| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 228214000 | With protecting of work or filler or applying flux | 86 |
| 20100155457 | REDUCING A GENERATION OF CONTAMINANTS DURING A SOLDER REFLOW PROCESS - Avoiding contaminant generation within a hard disk drive due to increased temperatures during a solder reflow process is described. Energy from a beam of energy that is directed toward a plurality of polyimide regions is received. Each of the plurality of polyimide regions are disposed adjacent to at least one solder pad. The plurality of polyimide regions and the at least one solder pad comprises a first component of a hard disk drive. Then, a portion of the energy is reflected away from the plurality of polyimide regions to prevent an absorption of the portion by the plurality of polyimide regions and a burning of the plurality of polyimide regions. | 06-24-2010 |
| 20100243717 | SOLDERING FLUX, SOLDER PASTE COMPOSITION AND SOLDERING METHOD - Provided is a soldering flux in which the volatilized amount in reflowing is reduced to enable soldering with a small environmental load while suppressing the stickiness of the flux residue to ensure a high reliability, as well as a solder paste composition and a soldering method using the same. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an organic acid anhydride being liquid form at 20° C. or higher and a polyhydric alcohol being liquid form at 20° C. or higher, and when the acid value and the content of the organic acid anhydride is AV (mgKOH/g) and W | 09-30-2010 |
| 20120074210 | SOLDERING PREFORM - A soldering preform for soldering in a reducing atmosphere is substantially disc-shaped and has two soldering surfaces each for being in contact with an object to be soldered, respectively, and with at least one recess on at least one soldering surfaces for constituting a channel open to a surface of the object. | 03-29-2012 |
| 20130140349 | IMPELLER MANUFACTURING METHOD - The present invention relates to a method of joining a hub | 06-06-2013 |
| 20150097023 | PROCESS FOR JOINING TWO METAL PARTS BY BRAZE-WELDING - A process for joining two parts by braze-welding, including forming a joint, between two surfaces to be joined, and a fillet. The composition of the filler metal used to form the fillet is different from that used to form the joint, to provide the joint with a higher ductility. The method can, for example, be applied to production of high-pressure compressor guide-vane sectors for a turbomachine. | 04-09-2015 |
| 20150108205 | WELDING METHOD - A welding method, including: forming a molten solder in a solder bath, forming a dynamic flow of the molten solder from the solder bath, and contacting an object to be welded with the dynamic flow of the molten solder and conducting welding. The surface of the molten solder includes a reduction layer. The oxygen content of the molten solder is below 10 ppm. | 04-23-2015 |
| 228215000 | By confining filler | 1 |
| 20080277456 | SYSTEM AND A METHOD FOR CONTROLLING FLOW OF SOLDER - An assembly including a solder wettable surface is provided. The assembly also includes a metal mask configured to restrict solder from flowing outside the solder wettable surface. | 11-13-2008 |
| 228218000 | Using gas, vapor, vacuum, or reactive flame | 41 |
| 20120199636 | Chamber With Low Turbulence Argon Purging System - Apparatus and method for purging atmospheric air from a chamber with a gas including means for generating a substantially non-turbulent, laminar flow front of the gas into the chamber with minimal turbulence to displace the atmospheric air in the chamber, the chamber having exhaust means associated therewith to permit the displaced atmospheric air to exit the chamber. The chamber is preferably a welding chamber and the gas is preferably argon. | 08-09-2012 |
| 20150336195 | MOLTEN METAL DISCHARGING DEVICE AND METHOD FOR DISCHARGING MOLTEN METAL - A molten metal discharging device according to the present invention that discharges a molten metal and bonds components with the molten metal discharged includes: a syringe having a tube shape that houses the molten metal therein; a shaft that slides inside the syringe to press the molten metal; a heater (syringe heat insulating heater) that is provided around the syringe and heats the molten metal to maintain a molten state; and the syringe including a shaft sliding portion in which the shaft slides and a nozzle that has an inner diameter smaller than that of the shaft sliding portion and discharges the molten metal from an opening at a tip thereof, a rotation mechanism that rotates the syringe, a rotation center of the rotation being an extending direction of the nozzle, a coating that repels the molten metal being applied to an interior wall of the nozzle. | 11-26-2015 |
| 228219000 | Gas or vapor | 29 |
| 20080277457 | Device and method for wave soldering - The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave generated above a solder reservoir, with a protective and/or active gas atmosphere of a first composition being located above the solder reservoir so as to exclude oxygen and with means for introducing the protective and/or active gas as well as an enclosure being provided, with the enclosure being configured in such a manner that it encloses at least the essential parts of a solder zone. | 11-13-2008 |
