Entries |
Document | Title | Date |
20080251720 | BEAM SCANNING IMAGING METHOD AND APPARATUS - An imaging apparatus uses focusing and collecting optics in combination with steering optics for efficient and speedy imaging of a target using an extended terahertz electro-magnetic range challenged by weak sources and low sensitivity of detection. This invention addresses efficient detection of this wave in combination with a speedy imaging speed. By proper location of optics to utilize angular conversion of the beam to a lateral scan, a rastering imaging apparatus is demonstrated without moving target or entire imaging system. A mirror-lens set is used to steer the terahertz (THz) beam along and (or) to collect the THz beam from each point of the target. The target is imaged with a much higher speed than when moving the target or the entire imaging system. A THz wave image can be taken at video frequency for practical usage of the apparatus in diverse application areas, where it has not been considered to be feasible. | 10-16-2008 |
20080251721 | THERMAL INFRARED SOLID STATE IMAGING DEVICE AND INFRARED CAMERA - An infrared solid state imaging device includes a pixel area with arranged infrared detection pixels and a integration circuit for modulating output current based on the output of the pixel. The integration circuit contains an integrating transistor that modulates a current based on the difference in potential between first and second constant current devices, a integration capacitor for storing the modulated current and being reset periodically, a bias current supply transistor, a switch for connecting the drain with the gate of the bias current supply transistor, a capacitor providing AC coupling between the output of the integrating transistor and the integrating capacitor, a gate bias switch for providing the integrating transistor with a bias voltage, a switch for selecting, as input to the integrating transistor, either one of outputs from the first and second constant current devices, and a capacitor for providing AC coupling between the switch and the gate of the integrating transistor. | 10-16-2008 |
20080296500 | DIRECT-VIEW, COMPACT SHORT WAVE INFRA RED (SWIR) VIEWER - A night vision device includes an objective lens assembly, an image detector assembly, an eyepiece lens assembly and a housing. The objective lens assembly receives low intensity light. The image detector assembly converts the low intensity light into a visible output image. The eyepiece lens assembly provides for viewing the output image from the image detector assembly. The housing receives the objective lens assembly, the image detector assembly, and the eyepiece lens assembly. Additionally, the housing aligns the objective lens assembly with the image detector assembly and the eyepiece lens assembly along an optical axis. | 12-04-2008 |
20090020700 | Method and device for generating an electrical signal in response to light - A device and method are disclosed for detecting light. The device includes a photodetector having at least one superlattice layer operative to generate an electrical signal in response to light incident thereon and one or more lenslets for directing light onto the photodetector. | 01-22-2009 |
20090045341 | SYSTEMS FOR OBSERVING REACTIONS USING INFRARED IMAGING - A system for monitoring the heats of reaction of an array of materials has an infrared transparent substrate containing the materials. A reaction chamber encloses the substrate. At least one reactant gas is coupled to the reaction chamber through a valve. An infrared camera images the array of materials. The camera outputs signals corresponding to an infrared emission intensity of at least one activated material in the array. A system for characterizing chemical reactions has an infrared transparent substrate for containing an array of materials. A modulated infrared radiation source simultaneously irradiates the materials in the array with infrared radiation. An infrared camera has a focal plane array detecting infrared radiation. An optical element focuses the infrared radiation transmitted by the array of materials onto the focal plane array. A processor coupled to the camera transforms sequential intensity profiles of the detected infrared radiation into infrared spectra using Fourier analysis. | 02-19-2009 |
20090050806 | VISIBLE LIGHT AND IR COMBINED IMAGE CAMERA WITH A LASER POINTER - A visible light (VL) and infrared (IR) combined image camera with a laser pointer. The laser pointer may be used for marking a hot spot on an object or for focusing an IR lens of a camera on an object. The laser pointer may be adjacent to the VL optics and offset from the IR optics. The VL sensor array may be much larger than the IR sensor array and the camera may also display the pixels of IR data with a much larger instantaneous field of view than the VL pixels. The camera may also provide audible alarms where the alarm is emitted with a tone of variable output to indicate the relative level of the alarm. | 02-26-2009 |
20090134328 | IMAGE-TAKING APPARATUS AND METHOD THEREOF - An image-taking apparatus includes an image-taking device configured to take an image of an object, at least one illumination light source configured to be able to illuminate the object, an illumination region controller configured to be able to partially emit an illumination light ray originating from the illumination light source towards a plurality of different regions of the object, and to sequentially change the location of an illuminated area of the illumination light ray, and a controller configured to cause the image-taking device to take an image of the object under a plurality of illumination conditions produced in accordance with control of the illumination region controller. | 05-28-2009 |
20090194693 | Imaging Apparatus for Combined Temperature and Luminescence Spatial Imaging of an Object - An imaging apparatus is disclosed for combined temperature and luminescence spatial imaging of an object ( | 08-06-2009 |
20090200467 | Automatic image-based volumetric detection of an object in a space - Automatic image-based volumetric detection of an object in a space is achieved based on a combinational characteristic produced by combining a first characteristic of a reference image associated with the space when empty, and second characteristic of a detection image associated with the space at a time when object detection is active. The combinational characteristic is independent of relative image intensity between the reference image and the detection image. The object detection operation is thus provided with a degree of independence relative to the respective illumination conditions during capture of the reference and detection images. | 08-13-2009 |
20090200468 | CLIP-ON INFRARED IMAGER - A clip-on infrared imager may be coupled and decoupled to an existing night vision system to add infrared imaging to provide a fused image through at least one of the night vision system eyepieces. | 08-13-2009 |
20090206261 | Apparatus and Method For Analyzing Relative Outward Flow Characterizations of Fabricated Features - An apparatus and method for characterizing gas flow through features fabricated in a hollow part. A pressure regulated cooled gas is applied to an interior of the part to the features fabricated in the part. At the same time, a pressure regulated heated gas is applied to an exterior part skin; and the heated gas has a controlled temperature differential from the pressure regulated cooled gas applied to the part interior. An infrared signature of escaping gas and the surrounding part skin is analyzed by a classification method to identify acceptable and unacceptable fabricated features. | 08-20-2009 |
