| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 228033000 | INCLUDING MEANS TO APPLY FLUX OR FILLER TO WORK OR APPLICATOR | 84 |
| 20080272177 | CONDUCTIVE BONDING MATERIAL FILL TECHNIQUES - A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity. | 11-06-2008 |
| 20090308912 | DEVICE FOR THE CONTROLLED DISPLACEMENT OF A SPRAY NOZZLE TO INDIVIDUAL SPRAY POINTS, IN PARTICULAR FOR SPRAYING FLUX IN WAVE SOLDERING UNITS - The invention relates to a device for the controlled displacement of an upward-directed spray nozzle to individual spray points that are situated a distance apart, in particular for spraying flux in wave soldering units. The spray nozzle is situated axially on a rotary axle rotated by a rotary drive, to which a deflection force directly radially to the rotary axle is applied in such a way that, when the rotary axle rotates, the spray nozzle executes a self-contained annular motion whose contour is limited in the radial direction by a stationary mask surrounding the spray nozzle. | 12-17-2009 |
| 20110127312 | Injection Molded Solder Method for Forming Solder Bumps on Substrates - A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified. | 06-02-2011 |
| 20110132967 | Ignition Source System for an Exothermic Reaction Mold Device - An ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A lid covers the open top wherein the lid has an opening therethrough. An electronic thermal igniter assembly has an ignition component receivable through the opening in the lid so that the exothermic weld material may be ignited by the electronic thermal igniter assembly. The igniter plug rests on top of the lid and the ignition body is retained in a recess within the igniter plug. | 06-09-2011 |
| 20110233262 | Micro-Fluidic Injection Molded Solder (IMS) - A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed. | 09-29-2011 |
| 20110278348 | AUTOMATIC SOLDERING DEVICE AND CARRIER DEVICE - To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. | 11-17-2011 |
| 20120132694 | Micro-Fluidic Injection Molded Solder (IMS) - A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed. | 05-31-2012 |
| 20130043296 | AUTOMATIC TORCH FLUXING APPARATUS - An automatic torch fluxing apparatus is provided and includes a supply of fuel, a flux container formed to define a reservoir of non-corrosive flux for aluminum brazing, the reservoir being receptive of the fuel whereby the fuel and the flux form a fuel/flux mixture and a torch to which the fuel/flux mixture is deliverable, the torch being configured to ignite the fuel in the fuel/flux mixture to form a flux enriched flame. | 02-21-2013 |
| 20130134207 | SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE SAME - Disclosed herein is a solder bump forming apparatus including: a flux dispenser dispensing a flux to a processing substrate; a solder dispenser dispensing a solder to the processing substrate to which the flux is applied while moving following the flux dispenser; and driver driving the flux dispenser and the solder dispenser. | 05-30-2013 |
| 20130284794 | METAL BONDING APPARATUS - The metal bonding apparatus comprises: a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion; a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion so as to sandwich the solution between the first bonding portion and the second bonding portion, and in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; and a heating unit configured to heat the first bonding portion and the second bonding portion, wherein the first bonding portion and the second bonding portion are bonded by the pressure applied by the pressing unit and the heat from the heating unit. | 10-31-2013 |
| 20130327811 | THREE DIMENSIONAL FLIP CHIP SYSTEM AND METHOD - Solder is simultaneously transferred from a mold to a plurality of 3D assembled modules to provide solder bumps on the modules. The mold includes cavities containing injected molten solder or preformed solder balls. A fixture including resilient pressure pads and vacuum lines extending through the pads applies pressure to the modules when they are positioned on the mold. Following reflow and solder transfer to the modules, the fixture is displaced with respect to the mold. The modules, being attached to the fixture by vacuum pressure through the pads, are displaced from the mold with the fixture. | 12-12-2013 |
| 20140034707 | SOLDER INJECTION HEAD - Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate. | 02-06-2014 |
| 20140117067 | VISCOUS MATERIAL FEEDER AND VISCOUS MATERIAL PRINTER - This viscous material feeder includes a nozzle to discharge a viscous material stored in a storage portion storing the viscous material and a feeding mechanism transferring the viscous material from the storage portion to the nozzle and discharging the viscous material from the nozzle. The nozzle has a bent feed route to guide the viscous material from the storage portion to a tip of the nozzle and is configured to be dividable along the bent feed route. | 05-01-2014 |