| 20090026248 | METHOD FOR SOLDERING COMPONENTS - The invention relates to a method for soldering components, in particular heat exchanger, in particular made of aluminium materials, aluminium alloys or wrought alloys, in a soldering furnace, in particular a continuous soldering furnace or a batch-type soldering furnace, which comprises a muffle, which is flushed with protective gas in order to create a protective atmosphere. In order to make the production of soldered components easier, during the soldering of the components the muffle is supplied with such a greatly increased amount of gas, in particular protective gas or reaction gas, that a low-oxygen protective atmosphere is created. | 01-29-2009 |
| 20090127320 | REFRIGERATION PURGING ADAPTOR - An adapter configured to enable a user to quickly and easily couple a fluid supply source to a pipe extending from a system to be brazed without requiring any modification or marring to the pipe. The adapter forming a substantially air-tight seal without requiring any bonding or adhesives. In one form the adapter comprises an access stem fitting on one end, and a step or conic adapter on another end. A method for using this device is also disclosed where in one form, the fitting is connected to a fluid source, the fitting is connected to the system to be brazed or welded, fluid is provided, and the system is brazed or welded. | 05-21-2009 |
| 20100059575 | DEVICE AND METHOD FOR SELECTIVE SOLDERING - The invention relates to a device and method for selective soldering, including at least one nozzle and a soldering channel surrounded by a vertically moveable hood, which immerses in a soldering bath or which is sealed against a surface of the soldering bath. The hood includes a passage for each nozzle, at least one gas feeding device for providing protective and/or active gas underneath the hood, and flow plates which are attached to the hood to extend substantially downward in the direction of the soldering bath from the hood. | 03-11-2010 |
| 20100170938 | SYSTEM AND METHOD FOR SOLDER BONDING - A volatile soldering aid for solder bonding surfaces. A thermally decomposable solid that is suspended in a carrier or dissolved in a solvent is incorporated in a solder assembly having two surfaces separated by a solder preform. The solvent or carrier is subsequently evaporated, and the assembly is heated to decompose the solid and produce a reducing gas. The assembly is then further heated to melt the solder preform. A vacuum may be introduced to remove the gas prior to melting of the solder preform. The solder preform in the assembly may be a monolithic preform or it may be a powder. The solder preform may be provided as a thin film deposited on one or both of the surfaces to be joined. Upon heating, the volatile soldering aid is converted to vapor without forming a liquid phase at the melting point of the solder. | 07-08-2010 |
| 20100200644 | SOLDERING APPARATUS - A selective soldering apparatus comprises a bath | 08-12-2010 |
| 20100243718 | SELECTIVE SOLDERING APPARATUS WITH JET WAVE SOLDER JET AND NITROGEN PREHEAT - Solder is pumped through a nozzle to produce a jet | 09-30-2010 |
| 20100264197 | APPARATUS AND METHOD FOR SOLDERING FLAT WORK PIECE - A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber. | 10-21-2010 |
| 20110204124 | PROCESS FOR FLUXLESS BRAZING OF ALUMINIUM AND BRAZING FILLER ALLOY FOR USE THEREIN - This relates to a process for controlled atmosphere brazing including, brazing an aluminium alloy without flux in a controlled atmosphere, while using brazing sheet including an aluminium alloy core upon which on at least one side a layer of filler alloy is clad, the filler clad layer having an inner-surface and an outer-surface, the inner-surface is facing the core, and wherein the filler alloy has a composition which is Na-free, Li-free, K-free, and Ca-free, and including, in wt. %: Si 3% to 15%, Cu 0.3% to 5%, Mg 0.05% to 1%, one or more elements selected from the group of: Bi, Pb, and Sb, and the sum of these elements being 0.35% or less, Fe 0 to 0.6%, Mn 0 to 1.5%, the balance aluminium. | 08-25-2011 |
| 20120055980 | Apparatus and Method for Providing an Inerting Gas During Soldering - Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus that is placed atop of a solder reservoir and comprises a plurality of porous tubes that are in fluid communication with an inerting gas. In another aspect, there is provided a method for providing an inerting gas to a wave soldering apparatus comprising the steps of, among other things, placing an apparatus atop at least one edge of the solder reservoir wherein the apparatus comprises a plurality of tubes comprising one or more openings in fluid communication with an inerting gas source. In a further aspect, at least one of the tubes comprises a non-stick coating or is comprised of a porous non-stick material such as a sleeve. | 03-08-2012 |
| 20120153010 | APPARATUS FOR THERMAL MELTING PROCESS AND METHOD OF THERMAL MELTING PROCESS - Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate. | 06-21-2012 |