20090212216 | Mining methods and apparatus - A method and apparatus for horizon control in a mining operation is provided. Fresh product | 08-27-2009 |
20090283678 | TARGET WITH THERMAL IMAGING SYSTEM - A target with a thermal imaging system comprising a layer of corrugated plastic, a layer of bifurcated metallic foil, a layer of clear plastic, a wire grid, two strips of carbon tape, a front cover sheet, and a power lead. The layer of bifurcated metallic foil is situated on top of the layer of corrugated plastic. The layer of clear plastic is situated on top of the layer of bifurcated metallic foil. The wire grid is situated on top of the layer of clear plastic. One strip of carbon tape is adhered to the right side of the wire grid, and the other strip of carbon tape is adhered to the left side of the wire grid. The power lead is connected to the carbon tape. The front cover sheet is adhered to the target so that it covers the wire grid and carbon tape. | 11-19-2009 |
20090302219 | VISIBLE LIGHT AND IR COMBINED IMAGE CAMERA - Methods, camera, and a computer-readable medium for registering on a camera display infrared and visible light images of a target scene taken from different points of view causing a parallax error. | 12-10-2009 |
20090321637 | CAMERA HAVING DISTORTION CORRECTION - A lightweight camera is provided that includes a lightweight lens system that has a reduced number of lenses. Reducing the number of lenses produces a lighter camera, but produces a distorted local image. The distorted local image is captured by the lightweight camera, and is preferably transmitted to a remote station. The remote station then performs image processing on the distorted image to remove at least some of the distortion in the image. Preferably, a Massively Parallel Richardson-Lucy (MPRL) algorithm is used to identify and remove distortion from the image. Also, motion, temperature and inter-detector difference distortion is detected and corrected. | 12-31-2009 |
20100012841 | IMAGING APPARATUS AND METHODS - Imagers, pixels, and methods of using the same are disclosed for imaging in various spectra, such as visible, near infrared (IR), and short wavelength IR (SWIR). The imager may have an imaging array having pixels of different types. The different types of pixels may detect different ranges of wavelengths in the IR, or the SWIR, spectra. The pixels may include a filter which blocks some wavelengths of radiation in the IR spectrum while passing other wavelengths. The filter may be formed of a semiconductor material, and therefore may be easily integrated with a CMOS pixel using conventional CMOS processing techniques. | 01-21-2010 |
20100025581 | INFRARED IMAGING APPARATUS - A representative embodiment of the invention provides an infrared (IR) imaging system adapted to (i) convert an IR image of an object into mechanical displacements of a plurality of movable plates, (ii) use the mechanical displacements to impart a corresponding spatial phase modulation pattern onto a beam of visible light, and (iii) apply spatial filtering to convert the spatial phase modulation pattern into a visible image of the object. | 02-04-2010 |
20100025582 | REMOTE SENSING OF SUBSURFACE ARTIFACTS BY USE OF VISUAL AND THERMAL IMAGERY - Methodology, systems, and apparatus for remote sensing as by detection and mapping of subsurface artifacts including clandestine tunnels and other subterranean facilities that may carry enemy soldiers, terrorists, weapons, munitions and explosives and other material of war or terrorism by use of visual and thermal imagery, specifically including the use of infrared (IR) thermography and related analysis, including visual imagery and its analysis including correlation between IR thermography data, visual data and other information which can be taken into consideration in relation to IR thermography data and visual data. Various types of data enhancements may be used to assist in target detection. | 02-04-2010 |
20100038539 | Pixel Interconnect Insulators and Methods Thereof - Particular embodiments relate generally to infrared focal plane arrays and methods thereof. According to one embodiment, an infrared focal plane comprises an array of pixels configured to detect optical radiation in a predetermined radiation band are positioned on a support substrate. The pixels are connected to pixel contacts on a read-out integrated circuit via pixel interconnects comprising bonding bumps. According to some embodiments, indium migration is blocked by a patterned electrical insulator comprising a plurality of intersecting walls defining a plurality of cells that surround each pixel interconnect. The patterned electrical insulator may be dimensioned such that it does not physically contact the support substrate, the array of pixels or pixel interconnects. In this manner, pixel-pair defects due to indium migration resulting from cryogenic thermal-cycling may be prevented, thereby extending the thermal-cycling lifetime of the focal plane array. | 02-18-2010 |
20100051809 | Monolithic Dual Band Imager - An imaging sensor for imaging scenes based on both shortwave infrared and midwave infrared radiation is disclosed. The imaging sensor comprises pixels that include a photodiode that is selectively sensitive to shortwave infrared radiation based upon its bias voltage. | 03-04-2010 |
20100090110 | Ge Imager for Short Wavelength Infrared - A germanium (Ge) short wavelength infrared (SWIR) imager and associated fabrication process are provided. The imager comprises a silicon (Si) substrate with doped wells. An array of pin diodes is formed in a relaxed Ge-containing film overlying the Si substrate, each pin diode having a flip-chip interface. There is a Ge/Si interface, and a doped Ge-containing buffer interposed between the Ge-containing film and the Ge/Si interface. An array of Si CMOS readout circuits is bonded to the flip-chip interfaces. Each readout circuit has a zero volt diode bias interface. | 04-15-2010 |
20100127172 | USE OF NOBLE METAL NANOPARTICLES AS LIGHT ABSORBERS AND HEAT GENERATORS IN THERMAL PHOTODETECTORS, SENSORS AND MICROELECROMECHANICAL DEVICES - This disclosure provides methods to integrate heat generating nanoparticles to microelectromechanical (MEMs) and photonic devices such as microbolometers and thermopiles for better photodetection and electrical energy generation. Nanoparticles include noble metal and semiconductor nanocrystals of different shapes, as light sensing and heat generating materials. | 05-27-2010 |
20100181484 | NEAR-INFRARED IMAGING SENSOR - A near-infrared imaging sensor according to the present invention includes a photodiode array sensitive to light with a wavelength of 1.2 to 3 μm and a multiplexer including a signal readout circuit. The near-infrared imaging sensor is contained in a housing and is vacuum-sealed. The housing includes a main body section and a lid covering the main body section. The lid is made of a material transparent to light with a wavelength of 1.2 to 3 μm. | 07-22-2010 |
20100213372 | Device For Imaging And Method For Producing The Device - A device for imaging the local distribution of at least one thermodynamic variable includes a radiation emitter capable of emitting electromagnetic radiation and a filter for filtering electromagnetic radiation. The emitter and the filter form an arrangement adapted for modifying the electromagnetic radiation emitted by the emitter in dependency of the local distribution of at least one thermodynamic variable at the location of the arrangement. The emitter further includes at least one electroluminescent layer and the filter is provided with at least one filter layer. The electroluminescent layer and the filter layer are integrated within a cohesive sequence of layers. The device is particularly suitable for infrared camera systems. | 08-26-2010 |