| 20150034698 | ROBOT - A robot includes: a stage unit; a rotation base connected to the stage unit in a rotatable manner around a predetermined rotating axis; an arm unit connected to the rotation base and having a base end rotatable around a first rotation axis that is substantially orthogonal to the rotating axis; a balancer connected to both the rotation base and the arm unit; and a cable arranged along the arm unit outside the balancer while supported by that balancer. | 02-05-2015 |
| 20150041520 | IGNITION DEVICE FOR EXOTHERMIC WELDING, MOLD FOR EXOTHERMIC WELDING FOR THE IGNITION DEVICE, AND APPARATUS FOR EXOTHERMIC WELDING COMPRISING SUCH A MOLD AND SUCH AN IGNITION DEVICE - The present invention relates to an ignition device for exothermic welding comprising an electrically conductive metal bushing ( | 02-12-2015 |
| 20150083785 | PURGING DEVICE FOR PIPE WELDING - Disclosed is a purging device for pipe welding, comprising: a pair of sealing tools that are disposed inside a pipe, expand by supplied air and are in contact with an inner wall of the pipe; and a connection pipe that is disposed between the pair of sealing tools, is a cylindrical body, wherein the sealing tools are respectively fixed to either side end of the connection pipe and the connection pipe is provided with a gas nozzle for discharging inert gas supplied from the outside, wherein each of the sealing tools further comprises a blocking layer that is flame retardant and is coupled in such a manner as to surround an outer circumferential surface of each of the sealing tools. | 03-26-2015 |
| 228035000 | By brush, wick, or pad | 1 |
| 20130221072 | Ex Flux - A flux application device is disclosed that allows users to solder copper pipe together with just one hand, thus the flux application device combines a brush and flux into one unit. The flux application device comprises a nozzle, a reservoir which typically comprises flux and is in fluid communication with the nozzle, and a brush head for applying the flux. The reservoir is a flexible reservoir containing flux that is secured to the nozzle to deliver the flux to a user. The flexible reservoir can be a reusable reservoir that a user would manually fill with flux, or a pre-filled replacement tube of flux. | 08-29-2013 |
| 228036000 | By partial or total immersion of work or applicator into liquid | 19 |
| 20090250504 | Solder applying apparatus - A solder applying apparatus includes a tray body having a base portion and a surrounding portion extending from a periphery of the base portion, cooperating with the base portion to define a solder-accommodating space therebetween for receiving a solder material therein, and having a top end distal from the base portion. The base portion has an inner wall confining a bottom side of the solder-accommodating space. The inner wall of the base portion is divided into a plurality of parallel planar regions. Each of the planar regions cooperates with an adjacent one of the planar regions to define a step therebetween so as to permit the planar regions to have different depths relative to the top end of the surrounding portion. | 10-08-2009 |
| 20110284619 | POINT FLOW SOLDERING APPARATUS - To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder. | 11-24-2011 |
| 20120160898 | DEVICE FOR SUPPLYING AN INERT GAS TO A WAVE SOLDERING INSTALLATION - The invention relates to a device for supplying inert gas in order to protect the surface of a solder bath in a wave soldering installation and the components to be soldered against oxidation. Wave soldering installations form solder waves over which parts to be soldered are transported. The parts to be soldered are generally electronic printed circuit boards which have electronic components soldered onto their undersides by the solder wave making contact with the printed circuit board. | 06-28-2012 |
| 20130134208 | SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE SAME - Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate. | 05-30-2013 |
| 228037000 | Flowing flux or filler (e.g., wave former, etc.) | 14 |
| 20090050674 | Wave Soldering Bath - In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of the bottom surface of the bath body is a vortex (T) of molten solder formed below the duct inlet accompanying rotation of an impeller pump ( | 02-26-2009 |
| 20090159640 | Wave soldering apparatus - A wave soldering apparatus includes: two parallel tracks; a soldering bath defining a wave soldering region between the tracks for soldering circuit boards passing therethrough; a conveying unit including two belts that are movably and respectively mounted on the tracks, and a plurality of clamping members mounted on the belts; and two adjusting mechanisms, each of which is mounted on a respective one of the tracks and each of which includes a pressing plate that is disposed at a top side of the wave soldering region and that is adjustable in height relative to the tracks so as to press downwardly against the clamping members that are under the pressing plate. | 06-25-2009 |
| 20090321498 | WAVE SOLDERING TANK - A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods. | 12-31-2009 |
