| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 228256000 | Applying or distributing fused filler | 63 |
| 20090152331 | SOLDER PASTES COMPRISING NONRESINOUS FLUXES - According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %. | 06-18-2009 |
| 20090218387 | Method of soldering portions plated by electroless ni plating - When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength. | 09-03-2009 |
| 20090230176 | JOINING JIG AND METHOD FOR MANUFACTURING A BONDED BODY OF DIFFERENT MEMBERS BY USING THE JIG - A joining jig | 09-17-2009 |
| 20090261149 | MOUNTING METHOD USING THERMOCOMPRESSION HEAD - A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an elastomer on a heatable metal head main body. In the method, after arranging an adhesive agent on a mounting region on the wiring board, an electric component is arranged on a mounting region, and the electric component is bonded on the wiring board by thermocompression by using the thermocompression head. At the time of performing thermocompression bonding, while pressing a top region of the electric component by a metal portion of the head main body, and adhesive in the vicinity of a side portion region of the electric component is pressed by a taper section of the elastic adhesive member. | 10-22-2009 |
| 20100012709 | Reflow furnace - A reflow furnace includes a suction pipe extending within a heating region along a rail on which a conveyor travels. Suction ports are formed on the inner side of the suction pipe. Flux fumes inside the reflow furnace are sucked into the suction ports and transported to the exterior of a tunnel of the furnace by the suction pipe. The flux fumes are removed by a flux fumes removal apparatus on the exterior of the tunnel, and cleaned gas is returned to the interior of the tunnel at the entrance and the exit of the tunnel, where it forms air curtains which prevent the ingress of outside air. | 01-21-2010 |
| 20100089982 | MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, COATING FILM FORMING METHOD AND SOLDERING METHOD - A member having a coating film capable of suppressing whisker generation is provided. The coating film ( | 04-15-2010 |
| 20100089983 | Forming Solder Balls on Substrates - A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described. | 04-15-2010 |
| 20100163608 | Method for depositing solder material on an electronic component part - A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part ( | 07-01-2010 |
| 20100170940 | Device for Soldering in the Vapor Phase - The application describes a soldering device comprising a soldering chamber for receiving a liquid and having a soldering chamber opening, an intermediate chamber arranged at the soldering chamber opening and having a substrate changing opening for supplying and removing items to be soldered, and a closure device for opening and closing the soldering chamber opening and the substrate changing opening. The closure device is designed as a unit such that, when the substrate changing opening is being closed, the soldering chamber opening is opened at the same time and vice versa. This soldering device is cost-effective in both production and operation. | 07-08-2010 |
| 20100264199 | JOINING METHOD FOR METAL MEMBERS - The present invention provides a joining method for metal members, including: preparing an Fe-based metal member of Fe-based material, and an Al-based metal member of Al-based material; providing a Zn-based brazing filler metal between the Fe-based metal member and the Al-based metal member; and joining the Fe-based metal member and the Al-based metal member, wherein the Zn-based brazing filler metal includes: 2.0 mass % or less of Al; and the balance of Zn and inevitable impurities, and in the joining, the Zn-based brazing filler metal is heated such that a liquid phase of the Zn-based brazing filler metal is generated, and in solidification of the Zn-based brazing filler metal in a condition of the liquid phase, Zn primary crystal or eutectic of Zn and Al is crystallized. | 10-21-2010 |
| 20110031302 | FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF - A flip-chip block structure with block bumps comprises a die, a substrate, a first block bump, and a second block bump. The die comprises an active side and a backside, a first die pad and a second die pad are disposed on the active surface, and an electrode layer is disposed on the backside. The first die pad and the second die pad are connected to the pattern side of the substrate via the first block bump and the second block bump respectively. Besides, the first block bump and the second block bump are formed by a wedge bonding method, therefore, the block bumps are more easily formed into larger sizes, which enhance electrical performance and thermal dissipation performance of the flip-chip structure due to a lower contact resistance and a larger contact area between the die and the substrate. | 02-10-2011 |