20100230594 | INFRARED SOLID-STATE IMAGE SENSOR - An infrared solid-state image sensor comprises: a pixel area comprising a sensitive pixel area where infrared detection pixels are arranged in a matrix form to detect incident infrared rays on the semiconductor substrate and a reference pixel area where reference pixels are provided, each of the infrared detection pixels comprising a thermoelectric conversion part, the thermoelectric conversion part comprising an infrared absorption film to absorb the incident infrared rays and convert the incident infrared rays to heat and a first thermoelectric conversion element to convert the heat obtained by the conversion in the infrared absorption film to a electric signal, each of the reference pixels comprising a second thermoelectric conversion element. Each of first ends of the reference pixels are connected to a reference potential line, and a difference between the signal potential read out from a corresponding signal line and a reference potential supplied from the reference potential line is amplified and outputted. | 09-16-2010 |
20100237245 | SHUTTERLESS INFRARED IMAGER ALGORITHM WITH DRIFT CORRECTION - An infrared imaging system having functionality for maintaining image quality in the presence of temperature drift of the system. Such functionality is applied repetitively to maintain image quality of a target scene, yet without continuous actuation of a shutter of the system. The functionality of the imaging system results from implementing an imager algorithm. In use, the imager algorithm functions with a calibration curve created for the imaging system, with the curve comprising a plot of system output versus target scene temperature. | 09-23-2010 |
20100243892 | BOLOMETER PIXEL PROVIDED WITH A MIM INTEGRATION CAPACITOR - A thermal imaging microelectronic device comprising:
| 09-30-2010 |
20100252736 | IMAGING SYSTEM - An imaging system is described which includes a radiation source outputting radiation incident on a scene. The radiation is pulsed and the reflected radiation is detected by a detector array and a resulting signal output by a read out circuit. The signal output is characteristic of the scene on which the radiation is incident. The output signal is combined over a number of pulses, the averaging being carried out on-chip and within the detector circuitry. The radiation source may be a semiconductor diode source amplified with a doped fibre amplifier. | 10-07-2010 |
20100258725 | ON-WAFER BUTTED MICROBOLOMETER IMAGING ARRAY - An apparatus and method for assembling a large microbolometer infrared imaging array from sub-arrays, comprising the step of forming a sub-array assembly of independent imaging arrays on the silicon wafer as the imaging sensor is being processed, whereby seams or gaps in a resulting image are avoided. | 10-14-2010 |
20100282967 | HIGH SENSITIVITY THZ SIGNAL DETECTOR AND CAMERA - Taught is a high sensitivity THz detector and camera comprising an integration body of a photonic crystal THz micro-cavity and semiconductor transistor on a semiconductor base. The THz signal is localized inside of the photonic crystal micro-cavity so as to generate high intensity field in the micro-cavity. The heat effect of the THz wave therein produces electron-hole pairs in the semiconductor. The current carrier is injected into the base electrode of the transistor and is amplified therein to produce signal current in the external circuit and thus high sensitive THz signal detection is realized. Integrating many such detectors together to construct a THz resonant cavity array, each resonant cavity only receives THz light from a certain position and having certain intensity. The signal is converted and then stored to obtain a complete THz image so as to realize imaging in real-time. Special signal amplification circuit is used to eliminate THz background radiation noise. | 11-11-2010 |
20100301214 | INFRARED CAMERA FOR GAS DETECTION - An IR camera is disclosed, comprising two IR detectors for detecting a first and a second image of the imaged area. A beamsplitter is operable to split the incoming radiation into a first beam comprising a first wavelength spectrum and a second beam comprising a second wavelength spectrum different from the first wavelength spectrum. The first beam is received at the first IR detector and the second beam is received at the second IR detector. A processor is operable to calculate properties of the imaged area based on the first and the second image in relationship to each other. The information obtained may be used, for example, to detect the presence or identity of a gas or to determine the material properties of an imaged object. | 12-02-2010 |
20110049365 | LOW ENERGY PORTABLE LOW-LIGHT CAMERA WITH WAVELENGTH CUTOFF - A sensor for night vision applications is provided, wherein the sensor comprises a semiconductor absorption layer of composition that limits long wavelength response cutoff to between 1.25 to 1.4 μm wavelength. The selection of this cutoff frequency provides improved dark current performance, thereby requiring less cooling of the sensor. Consequently, energy consumption is reduced, as the sensor does not require active cooling, so that the sensor is particularly beneficial for mobile night vision applications where battery weight is of high importance. | 03-03-2011 |
20110062332 | Charge-Coupled Device Monitor and Lighting Device Thereof - The present invention discloses a charge-coupled device monitor, comprising a lighting device, at least one charge-coupled unit and a processing unit. The lighting device comprises an infrared light emitting diode, an electrical conducting unit and a light guiding unit. The infrared light emitting diode receives a power to emit a light. The electrical conducting unit is positioned on a side of the infrared light emitting diode, electrically connecting to the infrared light emitting diode to provide the power. The light guiding unit, positioned on the other side of the infrared light emitting diode, changes the projecting profile of the light to a predetermined projecting profile, which comprises at least one straight edge. The charge-coupled unit receive the light emitted by the lighting device in the predetermined projecting profile and transforms the light to at least one electrical signal. The processing unit electrically connecting to the charge-coupled unit transmits an image according to the electrical signal. | 03-17-2011 |
20110062333 | ELECTROMAGNETIC BASED THERMAL SENSING AND IMAGING INCORPORATING MULTI-PIXEL IMAGING ARRAYS - A novel pixel circuit and multi-dimensional array for receiving and detecting black body radiation in the SWIR, MWIR or LWIR frequency bands. An electromagnetic thermal sensor and imaging system is provided based on the treatment of thermal radiation as an electromagnetic wave. The thermal sensor and imager functions essentially as an electromagnetic power sensor/receiver, operating in the SWIR (200-375 THz), MWIR (60-100 THz), or LWIR (21-38 THz) frequency bands. The thermal pixel circuit of the invention is used to construct thermal imaging arrays, such as 1D, 2D and stereoscopic arrays. Various pixel circuit embodiments are provided including balanced and unbalanced, biased and unbiased and current and voltage sensing topologies. The pixel circuit and corresponding imaging arrays are constructed on a monolithic semiconductor substrate using in a stacked topology. A metal-insulator-metal (MIM) structure provides rectification of the received signal at high terahertz frequencies. | 03-17-2011 |