| 20100065610 | Wide wave apparatus for soldering an electronic assembly - Especially for but not limited to lead-free solder, the apparatus disclosed herein will provide better quality of wave soldered joints at a lower cost, without the addition of more equipment. | 03-18-2010 |
| 20100163599 | WAVE SOLDERING BATH - In a conventional wave soldering bath, molten solder spouted from a second discharge nozzle did not have a uniform height, oxides were spouted from the nozzle opening and adhered to printed circuit boards, and constituent parts of the wave soldering bath were eroded. In a wave soldering bath according to the present invention, a cylinder is disposed at one end of a duct, a spiral pump is installed in the cylinder, and the width of a nozzle opening is made narrower than the width of the duct. | 07-01-2010 |
| 20110049218 | METHOD FOR CONNECTING ELECTRONIC COMPONENTS, METHOD FOR FORMING BUMP AND CONDUCTIVE CONNECTION FILM AND FABRICATION APPARATUS FOR ELECTRONIC COMPONENT MOUNTED BODY, BUMP AND CONDUCTIVE CONNECTION FILM - A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin. | 03-03-2011 |
| 20120024938 | SOLDERING APPARATUS - A solder drawing member ( | 02-02-2012 |
| 20120168488 | Solder Return for Wave Solder Nozzle - A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting solder from splashing onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted to extend from the trough into solder in the solder reservoir to further limit splashing solder from reaching unintended locations. | 07-05-2012 |
| 20120255987 | WAVE SOLDERING TANK - A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller. | 10-11-2012 |
| 20140027495 | Apparatus And Method For Providing An Inerting Gas During Soldering - Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a base comprising an interior volume in fluid communication with an inerting gas source, a tube having an interior volume and comprising one or more perforations for the flow of inerting gas therethrough, and one or more support legs comprising an interior volume in fluid communication with the interior volume of the base and the interior volume of the tube, wherein the one or more support legs extend vertically upward from the base and elevate the tube above the surface of molten solder contained within a solder reservoir, and wherein the inerting gas travels through the base, upward through the one or more support legs, into the interior volume of the tube, and out through the one or more perforations in the tube. | 01-30-2014 |
| 20140209661 | AUTOMATIC WELDING EQUIPMENT - Automatic welding equipment includes a wave soldering machine including a tank, a plurality of first nozzles, a first pump, and a first guide plate. The tank has an opening. The first nozzles and melted solder are disposed in the tank. The first pump is disposed in the tank for jetting the solder via the first nozzles. The first guide plate is located at the opening and includes a first plate portion and a second plate portion. The first plate portion is located over the first nozzles and has a plurality of first holes for passed through by the solder jetted from the first nozzles. The second plate portion, connected to the first plate portion, guides the solder to flow out of the first holes. The solder guided by the second plate portion passes through second holes of the second plate portion and returns into the tank. | 07-31-2014 |
| 20150014394 | WAVE SOLDERING APPARATUS AND NOZZLE THEREOF - An apparatus used for wave soldering including a nozzle device configured to discharge molten solder to a circuit board near a solder tank, wherein, the nozzle device includes at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings. | 01-15-2015 |
| 20150367438 | PRE-HEATER LATCH AND SEAL MECHANISM FOR WAVE SOLDER MACHINE AND RELATED METHOD - A wave solder machine includes a pre-heating station, a wave soldering station, and a conveyor to transport substrates through a tunnel passing through the pre-heating station and the wave soldering station. The tunnel has a substantially oxygen-free environment. The pre-heating station includes a pre-heater including a support frame assembly, and a heater assembly supported by the support frame assembly. The heater assembly is slidably coupled to the support frame assembly between an operational position and a non-operational position. The pre-heater further includes a seal disposed between the heater assembly and the support frame assembly. The seal provides a gas-tight seal when the heater assembly is in the operational position to prevent atmosphere from entering the tunnel thereby preserving the substantially oxygen-free environment within the tunnel. | 12-24-2015 |
| 20160184914 | Device For Soldering Electrical Or Electronic Components - A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle. | 06-30-2016 |
| 228039000 | With means to mask or stop work | 1 |