| 20110073637 | Reflow Air Management System and Method - A reflow module of a reflow oven including a reflow fixture housed within a compartment of the reflow oven, removable side ports attached to the reflow fixture for controlling air flow through the reflow module and a chamber housing encasing the reflow fixture within the compartment of the reflow oven. A reflow oven incorporating the reflow module may include a reflow fixture having a plurality of air tubes and at least one orifice fixture plate removably attached to the reflow fixture, wherein the at least one orifice fixture plate includes a plurality of orifices for directing airflow into the plurality of air tubes. | 03-31-2011 |
| 20110147440 | Solder in Cavity Interconnection Technology - An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball. | 06-23-2011 |
| 20110192887 | Micro-Fluidic Injection Molded Solder (IMS) - A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed. | 08-11-2011 |
| 20110248074 | METHOD AND APPARATUS FOR REFLOW SOLDERING - Reflow soldering apparatus comprising a vapour chamber in communication with a reservoir of heat transfer fluid such that a volume of vaporised heat transfer fluid is created and held in the vapour chamber by heating of the heat transfer fluid. A heating chamber is provided for receiving a board and a transportation mechanism is provided to transport vapour, and condensate formed from the vapour, from the volume of vaporised heat transfer fluid to the heating chamber. The transported vapour and condensate applies heat to the heating chamber for the reflow soldering process. | 10-13-2011 |
| 20110272454 | WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR - Provided is a wire solder with high tensile strength and pull cut resistance. An apparatus for feeding the wire solder is also provided. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The core wire is made of thermosetting resin or Joulean heat generating material. The wire solder has a single or multiple strands bound together. The wire solder is supplied from upstream of a location of soldering while the core wire is rewound under tension at a location downstream of the location of soldering. The apparatus for feeding the wire solder comprises a wire solder storage section where the wire solder with a core wire is stored and a core wire rewinding member that takes up an end of the core wire to rewind the core wire. While the core rewinding member is rotated to rewind the core wire, the single or multiple strands of solder are heated to perform soldering at the location of soldering upstream of the core wire rewinding member. | 11-10-2011 |
| 20110290864 | SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE - Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed. | 12-01-2011 |
| 20110315748 | ALUMINIUM ALLOY STRIP FOR BRAZING - The invention relates to a strip or sheet of aluminium alloy, comprising at least 80% by weight of aluminium and 0.01 to 0.5% yttrium and/or 0.05 to 0.5% bismuth, coated on at least one face with a brazing alloy. Said sheets and strips are used for the production of pieces by non-flux brazing. | 12-29-2011 |
| 20120000966 | METHODS AND APPARATUS FOR APPLYING METALLIC CLADDING TO INTERIOR SURFACES OF PIPE ELBOWS - An apparatus for applying a helical cladding bead to the interior surface of a pipe elbow has a rotor mounted to an elbow carriage so as to be rotatable about a primary axis. The elbow carriage is longitudinally movable parallel to the rotor's rotational axis. A radially-movable elbow collar is mounted to the rotor, and has means for mounting a first end of a pipe elbow. The second end of the elbow passes through a stationary frame with centering means for keeping the elbow's curved centerline tangential to the primary axis. A weld arm, extending from a weld arm carriage into the second end of the elbow, is sinuously configured so that it will not interfere with the elbow. The weld arm is rotatable about the primary axis in coordination with the rotor. A weld head is mounted at the extending end of the weld arm so as to remain spatially fixed regardless of rotation of the weld arm. An integrated drive mechanism rotates the rotor, moves the elbow carriage longitudinally, moves the elbow cradle radially, and rotates the weld arm in synchronization with the rotor, all in a coordinated fashion such that the elbow's center of rotation orbits around the primary axis in a plane perpendicular thereto. The elbow moves through the stationary frame at an average rate equal to one weld bead width per rotation, thus resulting in the deposition of a continuous helical weld bead cladding the interior surfaces of the elbow. | 01-05-2012 |
