| Entries |
| Document | Title | Date |
|---|
| 20080283847 | Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities - An integrated circuit package includes an angled one-piece substrate having a light source fixed to one area and a sensor die fixed to a second area, such that the light source is directed to illuminate the field of view of the sensor die when a surface of interest is imaged. The integrated circuit package is well suited for generating navigation information regarding movement relative to a surface. In one method of forming the integrated circuit package, the single-piece substrate is originally a generally flat lead frame to which the sensor die and light source are attached. After the components have been connected, the lead frame is bent to provide the desired light source-to-sensor angle. In an alternative method, the lead frame is pre-bent. For either method, optics may be connected to the integrated circuit package, thereby providing a module that includes the optics, the light source, the sensor and the packaging body. | 11-20-2008 |
| 20080315214 | Solderless Integrated Package Connector and Heat Sink for LED - Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body. | 12-25-2008 |
| 20090206349 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced and a method of manufacturing the same. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A first supporting body | 08-20-2009 |
| 20090230408 | OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optical device includes a semiconductor substrate including a device region formed thereon, the device region including at least one of a light-receiving region and a light-emitting region; a light-transmissive flattening film covering the device region, and including a first concave portion located in a region on an outer side of the device region; a light-transmissive member formed on the light-transmissive flattening film; and a light-transmissive adhesive layer bonding together the light-transmissive flattening film and the light-transmissive member, and filling the first concave portion. | 09-17-2009 |
| 20090236613 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - According to the present invention, a protective seal S | 09-24-2009 |
| 20090250707 | Multi-chip assembly with optically coupled die - Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed. | 10-08-2009 |
| 20090261352 | LIGHT EMITTING MODULE - A light emitting module includes a dielectric substrate, a solar cell unit, a metal pattern layer, light emitting units, and a power storage component. The dielectric substrate has a first surface and a second surface opposite to the first surface. The solar cell unit is positioned on the first surface. The metal pattern layer is positioned on the second surface. The light emitting units is positioned on the metal pattern layer. The power storage component includes a power charge port electrically coupled to the solar cell unit, and a power supply port electrically coupled to the metal pattern layer. | 10-22-2009 |
| 20090302329 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The invention is directed to providing a smaller semiconductor device formed as an optical sensor including a light receiving portion and a light emitting portion. A light receiving portion and a light emitting portion are disposed on a front surface of a semiconductor substrate for forming a semiconductor die, and a supporting body is attached to these so as to face these with an adhesive being interposed therebetween. A first opening exposing the light receiving portion from the front side of the supporting body is provided, and in a separated position therefrom, a second opening exposing the light emitting portion from the front side of the supporting body is provided. A first electrode and a second electrode are further disposed on the front surface of the semiconductor substrate, and bump electrodes electrically connected to these are disposed on the back surface of the semiconductor substrate. | 12-10-2009 |
| 20090315041 | OPTICAL MEMBER AND METHOD FOR MANUFACTURING OF OPTICAL MEMBER - There is provided an optical member | 12-24-2009 |
| 20090321750 | SURFACE MOUNT DEVICE - The disclosed subject matter is directed to a reliable surface mount device using a ceramic package, and includes LED devices that are simply composed and incorporate the use of the surface mount device. The surface mount device can include a ceramic package, a semiconductor optical chip mounted in the package, two soldering pads electrically connected to the chip electrodes and at least one dummy soldering pad located on either side of the soldering pads. Thermal fatigue located at or in the soldering connections connecting the chip electrodes to a mounting board can be reduced because the distance between the soldering pads can be reduced. The dummy soldering pad that is electrically insulated can allow the device to maintain a desirable location with poise during the reflow soldering process that occurs during manufacture, and can also reduce shear stress present at the soldering connections. Thus, the surface mount device and the LED device using the disclosed structure can maintain a high reliability even under harsh environmental conditions. | 12-31-2009 |