| 20130068822 | STENCIL FOR PRINTING SOLDER PASTE ON PRINTED CIRCUIT BOARD - A stencil for printing solder paste on a printed circuit board improves an assembly process, cuts production costs, and saves storage space. The stencil is coupled to a fixing frame having a plurality of fixing portions and a motor unit. The motor unit generates a plurality of pulling forces. The stencil includes a solder paste printing region and a plurality of fixing regions. Vias are disposed in the solder paste printing region. The directions of the pulling forces are coplanar with the solder paste printing region. The edge of the solder paste printing region extends outward to define the fixing regions. The fixing regions are movably fixed to the fixing portions and bear the pulling forces to flatten the solder paste printing region of the stencil. | 03-21-2013 |
| 228041000 | Solid flux or solid filler | 33 |
| 20080302856 | Conductive ball arraying apparatus - A conductive ball arraying apparatus includes an arraying jig including conductive ball insertion parts in a predetermined array pattern, a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls along with the arraying jig, moving means that moves the arraying jig and the ball cup relatively, the moving means moving the ball cup relatively along a top surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig, floating means that floats the ball cup from the arraying jig, and vibrating means that vibrates the ball cup. The moving means moves the ball cup relatively along the top surface of the arraying jig while floating the ball cup from the arraying jig and vibrating the ball cup. | 12-11-2008 |
| 20090001132 | MICRO-BALL LOADING DEVICE AND LOADING METHOD - A device for loading electro-conductive ball onto the terminal regions of a substrate more correctly and reliably is disclosed. Micro-ball loading device ( | 01-01-2009 |
| 20090039140 | Solder Mold With Venting Channels - A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities. | 02-12-2009 |
| 20090084827 | SOLDER BALL LOADING METHOD AND SOLDER BALL LOADING UNIT - A solder ball loading unit for loading a solder balls to be turned to a solder bumps on a connection pad of a printed wiring board, including a ball arranging mask having a plurality of openings corresponding to the connection pad of the printed wiring board, a cylinder member located above the ball arranging mask for gathering the solder balls just below the opening portion by sucking air from the opening portion, and a moving mechanism for moving the cylinder member in the horizontal direction, the moving mechanism moving the solder balls gathered on the ball arranging mask by moving the cylinder member and dropping the solder balls onto the connection pads of the printed wiring board through the opening in the ball arranging mask. | 04-02-2009 |
| 20090120996 | SOLDER BALL MOUNTING DECIVE - A solder ball mounting device that can mount minute solder balls with a diameter of 200 μm or less onto a connection pad. The solder ball mounting device can mount solder balls to be solder bumps on a printed circuit board using a mask having a plurality of openings corresponding to electrodes of a printed circuit board. The device includes a cylindrical member, which is positioned above the mask for arraying solder balls, for gathering solder balls immediately below the openings by sucking in air from the openings. A movement mechanism is for moving the cylindrical member horizontally relative to the mask for arraying solder balls, wherein solder balls gathered on the mask for arraying solder balls are moved by moving the cylindrical member and are then dropped on electrodes of the printed circuit board via openings of the mask for arraying solder balls. A current plate is placed within the cylindrical member, wherein at least a part of the current plate is positioned in an inner space formed by inner walls of the cylindrical member. | 05-14-2009 |
| 20090159641 | Forming Solder Balls on Substrates - A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described. | 06-25-2009 |
| 20090179064 | System and method for restoring metal components - A system for restoring a metal component with a brazing alloy, the system comprising an induction coil configured to extend around a portion of the metal component and at least a portion of the brazing alloy, a motion assembly configured to cause relative movement between the metal component and the induction coil along a first axis, and a heat exchanger assembly supported by the motion assembly and configured to form a thermal gradient along the metal component in a direction along the first axis. | 07-16-2009 |
| 20090289097 | Wafer Leveling-Bonding System Using Disposable Foils - A leveling-bonding method and an apparatus for performing the same are provided. The method includes providing a bond support for supporting a wafer; providing a bond head over the bond support; dispatching a foil over the wafer; placing the wafer on the bond support; and using the bond support and the bond head to apply a force on the foil and the wafer. | 11-26-2009 |