| 20120000967 | LAYERED STRUCTURES WITH INTEGRAL BRAZING MATERIALS - A layered structure comprising a base structure having a major surface, and a brazing layer secured to the major surface of the base structure, where the brazing layer is applied to the major surface prior to positioning the layered structure in contact with a turbine engine component. | 01-05-2012 |
| 20120211549 | ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature. | 08-23-2012 |
| 20120223127 | COMPONENTS AND METHODS OF FORMING PROTECTIVE COATING SYSTEMS ON COMPONENTS - Components and methods of forming a protective coating system on the components are provided. In an embodiment, and by way of example only, the component includes a ceramic substrate and a braze layer disposed over the ceramic substrate. The braze layer includes a silicon matrix having a first constituent and a second constituent that is different than the first constituent. The first constituent forms a first intermetallic with a portion of the silicon matrix and the second constituent forms a second intermetallic with another portion of the silicon matrix, wherein the braze layer is formulated to provide a barrier to oxygen diffusion therethrough. | 09-06-2012 |
| 20120234901 | MANUFACTURING METHOD OF A HEAT DISSIPATION DEVICE WITH GUIDING LINES AND SOLDERED HEAT PIPES - An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink. | 09-20-2012 |
| 20120255992 | Flux preparation with increased dynamic viscosity containing dehydrated K2A1F5, method to produce it and method to use it - Aqueous flux preparations with increased dynamic viscosity are provided. In the flux preparations, irreversibly dehydrated K | 10-11-2012 |
| 20120286026 | WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR - Provided is a solder with high tensile strength and pull cut resistance. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The wire solder has a single or multiple strands bound together. The wire solder is supplied from upstream of a location of soldering while the core wire is rewound under tension at a location downstream of the location of soldering. | 11-15-2012 |
| 20130020379 | Method of controlling bump printing apparatus - A method of controlling a bump printing apparatus includes securing a board having air holes therein to a printing table by vacuum suction using suction nozzles; bringing a mask into close contact with the board; printing solder bumps by compressing and moving a solder paste across an upper surface of the mask using a squeegee; spraying air through spray nozzles to separate the mask from the board; and terminating air spraying using the spray nozzles and terminating air suction using the suction nozzles to remove the board. | 01-24-2013 |
| 20130075455 | REFLOW PRETREATMENT APPARATUS AND REFLOW PRETREATMENT METHOD - This invention is to prevent tin from being adhered to a surface of part of an object to be soldered, a solder bump being formed in the part thereof. A reflow pretreatment apparatus includes a hydrogen radical generator and a filter for capturing suspended solids. The hydrogen radical generator radiates hydrogen radicals onto solder arranged in an object to be soldered. The filter for capturing suspended solids is arranged such that the hydrogen radicals are radiated onto the solder after passing through the filter for capturing suspended solids. | 03-28-2013 |
| 20130087605 | CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD - A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle. | 04-11-2013 |
| 20130098976 | METHOD FOR FORMING ELECTRICAL CONNECTOR - A method for forming an electrical connector. In one embodiment, the method includes: providing a body, where a plurality of terminals are fixed in the body, each terminal has an extending portion exposed downwardly out of the body, and a soldering portion disposed at one end of the extending portion; providing a flat working surface and a plurality of solder materials, and placing the body above the flat working surface, so that the solder material is connected upwardly to the soldering portion, and connected downwardly to the flat working surface; heating the solder material, and then cooling and solidifying the solder material, so that the solder material is fixed to the soldering portion; and removing the flat working surface. | 04-25-2013 |
