at least one second cavity which is arranged on the support and adjacent to the first cavity, at least one part of said portion of getter material being provided on the support or against at least one outer side wall of the first cavity, the first cavity and the second cavity forming together a hermetically sealed volume. | 04-11-2013 |
20130134608 | FUNCTIONAL PARTICLE, FUNCTIONAL PARTICLE GROUP, FILLER, RESIN COMPOSITION FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE - A functional particle ( | 05-30-2013 |
20130307167 | PHENOLIC OLIGOMER AND METHOD FOR PRODUCING THE SAME - The present invention relates to techniques including a phenolic oligomer of general formula (1): | 11-21-2013 |
20140197552 | CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT - A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation material at least partially surrounding the at least one chip and the carrier top side, wherein the encapsulation material is formed on one or more lateral sides of the carrier; and a ceramic material disposed on a carrier bottom side, and on at least one side of the encapsulation material. | 07-17-2014 |
20150028498 | MOLDING COMPOSITION FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME - Disclosed herein are a molding composition for a semiconductor package including a liquid crystal thermosetting polymer resin and graphene oxide to thereby effectively decrease coefficient of thermal expansion (CTE) and warpage and maximize an effect of thermal conductivity, and a semiconductor package using the same. | 01-29-2015 |
20150318228 | MODULE AND METHOD FOR PRODUCING MODULE - The present disclosure is intended to provide a module in which connection reliability between a wiring substrate and an electronic component mounted on the wiring substrate can be improved. A module | 11-05-2015 |
20150371924 | HEAT RELEASING SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a heat releasing semiconductor chip package includes attaching a first surface of a semiconductor chip onto an insulating film, injecting a coating liquid onto a second surface of the semiconductor chip to form a liquefied coating layer and curing the liquefied coating layer to form a heat releasing layer. The coating liquid includes a liquefied molding compound for heat releasing and fine alumina particles. Therefore, the heat releasing semiconductor chip package and method for manufacturing the semiconductor chip package form a heat releasing layer in direct contact with the semiconductor chip to maximize a heat releasing effect. | 12-24-2015 |
20160005671 | RESIN-SEALED ELECTRONIC CONTROL DEVICE - The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group. | 01-07-2016 |
20160013113 | PHOTOCOUPLER | 01-14-2016 |
20160035640 | UNDERFILL FILM, SEALING SHEET, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - The present invention provides an underfill film and a sealing sheet that are excellent in thermal conductive property and are capable of satisfactorily filling the space between the semiconductor element and the substrate. The present invention relates to an underfill film having a resin and a thermally conductive filler, in which a content of the thermally conductive filler is 50% by volume or more, an average particle size of the thermally conductive filler is 30% or less of a thickness of the underfill film, and a maximum particle size of the thermally conductive filler is 80% or less of the thickness of the underfill film. | 02-04-2016 |
20160186024 | LIQUID UNDERFILL MATERIAL COMPOSITION FOR SEALING SEMICONDUCTOR AND FLIP-CHIP SEMICONDUCTOR DEVICE - Provided is a liquid underfill material composition which has a favorable curing property without adding a curing catalyst; a favorable thin film penetration ability derived from its low viscosity; a favorable adhesiveness; and a high heat resistance property. The liquid underfill material composition for sealing a semiconductor contains specific amounts of: | 06-30-2016 |
20160379942 | Self-Destructive Circuits Under Radiation - Circuits which self-destruct under radiation are provided. In one aspect, a method for creating a radiation-sensitive circuit is provided. The method includes the step of: connecting an integrated circuit to a power supply and to a ground in parallel with at least one dosimeter device, wherein the dosimeter device is configured to change from being an insulator to being a conductor under radiation. Radiation-sensitive circuits are also provided. | 12-29-2016 |
20180025958 | BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | 01-25-2018 |