| 20120187181 | REFLOW APPARATUS, A REFLOW METHOD, AND A MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE - A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid. | 07-26-2012 |
| 20120312864 | MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A COPPER SURFACE - A module includes a substrate including a first copper surface and a semiconductor chip. The module includes a first sintered joint bonding the semiconductor chip directly to the first copper surface. | 12-13-2012 |
| 20130098974 | Apparatus And Method For Providing An Inerting Gas During Soldering - Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap. | 04-25-2013 |
| 20130200136 | REFLOW SOLDERING DEVICE AND REFLOW SOLDERING METHOD - In the present invention, when a power module is soldered to a heatsink, steam which is temperature-adjusted to at least the melting point of a solder is introduced from a steam generating tank into the flow path provided in the heatsink, the heatsink is heated and the solder is melted. Inert gas is introduced into a soldering tank from another route so as not to mix with the steam supplied to the heatsink. Voids in the solder are reduced and condensed by pressure regulation and as a result the negative impact of voids is eliminated. | 08-08-2013 |
| 20130221077 | METHOD FOR BRAZING ALUMINUM MEMBERS AND BRAZING APPARATUS USED FOR SAME - Provided are: a method for brazing an aluminum alloy, which is characterized in that brazing is carried out by heating an aluminum brazing sheet without using flux in a furnace that is in an argon gas-containing atmosphere, said aluminum brazing sheet comprising a core material that is composed of aluminum or an aluminum alloy and a brazing filler material that is composed of an aluminum alloy and clad on one surface or both surfaces of the core material, and said core material and/or said brazing filler material containing Mg; and a brazing apparatus which is used in the method for brazing an aluminum alloy. The brazing method has good and stable brazing properties and is applicable in industrial practice. | 08-29-2013 |
| 20130292455 | FLIP CHIP ASSEMBLY APPARATUS EMPLOYING A WARPAGE-SUPPRESSOR ASSEMBLY - A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate. | 11-07-2013 |
| 20130292456 | SYSTEMS AND METHODS FOR PROCESSING RIBBON AND WIRE IN ULTRASONIC BONDING SYSTEMS - An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor. | 11-07-2013 |
| 20130306714 | ALUMINIUM BRAZING SHEET MATERIAL FOR FLUXLESS BRAZING - A brazing sheet material including a core alloy layer bonded on at least one side with an aluminium brazing clad layer or layers forming a filler material of a 4000-series aluminium alloy. The core layer is made from an aluminium alloy having (in wt. %): Mg 1.0 to 3.0, Mn 0 to 1.8, Cu 0 to 0.8, Si 0 to 0.7, Fe 0 to 0.7, optionally one or more elements selected from the group (Zr, Cr, Hf, T), Zn 0 to 0.5, impurities and aluminium. The filler material forms a 4000-series aluminium alloy further including one or more wetting elements selected from Bi 0.03-0.5, Pb 0.03-0.5, Sb 0.03- 0.5, Li 0.03-0.5, Se 0.03-0.5, Y 0.03-0.05, Th 0.03-0.05, wherein the sum of these elements being 0.5% or less. | 11-21-2013 |
| 20140061286 | EXTRUDED 3XXX-SERIES ALUMINIUM ALLOY TUBE PRODUCT - An aluminium alloy extruded tube product for a heat exchanger assembly and made from a 3xxx-series aluminium alloys and including furthermore a purposive addition of one or more wetting elements selected from the group of: Bi 0.03% to 0.5%, Pb 0.03% to 0.5%, Sb 0.03% to 0.5%, Li 0.03% to 0.5%, Se 0.03% to 0.5%, Y 0.03% to 0.05%, Th 0.03% to 0.05%, and the sum of these elements being 0.5% or less. | 03-06-2014 |
| 20140246482 | FORMING BODY FOR SEALING AN OBJECT TO BE WELDED, MORE PARTICULARLY A PIPE - In some embodiments, a forming body for the temporary sealing of a flow cross-section of an assigned object to be welded is disclosed. In some embodiments, the forming body comprises a dimensionally stable, preferably biologically-degradable material, which has a water solubility≧90% and of which the main component is corn starch and/or corn semolina and/or corn flakes. | 09-04-2014 |
| 20150136842 | Method for Forming a Welded Seal - A welding method includes inserting a weldable object at least partially into a through-bore formed in a generally tubular body, the tubular body having an interior flow passageway and an outer surface, and the through-bore having a borehole wall; transmitting inert gas between the weldable object and the borehole wall, the gas being transmitted through the through-bore; and welding the weldable object to the tubular body while the inert gas is being transmitted. | 05-21-2015 |
| 20160052074 | WAVE SOLDERING NOZZLE SYSTEM AND METHOD OF WAVE SOLDERING - A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle system adapted to create a solder wave. The wave solder nozzle system has a nozzle frame, and a nozzle plate secured to the nozzle frame. The nozzle plate includes a first zone of openings positioned adjacent a leading edge of the nozzle plate, a second zone of openings positioned proximate a middle of the nozzle plate, and a third zone having no openings positioned adjacent a trailing edge of the nozzle plate. | 02-25-2016 |