| 20130153646 | METHOD FOR SUPPRESSING KIRKENDALL VOIDS FORMATION AT THE INTERFACE BETWEEN SOLDER AND COPPER PAD - The embodiment of the present invention relates to a method for suppressing Kirkendall voids formation in a solder joint. A solder alloy doped with 0.1˜0.7 weight percent (wt. %) of palladium (Pd) is utilized. Before soldering, the solder alloy is disposed on a copper (Cu) pad, possibly treated with a surface finish. Subsequently, the solder alloy is joined with the Cu pad, so as to form the solder joint with a Cu/Cu | 06-20-2013 |
| 20130186946 | SOLDER PASTE TRANSFER PROCESS - A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement, disposing the transfer tool in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the transfer tool to the solder pad locations. | 07-25-2013 |
| 20140001244 | ASSEMBLY AND PRODUCTION OF AN ASSEMBLY | 01-02-2014 |
| 20140048587 | BRAZING ALLOY AND PROCESSES FOR MAKING AND USING - Disclosed is a brazing alloy composition. The composition comprises, by weight, about 94% copper, about 4% zinc, and about 2% iron. Further disclosed is a brazing process utilizing the brazing alloy, a method for the brazing alloy's preparation and a work piece having members joined by the brazing alloy providing stronger bonding as demonstrated by braze joints having increased shear strength. | 02-20-2014 |
| 20140097232 | BONDING METHOD AND PRODUCTION METHOD - A bonding method of the present invention is a method of bonding two members (A and B) to each other with use of an Au—Sn solder. According to the bonding method of the present invention, after the bonding, an Au—Sn solder (S′) has weight percent of Sn which is not less than 38.0 wt % but not more than 82.3 wt %. | 04-10-2014 |
| 20140203069 | METALLIZED FILM-OVER-FOAM CONTACTS - A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens. | 07-24-2014 |
| 20140284376 | PB-FREE SOLDER BUMPS WITH IMPROVED MECHANICAL PROPERTIES - A method of forming an electronic device, comprising providing a semiconductor substrate having a first contact and an undoped electroplated lead-free solder bump formed on the first contact. The method also comprises providing a device package substrate having a second contact and a doped lead-free solder layer on the second contact comprising a fourth row transition metal dopant. The method further comprises melting the solder bump and the solder layer while the solder layer and the solder bump are in contact, thereby forming a doped solder bump consisting essentially of Sn, one or both of Ag and Cu, and the fourth row transition metal dopant. | 09-25-2014 |
| 20150021379 | ADDITIVE MANUFACTURING SYSTEM FOR JOINING AND SURFACE OVERLAY - An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials. | 01-22-2015 |
| 20150090775 | ORGANIC VAPOR JET PRINT HEAD WITH SOLDER JOINT - A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components. | 04-02-2015 |
| 228259000 | By immersing in stagnant pool | 9 |
| 20090008434 | Lead-Free Solder Alloy - A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed. | 01-08-2009 |
| 20090289102 | SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH - Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range. | 11-26-2009 |
| 20100276475 | GAS FEED DEVICE FOR A WAVE SOLDERING OR TINNING MACHINE - The invention relates to a supply device for feeding a gas to a wave brazing or tinning machine, wherein said machine is capable of generating at least one soldering wave, comprising: a gas inlet channel, a set of N secondary channels immersed in the solder bath of the brazing or tinning machine, and an injection channel supplying at least one injection means for injecting the gas in the vicinity of said at least one wave, each secondary channel having its inlet end connected to the injection channel, characterized in that the number N of secondary channels is equal to or higher than 1, and in that the inner diameter d of the secondary channels and the gas flow rate Q | 11-04-2010 |
| 20100314433 | Method for Manufacturing Tight Pitch, Flip Chip Integrated Circuit Packages - A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed. | 12-16-2010 |
| 20120091188 | SOLDER POT - Solder pot intended for a machine for selective soldering of through-hole electronic components on a printed circuit board, characterized in that it is in the form of a right prism, preferably with a hexagonal base. | 04-19-2012 |
