| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 250239000 | Housings (in addition to cell casing) | 51 |
| 20080237454 | STACKABLE HELIOSTAT FRAME STRUCTURE - A heliostat includes a pedestal, a transmission system, a frame assembly, and a mirror assembly. The frame assembly generally includes a first frame set and a second frame set mounted to the transmission system which is mounted upon the pedestal. Each frame set includes a stackable inner frame assembly and a stackable outer frame assembly. Each stackable inner frame assembly is identical and each stackable outer frame assembly is identical such that a multiple of inner frames and a multiple of outer frames are readily stackable in a nested arrangement for storage and transport. | 10-02-2008 |
| 20080237455 | LIGHT RECEIVING APPARATUS - A light receiving apparatus includes a holder made of metal and a light receiving element that is attached to the holder, receives laser light reflected by an information medium, and outputs an electric signal. The light receiving element is constructed of a bare chip, is attached to the holder, and parts of the light receiving element aside from a part on which the laser light is incident are sealed using resin. | 10-02-2008 |
| 20080251705 | IMAGE SENSOR CHIP PACKAGE - An image sensor chip package includes a base, a sidewall adhered on peripheries of the base, an image sensor chip adhered on a top face of the base, and a cover adhered with the sidewall. The base includes a top face and a bottom face formed on an opposite side to the top face defining a number of outer pads thereon. The sidewall includes a number of inner pads is disposed on the inner side of the sidewall and corresponding to electrically connect with the corresponding outer pads. The inner pads are disposed on the sidewall to make the base become little. Thus, a volume of the image sensor chip package becomes thinner compare with the conventional image sensor chip package. | 10-16-2008 |
| 20080251706 | Optical pickup - The soldered connection of an end portion of a cable extending from each element with a main substrate is prevented from being broken. An end portion of a cable t | 10-16-2008 |
| 20080251707 | OPTICAL CHASSIS, CAMERA HAVING AN OPTICAL CHASSIS, AND ASSOCIATED METHODS - A camera including a mount substrate, a detector on a first surface of the mount substrate, a spacer on the mount substrate, the spacer including a hole exposing the detector, a cover on the spacer, the cover covering the hole, the mount substrate, the spacer and the cover together sealing the detector, the cover having a planar surface facing the detector, and an external electrical interconnection for the detector provided outside the sealing, the external electrical interconnection being on a first surface and a second surface, different from the first surface, of the mount substrate, the external electrical interconnection adapted to connect the detector to an electrical contact pad. | 10-16-2008 |
| 20080277571 | Optoelectronic component - Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. | 11-13-2008 |
| 20080308717 | Camera module with window mechanical attachment - An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place. | 12-18-2008 |
| 20090008540 | Camera device and electronic device including the same - In a camera device of the present invention, a camera module | 01-08-2009 |
| 20090050795 | IMAGING APPARATUS AND PHOTOELECTRIC CONVERSION ELEMENT PACKAGE RETAINING UNIT - A photoelectric conversion element package retaining unit includes a photoelectric conversion element package having electrodes formed on a rear surface of a light-receiving surface, a printed circuit board electrically connected to the electrodes, and a retaining member configured to retain the photoelectric conversion element package. The printed circuit board includes a first opening formed in an area corresponding to an inside of the electrodes. The retaining member includes a positioning unit configured to position the photoelectric conversion element package in an axial direction orthogonal to the light-receiving surface by abutting on the photoelectric conversion element package outside the electrodes, and a second opening formed to pour an adhesive into the area corresponding to the inside of the electrodes. | 02-26-2009 |
| 20090057544 | CAMERA MODULE LENS CAP - A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module. | 03-05-2009 |
| 20090095893 | Imager module packaging - An imaging device module includes a circuit mounting layer; a bottom glass layer disposed above the circuit mounting layer; a silicon die disposed above the bottom glass layer; a top glass layer disposed above the silicon layer; and a lens holder disposed above the top glass layer. The silicon die includes an image sensor. The lens holder contains an optical component. | 04-16-2009 |