| 20100044412 | BALL ARRAY MASK AND BALL ARRAY MASK SUPPORTING APPARATUS - A ball array mask includes: a metal mask, which includes through holes into which minute balls are inserted, and which is positioned at a location above an object to be mounted; a hollow frame; a stretchable sheet, edges of the metal mask being affixed to the hollow frame by the stretchable sheet; and projection members that are attached to respective corners of the metal mask so as to pull the metal mask outwardly. | 02-25-2010 |
| 20100044413 | MINUTE BALL ARRAY APPARATUS - A minute ball array apparatus includes: an array jig including insert parts, into which minute balls are to be inserted, and which are formed in a predetermined pattern; a ball moving unit, which comprises a thrust surface, and which moves the thrust surface along an upper surface of the array jig so as to move the minute balls supplied onto the upper surface of the array jig to drop the minute balls into the insert parts of the array jig; a collapsing member, which is provided in a vicinity of the thrust surface, and which collapses a buildup of the minute balls rising along the thrust surface when the thrust surface is moved by the ball moving unit; and a motion imparting unit that imparts the collapse member with motion for collapsing the rising buildup of the minute balls. | 02-25-2010 |
| 20100072259 | SOLDER BALL PRINTING APPARATUS - Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy. | 03-25-2010 |
| 20100096436 | SEMI-AUTOMATIC BRAZING DEVICE - A semi-automatic brazing apparatus having a brazing wire feeding apparatus containing a brazing wire feed mechanism a controller, and a user input device. The brazing wire from a brazing wire source is continuously drawn from the source through the apparatus via the feeding mechanism and is directed towards a brazing gun for a semi-automatic brazing operation. | 04-22-2010 |
| 20100193571 | INERT GAS TUBE AND CONTACT TUBE OF AN APPARATUS FOR IMPROVED NARROW-GAP WELDING - An apparatus for improved narrow-gap welding is provided. The apparatus includes an inert gas tube within which a contact tube is arranged, the contact tube includes a wire feed for a melting wire. The contact tube is coolable in the interior. In another embodiment, the apparatus is formed from an inner core and an outer jacket wherein at the end of the contact tube, the contact tube has a ceramic coating. The coating is applied to the outer jacket and/or the inner core. | 08-05-2010 |
| 20100288818 | BUMP PRINTING APPARATUS - There is provided a bump printing apparatus that can improve the printability of solder bumps printed on a board. The bump printing apparatus may include a printing table onto which a board is mounted; a mask making close contact with the board and printing solder bumps on the board by separating the mask from the board after a printing operation; and mask tables extending from the printing table to edges of the mask and sucking the edges of the mask to bring the edges of the mask into close contact with the board under vacuum. | 11-18-2010 |
| 20110168762 | SOLDERING IRON TIP - A soldering iron tip is used for heating a solder bar during a soldering operation so as to solder a workpiece. An end surface of the soldering iron tip has a guide hole, and the guide hole forms a channel in the soldering iron tip. Meanwhile, a side surface of the soldering iron tip has a through hole in communication with the channel. When the soldering operation is performed, relative positions of the guide hole and the workpiece overlap each other. After the solder bar is made to pass through the through hole and heated inside the channel, the molten solder bar flows along the channel to reach the workpiece via the guide hole, thereby completing the soldering operation. | 07-14-2011 |
| 20120000963 | Mask frame apparatus for mounting solder balls - Disclosed herein is a mask frame apparatus capable of forming a bump having a micro-pitch without performing the manufacturing and the operation controlling of a separate head apparatus and preventing the reduction of a mounting speed of solder balls due to the repetition of an operation of separately recovering the solder balls after they are mounted on a mask. A mask frame apparatus for mounting solder balls includes: an outer circumferential mask frame configured to supply solder balls and having a hollow type duct shape; and an inner mask duct having a duct shape and positioned over the inside of a circumference of the outer circumferential mask frame so as to be in communication with the outer circumferential mask frame, and including a plurality of mask openings formed in a duct shape bottom surface so that the solder balls introduced through the hollow type outer circumferential mask frame are mounted on a substrate by the flow of air. | 01-05-2012 |
| 20120031954 | Ball Mounting Apparatus and Method - A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder halls to the first plate. | 02-09-2012 |
