| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 228400100 | WITH MEANS TO JUXTAPOSE AND BOND PLURAL WORKPIECES | 27 |
| 20130175323 | Serial thermal linear processor arrangement - A linear, serial chip/substrate assembly processing machine for stepwise advancing a pre-assembled chip/die substrate on a support plate through a series of sealable chambers having displacable bottom processing portions. The process begins at a loading station and ends up at an unloading station after various melting and vacuuming of chip/substrate components supported on a device tray through those various chambers to the final joining thereof. | 07-11-2013 |
| 228400500 | Wire lead bonder | 14 |
| 20080314963 | Bonding Tool With Improved Finish - A bonding tool includes a body portion terminating at a tip portion. The tip portion is formed from a material, wherein a grain structure of the material is exposed for at least a portion of the tip portion. | 12-25-2008 |
| 20090078740 | WIREBONDER FORMING LOW PROFILE WIRE BONDS BETWEEN INTEGRATED CIRCUITS DIES AND PRINTED CIRCUIT BOARDS - A wirebonder for electrically connecting an integrated circuit die with conductors on a printed circuit board. The wirebonder has a bonding tool for attaching wire bonds from the integrated circuit die to the conductors of the printed circuit board and a wire engaging structure for deforming the wire bonds such that they have a flatter profile shape. | 03-26-2009 |
| 20090277950 | WIREBONDING METHOD AND APPARATUS - A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing. | 11-12-2009 |
| 20100001039 | SELECTIVE SOLDERING SYSTEM - A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs. | 01-07-2010 |
| 20110073635 | GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS - A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: ( | 03-31-2011 |
| 20110079629 | Method and apparatus for manufacturing stacked-type semiconductor device - A method of manufacturing a stacked-type semiconductor device, comprises: arranging a plurality of stacked chips obtained by stacking semiconductor chips on a plurality of stages on a support substrate; connecting a semiconductor chip of each stage in each stacked chip and the support substrate by wire while performing heating in units of stacked chips; performing plastic molding of each stacked chip; and separating the stacked chips from each other. | 04-07-2011 |
| 20130221071 | CAPILLARY EXCHANGE SYSTEM OF SEMICONDUCTOR WIRE BONDING - A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit. | 08-29-2013 |
| 20130341377 | WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER - Disclosed is a wedge bonder, comprising a wedge for bonding a wire to surfaces to form an electrical interconnection therebetween, a cleaning device for cleaning the wedge, and a positioning device to which the wedge is mounted. In particular, the positioning device is operative to move the wedge to the cleaning device for cleaning. A method of cleaning a wedge of a wedge bonder is also disclosed. | 12-26-2013 |
| 20140014708 | LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES - A lead frame support plate | 01-16-2014 |
| 20140203065 | ULTRA FINE PITCH WEDGE FOR THICKER WIRE - An ultra-fine pitch wedge bonding tool and method for its manufacture are disclosed. The wedge tool is formed with a foot width calculated to enable accurate bonding of wires separated at an ultra-fine pitch. The wedge tool is made out of a tungsten carbide alloy having characteristics conforming to specified constraints that lead to improved performance and enable the use of thicker wire. A pocket is formed at the tip of the wedge tool and a wire feeding hole is formed from the rear side of the tool and exiting inside the pocket, at an elevation above the bonding foot. Side walls are provided on both sides of the pocket to guide the wire exiting the feed hole inside the pocket towards the bonding foot. | 07-24-2014 |
| 20140217152 | LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES - A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed. | 08-07-2014 |
| 20140319199 | Multi-functional detachable and replaceable wire bonding heating plate - A multi-functional detachable and replaceable wire bonding heating plate is provided with a heat blocking layer, a heating layer, a heat equalization layer, and a top layer. The bottom of the heat blocking layer has a recessed portion and the heating layer is disposed on top of the heat blocking layer. The heat equalization layer is disposed on top of the heating layer. A detachable and replaceable top layer is disposed on top of the heat equalization layer wherein a protruding support block is disposed on top of the top layer. The heat equalization layer and the top layer can be securely bonded to each other by the attraction force method, the engaging method, and the vacuum method. The invention allows the top layer to be timely detached and properly replaced to meet the specifications of different lead frames or PCB substrates and can reduce the production cost. | 10-30-2014 |
| 20140332583 | WIRE BONDING APPARATUS - Provided is a wire bonding apparatus including: a base ( | 11-13-2014 |
| 20160148898 | WIRE SPOOL SYSTEM FOR A WIRE BONDING APPARATUS - Disclosed is a wire spool system for a wire bonding apparatus, comprising: a wire reel arranged to receive a wire; a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus; and a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide. The wire spool system comprises an imaging module comprising a camera having an image sensor. The imaging module also comprises an image processing unit. The camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data. The image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path. | 05-26-2016 |