| 20090134320 | FILTERED PHOTOSENSORS AND PHOTO CONTROL DEVICES INCLUDING THE SAME AND METHODS FOR FORMING THE SAME - Methods of forming a filtered photosensor include providing a photosensor and an infrared blocking ink. The infrared blocking ink is printed on the photosensor. Printing the infrared blocking ink may include dipping the photosensor in the infrared blocking ink or spraying and/or brushing the infrared blocking ink on the photosensor. Photo control devices including a photosensor with an infrared blocking ink thereon are also provided. | 05-28-2009 |
| 20090146051 | PHOTOELECTRIC CONVERSION ELEMENT UNIT AND IMAGING APPARATUS - A photoelectric conversion element unit for use in an imaging apparatus including a photoelectric conversion element package containing a photoelectric conversion element, a wiring substrate where the photoelectric conversion element package is mounted on the first surface and an electronic component related to the photoelectric conversion element is mounted on a rear side of the first surface, and a support board attached to an attachment point in the imaging apparatus where the photoelectric conversion element package is fixed, wherein an opening smaller than an external form of the photoelectric conversion element package is formed in the support board, and the electronic component mounted on the wiring substrate is provided within the opening. | 06-11-2009 |
| 20090159788 | OPTICAL NAVIGATOR SENSOR AND OPTICAL NAVIGATOR APPARATUS USING THE SAME - An optical navigator sensor for sensing an image of an object comprises a substrate, a laser diode, an optical sensor device and a housing. The optical sensor device and the laser diode are fixed on the base plate and covered by the housing. The housing guides the light emitted from the laser diode to the object and guides the light reflected from the object to the optical sensor device. | 06-25-2009 |
| 20090250599 | NUCLEAR GAUGES AND RELATED METHODS OF ASSEMBLY - Nuclear gauges, their components and method for assembly and adjustment of the same are provided. The nuclear gauges are used in measuring the density and/or moisture of construction-related materials. The nuclear gauge can include a gauge housing having a vertical cavity therethrough and at least one radiation detector located within the housing. The nuclear gauge can include a vertically moveable source rod and a radiation source operatively positioned within a distal end of the source rod. The nuclear gauge can also include a radiation shield assembly. | 10-08-2009 |
| 20090278035 | Motion-detecting module for combining a light-emitting function and a light-sensing function together - A motion-detecting module for combining a light-emitting function and a light-sensing function together includes a chip unit, a cover unit, and a light-guiding unit. The chip unit has a PCB, a light-emitting chip, and an image-sensing chip, and both the light-emitting chip and the image-sensing chip are electrically disposed on the PCB. The cover unit covers the light-emitting chip and the image-sensing chip. The cover unit has a receiving space for communicating the light-emitting chip and the image-sensing chip, a first opening for exposing the light-emitting chip, and a second opening for exposing the image-sensing chip. The light-guiding unit is disposed under the cover unit, and the light-guiding unit at least has a first refraction surface, a second refraction surface, a third refraction surface, a fourth refraction surface, and a reflection surface. | 11-12-2009 |
| 20100102213 | APPARATUS AND METHOD FOR ALIGNING AN IMAGE SENSOR - An imaging device and a method for aligning an image sensor within the imaging device are disclosed. The imaging device comprises a housing and an image sensor assembly including a header and an image sensor mounted to the header. The header of the image sensor assembly is coupled to the housing. Means for aligning the image sensor with respect to the header are provided. Means for aligning the header with respect to the housing of the imaging device are also provided. A distance separating the image sensor alignment means and the header alignment means is pre-determined such that a distance between the image sensor and the housing of the imaging device is pre-determined. | 04-29-2010 |
| 20100123072 | DETECTOR WITH MOUNTING HUB TO ISOLATE TEMPERATURE INDUCED STRAIN AND METHOD OF FABRICATING THE SAME - An imaging device and method of fabricating the same is disclosed. The imaging device may include an imaging sensor base, an image detector and a multilayer board. The imaging sensor base has a bonded hub having uniform flatness. The mounting hub sized to fit into a receptacle in the multilayer board. The image detector sized to match a size of the imaging sensor base and bonded to a top surface of the imaging sensor base. The imaging device may also include a readout integrated circuit (ROIC) sized to substantially match the size of the imaging sensor base and disposed on the image detector. A plurality of equi-spaced flexures and receptacles for receiving the plurality of flexures may also be used to maintain positional stability and minimize thermal strain. | 05-20-2010 |