| 20100006863 | OPTICAL SEMICONDUCTOR DEVICE - A metal pattern for a high frequency signal is patterned on a flexile substrate, and the flexile substrate is bent in such a way as to form a substantially right angle at a spot corresponding to an end of the metal pattern for the signal. And an end of the metal pattern is fixedly attached to a lead pin for signaling, attached to a stem, for electrical continuity, so as to be in a posture horizontal with each other. Meanwhile, a part of the lead pins attached to the stem, being in such a state as penetrated through respective holes provided in the flexible substrate, is fixedly attached to a part of metal patterns provided on the flexible substrate so as to ensure electrical continuity therebetween. | 01-14-2010 |
| 20100025697 | OPTICAL MODULE - An optical module of the present invention includes a semiconductor device, a grounded metal member for mounting the semiconductor device thereon, a substrate for mounting the grounded metal member thereon, and a lead pin fixed to and insulated from the grounded metal member and soldered to the substrate. The lead pin is used to supply power to the semiconductor device. The grounded metal member has a protrusion on a surface thereof facing the substrate and wherein the protrusion of the grounded metal member is in contact with the substrate. | 02-04-2010 |
| 20100065858 | Semiconductor device including a plurality of semiconductor substrates and method of manufacturing the same - In a semiconductor device, a first semiconductor substrate includes a first element on a first-surface side thereof, and a second semiconductor substrate includes a second element and a wiring part on a first-surface side thereof. The first semiconductor substrate and the second semiconductor substrate are attached with each other in such a manner that a first surface of the first semiconductor substrate is opposite a first surface of the second semiconductor substrate. A hole is provided from a second surface of the first semiconductor substrate to the wiring part through the first semiconductor substrate, and a sidewall of the hole is insulated. A drawing wiring part made of a conductive member fills the hole. | 03-18-2010 |
| 20100078655 | Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same - The present invention comprises a first substrate with a die formed on a die metal pad, a first and a second wiring circuits formed on the surfaces of the first substrate. A second substrate has a die opening window for receiving the die, a third wiring circuit is formed on top surface of the second substrate and a fourth wiring circuit on bottom surface of the second substrate. An adhesive material is filled into the gap between back side of the die and top surface of the first substrate and between the side wall of the die and the side wall of the die receiving through hole and the bottom side of the second substrate. During the formation, laser is introduced to cut the backside of the first substrate and an opening hole is formed in the first substrate to expose a part of the backside of the Au or Au/Ag metal layer of chip/die. | 04-01-2010 |
| 20100171127 | OPTICALLY COUPLED DEVICE AND METHOD OF MANUFACTURING THE SAME - An optically coupled device includes a light emitting element and a light receiving element which are electrically isolated from each other, and an optical waveguide allowing therethrough transmission of light from the light emitting element to the light receiving element, wherein the optical waveguide is covered with an encapsulation resin containing a light reflective inorganic particle which is typically composed of titanium oxide, the light emitting element and the light receiving element are respectively provided on a base (for example, package terminals), and the entire portion of the outer surface of the optical waveguide, brought into contact with none of the light emitting element, the light receiving element and the base, is covered with the encapsulation resin. | 07-08-2010 |
| 20100193803 | Stacked Micro Optocouplers and Methods of Making the Same - Disclosed are packages for optocouplers and methods of making the same. An exemplary optocoupler comprises a substrate having a first surface and a second surface, a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's first surface, and a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's second surface. The substrate may comprise a pre-molded leadframe, and electrical connections between optoelectronic dice on opposite surfaces of the substrate may be made via one or more leads of the leadframe. | 08-05-2010 |