20110062334 | ELECTROMAGNETIC BASED THERMAL SENSING AND IMAGING INCORPORATING DISTRIBUTED MIM STRUCTURES FOR THz DETECTION - A novel pixel circuit and multi-dimensional array for receiving and detecting black body radiation in the SWIR, MWIR or LWIR frequency bands. An electromagnetic thermal sensor and imaging system is provided based on the treatment of thermal radiation as an electromagnetic wave. The thermal sensor and imager functions essentially as an electromagnetic power sensor/receiver, operating in the SWIR (200-375 THz), MWIR (60-100 THz), or LWIR (21-38 THz) frequency bands. The thermal pixel circuit of the invention is used to construct thermal imaging arrays, such as 1D, 2D and stereoscopic arrays. Various pixel circuit embodiments are provided including balanced and unbalanced, biased and unbiased and current and voltage sensing topologies. The pixel circuit and corresponding imaging arrays are constructed on a monolithic semiconductor substrate using in a stacked topology. A metal-insulator-metal (MIM) structure provides rectification of the received signal at high terahertz frequencies. | 03-17-2011 |
20110079714 | IMAGER FOR CONSTRUCTING COLOR AND DEPTH IMAGES - A dual-mode includes a light source configured to project a structured illumination from which visible light can be filtered. The dual-mode imager also includes a detector configured to capture both the structured illumination and visible light from the scene. A temporal or spatial filter is used to selectively block visible light from one or more portions of the detector while passing the structured illumination to the one or more portions of the detector. | 04-07-2011 |
20110089324 | RADIANT ENERGY IMAGER USING NULL SWITCHING - In some aspects, the present invention embodies both the method and apparatus for converting a pattern of irradiation to a visible image. An embodiment of the present invention provides an array of micro-electro-mechanical sensors with each sensor includes a deflectable micro-cantilever, responsive to absorbed incident radiation and to an applied repulsive electrostatic field. In an aspect, the sensor device also includes a null-sensing circuit coupled to a switch contact on or near the substrate, which senses when the micro-cantilever reaches its null location, by electrical connection with an upper switch contact on the micro-cantilever. Other embodiments are also described. | 04-21-2011 |
20110121178 | CAMERA WITH TWO VISUAL IMAGING SUBSYSTEMS FOR DETERMINING PARALLAX AND FOR FOCUSING AN IR IMAGING SUBSYSTEM - A camera has an infrared (“IR”) imaging subsystem that includes an IR detector. The camera also has a first and second visual imaging subsystem for generating a first visual image and a second visual image of an object in a scene. The first visual image and the second visual image have a parallax that is dependent on the distance to the object and based on a known parallax function. The camera also has a processor for determining the parallax between the first visual image and second visual images. The IR imaging subsystem may also include an IR optical element for focusing IR radiation on the IR detector. The IR optical element may be operable to focus the IR radiation on the IR detector based on the parallax between the first visual image and the second visual image. | 05-26-2011 |
20110155908 | COLOR FILTER ARRAY AND IMAGE OBTAINING APPARATUS - A color filter array and image obtaining apparatus are provided. The color filter array includes at least one unit cell having a predetermined array of pixels, and the predetermined array including the color pixels and transparent pixels. Each 2×2 array of pixels in the unit cell includes one transparent pixel and three color pixels and at least one transparent pixel is located in each row or in each column of the unit cell. The image obtaining apparatus generate an electrical image signal corresponding to sensed light that has passed through the color filter array. | 06-30-2011 |
20110198499 | Near-infrared photodetectors, image sensors employing the same, and methods of manufacturing the same - Silicon photodetectors using near-infrared dipole antennas. The photodetectors include a silicon region formed on a semiconductor substrate, dipole antenna forming two arms that are spaced apart with the silicon region therebetween and inducing an electromagnetic wave signal of incident light, and electrodes disposed in a vertical direction of the dipole antenna and spaced apart with the silicon region therebetween, where a critical bias voltage is applied to the electrodes to induce an avalanche gain operation in the silicon region. | 08-18-2011 |
20110210251 | INFRARED SOLID-STATE IMAGING DEVICE - A thermal infrared solid-state imaging device includes a horizontal scanning circuit for scanning a pixel area horizontally to read an infrared image, and vertical scanning circuits provided at both ends of the pixel area. The vertical scanning circuits drive a drive line by applying a driving voltage at both ends of the drive line (in two-end driving). Further a bias voltage is applied at the end of the pixel area to a bias line connected to differential integrating circuits. | 09-01-2011 |
20110233404 | OPTICAL SWITCH WINDOW FOR UNCOOLED FPA PACKAGE - In an uncooled camera having a focal plane array and an optical lens for focusing radiation from infrared radiation sources onto the focal plane array, the improvement comprising providing a thermochromic optical switch for blocking radiation from an extremely hot infrared radiation source from reaching the focal plane array. | 09-29-2011 |
20110260060 | SYSTEM AND METHOD FOR THERMAL IMAGING SEARCHLIGHT - A searchlight includes a canopy, a thermal-imaging camera, and an infrared (IR) light source. The thermal-imaging camera is mounted within the canopy so that the thermal-imaging camera is operable to move in conjunction with the canopy. The IR light source disposed along a periphery of the canopy. | 10-27-2011 |
20110266441 | Pixel-level optically transitioning filter elements for detector devices - Optically transitioning pixel-level filtering using a multi-level structure that includes an isolated optically transitioning filter element that is suspended over a corresponding radiation detector element in a one-to-one relationship to provide, for example, one or more features such as spectral detection and/or selective radiation immunity. | 11-03-2011 |
20110297829 | THREE-DIMENSIONAL HOT SPOT LOCALIZATION - A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT). The 3D analysis is based on the principles of thermal wave propagation through different material layers and the resulting phase shift/thermal time delay. With more complex multi level stacked die architectures it is necessary to acquire multiple LIT results at different excitation frequencies for precise hot spot depth localization. Additionally, the use of multiple time-resolved thermal waveforms, measured in a minimized field of view on top of the hot spot location, can be used to speed up the data acquisition. The shape of the resulting waveforms can be analyzed to further increase the detection accuracy and confidence level. | 12-08-2011 |