| 20120067938 | METHOD AND APPARATUS FOR LOADING SOLDER BALLS - A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having openings that correspond to the pads, one or more cylinder members is positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion. A conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the board through the openings of the mask held by the holding device. | 03-22-2012 |
| 20120080504 | Solder Ball Loading Mask, Apparatus And Associated Methodology - A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer | 04-05-2012 |
| 20120080505 | Solder Ball Loading Mask, Apparatus and Associated Methodology - A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer | 04-05-2012 |
| 20120085810 | JIG FOR ROUND SOLDER BALL ATTACHMENT - Disclosed herein is a jig for solder ball attachment capable of sensing whether missing balls occur by electrical sensing using an electrical sensor structure in which a conductive thin film is embedded in the jig and electrically sensing whether abnormal solder balls, for example, large ball/small ball/ball size are attached, without confirming whether abnormal solder balls, for example, large ball/small ball/ball size are attached by vision one by one, thereby shortening operating time and improving workability. | 04-12-2012 |
| 20120145769 | LASER CLADDING DEVICE WITH AN IMPROVED NOZZLE - A laser cladding device for applying a coating to a part comprising a laser which can generate laser light, which is adapted to heat the coating and the part, a main body defining a laser light channel adapted to transmit the laser light to the part, a coating channel adapted to transmit the coating to the part, and a vacuum channel and a nozzle having an exit. The nozzle comprises a delivery port at one end of the laser light channel, a coating port at one end of the coating channel, and a vacuum port at one end of the vacuum channel, wherein the vacuum port is positioned generally adjacent the delivery port In operation the vacuum port draws a vacuum, pulling the coating towards the part. | 06-14-2012 |
| 20120280020 | WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR - Provided is an apparatus for feeding wire solder with high tensile strength and pull cut resistance. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The apparatus for feeding the wire solder comprises a wire solder storage section where the wire solder with a core wire is stored and a core wire rewinding member that takes up an end of the core wire to rewind the core wire. While the core rewinding member is rotated to rewind the core wire, the single or multiple strands of solder are heated to perform soldering at the location of soldering upstream of the core wire rewinding member. | 11-08-2012 |
| 20130140344 | SOLDER BALL MOUNTING TOOL - A solder ball mounting tool is provided, and includes a base, a positioning plate, a screen plate, and a pushing element. The base includes a first surface, a second surface, a through hole extending through the first surface and the second surface, a first chip accommodating portion, and positioning pillars. The first chip accommodating portion and the positioning pillars are located on the first surface, and the position of the first chip accommodating portion is corresponding to the position of the through hole. The positioning plate includes a second chip accommodating portion and first positioning holes corresponding to the positioning pillars. The screen plate includes a mesh region and second positioning holes corresponding to the positioning pillars. The pushing element is movably disposed in the through hole and includes a first end portion and a second end portion. | 06-06-2013 |
| 20130306709 | SOLDER BALL SUPPLYING APPARATUS - Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof. | 11-21-2013 |
| 20150008251 | METHOD AND APPARATUS FOR MEASURING A FREE AIR BALL SIZE DURING WIRE BONDING - Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed. | 01-08-2015 |
| 20150076213 | ROBOT - A robot according to an embodiment includes a flange, a wrist arm, a forearm, and a feeder. The flange configured so that a welding torch is attached thereto and configured to rotate about a T axis. The wrist arm configured to rotate about a B axis substantially perpendicular to the T axis and configured to support the flange. The forearm configured to support the wrist arm. The feeder attached to a position between a base end and a tip end of the forearm and configured to feed a welding wire. | 03-19-2015 |
| 20150115016 | BALL MOUNT MODULE - Embodiments of the invention provide a ball mount module for sucking and sticking balls positioned in a ball supply bath, transferring the balls, and mounting the balls on a ball pad of a substrate. The ball mount module includes a sucking head, a sucking base coupled to the sucking head and having irregular air channels, and a sucking and sticking panel including bail sucking and sticking holes formed therein so as to be in communication with the irregular air channels of the sucking base and coupled to the sucking head. The sucking base is made of ceramic. | 04-30-2015 |
| 20150122873 | Apparatus and Method for Placing and Mounting Solder Balls on an Integrated Circuit Substrate - An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced. | 05-07-2015 |