| 20100219420 | FK Module and Method for the Production Thereof - A module and method of its production in which areal electronic components are formed. The module includes (a) a cover electrode covering the electronic components; (b) a flexibly deformable substrate; (c) a base electrode formed on the substrate; and (d) an optically active layer faulted on the base electrode. The electronic components are formed on the flexibly deformable substrate by the optically active layer, the cover electrode; and the base electrode. The cover electrode projects over the optically active layer at a first side and the base electrode extends beyond the optically active layer at a second side which is oppositely disposed with regards to the first side. The components are arranged at a spacing from one another on the substrate and thereby a free substrate surface is present between components so that, on a folding in a region of the free substrate surface, the base electrode and the cover electrode are adjacent and contact one another areally and an electrically conductive touching contact is established. The electronic components are electrically connected in series with one another. | 09-02-2010 |
| 20100219421 | METHOD AND SYSTEM FOR ELECTRICALLY COUPLING A CHIP TO CHIP PACKAGE - A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds. | 09-02-2010 |
| 20110031509 | LED MODULE AND LIGHTING DEVICE USING THE SAME - The LED module comprises a flexible wiring substrate and surface mounting type LED packages. The flexible wiring substrate is formed at its surface with power supply terminals which comprises a first electrode pad and a second electrode pad, and is formed with a patterned wiring being electrically connected to the patterned wiring. The surface mounting type LED package comprises an LED chip and a mounting substrate. The mounting substrate is formed at its front surface with a recess, and its rear surface with a first connection electrode and the second connection electrode which are electrically connected to the first electrode pad and the second electrode pad, respectively when the mounting substrate is mounted on the flexible wiring substrate. The LED chip is disposed within the recess so as to receive the electrical current through the outside connection electrode and the power supply terminal. | 02-10-2011 |
| 20110057203 | PACKAGE CARRIER - A package carrier suitable for carrying at least one light emitting device and at least one light receiving device includes a carrier substrate and a metal sheet. The carrier substrate includes a first carrying area and a second carrying area. The light emitting device is disposed in the first carrying area and the light receiving device is disposed in the second carrying area. The metal sheet is disposed in the carrier substrate and located between the first carrying area and the second carrier area, for blocking optical signal transmission between the light emitting device and the light receiving device. | 03-10-2011 |
| 20110108857 | HOUSING FOR HIGH-POWER LEDS - The present invention relates to a housing for radiation-emitting or radiation-receiving optoelectronic components, such as LEDs, and to a method for producing said housing. The housing comprises a composite assembly comprising a base pan ( | 05-12-2011 |
| 20110127546 | REFLECTIVE SECONDARY LENS SYSTEM AND SEMICONDUCTOR ASSEMBLY AND ALSO METHOD FOR THE PRODUCTION THEREOF - The present invention relates to a reflective and/or refractive secondary lens system for focusing sunlight onto semiconductor elements, the secondary lens system being characterised according to the invention by a projection which is disposed around the basic body forming the secondary lens system. Furthermore, the present invention relates to a semiconductor assembly which includes the secondary lens system according to the invention, and also to a method for the production of this semiconductor assembly. In particular, this semiconductor assembly represents a concentrating solar cell module. | 06-02-2011 |
| 20110215341 | Biometric Sensor Assembly With Integrated Visual Indicator - A biometric sensor assembly comprises a substrate to which is mounted a die containing sensor circuitry, at least one conductive bezel having a visual indicator region formed therein, and electrically connected to said die by way of said substrate, a light source, and a light-directing region directing light from the light source to the visual indicator region. The die, the light-directing region, and the bezel are encased in an encapsulation structure such that a portion of a surface of the die and the visual indication region are exposed or at most thinly covered by the encapsulation structure. The light-directing region directs light emitted by the light source within the encapsulation structure to the visual indicator region. Desired indicia in the visual indicator region may thereby be illuminated, while the die and bezel, and optionally the light source, are protected by the encapsulation structure. | 09-08-2011 |
| 20110215342 | LED PACKAGING WITH INTEGRATED OPTICS AND METHODS OF MANUFACTURING THE SAME - Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of patterned metal contacts on a front side. The metal contacts may be in electrical communication with control logic formed in the substrate. The LEDs mounted on the packaging substrate may also be encapsulated individually or in groups and then singulated, or the LEDs mounted on the packaging substrate may be integrated with a micro-mirror array or an array of lenses. | 09-08-2011 |
| 20110215343 | Semiconductor device and optical pickup device - By increasing the width of a lead terminal | 09-08-2011 |
