| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 228227000 | Plural heat applying | 12 |
| 20080237313 | SOLDERING METHOD AND APPARATUS - To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step. | 10-02-2008 |
| 20090314825 | METHOD FOR SOLDERING WITH A MULTISTEP TEMPERATURE PROFILE - In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the soldering operation. | 12-24-2009 |
| 20100032472 | Brazing composition and brazing method for superalloys - A brazing composition for the brazing of superalloys including a base material with at least one initial phase is provided. The initial phase has a solidus temperature that is below the solidus temperature of the base material and, above a certain temperature, forms with the base material and/or with at least one further initial phase at least one resultant phase, the solidus temperature of which is higher that the solidus temperature of the initial phases. Heat treatment takes place in two stages, wherein the temperature of the second heat treatment is preferably 800-1200° C. The brazing composition may likewise be of the type MCrAlX, and the power particles of the initial phase may be in the form of nanoparticles. | 02-11-2010 |
| 20100301103 | METHOD AND APPARATUS FOR THE WELDING OF PIPES - Two pipes are arranged end to end, the pipes being shaped such that a groove is defined between the ends of the pipe. A plurality of welding torches are used to weld in the groove, such that at least some of the welding torches perform a first welding pass, the welding characteristics of the torches are adjusted and at least some of the welding torches are used to perform a second welding pass. At least one torch welds in a first sector in the first welding pass and a second sector in the second welding pass, the second sector being different to the first. The sectors might overlap or might not overlap. | 12-02-2010 |
| 20110290863 | SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTOR CHIP - An object of the present invention is to provide a composition of a sintering Ag paste which can metallically bond to a nonprecious metal member with high strength as well as to a precious metal member, in a sintering Ag paste which metallically bonds to a metal at a low temperature, and to provide a bonding method to obtain a joint part having high strength. The sintering Ag paste is a material containing a solution of an organic silver complex that is easily decomposed by heat regardless of an atmosphere. Furthermore, the bonding method includes: metallizing a face of a nonprecious metal with Ag in a non-oxidizing atmosphere in a step prior to sintering Ag particles; and then sintering the Ag particles in an oxidizing atmosphere. | 12-01-2011 |
| 228230000 | Diverse heating | 1 |
| 20090014503 | Reflow apparatuses and methods for reflow - There are provided reflow apparatuses and a methods therefor. In some embodiments, a reflow apparatus includes a first heating unit capable of heating a solder on a substrate up to just below before a melting point of the solder at ambient pressure such that the solder on the substrate is melted and electronic components mounted on the substrate are then soldered to the substrate; and a second heating unit connected to the first heating unit, the second heating unit capable of heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state. | 01-15-2009 |
| 228231000 | Including post-heating | 3 |
| 20110017809 | Method for Soldering with a Multistep Temperature Profile - A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau. | 01-27-2011 |
| 20130168439 | Thermal Processing Method for Welding Area on Branched Pipes - The present invention provides a heat treatment method comprising: welding a small diameter pipe ( | 07-04-2013 |
| 20140367455 | JOINING PROCESS FOR SUPERALLOYS - A method of bonding superalloys is provided. The method includes: aligning a first superalloy subcomponent having a gamma-prime solvus g′ | 12-18-2014 |
| 228232000 | Including preheating | 3 |
| 20090020593 | Method and Apparatus for Manufacturing Solder Mounting Structure - In manufacturing a camera module structure ( | 01-22-2009 |
| 20130248585 | BRAZING METHOD - A brazing method includes the steps of providing a first part and a second part, at least a first portion of the first part configured to fit inside a second portion of the second part, preplacing a non-self-fluxing braze alloy on one or more of the first portion and the second portion, thermally treating at least one of the first portion and the second portion, to create a temperature differential between the first portion and the second portion, inserting the first portion into the second portion, and heating at least one of the first portion and the second portion to melt the non-self-fluxing braze alloy. The first portion is joined by brazing to the second portion. | 09-26-2013 |
| 20140034716 | HOT BAR SOLDERING - A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant. | 02-06-2014 |