| 20140183250 | HEAT TRANSFER DEVICE FOR WAVE SOLDERING - A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane. | 07-03-2014 |
| 20150327360 | MOUNTING CARRIER AND METHOD OF MOUNTING A MOUNTING CARRIER ON A CONNECTING CARRIER - A mounting carrier for semiconductor chips includes a second main surface provided for mounting of semiconductor chips, and a first main surface opposite to the second main surface. The mounting carrier also includes a mounting body, wherein the mounting body includes a first metallization on the side facing the first main surface and the first main surface includes a structure having a plurality of columnar structural elements. | 11-12-2015 |
| 20160039032 | SOLDER APPLICATION METHOD AND APPARATUS - A method of applying solder includes providing a first roller and a second roller, where at least one of the first and second rollers has an outer surface comprising a solder wicking material. A metallic article is provided, the metallic article having a first side and a second side, and having an opening extending from the first side to the second side. The metallic article is dipped in solder, where the dipping forms an initial coating of solder on the metallic article. After the dipping, the metallic article is fed between the first and second rollers. The wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers. | 02-11-2016 |
| 20160082551 | TIN-BASED SOLDER COMPOSITION WITH LOW VOID CHARACTERISTIC - A tin-based solder melt or aqueous tin plating bath composition comprising a source of tin and a stabilizing additive of chemical structure: | 03-24-2016 |
| 228260000 | Using pumped stream or jet | 12 |
| 20080210743 | PROCESS OF FABRICATING STACK COMPONENT - A process of fabricating a stack capacitor includes the following steps. First of all, multiple energy storage units having respective first electrodes and second electrodes at opposite sides are provided. These energy storage units are then stacked to have the first electrodes contact with each other and the second electrodes contact with each other, wherein the energy storage units are initially positioned by a fastening member. Next, the first electrodes are bonded together via a first conductive layer and the second electrodes are bonded together via a second conductive layer, thereby fabricating the stack component. | 09-04-2008 |
| 20090166399 | Laminar flow well - It has been observed that turbulent solder flow, particularly at the opening of a conventional flow well, correlates to a greater degree of Cu dissolution of the PTH barrels of a PCB, especially those that are aligned with the opening. A more laminar solder flow is created to more evenly distribute the solder flow and thus reduce the rate of Cu dissolution near the flow well opening, particularly during a PTH rework process. In one aspect, a flow well for a soldering machine is provided comprising a flow distribution element, wherein solder flowing into the flow well is distributed by the flow distribution element to provide a more laminar flow. | 07-02-2009 |
| 20090212094 | Wave Soldering Bath - Problem: In a conventional wave soldering bath, oxides which intermixed with molten solder were sucked into a duct from a suction port of the duct and were discharged from a discharge nozzle and adhered to printed circuit boards. | 08-27-2009 |
| 20100001047 | WAVE SOLDERING TANK - In a wave soldering tank using a conventional screw pump, pulsation sometimes occurred in which molten solder spouting from the discharge nozzle moved up and down. The cause of the occurrence of the pulsation in a screw pump was that the gap between the screw pump and the casing was wide, so there was reverse flow through the gap. It is conceivable to narrow the gap, but if the gap is made narrow, the screw pump ends up contacting the casing if the screw pump becomes eccentric. | 01-07-2010 |
| 20110079632 | MULTISTACK SOLDER WAFER FILLING - A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes. | 04-07-2011 |