| 20110241023 | MULTICHIP LIGHT EMITTING DIODE (LED) AND METHOD OF MANUFACTURE - The present invention provides a multichip LED and method of manufacture in which white light is produced. Specifically, a plurality of electrically interconnected LED chips (e.g., interconnected via red metal wire) is selected for conversion of light to white light. In a typical embodiment, the LED chips comprise: a blue LED chip, a red LED chip, a green LED chip, and a target LED chip whose light output is converted to white light. A wavelength of a light output by one or more of the plurality of chips will be measured. Based on the wavelength measurement, a conformal coating is applied to the one or more of the LED chips. The conformal coating has a phosphor ratio that is based on the wavelength. Moreover, the phosphor ratio is comprised of at least one of the following colors: yellow, green, or red. Using the conformal coating the light output of the target LED is then converted to white light. In a typical embodiment, these steps are performed at the wafer level so that uniformity and consistency in results can be better obtained. Several different approaches can be implemented for isolating the coating area. Examples include the use of a paraffin wax, a silk screen, or a photo resist. Regardless, this approach allows multiple chips to be treated simultaneously. | 10-06-2011 |
| 20110272713 | OPTOELECTRONIC COMPONENT - An optoelectronic component includes a connection carrier on which at least two radiation-emitting semiconductor chips are arranged, a conversion element fixed to the connection carrier, wherein the conversion element spans the semiconductor chips such that the semiconductor chips are surrounded by the conversion element and the connection carrier, and at least two of the radiation-emitting semiconductor chips differ from one another with regard to wavelengths of electromagnetic radiation they emit during operation, wherein the conversion element spans the semiconductor chips as a dome. | 11-10-2011 |
| 20110297967 | SEMICONDUCTOR LIGHT-RECEIVING ELEMENT AND OPTICAL MODULE - A semiconductor light-detecting element includes: a semiconductor substrate of a first conductivity type having a band gap energy, a first principal surface, and a second principal surface opposed to the first principal surface; a first semiconductor layer of the first conductivity type on the first principal surface and having a band gap energy smaller than the band gap energy of the semiconductor substrate; a second semiconductor layer of the first conductivity type on the first semiconductor layer; an area of a second conductivity type on a part of the second semiconductor layer; a first electrode connected to the second semiconductor layer; a second electrode connected to the area; and a low-reflection film on the second principal surface. The second principal surface is a light-detecting surface detecting incident light, and no substance or structure having a higher reflection factor, with respect to the incident light, than the low-reflection film, is located on the second principal surface. | 12-08-2011 |
| 20120025209 | OPTICAL CONNECTION THROUGH SINGLE ASSEMBLY OVERHANG FLIP CHIP OPTICS DIE WITH MICRO STRUCTURE ALIGNMENT - A system includes an optical transceiver assembly, including a flip chip connection of a semiconductor die with a photonic transceiver that overhangs a substrate to which it is to be connected. The assembly further includes an alignment pin that is held to the semiconductor die at a micro-engineered structure in the semiconductor die. The alignment pin provides passive alignment of the photonic transceiver with an optical lens that interfaces the photonic transceiver to one or more optical channels. | 02-02-2012 |
| 20120025210 | OPTICAL MODULE ENCLOSING LEAD FRAME AND SEMICONDUCTOR OPTICAL DEVICE MOUNTED ON THE LEAD FRAME WITH TRANSPARAENT MOLD RESIN - An optical module with a new arrangement is disclosed. The optical module molds devices with a resin transparent to light subject to the device mounted on the lead frame and electrically connected with the lead frame by the bonding wire. The lead frame provides a screen apart from the device by a distance substantially comparable with a dimension of the device. The screen compensates the stress induced in the bonding wire due to a large discrepancy on the thermal expansion coefficient of the transparent resin. | 02-02-2012 |
| 20120091473 | ELECTRONIC DEVICE WHICH PERFORMS AS LIGHT EMITTING DIODE AND SOLAR CELL - An electronic device performing as a light emitting diode and a solar cell, and which comprises: a solar cell unit including a first electrode layer, an energy-level compensation layer formed on the first electrode layer, a photoelectric-conversion layer formed on the energy level compensation layer, and a shared electrode layer formed on the photoelectric-conversion layer; and a light emitting diode unit including the shared electrode layer, and a light emitting layer formed on the shared electrode layer and a second electrode layer formed on the light emitting layer, wherein a LUMO energy-level of the energy-level compensation layer is smaller than a work function of the first electrode layer and is larger than a LUMO energy level of the photoelectric-conversion layer, thereby increasing the generating efficiency of the solar cell unit or the luminous efficiency of the light emitting diode unit due to high electron mobility among the respective layers. | 04-19-2012 |