| 20150129640 | SCREEN PRINTING MACHINE AND ELECTRONIC COMPONENT MOUNTING SYSTEM - A screen printing machine for forming a print of paste supplied to a mask plate having pattern holes, includes: a filling squeegee which is held to have a given clearance with respect to the mask plate, and which fills the pattern holes with the paste by moving the filling squeegee relative to the mask plate in a printing direction; and an urging member which urges the filling squeegee toward the mask plate such that at least the given clearance is maintained. The screen printing machine further includes a scraping squeegee which is held to maintain a given interval from the filling squeegee in the printing direction, and which scraps off paste remaining on the mask plate after passage of the filling squeegee by moving the scraping squeegee together with the filling squeegee in the printing direction. | 05-14-2015 |
| 20150129641 | SCREEN PRINTING MACHINE, ELECTRONIC COMPONENT MOUNTING SYSTEM, AND SCREEN PRINTING METHOD - A screen printing machine for forming a print of paste supplied to a mask plate having pattern holes, includes: a flexible filling squeegee which performs a squeegeeing operation in which the filling squeegee is moved relative to the mask plate in a printing direction; and a scraping squeegee which is held to maintain a given interval from the filling squeegee in the printing direction and to be movable together with the filling squeegee in the printing direction, and which scraps off the paste remaining on the mask plate after passage of the filling squeegee. In the squeegeeing operation, the filling squeegee is pushed up and bent by the paste to provide a clearance between a bottom end of the filling squeegee and the mask plate with the paste interposed therebetween so that the pattern holes are filled with paste with a prescribed filling pressure. | 05-14-2015 |
| 20150328707 | SOLDER BALL ATTACHING APPARATUS AND METHOD OF MANUFACTURING THE SAME - Provided are a solder ball attaching apparatus, a method of manufacturing the same, and a solder ball attaching method using the method. The solder ball attaching apparatus includes a housing, a porous plate on a bottom surface of the housing, a mask pattern on a bottom surface of the porous plate and having holes which provide spaces for temporarily storing solder balls, and a vacuum unit providing a vacuum force to the porous plate. | 11-19-2015 |
| 20160016247 | APPARATUS FOR ADSORBING SOLDER BALL AND METHOD OF ATTACHING SOLDER BALL USING THE SAME - Provided are an apparatus of adsorbing solder balls and a method of attaching the solder balls using the same. The solder ball adsorbing apparatus includes a body, a plurality of eject pins disposed in the body and configured to move in downward and upward directions with respect to a substrate on which the solder balls are to be loaded, and a solder ball holder disposed in the body and configured to hold the solder balls at the eject pins and release the solder balls therefrom. The eject pins include a first eject pin disposed at a center of the body in parallel with a vertical surface that is perpendicular to a bottom surface of the body, a second eject pin disposed at an edge of the body at a first angle with respect to the vertical surface, and a third eject pin disposed between the first and second eject pins. | 01-21-2016 |
| 228042000 | Gaseous flux | 13 |
| 20090008426 | Addition of D2 to H2 to Detect and Calibrate Atomic Hydrogen Formed By Dissociative Electron attachment - A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed. | 01-08-2009 |
| 20090134201 | Work Clamp and Wire Bonding Apparatus - A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing a use amount of antioxidant gas are provided. The work clamp according to the present invention includes an interior hollow portion | 05-28-2009 |
| 20110017805 | INERT ENVIRONMENT ENCLOSURE - A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure. | 01-27-2011 |
| 20110049219 | WIRE-BONDING MACHINE WITH COVER-GAS SUPPLY DEVICE - A wire-bonding machine includes a main body, a fixture block, a mounting block, a gas supply tube, a cover-gas supply device, a capillary tool and an electrode. The fixture block is provided with a chamber defined therein and a central bore formed at one side wall of the fixture block communicating the chamber. The mounting block has a fixture member extending upwards for being mounted to the main body and an electrode clamping member extending downwards into the chamber of the fixture block. The cover-gas supply device has a continuous gas passage and an orifice defined therein. The protection gas flows in a steady flow field around the orifice in the continuous gas passage of the cover-gas supply device so as to result in better ball formation during the ball formation and ball-bonding process. | 03-03-2011 |
| 20120125975 | INERT ENVIRONMENT ENCLOSURE - A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure. | 05-24-2012 |