| 20100133425 | Optical Pickup Apparatus - An optical pickup apparatus comprising: a photo detector configured to receive light reflected from a medium; a housing mounted with the photo detector; and a projecting portion projecting from the housing, the projecting portion including a displacement preventer configured to prevent displacement of the photo detector or an adhesive relative to the housing, the displacement preventer including a fixing portion formed to extend along a plurality of directions, the photo detector being provided on the housing by applying the adhesive to the displacement preventer. | 06-03-2010 |
| 20100243873 | OPTICAL PICKUP DEVICE - An optical pickup device includes a house having three walls connected together whose horizontal cross-section is substantially U-shaped. A first wall supports one end of a shaft, a second wall facing the first wall supports the other end of the shaft and a third wall connects the first and second walls. A lubricant tray is surrounded by the three walls and the shaft. By the shaft being attached to an end side surface of the lubricant tray, the shaft can be integrally formed with the housing. A radius of curvature or an angle formed on a horizontal cross-section of the three walls is larger than a radius of curvature or an angle formed between one of the three walls and the lubricant tray. | 09-30-2010 |
| 20100258713 | LIGHT RECEIVING DEVICE AND METHOD OF MANUFACTURING LIGHT RECEIVING DEVICE - A light receiving device | 10-14-2010 |
| 20110024610 | IMAGE SENSOR PACKAGE STRUCTURE - The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced. | 02-03-2011 |
| 20110031385 | PHOTOELECTRIC CONVERSION MODULE - A photoelectric conversion module includes a transmission side photoelectric conversion part for converting an electrical signal into an optical signal, a transmission side circuit board on which the transmission side photoelectric conversion part is mounted on a top surface side of the transmission side circuit board, a reception side photoelectric conversion part for converting an optical signal into an electrical signal, a reception side circuit board on which the reception side photoelectric conversion part is mounted on a top surface side of the reception side circuit board, and a housing. The transmission side circuit board and the reception side circuit board are placed such that a back surface of the transmission side circuit board is opposite to the housing and a back surface of the reception side circuit board is opposite to the housing. | 02-10-2011 |
| 20110042558 | Optical device and method of manufacturing the same - An optical device and a method of making an optical device is described herein. The optical device comprises a housing, an optical element, a base structure that supports the optical element and that interfaces with the housing to form a gap section between an outer wall section of the base structure and an inner wall section of the housing, a resin within the gap section fixing the housing to the base structure, and a light accommodation section in the housing. The light accommodation section accommodates a transmittance of light to the resin within the gap section. | 02-24-2011 |
| 20110062317 | Testing Apparatus for Light-Emitting Devices - A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain a optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture. | 03-17-2011 |
| 20110147573 | SENSOR CAP ASSEMBLY SENSOR CIRCUIT - A sensor cap assembly includes a radiation shielding part provided with a radiation entrance opening, and a radiation-transmissive lens mounted from the outside to the shielding part. The lens is a thick lens with a ratio T/D of thickness (T) to diameter (D) of more than 0.10, preferably more than 0.15. | 06-23-2011 |
| 20110155896 | DETECTOR ASSEMBLY FOR A SCINTILLATION ARTICLE - A detector assembly includes a cap assembly configured to close an end of a detector housing that is configured to contain a sensor therein, the cap assembly has a radially expandable member configured to expand radially within the detector housing and lock the position of the cap assembly relative to the detector housing. | 06-30-2011 |
| 20110204215 | OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME - An optical device includes: an optical component; a case air-sealed, and made of metal, the optical component being secured within the case; and a lens provided within the case, and positionally adjusted in consideration of a deformation of the case air-sealed, light emitted from the optical component passing through the lens or light traveling to the optical component passing through the lens. | 08-25-2011 |
| 20110220782 | OPTICAL SENSOR HOLDER FOR TRACKING LOCATION OF SUNLIGHT - A holder having an optical sensor for tracking location of sunlight is disclosed. The optical sensor holder includes a holder | 09-15-2011 |
