| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 228560300 | SOLDER FORM | 16 |
| 20080237301 | Solder preform and a process for its manufacture - A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example. | 10-02-2008 |
| 20090020585 | Aluminum alloy brazing sheet having high-strength and production method therefor - An aluminum alloy brazing sheet having high strength comprising: | 01-22-2009 |
| 20090101695 | GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, AND HIGH RESIN FLOWABILITY RESISTANCE - There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm. | 04-23-2009 |
| 20100065611 | STRUCTURE FOR JOINING MEMBERS - A structure for joining members which is suited for joining of thin members together and suited for joining of members made of different materials. The structure includes a nut, a first member superposed on the nut such that a preliminarily formed hole on the first member is contiguous with the threaded hole of the nut, and a second member superposed on the first member so as to cover the hole. | 03-18-2010 |
| 20100127044 | SOLDER BALL - An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a bonding reliability of the solder balls by reducing an oxide film on a surface of the solder ball. | 05-27-2010 |
| 20110068149 | Solder preform and a process for its manufacture - A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example. | 03-24-2011 |
| 20110089222 | FILLER METAL WITH FLUX FOR BRAZING AND SOLDERING AND METHOD OF MAKING AND USING SAME | 04-21-2011 |
| 20120006881 | Flux Cored Preforms for Brazing - A brazing material wire preform suitable for use in brazing two components to one another. The preform is made from a length of wire having a core of flux material, and a longitudinal seam or gap that extends over the length of the wire. The seam is formed so that when heated, the flux material flows from the core and out of the seam. The length of wire is in the form of a loop having a certain circumference so that when the preform is heated, the flux material disperses uniformly from the circumference of the preform for evenly treating the surface of a component on which the preform is placed. The length of wire may include a silver alloy. | 01-12-2012 |
| 20120012642 | INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. With a two-layer ball-limiting composition comprising an adhesion/reaction barrier layer, wherein the adhesion/reaction barrier layer serves both as an adhesion layer and a reaction barrier layer, the adhesion/reaction barrier layer can be comprised of a material selected from the group consisting of Zr and ZrN | 01-19-2012 |
| 20120118936 | Ni BASE ALLOY SOLID WIRE FOR WELDING - An object of the present invention is to provide a Ni base alloy solid wire for welding, which has excellent cracking resistance to ductility dip cracking in weld metal, can increase the tensile strength of the weld metal to not less than the tensile strength of the base material, and has excellent weldability. The present invention provides a solid wire which has a composition containing Cr: 27.0 to 31.5 mass %, Ti: 0.50 to 0.90 mass %, Nb: 0.40 to 0.70 mass %, Ta: 0.10 to 0.30 mass %, C: 0.010 to 0.030 mass %, and Fe: 5.0 to 11.0 mass %, and is regulated to Al: 0.10 mass % or less, N: 0.020 mass % or less, Zr 0.005 mass % or less, P:0.010 mass % or less, S: 0.0050 mass % or less, Si: 0.50 mass % or less, and Mn: 1.00 mass % or less, with the balance including Ni and inevitable impurities. | 05-17-2012 |
| 20120286025 | Ni-Fe-BASED ALLOY BRAZING FILLER MATERIAL - A Ni—Fe-based alloy brazing filler material is provided comprising, in mass %, Fe: 21 to 40%; Cr: 10 to 30%; P: 7 to 11%; B: 0 to 5%; Si: 0 to 4.5%; V: 0 to 5%; Co: 0 to 5%; Mo: 0 to 5%; the balance being Ni and unavoidable impurities, wherein the mass ratio of Fe to P (Fe/P) is in a range of 2.6 to 5. The present invention provides a Ni—Fe-based alloy brazing filler material having a low melting temperature and a superior corrosion resistance and comprising raw materials that are relatively easily available, for use in manufacture of stainless-steel heat exchangers or the like. | 11-15-2012 |
| 20130082087 | SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE - A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is sucked surface. | 04-04-2013 |
| 20150122874 | SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE - A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup. | 05-07-2015 |
| 20160199946 | SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE | 07-14-2016 |
| 20160375517 | SOLDER WIRE BOBBINLESS COIL - A solder wire bobbinless coil includes a solder wire coil formed by winding a solder wire into a hollow columnar, the solder wire coil having a first coil opening at one end of the hollow columnar, and a second coil opening at the other end of the hollow columnar; and a covering film covering an outer surface of the solder wire coil. The covering film has a first film opening smaller than the first coil opening on a portion covering the first coil opening and a second film opening equal to or smaller than the second coil opening on a portion covering the second coil opening, and the first film opening includes, at a peripheral area thereof, a first protruding portion extending so as to protrude to an inner side of the first coil opening. | 12-29-2016 |
| 20170232561 | ALUMINUM ALLOY BRAZING SHEET | 08-17-2017 |