| 20160074955 | PURGE DAM AND METHOD OF USE - A purge dam assembly confines a volume within an assembly of pipes, including a distal pipe and a proximal pipe together arranged for butt welding at a seam. A distal disk is covered at its periphery with a distal bootie including gasketing material. A proximal disk is covered at its periphery with a proximal bootie including the gasketing material. The each disk is sized such that the bootie contacts but does not completely seal against an inner surface of one of the tubes or pipes permitting a purging flow of gas from the volume and past each disk. A cross-member having a proximal and a distal end, the proximal end is affixed to the proximal disk and the distal end is affixed to the distal disk to preserve the spatial separation between the proximal disk and distal disks and to maintain the proximal and distal disks in coaxial alignment. | 03-17-2016 |
| 228220000 | Reducing gas | 5 |
| 20100078464 | Wire bonding apparatus and ball forming method - A wire bonding apparatus including a capillary having a through-hole through which a wire is inserted; an inert gas feed section for feeding inert gas containing reducing gas to a region on the tip end side of the bonding tool; and a gas blowing nozzle for blowing out inert gas containing reducing gas along a base end surface of the capillary including an opening of the through-hole. The pressure in the through-hole is made lower than the ambient pressure by the gas blown out of the gas blowing nozzle toward the opening of the base end of the capillary, so that the inert gas containing reducing gas blown out of the inert gas feed section flows through the tip end into the through-hole, thus preventing oxidation of the part of the wire inside the through-hole of the capillary. | 04-01-2010 |
| 20100170939 | JOINING METHOD AND REFLOW APPARATUS - A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state. | 07-08-2010 |
| 20100213247 | COATED CBN - The invention relates to a coated boron or nitrogen containing superhard abrasive material selected from cBN, boron suboxide and boron carbide comprising: cBN, boron suboxide and/or boron carbide superhard abrasive material substrate; a primary layer of a carbide/nitride/boride forming metal, such metal preferably being Ti and preferably being substantially in the form of the carbide, nitride or boride; a secondary layer of a high melting point metal selected from W, Mo, Cr, Ni, Ta, Au, Pt, Pd and alloys thereof; and an overcoat of Ag, Ni, Cu, Au, Pd, Pt, Rh, Os, Ir, Re, combinations and alloys thereof such as bronze (Cu/Sn), silver/bronze and silver/tin, the metal of the secondary layer being different to the metal of the overcoat. The invention further relates to methods for the manufacture of such material, use of such materials in tools and tools including such material. | 08-26-2010 |
| 20140374470 | SOLDERING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a soldering method through nickel plating layer to reduce void occurrence rate and a method of manufacturing semiconductor device by using the soldering method. By heating a copper base plate having a nickel plating layer at a temperature range of 300° C. to 400° C. in an inert gas atmosphere beforehand, void occurrence rate can be reduced in soldering the copper base plate to an insulating circuit board. | 12-25-2014 |
| 20150334849 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM - Manufacturing quality of a semiconductor device can be improved, and manufacturing throughput can be improved. A method of manufacturing a semiconductor device includes (a) placing a substrate on a substrate supporting unit installed in a processing chamber, the substrate having thereon a solder with an oxygen-containing film on a surface thereof, (b) reducing the oxygen-containing film by supplying a reducing gas into the processing chamber while maintaining a thermal conductivity of an inner atmosphere of the processing chamber at a first thermal conductivity, and (c) melting the solder by supplying a thermally conductive gas into the processing chamber while maintaining the thermal conductivity of the inner atmosphere of the processing chamber at a second thermal conductivity higher than the first thermal conductivity. | 11-19-2015 |
| 228221000 | Vacuum | 10 |
| 20100206941 | COATED DIAMOND - The invention relates to a coated diamond comprising a diamond substrate; a primary carbided layer of a carbide forming element; a secondary layer of a high melting point metal selected from W, Mo, Cr, Ni, Ta, Au, Pt, Pd or any combination or alloy thereof, the secondary layer being substantially free of carbide forming element from the primary layer; and an overcoat of Ag, Ni, Cu, Au, Pd, Pt, Rh, Os, Tr, Re, any combination or alloy thereof, the metal of the secondary layer being different to the metal of the overcoat. The invention further relates to methods for producing such coated diamonds and abrasive-containing tools including such coated diamonds. | 08-19-2010 |