20110303846 | IR DETECTOR SYSTEM AND METHOD - An Infra Red detector system and method is disclosed. There is benefit in providing signal processing functions into each pixel of a 2D focal plane IR detector for applications such as hostile target detection. The thermal characteristics of muzzle flash or a projectile and it's trajectory for example are distinguishable from background scene. A technique to add a signal detection function to normal IR detector thermal imaging operation to a standard direct inject Integrate While Read (IWR) pixel circuit and for providing target detection at extremely high data rates is described. | 12-15-2011 |
20110315878 | SIMULTANEOUS DUAL BAND DUAL FOV IMAGING SYSTEM - A two fields-of-view system has both fields of view imaged simultaneously to the same image plane. For example, an optical system comprising of two or more FOV where a common dual band focal plane array is used in order to image both spectral bands independently. Each spectral band is passed through a common imager, but split off by a beam splitter so that each spectral band sees a different field of view centered at the same point. The two fields of view are separated spectrally but enabled to be imaged simultaneously due to the spectral separation of the focal plane array and the use of a beam splitter. Such a system allows viewing two fields of view simultaneously. | 12-29-2011 |
20120006987 | Charged Particle Beam Processing System with Visual and Infrared Imaging - A charged particle beam system for processing substrates is disclosed, comprising a charged particle column, combination infrared radiation and visible light illumination and imaging subsystems, in-vacuum optics, and a precision stage for supporting and positioning the substrate alternately under the charged particle column and the imaging system. The axes of the charged particle column and imaging system are offset to enable much closer working distances for both imaging and beam processing than would be possible in a single integrated assembly. A method for extremely accurately calibrating the offset between the column and imaging system is disclosed, enabling beam processing at precisely-determined locations on the substrate. The imaging system is capable of locating sub-surface features on the substrate which cannot be seen using the charged particle beam. Two illumination modes are disclosed, enabling both bright-field and dark-field imaging in infrared radiation and visible light. | 01-12-2012 |
20120012748 | ARCHITECTURES FOR IMAGER ARRAYS AND ARRAY CAMERAS - Architectures for imager arrays configured for use in array cameras in accordance with embodiments of the invention are described. One embodiment of the invention includes a plurality of focal planes, where each focal plane comprises a two dimensional arrangement of pixels having at least two pixels in each dimension and each focal plane is contained within a region of the imager array that does not contain pixels from another focal plane, control circuitry configured to control the capture of image information by the pixels within the focal planes, where the control circuitry is configured so that the capture of image information by the pixels in at least two of the focal planes is separately controllable, and sampling circuitry configured to convert pixel outputs into digital pixel data. | 01-19-2012 |
20120025080 | COLOR CORRECTION CIRCUITRY AND METHODS FOR DUAL-BAND IMAGING SYSTEMS - An imaging system may include a dual-band image sensor that captures visible and near-infrared light and image processing circuitry that performs color corrections on images captured by the dual-band image sensor. The image processing circuitry may analyze each captured image in two different color spaces to determine what type of light source lit each image. The image processing circuitry may determine whether an image was lit by a light source having a relatively high proportion of near-infrared emissions such as an incandescent light, a light source having a relatively low proportion of near-infrared emissions such as a fluorescent light, or a light source having an intermediate proportion of near-infrared emissions such as sunlight or other blackbody radiator. After determining what type of light source lit an image, the image processing circuitry may adjust color balances in that image using a color correction matrix associated with that type of light source. | 02-02-2012 |
20120043464 | INFRARED DETECTOR - In at least one embodiment, an infrared (IR) detector for generating an image of an object is provided. The IR detector includes a plurality of thermal sensing elements that are arranged in an array of M columns and N rows. Each thermal sensing element is configured to receive at least one oscillating signal and detect at least a portion of a thermal output from the object. Each thermal sensing element is further configured to generate an electrical output signal that is indicative of at least a portion of detected thermal output and to modulate the electrical output signal with the at least one oscillating signal to generate a modulated output signal that is indicative of at least a portion of the image of the object. | 02-23-2012 |
20120061567 | IMAGING APPARATUS AND METHODS - Imagers, pixels, and methods of using the same are disclosed for imaging in various spectra, such as visible, near infrared (IR), and short wavelength IR (SWIR). The imager may have an imaging array having pixels of different types. The different types of pixels may detect different ranges of wavelengths in the IR, or the SWIR, spectra. The pixels may include a filter which blocks some wavelengths of radiation in the IR spectrum while passing other wavelengths. The filter may be formed of a semiconductor material, and therefore may be easily integrated with a CMOS pixel using conventional CMOS processing techniques. | 03-15-2012 |
20120074321 | VARIABLE WAVEBAND INFRARED IMAGER - A waveband imager includes an imaging pixel that utilizes photon tunneling with a thermally actuated bimorph structure to convert infrared radiation to visible radiation. Infrared radiation passes through a transparent substrate and is absorbed by a bimorph structure formed with a pixel plate. The absorption generates heat which deflects the bimorph structure and pixel plate towards the substrate and into an evanescent electric field generated by light propagating through the substrate. Penetration of the bimorph structure and pixel plate into the evanescent electric field allows a portion of the visible wavelengths propagating through the substrate to tunnel through the substrate, bimorph structure, and/or pixel plate as visible radiation that is proportional to the intensity of the incident infrared radiation. This converted visible radiation may be superimposed over visible wavelengths passed through the imaging pixel. | 03-29-2012 |
20120085907 | INFRARED ARRAY SENSOR - The infrared array sensor comprises a base with recess and a plurality of image elements on the base to cover the recess. The image element has the first infrared absorption members and the thermosensors. The thin film structural body is formed with a slit which divides the thin film structural body into the cantilevers. The cantilever has one lengthwise end which is defined as the first end, and remaining one lengthwise end which is defined as the second end. The thermosensor is disposed on the cantilever. When the temperature variation of the thermosensor is caused, the thermosensor generates the output signal corresponding to the temperature variation of the thermosensor. | 04-12-2012 |