| 20110266425 | Device for capturing a laser beam - The invention relates to a device for capturing a laser beam, comprising a receiver unit having a housing with a front surface, along one side of which a measurement region capturing the laser beam that comprises a sensor associated therewith runs, and a mounting ( | 11-03-2011 |
| 20110303833 | SHIELDING STRUCTURE AND IMAGING DEVICE SUPPORT STRUCTURE - An imaging device support structure includes a master flange having an opening portion through which an optical axis A passes, an imaging device which is attached to the master flange via the attachment plate and is positioned in the opening portion as viewed in an optical axis A direction, and a shielding member which shields a gap between the master flange and the imaging device in the opening portion. The shielding member is pressed against the opening edge of the first opening portion. The opening edge of the first opening portion has a substantially polygonal shape with corner portions which outwardly protrude. | 12-15-2011 |
| 20120043458 | RUGGEDIZED TOOL AND DETECTOR DEVICE - A tool comprising a tool body having an opening defined by interior walls extending into the tool body and a casing disposed within the opening. The tool further includes a scintillator material disposed within the casing and a first compressive member disposed within the tool body at a first axial location. The first axial location extends for a fraction of a total axial length of the casing and exerts a first radially compressive force at the first axial location. | 02-23-2012 |
| 20120091326 | SENSOR DEVICE, COMPRISING AN OPTICAL SENSOR, A CONTAINER AND A COMPARTMENTALIZATION MEANS - A sensor device has an optical sensor ( | 04-19-2012 |
| 20120119075 | OPTICAL SENSOR FOR IDENTIFYING AND/OR AUTHENTICATING OBJECTS - The invention relates to an optical sensor for identifying and/or authenticating objects on the basis of characteristic reflection patterns, and to a device comprising a plurality of sensors connected to one another. | 05-17-2012 |
| 20120175508 | SENSOR MODULE - A sensor module includes a lens attached on an opening side of a housing and a circuit board with a sensor device mounted thereon attached on the other opening side. A stepped part is formed on the inside of the housing. An adjustment gap for adjusting the position of the circuit board is formed between a vertical face of this stepped part and an outer peripheral face of the circuit board. An adhesive injection groove that varies the width of the adjustment gap is formed by providing a recess and/or a projection on the vertical face of the stepped part and an opposing face of the outer peripheral face of the circuit board in at least one of at least two fixing portions where the circuit board is fixed to the stepped part with an adhesive. Adhesive is applied into the adhesive injection groove. | 07-12-2012 |
| 20120267518 | SENSOR PROTECTOR - A sensor protector is intended to reduce the sensitivity of the optical sensor ( | 10-25-2012 |
| 20120286147 | WIDE-ANGLE LASER SIGNAL SENSOR - A laser sensor comprising a sensor head to receive laser light. The sensor head may have a globe-shaped optical member, the globe-shaped optical member may be optically coupled to an optical-to-electrical converter, the optical-to-electrical converter may be configured to convert laser light from the sensor head to an electronic output signal, and the sensor head may be configured to provide a 360 degree field of view in a horizontal plane and a positive (+) 90 degree field of view in a vertical plane above the horizontal plane. | 11-15-2012 |
| 20120312973 | OPTICAL SENSOR ELEMENT AND OPTICAL SAMPLE ANALYSING APPARATUS - An exemplary optical sensor element for use in an optical sample analyzing apparatus, includes a housing that includes at least one optical sensor component. A housing body and a housing lid are removably connected to the housing body so that in an assembled state, the housing body and the housing lid form a fluid-tight housing. The housing lid is equipped with replaceable moisture control elements. | 12-13-2012 |
| 20130105676 | Apparatus Comprising an Optical Sensor and a Housing Part for an Apparatus | 05-02-2013 |
| 20140166867 | Electronic Devices with Light Sensors - Electronic devices may be provided with light sensors. Light sensors may be proximity sensors or ambient light sensors. Proximity sensors may include a light-emitting component and a light-sensitive component. The electronic device may include an enclosure formed from housing structures and some or all of a display for the device. The enclosure may include openings such as openings formed from clusters of smaller openings. Each light sensor may receive light through one of the clusters of openings. The light sensor may receive the light directly through the openings or may receive light that passes through the openings and is guided to the light sensor by light guiding structures. The light guiding structures may include fiber optic structures or light-reflecting structures. Fiber optic structures may fill or partially fill the openings. Light reflecting structures may be machined cavities in an internal support structure. | 06-19-2014 |