| 20110089225 | Low Turbulence Argon Purging System - Apparatus and method for purging atmospheric air from a chamber with a gas including means for generating a substantially non-turbulent, laminar flow front of the gas into the chamber with minimal turbulence to displace the atmospheric air in the chamber, the chamber having exhaust means associated therewith to permit the displaced atmospheric air to exit the chamber. The chamber is preferably a welding chamber and the gas is preferably argon. | 04-21-2011 |
| 20120091187 | BONDING APPARATUS AND BONDING METHOD - A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units. | 04-19-2012 |
| 20120273559 | VACUUM PALLET REFLOW - A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly. | 11-01-2012 |
| 20120318856 | JOINT APPARATUS, JOINT METHOD, AND COMPUTER STORAGE MEDIUM - A joint apparatus of the present invention includes: a pre-thermal processing unit including a first thermal processing plate mounting and thermally processing a superposed substrate where substrates are superposed on each other with joint portions of the substrates in contact with each other, and a first pressure reducing mechanism; a joint unit including a second thermal processing plate mounting and thermally processing the superposed substrate processed in the pre-thermal processing unit, a pressurizing mechanism pressing the superposed substrate on the second thermal processing plate toward the second thermal processing plate side, and a second pressure reducing mechanism; and a post-thermal processing unit including a third thermal processing plate mounting and thermally processing the superposed substrate processed in the joint unit, and a third pressure reducing mechanism, wherein each of the pre-thermal processing unit and the post-thermal processing unit is hermetically connected to the joint unit. | 12-20-2012 |
| 20130068826 | Die Bonder and Bonding Method - A die bonder includes a die supply stage, which is configured to hold a wafer; a first head having a first collet, which is configured to pick up a die from the wafer and to attach the die, provisionally, on a target to be conducted with mounting thereon, on the attach stage; a second head having a second collet, which is configured to conduct main compression of the die, which is provisionally attached on the attach stage, on the target to be conducted with mounting; and a controller apparatus, wherein the controller apparatus controls the first head to pick up a next die from the die supply stage, during when the second head conducts the main compression on the die onto the target to be conducted with mounting, thereby achieving the die bonder and the die bonding method being stable in quality. | 03-21-2013 |
| 20130186945 | MANUFACTURING METHOD FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURING APPARATUS - An electronic device manufacturing apparatus is disclosed. The electronic device manufacturing apparatus includes a vacuum chamber, a support part, a moving part, and a heating part. The support part is located in the vacuum chamber and has a first placement surface on which a first member is to be placed. The moving part is located in the vacuum chamber and has a second placement surface on which a second member is to be placed. The moving part is movable between a first position where the first placement surface and the second placement surface do not face each other when seen in plan view and a second position where the first placement surface and the second placement surface face each other when seen in plan view. The heating part heats the first member and the second member. | 07-25-2013 |
| 20130206822 | METHOD OF BONDING ALUMINUM ALLOY MATERIALS TO EACH OTHER - A method of bonding two members including an aluminum alloy material as one member, and an aluminum alloy material or a pure aluminum material as the other member, the method being characterized in: that the aluminum alloy material for the one member and the aluminum alloy material for the other member are composed of an aluminum alloy containing Mg of not more than 0.5 mass %; and that a bonding process is carried out in a furnace having a non-oxidizing atmosphere at a temperature, at which a ratio of a mass of liquid phases generated in the aluminum alloy material defined as the one member to the total mass of the aluminum alloy material falls within a range from 5% to 35%, on the condition that there is either a coated fluoride-based flux or a coated chloride-based flux between both of the members to be bonded. | 08-15-2013 |
| 20140034715 | VACUUM REFLOW VOIDING REWORK SYSTEM - A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced. | 02-06-2014 |
| 20150342061 | Vacuum Pallet Reflow - A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly. | 11-26-2015 |
| 228222000 | Using cooling means (e.g., heat sink or barrier) | 2 |
| 20080277458 | METHOD FOR THE SUBSEQUENT TREATMENT OF WELDED CONNECTIONS - A method for the subsequent treatment of welded connections is shown and described. The object of providing a method for the subsequent treatment of a weld by which the tensile stresses in the region of the weld are reduced is achieved by applying a top layer to the weld on a workpiece by cold-gas spraying. | 11-13-2008 |