| 20120145770 | APPARATUS FOR INCREASING COVERAGE OF SHIELDING GAS DURING WIRE BONDING - A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet. | 06-14-2012 |
| 20130119112 | REFLOW SOLDERING SYSTEM - A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board. | 05-16-2013 |
| 20140209662 | REFLOW OVEN AND METHODS OF TREATING SURFACES OF THE REFLOW OVEN - A reflow oven includes a chamber housing including surfaces that are in contact with heated air mixed with contaminants, including flux, and a water-soluble layer selectively applied to the surfaces of the chamber housing. Embodiments of the reflow oven include an acrylic-based layer, such as an acrylic paint. In one embodiment, the acrylic paint includes a water-soluble polymer, a polymer emulsion, and water. The water-soluble polymer includes butyl benzyl phthalate. In some embodiments, the acrylic paint includes 1-10% by weight butyl benzyl phthalate, 30-55% by weight acrylic polymer emulsion, and balance water. In a certain embodiment, the acrylic paint includes 1-5% by weight butyl benzyl phthalate, 35-50% by weight acrylic poly emulsion, and balance water. Methods of treating surfaces of the reflow oven are further disclosed. | 07-31-2014 |
| 20140326779 | Inflatable Purge Dam Apparatus With Diffuser - An inflatable purge dam apparatus includes first and second inflatable purge bladders defining a weld-zone therebetween. A purge gas discharge port is adapted to deliver a purge gas into the weld zone. A purge gas diffuser is in fluid communication with the gas discharge port. The purge gas diffuser is operable to diffuse the purge gas as it enters the weld zone. | 11-06-2014 |
| 20150129642 | REFLOW OVEN AND METHODS OF TREATING SURFACES OF THE REFLOW OVEN - A reflow oven includes a chamber housing including surfaces that are in contact with heated air mixed with contaminants, including flux, and a water-soluble layer selectively applied to the surfaces of the chamber housing. Embodiments of the reflow oven include an acrylic-based layer, such as an acrylic paint. In one embodiment, the acrylic paint includes a water-soluble polymer, a polymer emulsion, and water. The water-soluble polymer includes butyl benzyl phthalate. In some embodiments, the acrylic paint includes 1-10% by weight butyl benzyl phthalate, 30-55% by weight acrylic polymer emulsion, and balance water. In a certain embodiment, the acrylic paint includes 1-5% by weight butyl benzyl phthalate, 35-50% by weight acrylic poly emulsion, and balance water. Methods of treating surfaces of the reflow oven are further disclosed. | 05-14-2015 |
| 20150314385 | BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATMENT METHOD, AND SYSTEM THEREFOR - A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. | 11-05-2015 |
| 20150382482 | GAS-BLOWING-HOLE ARRAY STRUCTURE AND SOLDERING APPARATUS - In a gas-blowing-hole array structure, which enables gas to be blown to the whole surface of the conveyed member such as a printed circuit board, a semiconductor wafer or the like almost concentrically and allows the whole surface of conveyed member to be very uniformly heated or cooled, a nozzle pattern P | 12-31-2015 |
| 20160003738 | DEVICE AND METHOD FOR MEASURING THE OXYGEN CONTENT IN WELDING PROCESSES - The invention relates to a device for measuring the oxygen content in welding processes, in particular shielded arc welding, the device having at least one sensor element for sensing the oxygen content of a shielding atmosphere. With the aim of providing a device for measuring the oxygen content in welding processes that provides stable measured values for the residual oxygen content even at very high temperatures of the welding process and is ready to use after a very short time, it is envisaged to design the sensor element as an optical oxygen sensor. | 01-07-2016 |
| 228043000 | Moving work | 2 |
| 20130056523 | VEHICLE FLOOR PRODUCTION SYSTEM - In one aspect, the present invention provides a vehicle floor production system, in which a carrier is moved through a loop formed by a return line provided at the top of the system and a welding line provided at the bottom, and the carrier is horizontally moved by the frictional force of a horizontal movement driving means. Preferred systems can reduce the manufacturing cost and required installation area. | 03-07-2013 |
| 20140131423 | FETCHING MECHANISM AND AUTOMATIC WELDING SYSTEM USING THE SAME - A fetching mechanism includes a support base, a fetching member positioned on the support base and an adsorbing assembly. The adsorbing assembly is positioned on the support base and is spaced from the fetching member. The adsorbing assembly includes a driving member positioned on the support base and an adsorbing member driven by the driving member. The fetching member fetches one welding member, the adsorbing member is driven by the driving member to extend out and adsorbs the workpiece, and the adsorbing member is driven to drawback until each welding member attaches the workpiece. The application also supplies an automatic welding system using the fetching mechanism. | 05-15-2014 |