20120091340 | SCENE BASED NON-UNIFORMITY CORRECTION FOR INFRARED DETECTOR ARRAYS - In various embodiments, a method and system for compensating non-uniformities among detector elements of a detector array, without the use of dither mirrors or requirement of scene motion for non-uniformity correction achieved by computing scene spatial gradient and temporal gradient of image frames of the scene captured by the detector array at different times, and utilizing both the scene spatial and temporal gradients in detailed local gradient processing. Such local gradient processing may include computing masks to preserve spatial scene details, while eliminating scene noise (e.g., fixed pattern noise) from the captured image frames and correcting non-uniformity among detector elements. | 04-19-2012 |
20120119088 | INFRARED IMAGING DEVICE - An infrared imaging device according to an embodiment includes: an imaging area formed on a semiconductor substrate, the imaging area having a plurality of pixels arranged in a matrix form, the plurality of pixels including a plurality of reference pixels arranged in at least one row and a plurality of infrared detection pixels arranged in remaining rows to detect incident infrared rays, each of the reference pixels having a first thermoelectric conversion element, each of the infrared detection pixel having a thermoelectric conversion unit, the thermoelectric conversion unit having an infrared absorption film to absorb the incident infrared rays and convert the incident infrared rays to heat and a second thermoelectric conversion element to convert the heat obtained by the conversion conducted by the infrared absorption film to an electric signal. | 05-17-2012 |
20120132805 | ELECTRONIC CIRCUIT FOR BIASING AND READING A RESISTIVE THERMAL DETECTOR - An electronic circuit, for biasing and reading at least one resistive thermal detector, comprising:
| 05-31-2012 |
20120138797 | INFRARED SENSORS, FOCAL PLANE ARRAYS AND THERMAL IMAGING SYSTEMS - An infrared sensor and infrared imaging system, wherein said infrared sensor comprises: a first film structure, a second film structure, a gap between said first film structure and said second film structure. Reference light is incident from one of said first film structure and said second film structure. When said gap distance changes, the intensity of transmitted reference light changes, and the intensity of reflected reference light changes. When infrared light is incident, at least one of the said first and second film structures absorbs infrared light and the temperature changes, causing said gap distance to change. By detecting the intensity of said transmitted reference light or reflected reference light, the incident infrared light can be measured. | 06-07-2012 |
20120145903 | SYSTEM FOR PRODUCING ENHANCED THERMAL IMAGES - An imaging device has a thermal sensor to remotely measure respective temperatures of regions within an imaging field and to generate temperature information signals. A motion tracking system tracks motion of the thermal sensor and generates position information signals representing positions of the thermal sensor during the temperature measurements. An image construction processor uses the position and temperature information signals to generate a two-dimensional image representative of the imaging field including respective temperature indications at different locations within the two-dimensional image, and stores the two-dimensional image within a memory. The two-dimensional image may be used as an output image for display to a user. | 06-14-2012 |
20120153148 | SYSTEM AND METHOD FOR TERAHERTZ 2D INTERFEROMETRIC AND SYNTHETIC APERTURE IMAGING WITH AN INCOHERENT SOURCE - An interferometric and synthetic aperture THz incoherent imaging system is provided, in which a high-power electronic source such as a 0.094 THz Gunn Oscillator is integrated with a continuous-wave (CW) terahertz detection system in order to achieve a high signal-to-noise ratio. THz imaging of a point source located 10 m away from the detector array is presented. A 2-D THz reflective image is reconstructed with only four detectors using rotational synthesis. | 06-21-2012 |
20120168625 | Millimeter Wave Imaging Sensor - A millimeter wave imaging sensor includes a plurality of millimeter wave sensors disposed on one plane intersecting an incoming direction of millimeter waves emitted from a subject. Each of the plurality of millimeter wave sensors includes an antenna portion, a wave detection unit, a transmission path, and a shielding member. Adjacent millimeter wave sensors, among the plurality of millimeter wave sensors, are positioned according to outer peripheral shape of the shielding members of the adjacent millimeter wave sensors. | 07-05-2012 |
20120228496 | UNCOOLED INFRARED IMAGING ELEMENT AND MANUFACTURING METHOD THEREOF - An uncooled infrared imaging element includes a pixel region, a device region, and a support substrate. The pixel region includes heat-sensitive pixels. The heat-sensitive pixels are arranged in a matrix and change current-voltage characteristics thereof in accordance with receiving amounts of infrared. The device region includes at least one of a drive circuit and a readout circuit which includes a MOS transistor. The drive circuit drives the heat-sensitive pixels. The readout circuit detects signals of the heat-sensitive pixels. The support substrate is provided with a cavity region to be under pixel region and the MOS transistor. | 09-13-2012 |
20120228497 | INFRARED IMAGING ELEMENT - An infrared imaging element according to an embodiment includes: a semiconductor substrate including a stacked structure of a silicon first substrate, and a first insulation film, first cavities being provided on a surface of the first substrate; an infrared detection unit provided in the semiconductor substrate and including, detection cells provided respectively over the first cavities, each of the detection cells having diodes and a second insulation film, the first insulation film converting incident infrared rays to heat, the diodes converting the heat obtained by the first insulation film to an electric signal, a third insulation film having a top face located at a greater distance from the semiconductor substrate as compared with a top face of the second insulation film; and a second substrate provided over the third insulation film. A second cavity is formed between the second substrate and the infrared detection unit. | 09-13-2012 |
20120241614 | Apparatus and Method for Multi-Spectral Imaging - An apparatus for multi-spectral imaging includes a microbolometer array comprising a two-dimensional array of microbolometer detectors that are configured to respond to energy having a first range of wavelengths comprising a first plurality of spectral bands. The apparatus also includes a wideband window configured to allow energy having a second range of wavelengths to reach the microbolometer array. The second range of wavelengths comprises a second plurality of spectral bands. The apparatus additionally includes optics configured to focus the energy from a scene towards the microbolometer array. The apparatus further includes a processor configured to generate an output based on a response of the microbolometer array to energy having a third range of wavelengths comprising a third plurality of spectral bands. There is substantial overlap between the first, second, and third range of wavelengths and the first, second, and third plurality of spectral bands. | 09-27-2012 |
