| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 257703000 | Composite ceramic, or single ceramic with metal | 9 |
| 20080296753 | MOLDED CERAMIC SURFACE MOUNT PACKAGE - The surface mount package is assembled from a ceramic base which is imprinted on its upper and lower surfaces with conductive patterns for attachment of and connection to an electronic or electromechanical device, a molded dielectric layer for forming a cavity and a seal ring. The molded dielectric is formed by aligning a dielectric preform with the base, positioning the seal ring on top of the preform, then applying a mold over the layers to shape the dielectric during a firing process that fuses the base, preform and seal ring to create a hermetic seal. The preform is of sufficient thickness that the electronic device will be fully contained within the cavity when placed into the completed package. | 12-04-2008 |
| 20090079060 | METHOD AND STRUCTURE FOR DISPENSING CHIP UNDERFILL THROUGH AN OPENING IN THE CHIP - A method of making an integrated circuit package includes forming a through hole in an integrated circuit and assembling a die containing the integrated circuit on a carrier so that the die is mechanically and electrically connected to the carrier. Thereafter, an underfill material is dispensed between the die and the carrier via the through hole. | 03-26-2009 |
| 20090174063 | Semiconductor Module - A semiconductor module | 07-09-2009 |
| 20090261471 | RF POWER TRANSISTOR PACKAGE - An RF power transistor package with a rectangular ceramic base can house one or more dies affixed to an upper surface of the ceramic base. Source leads attached to the ceramic base extend from at least opposite sides of the rectangular base beneath a periphery of a non-conductive cover overlying the ceramic base. The cover includes recesses arranged to receive the one or more die, the ceramic base, gate and drain leads and a portion of the source leads. The cover further includes bolt holes arranged to clamp the ceramic base and source leads to a heat sink. Bosses at corners of the cover outward of the bolt holes exert a downward bowing force along the periphery of the cover between the bolt holes. | 10-22-2009 |
| 20100065962 | POWER SEMICONDUCTOR MODULE - A semiconductor module includes a multilayer substrate. The multilayer substrate includes a first metal layer and a first ceramic layer over the first metal layer. An edge of the first ceramic layer extends beyond an edge of the first metal layer. The multilayer substrate includes a second metal layer over the first ceramic layer and a second ceramic layer over the second metal layer. An edge of the second ceramic layer extends beyond an edge of the second metal layer. The multilayer substrate includes a third metal layer over the second ceramic layer. | 03-18-2010 |
| 20100078805 | METHOD AND CORE MATERIALS FOR SEMICONDUCTOR PACKAGING - A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element. | 04-01-2010 |
| 20110074010 | POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE - A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %. | 03-31-2011 |
| 20150375993 | MEMS PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A MEMS package structure is disclosed. The MEMS package structure includes a first glass substrate on a micro-electromechanical systems (MEMS) structure, a sealant adhered between the first glass substrate and the MEMS structure; and a first moisture barrier on the sidewalls of the first glass substrate, the sealant, and the MEMS structure. | 12-31-2015 |
| 20160111377 | Molded Device with Anti-delamination Structure Providing Multi-layered Compression Forces - The present invention provides a molded encapsulated multi-layered semiconductor device, comprising a first substrate, a second substrate and an anti-delamination structure (ADS). The ADS comprises a connecting part and extended structures, and is filled by an insulating material. The present invention is able to provide the molded semiconductor device with higher reliability and longer lifetime through reduction of shear stress generated from the coefficient of thermal expansion mismatch between a silicon die and the substrates by mechanically locking with the ADS. | 04-21-2016 |