| 20110079633 | Soldering Equipment and Soldering Method for Electronic Components - A tin or solder alloy film is formed by ejecting molten tin liquid or molten solder alloy liquid in a jet state onto a copper surface of an electronic component. The overflowing molten tin or molten solder alloy liquid is transported to a stirrer. Then, cuprate and the like mixed in the overflowing molten tin or molten solder alloy liquid are taken in to the organic fatty acid solution by fiercely stirring and mixing the molten tin or molten solder alloy liquid in contact with a solution at a temperature of 180 to 350° C. containing 1 to 80 weight % of organic fatty acid having 12 to 20 carbon number that circulates in the stirrer to purify the overflowing molten tin or molten solder alloy liquid. The mixed solution is introduced into a reservoir of the organic fatty acid solution, and the purified molten tin solution or molten solder alloy liquid separated according to the specific gravity difference in the reservoir of the organic fatty acid solution is returned from the bottom of the organic fatty acid solution reservoir to the reservoir of the molten tin or molten solder liquid by a pump for circulation use. By means of this, copper is prevented from accumulating in the molten tin or molten solder liquid, and thus it is possible to continuously perform a stable soldering process for a long term. | 04-07-2011 |
| 20110226843 | SOLDER RETURN FOR WAVE SOLDER NOZZLE - A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted so as to extend from the trough into solder in the solder reservoir to further contain the solder and limit the degree to which splashing solder can reach unintended locations. | 09-22-2011 |
| 20110303737 | JET SOLDERING DEVICE AND SOLDERING METHOD - A jet soldering device of the present invention includes: a solder bath ( | 12-15-2011 |
| 20120006886 | LOCALIZED JET SOLDERING DEVICE AND PARTIAL JET SOLDERING METHOD - To enable the molten solder to be partially spouted onto a component-mounting member in a stable state without decreasing the revolutions of a pump which is difficult to set a spouted amount of molten solder, even if a nozzle having a small spouting opening is used in a partial-jet-solder bath. | 01-12-2012 |
| 20120125982 | GAS FEED DEVICE FOR A WAVE SOLDERING OR TINNING MACHINE - The invention relates to a supply device for feeding a gas to a wave brazing or tinning machine, wherein said machine is capable of generating at least one soldering wave, comprising: a gas inlet channel, a set of N secondary channels immersed in the solder bath of the brazing or tinning machine, and an injection channel supplying at least one injection means for injecting the gas in the vicinity of said at least one wave, each secondary channel having its inlet end connected to the injection channel, characterized in that the number N of secondary channels is equal to or higher than 1, and in that the inner diameter d of the secondary channels and the gas flow rate Q | 05-24-2012 |
| 20120234902 | MULTISTACK SOLDER WAFER FILLING - A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes. | 09-20-2012 |
| 20130032631 | SOLDER RETURN FOR WAVE SOLDER NOZZLE - A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted so as to extend from the trough into solder in the solder reservoir to further contain the solder and limit the degree to which splashing solder can reach unintended locations. | 02-07-2013 |
| 228261000 | Using spray | 1 |
| 20130001280 | METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK - Metal nanoink for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent in the form of oxygen nanobubbles or oxygen bubbles either before or after metal nanoparticles whose surfaces are coated with a dispersant are mixed into the organic solvent. Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized. | 01-03-2013 |
| 228262000 | With agitating or vibrating (e.g., using ultrasonic energy) | 3 |
| 20110204126 | METHOD AND APPARATUS FOR APPLYING SOLDER TO A WORK PIECE - The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature T | 08-25-2011 |
| 20120298730 | Method For Dispensing Solder On A Substrate And Method For Mounting Semiconductor Chips - The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder. | 11-29-2012 |
| 20150129648 | Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said Method - A method for minimizing voids when soldering a printed circuit board being equipped with components, in particular with electrical and/or electronic components, includes oscillation of the printed circuit board while the solder situated between the components and the printed circuit board is being melted or after it has been melted. In this respect, the frequency of the oscillation changes between a starting frequency and a final frequency. Preferably, the oscillation is introduced in a direction of the printed circuit board plane by directly or indirectly coupling at least one actuator to at least one lateral edge of the printed circuit board, wherein the lateral edge of the printed circuit board, the edge being opposite to the actuator in each instance, is supported at a dead stop. | 05-14-2015 |