20120241615 | TERAHERTZ WAVE DETECTION DEVICE, TERAHERTZ WAVELENGTH FILTER, IMAGING DEVICE, AND MEASUREMENT DEVICE - A terahertz wave detection device includes a wavelength filter transmitting terahertz waves having a predetermined wavelength, and a detection portion detecting the terahertz waves having the predetermined wavelength that have passed through the wavelength filter by converting the terahertz waves into heat, wherein the wavelength filter includes a metal layer having a plurality of holes communicating with an incident surface onto which the terahertz waves are incident and an emission surface from which the terahertz waves having the predetermined wavelength are emitted, and a dielectric portion filling in the plurality of holes and made of a dielectric, wherein the plurality of holes are formed with a predetermined pitch along a direction that is perpendicular to a normal line of the incident surface. | 09-27-2012 |
20120261575 | Thermal Imager Using Metamaterials - An apparatus and method are disclosed for detecting terahertz radiation at room temperature. A detecting pixel includes a sub-wavelength split-ring resonator, and is mechanically coupled to (but thermally decoupled from) a substrate via a cantilever formed from two materials that have a significant mismatch in their thermal expansion coefficients. Incident radiation causes the split-ring resonator to resonate, thereby generating heat that is transferred to the cantilever, causing the cantilever to flex. An optical readout system includes a secondary light source, such as a laser, that shines on a reflective surface on the pixel, whereby a photodiode detects the reflected light and permits calculation of a relative deflection of the pixel in the nanometer range. An exemplary detector has a noise equivalent power rating of approximately 60 pW/√Hz. | 10-18-2012 |
20130075607 | IMAGE SENSORS HAVING STACKED PHOTODETECTOR ARRAYS - An image sensor of an aspect includes a first photodetector array and a second photodetector array. The second photodetector array is coupled under the first photodetector array. Photodetectors of the second photodetector array are coupled under corresponding photodetectors of the first photodetector array. The image sensor includes a thickness of a photocarrier generation material optically coupled between the corresponding photodetectors of the first and second arrays. Other image sensors, methods of making the image sensors, methods of using the image sensors, and color filter patterns for such image sensors are also disclosed. | 03-28-2013 |
20130082178 | MICROBOLOMETER DETECTOR LAYER - A microbolometer is disclosed, including a bottom dielectric of a bridge structure; a detector layer disposed above the bottom dielectric, the detector layer comprised of a metal-doped vanadium pentaoxide material; and a top dielectric disposed above the detector layer. | 04-04-2013 |
20130099118 | TERAHERTZ WAVE DETECTING DEVICE, IMAGING DEVICE, AND MEASURING DEVICE - A terahertz wave detecting device includes a wavelength filter and a detection part. The wavelength filter is configured to convert terahertz waves to heat. The detection part is configured to detect the heat converted by the wavelength filter. The wavelength filter includes a wavelength selection layer and a terahertz wave absorption layer. The wavelength selection layer is configured to transmit terahertz waves of a prescribed wavelength among the terahertz waves. The terahertz wave absorption layer is provided in contact with the wavelength selection layer and the detection part, and contains a material for absorbing the terahertz waves of the prescribed wavelength. | 04-25-2013 |
20130153766 | WAFER-LEVEL INTRAPIXEL GETTER REFLECTOR WHOLE DIE ENCAPSULATION DEVICE AND METHOD - An apparatus and method for a wafer level vacuum package uncooled microbolometer focal plane array (FPA) on a wafer level substrate with a thin film getter-reflector (G-R). The G-R removes gas from the vacuum package and is reflective in the frequency band of the FPA. Sensor pixels are supported about a quarter-wavelength above the G-R which is within the perimeter of the imaging array. The package is evacuated through a single aperture, and vacuum is maintained for the lifetime of the FPA. Imaging sensor size is reduced while maintaining resolution by reducing non-imaging area. | 06-20-2013 |
20130161514 | HIGH-SPEED GIGA-TERAHERTZ IMAGING DEVICE AND METHOD - A high-speed room-temperature imaging system, especially for electromagnetic radiation in the GHz and THz frequency range, is based on the sensor consisting of a matrix of plasmonic semiconductor detectors. The imaging system comprises a radiation source module, a terahertz beam director module, a plasmonic imaging sensor module, and a signal processing module. Entire image is formed simultaneously providing for high-speed image acquisition. Images can be acquired either at a single frequency (discrete spectrum) or wide frequency bands (continuous spectrum). The imaging system can be used in defectoscopy, inspection, medical and other applications. | 06-27-2013 |
20130181129 | High Resolution Thermography - A thermographic imaging device includes a focal array portion including a planar arrangement of a plurality of light sensitive devices, and an aperture portion including a facing planar surface, an opposing planar surface, and an arrangement of a plurality of orifices that are communicative with the facing planar surface and the opposing planar surface, each infrared sensitive device of the plurality of infrared arranged in alignment with a corresponding orifice of the plurality of orifices. | 07-18-2013 |
20130248711 | INFRARED SENSOR - An infrared sensor, comprising at least one pixel comprising a first sensor and a second sensor, wherein the first and second sensors are dissimilar. | 09-26-2013 |
20140291520 | IMAGER FOR CONSTRUCTING COLOR AND DEPTH IMAGES - A dual-mode includes a light source configured to project a structured illumination from which visible light can be filtered. The dual-mode imager also includes a detector configured to capture both the structured illumination and visible light from the scene. A temporal or spatial filter is used to selectively block visible light from one or more portions of the detector while passing the structured illumination to the one or more portions of the detector. | 10-02-2014 |
20150034825 | DEVICE FOR RADIATING OR RECEIVING ELECTROMAGNETIC WAVES - The present invention relates to a device for radiating or receiving an electromagnetic wave. The device includes a substrate including a recess coated by a material that reflects the electromagnetic wave, a metal portion that radiates or receives the electromagnetic wave, and an electronic element connected to the metal portion on the substrate. The metal portion includes a portion provided above an opening of the recess and a portion which is located on the substrate and connected to the electronic element. | 02-05-2015 |
20150069237 | INFRARED CONVERSION DEVICE, IMAGING APPARATUS, AND IMAGING METHOD - An infrared conversion device includes: a substrate ( | 03-12-2015 |
20150069238 | TERAHERTZ ELECTROMAGNETIC WAVE GENERATOR,TERAHERTZ SPECTROMETER AND METHOD OF GENERATING TERAHERTZ ELECTROMAGNETIC WAVE - A terahertz electromagnetic wave generator according to the present disclosure includes: a substrate; a thermoelectric material layer which is supported by the substrate and which has a surface; and a pulsed laser light source system which locally heats the thermoelectric material layer with an edge of the surface of the thermoelectric material layer irradiated with pulsed light, thereby generating a terahertz electromagnetic wave from the thermoelectric material layer. | 03-12-2015 |