| 20140239167 | SUBMOUNT FOR OPTOELECTRONIC, OPTICAL, OR PHOTONIC COMPONENTS - An optical submount has a circumscribed 4-faced depression on its bottom surface and a 3-faced depression at an edge of its bottom surface. An optical signal is transmitted through a face of the 3-faced depression and internally reflected from a face of the 4-faced depression. A set of additional depressions and intervening areas on the submount bottom surface act as an alignment mark. | 08-28-2014 |
| 20140263989 | Geometry Layout and Filter Packaging for System for Wireless, Motion and Position-Sensing, Integrating Radiation Sensor for Occupational and Environmental Dosimetry - A device comprising: a substrate, four or more sensor packages mounted on the substrate, and a respective set of one or more filters for each of the four or more sensor packages, wherein each sensor package of the four or more sensor packages comprises one or more radiation sensors mounted therein, wherein each set of filters filter one or more types of radiation entering an exposed side of each of the one or more radiation sensors at angle of at least 60 degrees with respect to a respective axial line through respective centers of each of the one or more radiation sensors. | 09-18-2014 |
| 20140374580 | Multi-Optical Axis Photoelectric Sensor - Provided is a multi-optical axis photoelectric sensor that can achieve downsizing and weight reduction. The multi-optical axis photoelectric sensor includes a case body which is formed to have open ends and has the same cross-sectional shape in a longitudinal direction of the multi-optical axis photoelectric sensor; end members which are attached to one end and the other end of the case body and each formed of a molded article for closing an opening on each of the ends; and an optical component which is arranged from one end to the other end of the case body so as to be separated from an inner face of the case body. The optical component has a function of defining the spread angle of each optical axes. The optical component and the end members are directly or indirectly physically engaged with each other to unrotatably position the optical component by the end members. | 12-25-2014 |
| 20150323380 | PHOTOCELL RECEPTACLE - A photocell receptacle includes a base configured to be fixedly mounted to a housing of a light fixture. The base has an opening providing access to the interior of the housing of the light fixture. The base has a base locking feature. The photocell receptacle includes a cap having a cap locking feature. The cap locking feature operably engaging the base locking feature to secure the cap to the base. The cap is variably positionable at different angular positions relative to the base. The cap has contact channels holding electrical contacts configured to be electrically connected to corresponding contacts of a photocell. | 11-12-2015 |
| 20150357483 | Light Sensing Device and Method of Arranging Light Sensing Element Thereof - A light sensing device includes a substrate, a plurality of light sensing elements and a cover. The plurality of light sensing elements are disposed on the substrate for sensing light. The cover is utilized for sheltering the plurality of light sensing elements, wherein the cover includes a hole for passing the light. A set of the plurality of light sensing elements is selected to be enabled according to a location of the hole relative to the plurality of light sensing elements. | 12-10-2015 |
| 20150362345 | ROTATING LASER - A rotating laser ( | 12-17-2015 |
| 20160041029 | IMAGE MODULE PACKAGE AND MANUFACTURING METHOD THEREOF - There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle. | 02-11-2016 |
| 20160068248 | MOVING CONFORMAL WINDOW FOR LARGE APERTURE OPTICS ON AIRCRAFT MOUNTED PODS - A single monotlithic moving window may follow the free aperture of an optical sensor contained in a housing over a reasonable field of regard by translating the window with respect to the sensor and/or a pod cover. Because the window angle of attack is unvarying, near field turbulence is minimized over the envelope of operation. | 03-10-2016 |
| 20160133662 | IMAGE SENSOR DEVICE WITH DIFFERENT WIDTH CELL LAYERS AND RELATED METHODS - An image sensor device may include an interconnect layer, an image sensor IC on the interconnect layer, and a barrel adjacent the interconnect layer and having first electrically conductive traces. The image sensor device may include a liquid crystal focus cell carried by the barrel and having cell layers, and second electrically conductive contacts. A pair of adjacent cell layers may have different widths. The image sensor device may include an electrically conductive adhesive body coupling at least one of the second electrically conductive contacts to a corresponding one of the first electrically conductive traces. | 05-12-2016 |
| 20160153831 | FORWARD LOOKING LIGHT SENSOR OF A COSINE SQUARED OF THE ANGLE | 06-02-2016 |
| 20160178410 | SENSOR ARRAY PACKAGING SOLUTION | 06-23-2016 |