| 20120138961 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor package structure includes a package substrate, at least a chip, solder balls, a light emitting/receiving device, a optical intermediary device and an optical transmission device. The package substrate has a first surface, a second surface, a circuit and solder ball pads, wherein each solder ball pad is electrically connected to the circuit. The chip is disposed on the first surface and electrically connected to the circuit. The solder balls are respectively disposed on the solder ball pads. The light emitting/receiving device is disposed on the package substrate and electrically connected to the circuit. The optical intermediary device is disposed above the light emitting/receiving device. The optical transmission device is inserted in the optical intermediary device, wherein a light emitting by the light emitting/receiving device is emitted to the optical transmission device via the optical intermediary device so that an optical signal is transmitted through the optical transmission device. | 06-07-2012 |
| 20120138962 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a number of light emitting diode chips, a number of color sensor modules, and a reflecting cup around the light emitting diode chips. Each light emitting diode chip has a main light emitting surface and a sub light emitting surface opposite to the main light emitting surface. Intensities of light from the light emitting diode chips are detected by the color sensor modules for adjusting color temperatures of the light from the light emitting diode chips. | 06-07-2012 |
| 20120199851 | SEMICONDUCTOR RELAY - A semiconductor relay includes two MOSFETs; a light emitting element; a light-receiving drive element for switching on and off the two MOSFETs; two output and two input conductor plates electrically connected to the two MOSFETs and the light emitting element, respectively; and an encapsulating resin encapsulating the two MOSFETs, the light emitting element, the light-receiving drive element, the two output and the two input conductor plates. The two output and two input conductor plates includes terminal portions which protrude outside the encapsulating resin and are mounted on a common printed circuit board. Further, the two output conductor plates includes mount portions on which the two MOSFETs are mounted or on which drain electrodes of the two MOSFETs are connected, and the mount portions are encapsulated by the encapsulating resin in such an orientation that a thickness direction of the mount portions intersects that of the printed circuit board. | 08-09-2012 |
| 20120286295 | Organic Light-Emitting Display Device - An organic light-emitting display device comprises a substrate including a plurality of light-emitting regions separated by a non-light-emitting region, an organic light-emitting element disposed on each of the light-emitting regions, and a photoactive element disposed on the non-light-emitting region. | 11-15-2012 |
| 20130037826 | LED PACKAGE MODULE AND MANUFACTURING METHOD THEREOF - A light emitting diode (LED) package module and the manufacturing method thereof are presented. A plurality of LEDs and a plurality of semiconductor elements are disposed on a silicon substrate, and then a plurality of lenses is formed above the positions of the plurality of the LEDs, and the plurality of the lenses is corresponding to the plurality of the LEDs. Then, a plurality of package units is defined on the silicon substrate, and each package unit has a semiconductor element and at least one LED. After that, the silicon substrate is cut to form a plurality of LED package modules, and each LED package module has at least one package unit. | 02-14-2013 |
| 20130049019 | DISPLAY DEVICE - Exemplary embodiments of the described technology relate generally to display devices including dye-sensitized solar cells. The display device according to an exemplary embodiment includes a display element for displaying an image, and a dye-sensitized solar cell for converting light into electricity to offset the power consumption of the display element. The dye-sensitized solar cell includes a selective photo-absorption material for selectively absorbing light from at least one wavelength band. | 02-28-2013 |
| 20130075762 | OPTICALLY TRANSMISSIVE METAL ELECTRODE, ELECTRONIC DEVICE, AND OPTICAL DEVICE - According to one embodiment, an optically transmissive metal electrode includes a plurality of first and second metal wires. The first metal wires are disposed along a first direction, and extend along a second direction intersecting the first direction. The second metal wires are disposed along a third direction parallel with a plane including the first and second directions and intersecting the first direction, contact the first metal wires, and extend along a fourth direction parallel with the plane and intersecting the third direction. A first pitch between centers of the first metal wires is not more than a shortest wavelength in a waveband including visible light. A second pitch between centers of the second metal wires exceeds a longest wavelength in the waveband. A thickness of the first and second metal wires along a direction vertical to the plane is not more than the shortest wavelength. | 03-28-2013 |