| 228500100 | With means to treat workpieces (e.g., cutting, deforming, etc.) | 2 |
| 20080245844 | Method for Welding Two Welding Parts by Means of a Fillet Weld and Welding Part with an Inclined Tapered Edge Area Therefor - The invention relates to a method for welding two welding parts ( | 10-09-2008 |
| 20160143156 | Reflow treating unit and substrate treating apparatus - Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber. The exhaust member includes a plurality of individual exhaust lines connecting a plurality of process chambers to each other and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module. | 05-19-2016 |
| 228600100 | Plural discrete workpieces | 10 |
| 20090078741 | Method of manufacturing vehicle body and welding facility - A method is disclosed for manufacturing a plurality of vehicle bodies having different vehicle types using the same manufacturing line. In the method, when a frame member assembly and a panel member assembly of the vehicle body are to be joined, the frame member assembly and the panel member assembly are welded on a different welding stage, enabling the welding stage to be changed according to the vehicle type. | 03-26-2009 |
| 20100301099 | METHOD OF MANUFACTURING VEHICLE BODY AND WELDING FACILITY - A welding facility includes a main welding line for manufacturing an assembly of frame members, and a sub-welding line for manufacturing an assembly of panel members, the sub-welding line merging with the main welding line. The main welding line is comprised of a plurality of welding stages provided with a welding robot, the sub-welding line is provided at the end with a transfer mechanism for transferring the panel member assembly to the desired welding stage, and the merging parts are changeable according to the type of product to be welded. The facility permits a plurality of vehicle bodies having different vehicle types to be manufactured using the same manufacturing line. | 12-02-2010 |
| 20110011918 | Automotive body shop flexible framing gate changing system - An automotive body framing system includes a setter supported by parallel spaced tracks for movement from a work position to a standby position and to a gate change position and driven by corresponding racks and synchronized pinion drive units. Opposing gate storage belt shuttles are located at the gate change position for receiving the setter therebetween, and a gate staging cart is supported in back of the setter by parallel tracks and is also moved between opposing gate storage belt shuttles by synchronized rack and pinion drive units. Power operated registration units are positioned on the setter to register each gate received at precise horizontal and vertical positions, and the setter, staging cart and gate storage belt shuttles each have a series of resilient guide and support rollers to provide for quiet operation during rapid transfer of the gates on the setter, staging cart and belt shuttles. | 01-20-2011 |
| 20120055975 | AUTOMATIC SOLDERING SYSTEM - An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is conveyed by the conveyor mechanism for carrying a workpiece. The first part assembling mechanism and the first soldering mechanism assemble and solder a first part to the primary workpiece carried by the vehicle. The turn-over mechanism turns the vehicle that is conveyed by the conveyor mechanism and carries the primary workpiece having the first part assembled thereto by a predetermined angle. The second part assembling mechanism and the second soldering mechanism assemble and solder and position a second part to the primary workpiece. The control system is electrically connected to and thus controls the first part and second part assembling mechanisms, the first and second soldering mechanisms, and the turn-over mechanism. | 03-08-2012 |
| 228600200 | With electrical connection made at joint | 6 |
| 20090127314 | IN-LINE PACKAGE APPARATUSES AND METHODS - An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker. | 05-21-2009 |
| 20110017803 | Method for Connecting a Component With a Substrate - An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber, wherein the component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between a current position of the component and a current position of the substrate, for placing and pressing the component on the substrate, and the combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of a lower side of the component to be connected and a pressing direction of the component, the angle corresponding to an angle between the normal of a surface area of the substrate to be connected and the pressing direction of the component. | 01-27-2011 |
| 20110180588 | ELECTRONIC COMPONENT MOUNTING SYSTEM - An object of the invention is to provide an electronic component mounting system which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently. Provided is an electronic component mounting system formed so that a screen printing module M | 07-28-2011 |
| 20120111922 | Thermal Compressive Bonding with Separate Die-Attach and Reflow Processes - A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump. | 05-10-2012 |
| 20140263575 | ELEMENT PRESSING APPARATUS AND HEATING SYSTEM USING ELEMENT PRESSING APPARATUS - An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes. | 09-18-2014 |
| 20160118362 | BONDING APPARATUS AND SUBSTRATE MANUFACTURING EQUIPMENT INCLUDING THE SAME - A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other. | 04-28-2016 |