| 20090008432 | HEATING DEVICE, REFLOW DEVICE, HEATING METHOD, AND BUMP FORMING METHOD - A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air. | 01-08-2009 |
| 228223000 | Applying flux | 36 |
| 20080302861 | Method and apparatus for wave soldering an electronic substrate - A wave soldering apparatus includes a solder supply and a first wave soldering nozzle in fluid communication with the solder supply. The first wave soldering nozzle includes a flat plate having a plurality of square-shaped openings formed therein to generate a first solder wave. An inert system is configured to deliver an inert gas around the first solder wave. Other embodiments and methods of wave soldering are further disclosed. | 12-11-2008 |
| 20090001141 | Method for Arc or Beam Brazing/Welding of Workspieces of Identical or Different Metals or Metal Alloys with Additional Materials of Sn Base Alloys; Sn Base Alloy Wire - The invention is directed to a method for arc or beam brazing/welding of workpieces (A) made of steel, cast iron, nickel, cadmium, beryllium, titanium, molybdenum, magnesium, aluminum, copper, lead, zinc, tin, hard metal and alloys thereof with workpieces (B) made of steel, cast iron, nickel, cadmium, beryllium, titanium, molybdenum, magnesium, aluminum, copper, lead, zinc, tin, hard metal and alloys thereof, wherein said workpieces (A) and (B) may consist of identical or different metals or metal alloys, using a fused additional metal alloy, characterized by the following steps: a) positioning the workpieces to be joined; b) fusing the additional metal alloy containing an SnZn, SnAg, SnZnAg, SnCu, SnCuAg, SnZnCu or SnZnCuAg alloy; c) applying the fused additional metal alloy on the contact surfaces or partial areas of the contact surfaces between the positioned workpieces; and d) cooling the joined workpieces; steps b) and c) being carried out one immediately after the other. The invention is also directed to a method of filling gaps or dents in sheet metal treatment and in bodywork construction and to a wire for use in said method. | 01-01-2009 |
| 20090026249 | METHOD FOR SOLDERING TWO COMPONENTS TOGETHER BY USING A SOLDER MATERIAL - A method for soldering or hybridizing two components to each other by means of a solder material, including producing, on the opposite-facing surfaces of the components to be soldered or hybridized, a surface capable of being wetted by said solder material, this surface being produced on a first component which is in electrical contact with a metallic conductor, depositing an appropriate quantity of solder material capable of constituting a solder or hybridization pad on one of the wettability surfaces, depositing a flux material in liquid form, bringing the wettability surface of the other component into contact with the solder material thus deposited and raising the temperature until at least the melting temperature of the solder material is reached in order to ensure effective soldering or hybridization of the two components to each other due to the reflow effect. | 01-29-2009 |
| 20090032573 | AMORPHOUS CAESIUM ALUMINUM FLUORIDE COMPLEX, ITS PRODUCTION AND USE - The present invention provides an amorphous caesium aluminium fluoride complex, a process for its production and the use of the complex as a flux, in particular for the soft soldering of aluminium. | 02-05-2009 |
| 20090230175 | Flux for soldering and method for manufacturing an electronic device using the same - A flux for soldering of the present invention, in connecting a mounting pad exposed on a board to a solder ball, is applied onto at least one of a surface of the mounting pad and the solder ball. The flux for soldering contains a solvent, and the solvent contains a compound, which is represented by a general formula (1) and having a boiling point of 218° C. or higher and 240° C. or lower: R | 09-17-2009 |
| 20100019018 | Method And Device For Wetting The Bumps Of A Semiconductor Chip With Soldering Flux - The present invention relates to a method and a device for wetting the bumps of a semiconductor chip with a soldering flux, in which a container, which accommodates the soldering flux and is open on the bottom, and a base plate, which contains at least one cavity, are moved back-and-forth in relation to one another on one side of the cavity to the other side of the cavity. The viewed in the movement direction front wall of the container is lifted up during the relative movement, so that it is located at a distance above the base plate. The distance is somewhat greater than the height difference by which the soldering flux projects above the level of the surface of the base plate. This measure has the effect that the front wall of the container does not convey any soldering flux onto the base plate, which has caused the loss of this soldering flux until now. | 01-28-2010 |