| 20130075763 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING TOUCH SUBSTRATE - A display apparatus includes a first substrate including a plurality of pixels, and a second substrate facing the first substrate, the second substrate comprising a sensor area and a peripheral area, the sensor area comprising a plurality of sensors. The second substrate includes an insulating layer, and a plurality of lines disposed on the insulating layer corresponding to the peripheral area and connected to the sensors. A void is formed in the insulating layer between two adjacent lines of the plurality of lines at a boundary of the sensor area and the peripheral area. | 03-28-2013 |
| 20130153932 | METHOD FOR MANUFACTURING PHOTOCOUPLER, AND PHOTOCOUPLER LEAD FRAME SHEET - A method for manufacturing a photocoupler includes: mounting light emitting devices and light receiving devices on a lead frame sheet; positioning the lead frame sheet with respect to a die by cutting off the one set of column portions from a linking portion and inserting a first pilot pin formed on the die into a second pilot hole; opposing the light emitting devices and the light receiving devices to each other; connecting the light emitting side coupling bars and the light receiving side coupling bars to each other on the die; forming a resin body so as to cover a pair of the light emitting device and the light receiving device; and cutting off the light emitting side lead frame portion from the light emitting column portion and cutting off the light receiving side lead frame portion from the light receiving column portion. | 06-20-2013 |
| 20130181232 | Optocoupler with Surface Functional Coating Layer - Various embodiments of methods and devices are provided for an optocoupler comprising an optically reflective compound comprising silicone and inner and outer surfaces. A molding compound surrounds and encapsulates at least portions of the outer surfaces of the optically reflective compound to form an enclosure. A surface functional coating layer is provided in the optically reflective compound to promote adhesion and increase breakdown voltages between inner walls of the enclosure and the outer surfaces of the optically reflective compound. | 07-18-2013 |
| 20130207126 | OPTOELECTRONIC APPARATUSES AND METHODS FOR MANUFACTURING OPTOELECTRONIC APPARATUSES - A method for manufacturing an optoelectronic apparatus includes attaching bottom surfaces of first and second packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e.g., a tape) so that there is a space between the first and second POSDs. An opaque molding compound is molded around portions of the first and second POSDs attached to the carrier substrate, so that peripheral surfaces of the first POSD and the second POSD are surrounded by the opaque molding compound, the space between the first and second POSDs is filled with the opaque molding compound, and the first and second POSDs are attached to one another by the opaque molding compound. The carrier substrate is thereafter removed so that electrical contacts on the bottom surfaces of the first and second POSDs are exposed. A window for each of the POSDs is formed during the molding process or thereafter. | 08-15-2013 |
| 20130248887 | OPTICAL ELECTRONIC PACKAGE - An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip. | 09-26-2013 |
| 20130264586 | Opto-Electronic Module - An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black. | 10-10-2013 |
| 20130292705 | OPTICAL APPARATUS - An optical apparatus includes a substrate | 11-07-2013 |
| 20140034972 | HOUSING FOR HIGH-POWER LIGHT EMITTING DIODES - A housing for optoelectronic components, such as LEDs, and to a method for producing such a housing are provided. The housing has a base body with an upper surface that at least partially defines a mounting area for at least one optoelectronic functional element, such that the base body provides a heat sink for an optoelectronic functional element. The base body also has a lower surface and a lateral surface. The housing has a connecting body for the optoelectronic functional element, which is joined to the base body at least by a glass layer. The connecting body is arranged at a lateral side of the base body and at least partially extends around a periphery of the base body. | 02-06-2014 |
| 20140091326 | Light Blocking Structure in Leadframe - A semiconductor proximity sensor ( | 04-03-2014 |