20150069239 | DIVIDED-APERTURE INFRA-RED SPECTRAL IMAGING SYSTEM FOR CHEMICAL DETECTION - A divided-aperture infrared spectral imaging (DAISI) system that is structured to provide identification of target chemical content in a single imaging shot based on spectrally-multiplexed operation. The system is devoid of spectral scanning acquisition of infrared (IR) spectral signatures of target content with an IR detector and does not require content. | 03-12-2015 |
20150136982 | DIVIDED-APERTURE INFRA-RED SPECTRAL IMAGING SYSTEM - Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays disposed in the focal plane of two corresponding focusing lenses. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays. | 05-21-2015 |
20150309153 | LIGHT SOURCE POSITION DETECTION APPARATUS, LIGHT SOURCE TRACKING APPARATUS, CONTROL METHOD AND PROGRAM - A light source position detection apparatus ( | 10-29-2015 |
20150350572 | NIGHT-VISION DEVICE - A night-vision device is provided with a projection unit, an image pickup unit, a luminance ratio determining unit, and a projection control unit. The luminance ratio determining unit determines whether a determination luminance ratio in a set region is within a predetermined luminance range as a luminance ratio at which a subject to be detected forms an emphasized image, said set region having been set at least in a part of an image obtained by means of the image pickup unit. In the cases where the determination luminance ratio is out of the predetermined luminance range, the projection control unit controls the intensity of near-infrared light emitted from the projection unit such that the determination luminance ratio is within the predetermined luminance range. | 12-03-2015 |
20150362374 | Atomic Layer Deposition of Vanadium Oxide for Microbolometer and Imager - This disclosure describes a microbolometer sensor element and microbolometer array imaging devices optimized for infrared radiation detection that are enabled using atomic layer deposition (ALD) of vanadium oxide material layer (VO | 12-17-2015 |
20150369670 | DIGITAL IMAGING BOLOMETER AND METHOD OF MEASURING PHOTON RADIATION IN A PIXELATED IMAGE - A digital bolometer architecture provides dynamic control of a simultaneous integration time for all pixels, with a temporal response that is more uniform than conventional bolometers and lacks frame cross-talk from decay tails, and which supports sub-frame measurement for on readout computational imaging. This is accomplished by replacing resistive pixel temperature sensing with continuous optical interferometric measurement and subsequent signal accumulation. Balanced reference sensors allow rejection of temperature differences across the thermal sink. The thermal time constant of the pixels is substantially reduced and the lost SNR is recovered by integration of the measured signals, using a programmable integration time. | 12-24-2015 |
20160037089 | MULTI-BAND THERMAL IMAGING SENSOR WITH INTEGRATED FILTER ARRAY - Infrared imaging systems and methods incorporating the use of pixelated filter arrays integrated with the imaging detector. In one example, an infrared imaging system includes imaging optics that focus infrared radiation towards a focal plane of the system, an uncooled focal plane array sensor configured to receive the infrared radiation from the imaging optics, and a processor coupled to the uncooled focal plane array sensor and configured to receive and process image data received from the uncooled focal plane array sensor. The uncooled focal plane array sensor includes a two-dimensional array of microbolometer pixels and a corresponding two-dimensional filter array integrated and aligned with the two-dimensional array of microbolometer pixels such that each microbolometer pixel has a corresponding filter. The filter array is configured to filter the infrared radiation into at least two spectral bands or at least two polarizations. | 02-04-2016 |
20160057364 | COMPACT SHORT FLAT-FIELD SCHMIDT OPTICS FOR MM-WAVE OPERATION - Millimeter-wave optical imaging systems and methods. In one example, a mm-wave optical imaging system includes a mm-wave imaging detector located at a focal plane of the optical imaging system, an immersion lens directly coupled to the imaging detector and configured to focus the electromagnetic radiation onto the imaging detector, the immersion lens having a curved first surface and an opposing planar second surface, wherein the focal plane is located on the planar second surface and the imaging detector is directly coupled to the planar second surface, a positive power primary minor configured to reflect the electromagnetic radiation towards the immersion lens, and a Schmidt aspheric corrector configured to receive and direct the electromagnetic radiation towards the primary minor, wherein the system aperture stop is located on the Schmidt aspheric corrector. | 02-25-2016 |
20160088240 | PROTECTIVE WINDOW FOR AN INFRARED SENSOR ARRAY - Various embodiments of the present disclosure may include a focal plane array configured to capture thermal image data from a scene. The embodiments may further include a sensor window displaced a first distance from the focal plane array. The embodiments may also include a protective window displaced a second distance greater than the first distance from the focal plane array, wherein the second distance causes damage or debris incident on the protective window to be out of focus in the thermal image data. | 03-24-2016 |
20160103000 | OPTICAL POSITION ENCODER - Optical position encoding mechanisms and methods for use in reimaged optical imaging systems. In one example, a reimaged optical imaging system includes an imaging detector, an optical component, and at least one light source coupled to the optical component and configured to be reimaged onto the imaging detector, wherein a position of an image of the at least one light source at the imaging detector encodes a position of the optical component relative to the imaging detector. | 04-14-2016 |
20160118444 | ORGANIC P-N JUNCTION BASED INFRARED DETECTION DEVICE AND MANUFACTURING METHOD THEREOF AND INFRARED IMAGE DETECTOR USING SAME - The present invention provides an organic p-n junction based infrared detection device and a manufacturing method thereof and an infrared image detector using the device. The organic p-n junction based infrared detection device ( | 04-28-2016 |
20160161338 | Dual Spectral Imager with No Moving Parts - A device images radiation from a scene in two wavelength bands. An uncooled detector of the radiation includes two separate detector regions. A first filter associated with the first detector region allows radiation in a first wavelength band to be imaged on the first detector region. A second filter associated with the second detector region allows radiation in a second wavelength band to be imaged on the second detector region. An image forming optical component forms an image of the scene on the detector. Two wedge-shaped components are positioned at a fixed distance from the image forming optical component. Each wedge-shaped component directs radiation from the scene through the image forming optical component onto the detector. The radiation is imaged separately onto the two detector regions through an f-number of less than approximately 1.5. Imaged radiation on each detector region includes radiation in one respective wavelength band. | 06-09-2016 |
20160169747 | SYSTEM AND METHOD FOR RAPID THERMAL DATA ACQUISITION | 06-16-2016 |
20160254309 | IMAGING APPARATUS | 09-01-2016 |