| 20100038411 | METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD - A conductive circuit board is produced by imparting tackiness to the conductive circuit surface on a printed wiring board, attaching solder powder to the tacky area by supplying a slurry containing solder powder, and then heating the printed wiring board to melt the solder, thereby forming a solder circuit. In the solder circuit prepared by this method, tackiness is imparted to portions of the circuit with an insufficient amount of solder attached thereto and solder powder is attached to these tacky areas, or a solder paste is applied to the portions of the circuit with an insufficient amount of solder attached, and the solder powder or solder paste is melted to rectify the solder circuit, thereby producing a conductive circuit board with little variation in the amount of solder attached. | 02-18-2010 |
| 20100116870 | Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface - A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components. | 05-13-2010 |
| 20100163606 | APPARATUS AND METHOD OF COATING FLUX - An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening. | 07-01-2010 |
| 20100301102 | FLUXER FOR SOLDERING APPARATUS - A fluxer comprises a spray head ( | 12-02-2010 |
| 20110180591 | FLUXING AGENT FOR SOLDERING METAL COMPONENTS - The aim of the invention is to provide a fluxing agent for soldering components, which creates one or more specific surface characteristics during the soldering process itself, thus obviating the need for the surface treatment process that is conventionally carried out after the soldering process. To achieve this, nanoparticles are added to a base substance. | 07-28-2011 |
| 20120205425 | MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS - A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 percent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders. | 08-16-2012 |
| 20120217289 | Flux Composition and Techniques for Use Thereof - The present invention is directed to flux compositions and uses thereof. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects. | 08-30-2012 |
| 20120267423 | Methods and Apparatus for Thin Die Processing - A vacuum tip and methods for processing thin integrated circuit dies. A vacuum tip for attaching to an integrated circuit die is disclosed comprising a vacuum port configured to connect to a vacuum supply on an upper surface and having a bottom surface; and at least one vacuum hole extending through the vacuum tip and exposed at the bottom surface of the vacuum tip; wherein the vacuum tip is configured to physically contact a surface of an integrated circuit die. Methods for processing integrated circuit dies are disclosed. | 10-25-2012 |
| 20130043297 | AUTOMATIC FLUXING MACHINE - An automatic fluxing machine is provided and includes a dispensing section including a surface having through holes formed therein through which flux material is dispensable toward a braze joint and a plugging section disposed below the braze joint to prevent downward flow of dispensed flux material. | 02-21-2013 |
| 20130082093 | Amine, Carboxylic Acid Flux Composition And Method Of Soldering - A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: | 04-04-2013 |
| 20130082094 | POLYAMINE, CARBOXYLIC ACID FLUX COMPOSITION AND METHOD OF SOLDERING - A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: | 04-04-2013 |
| 20130299564 | BRAZING PRE-FLUX COATING - Pre-flux coating for the manufacturing of components by brazing, in particular manufacturing of heat exchangers of aluminium components including one or more fluxes and filler materials. The coating is composed of fluxes in the form of potassium aluminum fluoride K | 11-14-2013 |
| 20130341379 | HYBRID LOW METAL LOADING FLUX - Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed. | 12-26-2013 |
| 20140048586 | Innovative Multi-Purpose Dipping Plate - The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates. | 02-20-2014 |
| 20140076958 | Corrugated Solder Pre-form and Method of Use - A solder pre-form for soldering a coaxial cable to a connector body is provided with a plurality of flux grooves on a cable side and a connector side. The solder pre-form may also have a plurality of holes between the cable and connector sides. In a method of use, flux is applied to the flux grooves and the solder pre-form applied to encircle the outer conductor which is then inserted into the connector body and the solder pre-form melted to complete the solder interconnection. Where holes are present, flux may be applied to the connector side, passing through the holes also to the cable side. | 03-20-2014 |
| 20140103098 | MASK FOR BUMPING SOLDER BALLS ON CIRCUIT BOARD AND SOLDER BALL BUMPING METHOD USING THE SAME - Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings. | 04-17-2014 |
| 20140110462 | FORMING AN ARRAY OF METAL BALLS OR SHAPES ON A SUBSTRATE - A process and apparatus for forming and transferring metal arrays of balls and shapes is described incorporating molds, tape, injection molded metal such as solder, metal reflow and a mask on a substrate for shearing solidified metal of metal arrays into respective openings in the mask. | 04-24-2014 |
| 20140183249 | SUBSTRATE PROCESSING DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a substrate processing device, including: a first mask disposed over a base substrate and provided with a first opening which exposes a connection pad of the base substrate; a first squeeze inserting a flux ball into a first opening of the first mask; and a first heating means heating a flux ball which is disposed on the connection pad. | 07-03-2014 |