| 20140167074 | Intensity Scattering LED Apparatus - An Intensity Scattering LED apparatus which comprises an uneven surface on the tip of the epoxy encapsulation layer of the LED to act as a scattering lens such that the light beam on the normal line, relative to the light source, is scattered and the intensity to the human eye or human body is decreased. Simultaneously, the light beams that are not on the normal line are unchanged, and moreover, the total intensity and the brightness of the LED remain unchanged. In the instant invention, no reductions in driving current or additional diffusing agents are needed to decrease the intensity and the brightness of the LED and may be structured as Pin Packaging having two or more supporting legs and/or SMD (Surface Mount Device) Packaging having no supporting leg but having two or more connecting pads. | 06-19-2014 |
| 20140197424 | OPTOELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an optoelectric device may include the steps of providing a layer of an optoelectric active material between a first electrode and a second electrode, providing a patterned electrically insulating layer structure at least one of said electrodes, the patterned electrically insulating layer structure having openings, providing an electrolyte in said openings, and depositing a metallic layer in said openings from the electrolyte by electroplating, wherein the electrolyte is formed by an ionic liquid. | 07-17-2014 |
| 20140291702 | OPTICAL/ELECTRICAL TRANSDUCER USING SEMICONDUCTOR NANOWIRE WICKING STRUCTURE IN A THERMAL CONDUCTIVITY AND PHASE TRANSITION HEAT TRANSFER MECHANISM - An optical/electrical transducer device has housing, formed of a thermally conductive section and an optically transmissive member. The section and member are connected together to form a seal for a vapor tight chamber. Pressure within the chamber configures a working fluid to absorb heat during operation of the device, to vaporize at a relatively hot location as it absorbs heat, to transfer heat to and condense at a relatively cold location, and to return as a liquid to the relatively hot location. The transducer device also includes a wicking structure mounted within the chamber to facilitate flow of condensed liquid of the working fluid from the cold location to the hot location. At least a portion of the wicking structure comprises semiconductor nanowires, configured as part of an optical/electrical transducer within the chamber for emitting light through and/or driven by light received via the transmissive member. | 10-02-2014 |
| 20150069422 | PHOTOCOUPLER AND LIGHT EMITTING ELEMENT - According to one embodiment, a photocoupler includes: an input terminal; a light emitting unit; a light receiving unit and an output terminal. An input electrical signal having a prescribed voltage is input into an input terminal. The light emitting unit is connected to the input terminal, includes a light emitting element configured to emit emission light, and is configured to drive the light emitting element under a constant voltage of the input electrical signal. The light receiving unit includes a light receiving element configured to receive the emission light and convert the emission light into an electrical signal. The output terminal is insulated from the input terminal and configured to output the electrical signal in accordance with the input electrical signal. | 03-12-2015 |
| 20150108506 | SINGULATING HYBRID INTEGRATED PHOTONIC CHIPS - During a fabrication technique, trenches are defined partially through the thickness of a substrate. Then, photonic integrated circuits are coupled to the substrate. These photonic integrated circuits may be in a diving-board configuration, so that they at least partially overlap the trenches. While this may preclude the use of existing dicing techniques, individual hybrid integrated photonic chips (which each include a portion of the substrate and at least one of the photonic integrated circuits) may be singulated from the substrate by: coupling a carrier to a front surface of the substrate; thinning the substrate from a back surface until the partial trenches are reached (for example, by grinding the substrate); attaching a support mechanism (such as tape) to the back surface of the substrate; removing the carrier; and then removing the support mechanism. | 04-23-2015 |
| 20160172528 | LIGHT RECEIVING/EMITTING ELEMENT AND SENSOR DEVICE USING SAME | 06-16-2016 |
| 20160181342 | DISPLAY DEVICE | 06-23-2016 |
| 20160380161 | OPTICAL CONVERTER SYSTEM FOR (W)LEDS - An optical converter system for (W)LEDs, and a method for producing the optical converter system are provided. The optical converter system includes an inorganic converter for converting the radiation emitted from the LED, an inorganic optical component, such as glass, disposed downstream relative to the converter in the direction of emission of the LED. The converter and the first optical component are adjacent to one another and joined at least in sections. | 12-29-2016 |
| 20220139894 | SEMICONDUCTOR PACKAGES - A semiconductor package includes a photonic integrated circuit, an electronic integrated circuit and a waveguide. The photonic integrated circuit includes an optical coupler. The electronic integrated circuit is disposed aside the photonic integrated circuit. The waveguide is optically coupled to the optical coupler, wherein the waveguide is disposed at an edge of the photonic integrated circuit and protrudes from the edge of the photonic integrated circuit. | 05-05-2022 |