| 20150034704 | ELECTRICAL COMPONENT HAVING PRESOLDERED SURFACE WITH FLUX RESERVOIRS - A presoldered prefluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with a series of generally equally spaced apart flux wells formed in the surface of the solder for protectively storing and retaining flux therein. The flux wells can have a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm that is deep enough for retaining a quantity of flux therein when flux on the surface of the layer of solder wears off during shipping and/or handling. | 02-05-2015 |
| 20150097024 | ELECTRODE FORMING DEVICE, ELECTRODE FORMING SYSTEM AND ELECTRODE FORMING METHOD - An electrode forming device has a pressing unit that presses a substrate on a printing table from above, a suction unit that sucks the substrate on the printing table, a mask member integrally formed with a first mask section used for applying flux on the substrate and a second mask section used for filling a conductive ball on the substrate applied with the flux, a squeegee head that applies the flux via the first mask section, an air cylinder that moves the mask member, and a filling head that fills a conductive ball via the second mask section. | 04-09-2015 |
| 20150097025 | ELECTRODE FORMING DEVICE AND ELECTRODE FORMING METHOD - An electrode forming device has a flux application unit that applies flux on a substrate; a plurality of ball filling units that are arranged in series at a downstream side of the flux application unit and fill conductive balls on the substrate applied with the flux to form electrodes; and a first conveying device, a second conveying device, a first bypass conveyor and a second bypass conveyor that convey the substrate to one of the ball filling units and conveys the substrate in such a way as to bypass the other ball filling unit. | 04-09-2015 |
| 20160175994 | JOINING TO ALUMINIUM | 06-23-2016 |
| 228224000 | Flux affixed to or incorporated with filler | 8 |
| 20100219231 | Braze Ring - A method of connecting a straight tubular end to a flared tubular end includes locating a substantially annular braze ring substantially concentrically around the straight tubular end, inserting the straight tubular end into the flared tubular end so that the braze ring engages the flared tubular end, and heating the braze ring so that flux separates from an exterior channel of the braze ring and the separated flux from the exterior channel contacts at least one of a faying surface of the flared tubular end and a faying surface of the straight tubular end. | 09-02-2010 |
| 20120217290 | Flux Composition and Techniques for Use Thereof - The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects. | 08-30-2012 |
| 20130001279 | Flux Composition and Techniques for Use Thereof - The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects. | 01-03-2013 |
| 20130082095 | Flux Composition And Method Of Soldering - A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: | 04-04-2013 |
| 20130175330 | Method For Making A Solder Joint - A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly. | 07-11-2013 |
| 20140175160 | SOLDER PASTE MATERIAL TECHNOLOGY FOR ELIMINATION OF HIGH WARPAGE SURFACE MOUNT ASSEMBLY DEFECTS - A composition including a solder flux including a rosin material have a property to maintain a less than 10 percent drop in tackiness from an initial tackiness value of 20 gf to 120 gf over a temperature regime of 20° C. to 200° C. A composition including a solder powder; and a solder flux including a rosin material including a softening temperature of 150° C. to 200° C. and a molecular weight of 300 g/mol to 600 g/mol. A method including introducing a solder paste to one or more contact pads of a substrate, the solder paste including a solder powder and a solder flux including a rosin material including a softening temperature of 150° C. to 190° C. and a molecular weight of 300 g/mol to 600 g/mol; contacting the solder paste with a solder ball of a package substrate; and heating the solder paste. | 06-26-2014 |
| 20150028085 | BONDING MATERIAL AND BONDING METHOD IN WHICH SAID BONDING MATERIAL IS USED - The occurrence of uneven drying in the center and end of a surface of a bonding layer during a desolvation process of a pre-drying step is reduced to ensure highly reliable bonding without peeling of a bonding surface even after repeated exposure to heat shock after bonding. The bonding material of the present invention to achieve the object contains silver nanoparticles coated with organic substance having 6 or less carbon atoms and having an average primary particle diameter of 10 to 30 nm as main silver particles, silver nanoparticles coated with an organic substance having 6 or less carbon atoms and having an average primary particle diameter of 100 to 200 nm as secondary silver particles, two kinds of solvents having different boiling points, and a dispersant. | 01-29-2015 |
| 20150102090 | Flux, Solder Composition, and Method for Manufacturing Electronic Circuit Mounted Substrate - Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid. | 04-16-2015 |
